Waste gas treatment device for wafer cleaning equipment

Abstract

The invention relates to the technical field of semiconductor equipment, and particularly discloses a waste gas treatment device for wafer cleaning equipment, which comprises a box body, a negative plate is arranged in the box body in a lifting manner, a positive plate is rotationally arranged in the box body, and the box body is internally divided into a charge region, an adjusting region and a collecting region; the positive plate and the negative plate are located in the adjusting area, a first power part for driving the negative plate to move is arranged in the box body, and a collecting assembly for collecting particulate matters and an adjusting assembly for adjusting the electric field intensity are arranged in the box body. Through the negative plate arranged in a lifting mode and the positive plate arranged in a rotating mode, the electric field intensity is adjusted, particulate matter of different sizes is recycled, and the waste gas removal effect is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a waste gas treatment device for wafer cleaning equipment. Background Technology

[0002] In semiconductor manufacturing processes, impurities such as particulate contaminants, organic residues, metal ions, and native oxide layers inevitably adhere to the surface of wafers. These contaminants can affect subsequent wafer processing, making wafer cleaning an indispensable part of the manufacturing process. Currently, wet cleaning equipment is mainly used for cleaning, with the core process being the RCA cleaning method based on chemical solutions. This involves using SPM to remove organic contaminants, APM to remove particles and some metals, HPM to remove metal ions, and DHF to remove the oxide layer, followed by rinsing with ultrapure water and steam drying.

[0003] The cleaning process of wafers using cleaning equipment generates complex waste gas. Existing technologies use electrostatic precipitators to recover and treat the waste gas. Dry electrostatic precipitators charge particles through corona discharge and drive them to adhere to the collecting plates under the action of electric field force. Then, periodic mechanical vibration causes the accumulated dust to fall into the ash hopper. Wet electrostatic precipitators, on the other hand, drive particles to adhere to the inner wall of the collecting tube under the action of electric field force, and then the collected particles are washed away by liquid through spraying.

[0004] When existing electrostatic precipitators treat continuously emitted waste gas, particulate matter accumulates on the collecting plates or tubes as the waste gas passes through the electric field. When the accumulated layer reaches a certain thickness, the high-speed, continuous waste gas will re-entrain the loosely attached particles in the accumulated layer, causing some particles to be directly carried out of the equipment outlet. This results in a decrease in dust removal efficiency over time, making it difficult to continuously, efficiently, and stably recover high-value particles from the waste gas. Therefore, improvements are urgently needed. Summary of the Invention

[0005] In order to improve the problem of low dust removal efficiency and difficulty in continuous and efficient recycling of waste gas from wafer cleaning equipment by existing electrostatic dust removal devices, this application provides a waste gas treatment device for wafer cleaning equipment.

[0006] The waste gas treatment device for wafer cleaning equipment provided in this application adopts the following technical solution: A waste gas treatment device for wafer cleaning equipment includes a housing, in which a negative electrode plate is vertically mounted and a positive electrode plate is rotatably mounted. The housing is divided into a charging zone, an adjustment zone, and a collection zone. The positive electrode plate and the negative electrode plate are located in the adjustment zone. A first power component for driving the negative electrode plate to move is provided inside the housing. A collection component for collecting particulate matter and an adjustment component for adjusting the electric field strength are provided inside the housing. When large particles are introduced, the adjustment component moves the negative electrode plate closer to the positive electrode plate, shortening the distance between the positive and negative electrode plates. The large particles pass through the charging region and the adjustment region and are introduced into the collection component in the collection region. When small particles are introduced, the adjustment component moves the negative electrode plate away from the positive electrode plate, increasing the distance between the positive and negative electrode plates. The small particles pass through the charging region and the adjustment region and are introduced into the collection component in the collection region. When large and small particles are introduced simultaneously, the adjustment component adjusts the deflection angle of the positive electrode plate so that the positive electrode plate is tilted relative to the negative electrode plate. The large and small particles pass through the charging region and the adjustment region and are simultaneously introduced into the collection component.

