Color conversion component for light emitting diode

Abstract

According to an embodiment of the present invention, a color conversion member for an LED comprises: a color conversion part formed in a plate shape that converts and passes the color of light emitted from the LED; a light reflecting portion covering a side surface of the color conversion portion and reflecting light propagating toward the side surface of the color conversion portion; and a light absorbing part covering the outside of the light reflecting part and absorbing the light that has passed through the light reflecting part. The color conversion part, the light reflection part and the light absorption part are integrally formed, and a light emission surface forms a flat plate-shaped structure. The light reflecting portion reflects light propagating toward the side surface of the color conversion portion, and the light absorbing portion removes the light propagating in the side direction, thereby improving the straightness of the emitted light.

Description

Technical Field

[0001] This invention relates to a color conversion component for a light-emitting diode (LED). More specifically, it relates to a color conversion component for a light-emitting diode that is mounted in front of the LED chip and radiates light by changing the wavelength of the light emitted by the LED. Background Technology

[0002] With the increasing use of multi-beam LEDs in applications such as automotive headlights, small LEDs are arranged in multiples and controlled to blink independently. Since each small LED can blink independently, improving the light transmittance and light quality of each LED is essential.

[0003] Japanese Patent No. 7117127 discloses a light-emitting device comprising: a substrate, a light-emitting element disposed on the substrate, and a wavelength conversion member disposed on the light-emitting element. The wavelength conversion member covers the entire upper surface of the light-emitting element and has an upper surface smaller than its bottom surface, with its width gradually decreasing in a direction parallel to the substrate as it extends from the bottom surface to the upper surface; a first covering member covering the side surface of the wavelength conversion member and a second covering member covering the entire side surface of the light-emitting element and extending from the bottom periphery of the wavelength conversion member toward the upper surface. The first covering member and the second covering member have different light absorption rates. The first covering member fills the space between the second covering member and the wavelength conversion member, and the inner side surface of the second covering member extends from the bottom periphery of the wavelength conversion member toward the upper surface in a direction perpendicular to the substrate. Summary of the Invention

[0004] Technical issues

[0005] The present invention aims to provide a color conversion component for light-emitting diodes, which has high straightness, a smooth surface and small size, and is free from cracks or chipping, thereby improving the light quality of light-emitting diodes.

[0006] Problem-solving methods

[0007] A color conversion component for a light-emitting diode according to an embodiment of the present invention includes: a plate-shaped color conversion section that converts and passes through the color of light emitted by the light-emitting diode; a light-reflecting section that covers the side of the color conversion section and reflects light propagating toward the side of the color conversion section; and a light-absorbing section that covers the outside of the light-reflecting section and absorbs light passing through the light-reflecting section. The color conversion section, the light-reflecting section, and the light-absorbing section are integrally formed to form a plate-shaped structure with a flat light-emitting surface. The light-reflecting section reflects light propagating toward the side of the color conversion section, while the light-absorbing section removes light propagating toward the side, thereby improving the directness of the emitted light.

[0008] The side of the color conversion part can be formed at an angle, the light reflection part is a film structure that covers the side of the angled color conversion part, and the light absorption part is a rectangular frame structure with an angled inner side and an outer side parallel to the direction of light travel, thus forming a rectangular flat plate structure as a whole.

[0009] The side of the color conversion part is inclined within a certain depth, and the rest is parallel to the direction of light propagation; the light reflecting part is a film structure that covers the side of the color conversion part, and similar to the color conversion part, part of it is inclined along the direction of light propagation, and part of it is parallel; the light absorbing part is a rectangular frame structure, part of the inner side is inclined, the rest is parallel to the direction of light propagation, and the outer side is parallel to the direction of light propagation, thus forming a rectangular flat plate structure as a whole.

[0010] The light-reflecting part is made of any one of aluminum, silver, gold, copper, chromium, titanium dioxide or cerium oxide, and is attached to the color conversion part by vapor deposition to form a film structure.

[0011] The light-absorbing part is composed of a mixture of glass and carbon powder, which is made by mixing and solidifying liquid glass and carbon powder.

[0012] The light-absorbing part can also be made of chromium oxide or nickel-chromium alloy and coated on the outside of the light-reflecting part by vapor deposition.

