Copper sheet processing method capable of preventing residue of slag on back surface

Abstract

The invention relates to the technical field of post-processing of metal devices, in particular to a copper sheet processing method capable of preventing residue of back slag, which comprises the following steps: step 1, polishing the surface of a copper sheet; 2, removing impurities on the surface of the copper sheet subjected to polishing treatment; 3, depositing a metal sacrificial layer on the back surface of the copper sheet; 4, the metal sacrificial layer is fixed to the carrier through the wax layer, and the back face of the copper sheet faces the carrier; fifthly, the front face of the copper sheet is made to be close to laser cutting equipment, laser cutting machining is conducted on the copper sheet through the laser cutting equipment, and then the machined copper sheet is cooled; 6, heating the wax layer, and then separating the copper sheet from the carrier; 7, removing the wax left on the copper sheet; and 8, removing the metal sacrificial layer on the back surface of the copper sheet. According to the method, the metal sacrificial layer is deposited on the back surface of the copper sheet material needing to be processed, so that the copper sheet material without impurity residues on the surface can be obtained.

Description

Technical Field

[0001] This invention relates to the field of metal device post-processing technology, specifically to a method for processing copper sheets to prevent slag residue on the back side. Background Technology

[0002] Laser cutting, as one of the core application technologies in the field of laser processing, has been widely used in the processing of metal materials due to its significant advantages such as high cutting precision, high speed, and small heat-affected zone. It is especially suitable for the processing needs of precision metal parts in industries such as aerospace, automotive manufacturing, and electronic equipment. Its working principle is to use a high-energy-density laser beam to generate high temperatures, causing the metal material to melt rapidly. By relatively moving the metal material or the laser beam, the laser beam cuts along a preset contour on the material surface, thereby obtaining a workpiece of the required shape and size.

[0003] In the actual laser cutting process of metal materials, when the laser beam penetrates the material surface, the molten material generated by the high temperature exhibits two migration states: some splashes onto the front side of the material, while the other part penetrates to the back side. After laser processing, this molten material cools and adheres to the material surface as the temperature decreases, forming slag. To reduce the impact of slag on processing quality, the industry commonly uses optimized process parameters for control, specifically adjusting laser power, cutting rate, and auxiliary gas pressure. These methods can reduce the amount of slag on the front side of metal materials such as copper sheets to a certain extent. Simultaneously, the industry also employs post-processing methods such as acid pickling and mechanical cleaning to remove residual slag.

[0004] However, existing technical solutions still have insurmountable drawbacks: on the one hand, adjusting process parameters can only reduce the amount of slag on the front side, and it is difficult to control the slag that penetrates to the back side of the material; on the other hand, existing post-treatment methods such as pickling and mechanical wiping have inherent drawbacks. The chemical agents in the pickling process can easily corrode the metal substrate, while mechanical wiping may cause scratches and increased roughness on the material surface, which seriously damages the surface integrity of metal materials such as copper sheets and affects the subsequent assembly accuracy and performance of the workpiece.

[0005] In view of this, how to overcome the shortcomings of the existing technology has become the subject of study and solution of this invention. Summary of the Invention

[0006] The purpose of this invention is to provide a copper sheet processing method that prevents slag residue from remaining on the back side.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0008] A method for processing copper sheets to prevent slag residue on the back side includes the following steps:

[0009] Step 1: Polish the surface of the copper sheet;

[0010] Step 2: Remove surface impurities from the copper sheet after polishing;

[0011] Step 3: Deposit a metal sacrificial layer on the back side of the copper sheet;

[0012] Step 4: Fix the metal sacrificial layer to the carrier using a wax layer, so that the back of the copper sheet faces the carrier;

[0013] Step 5: Place the front side of the copper sheet close to the laser cutting equipment, and use the laser cutting equipment to laser cut the copper sheet. Then cool the processed copper sheet.

[0014] Step 6: Heat the wax layer, then separate the copper sheet from the carrier;

[0015] Step 7: Remove any remaining wax from the copper sheet;

[0016] Step 8: Remove the metal sacrificial layer on the back of the copper sheet.

