Silicon-based landfill fan-out integrated packaging structure of multi-parameter sensor of coal mining machine
By integrating multi-parameter sensors and realizing digital signal processing through a silicon-based landfill fan-out integrated packaging structure, the problems of complex sensor layout and poor anti-interference ability in coal mining machines are solved, and the stability and explosion-proof performance of underground sensors are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CCTEG COAL MINING RES INST
- Filing Date
- 2025-12-29
- Publication Date
- 2026-05-12
AI Technical Summary
The existing coal mining machine's sensors are arranged separately, resulting in complex and easily damaged external wiring harnesses, poor anti-interference ability for long-distance analog signal transmission, and traditional packaging structures that are difficult to adapt to the requirements of high-frequency strong vibration and explosion-proof heat dissipation in underground mining.
The silicon-based buried fan-out integrated packaging structure includes a sensor housing, a silicon-based carrier, a sensor buried layer, an insulating layer, a fan-out wiring layer, and an explosion-proof protection layer. It integrates a multi-parameter sensor and achieves efficient sensor integration and stable operation through differential signal transmission and digital processing, combined with a thermally conductive buffer layer and explosion-proof protection.
The number of mounting holes and wiring harnesses on the coal mining machine body has been reduced, improving the sensor's anti-interference capability and explosion-proof performance, and ensuring the long-term stability and reliability of the sensor in harsh underground environments.
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Figure CN122015928A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of interdisciplinary technology of semiconductor packaging and underground mining monitoring technology, specifically to a silicon-based landfill fan-out integrated packaging structure for multi-parameter sensors of coal mining machines. Background Technology
[0002] As the core equipment of fully mechanized mining faces, the intelligent operation of coal mining machines highly depends on the real-time sensing of key parameters such as the temperature of the cutting section, machine vibration, surrounding gas concentration, and overall machine posture. Currently, the industry generally adopts a discrete sensor solution, which involves configuring independent sensor units for the above-mentioned different parameters and distributing them at different positions on the rocker arm or body of the coal mining machine. This layout requires a large number of mounting holes to be reserved on the machine surface, and each sensor needs to be powered and transmit data through independent cables, resulting in a large number of external wiring harnesses with complex routing. In the confined space, humid environment, and continuous coal splashing in the underground working environment, this complex external wiring is prone to scratches, entanglement, breakage, or loosening of interfaces, seriously affecting the equipment's uptime and maintenance efficiency. In addition, existing discrete monitoring systems mostly use analog signals for long-distance transmission. However, when the high-power variable frequency speed control device of the coal mining machine is working, the electromagnetic environment at the scene is extremely complex, and the analog signal link is easily interfered with, resulting in data distortion. Meanwhile, general-purpose sensor packaging structures often fail to meet the unique explosion-proof requirements and high-frequency, high-vibration conditions of underground applications. The internal chip and lead interconnection structure are prone to fatigue failure under long-term mechanical impact, and the heat dissipation problem in the sealed explosion-proof housing is also difficult to solve effectively, which restricts the long-term stability of the monitoring system. Summary of the Invention
[0003] To address the shortcomings of existing technologies, this invention provides a silicon-based buried fan-out integrated packaging structure for multi-parameter sensors in coal mining machines. This solves the problems of complex and easily damaged external wiring harnesses, poor anti-interference capability for long-distance analog signal transmission, and difficulty in adapting traditional packaging structures to the requirements of high-frequency vibration and explosion-proof heat dissipation in underground mining, caused by the separate arrangement of sensors in existing coal mining machines.
