Cooling liquid, liquid cooling module and electronic equipment

Abstract

The invention provides a cooling liquid, a liquid cooling module and electronic equipment. The cooling liquid comprises a heat exchange medium and a first surface active agent mixed and dissolved with the heat exchange medium, the hydrophilic-lipophilic balance value HLB of the first surface active agent is larger than or equal to 8, and the static surface tension of the cooling liquid is 13-30 mN / m. The cooling liquid can reduce the problem of pump blockage caused by bubbles, and the reliability of the flowing of the cooling liquid in the liquid cooling module is improved.

Description

Technical Field

[0001] This application relates to the field of heat exchange, specifically to a coolant, a liquid cooling module, and electronic equipment. Background Technology

[0002] With the increasing integration of electronic devices, the heat generated by their internal heat-generating components has also increased dramatically. To address the ever-increasing demands for high performance and heat flux density in mobile terminal products, micro-pump liquid cooling technology is one of the future development trends. The liquid cooling module is a key component in micro-pump liquid cooling technology. In applications with ultra-thin and lightweight electronic device architectures, the flow channels of the liquid cooling module become thinner, increasing flow resistance. Furthermore, the evaporation of the coolant and residual gases from the membrane material and coolant slowly accumulate into large bubbles in the flow channels. When these bubbles flow through the inlet of the micropump, they block and inhibit the coolant from entering the micropump cavity, exhibiting pump jamming and flow stagnation. This leads to a significant deterioration in heat dissipation performance and affects the reliability of the liquid cooling module. Summary of the Invention

[0003] This application provides a coolant, a liquid cooling module, and electronic equipment to reduce the problem of coolant pump jamming caused by air bubbles and improve the reliability of coolant flow within the liquid cooling module.

[0004] In a first aspect, this application provides a coolant comprising a heat exchange medium and a first surfactant miscible with the heat exchange medium, wherein the first surfactant has a hydrophilic-lipophilic balance value (HLB) greater than or equal to 8, and the static surface tension of the coolant is 13 to 30 mN / m.

[0005] By adding a first surfactant with HLB ≥ 8 to the heat exchange medium, and keeping the static surface tension of the coolant within the range of 13–30 mN / m, the gas in the heat exchange medium can be dispersed to form microbubbles, preventing the gas from accumulating into large bubbles. This reduces the problem of pump jamming caused by large bubble blockage, improves the smoothness of coolant flow, and avoids a decrease in the heat dissipation reliability of the liquid cooling module.

[0006] In one implementation, the first surfactant has a hydrophilic-lipophilic balance (HLB) value greater than or equal to 11. By optimizing the HLB value of the first surfactant, the gas dispersion in the coolant can be further adjusted, resulting in higher bubble dispersion and the formation of smaller microbubbles.

[0007] In one implementation, the mass percentage of the first surfactant in the coolant is less than or equal to 2%. By adjusting the mass percentage of the first surfactant, it is possible to prevent the content of the first surfactant from being too high and affecting the heat dissipation efficiency of the coolant.

[0008] In one implementation, the heat exchange medium includes water, silicone oil, or fluorinated liquid.

[0009] In one implementation, the heat exchange medium is water, and the molecular formula of the first surfactant is: Rf1-X1-M1; where,

[0010] Rf1 is CF3-R1-, and R1 is a C3 to C15 perfluoroalkylene group;

[0011] X1 is selected from -SO3-, -COO-, and -(R2O). m -, R2 is a C2 to C6 alkylene group, and m takes the value of 1 to 30;

[0012] M1 is selected from H, monovalent metal cations, or monovalent organic cations.

[0013] When the heat exchange medium is water and the first surfactant is Rf1-X1-M1, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0014] In one implementation, the C3-C15 perfluoroalkylene group in Rf1 can be a straight-chain perfluoroalkylene group, a branched perfluoroalkylene group, or a cyclic perfluoroalkylene group. In one implementation, M1 is H. When X1 is -SO3-, H can be H... + It exists in the form of -SO3H, which can form with X1. This is when X1 is -COO- or -(R2O). m When H is present, it can combine with adjacent O to form a hydroxyl group -OH. In one implementation, when M1 is a monovalent metal cation, it may include Na. + K + , or NH 4+ When M1 is a monovalent organic cation, it can be an organic amine cation. The first surfactant containing the above-mentioned groups has a high solubility in water and is more uniformly dispersed in water, which is more conducive to the formation of microbubbles.

[0015] In one implementation, the coolant also includes an antifoaming agent with a surface tension of less than 25 mN / m. Adding the antifoaming agent further eliminates large air bubbles that accumulate in the coolant.

[0016] In one implementation, the defoamer comprises a hydrophobic solvent and hydrophobic particles dispersed in the hydrophobic solvent, wherein the hydrophobic particles account for 60-90% of the mass of the defoamer. The defoamer can diffuse to the surface of the bubbles and interact with the bubbles through the local surface tension difference, causing the bubbles to burst.

[0017] In one implementation, the hydrophobic solvent includes at least one of an aliphatic derivative or a polysiloxane. This hydrophobic solvent has high fluidity, preventing the defoamer from agglomerating.

[0018] In one implementation, the hydrophobic particles are selected from silica particles, wax particles, or inorganic particles modified with hydrophobic groups. The particle size of the hydrophobic particles can be 0.1-20 micrometers. The hydrophobic particles can help improve the bubble rupture process.

[0019] In one implementation, the defoamer accounts for less than or equal to 1% of the mass of the coolant. By controlling the amount of defoamer added, defoaming can be achieved while balancing the heat dissipation efficiency of the coolant.

[0020] In one implementation, the coolant further includes a second surfactant with a hydrophilic-lipophilic balance (HLB) value of less than 8; the mass percentage of the second surfactant in the coolant is less than or equal to 2%, or for example, less than or equal to 1%, or for example, less than or equal to 0.5%. By adding the second surfactant, the dynamic surface tension of the coolant can be reduced, thereby improving the coolant's fluidity.

[0021] In one implementation, the second surfactant includes at least one of an alkynol surfactant or a gemini surfactant.

[0022] In one implementation, the static surface tension of the coolant is 18–25 mN / m. When the heat exchange medium of the coolant is water, a static surface tension of 18–25 mN / m is more conducive to the formation of microbubbles and to the uniform dispersion of the bubbles.