[0017] In step one, a portion (approximately 10µm) of the surface layer of the copper sheet is removed through polishing (grinding) to remove defects such as scratches on the surface of the copper sheet.

[0018] In step three, a metal sacrificial layer is deposited on the back of the copper sheet to prevent slag from adhering to the back of the copper sheet.

[0019] In step four, the metal sacrificial layer is fixed to the carrier by a wax layer, which facilitates fixation and processing.

[0020] In step five, the copper sheet can be naturally cooled to room temperature (25°C) after processing.

[0021] Step six can be specifically as follows: Remove the processed copper sheet from the laser cutting equipment, place the copper sheet along with the carrier on a baking plate, and after the wax melts, peel the copper sheet off from the edge. The heating temperature of the baking plate can be 100 degrees Celsius, and the heating time can be 2 minutes.

[0022] In steps six, seven, and eight, the wax and metal sacrificial layer are removed to obtain a material with no residue on the surface.

[0023] In summary, this application deposits a metal sacrificial layer on the back side of the copper sheet material to be processed, so that the slag generated by laser cutting of the copper sheet is blocked by the metal sacrificial layer. This prevents the slag from gradually approaching, adhering to, and cooling and fixing to the back side of the copper sheet, thus avoiding the slag from damaging the surface quality of the copper sheet material. This results in a copper sheet material with no impurities remaining on the surface, reduces cleaning time, improves processing efficiency, and avoids the phenomenon of surface damage to the copper sheet material caused by existing slag removal methods.

[0024] Further technical solutions, step two includes the following steps:

[0025] S1. Wipe the copper sheet with anhydrous ethanol to remove oil and particles from its surface;

[0026] S2. Wait for the anhydrous ethanol on the surface of the copper sheet to evaporate naturally.

[0027] Anhydrous ethanol can provide a more thorough cleaning of copper sheets, such as removing oil stains. Furthermore, anhydrous ethanol evaporates naturally, requiring no additional treatment and simplifying the impurity removal process. The preset time can be 5 minutes, but the exact time is not limited.

[0028] Further technical solutions, step four includes the following steps:

[0029] S1. Apply solid wax evenly to the vehicle to form a wax layer on the vehicle;

[0030] S2. Adhere the surface of the metal sacrificial layer away from the copper sheet to the wax layer;

[0031] S3. Pressurization and cooling are used to keep the metal sacrificial layer and the wax layer relatively fixed.

[0032] There are no restrictions on the type of solid wax or the specific structure of the vehicle, as long as it can achieve the corresponding purpose.

[0033] By applying pressure (pressure unlimited), the metal sacrificial layer and the wax layer can be tightly bonded together, and by cooling (temperature unlimited), the wax layer can be solidified. This achieves relative fixation of the metal sacrificial layer, the wax layer, the copper sheet, and the carrier, preventing slippage of the copper sheet during laser processing and ensuring processing quality. The fixation of the carrier is not limited here.

[0034] In a further technical solution, the metal sacrificial layer is set as an aluminum sacrificial layer;

[0035] In step eight, the copper sheet is placed with the back side facing up in a sacrificial layer dissolving solution, which is selected from any one or a combination of NaOH solution and KOH solution.

[0036] The aluminum sacrificial layer can also be understood as an aluminum film, which can be formed by PVD (physical vapor deposition) process, an existing method, which will not be elaborated here.

[0037] Using NaOH solution as an example, NaOH solution reacts with metallic aluminum, thus quickly removing the aluminum sacrificial layer on the back of the copper sheet. NaOH solution does not react with copper (ignoring special cases such as high temperatures), therefore, it avoids degrading the surface quality of the copper sheet.

[0038] Optionally, in step eight, the temperature of the sacrificial layer dissolution solution is 25°C.

[0039] A further technical solution, in step five, involves using nitrogen gas to help blow away the slag on the front side of the copper sheet while operating the laser cutting equipment. This can also suppress the oxidation of the copper sheet due to air during the laser processing.

