Glass-based carrier plate and preparation method thereof

Abstract

The invention discloses a glass-based carrier plate and a preparation method thereof. The glass-based carrier plate comprises a glass substrate, a dielectric layer located on at least one side of the glass substrate, and an insulating layer located on the side, away from the glass substrate, of the dielectric layer. Wherein the dielectric layer comprises glass fiber cloth, the glass fiber cloth comprises a plurality of warp yarns and a plurality of weft yarns, and the linear densities and / or tensions of the warp yarns and the weft yarns are different. According to the present invention, the warp yarn and the weft yarn form the difference in the line density and / or the tension, such that the microstructure of the interface between the glass substrate and the insulating layer is optimized, the peeling strength is improved, and the interface layering phenomenon between the glass substrate and the insulating layer is prevented. Besides, the dielectric layer is used as a flexible stress buffer structure, can effectively passivate the jump of the thermal expansion coefficient between the glass substrate and the insulating layer, and remarkably reduces the warping and cracking risks caused by thermal stress.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a glass substrate and its preparation method. Background Technology

[0002] Advanced packaging technologies are evolving towards heterogeneous integration, ultra-high I / O density, and ultra-large sizes, placing increasingly stringent demands on the performance of packaging substrates. Traditional organic substrates suffer from high coefficients of thermal expansion and limited in-plane dimensional stability, easily leading to severe warping when handling large chip packaging. In contrast, glass substrates possess extremely low and adjustable coefficients of thermal expansion, closely matching silicon chips; their high rigidity and excellent dimensional stability provide the necessary mechanical support for ultra-large-size packaging. Simultaneously, the excellent surface flatness of glass substrates facilitates the fine fabrication of micron- or even submicron-level circuitry and exhibits good high-frequency electrical performance.

[0003] However, the smooth and chemically inert surface of glass results in insufficient adhesion to organic polymers such as ABF, making it prone to interfacial delamination during damp heat testing and thermal cycling. Furthermore, the difference in thermal expansion coefficients between the glass substrate and organic materials like ABF exceeds one order of magnitude. During high-heat-load packaging processes such as reflow soldering, the resulting high thermomechanical stress concentrates at the interface, easily leading to glass substrate cracking or defects within the ABF layer, posing a risk of "board explosion." Summary of the Invention

[0004] This application provides a glass substrate and its preparation method to solve the problems of interface delamination, glass substrate cracking, and risk of substrate explosion caused by insufficient bonding strength and mismatch of thermal expansion coefficients between the glass substrate and the organic polymer material.

[0005] A first aspect of this application provides a glass substrate, comprising: Glass substrate; A dielectric layer is located on at least one side of the glass substrate; An insulating layer is located on the side of the dielectric layer away from the glass substrate; The dielectric layer comprises a glass fiber cloth, which includes multiple warp yarns and multiple weft yarns, wherein the linear density and / or tension of the warp yarns and the weft yarns are different.

[0006] In some embodiments, the linear density of the warp yarn is greater than that of the weft yarn, and the tension of the warp yarn is greater than that of the weft yarn.

[0007] In some embodiments, the warp yarns and the weft yarns are interwoven alternately in the same plane, wherein multiple warp yarns are arranged along a first direction and multiple weft yarns are arranged along a second direction; the first direction and the second direction are located in the plane containing the warp yarns and the weft yarns and intersect each other.

[0008] In some embodiments, a plurality of warp yarns are arranged sequentially along a first direction to form a warp layer, and a plurality of weft yarns are arranged sequentially along a second direction to form a weft layer; wherein the warp layer and the weft layer are stacked together along the thickness direction, the weft layer is located on the side facing the insulating layer, and the first direction and the second direction intersect each other.

[0009] In some embodiments, the dielectric layer further includes a resin matrix, wherein the resin matrix comprises 30%-70% by mass in the dielectric layer.

[0010] In some embodiments, the dielectric layer further includes a filler comprising silicon dioxide and / or boron nitride.

[0011] In some embodiments, the warp and weft yarns comprise: E-glass fiber, NE-glass fiber, or S-glass fiber.

