Nickel-plated copper production line applied to integrated circuit manufacturing

Abstract

The invention relates to the technical field of integrated circuit manufacturing, in particular to a nickel-plated copper production line applied to integrated circuit manufacturing. The device comprises an electroplating bath, a plurality of water pumping devices are arranged in the electroplating bath, a liquid spraying assembly is arranged at the end of each water pumping device and located close to the top of a product strip, and a water outlet in the tail end of each liquid spraying assembly is of a circular structure in the initial state; two bending assemblies are arranged in the liquid spraying assembly, and when liquid flow distribution needs to be changed, a water outlet in the tail end of the liquid spraying assembly is changed into an elliptical structure from a circular structure by operating the bending assemblies; a transverse elliptical liquid curtain which is consistent with the width direction of the strip is formed at the outlet in cooperation with operation and rotary adjustment of the bending assembly; by changing the liquid flow form, columnar impact jet flow with high pressure in the center and low pressure on the two sides formed by a traditional round pipe is converted into sheet laminar flow with uniform pressure distribution and transverse extension; the liquid flow coverage in the width direction of the strip is expanded.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and more specifically, to a nickel-copper plating production line for integrated circuit manufacturing. Background Technology

[0002] The continuous nickel-copper plating production line is a highly efficient surface treatment system for processing long strip metal substrates (such as copper strips and stainless steel strips). Its core technology involves electrochemical deposition to continuously and uniformly deposit functional metal layers (such as nickel and copper) onto the surface of the high-speed conveyed strip. This production line integrates modules for unwinding, pretreatment, electroplating, post-treatment, and rewinding, and is widely used in electronic components, new energy battery current collectors, high-end connectors, and decorative building materials.

[0003] Currently, the mainstream continuous nickel-copper plating production lines in the industry mainly adopt a vertical or horizontal layout. During the electroplating process, the product strip is first cleaned and activated, and then passed vertically or horizontally through an electroplating unit consisting of an anode and a spray system. In this unit, the electroplating solution is pumped out from the storage tank through a pumping system and sprayed or sprinkled onto the surface of the strip through pipes and distributors. Under the action of an electric field, the metal ions in the solution are reduced and deposited on the conductive layer on the surface of the strip to form a coating. Subsequently, the strip undergoes post-processing steps such as rinsing and drying, and is finally wound into a finished product.

[0004] In the electroplating solution application process, traditionally, a simple circular tube outlet is used for spraying or sprinkling. Due to the columnar free jet formed by the circular tube outlet, its velocity and pressure are distributed in a parabolic shape with high velocity at the center and low velocity at the edges. When the high-speed liquid flow vertically impacts the high-speed running product strip, at the fluid distribution level, the pressure in the core impact zone of the columnar liquid flow is significantly higher than that in the diffusion zones on both sides. This limits the effective wetting width of the strip surface, forcing the central area to form an excessively thick liquid film, while the lateral areas can only be covered by the lateral spread of the liquid. This easily results in a thin coating with a thicker central layer and thinner lateral layers.

[0005] Therefore, there is an urgent need for a nickel-copper plating production line for integrated circuit manufacturing to solve the above problems. Summary of the Invention

[0006] This invention provides a nickel-copper plating production line for integrated circuit manufacturing. It utilizes multiple pumping devices and a matching liquid spraying assembly within the electroplating tank. Initially, the outlet of the liquid spraying assembly is circular. By manipulating symmetrically arranged bending components within the assembly, the outlet can be deformed from a circle to an elliptical structure. Rotating the liquid spraying assembly aligns the major axis of the elliptical structure with the width direction of the product strip, forming a laterally expanding elliptical liquid curtain. This allows the electroplating solution to uniformly cover the surface of the product strip, preventing a center-thick and side-thin liquid film distribution and ensuring uniform plating thickness. This solves the problems mentioned in the background art, namely:

[0007] Traditional simple circular tube outlet forms a columnar free jet, whose velocity and pressure are parabolically distributed with high center and low edge, resulting in limited effective wetting width on the strip surface, thick liquid film in the center and thin on both sides, thus forming an uneven coating.