[0040] In step five, several pieces of material can be cut from the copper sheet. These materials can be arranged into a rectangular array, with adjacent materials spaced 0.4 μm apart. The length of each material is 6000 μm and the width is 60 μm. During this process, a nanosecond laser is used for laser processing, which is performed in a nitrogen atmosphere.

[0041] Further technical solutions, step seven includes the following steps:

[0042] S1. Place the copper sheet in anhydrous ethanol for ultrasonic cleaning to remove the wax residue on the copper sheet;

[0043] S2. Place the copper sheet in pure water for ultrasonic cleaning to remove any residual anhydrous ethanol from the copper sheet.

[0044] It should be noted that the metal sacrificial layer still exists in step seven, so it can also be understood as removing the wax residue on the copper sheet and the metal sacrificial layer.

[0045] Continuous ultrasonic cleaning, combined with the use of anhydrous ethanol, can completely remove residual wax, thus promoting the production of a clean copper sheet. Understandably, heating alone can generally only separate the wax layer from the metal sacrificial layer.

[0046] Optionally, in step seven, S1, the temperature of the anhydrous ethanol is 40℃, the ultrasonic power is 240W, the frequency is 40kHz, and the cleaning time is 5min. In step seven, S2, the cleaning temperature is 25℃, the ultrasonic power is 240W, the frequency is 40kHz, and the cleaning time is 3min.

[0047] A further technical solution involves a metal sacrificial layer with a thickness ranging from 0.5 to 2.0 μm.

[0048] Test data shows that if the thickness of the metal sacrificial layer is less than 0.5µm (for example, 0.1µm), slag is easily left on the back of the copper sheet, and the thinner the layer, the more slag remains. If the thickness of the metal sacrificial layer is greater than 2.0µm, it will increase unnecessary costs.

[0049] A further technical solution also includes step nine, which includes the following steps:

[0050] S1. Place the copper sheet after removing the metal sacrificial layer in pure water for ultrasonic cleaning to remove the residual metal sacrificial layer and other impurities.

[0051] S2. Immerse the cleaned copper sheet in isopropanol for dehydration to replace the water on the surface of the copper sheet, avoid leaving watermarks due to evaporation during the drying process, and reduce the risk of oxidation of the copper sheet surface; specific parameters, such as the concentration of isopropanol, are not limited here, as long as the purpose of dehydration is achieved.

[0052] S3. Transfer the dehydrated copper sheet to a nitrogen drying tank for drying to (quickly and without residue) remove residual isopropanol. The nitrogen drying tank can also be called a nitrogen drying oven.

[0053] Optionally, in step nine, S1, the cleaning temperature is 25℃, the ultrasonic power is 240W, the frequency is 40kHz, and the cleaning time is 5min. In step nine, S3, the drying temperature is 60℃, and the drying time is 10min.

[0054] Due to the application of the above-mentioned solution, the technical solution of this application has the following advantages and effects compared with the prior art:

[0055] This application deposits a metal sacrificial layer on the back of the copper sheet material to be processed, so that the slag generated by laser cutting of the copper sheet is blocked by the metal sacrificial layer, preventing the slag from gradually approaching, adhering to and cooling and fixing to the back of the copper sheet. This can prevent the slag from damaging the surface quality of the copper sheet material, resulting in a copper sheet material with no impurities remaining on the surface, reducing cleaning time, improving processing efficiency, and avoiding the phenomenon of surface damage to the copper sheet material caused by existing slag removal methods. Attached Figure Description

[0056] Figure 1 This is a flowchart of the slag removal method according to an embodiment of the present invention;

[0057] Figure 2 This is a schematic diagram showing the positions of the copper sheet and the carrier in an embodiment of the present invention;

[0058] Figure 3 This is a schematic diagram of the cut copper sheet according to an embodiment of the present invention.

