Copper cylinder electroplating system

Abstract

The invention discloses a copper cylinder electroplating system. The system comprises an electroplating bath; the electroplating mechanism comprises two groups of spraying units which are parallel and opposite to each other and extend along the length direction of the electroplating bath, and anode units which are correspondingly arranged on the backs of the spraying units; the cathode hanging tool comprises a frame body, a first conductive clamping assembly, a second conductive clamping assembly and an electricity taking carbon brush, the first conductive clamping assembly is arranged on the upper portion of the frame body, the second conductive clamping assembly is arranged on the lower portion of the frame body, and the electricity taking carbon brush is arranged on the side portion of the frame body. The second conductive clamping assembly is electrically connected with the first conductive clamping assembly and the second conductive clamping assembly through cables; each conductive groove is used for accommodating the power-taking carbon brush of the corresponding cathode hanger and providing cathode current for the power-taking carbon brush; according to the invention, the problems that the hanger used by the traditional electroplating bath cannot adapt to the quick remodeling requirements of PCBs with different sizes, and the uniformity of the plating layer of the PCB is influenced due to current interruption easily caused by fluctuation of contact resistance can be solved.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment, and more specifically to a copper tank electroplating system. Background Technology

[0002] In the field of PCB electroplating technology, traditional electroplating tanks generally adopt immersion or single-sided spraying processes, which have uneven electric field distribution between the anode and cathode, and are prone to edge effects, resulting in significant differences in plating thickness between the edge and center areas of the PCB board. In addition, traditional electroplating fixtures mostly adopt single-point clamping and rigid conductive structures, which cannot adapt to the rapid changeover requirements of PCB boards of different sizes, and the fluctuation of contact resistance can easily cause current interruption, affecting the uniformity of the PCB board plating. Summary of the Invention

[0003] To overcome the above-mentioned shortcomings, the present invention aims to provide a copper cylinder electroplating system.

[0004] To achieve the above objectives, the technical solution adopted by the present invention includes:

[0005] Electroplating tank; The electroplating mechanism includes two sets of parallel and facing spray units that extend along the length of the electroplating tank, and an anode unit correspondingly disposed on the back of each spray unit. An electroplating space is formed between the two spray units for the workpiece to be electroplated to pass through. The spray unit includes a spray pipe and a plurality of nozzles evenly arranged on the spray pipe. A cathode holder is used to clamp a workpiece to be electroplated and provide cathode current. The cathode holder includes a frame body, a first conductive clamping assembly, a second conductive clamping assembly, and a power-collecting carbon brush. The frame body is used to accommodate and fix the workpiece to be electroplated. The first conductive clamping assembly is located on the upper part of the frame body and is used to clamp the upper end of the workpiece to be electroplated. The second conductive clamping assembly is located on the lower part of the frame body and is used to clamp the lower end of the workpiece to be electroplated. The power-collecting carbon brush is located on the side of the frame body and is electrically connected to the first conductive clamping assembly and the second conductive clamping assembly via a cable. A conductive groove is disposed above the electroplating tank along the width direction of the electroplating tank. There is at least one conductive groove, and each conductive groove is used to accommodate the corresponding cathode holder's carbon brush and to provide cathode current to the carbon brush.

[0006] In the preferred embodiment of the above-mentioned copper plating system, a walking structure is also included. The walking structure includes a walking chain assembly, a guide plate, a guide roller assembly, and a connector. The walking chain assembly is rotatably disposed on the upper part of the plating tank. Each of the chains in the walking chain assembly is provided with an inclined slot. The connector is disposed on the upper side of the frame body and can enter the slot of the chain. The guide plate is disposed on the upper part of the plating tank along the length direction of the plating tank. The guide roller assembly includes guide wheels that are rotatably mounted on the frame body and abut against the guide plate.

[0007] In the preferred technical solution of the above-mentioned copper cylinder electroplating system, the frame body includes an upper frame and a lower frame. The upper frame has a through hole on its side, and the lower frame has a corresponding waist hole on its side. The upper frame and the lower frame are connected by bolts and nuts passing through the through hole and waist hole to adjust the relative position of the upper frame and the lower frame and to lock and fix them.