[0008] To achieve the above objectives, the nickel-copper plating production line for integrated circuit manufacturing includes an unwinding device, a pretreatment module, an electroplating module, and a posttreatment module arranged in sequence. The electroplating module includes an electroplating tank, which is configured to contain electroplating solution and allow the product strip to pass through vertically. The outer wall of the electroplating tank is connected to the inlet and outlet pipes by a filtration mechanism.

[0009] The electroplating tank is equipped with multiple water pumping devices. The end of each water pumping device is equipped with a liquid spraying assembly. The liquid spraying assembly is located near the top of the product strip, and the water outlet at the end of the liquid spraying assembly is initially circular.

[0010] The spraying assembly has two bending components inside. When it is necessary to change the liquid flow distribution, the end outlet of the spraying assembly can be deformed from a circular structure to an elliptical structure by operating the bending components.

[0011] Meanwhile, by rotating the installation direction of the spraying assembly at the end of the pumping device, the major axis of the elliptical structure is aligned with the width direction of the product strip, thus adjusting the electroplating solution sprayed on the surface of the product strip into a laterally expanding elliptical liquid curtain.

[0012] In the above technical solution, because the columnar jet from the traditional round tube outlet will cause the liquid film on the strip surface to be thick in the center and thin on both sides, resulting in poor coating uniformity, multiple water pumping devices are first installed in the electroplating tank, and the liquid spraying assembly is arranged near the top of the product strip. The electroplating liquid is continuously supplied through the water pumping devices. Taking advantage of the vertical transport characteristics of the strip, the electroplating liquid is allowed to naturally extend and cover the strip surface after being sprayed down from the top.

[0013] Initially, the outlet of the spray assembly is circular. By setting two bending components inside the spray assembly, the outlet is driven to change from circular to elliptical by operating the bending components. This is because the elliptical structure can break the problem of uneven pressure distribution of the columnar jet and expand the liquid flow coverage. Then, by rotating the spray assembly, the major axis of the ellipse is aligned with the width direction of the product strip, allowing the liquid flow to spread fully in the width direction of the strip, forming a laterally expanding elliptical liquid curtain, ensuring that every area of ​​the strip surface can obtain uniform liquid film coverage.

[0014] Based on this, the filtration mechanism includes a filter tank, and an outlet plate and an inlet plate are respectively provided near both ends inside the filter tank. The bottom of the outlet plate is fixedly connected to the bottom of the filter tank, and an overflow gap is left between its top and the top of the filter tank. The top of the inlet plate is flush with the top of the filter tank, and an overflow gap is left between its bottom and the bottom of the filter tank.

[0015] Preferably, inside the filter tank, a high-level overflow trough is formed between the water outlet plate and the inner wall of one end of the filter tank, and a low-level extraction trough is formed between the water inlet plate and the inner wall of the other end of the filter tank. The space between the water outlet plate and the water inlet plate is the main trough. The high-level overflow trough is connected to the electroplating tank through a water outlet pipe, and the low-level extraction trough is connected to the electroplating tank through a water inlet pipe.

[0016] In another technical solution, the water pumping device includes a water pump, which is fixedly connected to the outer wall of the electroplating tank. The two ends of the water pump are respectively connected to a water pumping pipe and a water inlet pipe. Both the water pumping pipe and the water inlet pipe are fixedly connected to the inside of the electroplating tank. A corrugated pipe is fixedly connected to the end of the water inlet pipe, and a liquid spraying component is provided at the end of the corrugated pipe.

[0017] In the above scheme, the spraying assembly includes a rotating tube, which is rotatably connected inside the corrugated pipe near the end. The end of the rotating tube that extends out of the corrugated pipe is fixedly connected to a pipe head, and the end of the pipe head is provided with an annular groove and sealed by the end.