[0007] By adopting the above technical solution, when the exhaust gas is introduced into the chamber, it first enters the charging zone. The negative ions in the charging zone collide with and attach to the surface of the particles in the exhaust gas, making the particles in the exhaust gas negatively charged. The exhaust gas then passes through the regulating zone, where the electric field strength is adjusted by the regulating component, so that particles of different sizes are all introduced into the collection component, thereby achieving the effect of removing and neutralizing particles from the exhaust gas. The removed airflow is discharged from the chamber, thus completing the recycling treatment of the exhaust gas.

[0008] When the exhaust gas contains only large particles, the first power component drives the positive plate to descend along the height of the housing, shortening the distance between the positive and negative plates, thereby increasing the electric field strength between the positive and negative plates and accurately guiding the particles in the exhaust gas into the collection assembly.

[0009] When the exhaust gas contains only small particles, the first power component drives the positive plate to rise along the height of the housing, increasing the distance between the positive and negative plates. This weakens the electric field strength between the positive and negative plates, allowing the particles in the exhaust gas to be accurately guided into the collection assembly.

[0010] When the exhaust gas contains both large and small particles, the positive plate is deflected to increase the distance between the side containing the small particles and the side containing the large particles, thereby recovering both large and small particles from the exhaust gas. Compared to existing electrostatic precipitators, this device guides particles of varying sizes into the collection box, reducing secondary disturbance of the accumulated particles by the airflow and effectively improving the removal efficiency of particulate matter from the exhaust gas.

[0011] Optionally, the collection assembly includes a collection box that is slidably disposed inside the box body, the collection box having a collection port, and a collection plate that is slidably disposed inside the box body and movably fitted with the collection port. The collection assembly also includes a driving component for driving the collection plate to move and a synchronizing component for driving the positive electrode plate to rotate.

[0012] By adopting the above technical solution, when large particles are recycled, the driving component moves the collecting plate and blocks part of the collection port corresponding to small particles; when small particles are recycled, the driving component moves the collecting plate and blocks another part of the collection port; if large and small particles exist at the same time, the synchronizing component moves the collecting plate to fully open the collection port, so that large and small particles are simultaneously introduced into the collection box; by adjusting the size of the collection port, the escape of volatile gases in the collection box is reduced, and the impact of particles carrying out particles in the collection box when too many particles accumulate in the collection box is also reduced.

[0013] Optionally, the driving component includes a connecting rod fixed to the collecting plate and a movable opening opened in the housing, the collecting plate being movably fitted with the movable opening, and a second power component being slidably disposed in the housing, the output end of the second power component being disposed at the end of the collecting plate.

[0014] By adopting the above technical solution, when the second power component is started, the second power component drives the collection plate to move on the moving port through the connecting rod. The collection plate blocks the collection port and separates particles of different sizes. This makes the size of the collection port correspond to the position where the particles are introduced, reducing secondary pollution caused by the evaporation of the solution in the gas box.

[0015] Optionally, the synchronizing element includes a rack slidably disposed within the housing, a gear rotatably disposed within the housing, a driving wheel coaxially fixed to the gear, and a driven wheel rotatably disposed within the housing. The gear meshes with the rack, and the driving wheel meshes with the driven wheel. A rotating shaft is fixedly disposed on the positive electrode plate, and the driven wheel is coaxially fixed to the end of the rotating shaft. One end of the rack is disposed on the collecting plate. A third power element is disposed within the housing, and the output end of the third power element is disposed on one end of the rack. A receiving groove is provided within the housing, and the collecting plate is inserted into and adapted to the receiving groove.

[0016] By adopting the above technical solution, when large and small particles are processed simultaneously, the third power component is activated, which drives the rack to move. The rack pushes the collection plate into the receiving tank, fully opening the collection port and facilitating the adjustment zone to guide particles of all sizes into the collection box. Simultaneously, the rack drives the gear to rotate, which in turn drives the driven wheel to rotate through the driving wheel. The driven wheel then drives the rotating shaft to rotate, thereby causing the positive electrode plate to deflect at a certain angle. This weakens the electric field strength corresponding to small particles and increases the electric field strength corresponding to large particles, ensuring that particles of different sizes are all guided into the collection box. This completes the waste gas recovery and treatment, reduces the accumulation of particulate matter, and improves the removal efficiency of particles from waste gas.