[0023] In one implementation, the dynamic surface tension of the coolant is less than or equal to 35 mN / m. A dynamic surface tension of less than or equal to 35 mN / m is more conducive to improving the coolant's fluidity.

[0024] In one implementation, the heat exchange medium is a fluorinated liquid, and the first surfactant includes a fluorocarbon surfactant with the molecular formula Rf2-X2-M2; wherein,

[0025] Rf2 is CF3-R3-, where R3 is a C3 to C15 perfluoroalkylene group;

[0026] X2 is selected from -(R4O) m -, R4 is a C2 to C6 alkylene group, and m ranges from 1 to 30;

[0027] M2 is selected from H or C1 to C5 alkyl groups.

[0028] When the heat exchange medium is a fluorinated liquid and the first surfactant is Rf2-X2-M2, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0029] In one embodiment, the C3-C15 perfluoroalkyl group in Rf2 can be a straight-chain perfluoroalkyl group, a branched perfluoroalkyl group, or a cyclic perfluoroalkyl group. In another embodiment, M2 is H or a C1-C5 alkyl group. The first surfactant containing the above-mentioned groups has a high solubility in water and is more uniformly dispersed in water, thus making it more conducive to the formation of miniaturized bubbles.

[0030] In one implementation, the first surfactant comprises a fluorinated acrylate copolymer, which is formed by polymerization of a fluorinated acrylate compound, the molecular formula of which is: in,

[0031] Ra is H or methyl;

[0032] Rb is a C1-C6 alkylene group, -(R5O) x -, R5 is a C2 to C6 alkylene group, and x takes the value of 1 to 3;

[0033] Rc is a C3 to C12 perfluoroalkyl group.

[0034] When the heat exchange medium is a fluorinated liquid and the first surfactant is Rf2-X2-M2, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0035] In one implementation, the fluorinated liquid is selected from at least one of the following compounds: C1-C12 perfluoroalkanes, C1-C12 perfluoroolefins, C1-C12 cyclic perfluoroalkanes, C1-C12 perfluoroalkynes, C1-C12 cyclic perfluoroolefins, CF2-A m -B n -OCF3, R f -OR h R f -C(O)-R h 、or R f -N(R h )-R g At least one of them. Among them,

[0036] CF2-A m -B n In -OCF3, A is selected from -OCF2-, -OCF2CF2-, or -OCF(CF3)CF2-, and B is selected from -OCF(CF3)- or -OCF2CF(CF3)-; m and n are each independently selected from integers from 0 to 50, and m+n≥1;

[0037] R f -OR h In the middle, R f and Rh Each is independently selected from C1-C8 straight-chain perfluoroalkyl, C1-C8 branched perfluoroalkyl, or C1-C4 hydrofluoroalkyl;

[0038] R f -C(O)-R h In this context, Rf and Rh are each independently selected from C3-C8 straight-chain perfluoroalkyl, C3-C12 branched perfluoroalkyl, or C3-C12 perfluoroalkyl containing a cyclic structure.

[0039] R f -N(R h )-R g In the middle, R f R h and R g Each is independently selected from straight-chain perfluoroalkyl groups of C3 to C8, branched perfluoroalkyl groups of C3 to C12, or perfluoroalkyl groups of C3 to C12 containing a cyclic structure.

[0040] Fluorinated liquids with the above molecular structure have good fluidity, low surface tension, and excellent thermal conductivity, which allows the coolant to have both high thermal conductivity and good gas dispersion properties.

[0041] In one implementation, when the heat exchange medium is a fluorinated liquid and the first surfactant is Rf2-X2-M2, the static surface tension of the coolant is 13–20 mN / m. This static surface tension in the coolant is more conducive to the formation of microbubbles and to the uniform dispersion of these bubbles.

[0042] In one implementation, the heat exchange medium is silicone oil and a siloxane surfactant. When the heat exchange medium is silicone oil and the first surfactant is a siloxane surfactant, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0043] Secondly, this application provides a liquid cooling module, which includes a micro pump and a heat exchange pipeline. The heat exchange pipeline is connected to the micro pump to form a closed heat exchange passage. The heat exchange pipeline is filled with the coolant of this application, and the micro pump is used to drive the coolant to flow in the heat exchange pipeline.

[0044] Liquid cooling modules can be installed inside electronic devices or through the heat-generating components of electronic devices. The coolant in the liquid cooling module can circulate in the heat exchange pipeline under the action of a micro pump. The heat exchange pipeline can extend from the heat-generating area of ​​the electronic device to the heat-dissipating area, thereby realizing heat transfer.

[0045] Thirdly, this application provides an electronic device, which includes a heat source element and a liquid cooling module of this application, wherein a portion of the liquid cooling module is in contact with the heat source element or connected to the heat source element through a heat-conducting component.

[0046] The heat source element can be in direct contact with the liquid cooling module, or it can be in contact with the liquid cooling module through a thermally conductive component. The thermally conductive component is used to conduct heat between the heat source element and the liquid cooling module. The thermally conductive component can be a thermally conductive adhesive layer.

[0047] The electronic devices covered by this application include mobile terminals or wearable electronic devices such as mobile phones, tablets, computers, watches, and glasses.

[0048] The technical effects that can be achieved by the second and third aspects mentioned above can be referred to the corresponding effect descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0049] Figure 1 This is a schematic diagram of the structure of a liquid cooling module according to one embodiment;

[0050] Figure 2 for Figure 1 A partial cross-sectional view of the heat exchange pipeline structure shown at point AA.

[0051] Figure 3 This is a schematic diagram of the structure of an electronic device according to one embodiment;

[0052] Figure 4 This is a schematic diagram of the structure of an electronic device according to another embodiment of this application;

[0053] Figure 5 This is a schematic diagram of the structure of an electronic device according to another embodiment of this application;

[0054] Figure 6 A schematic diagram of the three-dimensional structure of a watch;

[0055] Figure 7 This is a schematic diagram of the structure of a tablet computer according to one embodiment;

[0056] Figure 8 This is a schematic diagram of the structure of a laptop computer according to one embodiment.