[0018] Preferably, the outer wall of the rotating tube is provided with an annular flange, and the inner wall of the end of the corrugated tube is provided with a matching annular groove. The annular flange is rotatably engaged in the annular groove, thereby realizing the rotation and axial positioning of the spraying assembly relative to the corrugated tube.

[0019] The annular groove contains two bending components that are movably connected to each other, and the two bending components are arranged symmetrically.

[0020] The bending assembly includes two balls and a deformable wire; the two balls are movably engaged inside the annular groove; the deformable wire is fixedly connected between the two balls and located inside the annular groove.

[0021] In this technical solution, the diameter of the ball is larger than the diameter of the annular groove, and the diameter of the deformable wire is smaller than the diameter of the annular groove. This is used to restrict the movement of the two balls within the annular groove, while allowing the deformable wire to freely stretch and deform within the annular groove.

[0022] Both the pipe head and the end are made of flexible, corrosion-resistant material, which is used to undergo elastic deformation during the bending assembly to change the shape of the outlet.

[0023] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0024] The outlet of the liquid spraying assembly is designed as a variable structure that can be transformed from a circle to an ellipse. Combined with the operation and rotation adjustment of the bending assembly, the outlet forms a transverse elliptical liquid curtain that is consistent with the width direction of the strip.

[0025] By changing the flow pattern, the columnar impact jet formed by the traditional circular tube with high pressure in the center and low pressure on both sides is transformed into a sheet-like laminar flow with uniform pressure distribution and lateral extension. This provides a uniform and gentle flow coverage in the width direction of the strip, expands the wetting width and achieves uniform liquid film thickness, avoiding the coating thickness caused by uneven jet pressure distribution. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram showing the connection relationship between the filtration mechanism and the electroplating tank of the present invention;

[0028] Figure 3 This is a schematic diagram of the cyclic state of the filtration mechanism of the present invention;

[0029] Figure 4 This is a schematic diagram of the pumping device structure of the present invention;

[0030] Figure 5 This is a schematic diagram of a partial internal structure of the electroplating tank of the present invention;

[0031] Figure 6 This is a schematic diagram of the strip spraying structure of the product of the present invention;

[0032] Figure 7 This is a schematic diagram of the spraying assembly structure of the present invention;

[0033] Figure 8 This is an exploded view of the spray assembly structure of the present invention;

[0034] Figure 9 This is a schematic diagram of the distribution structure of the bending component of the present invention;

[0035] Figure 10 This is a schematic diagram of the bending component structure of the present invention;

[0036] Figure 11 This is a schematic diagram of the deformation state of the liquid spray according to the present invention;

[0037] Figure 12 This is a schematic diagram of the elliptical deformation process of the present invention.

[0038] The meanings of the labels in the diagram are as follows:

[0039] 1. Electroplating tank; 11. Water outlet pipe; 12. Water inlet pipe;

[0040] 13. Pumping device; 130. Corrugated pipe; 131. Inlet pipe; 132. Pumping pipe; 133. Pump;

[0041] 14. Spray assembly; 140. Pipe end fitting; 141. End fitting; 142. Tube adapter;

[0042] 15. Bending assembly; 150. Bead; 151. Deformed wire;

[0043] 2. Filtration mechanism; 21. Water outlet plate; 22. Water inlet plate; 23. Filtration tank. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] Currently, when using traditional cylindrical tube spraying, the uneven distribution of the impact force of the columnar liquid flow results in a thicker liquid film in the center and thinner films at the edges on the strip surface, ultimately leading to uneven electroplating layer thickness. This invention provides a nickel-copper plating production line for integrated circuit manufacturing, comprising an unwinding device, a pretreatment module, an electroplating module, and a post-treatment module arranged sequentially.

[0046] See Figures 1-2 As shown, the electroplating module includes an electroplating tank 1, which is configured to contain electroplating liquid and allow product strips to pass through vertically. The outer wall of the electroplating tank 1 is connected to the inlet pipe 12 via an outlet pipe 11 and a filter mechanism 2.