[0059] In the above attached figures: 1. Copper sheet; 2. Metal sacrificial layer; 3. Wax layer; 4. Carrier. Detailed Implementation

[0060] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0061] The terms “include,” “including,” and “have” used in this article are all open-ended, meaning they include but are not limited to.

[0062] Unless otherwise specified, the terms used herein generally have their ordinary meaning in the context of the art, the subject matter, and the specific context. Certain terms used to describe this case will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing this case.

[0063] The terminology used herein is for the purpose of describing specific embodiments only and is not intended to limit the scope of this work. Singular forms such as “a,” “this,” “this,” “the,” and “the” as used herein also include plural forms.

[0064] See Figures 1-3 A method for processing copper sheets to prevent slag residue on the back side includes the following steps:

[0065] Step 1: Polish the surface of copper sheet 1;

[0066] Step 2: Remove surface impurities from copper sheet 1 after polishing;

[0067] Step 3: Deposit a metal sacrificial layer 2 on the back side of copper sheet 1;

[0068] Step 4: Fix the metal sacrificial layer 2 to the carrier 4 using the wax layer 3, so that the back of the copper sheet 1 faces the carrier 4;

[0069] Step 5: Place the front side of copper sheet 1 close to the laser cutting equipment, and use the laser cutting equipment to laser cut copper sheet 1, and then cool the processed copper sheet 1.

[0070] Step 6: Heat the wax layer 3, and then separate the copper sheet 1 from the carrier 4;

[0071] Step 7: Remove any remaining wax from copper sheet 1;

[0072] Step 8: Remove the metal sacrificial layer 2 from the back of copper sheet 1.

[0073] In step one, a portion (approximately 10 μm) of the surface layer of copper sheet 1 is removed through polishing (grinding) to remove defects such as scratches on the surface of copper sheet 1.

[0074] In step three, a metal sacrificial layer 2 is deposited on the back side of the copper sheet 1 to prevent slag from adhering to the back side of the copper sheet 1.

[0075] In step four, the metal sacrificial layer 2 is fixed to the carrier 4 by the wax layer 3, which facilitates fixing and processing.

[0076] In step five, after copper sheet 1 is processed, it can be naturally cooled to room temperature (25 degrees Celsius).

[0077] Step six can be specifically as follows: Remove the processed copper sheet 1 from the laser cutting equipment, place the copper sheet 1 together with the carrier 4 on the baking plate, and after the wax melts, peel off the copper sheet 1 from the edge. The heating temperature of the baking plate can be 100 degrees Celsius, and the heating time can be 2 minutes.

[0078] In steps six, seven, and eight, the wax and metal sacrificial layer 2 are removed to obtain a material with no residue on the surface.

[0079] In summary, this application deposits a metal sacrificial layer 2 on the back side of the copper sheet 1 to be processed, so that the slag generated by laser cutting of the copper sheet 1 is blocked by the metal sacrificial layer 2, preventing the slag from gradually approaching, adhering to and cooling and fixing to the back side of the copper sheet 1. This can prevent the slag from damaging the surface quality of the copper sheet 1, resulting in a copper sheet 1 with no impurities remaining on the surface, reducing cleaning time, improving processing efficiency, and avoiding the phenomenon of surface damage to the copper sheet 1 caused by existing slag removal methods, thus solving the various problems in the background art.

[0080] Here is an example of wax layer 3: Wax layer 3 can be made of high-viscosity adhesive wax with a melting point of 70℃ and a viscosity of 300 Pa·s. The coating thickness can be controlled at 500 μm, and the coating amount is not specifically required, only needing to meet the preset coating thickness. The specific parameters of wax layer 3 are not limited, as long as it has excellent adhesive properties, is easy to remove, and can be used for temporary fixation of workpieces during grinding and cutting.

[0081] In this embodiment, step two includes the following steps:

[0082] S1. Wipe copper sheet 1 with anhydrous ethanol to remove oil and particulate matter from the surface of copper sheet 1;

[0083] S2. Wait for the predetermined time until the anhydrous ethanol on the surface of copper sheet 1 evaporates naturally.