[0057] Figure label:

[0058] 10-Liquid cooling module; 11-Micro pump; 12-Heat exchange piping; 121-Top cover layer; 122-Bottom cover layer; 123-Support layer; 13-Coolant;

[0059] 20 - Foldable phone; 21 - First display screen; 22 - Second display screen; 23 - Hinge assembly;

[0060] 30 - Watch; 31 - Watch face; 32 - Watch strap;

[0061] 40 - Tablet PC; 41 - Back cover;

[0062] 50 - Laptop computer; 51 - Keyboard side; 52 - Back cover; 53 - Display screen. Detailed Implementation

[0063] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0064] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” and “this” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise.

[0065] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0066] Electronic devices, such as mobile phones, tablets, computers, wearable devices, and automotive devices, typically contain heat-generating components. With the increasing integration of electronic devices, the heat generated by internal power devices, such as chips and batteries, is growing. To transfer heat from these components, one existing heat dissipation method utilizes liquid cooling modules with micropump structures. For example, in foldable electronic devices, one end of the liquid cooling module can be located in the area where heat-generating components like chips are located, while the other end can extend to other areas. This allows the liquid cooling module to conduct heat generated by the heat-generating components to other areas for heat dissipation, preventing heat concentration. Typically, a liquid cooling module includes a micropump and heat exchange channels filled with coolant. The coolant, also known as the liquid working fluid, is used by the micropump to drive the flow of coolant for heat transfer. However, because the heat exchange channels and the inlet of the micropump in the liquid cooling module are relatively narrow, large air bubbles in the coolant can easily become stuck at the inlet of the micropump, hindering the flow of coolant and affecting the heat dissipation effect of the liquid cooling module.

[0067] Based on this, embodiments of this application provide a coolant. The coolant in this embodiment is formulated by combining a heat exchange medium with a first surfactant having a specific hydrophile-lipophile balance (HLB) value, so that the static surface tension of the coolant is controlled within a certain range. This prevents the agglomeration of small bubbles in the coolant into large bubbles, thereby solving the problem of bubble-induced pump blockage.

[0068] The HLB value is a parameter system that quantitatively describes the equilibrium state between hydrophilic and lipophilic groups in a surfactant molecule. A higher value indicates stronger hydrophilicity, while a lower value indicates more pronounced lipophilicity.

[0069] Static surface tension is the force formed by the intermolecular interactions on the surface of a coolant in equilibrium, manifested as the tendency of the coolant surface to contract to its minimum curvature. It represents a thermodynamic equilibrium state of the liquid surface when undisturbed by external forces. The surface tension of a coolant can be measured using a surface tension meter.

[0070] The coolant in this embodiment includes a heat exchange medium and a first surfactant that is miscible with the heat exchange medium. The first surfactant has a hydrophilic-lipophilic balance value (HLB) greater than or equal to 8, and the static surface tension of the coolant is 13 to 30 mN / m.

[0071] The HLB value of the first surfactant can be greater than or equal to 11, for example, greater than or equal to 13. In one embodiment, the HLB value of the first surfactant is less than or equal to 30. Exemplarily, the HLB value of the first surfactant can be, for example, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 0, 22, 24, 26, 28, 30, etc. By optimizing the HLB value of the first surfactant, the gas dispersion in the coolant can be further adjusted, resulting in higher bubble dispersion and the formation of smaller microbubbles.

[0072] The static surface tension of the coolant in this embodiment of the application can be, for example, greater than or equal to 13 and less than or equal to 20 mN / m, or greater than 20 and less than or equal to 30 mN / m. Controlling the static surface tension of the coolant between 13 and 30 mN / m allows for uniform dispersion of gas in the heat exchange medium, preventing the formation of large bubbles, thereby reducing the occurrence of coolant pump jamming and improving the reliability of coolant flow.

[0073] To prevent excessive amounts of the first surfactant from affecting the heat dissipation effect of the coolant, in one embodiment of this application, the mass percentage of the first surfactant in the coolant is less than or equal to 2%, for example, less than or equal to 1%, for example, less than or equal to 0.5%, or for example, less than or equal to 0.2%. In another embodiment, the mass percentage of the first surfactant in the coolant can be greater than or equal to 0.01%, for example, greater than or equal to 0.05%, to achieve a better bubble dispersion effect. Exemplarily, the mass percentage of the first surfactant in the coolant can be, for example, 0.01%, 0.03%, 0.05%, 0.07%, 0.09%, 0.1%, 0.12%, 0.15%, 0.2%, 0.25%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, or 1.0%, or any value between any two of these values.

[0074] In the coolant of this application embodiment, the heat exchange medium includes water, silicone oil, or fluorinated liquid. The following explains the cases where the heat exchange medium is water, fluorinated liquid, or silicone oil.

[0075] In one embodiment, the heat exchange medium is water, and the first surfactant may be a fluorocarbon surfactant, the molecular formula of which may be represented as: Rf1-X1-M1; wherein,

[0076] Rf1 is CF3-R1-, and R1 is a C3 to C15 perfluoroalkylene group;

[0077] X1 is selected from -SO3-, -COO-, and -(R2O). m -, R2 is a C2 to C6 alkylene group, and m takes the value of 1 to 30;

[0078] M1 is selected from H, monovalent metal cations, or monovalent organic cations.

[0079] When the heat exchange medium is water and the first surfactant is Rf1-X1-M1, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0080] In one embodiment, the C3-C15 perfluoroalkylene group of Rf1 can be, for example, a C3-C15 linear perfluoroalkylene group, a C3-C15 branched perfluoroalkylene group, or a C3-C15 cyclic perfluoroalkylene group. In one embodiment, Rf1 can be represented as CF3-(CF2). n - The value of n can be from 3 to 15. For example, the value of n can be any two values ​​between 3, 4, 5, 6, 7, 8, 9, or 10 or more.

[0081] In one embodiment, R2 may be, for example, ethylene, propylene, butylene, or pentylene. The -(R2O) in X1m For example, it could be -(CH2CH2O). m -, where m is an integer from 1 to 30.

[0082] In one embodiment, M1 is H. When X1 is -SO3-, H can be H + It exists in the form of -SO3H, which can form with X1. This is when X1 is -COO- or -(R2O). m When H combines with adjacent O, it can form a hydroxyl group -OH. In one embodiment, M1 in Rf1-X1-M1 is a monovalent metal cation or a monovalent organic cation. Monovalent metal cations or monovalent organic cations have higher solubility and better stability. For example, when M1 is a monovalent metal cation, it may include Na. + K + , or NH 4+ When M1 is a monovalent organic cation, it can be an organic amine cation. The first surfactant containing the above-mentioned groups has a higher solubility in water and is more uniformly dispersed in water, which is more conducive to the formation of microbubbles.