[0047] It should be noted that the unwinding device, pre-treatment module, post-treatment module, and product strip transport device are all existing technologies. In the existing technology, the product strip transport device mainly consists of a winding machine, guide rollers, and drive rollers. Through the winding power of the winding machine and the transmission action of the drive rollers, the product strip is released from the unwinding device and continuously passes through the pre-treatment module, electroplating module, and post-treatment module in a vertical direction to achieve continuous nickel-copper plating. The conventional processing steps of the pre-treatment module are to perform ultrasonic degreasing, micro-etching, pickling, and pure water cleaning on the strip in sequence to remove the oxide layer, oil, and impurities on the surface of the strip and improve the adhesion between the subsequent plating layer and the strip. The conventional processing steps of the post-treatment module are to remove adhesive, etching, multi-stage pure water cleaning, and hot air drying. After the processing is completed, the strip is finally wound up by the winding machine into a finished product.

[0048] In the above technical solution, the filtration mechanism 2 includes a filter tank 23, and an outlet plate 21 and an inlet plate 22 are respectively provided near both ends inside the filter tank 23. See [link to technical details]. Figure 3 As shown, the bottom of the water outlet plate 21 is fixedly connected to the bottom of the filter tank 23, and there is an overflow gap between its top and the top of the filter tank 23. The top of the water inlet plate 22 is flush with the top of the filter tank 23, and there is an overflow gap between its bottom and the bottom of the filter tank 23.

[0049] See Figure 2 As shown, inside the filter tank 23, a high-level overflow trough is formed between the water outlet plate 21 and the inner wall of one end of the filter tank 23, and a low-level extraction trough is formed between the water inlet plate 22 and the inner wall of the other end of the filter tank 23. The space between the water outlet plate 21 and the water inlet plate 22 is the main trough. The high-level overflow trough is connected to the electroplating tank 1 through the water outlet pipe 11, and the low-level extraction trough is connected to the electroplating tank 1 through the water inlet pipe 12.

[0050] The electroplating solution continuously flows into the filter tank 23 through the outlet pipe 11. The high-level overflow tank is formed by the outlet plate 21 and the inner wall of one end of the filter tank 23. When the level of the electroplating solution in the high-level overflow tank rises above the overflow gap between the top of the outlet plate 21 and the inner top of the filter tank 23, the electroplating solution overflows smoothly along the overflow gap to the main tank between the outlet plate 21 and the inlet plate 22. At this time, filter media such as filter paper and cotton core can be placed in the main tank.

[0051] As the electroplating solution slowly flows through the filter medium in the main tank, impurities are intercepted by the filter medium, thus purifying the electroplating solution. The purified electroplating solution continues to flow towards the inlet plate 22. Since the top of the inlet plate 22 is flush with the top of the filter tank 23 and there is an overflow gap between the bottom of the inlet plate 22 and the inner bottom of the filter tank 23, the electroplating solution will flow from the bottom overflow gap into the low-level extraction tank formed by the inner wall of the inlet plate 22 and the other end of the filter tank 23. Finally, the purified electroplating solution flows back into the electroplating tank 1 through the inlet pipe 12 connected to the low-level extraction tank, forming a complete closed-loop filtration cycle, ensuring that the electroplating solution in contact with the strip during the electroplating process remains clean.

[0052] In practice, multiple pumping devices 13 are installed inside the electroplating tank 1. A liquid spraying assembly 14 is installed at the end of each pumping device 13. The liquid spraying assembly 14 is located near the top of the product strip, and the outlet of the end of the liquid spraying assembly 14 is initially circular. Two bending assemblies 15 are installed inside the liquid spraying assembly 14. When it is necessary to change the liquid flow distribution, the end outlet of the liquid spraying assembly 14 is deformed from a circular structure to an elliptical structure by operating the bending assemblies 15. At the same time, by rotating the installation direction of the liquid spraying assembly 14 at the end of the pumping device 13, the major axis of the elliptical structure is aligned with the width direction of the product strip, and the electroplating liquid sprayed on the surface of the product strip is adjusted into a laterally expanding elliptical liquid curtain.