[0012] A second aspect of this application provides a method for preparing a glass substrate, comprising: A glass fiber cloth is prepared, the glass fiber cloth comprising: multiple warp yarns and multiple weft yarns, wherein the linear density and / or tension of the warp yarns and the weft yarns are different; The fiberglass cloth is impregnated with a resin matrix and dried semi-cured to form a prepreg. The glass substrate, the prepreg, and the insulating layer are stacked sequentially and pressed together in a vacuum environment to completely cure the resin matrix.

[0013] In some embodiments, the preparation of the glass fiber cloth specifically includes: Multiple warp yarns are arranged along a first direction, and multiple weft yarns are arranged along a second direction, such that the warp and weft yarns are alternately interwoven in the same plane to form the glass fiber cloth with interlacing points; or Multiple warp yarns are arranged sequentially along a first direction and temporarily fixed with a thermodegradable adhesive thread to form a warp layer; Multiple weft yarns are arranged sequentially along the second direction and temporarily fixed with thermally degradable adhesive thread to form a weft yarn layer; The warp layer and the weft layer are overlapped along the thickness direction, with the weft layer located on the side facing the insulation layer, to form the glass fiber cloth without interlacing points.

[0014] In some embodiments, after impregnating the fiberglass cloth with a resin matrix and drying it semi-cured to form a prepreg, the method further includes: An array of microgrooves is formed on the side of the prepreg facing the insulating layer.

[0015] The beneficial effects of this application are as follows: This application provides a glass substrate and its preparation method. The glass substrate includes a glass substrate, a dielectric layer located on at least one side of the glass substrate, and an insulating layer located on the side of the dielectric layer away from the glass substrate. The dielectric layer comprises a glass fiber cloth, which includes multiple warp yarns and multiple weft yarns, with different linear densities and / or tensions between the warp and weft yarns. By creating a difference in linear density and / or tension between the warp and weft yarns, the microstructure of the interface between the glass substrate and the insulating layer is optimized, peel strength is improved, and interfacial delamination between the glass substrate and the insulating layer is prevented. Furthermore, the dielectric layer, as a flexible stress buffer structure, can effectively passivate the abrupt change in the coefficient of thermal expansion between the glass substrate and the insulating layer, significantly reducing the risk of warping and cracking caused by thermal stress. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the glass substrate provided in the embodiments of this application; Figure 2 One of the schematic diagrams illustrating the formation process of the glass fiber cloth provided in the embodiments of this application; Figure 3 This is a second schematic diagram illustrating the formation process of the glass fiber cloth provided in the embodiments of this application; Figure 4 A flowchart illustrating the preparation method of the glass substrate provided in the embodiments of this application. Detailed Implementation

[0018] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the application will be further described below in conjunction with the accompanying drawings and embodiments. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. Terms describing position and direction described in this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of this application are for illustrating relative positional relationships only and do not represent actual scale.

[0019] Advanced packaging technologies are evolving towards heterogeneous integration, ultra-high I / O density, and ultra-large sizes, placing increasingly stringent demands on the performance of packaging substrates. Traditional organic substrates (e.g., FR-4, BT resin substrates) suffer from high coefficients of thermal expansion and limited in-plane dimensional stability, easily leading to severe warping when handling large chip packages. In contrast, glass substrates possess extremely low and adjustable coefficients of thermal expansion, closely matching silicon chips. Their high rigidity and excellent dimensional stability provide the necessary mechanical support for ultra-large-size packaging. Furthermore, the excellent surface flatness of glass substrates facilitates the fine fabrication of micron- or even submicron-level circuitry and offers superior high-frequency electrical performance.

[0020] However, the smooth and chemically inert surface of glass results in insufficient adhesion to organic polymers such as ABF, making it prone to interfacial delamination during damp heat testing (e.g., JEDEC JESD22-A101 steady-state damp heat test) and thermal cycling tests. Furthermore, the coefficient of thermal expansion (CTE) of the glass substrate is approximately 3.5 ppm / ℃, while that of ABF is approximately 40 ppm / ℃-50 ppm / ℃, a difference exceeding one order of magnitude. During high-heat-load packaging processes such as reflow soldering, the resulting high thermomechanical stress concentrates at the interface, easily leading to glass substrate cracking or defects within the ABF layer, posing a risk of "board explosion."