[0017] Optionally, the housing is provided with a first ventilation pipe and a second ventilation pipe arranged side by side, the arrangement direction of the first ventilation pipe and the second ventilation pipe being parallel to the width direction of the housing. The adjustment component includes a first ventilation plate and a second ventilation plate rotatably disposed in the first ventilation pipe and the second ventilation pipe. A first sensor and a second sensor are respectively disposed on the first ventilation plate and the second ventilation plate. The first ventilation pipe and the second ventilation pipe are both connected to the charged area.

[0018] By adopting the above technical solution, since the wafer cleaning machine will produce particles of different sizes in different steps of cleaning the wafer, the technicians will adjust the air volume to exhaust the gas. Since the content of particulate matter produced during the cleaning process is constant, the content of particulate matter in the exhaust gas can be indirectly identified by identifying the air volume.

[0019] When waste gas containing large particles is introduced into the first ventilation duct, the first sensor identifies the deflection angle of the first ventilation plate and transmits the signal to the first power component. The first power component controls the movement of the negative plate and adjusts the electric field strength between the negative plate and the positive plate, so that the large particles in the waste gas are guided into the collection box. When wastewater containing small particles is introduced into the second ventilation duct, the second sensor identifies the deflection angle of the first and second ventilation plates and transmits the signal to the first power component to adjust the electric field strength, so that the small particles in the waste gas are guided into the collection box.

[0020] Optionally, the housing is provided with an exhaust pipe, and the adjustment assembly further includes an exhaust plate rotatably disposed inside the exhaust pipe. A third sensor is disposed on the exhaust plate, and the exhaust pipe is connected to the adjustment area.

[0021] By adopting the above technical solution, when exhaust gas is simultaneously introduced into the first ventilation pipe and the second ventilation pipe, the air volume passing through the exhaust pipe is enhanced due to the simultaneous introduction of exhaust gas containing both large and small particles. When the exhaust gas drives the exhaust plate to rotate, the rotation angle of the exhaust plate is different from the rotation angle when exhausting large and small particles separately. The third sensor identifies the air volume by recognizing the rotation angle of the exhaust plate and controls the first power component through the controller to raise and lower the positive plate, thereby changing the electric field strength in the adjustment zone and ensuring that both large and small particles are introduced into the collection box. At the same time, the third sensor transmits a signal to the third power component to control the start and stop of the third power component.

[0022] Optionally, multiple discharge rods are evenly spaced inside the chamber, with the discharge rods arranged perpendicular to the exhaust gas direction. Two auxiliary electrode plates are symmetrically arranged inside the chamber, with the discharge rods located between the two auxiliary electrode plates. The channel formed by the two auxiliary electrode plates is the charging region.

[0023] By adopting the above technical solution, after the exhaust gas enters the charged area, the discharge rod inside the charged area discharges, and the generated negative electrons are adsorbed on the outer surface of the particles, making the particles in the exhaust gas negatively charged. The auxiliary electrode plate is grounded through the box, which improves the safety of the device.

[0024] Optionally, a diversion plate is provided inside the box, and a partition is provided in the collection box to divide the collection box into two collection chambers.

[0025] By adopting the above technical solution, the diversion plate installed inside the box can accurately guide particles of different sizes into different collection chambers inside the collection box; when the first ventilation pipe and the second ventilation pipe are ventilating at the same time, the mixing of particles of different sizes is reduced, so that particles of different sizes are guided into different collection chambers inside the collection box.

[0026] In summary, this application includes at least one of the following beneficial technical effects: 1. This device achieves dynamic control of the electric field intensity distribution in the adjustment zone through the coordinated action of a liftable negative electrode plate and a rotatable positive electrode plate. When treating waste gas containing large particles, the electric field intensity is enhanced by shortening the electrode plate spacing. When treating waste gas containing small particles, the electric field intensity is weakened by increasing the electrode plate spacing. When treating waste gas containing both large and small particles, the positive electrode plate is deflected to form an inclined arrangement, so that the generated electric field intensity is adapted to the particle size. This allows particles of different sizes in the waste gas to be drawn into the collection box. Compared with existing technologies, this device reduces secondary escape caused by the continuous airflow washing away loose particles on the electrode plate surface, significantly improving the removal efficiency and recovery effect of particulate matter. 2. When treating exhaust gas containing large and small particles simultaneously, the third power component drives the rack to move and pushes the collection plate into the receiving tank, so that the collection port is fully opened. At the same time, through the combined action of the rack, gear, driving wheel, driven wheel and rotating shaft, the positive plate is deflected, so that the positive plate is tilted to the negative plate, so that the electric field intensity in the adjustment zone changes continuously and matches the motion characteristics of particles of different sizes, so as to realize the simultaneous collection and treatment of exhaust gas containing particles of different sizes, effectively improving the exhaust gas treatment efficiency. 3. This device uses a movable collection plate and a partitioned collection chamber to work together, and by changing the electric field strength of the adjustment zone, it classifies and collects particulate matter from the first and second ventilation pipes. This reduces the volatilization and escape of the reagents in the collection box, and reduces secondary pollution caused by the reagents to the treated waste gas and the inside of the equipment, thereby further improving the purification effect of the waste gas.