[0053] For details, see Figure 4As shown, the water pumping device 13 includes a water pump 133, which is fixedly connected to the outer wall of the electroplating tank 1. The two ends of the water pump 133 are respectively connected to a water pumping pipe 132 and a water inlet pipe 131. Both the water pumping pipe 132 and the water inlet pipe 131 are fixedly connected to the inside of the electroplating tank 1. A corrugated pipe 130 is fixedly connected to the end of the water inlet pipe 131, and a liquid spraying component 14 is provided at the end of the corrugated pipe 130.

[0054] When the water pump 133 is started, its internal power mechanism generates suction power, and the electroplating solution purified by the filter mechanism 2 is drawn through the water pump pipe 132. After the water pump 133 pressurizes the electroplating solution, it is transported to the corrugated pipe 130 through the water inlet pipe 131 at the other end, and then transported to the liquid spraying assembly 14 connected to its end through the conduction effect of the corrugated pipe 130.

[0055] Among them, the corrugated pipe 130 has flexible and deformable characteristics, see Figure 5 As shown, it can adaptively bend and finely adjust the installation position according to the position and height of the product strip in the electroplating tank 1 and the rotation adjustment requirements of the liquid spraying assembly 14, such as... Figure 6 As shown, the liquid coating assembly 14 is aligned with the product strip, and the liquid coating assembly 14 is positioned on top of the product strip to ensure that the electroplating solution is coated on the surface of the strip.

[0056] The working principle of the water pump 133 is as known in the prior art. It is driven by a motor to rotate the impeller in the pump body at high speed, so that a negative pressure environment is formed in the impeller cavity. The electroplating solution in the electroplating tank 1 is drawn into the pump body through the water pumping pipe 132 by the pressure difference between atmospheric pressure and the pressure inside the cavity. At the same time, the high-speed rotating impeller will generate centrifugal force on the drawn electroplating solution, so that the electroplating solution gains kinetic energy and pressure energy. Under the action of pressure, the electroplating solution is pressurized and transported to the subsequent pipelines and components along the water inlet pipe 131, realizing the stable suction and directional transportation of the electroplating solution. Its specific structure and working process are all conventional technical means in this field, without any additional innovative design.

[0057] In this embodiment, see Figure 7 and Figure 8 As shown, the rotating tube 142 of the spray assembly 14 is assembled inside the bellows 130 near the end. The outer wall of the rotating tube 142 is integrally formed with an annular flange. Correspondingly, the inner wall of the end of the bellows 130 is provided with an annular groove that matches the size and curvature of the annular flange. During assembly, the annular flange is embedded in the annular groove to form a rotatable snap-fit.

[0058] The axial limiting effect of the annular flange and the annular groove can effectively restrict the movement of the liquid spraying assembly 14 along the axis of the rotating tube 142, and prevent the liquid spraying assembly 14 from being displaced due to liquid pressure or adjustment during operation; at the same time, it allows the liquid spraying assembly 14 to rotate freely 360° relative to the bellows 130, so that when the outlet of the liquid spraying assembly 14 is deformed, the long axis direction of the outlet can be adjusted to meet the requirements of the strip width.

[0059] Furthermore, after the end of the swivel pipe 142 away from the corrugated pipe 130 passes through the pipe body, it is fixedly connected to the pipe head 140. The annular groove opened at the end of the pipe head 140 is used to install the bending assembly 15. The end 141 covers the end of the pipe head 140 through a sealing fit, which protects the bending assembly 15 in the annular groove and seals the gaps around the water outlet to prevent electroplating solution leakage.