[0013] Invention Effects

[0014] According to the present invention, a small, durable, and light-transmitting smooth-shaped color conversion component for light-emitting diodes can be manufactured. Attached Figure Description

[0015] Figure 1 This is a cross-sectional view of a color conversion component for a light-emitting diode according to an embodiment of the present invention.

[0016] Figures 2 to 5 This is a diagram showing the direction of light travel and light quality when the color conversion component is used in the comparative example of the present invention.

[0017] Figure 6 A flowchart illustrating a method for manufacturing a color conversion component for a light-emitting diode according to an embodiment of the present invention is shown.

[0018] Figures 7 to 15 The diagram shows the results of each step in the manufacturing method of a color conversion component for a light-emitting diode according to an embodiment of the present invention.

[0019] Figure 16 To show a perspective view of the color conversion component for a light-emitting diode according to an embodiment of the present invention,

[0020] Figure 17This is a cross-sectional view showing a color conversion component for a light-emitting diode according to another embodiment of the present invention.

[0021] (Explanation of reference numerals in the attached diagram)

[0022] 1; Color conversion unit; 3; Light reflection unit

[0023] 5; Light absorption unit; 10; Color conversion unit

[0024] 31; Original board 32; Protrusion

[0025] 33; Cutting groove; 34; Chipped edge area

[0026] 37; reflective film; 38; secondary cutting groove

[0027] 39; Light-absorbing materials Detailed Implementation

[0028] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The drawings illustrate exemplary aspects of the present invention and are provided only for the purpose of more detailed explanation; the scope of the present invention is not limited thereto.

[0029] Furthermore, regardless of the reference numerals in the accompanying drawings, the same or corresponding structural elements are given the same reference numerals, and repeated descriptions of them are omitted. For ease of explanation, the size and shape of the various structural components shown in the drawings are exaggerated or reduced.

[0030] In addition, terms including ordinal numbers such as first or second can be used to describe various structural elements, which are not limited to the terms mentioned above, but are only used to distinguish one structural element from another.

[0031] According to an embodiment of the present invention, a color conversion component 10 for a light-emitting diode, such as Figure 1 As shown, it can be formed into a flat plate shape. A color conversion part 1 is formed in the central part, and a light reflecting part 3 is formed around it. A light absorbing part 5 can be formed around the light reflecting part 3.

[0032] The color conversion section 1 can be formed as a rectangular plate, and its side can be formed as an inclined structure. A light reflecting section 3 can be formed on the outer side of the inclined side. The light reflecting section 3 can be in close contact with the side of the color conversion section 1. The outer surface of the light reflecting section 3 can be formed parallel to the inner surface. The light reflecting section 3 can be formed to cover the entire side of the color conversion section 1.

[0033] The light-absorbing part 5 can be formed to be in close contact with the outer surface of the light-reflecting part 3. The inner surface of the light-absorbing part 5 can be formed to have the same inclined structure as the outer surface of the light-reflecting part 3. The outer surface of the light-absorbing part 5 can be perpendicular to the upper and lower surfaces of the color-converting part 1. The light-absorbing part 5 can have a rectangular frame shape covering the side of the light-reflecting part 3. The color-converting component 10, which combines the color-converting part 1, the light-reflecting part 3, and the light-absorbing part 5, can be formed into a flat rectangular plate structure.

[0034] The color conversion section 1 can be formed by mixing fluorescent material powder, glass powder, binder, etc., and then firing them. The light reflecting section 3 can be a thin film made of metals such as aluminum, silver, gold, copper, chromium, titanium dioxide, or cerium oxide. The light absorbing section 5 can be manufactured by mixing carbon powder into silicone resin or epoxy resin. Liquid glass can be used instead of silicone resin, which may have advantages in terms of strength, durability, and adhesion compared to silicone resin. Light changes color when passing through the color conversion section 1, is reflected when it encounters the light reflecting section 3, and is absorbed when it encounters the light absorbing section 5.