[0083] When the heat exchange medium of the coolant is water, the static surface tension of the coolant is 18-30 mN / m, which can be further 18-28 mN / m, or even 18-25 mN / m. This is more conducive to the formation of microbubbles and to the uniform dispersion of the bubbles.

[0084] As an example, fluorocarbon surfactants can be selected from compounds with the following molecular formulas:

[0085] C8F 17 -SO3-N(C2H5)4、C6F 13 -SO3-NH3-C2H4OH, C8F 17 -(CH2CH2O) 10 -CH2CH2OH.

[0086] When the heat exchange medium is water, the first surfactant in the coolant may include, in addition to the fluorocarbon surfactants shown in Rf1-X1-M1, siloxane surfactants.

[0087] As an example, siloxane surfactants can be silane substances with the following structures:

[0088] CH3-(CH3)2SiO-[(CH3)2SiO]a-[(CH3)(CH2CH2CH2O-(C2H4O)m-(C3H6O)nR)SiO] b-Si(CH3)3, where a and b are each independently taken from integers from 4 to 20, m is taken from 8 to 40, n is taken from 0 to 15, and R can be independently selected from -H, -CH3, -COOCH3, or phenyl, etc.

[0089] As an example, silane surfactants can be selected from compounds with the following molecular formulas:

[0090]

[0091] In the above chemical structural formula, n, X, and Y are each independently selected from integers between 4 and 20.

[0092] To improve the fluidity of the coolant, in one embodiment, the coolant further includes a second surfactant. The second surfactant has a hydrophilic-lipophilic balance (HLB) value of less than 8, or for example, greater than or equal to 6. The mass percentage of the second surfactant in the coolant is less than or equal to 2%, or for example, less than or equal to 1%, or for example, less than or equal to 0.5%. By adding the second surfactant, the dynamic surface tension of the coolant can be reduced, thereby improving its fluidity. In one embodiment, the dynamic surface tension of the coolant is less than or equal to 35 mN / m. A dynamic surface tension of less than or equal to 35 mN / m is more conducive to improving the fluidity of the coolant.

[0093] The second surfactant includes at least one of alkynol surfactants or gemini surfactants.

[0094] The chemical formula of alkynol surfactants can be represented as HO-R 1 -C≡CR 2 -OH, where R 1 and R 2 Each segment is independently selected from substituted or unsubstituted C1-C20 alkyl, C3-C20 cycloalkyl, or C6-C20 aralkyl, straight-chain segments containing heteroatoms (such as -O-, -S-), or branched segments. HO-R 1 -C≡CR 2 The hydroxyl group (-OH) in -OH can be partially or completely esterified, etherified, or sulfonated.

[0095] As an example, alkynyl alcohol surfactants can be selected from compounds with the following molecular formulas:

[0096]

[0097] The chemical formula of a gemini surfactant can be represented as [YR] 3 -ZR 4 -]2-L. Where Y is a hydrophilic group, for example, it can be -N. + (CH3) 2-SO3-, -COO-, -PO4-. R 3 and R 4 Each group is independently selected from C8-C22 alkyl or aryl groups. Z is a linking group, such as -O-, -S-, -NH-, or -COO-. L is a spacer group, such as -(CH2). p -、-Ph-、-O-(CH2CH2O) q -, p = 1~6, q = 1-10.

[0098] As an example, gemini surfactants can be selected from compounds with the following molecular formulas:

[0099]

[0100] It can further eliminate air bubbles in the coolant and form microbubbles. In one embodiment, the coolant also includes an antifoaming agent with a surface tension of less than 25 mN / m, or more specifically, less than or equal to 25 mN / m.

[0101] The defoamer may include a hydrophobic solvent and hydrophobic particles dispersed in the hydrophobic solvent. The hydrophobic solvent may include at least one of aliphatic derivatives or polysiloxanes. This hydrophobic solvent has high fluidity, preventing the defoamer from agglomerating. The hydrophobic particles may be selected from silica particles, wax particles, or inorganic particles modified with hydrophobic groups. The hydrophobic groups may be, for example, hydrocarbon groups, ester groups, aryl groups, ether groups, or perfluoroalkyl groups. The particle size of the hydrophobic particles may be 0.1-20 micrometers. The defoamer can diffuse to the surface of the bubbles and interact with them through local surface tension differences, causing the bubbles to burst.

[0102] In one embodiment, the mass percentage of hydrophobic particles in the defoamer can be 60-90%. The mass percentage of hydrophobic particles in the defoamer should not be too high, as this can easily lead to a decrease in the thermal conductivity of the coolant and increase the risk of the micro-pump being clogged by the hydrophobic particles. If it is too low, the effect on dissipating bubbles is weak, and the ideal defoaming effect cannot be achieved. In this embodiment, the defoaming effect of the defoamer in the coolant is to disperse large bubbles into smaller bubbles, rather than to remove bubbles.

[0103] In order to achieve defoaming while balancing the heat dissipation efficiency of the coolant, in the embodiments of this application, the mass percentage of the defoamer in the coolant is less than or equal to 1%, or for example, less than or equal to 0.5%, or for example, less than or equal to 0.2%.

[0104] In one embodiment, when the heat exchange medium is water, the coolant in this embodiment may further include a dye. The mass percentage of the dye in the coolant may be less than or equal to 0.1%, for example, less than or equal to 0.05%.

[0105] In one embodiment, when the heat exchange medium is water, the coolant may include the following components in the following mass percentages: 0.08-0.3% first surfactant, 0.3-1% second surfactant, 0.3-0.5% defoamer, and the balance being water. In another embodiment, when the heat exchange medium is water, the coolant may include the following components in the following mass percentages: 0.08-0.3% first surfactant, 0.3-1% second surfactant, 0.3-0.5% defoamer, 0.03-0.05% dye, and the balance being water. The defoamer may be an organosilicon defoamer. The dye may be a water-soluble dye. The water in the embodiments of this application may be deionized water.