[0008] In the preferred embodiment of the above-mentioned copper cylinder electroplating system, the first conductive clamping assembly includes a plurality of upper clamps arranged at intervals, and the second conductive clamping assembly includes a plurality of lower clamps arranged at intervals. Both the upper and lower clamps are made of conductive material, and the surfaces of the upper and lower clamps are covered with an insulating and corrosion-resistant layer. The insulating and corrosion-resistant layer covers the remaining surfaces except for the parts in contact with the workpiece to be electroplated.

[0009] In the preferred embodiment of the above-mentioned copper cylinder electroplating system, the material of the insulating and corrosion-resistant layer is at least one of PP, PE, PVC, PTFE or epoxy resin.

[0010] In the preferred technical solution of the above-mentioned copper cylinder electroplating system, the anode unit includes an anode plate and a shielding plate disposed on the anode plate. The shielding plate has regional compensation holes on its surface. The regional compensation holes are at least one of grids of different densities, circular hole arrays, and irregular holes. The opening density or size of the regional compensation holes is adapted to the current density of the corresponding area of ​​the workpiece.

[0011] In the preferred embodiment of the above-mentioned copper plating system, a baffle pipe is provided below the plating space in the plating tank, and the baffle pipe has several upward-through air holes.

[0012] In the preferred embodiment of the above-mentioned copper cylinder electroplating system, along the width direction of the electroplating tank, a first limiting plate and a second limiting plate are provided below the nozzle in the electroplating tank, and a limiting post is provided at the lower part of the frame body, the limiting post being able to extend between the first limiting plate and the second limiting plate.

[0013] In the preferred embodiment of the above-mentioned copper plating system, an inlet pipe is provided inside the plating tank, and an overflow pipe is provided above the plating tank.

[0014] In the preferred embodiment of the copper cylinder electroplating system described above, the width of the electroplating space formed between the two spraying units is 10-30 mm.

[0015] The beneficial effects of this invention are that the cathode hanger of this copper cylinder electroplating system adopts a sliding contact between the power-collecting carbon brush and the conductive tank, and the frame body has an adjustable structure, which ensures stable current conduction and adapts to PCB boards of different sizes, improves process stability and yield, and is suitable for high-precision PCB board manufacturing needs. Attached Figure Description

[0016] Figure 1 This is the front view of the present invention; Figure 2 This is a right view of the present invention; Figure 3 This is a front view of the present invention; Figure 4 This is a schematic diagram of the injection unit. Figure 5 This is a schematic diagram of the anode unit. Figure 6 This is the front view of the cathode mount; In the diagram: 1. Electroplating tank; 2. Electroplating mechanism; 21. Spraying unit; 211. Spray pipe; 212. Nozzle; 212. Anode unit; 221. Anode plate; 222. Shielding plate; 222. Area compensation hole; 2221. Electroplating space; 23. Cathode hanger; 3. Frame body; 31. Upper frame; 311. Lower frame; 312. Bolt; 313. Limiting post; 314. First conductive clamping assembly; 32. Upper clamp; 321. Second conductive clamping assembly; 33. Lower clamp; 331. Electrostatic carbon brush; 34. Conductive groove; 4. Walking structure; 5. Walking chain assembly; 51. Guide plate; 52. Guide roller assembly; 53. Connector; 54. Baffle pipe; 6. First limiting plate; 71. Second limiting plate; 72. Liquid inlet pipe; 81. Overflow pipe; 82. PCB board; 9. Detailed Implementation

[0017] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0018] It should be noted that in the description of this invention, terms such as "upper," "lower," "left," "right," "front," and "rear," which indicate direction or positional relationships, are based on the direction or positional relationships shown in the accompanying drawings. These are used merely for ease of description and do not indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "set," "connected," and "linked" should be interpreted broadly, for example, referring to a fixed connection, a detachable connection, or an integral connection. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] See Figures 1 to 6 The copper plating system of the present invention includes an electroplating tank 1, an electroplating mechanism 2, a cathode hanger 3, and a conductive tank 4.