[0027] 4. By designing parallel first and second ventilation pipes, the device allows waste gas from different process sections carrying particles of different sizes to enter the regulating zone and be introduced into the collection box. The device can simultaneously treat waste gas containing particles of different sizes, effectively improving the practicality of the device. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the overall structure of an embodiment of this application; Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure along the middle AA; Figure 3 yes Figure 1 A partial sectional view of the structure along the central axis AA; Figure 4 Partial structural schematic diagrams of embodiments of this application; Figure 5 This is a structural schematic diagram illustrating the synchronization element and the driving element in an embodiment of this application; Figure 6 This is a schematic diagram illustrating the structure of the collection box in an embodiment of this application.

[0029] Reference numerals: 1. Box body; 11. First ventilation pipe; 111. First ventilation plate; 112. First sensor; 12. Second ventilation pipe; 121. Second ventilation plate; 122. Second sensor; 13. Exhaust pipe; 131. Exhaust plate; 132. Third sensor; 14. Diverter plate; 21. Charged area; 22. Adjustment area; 23. Collection area; 31. Positive electrode plate; 32. Negative electrode plate; 33. Discharge rod; 34. Auxiliary electrode plate; 35. First power component; 41. Collection box; 411. Collection port; 412. Partition plate; 413. Collection cavity; 42. Collection plate; 431. Second power component; 432. Connecting rod; 433. Moving port; 441. Third power component; 442. Rack; 443. Gear; 444. Driving wheel; 445. Driven wheel; 446. Rotating shaft; 447. Receiving groove. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-6 This application will be described in further detail.

[0031] This application discloses an exhaust gas treatment device for wafer cleaning equipment. (Refer to...) Figure 1-4 The waste gas treatment device for wafer cleaning equipment includes a housing 1. The length of the housing 1 is parallel to the flow direction of the waste gas. One end of the housing 1 is connected to a first ventilation pipe 11 and a second ventilation pipe 12. A flow divider 14 is fixedly connected inside the housing 1. The shape of the flow divider 14 can be set to gradually thicken along the flow direction of the waste gas to reduce the mixing of waste gas containing particles of different sizes that are simultaneously introduced into the first ventilation pipe 11 and the second ventilation pipe 12. The other end of the housing 1 is connected to an exhaust pipe 13. Two auxiliary electrode plates 34 are symmetrically arranged inside the housing 1. The two auxiliary electrode plates 34 are parallel to the length of the housing 1. The interior of the housing 1 is... Multiple discharge rods 33 are evenly spaced and perpendicular to the bottom of the housing 1. They can also be discharge lines. A counterweight is placed at the bottom of the discharge line. A charging area 21 is formed between two auxiliary electrode plates 34. The discharge rods 33 are negative electrodes and the auxiliary electrode plates 34 are positive electrodes. The auxiliary electrode plates 34 are connected to the ground. A negative electrode plate 32 is raised and lowered inside the housing 1. A positive electrode plate 31 is rotated inside the housing 1. An adjustment area 22 is formed between the positive electrode plate 31 and the negative electrode plate 32. The adjustment area 22 is connected to the collection area 23. The housing 1 is equipped with a collection component for collecting particulate matter and an adjustment component for adjusting the electric field strength.