[0004] To achieve the above objectives, the present invention is implemented through the following technical solution: a silicon-based landfill fan-out integrated packaging structure for a multi-parameter sensor of a coal mining machine, comprising: a sensor housing, on the side of which is provided a U-shaped slot and an M12 screw-on interface; A silicon-based carrier located inside the sensor housing, the silicon-based carrier having multiple slots for accommodating different types of sensor chips; A sensor embedding layer, which fills the groove and surface of the silicon-based carrier, is used to fix the sensor core. An insulating layer covers the sensor's buried layer; The fan-out wiring layer is located above the insulating layer and is electrically connected to the sensor chip in the sensor embedding layer through conductive vias, and converges multiple sensor signals to the M12 screw interface. An explosion-proof protective layer covers the fan-out wiring layer, and an annular metal explosion-proof ring is provided at the edge of the packaging structure.
[0005] Preferably, the grooves on the silicon-based carrier are modularly distributed, specifically including: Temperature bath located in the edge area; A grid-shaped heat dissipation groove is arranged adjacent to the temperature slot; An inclined groove located at the center of the carrier; In addition, there are gas tanks, signal conditioning chip tanks, accelerometer tanks, vibration tanks, and two reserved tanks distributed in other areas of the carrier.
[0006] Preferably, a gas flow hole penetrating the silicon-based carrier is provided at the bottom or corresponding position of the gas tank; the gas flow hole is a micropore array structure composed of multiple micropores, used to connect the external environment with the gas sensor core installed in the gas tank.
[0007] Preferably, the sensor embedding layer adopts a differentiated encapsulation structure, including: A semi-enclosed package is used for sensor cores installed in gas tanks, wherein the semi-enclosed package exposes the gas-sensitive surface of the sensor core or is only covered with a thin layer of breathable material. Full-encapsulation packaging is used for sensor chips other than gas sensors, so that they are completely covered by the encapsulation material.
[0008] Preferably, a thermally conductive buffer layer is further provided between the bottom of the sensor embedding layer and the silicon-based carrier. The thermally conductive buffer layer is made of a thermally conductive and elastic material to conduct heat and absorb vibration and shock.
[0009] Preferably, a silicon-based heat dissipation grid with a depth of 100μm is etched inside the heat dissipation groove, and the silicon wall thickness between the temperature groove and the heat dissipation groove enables the temperature sensor core to quickly sense the thermal state of the coal mining machine body conducted through the silicon-based carrier.
[0010] Preferably, the vibration groove and the accelerometer groove are disposed in close contact with the bottom of the silicon-based carrier, and a gap of at least 1 mm is maintained between them to suppress signal crosstalk; the tilt groove is located at the geometric center of the silicon-based carrier to provide a stable attitude measurement reference.
[0011] Preferably, the fan-out wiring layer includes a double-layer copper wiring structure, which integrates signal transmission lines, grounding lines and SPI bus conversion units; after converting the analog signals of each sensor chip into digital signals, the fan-out wiring layer leads them out to the M12 screw interface through a single differential signal line.
[0012] Preferably, the explosion-proof protective layer is made of polyimide composite material, which completely covers the surface of the fan-out wiring layer and extends to the side of the silicon-based carrier; the annular metal explosion-proof ring is embedded in the edge of the explosion-proof protective layer and is insulated from the electrical pins of the M12 screw-on interface.
[0013] Preferably, the bottom of the sensor housing is integrated with several positioning protrusions made of ceramic material, and the U-shaped slot is a plug-in structure set on the side of the housing for fixing with the coal mining machine mounting base.
[0014] Working Principle: This multi-parameter sensor utilizes a ceramic positioning structure that fits snugly against the coal mining machine body, enabling real-time monitoring of equipment status and environmental parameters during cutting operations. External gas is filtered through a microporous array, blocking large particles of coal dust and water droplets, before diffusing to the surface of the internal gas-sensitive element for detection. Simultaneously, the vibration waves and impact forces generated by the coal mining machine are transmitted to the internal accelerometer and vibration sensor through a damping buffer layer. The rigidity of the silicon-based carrier ensures that the vibration signal is not distorted during transmission. The tilt sensor, located at the geometric center of the carrier, calculates the rocker arm pitch and body tilt attitude while minimizing interference from edge centrifugal forces. Heat generated during machine operation is conducted to the temperature-sensitive unit via the silicon-based base, and thermal balance is maintained in conjunction with the silicon-based heat dissipation grid.