[0021] In view of this, embodiments of this application provide a glass substrate to solve the problems of interface delamination, glass substrate cracking, and risk of board explosion caused by insufficient bonding strength and mismatch of thermal expansion coefficients between the glass substrate and the organic polymer material.

[0022] Figure 1 This is a schematic diagram of the structure of a glass substrate provided in an embodiment of this application, as shown below. Figure 1 As shown, the glass substrate includes: a glass substrate 1, a dielectric layer 2, and an insulating layer 3. The dielectric layer 2 is located on at least one side of the glass substrate 1. In a specific embodiment, such as... Figure 1As shown, the dielectric layer 2 can be located on both sides of the glass substrate 1. The insulating layer 3 is located on the side of the dielectric layer 2 away from the glass substrate 1. The insulating layer 3 can be an ABF layer or other organic polymer material, which is not specifically limited here. The dielectric layer 2 includes, for example,... Figure 2 or Figure 3 The glass fiber cloth 21 shown comprises multiple warp yarns 211 and multiple weft yarns 212, with different linear densities and / or tensions between the warp yarns 211 and the weft yarns 212. This embodiment optimizes the microstructure of the interface between the glass substrate 1 and the insulating layer 3 by creating a difference in linear density and / or tension between the warp yarns 211 and the weft yarns 212, thereby improving peel strength and preventing interface delamination between the glass substrate 1 and the insulating layer 3. Furthermore, the dielectric layer 2, as a flexible stress buffer structure, effectively passivates the abrupt change in the coefficient of thermal expansion between the glass substrate 1 and the insulating layer 3, significantly reducing the risk of warping and cracking caused by thermal stress.

[0023] like Figure 1 As shown, the glass substrate also includes a conductive metal layer 4 located on the side of the insulating layer 3 away from the dielectric layer 2. The conductive metal layer 4 can be copper, aluminum, or a copper-aluminum alloy, and is not specifically limited here. The conductive metal layer 4 is formed on the surface of the insulating layer 3 by electroplating, chemical plating, or sputtering processes, and is used to form high-density interconnect lines to realize the electrical connection between the chip and external circuits. The glass substrate also includes a through-hole H, which penetrates the glass substrate 1, the dielectric layer 2, and the insulating layer 3. The inner wall of the through-hole H is electroplated with a seed layer (…). Figure 1 (Not shown) and a conductive metal layer 4, the seed layer being a titanium / copper composite layer or a chromium / copper composite layer, used to enhance the adhesion between the conductive metal layer 4 and the glass substrate 1. The conductive metal layer 4 is formed on the inner wall of the through hole H, enabling vertical electrical conduction between the upper and lower surfaces of the glass substrate and between the multilayer structures.

[0024] In some embodiments, the linear density of warp yarn 211 is greater than that of weft yarn 212, and the tension of warp yarn 211 is greater than that of weft yarn 212. In a specific embodiment, the linear density of warp yarn 211 can be 100 Tex with a tension of 25 cN, and the linear density of weft yarn 212 can be 50 Tex with a tension of 15 cN. The lower linear density and lower tension of weft yarn 212 make it easier to deform during the pressing process, thereby forming a mechanical interlocking structure with the flowing insulating layer 3, greatly improving the peel strength and preventing the phenomenon of interface delamination between the glass substrate 1 and the insulating layer 3. At the same time, the higher linear density and higher tension of warp yarn 211 provide structural support, and through the synergistic effect of micro-mechanical interlocking and resin chemical bonding, the peel strength of the interface is further improved, ensuring the long-term reliability of the glass substrate in high temperature and high humidity environments.