[0032] Because the waste gas generated by the wafer cleaning machine contains trace amounts of acid such as hydrogen fluoride and hydrogen chloride, and this acid can corrode the electrode plates inside the device, leading to a decrease or even failure in the cleaning effect, the waste gas needs to be neutralized and removed by passing it through a dry acid gas adsorption tower or other treatment methods before it is introduced into the device.

[0033] When the exhaust gas is recycled, it enters the housing 1 through the first ventilation pipe 11 and the second ventilation pipe 12, and first passes through the charging zone 21. The discharge rod 33 in the charging zone 21 generates a large number of negative electrons, which are adsorbed onto the particulate matter in the exhaust gas. Then it passes through the adjustment zone 22, where the adjustment component adjusts the electric field strength of the adjustment zone 22, so that particles of different sizes are all introduced into the collection component through the collection zone 23, thereby completing the recycling of particulate matter in the exhaust gas. Compared with the existing electrostatic dust removal device, this device reduces the accumulation of particulate matter on the electrode plate and collects particles of different sizes into the collection box 41. It also reduces the removal of loosely adsorbed particles when high-speed continuous airflow enters the device, effectively improving the removal and recycling effect of particulate matter in the exhaust gas.

[0034] Reference Figure 4-6 The housing 1 contains two first power components 35, which can be cylinders or electric telescopic rods. A slide rail is provided inside the housing 1, and the negative electrode plate 32 is slidably mounted on the slide rail. The slide rail can be made of insulating materials such as polyetheretherketone (PEEK) or ultra-high molecular weight polyethylene. An insulating block is provided at the connection between the output end of the first power component 35 and the negative electrode plate 32, and the insulating block is made of the same material as the slide rail. The collection assembly includes a collection box 41 slidably mounted inside the housing 1. A partition 412 is fixed inside the collection box 41, dividing the collection box 41 into two collection chambers 413. The collection box 41 can be filled with hydrogen peroxide, calcium hydroxide, and other agents used to fix fluorine / chlorine, performing preliminary treatment on the collected particles. To remove residual acid mist from the particles, a collection port 411 is opened on the collection box 41. A partition 412 divides the collection port 411 into two parts, which correspond to the first ventilation pipe 11 and the second ventilation pipe 12, respectively. A baffle plate can be installed on the collection box 41 to open and close the collection port 411, and the opening and closing are controlled by an electric push rod. When the exhaust gas does not need to be treated, the collection box 41 is in a closed state to reduce the damage to the inside of the device caused by the volatilization of the agent inside the collection box 41. The collection port 411 is elongated. A collection plate 42 that slides inside the box body 1 and fits against the collection port 411 is provided. A driving component for moving the collection plate 42 and a synchronizing component for storing the collection plate 42 are provided inside the box body 1.

[0035] The driving component includes a second power component 431 disposed inside the housing 1. The second power component 431 can be a cylinder or an electric telescopic rod, etc. The output end of the second power component 431 is fixedly connected to a connecting rod 432. The end of the connecting rod 432 away from the second power component 431 is fixedly connected to a collecting plate 42. A mounting plate is fixedly connected to the second power component 431, and the mounting plate is slidably disposed on the housing 1. The synchronizing component includes a third power component 441 fixedly connected inside the housing 1. The third power component 441 can also be a cylinder or an electric push rod. The output end of the third power component 441 is fixedly connected to a rack 442. The end of the rack 442 away from the third power component 441 is fixedly connected to the mounting plate. Inside the housing 1, a gear 443 is rotatably mounted and meshes with a rack 442. A drive wheel 444 is coaxially fixed to the gear 443. A rotating shaft 446 is fixed to the positive plate 31 and rotatably mounted inside the housing 1. The material of the part where the rotating shaft 446 connects to the negative plate 32 is the same as that of the slide rail. A driven wheel 445 that meshes with the drive wheel 444 is coaxially fixed to one end of the rotating shaft 446. Both the drive wheel 444 and the driven wheel 445 are bevel gears. The output end of the second power component 431 moves in a direction parallel to the width direction of the housing 1, and the output end of the third power component 441 moves in a direction parallel to the length direction of the housing 1.

[0036] Since wafer cleaning machines produce particles of different sizes in different cleaning steps, and the content of particles adsorbed and discharged by the exhaust gas during the cleaning process is certain, technicians adjust the air volume to exhaust the gas. Therefore, the particle size of the particles in the exhaust gas can be indirectly identified by identifying the air volume.