[0106] In another embodiment, the heat exchange medium is a fluorinated liquid, and the first surfactant includes a fluorocarbon surfactant. The HLB value of the first surfactant is less than or equal to 6, and more specifically less than or equal to 4.

[0107] In this embodiment, when the heat exchange medium is a fluorinated liquid, adding a first surfactant with an HLB value of 6 or less can reduce the static surface tension of the coolant to 13–20 mN / m. This static surface tension in the coolant is more conducive to the formation of microbubbles and to the uniform dispersion of these bubbles.

[0108] The fluorinated liquid can be selected from at least one of the following compounds: C n F 2n+2 (n takes the value of an integer from 1 to 12), C n F 2n (n takes the value of an integer from 1 to 12), C n F 2n-2 (n is an integer from 1 to 12), CF2-A m -B n -OCF3, R f -OR h R f -C(O)-R h Or R f -N(R h )-R g At least one of them.

[0109] C n F 2n+2 It is a C1 to C12 perfluoroalkane, C n F 2n It is a C1-C12 perfluoroolefin or a C1-C12 cyclic perfluoroalkanes, C n F 2n-2 It is a C1-C12 perfluoroalkyne or a C1-C12 cyclic perfluoroolefin.

[0110] Among them, CF2-A m-B n In -OCF3, A is selected from -OCF2-, -OCF2CF2-, or -OCF(CF3)CF2-, and B is selected from -OCF(CF3)- or -OCF2CF(CF3)-; m and n are each independently selected from integers from 0 to 50, and m+n≥1. R f -OR h In the middle, R f and R h Each is independently selected from C1-C8 straight-chain perfluoroalkyl, C1-C8 branched perfluoroalkyl, and C1-C4 hydrofluoroalkyl. f -C(O)-R h In this context, Rf and Rh are each independently selected from C3-C8 straight-chain perfluoroalkyl groups, C3-C12 branched perfluoroalkyl groups, or C3-C12 perfluoroalkyl groups containing cyclic structures. f -N(R h )-R g In the middle, R f R h and R g Each is independently selected from straight-chain perfluoroalkyl groups of C3 to C8, branched perfluoroalkyl groups of C3 to C12, or perfluoroalkyl groups of C3 to C12 containing a cyclic structure.

[0111] As an example, the fluoride may be selected from at least one of the following structures:

[0112]

[0113] n is 1 to 4, R1 is F or a C1 to C7 perfluoroalkyl group, and R2 is a C1 to C7 perfluoroalkyl group. The C1 to C7 perfluoroalkyl group can be represented as -C x F 2x+1 x is a natural number from 1 to 7.

[0114] The fluorinated liquid can be a pure substance or a mixture, such as at least two of the compounds listed above. The total mass percentage of the compounds listed above in the fluorinated liquid can be ≥90%.

[0115] Fluorinated liquids with the above molecular structure have good fluidity, low surface tension, and excellent thermal conductivity, which allows the coolant to have both high thermal conductivity and good gas dispersion properties.

[0116] In this embodiment, the molecular formula of the fluorocarbon surfactant in the first surfactant can be: Rf2-X2-M2; wherein,

[0117] Rf2 is CF3-R3-, where R3 is a C3 to C15 perfluoroalkylene group;

[0118] X2 is selected from -(R4O) m -, R4 is a C2 to C6 alkylene group, and m ranges from 1 to 30;

[0119] M2 is selected from H or C1 to C5 alkyl groups.

[0120] When the heat exchange medium is a fluorinated liquid and the first surfactant is Rf2-X2-M2, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0121] In one implementation, the C3-C15 perfluoroalkylene group of Rf2 can be, for example, a C3-C15 linear perfluoroalkylene group, a C3-C15 branched perfluoroalkylene group, or a C3-C15 cyclic perfluoroalkylene group. In one embodiment, Rf2 can be represented as CF3-(CF2). n - The value of n can be from 3 to 15. For example, the value of n can be any two values ​​between 3, 4, 5, 6, 7, 8, 9, or 10 or more.

[0122] In one embodiment, R3 in Rf2 can be, for example, ethylene, propylene, butylene, or amylene. -(R4O) in X2 m For example, it could be -(CH2CH2O). m -, where m is an integer from 1 to 30.

[0123] In one implementation, M2 is H or a C1-C5 alkyl group. The C1-C5 alkyl group can be, for example, methyl, ethyl, propyl, butyl, or pentyl. The first surfactant containing the above-mentioned groups has a higher solubility in water and disperses more uniformly in water, thus being more conducive to the formation of miniaturized bubbles.

[0124] When the heat exchange medium is a fluorinated liquid and the first surfactant is Rf2-X2-M2, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0125] As an example, the fluorocarbon surfactants in fluorinated liquids can be selected from the following compounds:

[0126] C8F 17 -(CH2CH2O) 10 -CH2CH2-OH, C6F 13 -(CH2CH2O)7-CH2CH2-OH, C6F 13 -(CH2CH2O) 12 -CH2CH2-OH.

[0127] In one embodiment, the first surfactant may include, in addition to fluorocarbon surfactants, a fluorinated acrylate copolymer, which is formed by polymerization of a fluorinated acrylate compound, and the molecular formula of the fluorinated acrylate is: in,

[0128] Ra is H or methyl;

[0129] Rb is a C1-C6 alkylene group, -(R5O) x -, R5 is a C2 to C6 alkylene group, and x takes the value of 1 to 3;

[0130] Rc is a C3 to C12 perfluoroalkyl group.

[0131] In Rb, the C1-C6 alkylene groups can be, for example, methylene, ethylene, propylene, butylene, pentylene, or hexylene. The C1-C6 alkylene groups can be straight-chain or branched; specific details regarding straight-chain and branched alkylene groups will not be elaborated here. The C2-C6 alkylene groups can be, for example, ethylene, propylene, butylene, pentylene, or hexylene. The C1-C6 alkylene groups can be straight-chain or branched. The -(R5O) in Rb... x -Can be -(CH2CH2O) x -, x is 1 to 3.

[0132] In Rc, the C3-C12 perfluoroalkyl group can be, for example, a straight-chain perfluoroalkyl group of C3-C12, a branched perfluoroalkyl group of C3-C12, or a cyclic perfluoroalkyl group of C3-C12. Examples include perfluoropropyl, perfluorobutyl, perfluoropentyl, and perfluorohexyl.