[0060] See Figure 9 As shown, the annular groove at the end of the pipe head 140 is a closed groove opened in the circumferential direction. The two bending components 15 are symmetrically arranged along the diameter direction of the annular groove. During assembly, the two balls 150 of each bending component 15 are respectively embedded in the annular groove, so that the balls 150 can slide flexibly along the circumference of the annular groove. The deformation wire 151 connecting the two balls 150 is naturally tensioned at the bottom of the annular groove, forming a symmetrical deformation driving structure. When the bending components 15 are operated, the symmetrically distributed components can synchronously drive the corresponding two sides of the pipe head 140 to deform, avoiding the deformation and skew of the outlet caused by unilateral force.

[0061] See Figure 10 As shown, the bending assembly 15 includes two balls 150 and a deformable wire 151; the two balls 150 are movably engaged inside the annular groove; the deformable wire 151 is fixedly connected between the two balls 150 and located inside the annular groove; wherein, the diameter of the balls 150 is larger than the diameter of the annular groove, so that the balls 150 can be engaged at a preset specific position inside the annular groove, restricting the circumferential trajectory sliding of the balls 150 in the annular groove, so that the balls 150 of each bending assembly 15 always remain at a fixed point, providing a fixed tension support base for the deformable wire 151, and avoiding the displacement of the tension position of the deformable wire 151 due to the sliding of the balls 150;

[0062] The diameter of the deformable wire 151 is smaller than the diameter of the annular groove. This ensures that there is sufficient clearance between the outer periphery and the annular groove wall when the deformable wire 151 undergoes deformation actions such as expansion, contraction, and bending. This prevents the deformation from being restricted due to contact interference with the annular groove wall, and ensures that the deformable wire 151 can freely complete the deformation as required.

[0063] Among them, the deformable wire 151 is a nickel-titanium shape memory alloy material in the prior art. It has a slender straight wire structure and has the characteristics of shape memory effect, super elasticity and acid and alkali corrosion resistance. It can undergo controllable deformation such as expansion, contraction and bending under external force and can stably maintain the deformed shape after deformation. Moreover, this material is suitable for the working environment of the electroplating solution in the electroplating tank 1. It is not easily corroded, has good fatigue resistance, can be repeatedly deformed for a long time without failure, and can also return to the initial straight state under external force triggering.

[0064] In addition, both the pipe head 140 and the end 141 are integrally molded from flexible and corrosion-resistant polytetrafluoroethylene material. Based on the chemical stability and elastic deformation of this material, it can withstand corrosive media such as acids, alkalis and metal ions in the electroplating solution and will not react chemically with the electroplating solution. While adapting to the harsh working environment in the electroplating tank 1, it can undergo uniform elastic deformation under the pulling action of the bending component 15, thereby changing the cross-sectional shape of the outlet. Moreover, after deformation, there is no plastic deformation and good recovery. It can synchronously restore the initial shape with the reset of the bending component 15.

[0065] See Figure 11 and Figure 12 As shown, when it is necessary to change the shape of the water outlet, an external force is first applied to the bending assembly 15 to trigger the bending of the internal deformable wire 151. Since the tension point of the deformable wire 151 remains fixed, its deformation will form a symmetrical and uniform tension force on the water outlet end of the pipe head 140. Affected by this force, the pipe head 140 undergoes elastic deformation, which in turn directly drives the water outlet at its end to deform from a circle to an elliptical structure.

[0066] After deformation is complete, the rotatable spray assembly 14 can be precisely adjusted so that the major axis of the elliptical outlet is aligned with the width of the strip. When it is necessary to restore the outlet to its initial shape, a reverse triggering force is applied to the deformable wire 151 to restore it to its initial state. This, in turn, creates a reverse pull on the pipe head 140, causing the pipe head 140 to elastically reset, and the outlet also synchronously returns from an ellipse to a circle.

[0067] Working principle:

[0068] Once the production line is started, the product strip transport drive provides continuous power, which drives the product strip to be released from the unwinding device and enter the pretreatment module in a vertical direction. Through the conventional process of ultrasonic degreasing, micro-etching, pickling and pure water cleaning, the oxide layer, oil and impurities on the surface of the strip are thoroughly removed. After pretreatment, the strip continues to maintain a vertical posture and enters the electroplating tank 1 of the electroplating module for nickel-copper plating.