[0025] In some embodiments, Figure 2 The diagram shows the formation process of interwoven fiberglass cloth, as shown below. Figure 2 As shown, warp yarns 211 and weft yarns 212 are alternately interwoven in the same plane. Multiple warp yarns 211 are arranged along a first direction X, and multiple weft yarns 212 are arranged along a second direction Y. The first direction X and the second direction Y are located within the plane containing the warp yarns 211 and weft yarns 212 and intersect each other. By alternately interweaving multiple warp yarns 211 and multiple weft yarns 212 in the same plane to form a glass fiber cloth 21 with interlacing points, and placing the dielectric layer 2 containing the glass fiber cloth 21 between the glass substrate 1 and the insulating layer 3, the problems of insufficient interfacial bonding force and mismatch of thermal expansion coefficients between the glass substrate 1 and the insulating layer 3 are solved. Preferably, when the first direction X and the second direction Y are orthogonal, optimal anisotropic mechanical properties and stress distribution effects can be obtained. Specifically, the weft yarns 212 of the glass fiber cloth 21, which have lower linear density and tension, can deform during the pressing process, forming a micro-mechanical interlocking structure with the flowing insulating layer 3. Simultaneously, the warp yarns 211, with higher linear density and tension, provide structural support. Through the synergistic effect of micro-mechanical interlocking and resin chemical bonding, the peel strength of the interface is improved, ensuring long-term reliability under high temperature and high humidity environments. Furthermore, the dielectric layer 2, as a flexible stress buffer structure, can effectively buffer and dissipate thermal stress caused by the large difference in thermal expansion coefficients, significantly reducing the risk of cracking of the glass substrate 1 and defects in the insulating layer 3.

[0026] In some embodiments, Figure 3 The formation process of the laminated glass fiber cloth 21, such as... Figure 3 As shown, multiple warp yarns 211 are arranged sequentially along the first direction X to form a warp layer M, and multiple weft yarns 212 are arranged sequentially along the second direction Y to form a weft layer N. The warp layer M and the weft layer N are stacked along the thickness direction, with the weft layer N located on the side facing the insulating layer 3. The first direction X and the second direction Y intersect each other. The non-interlaced stacked structure of the glass fiber cloth 21 can reduce or eliminate interlacing point protrusions, thereby achieving more uniform resin flow and a smoother interface, reducing defects in subsequent photolithography and electroplating processes, and improving stress distribution. Preferably, when the first direction X and the second direction Y are orthogonal, optimal anisotropic mechanical properties and stress distribution effects can be obtained. Specifically, a weft layer N with lower linear density and tension is used facing the insulating layer 3, resulting in greater deformation during the pressing process. This forms a micro-mechanical interlocking structure with the flowing insulating layer 3. Simultaneously, a warp layer N with higher linear density and tension provides structural support. Through the synergistic effect of micro-mechanical interlocking and resin chemical bonding, the interfacial peel strength is further improved, ensuring long-term reliability under high temperature and high humidity environments. Furthermore, the dielectric layer 2, as a flexible stress buffer structure, effectively buffers and dissipates thermal stress caused by the large difference in thermal expansion coefficients, significantly reducing the risk of cracking of the glass substrate 1 and defects in the insulating layer 3.

[0027] The glass substrate was subjected to a thermal cycling test at -55°C to 125°C for 1000 cycles. The integrity rate of the glass substrate in this application exceeded 99.5%, significantly reducing the risk of breakage. Simultaneously, the 90-degree peel strength between the insulating layer 3 and the glass substrate 1 was improved by more than 50%. Specifically, the glass substrate with the laminated glass fiber cloth 21 exhibited a peel strength greater than 10 N / cm. Therefore, the glass substrate provided in this embodiment effectively improves interface bonding strength, thermal cycling reliability, and breakage resistance, meeting the requirements of high-reliability packaging scenarios.