[0021] See Figure 1 , Figure 2 The electroplating mechanism 2 includes two spraying units 21 extending along the length of the electroplating tank 1 and disposed within the electroplating tank 1, and an anode unit 22 disposed on the back of each spraying unit 21. An electroplating space 23 is formed between the two spraying units 21 for the PCB board 9 to pass through. Both spraying units 21 are capable of spraying high-pressure electrolyte into the electroplating space 23 to deposit metal ions in the electrolyte onto the surface of the PCB board 9. Each spraying unit 21 includes a nozzle 211 and a plurality of nozzles 21 evenly arranged on the nozzle 211. 2. The nozzle 212 can be a Venturi nozzle. The nozzle 211 is connected to the pump body through a pipeline. The pump body can pump the electrolyte in the electroplating tank 1 into the nozzle 211 and finally spray it out towards the PCB board 9 through the nozzle 212. The narrow electroplating space 23 formed by the two sets of parallel and facing spray units 21 forces the high-pressure electrolyte to penetrate the surface of the PCB board 9 vertically in a laminar flow state, effectively reducing edge effects and concentration polarization, making the metal ion deposition more uniform, which is suitable for the through-hole electroplating and surface coating requirements of high-precision circuit boards.

[0022] See 1. Figure 2 , Figure 6The cathode holder 3 includes a frame body 31, a first conductive clamping assembly 32, a second conductive clamping assembly 33, and a power-collecting carbon brush 34. The frame body 31 has a window for placing the PCB board 9. The first conductive clamping assembly 32 is located on the upper part of the frame body 31 and is used to clamp the upper end of the workpiece to be electroplated and to conduct cathode current to the PCB board 9. The second conductive clamping assembly 33 is located on the lower part of the frame body 31 and is used to clamp the lower end of the workpiece to be electroplated and to conduct cathode current to the PCB board 9. The power-collecting carbon brush 34 is located on the side of the frame body 31 and is electrically connected to the first conductive clamping assembly 32 and the second conductive clamping assembly 33 through a cable. The first conductive clamping assembly 32 and the second conductive clamping assembly 33 can simultaneously energize the upper and lower ends of the PCB board 9 to achieve the effect of uniformly conducting cathode current to the PCB board 9, thereby improving the uniformity and efficiency of copper ion deposition on the surface of the PCB board 9.

[0023] See Figure 1 , Figure 2 , Figures 4 to 6 The carbon brush 34 is rotatably mounted on a carrier plate with a concave cross-section via a rotating shaft and a torsion spring. The torsion spring is sleeved on the rotating shaft and has a first end and a second end. The first end is fixed on the carrier plate and the second end is fixed on the side of the carbon brush 34. With the help of the elastic force of the torsion spring, the lower end of the carbon brush 34 can press against the conductive groove 4 set above the electrolytic cell and maintain sliding contact to ensure the stable introduction of cathode current.

[0024] See Figure 1 , Figure 2 , Figure 6 Several conductive grooves 4 are arranged along the width of the electroplating tank 1. The conductive grooves 4 can be conductive copper busbars. The conductive grooves 4 are located directly above the electrolytic tank. The number of conductive grooves 4 corresponds to the number of cathode hangers 3. Each conductive groove 4 is used to accommodate the corresponding cathode hanger 3's carbon brush 34 and can provide cathode current to the carbon brush 34, thereby providing cathode current to the PCB board 9 immersed in the electroplating tank 1. The sliding contact arrangement between the carbon brush 34 and the conductive groove 4 replaces the traditional cantilever brush. The current is evenly distributed to the first conductive clamping component 32 and the second conductive clamping component 33 through the cable. The contact resistance is low and stable, ensuring a continuous supply of cathode current and avoiding scorching or localized plating defects.

[0025] When electroplating the PCB board 9, the PCB board 9 is first placed in the window of the frame body 31, and the upper end of the PCB board 9 is clamped and fixed by the first conductive clamping component 32 and the lower end of the PCB board 9 is clamped and fixed by the second conductive clamping component 33. Then, the cathode hanger 3 is placed in the electroplating tank 1, and the carbon brush 34 of the cathode hanger 3 is brought into contact with the conductive tank 4. After that, the cathode hanger 3 is controlled to move in the electroplating tank 1, and the two spraying units 21 are controlled to spray high-pressure electroplating liquid onto the PCB board 9 clamped and fixed by the cathode hanger 3, so that the metal ions in the electroplating liquid are deposited on the surface of the PCB board 9, thus completing the electroplating of the PCB board 9.