[0035] like Figure 2 As shown, the color conversion component 23 can be attached to the light-emitting surface of the LED chip 20 to form a light-emitting module. The LED chip 20 emits blue light, which is converted into white light and emitted when passing through the color conversion component 23. However, in the comparative example, the color conversion component 23, which is composed only of the color conversion section 1, cannot maintain the linear propagation of light during the color conversion process. That is, the light cannot travel perpendicularly to the surface of the color conversion component 23, but instead... Figure 2 As shown, light diffuses laterally. By arranging multiple light-emitting modules and independently controlling their illumination, it is possible to control the emission of light only in a specific direction. However, if the linearity of each light-emitting module decreases, it is impossible to achieve the effect of emitting light only in the desired direction. Figure 2 As shown, the light emitted by adjacent light-emitting units will meet and interfere, which may lead to a decrease in the ability to distinguish.

[0036] like Figure 3 As shown, the light reflector 25 can be disposed on the side of the color conversion unit 23 in the form of a film. However, the light still cannot travel straight, and the light reflected by the light reflector 25 may propagate in the opposite direction. In this case, the straightness of the light also decreases. Part of the light emitted from the LED chip 20 may travel straight, while part may propagate towards the side of the color conversion unit 23. Therefore, it is necessary to correct the light propagating in the side direction so that it can travel straight. Figure 3As shown, not all light reaching the light reflector 25 is reflected; some may pass through it. Theoretically, the light reflector 3 should reflect all light, but in actual products, although most light is reflected, some may not be reflected and may pass through the light reflector 25 and propagate laterally. This may lead to a decrease in linearity and contrast.

[0037] like Figure 4 and Figure 5 As shown, the color conversion component 10 according to an embodiment of the present invention has an inclined color conversion section 1, the area of ​​which gradually increases along the light travel direction. Similarly, the inner area of ​​the light reflecting section 3 covering the side of the color conversion section 1 also gradually increases along the light travel direction. Since the light reflecting surface gradually expands along the light travel direction, light propagating toward the side of the color conversion component 10 is reflected back to the center when it encounters the light reflecting section 3, thereby improving the light directivity. Furthermore, all light transmitted through the light reflecting section 3 is absorbed by the light absorbing section 5, so only direct light can complete color conversion and be emitted. Here, the light travel direction refers to the direction in which all light components point when ideal directivity is achieved, and this direction is perpendicular to the surface of the LED chip 20.

[0038] According to embodiments of the present invention, such as Figure 5 As shown, compared to the light radiation mode of the comparative example, the light radiation mode of the present invention can form a narrower width. This type of light-emitting module with good linearity is very useful when multiple light-emitting modules are arranged in different positions and the light is controlled to radiate only towards the desired position.

[0039] According to an embodiment of the present invention, the color conversion component 10 is integrally formed with a light-reflecting portion 3 and a light-absorbing portion 5. A color conversion component 23 having only the color conversion portion 1 can be mounted on the LED chip 20, and a light-reflecting portion or a light-absorbing portion can be separately mounted on its side to form a light-emitting module. However, in applications that generate severe vibrations, such as automotive headlights, the light-reflecting portion or the light-absorbing portion may not be able to adhere tightly to the color conversion component 23, resulting in gaps or detachment. Therefore, by integrally forming the light-reflecting portion 3 and the light-absorbing portion 5 on the color conversion component 10 itself, good light transmission can be maintained for a long time in harsh environments. Furthermore, since there is no need to provide a separate light-absorbing wall outside the color conversion component 10, design freedom is increased, and materials are also saved.

[0040] Vibration and temperature can also reduce the durability of the light-emitting module. Because the power is very high when driving automotive headlights, the internal temperature of the light-emitting module can rise to 200 degrees Celsius. In winter, when the vehicle is parked, the temperature can drop to -40 degrees Celsius. Under these conditions, the components of the light-emitting module will expand or contract due to temperature changes, and cracks may form when gaps are created between the different components. These cracks will reduce the light quality of the light-emitting module. According to an embodiment of the present invention, the color conversion component 10 itself is integrally and firmly formed with the light-reflecting portion 3 and the light-absorbing portion 5, thus preventing quality degradation caused by temperature and vibration.

[0041] Figure 6 This invention relates to a method for manufacturing a color conversion component 10 according to an embodiment of the present invention.