[0015] The weak analog signals collected by each sensitive element enter the fan-out wiring layer directly through vertical vias. The signal conditioning circuit and bus conversion unit integrated here amplify, filter and convert the signals to analog-to-digital, and manage the timing of multi-channel data through the SPI bus controller to prevent signal conflicts and realize the digitization and standardization of source data.
[0016] The processed digital signals are converged through an internal double-shielded cabling network and exported using differential signal transmission. Common-mode rejection characteristics are utilized to resist electromagnetic interference from equipment such as downhole frequency converters. Throughout operation, the external composite explosion-proof layer and metal sealing ring remain sealed, isolating downhole moisture and corrosive media, preventing potential internal electrical sparks from igniting external gases, and ensuring that the sensor continuously outputs monitoring data under explosion-proof requirements.
[0017] This invention provides a silicon-based landfill fan-out integrated packaging structure for multi-parameter sensors in coal mining machines. It offers the following advantages: 1. This invention integrates heterogeneous sensors such as gas, vibration, temperature and attitude sensors into a single package by using a modular groove and fan-out packaging structure on a silicon-based carrier. This integration method replaces the traditional separate sensor layout, significantly reducing the size of the device, reducing the number of mounting holes and external connection harnesses on the coal mining machine body, and solving the problems of complex installation of multi-parameter monitoring equipment and easy tangling and damage of cables in narrow underground spaces.
[0018] 2. This invention integrates signal conditioning and SPI bus conversion units within the fan-out wiring layer, enabling the analog signals acquired by the sensor to be digitized at the source end. Combined with the differential signal transmission design at the end, it eliminates signal attenuation caused by long-distance analog transmission. Furthermore, by utilizing the common-mode rejection characteristics of differential lines, it effectively shields high-frequency electromagnetic interference generated by downhole high-power frequency converters, thereby improving the signal-to-noise ratio and transmission stability of the monitoring data.
[0019] 3. This invention adopts a multi-level protection structure including a thermally conductive buffer layer, a differentiated filling layer, and an explosion-proof protection layer. The thermally conductive buffer layer uses the elasticity of the material to absorb the high-frequency vibration and impact during coal mining machine cutting, preventing fatigue fracture of the internal interconnection structure, and in conjunction with silicon-based materials to dissipate heat. The sealing system formed by the external explosion-proof protection layer and the metal ring blocks the intrusion of underground dust and water vapor, prevents internal circuit sparks from leaking out, and meets the explosion-proof safety requirements of underground coal mine equipment. Attached Figure Description
[0020] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the multi-parameter sensor of the present invention; Figure 2 This is a schematic diagram showing the disassembled structure of the multi-parameter sensor of the present invention; Figure 3 This is a schematic diagram of the silicon-based carrier structure of the present invention; Figure 4 This is a schematic diagram of the sensor burial layer structure of the present invention.
[0021] The components include: 1. Sensor housing; 2. U-shaped slot; 3. M12 screw-on interface; 4. Silicon-based carrier; 401. Temperature slot; 402. Heat dissipation slot; 403. Inclined slot; 404. Gas slot; 405. Gas flow hole; 406. Signal conditioning chip slot; 407. Accelerometer slot; 408. Vibration slot; 409. Reserved slot; 5. Sensor embedding layer; 501. Thermally conductive buffer layer; 502. Semi-enclosed package; 503. Full-enclosed package; 6. Insulation layer; 7. Fan-out wiring layer; 8. Explosion-proof protection layer; 9. Annular metal explosion-proof ring. Detailed Implementation
[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0023] Example: Please see the appendix Figure 1 -Appendix Figure 4 The present invention provides a silicon-based landfill fan-out integrated packaging structure for a multi-parameter sensor for a coal mining machine, comprising: a sensor housing 1, on the side of which a U-shaped slot 2 and an M12 screw-on interface 3 are provided; The silicon-based carrier 4 is located inside the sensor housing 1, and multiple slots are formed on the silicon-based carrier 4 to accommodate different types of sensor chips. The sensor embedding layer 5 is filled in the groove and on the surface of the silicon-based carrier 4 and is used to fix the sensor core. Insulating layer 6 covers the sensor burial layer 5; Fan-out wiring layer 7 is located above insulating layer 6. It is electrically connected to sensor core in sensor buried layer 5 through conductive vias and aggregates multiple sensor signals to M12 screw interface 3. An explosion-proof protective layer 8 covers the fan-out wiring layer 7, and an annular metal explosion-proof ring 9 is provided at the edge of the package structure.