[0069] At this time, the filtering mechanism 2 connected to the outer wall of the electroplating tank 1 operates synchronously. The electroplating solution flows from the electroplating tank 1 into the high-level overflow tank of the filtering mechanism 2. As the liquid level continuously rises, when it exceeds the overflow gap at the top of the water outlet plate 21, the electroplating solution overflows smoothly into the main tank. During the process of slowly flowing through the filtering medium, the impurities therein are effectively intercepted and purified. The purified electroplating solution continues to flow towards the side of the water inlet plate 22 and flows into the low-level extraction tank through the overflow gap between the bottom of the water inlet plate 22 and the inner bottom of the filtering tank 23, and finally returns to the electroplating tank 1 through the water inlet pipe 12;

[0070] Meanwhile, the water pumping device 13 supporting the electroplating tank 1 starts synchronously. The water pump 133 drives the impeller to rotate at a high speed through the motor, creating a negative pressure environment inside the pump body. Using the pressure difference, the electroplating solution that has been purified in the electroplating tank 1 is extracted. The centrifugal force generated by the rotation of the impeller gives kinetic energy and pressure energy to the electroplating solution. The pressurized electroplating solution is transported to the liquid spraying component 14 through the pipeline, and the bellows 130 is adaptively bent and position - fine - tuned according to the position height of the strip in the electroplating tank 1 and the rotation adjustment requirements of the liquid spraying component 14, ensuring that the liquid spraying component 14 is positioned at the top of the vertically - transported strip;

[0071] In the initial state, the water outlet of the liquid spraying component 14 is circular. By applying an external force to the bending component 15 manually, the deformation wire 151 made of nickel - titanium shape - memory alloy inside it is triggered to bend. Since the pulling points of the deformation wire 151 are fixed and the two bending components 15 are symmetrically arranged, its deformation will form a symmetric and uniform pulling force on the pipe head part 140 made of polytetrafluoroethylene material, prompting the pipe head part 140 to undergo elastic deformation, and then the water outlet synchronously changes from a circular shape to an elliptical structure;

[0072] Subsequently, by rotating the liquid spraying component 14, the long axis of the elliptical water outlet is accurately adjusted to be consistent with the width direction of the strip. By flowing the pressurized electroplating solution out of the elliptical water outlet, an elliptical liquid curtain that expands horizontally along the width direction of the strip is formed, and it is evenly sprayed on the surface of the vertically - transported strip, avoiding the problem of uneven impact force distribution of the traditional columnar liquid flow, which causes the liquid film to be thick in the center and thin on both sides, and ensuring the uniformity of the coating thickness;

[0073] Finally, the strip that has completed nickel - copper plating processing continues to leave the electroplating tank 1 in a vertical posture under the drive of the transportation driving device, and enters the post - treatment module to successively complete conventional operations such as degumming, etching, multi - stage pure water washing, and hot - air drying, thus completing the nickel - copper plating processing of the product strip.

[0074] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A nickel-copper plating production line for integrated circuit manufacturing, comprising an unwinding device, a pretreatment module, an electroplating module and a posttreatment module arranged in sequence, wherein the electroplating module includes an electroplating tank (1), the electroplating tank (1) is configured to contain electroplating liquid and allow the product strip to pass through vertically, and the outer wall of the electroplating tank (1) is connected to an inlet pipe (12) via an outlet pipe (11) and a filter mechanism (2). Its features are: The electroplating tank (1) is equipped with multiple water pumping devices (13), and the end of the water pumping device (13) is equipped with a liquid spraying assembly (14). The liquid spraying assembly (14) is located near the top of the product strip, and the end outlet of the liquid spraying assembly (14) is initially circular. The liquid spraying assembly (14) is provided with two bending assemblies (15). When it is necessary to change the liquid flow distribution, the end outlet of the liquid spraying assembly (14) is deformed from a circular structure to an elliptical structure by operating the bending assemblies (15). Meanwhile, by rotating the liquid spraying assembly (14) at the end of the pumping device (13), the major axis of the elliptical structure is aligned with the width of the product strip, thus adjusting the electroplating liquid sprayed on the surface of the product strip into a laterally expanding elliptical liquid curtain.