[0042] according to Figure 7 First, a base plate 31 is prepared to be divided into individual LED color conversion components 10. The base plate 31 can be made into a circle or a square. Manufacturing a larger base plate 31 and dividing it into small chip-shaped LED color conversion components 10 is more efficient than manufacturing small LED color conversion components 10 in actual product size from the beginning. Since the commonly used LED color conversion components 10 are small in size and inconvenient to process by hand or machine, the above method is adopted. The base plate 31 can be obtained by mixing powdered phosphor material with glass crystals or silicone resin, followed by sintering, compression, drying and other processing steps.

[0043] Since the dimensions of the original board 31 are not the actual dimensions of the final application product, it needs to be divided into small LED color conversion components 10. In addition, since its surface may be relatively rough or even curved, it needs to be planarized.

[0044] like Figure 6 As shown, the steps The upper surface of the original plate 31 is to be ground. Figure 7 The processed raw plate 31 shown has a relatively flat bottom surface B, but its top surface T may be uneven or tilted. Typically, it is thinner in the center and thicker at the periphery, resulting in a curved top surface T. Through the steps... The grinding process can make the top surface T flat. If there are still minor bumps on the top surface T, that is, the surface roughness does not reach the required level, the fine grinding steps can be repeated to further polish and achieve a smooth surface.

[0045] According to an embodiment of the present invention, the grinding process can be performed using a surface grinding machine. The grinding machine gradually removes the surface of the original plate 31 using a rotating, flat, disc-shaped grinding wheel. During the grinding process, the thickness of the original plate 31 is reduced uniformly and gradually. The grinding system may include a support for supporting and moving the grinding machine; a support bed for placing the original plate 31; and mechanical equipment with a control unit.

[0046] according to The step involves forming cutting grooves 33 on the original plate 31. A mesh-like structure is formed by creating multiple parallel straight lines at regular intervals along the cutting lines using a cutting blade, and by creating multiple cutting lines perpendicular to these lines. The cutting grooves 33 are formed by cutting the original plate 31 only to a certain depth, rather than completely separating it. The original plate 31 between the cutting grooves 33 is raised, and these raised portions will become the areas of individual color conversion components 10.

[0047] For example, bevel-shaped cutting blades with a gradually narrowing outer width can be used. Therefore, such as Figure 8 As shown, the width of the cutting groove 33 gradually increases outwards. Next, the bottom of the cutting groove 33 is cut again. This time, instead of using a beveled cutting blade, a flat cutting blade without a bevel is used. The beveled cutting blade used in the first cut has the smallest width at its outermost point of rotation. In the second cut, a cutting blade with the same or slightly larger width can be used. After as... Figure 9 After the first and second cuts shown, the cutting groove 33 is completed.

[0048] According to the present invention, the depth d1 portion of the cutting groove 33 is formed by a single cut, and the subsequent depth d2 portion is formed by a second cut. The bottom surface of the cutting groove 33 is separated from the bottom surface by a predetermined thickness d3. The portion formed by the single cut gradually narrows and is inclined, while the width of the lower portion formed by the second cut remains constant.

[0049] like Figure 9 As shown, the formation of the cutting groove 33 also creates a chipped area 34. During the cutting process of the original plate 31 using the cutting blade, the surface of the original plate 31 may become uneven due to stress. The original plate 31 is manufactured by mixing various particles; therefore, when the cutting blade cuts the surface of the original plate 31, the material constituting the original plate 31 may fragment, thus forming the cutting groove 33, accompanied by chipping. Typically, chipping mainly occurs at the edges of the cutting groove 33, particularly forming the chipped area 34 at the widest outer edge of the upper part of the cutting groove 33. Removing these chips to obtain a smooth surface is ideal.

[0050] according to Figure 6 , Figure 9 and Figure 10 As step C, the upper surface T of the original plate 31 with the cutting groove 33 is surface ground to uniformly reduce the thickness of the original plate 31. The chipped edge portion 34 can be removed by grinding. Since grinding is performed to remove the chipped edge portion 34, only the surface portion is ground to a predetermined depth d4 to ensure that the inclined surface formed in the first cut B is not completely removed. After completing step C, as... Figure 10 and Figure 11 As shown, a base plate 31 with decahedral protrusions 32 arranged in a matrix on its surface can be obtained. The upper side of the protrusions 32 is inclined, while the lower side is vertical.