[0084] Anhydrous ethanol can further clean copper sheet 1 thoroughly, such as removing oil stains. Furthermore, anhydrous ethanol evaporates naturally, requiring no additional treatment and simplifying the impurity removal process. The preset time can be 5 minutes, but the exact time is not limited.

[0085] In this embodiment, step four includes the following steps:

[0086] S1. Apply solid wax evenly to the carrier 4 to form a wax layer 3 on the carrier 4;

[0087] S2. Adhere the surface of the metal sacrificial layer 2 away from the copper sheet 1 to the wax layer 3;

[0088] S3. The metal sacrificial layer 2 and the wax layer 3 are kept relatively fixed by applying pressure and cooling.

[0089] There are no restrictions on the type of solid wax, nor on the specific structure of vehicle 4, as long as it can achieve the corresponding purpose.

[0090] By applying pressure (pressure is not limited), the metal sacrificial layer 2 and the wax layer 3 can be tightly bonded together, and by cooling (temperature is not limited), the wax layer 3 can be solidified. This achieves relative fixation of the metal sacrificial layer 2, the wax layer 3, the copper sheet 1, and the carrier 4, preventing the copper sheet 1 from slipping during laser processing and ensuring processing quality. The fixation of the carrier 4 is not limited here.

[0091] In this embodiment, in step four, the metal sacrificial layer 2 is set as an aluminum sacrificial layer;

[0092] In step eight, copper sheet 1 is placed with its back side facing up in a sacrificial layer dissolving solution, which is selected from any one or a combination of NaOH solution and KOH solution.

[0093] The aluminum sacrificial layer can also be understood as an aluminum film, which can be formed by PVD (physical vapor deposition) process, an existing method, which will not be elaborated here.

[0094] Using NaOH solution as an example, NaOH solution reacts with metallic aluminum, thus quickly removing the aluminum sacrificial layer on the back of copper sheet 1. NaOH solution does not react with copper (ignoring special cases such as high temperature), thus avoiding degrading the surface quality of copper sheet 1.

[0095] Optionally, in step eight, the temperature of the sacrificial layer dissolution solution is 25°C.

[0096] In this embodiment, in step five, while running the laser cutting equipment, nitrogen gas is used to help blow away the slag on the front side of the copper sheet 1, which can also suppress the oxidation of the copper sheet 1 due to air during the laser processing.

[0097] In step five, several materials can be cut from the copper sheet 1. These materials can be arranged into a rectangular array, with adjacent materials spaced 0.4 μm apart, and the length and width of each material being 6000 μm. During this process, a nanosecond laser is used for laser processing, which is performed in a nitrogen atmosphere.

[0098] In this embodiment, step seven includes the following steps:

[0099] S1. Place copper sheet 1 in anhydrous ethanol for ultrasonic cleaning to remove the wax residue on copper sheet 1;

[0100] S2. Place copper sheet 1 in pure water for ultrasonic cleaning to remove the anhydrous ethanol remaining on copper sheet 1.

[0101] It should be noted that in step seven, the metal sacrificial layer 2 still exists. Therefore, it can also be understood as removing the wax residue on the copper sheet 1 and the metal sacrificial layer 2.

[0102] Continuous ultrasonic cleaning, along with the aid of anhydrous ethanol, can completely remove residual wax, thereby promoting the obtaining of a clean copper sheet 1. Understandably, heating alone can generally only separate the wax layer 3 from the metal sacrificial layer 2.

[0103] Optionally, in step seven, S1, the temperature of the anhydrous ethanol is 40℃, the ultrasonic power is 240W, the frequency is 40kHz, and the cleaning time is 5min. In step seven, S2, the cleaning temperature is 25℃, the ultrasonic power is 240W, the frequency is 40kHz, and the cleaning time is 3min.

[0104] In this embodiment, the thickness of the metal sacrificial layer 2 ranges from 0.5 to 2.0 μm.