[0133] In one embodiment, when the heat exchange medium is a fluorinated liquid, the coolant may include the following components in the indicated mass percentages: 0.2-0.5% of a first surfactant, 0.2-0.4% of a defoamer, and the balance being the fluorinated liquid. The defoamer may be an organosilicon defoamer.

[0134] As an example, fluorinated acrylate copolymers can be selected from compounds with the following molecular formulas:

[0135]

[0136] In another embodiment of this application, the heat exchange medium is silicone oil or a siloxane surfactant.

[0137] As an example, siloxane surfactants can be silane substances with the following structures:

[0138] CH3-(CH3)2SiO-[(CH3)2SiO]a-[(CH3)(CH2CH2CH2O-(C2H4O)m-(C3H6O)nR)SiO] b -Si(CH3)3, where a and b are each independently taken from integers from 4 to 20, m is taken from 8 to 40, n is taken from 0 to 15, and R can be independently selected from -H, -CH3, -COOCH3, or phenyl, etc.

[0139] As an example, silane surfactants can be selected from compounds with the following molecular formulas:

[0140]

[0141] In the above chemical structural formula, n, X, and Y are each independently selected from integers between 4 and 20.

[0142] When the heat exchange medium is silicone oil and the first surfactant is a siloxane surfactant, the static surface tension of the coolant can be effectively reduced to achieve bubble dispersion.

[0143] When the heat exchange medium is a fluorinated liquid or silicone oil, a certain amount of defoamer can also be added to the coolant. The interfacial tension of the defoamer can be less than or equal to 21 mN / m, or for example, less than or equal to 20 mN / m. The defoamer in this embodiment can have a similar material composition to the defoamer added when the heat exchange medium is water, and can also include hydrophobic solvents and hydrophobic particles. Specifically, hydrophobic solvents with different surface tensions can be selected according to actual needs. For example, the hydrophobic solvent can be at least one of polydimethylsiloxane and fluoroacrylate polymers. The hydrophobic particles can be hydrophobic inorganic particles modified with perfluorosilane. The amount of defoamer added to the coolant can be less than or equal to 0.5%, or for example, less than or equal to 0.3%.

[0144] The coolant in this embodiment of the application, by controlling the surface tension, can have the ability to break and dissolve bubbles, so that the coolant itself can break and dissolve large bubbles accumulated in the flow channel, ensuring that the coolant in the micro pump does not get stuck or stagnant, and ensuring the reliability of heat exchange.

[0145] In one embodiment, when the heat exchange medium is a fluorinated liquid or silicone oil, the coolant in this embodiment may further include a dye. The mass percentage of the dye in the coolant may be less than or equal to 0.1%, for example, less than or equal to 0.05%.

[0146] For the same technical purpose, this application also provides a liquid cooling module. Figure 1 This is a schematic diagram of the structure of a liquid cooling module according to one embodiment. Figure 1As shown, the liquid-cooled module 10 may include a micro-pump 11 and a heat exchange pipeline 12. The heat exchange pipeline 12 is connected to the micro-pump 11 to form a closed heat exchange passage. The heat exchange pipeline 12 is filled with the coolant of this application (not shown in the figure), and the micro-pump 11 is used to drive the coolant to flow within the heat exchange pipeline 12. The micro-pump 11 may be a piezoelectric ceramic pump. The heat exchange pipeline 12 may be a liquid-cooled plate. The heat exchange pipeline 12 may include multiple spaced-apart flow channels.

[0147] Figure 2 for Figure 1 A partial cross-sectional view of the heat exchange piping structure shown at point AA. (See diagram.) Figure 2 As shown, in one embodiment, the heat exchange pipeline 12 includes a top cover layer 121, a support layer 123, and a bottom cover layer 122. The support layer 123 is disposed between the top cover layer 121 and the bottom cover layer 122. The materials of the top cover layer 121, the support layer 123, and the bottom cover layer 122 may include polymer films, glass, and metals. The top cover layer 121 and the bottom cover layer 122 are respectively connected to the support layer 123, for example, by screw fixing, high-temperature adhesive bonding, UV adhesive curing bonding, thermoforming bonding, sealing welding, hot melt welding, ultrasonic welding, or direct one-piece 3D printing.

[0148] A flow channel can be formed between the support layer 123 and the top cover layer 121 and the bottom cover layer 122, and the coolant 13 is filled in the flow channel. With the action of the micro pump 11, the coolant 13 can circulate in the flow channel.

[0149] The liquid cooling module of this application embodiment can be attached as a separate module to electronic devices, electronic products, or related accessories, or it can be directly embedded into the structural material of the device. Therefore, based on the same technical objective, this application embodiment also provides an electronic device. The electronic device of this application includes, but is not limited to, mobile terminals such as mobile phones, tablets, computers, watches, and glasses, or wearable electronic devices. The electronic device of this application embodiment may include a heat source element and the liquid cooling module of this application embodiment. The heat source element may be, for example, a chip, processor, memory, circuit board assembly, etc. A portion of the liquid cooling module is in contact with the heat source element or connected to the heat source element through a thermally conductive component. A portion of the liquid cooling module can be in direct contact with the heat source element, and the heat generated by the heat source can be directly conducted to the liquid cooling module. When the coolant in the heat exchange module flows, it can conduct the heat to other areas. A portion of the liquid cooling module can also be connected to a heating element through a thermally conductive component, and the heat generated by the heating element can be transferred to the liquid cooling module through the thermally conductive component. The thermally conductive component may be, for example, thermally conductive adhesive. When the coolant in the heat exchange module flows, it can conduct the heat to other areas.

[0150] The following description, in conjunction with the accompanying drawings, provides a more detailed explanation of the arrangement structure of the heat exchange module in the electronic device according to an embodiment of this application.