[0051] according to Figure 6 and Figure 12 As <d>The step involves forming a reflective film 37 on the surface of the original plate 31. The reflective film 37 can form a thin film structure covering the surface of the color conversion component 10. The reflective film 37 can be formed by vapor deposition. The original plate 31 is fixed in a vacuum chamber with the side with the cut groove 33 facing down, and metal is placed underneath for evaporation, causing the metal to condense on the surface of the original plate 31 until a film of the desired thickness is achieved. By vapor deposition on the surface of the original plate 31 with the cut groove 33 in this way, the reflective film 37 will be deposited inside the cut groove 33, such as... Figure 12 As shown. The reflective film 37 ultimately forms the light-reflecting part 3 of the finished color conversion component 10.

[0052] according to Figure 6 and Figure 13 As <e>The step involves coating a light-absorbing material 39 onto the surface T of the original plate 31, which has a cutting groove 33. Silicone resin or epoxy resin can be mixed with toner to form a flowable light-absorbing material 39, which is then coated onto the entire upper surface of the original plate 31, including the interior of the cutting groove 33. The light-absorbing material 39 is then firmly fixed to the outer surface of the reflective film 37 by drying at room temperature or by heating. The light-absorbing material 39 ultimately forms the light-absorbing portion 5 of the processed color conversion component 10. After coating with the light-absorbing material 39, it can be leveled using a scraper before drying to ensure that the light-absorbing material 39 is uniformly filled inside the cutting groove 33.

[0053] The light-absorbing material 39 can be applied by mixing carbon powder with silicone resin or liquid glass and then injecting it into the cutting groove 33, but it can also be applied by other methods. For example, just as the reflective film 37 is formed by vapor deposition, the light-absorbing material 39 can also be applied to the substrate 31 by coating or vapor deposition. In this case, the light-absorbing material 39 used can be chromium oxide or a nickel-chromium alloy.

[0054] according to Figure 6 and Figure 14 As a step <f>The surface of the original plate 31, to which the light-absorbing material 39 has been fixed, is ground. Therefore, the light-absorbing material 39 fixed to the surface of the original plate 31 is uniformly thinned. Grinding can be performed until... Figure 14 As shown, the upper surface of the protrusion 32 of the original plate 31 is exposed. Excessive grinding to the depth of the cutting groove 33 is unnecessary. During grinding, the upper surface of the original plate 31 is exposed, while the cutting groove 33 remains filled with the light-reflecting film 37 and the light-absorbing material 39. This invention does not add the light-reflecting film 37 or the light-absorbing material 39 to the side after the color conversion component 10 is manufactured; instead, it integrates the light-reflecting film 37 and the light-absorbing material 39 with the original plate 31 by filling the cutting groove 33. Therefore, the original plate 31, the light-reflecting film 37, and the light-absorbing material 39 can be firmly integrated. In addition to the surface of the original plate 31, the light-absorbing material 39 can also be filled only within the cutting groove 33 to achieve the desired effect. Figure 14 The state, but as Figure 13 As shown, it is better to first coat the light-absorbing material 39 on both the surface of the original plate 31 and the cutting groove 33, and then remove it. This is because it is almost impossible to precisely and cleanly fill the light-absorbing material 39 only within the cutting groove 33. The same applies to the light-reflecting film 37; it is not easy to precisely deposit it only within the cutting groove 33. Therefore, it is advisable to first uniformly coat the light-reflecting film 37 and the light-absorbing material 39 on the original plate 31 and the cutting groove 33, and then remove the area outside the cutting groove 33. This allows the light-reflecting film 37 and the light-absorbing material 39 to adhere firmly to the original plate 31 and form a consistent structure along the entire cutting groove 33.