[0037] When waste gas containing large particles is introduced into the first ventilation pipe 11, the first power unit 35 controls the negative electrode plate 32 to move downward, shortening the distance between the positive electrode plate 31 and the negative electrode plate 32. According to E=U / D, when the voltage is constant, the distance between the positive electrode plate 31 and the negative electrode plate 32 is shortened, and the electric field strength is enhanced. This adjusts the electric field strength between the negative electrode plate 32 and the positive electrode plate 31, changing the trajectory of the large particles. At the same time, the second power unit 431 is activated, and the second power unit 431 extends and pushes the collection plate 42 to move in the moving port 433 through the connecting rod 432. The collection plate 42 blocks one side of the collection port 411, so that the open collection port 411 corresponds to the first ventilation pipe 11, thereby guiding the large particles in the waste gas into the collection box 41. The collection plate 42 makes the collection port 411 correspond to the first ventilation pipe 11, reducing the risk of volatilization of the substances filled in the collection box 41 and reducing secondary pollution of the device and the treated waste gas by the reagent.

[0038] When exhaust gas containing small particles is introduced into the second ventilation pipe 12, the first power unit 35 controls the negative plate 32 to rise, increasing the distance between the positive plate 31 and the negative plate 32 and reducing the electric field strength. At the same time, the output end of the second power unit 431 drives the collection plate 42 to move, so that the open collection port 411 corresponds to the second ventilation pipe 12, thereby allowing the small particles to be introduced into the collection box 41.

[0039] When exhaust gas is simultaneously introduced into the first ventilation pipe 11 and the second ventilation pipe 12, the diverter plate 14 separates the exhaust gas containing different particle sizes, reducing the mixing of exhaust gas during subsequent flow. The first power component 35 controls the movement of the negative electrode plate 32, and the third power component 441 is activated. The third power component 441 drives the rack 442 to move along the length of the housing 1. The rack 442 pushes the mounting plate and pushes the collection plate 42 into the receiving groove 447, fully opening the collection port 411. At the same time, the rack 442 drives the gear 443 to rotate, and the gear 443 drives the driving wheel 444 to rotate. The driving wheel 444 and the driven wheel 445 rotate, from... The positive electrode plate 31 is deflected at a certain angle. By setting the driving wheel 444 and driven wheel 445 with different tooth ratios, the rack 442 drives the collecting plate 42 to insert into the receiving groove 447, while the positive electrode plate 31 is deflected at a certain angle. This also increases the electric field strength in the area corresponding to the first ventilation pipe 11 and decreases the electric field strength in the area corresponding to the second ventilation pipe 12, so that particles of different sizes are all introduced into the collecting box 41. Since the electric field strength changes linearly during the tilting of the positive electrode plate 31, the head range of particles of different sizes becomes larger. Therefore, the width of the collecting port 411 is greater than or equal to the head range when particles of different sizes are present at the same time.

[0040] Reference Figure 1 , Figure 4 and Figure 5The adjustment assembly includes a first ventilation plate 111 rotatably disposed within a first ventilation duct 11, a second ventilation plate 121 rotatably disposed within a second ventilation duct 12, and an exhaust plate 131 rotatably disposed within an exhaust duct 13. A first sensor 112, a second sensor 122, and a third sensor 132 are respectively disposed on the rotation shafts of the first ventilation plate 111, the second ventilation plate 121, and the exhaust plate 131. All three sensors are angle sensors. A controller is disposed within the housing 1; this controller may be a dedicated electric actuator controller, a PID controller, or a programmable logic controller (PLC). The first sensor 112 and the second sensor 122 are connected to the first power... The first power component 35 and the second power component 431 are electrically connected. The third sensor 132 is electrically connected to both the first power component 35 and the third power component 441. The positive plate 31 is connected to the ground inside the housing 1. A high-precision, low-resistance sampling resistor can be connected in series between the positive plate 31 and the ground. This sampling resistor is electrically connected to the controller. During long-term use, the surfaces of the positive plate 31 and the negative plate 32 are prone to forming an isolation layer due to particles in the exhaust gas, which weakens the effective electric field strength between the positive plate 31 and the negative plate 32. The effective voltage through the positive plate 31 can be monitored by the sampling resistor, and the distance between the positive plate 31 and the negative plate 32 can be adjusted by the first power component 35 controlled by the controller, thereby compensating for the electric field strength.