[0026] In one or more embodiments, a walking structure 5 is also included. The walking structure 5 includes a walking chain assembly 51, a guide plate 52, a guide roller assembly 53, and a connector 54. The walking chain assembly 51 is rotatably disposed on the upper part of the electroplating tank 1. Each of the chains included in the walking chain assembly 51 is provided with an inclined slot. The connector 54 is disposed on the upper side of the frame body 31 and can enter the slot of the chain. The guide plate 52 is disposed on the upper part of the electroplating tank 1 along the length direction of the electroplating tank 1. The guide roller assembly 53 includes a guide wheel that is rotatably mounted on the frame body 31 and abuts against the guide plate 52.

[0027] See Figure 1 , Figure 2 , Figure 6 The walking chain assembly 51 includes several chains assembled in a ring, chain teeth for driving the chain rotation, and a servo motor. Each chain has an inclined slot, and the slots of several chains are assembled at an inclination towards the same side, so that the connector 54 installed on the frame body 31 can be inserted into the slot. When the walking chain assembly 51 rotates in a ring, it can drive the frame body 31 to move in the electroplating tank 1 through the connector 54.

[0028] See Figure 2 A vertical guide plate 52 is provided on the upper part of the electroplating tank 1 along its length direction. The guide roller group 53 has a first guide wheel and a second guide wheel that abut against both sides of the guide plate 52, and a third guide wheel that abuts against the side of the guide plate 52. With this arrangement, stability can be formed when the frame body 31 is driven by the walking chain group 51.

[0029] In one or more embodiments, the frame body 31 includes an upper frame 311 and a lower frame 312. The upper frame 311 has a through hole on its side, and the lower frame 312 has a waist hole on its side. The upper frame 311 and the lower frame 312 are connected to the nut by bolts 313 passing through the through hole and the waist hole, so as to adjust the relative position of the upper frame 311 and the lower frame 312 and lock them in place.

[0030] See Figure 2 , Figure 6The frame body 31 has an upper frame 311 and a lower frame 312. The upper frame 311 is located at the upper opening of the lower frame 312. The position of the upper frame 311 relative to the lower frame 312 in the vertical direction is adjustable, or the position of the lower frame 312 relative to the upper frame 311 in the vertical direction is adjustable. When both are moved to a preset position, they can be fixed to form an accommodating space for the workpiece to be electroplated. By setting the upper frame 311 and the lower frame 312 to be adjustable in the vertical direction, the electroplating carrier plate hanger of this application can be adapted to PCB boards 9 of different sizes, thereby improving the applicability of the electroplating carrier plate hanger of this application.

[0031] See Figure 2 The sides of the upper frame 311 and the lower frame 312 can be flat or cylindrical. The upper frame 311 and the lower frame 312 are covered with insulating material. The insulating material can reduce stray current and improve the uniformity of the plating layer on the PCB board 9 to be plated.

[0032] Specifically, when adjusting the upper frame 311 and the lower frame 312, simply turn the nuts in the opposite direction to release their limiting and fixing effect on the upper frame 311 and the lower frame 312. Then, move the upper frame 311 or the lower frame 312 vertically to the preset position, and then tighten the nuts and bolts 313 to lock and fix the upper frame 311 and the lower frame 312. This allows for adjustment of the accommodating space of the frame body 31, adapting to the clamping and fixing of PCB boards 9 of different sizes.

[0033] In one or more embodiments, the first conductive clamping assembly 32 includes a plurality of upper clamps 321 arranged at intervals, and the second conductive clamping assembly 33 includes a plurality of lower clamps 331 arranged at intervals. Both the upper clamps 321 and the lower clamps 331 are made of conductive material, and the surfaces of the upper clamps 321 and the lower clamps 331 are covered with an insulating and corrosion-resistant layer. The insulating and corrosion-resistant layer covers the remaining surfaces except for the parts in contact with the workpiece to be electroplated.

[0034] See Figure 6 Both the upper clip 321 and the lower clip 331 are quick clamps made of conductive material. The material of the upper clip 321 and the lower clip 331 can be copper, iron or other possible metal alloys. The upper clip 321 and the lower clip 331 are set as quick clamps, which can realize the quick clamping of PCB board 9, improve the efficiency of electroplating processing of PCB board 9, and have practicality.