[0105] Test data shows that if the thickness of the metal sacrificial layer 2 is less than 0.5µm (for example, 0.1µm), molten slag is easily left on the back of the copper sheet 1 (a thinner metal sacrificial layer 2 is insufficient to block the molten residue generated during laser cutting), and the thinner the layer, the more molten slag remains. If the thickness of the metal sacrificial layer 2 is greater than 2.0µm, it will increase unnecessary costs.

[0106] In this embodiment, step nine is also included, which includes the following steps:

[0107] S1. Place the copper sheet 1 after removing the metal sacrificial layer 2 in pure water for ultrasonic cleaning to remove the remaining metal sacrificial layer 2 and other impurities.

[0108] S2. Immerse the cleaned copper sheet 1 in isopropanol for dehydration to replace the water on the surface of the copper sheet 1, avoid leaving watermarks due to evaporation of residual water during the drying process, and reduce the risk of oxidation of the copper sheet surface; specific parameters, such as the concentration of isopropanol, are not limited here, as long as the purpose of dehydration is achieved.

[0109] S3. Transfer the dehydrated copper sheet 1 to a nitrogen drying tank for drying to quickly and completely remove residual isopropanol. The nitrogen drying tank can also be called a nitrogen drying oven.

[0110] Optionally, in step nine, S1, the cleaning temperature is 25℃, the ultrasonic power is 240W, the frequency is 40kHz, and the cleaning time is 5min. In step nine, S3, the drying temperature is 60℃, and the drying time is 10min.

[0111] The following provides specific embodiments and comparative examples for illustration.

[0112] Example 1

[0113] (1) Polish a copper sheet with a length and width of 20cm*20cm and a thickness of 80um to remove about 10um. After polishing, wipe the surface of the copper sheet with a lint-free cloth dipped in anhydrous ethanol, and then wait for the anhydrous ethanol to evaporate naturally.

[0114] (2) A layer of aluminum film with a thickness of 1 μm was deposited on the back of the copper sheet using PVD.

[0115] (3) Apply solid wax evenly to the carrier, then place the copper sheet face up on the carrier and attach it. After pressurization and cooling, the copper sheet is fixed on the surface of the carrier. Then, the carrier is placed in the laser equipment for processing.

[0116] (4) Laser processing is performed on the copper sheet material, and nitrogen gas is used to blow away the excess slag on the front of the copper sheet.

[0117] (5) After the material to be processed has cooled naturally to room temperature of 25°C, take out the carrier and place it on a baking plate at 100°C. Heat for 2 minutes to melt the wax on the back of the material, and then remove the material along the edge of the copper sheet.

[0118] (6) Suspend the copper sheet material in a container filled with anhydrous ethanol, heat the anhydrous ethanol to 50°C, turn on the ultrasonic cleaner and clean for 5 minutes, and then put the copper sheet into the water and ultrasonic for 3 minutes.

[0119] (7) Place the aluminum-plated side of the copper sheet material upward and immerse it in a 30wt% KOH solution for 2 minutes. After the reaction is complete, ultrasonically clean the copper sheet material in pure water for 5 minutes.

[0120] (8) Immerse the copper sheet material in isopropanol for dehydration, and then transfer it to a nitrogen drying tank for 10 minutes to obtain a clean copper sheet material with no slag residue on the back.

[0121] Example 2

[0122] The only difference from Example 1 is that 30wt% NaOH solution is used instead of 30wt% KOH solution, resulting in a clean copper sheet material with no slag residue on the back side.

[0123] Comparative Example 1

[0124] The only difference from Example 1 is that the thickness of the aluminum film is adjusted to 0.1 μm, and the final copper sheet material has some black slag residue on the back.

[0125] Comparative Example 2

[0126] The only difference from Example 1 is that a 10% (v / v) dilute hydrochloric acid solution was used instead of a 30wt% KOH solution. Although there was no slag residue on the surface of the copper sheet material, oxidation and yellowing occurred. This is because the 10% (v / v) dilute hydrochloric acid is more corrosive to the copper sheet than the 30wt% KOH solution, which causes the copper sheet to be oxidized as a whole, resulting in yellowing.