[0041] When exhaust gas containing large particles is introduced into the first ventilation duct 11, the first sensor 112 identifies the deflection angle of the first ventilation plate 111 and transmits the signal to the first power component 35, causing the large particles in the exhaust gas to be guided into the collection box 41. When exhaust gas containing small particles is introduced into the second ventilation duct 12, the second sensor 122 identifies the deflection angle of the second ventilation plate 121 and transmits the signal to the first power component 35 to adjust the electric field strength, causing the small particles in the exhaust gas to be guided into the collection box 41. When exhaust gas is introduced into the first ventilation duct 11 and the second ventilation duct 12 simultaneously, because exhaust gas containing different particle sizes is introduced at the same time... The exhaust gas containing particulate matter increases the airflow through the exhaust duct 13. When the exhaust gas drives the exhaust plate 131 to rotate, the rotation angle of the exhaust plate 131 is different from the rotation angle when exhausting large and small particles separately. The third sensor 132 identifies the amount of airflow by identifying the rotation angle of the exhaust plate 131, and controls the first power component 35 through the controller to deflect the positive plate 31 by a certain angle, thereby changing the electric field strength of the adjustment zone 22, so that particles of different sizes are all introduced into the collection box 41. At the same time, the third sensor 132 transmits the signal to the third power component 441 to control the start and stop of the third power component 441.

[0042] The implementation principle of the waste gas treatment device for wafer cleaning equipment in this application embodiment is as follows: when treating the waste gas generated by the wafer cleaning machine, the generated waste gas can be introduced into the housing 1 through the first ventilation pipe 11 or the second ventilation pipe 12.

[0043] When the exhaust gas passing through the first ventilation duct 11 contains large particles, the first sensor 112 identifies the rotation angle of the first ventilation plate 111 and drives the negative plate 32 to descend through the controller and the first power component 35, thereby increasing the electric field strength in the adjustment zone 22. At the same time, the second power component 431 drives the collection plate 42 to move, so that the collection port 411 corresponds to the first ventilation duct 11.

[0044] When the exhaust gas passing through the second ventilation duct 12 contains small particles, the second sensor 122 identifies the rotation angle of the second ventilation plate 121 and drives the negative plate 32 to rise through the controller and the first power component 35, thereby weakening the electric field strength in the adjustment zone 22. At the same time, the second power component 431 drives the collection plate 42 to move, so that the collection port 411 corresponds to the second ventilation duct 12. While reducing the volatilization of the agent in the collection box 41, it also ensures that particles of different sizes are all introduced into the collection chamber 413 of the collection box 41.

[0045] When the first ventilation duct 11 and the second ventilation duct 12 simultaneously introduce exhaust gas containing particles of varying sizes, the third sensor 132 identifies the rotation angle of the exhaust plate 131. The first power component 35 drives the negative plate 32 to move, while the third power component 441 pushes the rack 442 to move. The rack 442 drives the collection plate 42 to move into the receiving groove 447, fully opening the collection port 411. At the same time, the rack 442 drives the gear 443 to rotate, and through the driving wheel 444 and the driven wheel 445, it drives the positive plate 31 to deflect at a certain angle, thereby aligning with the first ventilation duct 11. The electric field strength in the area corresponding to the second ventilation duct 12 is increased, while the electric field strength in the area corresponding to the second ventilation duct 12 is weakened, so that particles of different sizes are all drawn into the collection box 41, thereby completing the recovery and treatment of particles in the exhaust gas. Compared with existing electrostatic dust removal equipment, this device adjusts the electric field strength according to the size of the particles in the exhaust gas through adjustable positive plate 31 and negative plate 32, so that particles of different sizes are all drawn into the collection box 41, reducing the accumulation of particles in the box 1 and reducing the continuous high-speed exhaust gas from carrying particles out of the box 1, effectively improving the removal effect of particles in the exhaust gas.