[0028] In some embodiments, the dielectric layer 2 further includes a resin matrix, wherein the resin matrix constitutes 30%-70% of the dielectric layer 2 by mass, for example, 40%, 50%, 60%, etc. In specific implementations, the resin matrix can be modified epoxy resin, BT resin, polyimide (PI), or a low-loss thermoplastic material. By controlling the mass percentage of the resin matrix in the dielectric layer 2 to 30%-70%, good flowability and filling capacity of the dielectric layer 2 can be ensured while maintaining mechanical strength and stability.

[0029] In some embodiments, the dielectric layer 2 further includes a filler, comprising silicon dioxide and / or boron nitride. Specifically, by adding silicon dioxide to the resin matrix of the dielectric layer 2, the coefficient of thermal expansion of the dielectric layer 2 can be effectively reduced, further matching its coefficient of thermal expansion with that of the glass substrate 1 and the insulating layer 3, thereby reducing interfacial thermal mismatch and further reducing the risk of cracking of the glass substrate 1 and defects in the insulating layer 3. Furthermore, boron nitride can be added to the resin matrix of the dielectric layer 2, thereby significantly improving the thermal conductivity of the dielectric layer 2 and enhancing the heat dissipation capacity of the glass substrate. When both silicon dioxide and boron nitride are added to the resin matrix of the dielectric layer 2, the long-term reliability of the glass substrate under thermal cycling and high humidity environments can be further improved.

[0030] In some embodiments, the warp yarns 211 and weft yarns 212 include E-glass fiber, NE-glass fiber, or S-glass fiber. E-glass fiber possesses good mechanical strength and insulation properties, and is relatively inexpensive, making it suitable for conventional packaging applications. NE-glass fiber has a low dielectric constant and dielectric loss, effectively reducing signal transmission delay and high-frequency loss, making it suitable for applications in high-speed, high-frequency packaging where signal integrity is critical. S-glass fiber has a higher elastic modulus and tensile strength, exhibiting excellent mechanical properties and heat resistance, making it suitable for applications in large-size or high-reliability packaging where structural strength and dimensional stability are critical. In specific implementations, the materials of the warp yarns 211 and weft yarns 212 can be selected according to different packaging requirements, thereby further optimizing the performance of the dielectric layer 2.

[0031] Based on the same inventive concept, embodiments of this application provide a method for preparing a glass substrate, such as... Figure 4 As shown, it includes: S401. Prepare a glass fiber cloth, the glass fiber cloth comprising: multiple warp yarns and multiple weft yarns, the linear density and / or tension of the warp yarns and weft yarns being different; S402. Impregnate fiberglass cloth with a resin matrix and dry it to semi-cur it to form a prepreg. S403. The glass substrate, prepreg and insulating layer are stacked in sequence and pressed together in a vacuum environment to completely cure the resin matrix.

[0032] The method for preparing the glass substrate provided in this application involves preparing a glass fiber cloth 21 with differences in warp density and / or tension between the warp yarns 211 and weft yarns 212. This causes differentiated deformation of the warp yarns 211 and weft yarns 212 during the pressing process, thereby optimizing the microstructure of the interface between the glass substrate 1 and the insulating layer 3 and forming a micro-mechanical interlocking structure to enhance the interfacial bonding strength. Simultaneously, the prepreg structure effectively passivates the abrupt change in the coefficient of thermal expansion between the glass substrate 1 and the insulating layer 3, significantly reducing the risk of warping and cracking caused by thermal stress.

[0033] Specifically, in step S401, the linear density of warp yarn 211 is greater than that of weft yarn 212, and the tension of warp yarn 211 is greater than that of weft yarn 212. In a specific embodiment, the linear density of warp yarn 211 can be 100 Tex with a tension of 25 cN, and the linear density of weft yarn 212 can be 50 Tex with a tension of 15 cN. The lower linear density and lower tension of weft yarn 212 make it easier to deform during the pressing process, thereby forming a mechanical interlocking structure with the flowing insulating layer 3, greatly improving the peel strength and preventing the phenomenon of interface delamination between the glass substrate 1 and the insulating layer 3. At the same time, the higher linear density and higher tension of warp yarn 211 provide structural support, and through the synergistic effect of micro-mechanical interlocking and resin chemical bonding, the peel strength of the interface is further improved, ensuring the long-term reliability of the glass substrate in high temperature and high humidity environments.