[0151] Figure 3 This is a schematic diagram of the structure of an electronic device according to one embodiment. The electronic device includes the liquid-cooling module of this application embodiment. Figure 3 As shown, the electronic device in this application embodiment can be a foldable electronic device, such as a foldable phone 20. The foldable phone 20 includes a chip (not shown), a first display screen 21, and a second display screen 22, with a hinge assembly 23 between the first display screen 21 and the second display screen 22. One end of a liquid cooling module 10 is disposed in the area where the first display screen 21 is located, and the other end is disposed in the area where the second display screen 22 is located. A portion of the liquid cooling module 10 spans the hinge assembly 23. Wherein, Figure 3 Taking the indicated location as an example, the chip of the electronic device can be set in the area where the first display screen 21 is located, that is, it can be set in... Figure 3 Upper-middle region. The first end of the liquid cooling module 10 is located in the upper region, corresponding to the chip, and can be bonded to the chip surface using thermally conductive adhesive. The second end of the liquid cooling module 10 is located in the lower region, which is the heat dissipation area, and other heat dissipation structures can be installed thereto to achieve heat dissipation. The heat generated by the chip can be transferred through the liquid cooling module, that is, the heat can be transferred to the lower region through the liquid cooling module.

[0152] The liquid cooling module 10 can be mounted on the inner surface of the housing or on the surface of other components inside the housing, thus achieving the installation and fixation of the liquid cooling module. The liquid cooling module 10 and heat source components, such as chips, can be bonded and fixed using thermally conductive adhesive. For other areas, thermally conductive materials or non-thermally conductive materials can be used for bonding and fixing; no specific restrictions are imposed, and the choice can be made according to the actual design.

[0153] Figure 4 This is a schematic diagram of the structure of an electronic device according to another embodiment of this application. Figure 4 As shown, the electronic device can be a flat-screen electronic device, such as a flat-screen mobile phone. The liquid cooling module 10 can extend to different locations within the flat-screen mobile phone. (Reference) Figure 4 As shown in the dashed box, the liquid cooling module 10 can extend from the top to the bottom of the flat-screen phone. The liquid cooling module 10 of this embodiment can be universally installed within the flat-screen phone to achieve heat conduction, such as transferring heat from high-heat accumulation areas to low-heat areas for heat dissipation.

[0154] Figure 5 This is a schematic diagram of the structure of an electronic device according to another embodiment of this application. Figure 5 As shown, the electronic device can be a watch 30. Figure 6 This is a schematic diagram of the three-dimensional structure of a watch. (Example) Figure 5 and Figure 6 As shown, in watch 30, the liquid cooling module 10 extends through the dial 31 of watch 30 to the strap 32 of watch 30. Both ends of the liquid cooling module 10 are respectively embedded in the strap 32 of watch 30. Through the heat conduction effect of the liquid cooling module 10, the heat generated by the chip of watch 30 can be conducted to the strap 32 for heat dissipation.

[0155] Figure 7 This is a schematic diagram of the structure of a tablet computer. Figure 7 As shown, in one embodiment, the liquid cooling module 10 can be used in the tablet computer 40. The liquid cooling module 10 can be disposed on one side of the back cover 41 of the tablet computer 40, and exemplaryly, it can be disposed between the battery and the back cover 41.

[0156] Figure 8 This is a schematic diagram of the structure of a laptop computer. Figure 8 As shown, in another embodiment, the liquid cooling module 10 may also be disposed in the laptop computer 50. Exemplarily, the liquid cooling module 10 may be disposed between the keyboard side 51 and the back cover 52 of the laptop computer 50. Alternatively, the liquid cooling module 10 may also be disposed through a hinge between the display screen 53 and the keyboard side 51 of the laptop computer 50, such that one end of the liquid cooling module 10 is disposed in the area where the display screen 53 is located, and the other end is disposed in the area where the keyboard side 51 is located.

[0157] In summary, the liquid cooling module of this application embodiment can be installed inside or through electronic devices. The coolant in the liquid cooling module can circulate in the heat exchange pipeline under the action of a micro pump. The heat exchange pipeline can extend from the heat-generating area of ​​the electronic device to the heat-dissipating area, thereby realizing heat transfer.

[0158] It is understood that, in the coolant of this application embodiment, since some other trace components will inevitably be introduced during the preparation process, the total mass percentage of heat exchange medium, first surfactant and optional second surfactant, defoamer and dye in the coolant of this application embodiment should be ≥95%, ≥98%, or ≥99%, etc., which should be understood as being within the scope defined in this application.

[0159] The coolant and liquid cooling module of this application will be explained below with reference to specific embodiments. In the following embodiments and comparative examples, the content of the heat exchange medium includes the content of uncontrollable trace components.

[0160] Examples 1-4 and Comparative Examples 1-5 are liquid cooling modules, each filled with a coolant as shown in Tables 1 to 9.

[0161] Table 1

[0162]

[0163] Table 2

[0164]

[0165] Table 3

[0166]

[0167] Table 4

[0168]

[0169] Table 5

[0170]

[0171] Table 6

[0172]

[0173] Table 7

[0174]

[0175] Table 8

[0176]

[0177] Table 9

[0178]

[0179] The flowability of the liquid cooling modules in the above embodiments and comparative examples was tested to observe whether the coolant in the liquid cooling module would cause pump jamming when air bubbles were present.

[0180] After the coolant in each of the above embodiments and comparative examples is prepared, it is injected into the flow channel of the corresponding liquid cooling module. The liquid cooling module is embedded into the inside of the mobile phone electronic product and bonded to the heat source. A driving voltage is applied to the micro pump to make the coolant inside the liquid cooling module circulate and dissipate heat.

[0181] During testing, the volume percentage of air bubbles in the coolant of each embodiment and comparative example was controlled within the same numerical range. The power of the heat source was also controlled within the same numerical range; for example, testing was conducted after stabilizing at a heat source power of 3.5W ± 0.5W for 60 seconds. The test structure is listed in Table 10.

[0182] Table 10

[0183]

[0184]

[0185] As can be seen from the test data in Table 10, the liquid cooling module of this application embodiment did not experience pump jamming during operation, and the bubbles were soluble, meaning that large bubbles could exist in the form of tiny bubbles invisible to the naked eye. However, in the liquid cooling modules of Comparative Examples 1-5, the liquid cooling modules of Comparative Examples 1-3 experienced pump jamming. The liquid cooling modules of Comparative Examples 4 and 5 also showed occasional pump jamming.

[0186] In the liquid cooling module of this application embodiment, the maximum temperature difference at each point is controlled within 5°C, while the maximum temperature difference of the liquid cooling modules corresponding to Comparative Examples 1-3 is around 20°C, which is much higher than that of the liquid cooling module of this application embodiment. When the liquid cooling modules corresponding to Comparative Examples 4 and 5 experience occasional pump jamming problems, the maximum temperature difference at each point of their liquid cooling modules is above 5°C.