[0127] Comparative Example 3

[0128] The only difference from Example 1 is that a 10% (v / v) dilute sulfuric acid solution was used instead of a 30wt% KOH solution. Although no slag residue remained on the surface of the copper sheet material, oxidation and yellowing occurred.

[0129] In summary, the thickness of the aluminum film and the type of sacrificial layer solution both have a significant impact on the processing quality of copper sheet materials.

[0130] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A method for processing copper sheets to prevent slag residue on the back side, characterized in that: Includes the following steps: Step 1: Polish the surface of the copper sheet (1); Step 2: Remove surface impurities from the copper sheet (1) after polishing; Step 3: Deposit a metal sacrificial layer (2) on the back side of the copper sheet (1); Step 4: Fix the metal sacrificial layer (2) to the carrier (4) through the wax layer (3) so that the back of the copper sheet (1) faces the carrier (4). Step 5: Place the front side of the copper sheet (1) close to the laser cutting equipment and perform laser cutting on the copper sheet (1) using the laser cutting equipment, and then cool the processed copper sheet (1). Step 6: Heat the wax layer (3), and then separate the copper sheet (1) from the carrier (4); Step 7: Remove the wax residue on the copper sheet (1); Step 8: Remove the metal sacrificial layer (2) from the back of the copper sheet (1).

2. The method for processing copper sheets to prevent slag residue on the back side according to claim 1, characterized in that: Step two includes the following steps: S1. Wipe the copper sheet (1) with anhydrous ethanol to remove oil and particulate matter from the surface of the copper sheet (1); S2. Wait for the anhydrous ethanol on the surface of the copper sheet (1) to evaporate naturally.

3. The method for processing copper sheets to prevent slag residue on the back side according to claim 1, characterized in that: Step four includes the following steps: S1. Apply solid wax evenly to the carrier (4) to form a wax layer (3) on the carrier (4). S2. The side of the metal sacrificial layer (2) facing away from the copper sheet (1) is bonded to the wax layer (3); S3. The metal sacrificial layer (2) and the wax layer (3) are kept relatively fixed by pressurization and cooling.

4. A method for processing copper sheets to prevent slag residue on the back side according to any one of claims 1-3, characterized in that: The metal sacrificial layer (2) is set as an aluminum sacrificial layer; In step eight, the copper sheet (1) is placed with its back side facing up in the sacrificial layer dissolving solution, which is selected from any one or a combination of NaOH solution and KOH solution.

5. A method for processing copper sheets to prevent slag residue on the back side according to any one of claims 1-3, characterized in that: In step five, while running the laser cutting equipment, nitrogen gas is used to help blow away the slag on the front side of the copper sheet (1).

6. A method for processing copper sheets to prevent slag residue on the back side according to any one of claims 1-3, characterized in that: Step seven includes the following steps: S1. Place the copper sheet (1) in anhydrous ethanol for ultrasonic cleaning to remove the wax residue on the copper sheet (1); S2. Place the copper sheet (1) in pure water for ultrasonic cleaning to remove the anhydrous ethanol remaining on the copper sheet (1).

7. A method for processing copper sheets to prevent slag residue on the back side according to any one of claims 1-3, characterized in that: The thickness of the metal sacrificial layer (2) ranges from 0.5 to 2.0 μm.

8. A method for processing copper sheets to prevent slag residue on the back side according to any one of claims 1-3, characterized in that: It also includes step nine, which includes the following steps: S1. Place the copper sheet (1) after removing the metal sacrificial layer (2) in pure water for ultrasonic cleaning to remove residual impurities; S2. Immerse the cleaned copper sheet (1) in isopropanol for dehydration to replace the water on the surface of the copper sheet (1), avoid leaving water marks due to evaporation of residual water during the drying process, and reduce the risk of oxidation of the surface of the copper sheet (1). S3. Transfer the dehydrated copper sheet (1) to a nitrogen drying tank for drying to remove residual isopropanol.

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