[0034] In step S402, the glass fiber cloth 21 is impregnated in a resin matrix (modulus approximately 2.5 GPa), with the mass percentage of the resin matrix controlled at 30%-70%. After drying and semi-curing, a prepreg is prepared. By controlling the mass percentage of the resin matrix, the prepreg maintains appropriate fluidity during subsequent pressing, ensuring that the resin matrix fully fills the gaps in the glass fiber cloth 21 and forms a good chemical bond with the insulation layer 3, while preventing excessive flow of the resin matrix, thereby guaranteeing the mechanical strength and stability of the prepreg.

[0035] In step S403, the glass substrate 1, prepreg, and insulating layer 3 are sequentially stacked and pressed under vacuum at 170℃-200℃ and 3-8MPa for 60 minutes to completely cure the resin matrix. The vacuum environment effectively eliminates interlayer air bubbles, and the combined effect of temperature and pressure promotes the full flow of the resin matrix and wets the surface of the glass fiber cloth 21 and the interface of the insulating layer 3, forming a dense and uniform dielectric layer 2 structure.

[0036] In some embodiments, preparing the glass fiber cloth specifically includes: such as Figure 2 As shown, multiple warp yarns 211 are arranged along the first direction X, and multiple weft yarns 212 are arranged along the second direction Y, so that the warp yarns 211 and weft yarns 212 are alternately interwoven in the same plane to form a glass fiber cloth 21 with interlacing points. By alternately interlacing multiple warp yarns 211 and multiple weft yarns 212 in the same plane to form a glass fiber cloth 21 with interlacing points, and placing the glass fiber cloth 21 between the glass substrate 1 and the insulating layer 3, the problems of insufficient interfacial bonding and mismatch of thermal expansion coefficients between the glass substrate 1 and the insulating layer 3 are solved.

[0037] like Figure 3 As shown, multiple warp yarns 211 are arranged sequentially along the first direction X and temporarily fixed with thermally degradable adhesive threads to form a warp layer M. Multiple weft yarns 212 are arranged sequentially along the second direction Y and temporarily fixed with thermally degradable adhesive threads to form a weft layer N. The warp layer M and the weft layer N are stacked along the thickness direction, with the weft layer N located on the side facing the insulating layer 3, forming the glass fiber cloth 21 without interlacing points. The non-interlaced laminated structure of the glass fiber cloth 21 can reduce or eliminate interlacing point protrusions, thereby obtaining more uniform resin flow and a smoother interface, reducing defects in subsequent photolithography and electroplating processes, and improving stress distribution. Furthermore, two glass fiber prepregs of different specifications (such as density and resin content) are superimposed to form a performance gradient transition. Specifically, the warp layer M with higher linear density and tension is set facing the glass substrate 1, while the weft layer N with lower linear density and tension is set facing the insulating layer 3. This allows for greater deformation during the pressing process, forming a micro-mechanical interlocking structure with the flowing insulating layer 3. At the same time, the warp layer N with higher linear density and tension provides structural support. Through the synergistic effect of micro-mechanical interlocking and resin chemical bonding, the interfacial peel strength is further improved, ensuring long-term reliability in high temperature and high humidity environments.

[0038] In some embodiments, after impregnating the fiberglass cloth with a resin matrix and drying it semi-cured to form a prepreg, the method further includes forming an array of microgrooves on the side of the prepreg facing the insulating layer 3. During the pressing process in step S403, the insulating layer 3 is in a fluid state under pressure and temperature, filling the microgrooves on the surface of the prepreg. After curing, it forms a mechanical anchoring structure, further enhancing the mechanical interlocking effect between the dielectric layer 2 and the insulating layer 3, and significantly improving the interlayer bonding strength and peel resistance.