[0055] according to Figure 6 and Figure 15 As <g>In this step, a groove 38 is formed again on the surface of the original plate 31, which is filled with light-absorbing material 39 and reflective film 37. A cutting blade is used to form the groove 38, similar to the previous one. The steps are the same. The position of the new cutting groove 38 is as follows: Figure 15 As shown, this is the portion of the original cut groove 33 filled with the reflective film 37 and the light-absorbing material 39. A second cut groove 38 is formed along the cutting line of the original first cut groove 33. A very thin cutting blade is used, which allows for the formation of a very narrow cut groove 38. The cut groove 38 divides the light-absorbing material 39 into two halves. Because the cut groove 38 is narrow, it does not cut into the side of the reflective film 37. The width of the cut groove 38 can be narrower than the shortest distance between one side of the reflective film 37 and the side of the adjacent reflective film 37. The side of the cut groove 38 is composed of the light-absorbing material 39, and inside it are the reflective film 37 and the color conversion section 1, in sequence.

[0056] The depth of the secondary cutting groove 38 can be deeper than the depth of the primary cutting groove 33. However, it will not be deep enough to completely cut the original board 31. <g>During the process, the original board 31 will not completely separate into the color conversion component 10. The final separation of the original board 31 will occur during this process. <h>Completed in the steps. <g>A cutting blade can also be used for complete cutting during the process, but in this process, the sides of the color conversion component 10 may become uneven or tilted. This is because under the rotational force of the high-speed rotating cutting blade, the color conversion component 10 may move or pop out in an undesirable direction. In the worst case, the light-absorbing material 39 may detach, or the reflective film 37 may be damaged. To obtain a clean and smooth color conversion component 10, in <g>Only the cutting groove 38 is formed in the step, and in the final <h>In this step, the original board 31 is separated into multiple color conversion components 10.

[0057] This embodiment describes in <f>Execute after the steps <g>One approach is to follow a set of steps, but as another method, it's also possible to execute the steps first. <g>Steps, then execute <f>The steps are as follows: First, the cutting groove 38 is formed, and then grinding is performed.

[0058] exist <h>In this step, the original plate 31 with the secondary cutting groove 38 is flipped so that the cutting groove surface faces down, and the other side is ground. Through grinding, the thickness of the original plate 31 is uniformly reduced. As mentioned earlier, decahedral protrusions 32 are arranged on the original plate 31, with a reflective film 37 and light-absorbing material 39 filling between them. The sides of the decahedral protrusions 32 include portions parallel to the light propagation direction and inclined portions. When the grinding is continued until the thickness of the original plate 31 is reduced to be flush with the inclined sides of the protrusions 32, the desired result is obtained. Figure 1 and Figure 16 The color conversion component 10 is shown. During the grinding process, the grinding machine applies uniform pressure to the original plate 31, thereby maintaining the position of the color conversion component 10 during separation. This allows for the production of multiple color conversion components 10 that firmly integrate the light-reflecting portion 3 and the light-absorbing portion 5 on their sides.

[0059] When the color conversion component 10 is adhered to the light-emitting surface of the LED chip 20, a color conversion effect can be achieved. Figure 4 The illustrated light-emitting module exhibits excellent light directivity. Even without using other components, a light-emitting module with excellent light directivity can be constructed solely using the LED chip 20 and the color conversion component 10. The color conversion component 10 has a smooth, uneven surface, the light-reflecting part 3 is also uniformly smooth, and the light-absorbing part 5 has a smooth surface, thus preventing light scattering and further improving light directivity. Figure 3 As shown, when the surface of the color conversion component 23 and the light reflecting part 25 are at a right angle or a larger angle, the light directivity may be reduced. However, the color conversion component 10 in this embodiment of the invention... Figure 4 As shown, the angle d formed by the light radiating surface and the light reflecting part 3 is an acute angle. That is, the light reflecting part 3 gradually expands along the light travel direction, thereby improving the light rectilinearity.

[0060] according to <h>The steps, if the thickness is large, grinding can obtain a product with... Figure 1 The color conversion component 10 shown in the diagram; however, if the grinding thickness is small, a color conversion component with... Figure 17 The color conversion component 10 is shown in the cross-section. The grinding depth is controlled only to the extent of removing the bottom surface of the reflective film 37, without grinding reaching the inclined side of the protrusion 32. In this way, the side of the color conversion component 1, the light reflecting component 3, and the light absorbing component 5 can form a wall-shaped portion 43 and an inclined portion 41 parallel to the light travel direction. The light reflecting component 3 mounted near the LED chip 20 can concentrate the light due to its inclined surface; while the light reflecting component 3 mounted away from the LED chip 20 is formed parallel to the light travel direction because it has less lateral light component, thereby guiding the light to propagate in a straight line.