[0035] In addition, the insulating and corrosion-resistant layer on the outer surface of the upper clip 321 and the lower clip 331 can isolate the electroplating solution from contact with the metal substrate of the upper clip 321 and the lower clip 331, effectively resisting strong acid and alkali corrosion, greatly extending the service life of the rack, and preventing metal ions in the upper clip 321 and the lower clip 331 from dissolving and contaminating the plating solution, thus ensuring the plating quality and yield of the PCB board 9. On the other hand, the insulating layer only exposes the clamping parts, reducing stray current interference and allowing the current to be directionally conducted to the PCB board 9, improving the uniformity of electroplating.

[0036] In one or more embodiments, the insulating corrosion-resistant layer is made of at least one of PP, PE, PVC, PTFE or epoxy resin.

[0037] In one or more embodiments, the anode unit 22 includes an anode plate 221 and a shielding plate 222 disposed on the anode plate 221. The shielding plate 222 has a region compensation hole 2221 on its surface. The region compensation hole 2221 is at least one of a grid of different densities, a circular hole array, or an irregular hole. The opening density or size of the region compensation hole 2221 is adapted to the current density of the corresponding area of ​​the workpiece.

[0038] See Figure 2 , Figure 5 The anode plate 221 is made of titanium-based or platinum-coated material and serves as the anode body for the electroplating reaction. The shielding plate 222 is fixed on the side of the anode plate 221 facing the workpiece being electroplated. The area compensation holes 2221 on its surface are a combination of at least one of the following hole types: grid holes of different densities, circular hole arrays, or irregular holes. In the high current density area of ​​the PCB board 9, the compensation holes at the corresponding positions on the shielding plate 222 are denser or smaller to block more electric field lines. In the low current density area, the compensation holes are sparser or larger to allow more current to pass through. When electroplating the PCB board 9, the electric field lines generated by the anode must first pass through the shielding plate 222 before reaching the surface of the PCB board 9. By selectively blocking the electric field lines, the shielding plate 222 can effectively balance the problem of uneven current density caused by differences in the circuit pattern on the surface of the PCB board 9, thereby improving the uniformity of the plating layer deposited on the surface of the PCB board 9.

[0039] In one or more embodiments, a baffle tube 6 is provided below the electroplating space 23 within the electroplating tank 1. The baffle tube 6 has several upward-through air holes. The baffle tube 6 is connected to an external pump body, which can be an air pump. Gas is pumped into the baffle tube 6 through the pump body and discharged upward through the air holes. This causes the air bubbles to strongly disturb the electrolyte during their ascent, effectively breaking down the static diffusion layer formed on the surface of the PCB board 9 due to the continuous consumption of metal ions. This accelerates the replenishment of fresh electrolyte, significantly alleviates concentration polarization, avoids the problems of scorching and uneven thickness of the plating layer under high current density, and improves the quality of the plating layer on the PCB board 9.

[0040] In one or more embodiments, along the width direction of the electroplating tank 1, a first limiting plate 71 and a second limiting plate 72 are provided in the electroplating tank 1 below the nozzle 211, and a limiting post 314 is provided at the lower part of the frame body 31, the limiting post 314 being able to extend between the first limiting plate 71 and the second limiting plate 72.

[0041] See Figure 2 , Figure 6 The first limiting plate 71 and the second limiting plate 72 are disposed within the electroplating tank 1 along the width direction of the electroplating tank 1, and the limiting post 314 is placed between the first limiting plate 71 and the second limiting plate 72. When the walking structure 5 controls the frame body 31 to move within the electroplating space 23, the limiting plate 71 and the second limiting plate 72 limit the limiting post 314 along the width direction of the electroplating tank 1, which can effectively reduce the swaying phenomenon of the frame body 31 during movement and improve the electroplating quality of the PCB board 9.

[0042] In one or more embodiments, an inlet pipe 81 is provided inside the electroplating tank 1. The inlet of the inlet pipe 81 is connected to an external pump, and the outlet of the inlet pipe 81 extends to the lower part of the electroplating tank 1. An overflow pipe 82 is provided above the electroplating tank 1. The inlet pipe 81 continuously replenishes fresh electrolyte into the tank through the external pump, ensuring that the metal ion concentration in the electroplating tank 1 is always maintained within the process setting range, avoiding the problem of ion depletion caused by long-term electroplating. The overflow pipe 82 controls the liquid level and discharges the used aged solution in a directional manner, preventing the accumulation of impurities and pH fluctuations, and extending the service life of the electroplating solution.