[0039] In summary, this application provides a glass substrate and its preparation method. The glass substrate includes a glass substrate 1, a dielectric layer 2, and an insulating layer 3. The dielectric layer 2 is located on at least one side of the glass substrate 1, and the insulating layer 3 is located on the side of the dielectric layer 2 away from the glass substrate 1. The dielectric layer 2 includes a glass fiber cloth 21, which comprises multiple warp yarns 211 and multiple weft yarns 212, with different linear densities and / or tensions between the warp yarns 211 and the weft yarns 212. By creating a difference in linear density and / or tension between the warp yarns 211 and the weft yarns 212, the microstructure of the interface between the glass substrate 1 and the insulating layer 3 is optimized, the peel strength is improved, and the phenomenon of interface delamination between the glass substrate 1 and the insulating layer 3 is prevented. As a flexible stress buffer structure, the dielectric layer 2 can effectively passivate the abrupt change in the coefficient of thermal expansion between the glass substrate 1 and the insulating layer 3, significantly reducing the risk of warping and cracking caused by thermal stress.

[0040] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0041] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A glass-based carrier plate, characterized in that, include: Glass substrate; A dielectric layer is located on at least one side of the glass substrate; An insulating layer is located on the side of the dielectric layer away from the glass substrate; The dielectric layer comprises a glass fiber cloth, which includes multiple warp yarns and multiple weft yarns, wherein the linear density and / or tension of the warp yarns and the weft yarns are different.

2. The glass substrate as described in claim 1, characterized in that, The linear density of the warp yarn is greater than that of the weft yarn, and the tension of the warp yarn is greater than that of the weft yarn.

3. The glass substrate as described in claim 2, characterized in that, The warp yarns and the weft yarns are interwoven alternately in the same plane, wherein multiple warp yarns are arranged along a first direction and multiple weft yarns are arranged along a second direction; the first direction and the second direction are located in the plane containing the warp yarns and the weft yarns and intersect each other.

4. The glass substrate as described in claim 2, characterized in that, Multiple warp yarns are arranged sequentially along a first direction to form a warp layer, and multiple weft yarns are arranged sequentially along a second direction to form a weft layer; wherein the warp layer and the weft layer are stacked along the thickness direction, the weft layer is located on the side facing the insulation layer, and the first direction and the second direction intersect each other.

5. The glass substrate as described in claim 3 or 4, characterized in that, The medium layer further includes a resin matrix, wherein the resin matrix comprises 30%-70% by mass in the medium layer.

6. The glass substrate carrier as described in claim 5, characterized in that, The dielectric layer further includes a filler comprising silicon dioxide and / or boron nitride.

7. The glass substrate carrier as described in claim 6, characterized in that, The warp and weft yarns include: E-glass fiber, NE-glass fiber, or S-glass fiber.

8. A method for preparing a glass-based carrier plate, characterized in that, include: A glass fiber cloth is prepared, the glass fiber cloth comprising: multiple warp yarns and multiple weft yarns, wherein the linear density and / or tension of the warp yarns and the weft yarns are different; The fiberglass cloth is impregnated with a resin matrix and dried semi-cured to form a prepreg. The glass substrate, the prepreg, and the insulating layer are stacked sequentially and pressed together in a vacuum environment to completely cure the resin matrix.

9. The preparation method according to claim 8, characterized in that, The preparation of the glass fiber cloth specifically includes: Multiple warp yarns are arranged along a first direction, and multiple weft yarns are arranged along a second direction, such that the warp and weft yarns are alternately interwoven in the same plane to form the glass fiber cloth with interlacing points; or Multiple warp yarns are arranged sequentially along a first direction and temporarily fixed with a thermodegradable adhesive thread to form a warp layer; Multiple weft yarns are arranged sequentially along the second direction and temporarily fixed with thermally degradable adhesive thread to form a weft yarn layer; The warp layer and the weft layer are overlapped along the thickness direction, with the weft layer located on the side facing the insulation layer, to form the glass fiber cloth without interlacing points.

10. The preparation method according to claim 8, characterized in that, After impregnating the fiberglass cloth with a resin matrix and drying it semi-cured to form a prepreg, the process further includes: An array of microgrooves is formed on the side of the prepreg facing the insulating layer.

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