[0024] The sensor housing 1 acts as a physical barrier for overall encapsulation, completely encasing the internal precision components and blocking high levels of dust and corrosive water mist in the well, ensuring the long-term stability of the equipment under harsh working conditions. The U-shaped slot 2 on the side, combined with the rocker arm mounting base, enables quick plug-and-play positioning, reducing maintenance costs through a maintenance-free design. The M12 screw-on interface 3 connects the integrated shielded cable, integrating power input and single-wire digital signal output, solving the problem of easy tangling and breakage in traditional multi-wire harnesses. The core silicon-based carrier 4 utilizes the high thermal conductivity of monocrystalline silicon to quickly dissipate heat, maintaining the chip's low-temperature operation. Its multi-slot design enables high-density modular integration of various sensors, including temperature, vibration, and gas sensors. The sensor embedding layer 5, filled within the slots, not only secures the core chip but also buffers mechanical vibration due to its low-stress characteristics, preventing solder joint failure. The insulating layer 6 covering it provides electrical isolation, eliminating signal crosstalk. The fan-out wiring layer 7, through conductive vias, constructs an interconnect network and SPI conversion circuit, integrating and converging multiple analog signals to eliminate transmission delay. On the outermost side, the explosion-proof protective layer 8 and the annular metal explosion-proof ring 9 together form a sealing system that meets the downhole explosion-proof standards and eliminates the risk of gas accidents caused by electrical sparks.
[0025] Please see the appendix Figure 2 -Appendix Figure 3 The grooves on the silicon-based carrier 4 are modularly distributed, specifically including: Temperature bath 401 is located in the edge region; A grid-shaped heat dissipation groove 402 is set immediately adjacent to the temperature groove 401; An inclined groove 403 is located at the center of the carrier; In addition, there are gas tank 404, signal conditioning chip tank 406, accelerometer tank 407, vibration tank 408 and two reserved tanks 409 distributed in other areas of the carrier.
[0026] The silicon-based carrier 4 adopts a modular tank layout. The temperature tank 401 is placed at the edge, avoiding the central heat accumulation area to ensure the accuracy of thermal measurements. The adjacent grid-like heat dissipation tank 402 increases the heat dissipation area, assisting the sensor in quickly responding to environmental temperature changes and releasing local thermal stress. The tilt tank 403 occupies the geometric center of the carrier, utilizing the physical stability of this position to eliminate edge deformation and centrifugal force interference, providing a high-precision attitude calculation benchmark for the MEMS tilt sensor. The gas tank 404, together with the gas flow hole, forms a gas entry channel to ensure the timeliness of gas concentration detection. The signal conditioning chip tank 406 integrates the processing unit nearby, realizing in-situ amplification and digitization of weak signals and suppressing transmission noise. The accelerometer tank 407 and the vibration tank 408 are used to monitor the dynamic impact and mechanical vibration spectrum of the drum, respectively, to jointly evaluate the equipment's operating status. The two reserved tanks 409 provide expansion interfaces for sensors such as humidity and pressure, adapting to different mining needs without changing the main structure, enhancing the versatility of the packaging.