[0046] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A waste gas treatment device for wafer cleaning equipment, characterized in that: The device includes a housing (1), in which a negative electrode plate (32) is vertically mounted and a positive electrode plate (31) is rotatably mounted. The housing (1) is divided into a charging zone (21), an adjustment zone (22), and a collection zone (23). The positive electrode plate (31) and the negative electrode plate (32) are located in the adjustment zone (22). The housing (1) is provided with a first power component (35) that drives the negative electrode plate (32) to move. The housing (1) is provided with a collection component for collecting particulate matter and an adjustment component for adjusting the electric field strength. When large particles are introduced, the first power unit (35) drives the negative electrode plate (32) to move closer to the positive electrode plate (31), the distance between the positive electrode plate (31) and the negative electrode plate (32) is shortened, the large particles pass through the charging region (21) and the adjustment region (22) and are introduced into the collection assembly in the collection region (23); When small particles are introduced, the first power unit (35) drives the negative electrode plate (32) away from the positive electrode plate (31), the distance between the positive electrode plate (31) and the negative electrode plate (32) increases, the small particles pass through the charging area (21) and the adjustment area (22), and are introduced into the collection component in the collection area (23); When large and small particles are introduced at the same time, the adjustment component adjusts the deflection angle of the positive plate (31) so that the positive plate (31) and the negative plate (32) are tilted. The large and small particles pass through the charging region (21) and the adjustment region (22) and are introduced into the collection component at the same time.

2. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: The collection assembly includes a collection box (41) that is slidably disposed inside the box body (1), the collection box (41) having a collection port (411) thereon, and a collection plate (42) that is slidably disposed inside the box body (1) and movably fitted with the collection port (411). The collection assembly also includes a drive component for driving the collection plate (42) to move and a synchronizing component for driving the positive electrode plate (31) to rotate.

3. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: The driving component includes a connecting rod (432) fixed to the collecting plate (42) and a moving port (433) opened in the box (1). The collecting plate (42) is movably attached to the moving port (433). A second power component (431) is slidably arranged in the box (1). The output end of the second power component (431) is located at the end of the collecting plate (42).

4. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: The synchronizing element includes a rack (442) slidably disposed within the housing (1), a gear (443) rotatably disposed within the housing (1), a driving wheel (444) coaxially fixed to the gear (443), and a driven wheel (445) rotatably disposed within the housing (1). The gear (443) meshes with the rack (442), and the driving wheel (444) meshes with the driven wheel (445). A rotating wheel is fixedly connected to the positive electrode plate (31). Shaft (446), driven wheel (445) is coaxially fixed to the end of shaft (446), one end of rack (442) is set on collection plate (42), a third power component (441) is provided in the box (1), the output end of the third power component (441) is set on one end of rack (442), a receiving groove (447) is opened in the box (1), and the collection plate (42) is inserted into the receiving groove (447).

5. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: The housing (1) is provided with a first ventilation pipe (11) and a second ventilation pipe (12) arranged side by side. The arrangement direction of the first ventilation pipe (11) and the second ventilation pipe (12) is parallel to the width direction of the housing (1). The adjustment component includes a first ventilation plate (111) and a second ventilation plate (121) rotatably disposed in the first ventilation pipe (11) and the second ventilation pipe (12). A first sensor (112) and a second sensor (122) are respectively disposed on the first ventilation plate (111) and the second ventilation plate (121). The first ventilation pipe and the second ventilation pipe (12) are both connected to the charged area (21).

6. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: The housing (1) is provided with an exhaust pipe (13), and the adjustment assembly also includes an exhaust plate (131) that is rotatably disposed in the exhaust pipe (13). A third sensor (132) is disposed on the exhaust plate (131), and the exhaust pipe (13) is connected to the adjustment area (22).

7. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: Multiple discharge rods (33) are evenly spaced inside the box (1). The discharge rods (33) are arranged perpendicular to the exhaust gas direction. Two auxiliary electrode plates (34) are symmetrically arranged inside the box (1). The discharge rods (33) are located between the two auxiliary electrode plates (34). The channel formed by the two auxiliary electrode plates (34) is the charging area (21).

8. The waste gas treatment device for wafer cleaning equipment according to claim 1, characterized in that: The box (1) is provided with a diversion plate (14), and the collection box (41) is provided with a partition (412) to divide the collection box (41) into two collection chambers (413).

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