[0061] Figure 1 , Figure 16 and Figure 17 An example of a color-converting component 10 formed by injecting and fixing a light-absorbing material 39 into a cutting groove 33 is shown. If the light-absorbing material 39 is chromium oxide or a nickel-chromium alloy, etc., and is applied to the substrate 31 by coating or vapor deposition, the light-absorbing material 39 may not completely fill the cutting groove 33. In this case, the light-absorbing portion 5 may also form a film-like structure like the light-reflecting portion 3. Therefore, if manufactured according to the above process, the side surface of the light-absorbing portion 5 may not be as... Figure 1 Instead of being perpendicular to the direction of light travel, it is formed at an angle, like the light reflector 3. If the light-absorbing material 39 fails to fill the cutting groove 33, then <g>The steps can be omitted. When the layer of light-absorbing material 39 is thin, it can be... <f>After grinding the upper surface of the original plate 31 in the step, proceed directly to... <h>The step involves separating the original board 31 into a color conversion component 10.

[0062] As described so far, the internal area of ​​the light reflector 3 gradually increases along the light travel direction and forms an inclined shape. However, the light reflector 3 can be mounted upside down on the LED chip 20. Even in this case, the light propagation can still be improved compared to the case without the light reflector 3 or the light absorber 5.

[0063] The embodiments of the present invention have been described above. However, as long as those skilled in the art can make various modifications and alterations to the present invention by adding, changing, deleting or adding structural elements without exceeding the scope of the invention's concept as described in the claims, these modifications and alterations will also be included within the scope of the invention's claims.< / h> < / f> < / g> < / h> < / h> < / f> < / g> < / g> < / f> < / h> < / g> < / g> < / h> < / g> < / g> < / f> < / e> < / d>

Claims

1. A color conversion component for a light-emitting diode, comprising: A color conversion section formed in the shape of a plate that converts and passes through the color of light emitted from a light-emitting diode; A light-reflecting part that covers the side of the color conversion part and reflects light propagating toward the side of the color conversion part; a light-absorbing part that covers the outside of the light-reflecting part and is formed around the periphery of the light-reflecting part and absorbs light transmitted through the light-reflecting part; The color conversion part, the light reflection part, and the light absorption part are integrally formed, and the light emitting surface is in the shape of a flat plate. The light reflection part reflects light propagating toward the side of the color conversion part, while the light absorption part removes the light propagating laterally, thereby improving the directness of the emitted light.

2. The color conversion component for a light-emitting diode according to claim 1, characterized in that, The side of the color conversion part is inclined, the light reflection part is a film structure covering the side of the inclined color conversion part, and the light absorption part is a rectangular frame structure with an inclined inner side and an outer side parallel to the light travel direction, thus forming a rectangular plate structure as a whole.

3. The color conversion component for a light-emitting diode according to claim 1, characterized in that, The side of the color conversion part is inclined within a certain depth, and the rest is parallel to the direction of light propagation; the light reflecting part is a film structure that covers the side of the color conversion part, and similar to the color conversion part, part is inclined along the direction of light propagation and part is parallel; the light absorbing part is a rectangular frame structure, part of the inner side is inclined, the rest is parallel to the direction of light propagation, and the outer side is parallel to the direction of light propagation, thus forming a rectangular plate structure as a whole.

4. The color conversion component for a light-emitting diode according to claim 1, characterized in that, The light-reflecting part is made of any one of aluminum, silver, gold, copper, chromium, titanium dioxide or cerium oxide, and is attached to the color conversion part by vapor deposition to form a film.

5. The color conversion component for a light-emitting diode according to claim 1, characterized in that, The light-absorbing part is composed of a mixture of glass and carbon powder, which is made by mixing liquid glass and carbon powder and then solidifying it.

6. The color conversion component for a light-emitting diode according to claim 1, characterized in that, The light-absorbing part is made of chromium oxide or nickel-chromium alloy and is coated on the outside of the light-reflecting part by vapor deposition.

Images