[0187] Therefore, the liquid cooling module of this application embodiment, through the compounding of the coolant, can achieve a smooth and uninterrupted cooling effect, resulting in better heat dissipation stability. The maximum temperature difference at various points of the liquid cooling module can be ≤5℃@3.5W&60s, that is, after stable conduction for 60s under a heat source of 3.5W±0.5W, the maximum temperature difference of the liquid cooling module is ≤5℃.

[0188] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A coolant, characterized in that, It includes a heat exchange medium and a first surfactant miscible with the heat exchange medium, wherein the first surfactant has a hydrophilic-lipophilic balance value (HLB) greater than or equal to 8, and the static surface tension of the coolant is 13–30 mN / m.

2. The coolant according to claim 1, characterized in that, The first surfactant has a hydrophilic-lipophilic balance value (HLB) greater than or equal to 11.

3. The coolant according to claim 1 or 2, characterized in that, The first surfactant accounts for less than or equal to 2% of the mass of the coolant.

4. The coolant according to any one of claims 1-3, characterized in that, The heat exchange medium includes water, silicone oil, or fluorinated liquid.

5. The coolant according to claim 4, characterized in that, The heat exchange medium is water, and the molecular formula of the first surfactant is: Rf1-X1-M1; wherein, The Rf1 is CF3-R1-, and R1 is a C3 to C15 perfluoroalkylene group; X1 is selected from -SO3-, -COO-, and -(R2O). m -, R2 is a C2 to C6 alkylene group, and m takes the value of 1 to 30; M1 is selected from H, monovalent metal cations, or monovalent organic cations.

6. The coolant according to claim 5, characterized in that, The coolant also includes an antifoaming agent, the surface tension of which is less than 25 mN / m.

7. The coolant according to claim 5 or 6, characterized in that, The defoamer comprises a hydrophobic solvent and hydrophobic particles dispersed in the hydrophobic solvent, wherein the hydrophobic particles constitute 60% to 90% of the defoamer by mass; and / or, The hydrophobic solvent includes at least one of aliphatic derivatives or polysiloxanes; and / or, The hydrophobic particles are selected from silica particles, wax particles, or inorganic particles modified with hydrophobic groups.

8. The coolant according to any one of claims 5-7, characterized in that, The defoamer accounts for less than or equal to 1% of the mass of the coolant.

9. The coolant according to any one of claims 5-8, characterized in that, The coolant also includes a second surfactant, the second surfactant having a hydrophilic-lipophilic balance (HLB) value of less than 8; the second surfactant having a mass percentage of less than or equal to 2% in the coolant.

10. The coolant according to claim 9, characterized in that, The second surfactant includes at least one of alkynol surfactants or gemini surfactants; and / or, The second surfactant accounts for less than or equal to 0.5% of the mass of the coolant.

11. The coolant according to any one of claims 1-10, characterized in that, The static surface tension of the coolant is 18–25 mN / m.

12. The coolant according to any one of claims 1-11, characterized in that, The dynamic surface tension of the coolant is less than or equal to 35 mN / m.

13. The coolant according to claim 4, characterized in that, The heat exchange medium is a fluorinated liquid, and the first surfactant includes a fluorocarbon surfactant with the molecular formula Rf2-X2-M2; wherein, The Rf2 is CF3-R3-, and R3 is a C3 to C15 perfluoroalkylene group; The X2 is selected from -(R4O) m -, R4 is a C2 to C6 alkylene group, and m ranges from 1 to 30; The M2 is selected from H or C1 to C5 alkyl groups.

14. The coolant according to claim 13, characterized in that, The first surfactant further includes a fluorinated acrylate copolymer, the molecular formula of which is: in, Ra is H or methyl; Rb is a C1-C6 alkylene group, -(R5O) x -, R5 is a C2 to C6 alkylene group, and x takes the value of 1 to 3; Rc is a C3 to C12 perfluoroalkyl group.

15. The coolant according to claim 13 or 14, characterized in that, The fluorinated liquid is selected from at least one of the following compounds: C1-C12 perfluoroalkanes, C1-C12 perfluoroolefins, C1-C12 cyclic perfluoroalkanes, C1-C12 perfluoroalkynes, C1-C12 cyclic perfluoroolefins, CF2-A m -B n -OCF3, R f -OR h 、or R f -C(O)-R h 、or R f -N(R h )-R g At least one of them; wherein, The CF2-A m -B n In -OCF3, A is selected from -OCF2-, -OCF2CF2-, or -OCF(CF3)CF2-, and B is selected from -OCF(CF3)- or -OCF2CF(CF3)-; m and n are each independently selected from integers from 0 to 50, and m+n≥1; The R f -OR h In, the R f and the R h Each is independently selected from C1-C8 straight-chain perfluoroalkyl, C1-C8 branched perfluoroalkyl, and C1-C4 hydrofluoroalkyl; The R f -C(O)-R h In this context, Rf and Rh are each independently selected from C3-C8 straight-chain perfluoroalkyl, C3-C12 branched perfluoroalkyl, and C3-C12 perfluoroalkyl containing a cyclic structure; The R f -N(R h )-R g In the middle, R f R h and R g Each is independently selected from straight-chain perfluoroalkyl groups of C3 to C8, branched perfluoroalkyl groups of C3 to C12, or perfluoroalkyl groups of C3 to C12 containing a cyclic structure.

16. The coolant according to any one of claims 13-15, characterized in that, The static surface tension of the coolant is 13–20 mN / m.

17. The coolant according to claim 4, characterized in that, The heat exchange medium is silicone oil, and the first surfactant is a siloxane surfactant.

18. A liquid-cooled module, characterized in that, include: A micropump and a heat exchange pipeline, wherein the heat exchange pipeline is connected to the micropump to form a closed heat exchange passage, the heat exchange pipeline is filled with a coolant as described in any one of claims 1-17, and the micropump is used to drive the coolant to flow within the heat exchange pipeline.

19. An electronic device, characterized in that, It includes a heat source element and a liquid cooling module as described in claim 18, wherein a portion of the liquid cooling module is in contact with the heat source element or connected to the heat source element via a heat-conducting component.

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