[0043] In one or more embodiments, the width of the electroplating space 23 formed between the two spraying units 21 is 10-30mm. The width of the electroplating space 23 can be adaptively adjusted according to the width of the frame body 31, specifically 10mm, 15mm, 20mm, 25mm, or 30mm. There is no specific limitation; it can be selected according to actual production needs.

[0044] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A copper plating system, characterized in that, include: Electroplating tank; The electroplating mechanism includes two sets of parallel and facing spray units that extend along the length of the electroplating tank, and an anode unit correspondingly disposed on the back of each spray unit. An electroplating space is formed between the two spray units for the workpiece to be electroplated to pass through. The spray unit includes a spray pipe and a plurality of nozzles evenly arranged on the spray pipe. A cathode holder is used to clamp a workpiece to be electroplated and provide cathode current. The cathode holder includes a frame body, a first conductive clamping assembly, a second conductive clamping assembly, and a power-collecting carbon brush. The frame body is used to accommodate and fix the workpiece to be electroplated. The first conductive clamping assembly is located on the upper part of the frame body and is used to clamp the upper end of the workpiece to be electroplated. The second conductive clamping assembly is located on the lower part of the frame body and is used to clamp the lower end of the workpiece to be electroplated. The power-collecting carbon brush is located on the side of the frame body and is electrically connected to the first conductive clamping assembly and the second conductive clamping assembly via a cable. A conductive groove is disposed above the electroplating tank along the width direction of the electroplating tank. There is at least one conductive groove, and each conductive groove is used to accommodate the corresponding cathode holder's carbon brush and to provide cathode current to the carbon brush.

2. The copper plating system according to claim 1, characterized in that: It also includes a walking structure, which includes a walking chain assembly, a guide plate, a guide roller assembly, and a connector. The walking chain assembly is rotatably disposed on the upper part of the electroplating tank. Each of the chains in the walking chain assembly is provided with an inclined slot. The connector is disposed on the upper side of the frame body and can enter the slot of the chain. The guide plate is disposed on the upper part of the electroplating tank along the length direction of the electroplating tank. The guide roller assembly includes guide wheels that are rotatably mounted on the frame body and abut against the guide plate.

3. The copper plating system according to claim 1, characterized in that: The main frame includes an upper frame and a lower frame. The upper frame has a through hole on its side, and the lower frame has a corresponding waist hole on its side. The upper frame and the lower frame are connected by bolts and nuts passing through the through hole and waist hole to adjust the relative position of the upper frame and the lower frame and to lock and fix them.

4. The copper plating system according to claim 1, characterized in that: The first conductive clamping assembly includes a plurality of upper clamps arranged at intervals, and the second conductive clamping assembly includes a plurality of lower clamps arranged at intervals. Both the upper and lower clamps are made of conductive material, and the surfaces of the upper and lower clamps are covered with an insulating and corrosion-resistant layer. The insulating and corrosion-resistant layer covers the remaining surfaces except for the parts in contact with the workpiece to be electroplated.

5. The copper plating system according to claim 4, characterized in that: The insulating and corrosion-resistant layer is made of at least one of PP, PE, PVC, PTFE or epoxy resin.

6. The copper plating system according to claim 1, characterized in that: The anode unit includes an anode plate and a shielding plate disposed on the anode plate. The shielding plate has regional compensation holes on its surface. The regional compensation holes are at least one of the following: grids of different densities, circular hole arrays, and irregular holes. The opening density or size of the regional compensation holes is adapted to the current density of the corresponding area of ​​the workpiece.

7. The copper plating system according to claim 1, characterized in that: A baffle tube is provided below the electroplating space in the electroplating tank, and the baffle tube has several upward-through air holes.

8. The copper plating system according to claim 1, characterized in that: Along the width direction of the electroplating tank, a first limiting plate and a second limiting plate are provided below the nozzle in the electroplating tank, and a limiting post is provided at the lower part of the frame body, the limiting post being able to extend between the first limiting plate and the second limiting plate.

9. The copper plating system according to claim 1, characterized in that: The electroplating tank is equipped with an inlet pipe, and the electroplating tank is equipped with an overflow pipe above it.

10. The copper plating system according to claim 1, characterized in that: The width of the electroplating space formed between the two spraying units is 10-30 mm.

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