2. The nickel-copper plating production line for integrated circuit manufacturing according to claim 1, characterized in that: The filtration mechanism (2) includes a filter tank (23). The filter tank (23) has an outlet plate (21) and an inlet plate (22) near both ends. The bottom of the outlet plate (21) is fixedly connected to the bottom of the filter tank (23), and there is an overflow gap between its top and the top of the filter tank (23). The top of the inlet plate (22) is flush with the top of the filter tank (23), and there is an overflow gap between its bottom and the bottom of the filter tank (23).

3. The nickel-copper plating production line for integrated circuit manufacturing according to claim 2, characterized in that: Inside the filter tank (23), a high overflow trough is formed between the water outlet plate (21) and the inner wall of one end of the filter tank (23), and a low extraction trough is formed between the water inlet plate (22) and the inner wall of the other end of the filter tank (23). The space between the water outlet plate (21) and the water inlet plate (22) is the main trough. The high-level overflow tank is connected to the electroplating tank (1) through the water outlet pipe (11), and the low-level extraction tank is connected to the electroplating tank (1) through the water inlet pipe (12).

4. The nickel-copper plating production line for integrated circuit manufacturing according to claim 1, characterized in that: The pumping device (13) includes a pump (133), which is fixedly connected to the outer wall of the electroplating tank (1). The pump (133) is connected to a pumping pipe (132) and an inlet pipe (131) at both ends. The pumping pipe (132) and the inlet pipe (131) are both fixedly connected inside the electroplating tank (1). A corrugated pipe (130) is fixedly connected to the end of the inlet pipe (131), and a liquid spraying assembly (14) is provided at the end of the corrugated pipe (130).

5. The nickel-copper plating production line for integrated circuit manufacturing according to claim 4, characterized in that: The spraying assembly (14) includes a rotating tube (142), which is rotatably connected inside the corrugated pipe (130) near the end. The end of the rotating tube (142) that extends out of the corrugated pipe (130) is fixedly connected to a pipe head (140). The end of the pipe head (140) is provided with an annular groove and is sealed by an end (141).

6. The nickel-copper plating production line for integrated circuit manufacturing according to claim 5, characterized in that: The outer wall of the rotating pipe (142) is provided with an annular flange, and the inner wall of the end of the corrugated pipe (130) is provided with a matching annular groove. The annular flange is rotatably engaged in the annular groove to realize the rotation and axial positioning of the spraying assembly (14) relative to the corrugated pipe (130).

7. The nickel-copper plating production line for integrated circuit manufacturing according to claim 5, characterized in that: The annular groove is movably connected to two bending components (15), which are arranged symmetrically.

8. The nickel-copper plating production line for integrated circuit manufacturing according to claim 7, characterized in that: The bending assembly (15) includes two balls (150) and a deformable wire (151); the two balls (150) are movably engaged inside the annular groove; the deformable wire (151) is fixedly connected between the two balls (150) and located inside the annular groove.

9. The nickel-copper plating production line for integrated circuit manufacturing according to claim 8, characterized in that: The diameter of the ball (150) is larger than the diameter of the annular groove, and the diameter of the deformable wire (151) is smaller than the diameter of the annular groove. This is used to restrict the two balls (150) to move within the annular groove, while allowing the deformable wire (151) to freely stretch and deform within the annular groove.

10. The nickel-copper plating production line for integrated circuit manufacturing according to claim 5, characterized in that: Both the pipe head (140) and the end (141) are made of flexible corrosion-resistant material and are used to undergo elastic deformation to change the shape of the outlet when the bending assembly (15) is in operation.

Images