[0027] Please see the appendix Figure 2 -Appendix Figure 3 A gas flow hole 405 penetrating the silicon-based carrier 4 is provided at the bottom or corresponding position of the gas tank 404; the gas flow hole 405 is a micropore array structure composed of multiple micropores, used to connect the external environment with the gas sensor core installed in the gas tank 404.
[0028] The gas trough 404 is used to house the gas sensor core, and its bottom or corresponding position has a gas flow hole 405 penetrating the silicon-based carrier 4. The gas flow hole 405 adopts a micropore array structure, forming multiple redundant gas channels under high dust and water mist conditions underground. The array distribution prevents monitoring failure due to coal dust accumulation or water film tension blockage in a single pore. The micropore structure also has a sieve filtering function, preventing large coal slag particles from directly impacting the internal chip. This design achieves effective communication between the external environment and the core, and by increasing the gas diffusion contact cross-sectional area, shortens the sensor response time, ensuring immediate response to abnormal underground gas concentrations.
[0029] Please see the appendix Figure 2 and attached Figure 4 The sensor embedding layer 5 adopts a differentiated encapsulation structure, including: The semi-encapsulated package 502 is used for sensor cores installed in gas tanks 404. The semi-encapsulated package 502 exposes the gas-sensitive surface of the sensor core or covers it only with a thin layer of breathable material. The 503 fully encapsulated package is used for sensor chips other than gas sensors, so that they are completely covered by the encapsulation material.
[0030] The sensor's buried layer 5 employs a differentiated packaging strategy to balance the functional requirements of environmental isolation and media contact in integrated packaging. The semi-encapsulated package 502 is specifically used for the core particles within the gas tank 404. While fixing the base, it reserves a reaction window, directly exposing the sensitive surface or covering it with a breathable thin layer, ensuring smooth diffusion of gas molecules to the sensing interface and avoiding obstruction of the gas path by the packaging material. This prevents the deposition of large dust particles while maintaining detection sensitivity. The fully encapsulated package 503 is used for the remaining sensor core particles, constructing a fully sealed protection system. It completely isolates the intrusion of underground water vapor and coal dust, provides structural damping to buffer vibration, prevents circuit corrosion and mechanical damage, and ensures the reliability of the device under harsh operating conditions.
[0031] Please see the appendix Figure 2 and attached Figure 4 A thermally conductive buffer layer 501 is also provided between the bottom of the sensor burial layer 5 and the silicon-based carrier 4. The thermally conductive buffer layer 501 is made of a thermally conductive and elastic material to conduct heat and absorb vibration and shock.
[0032] A thermally conductive buffer layer 501 is provided between the bottom of the sensor embedding layer 5 and the silicon-based carrier 4. This layer fills the microscopic voids at the heterogeneous interface to maximize the contact area, eliminate contact thermal resistance, and enhance interlayer bonding, preventing delamination caused by thermal expansion mismatch. The thermally conductive buffer layer 501 is made of a thermally conductive elastic material. It utilizes thermal conductivity to construct a low-resistance thermal path from the core to the carrier, rapidly transferring heat to avoid local heat island effects and device temperature drift. At the same time, its elastic characteristics provide mechanical damping and deformation compensation, buffering the high-frequency vibrations and instantaneous impacts during coal mining machine cutting, protecting the upper brittle core and lead structure, and preventing breakage or solder joint fatigue failure caused by rigid conduction.
[0033] Please see the appendix Figure 2 -Appendix Figure 3 The heat sink 402 has a silicon-based heat dissipation grid with a depth of 100μm etched inside, and the silicon wall thickness between the temperature sink 401 and the heat sink 402 enables the temperature sensor core to quickly sense the thermal state of the coal mining machine body conducted through the silicon-based carrier 4.
[0034] A silicon-based heat dissipation grid with a depth of 100μm is etched inside the heat dissipation slot 402. This micro-grid structure increases the heat dissipation surface area, improves heat exchange efficiency, accelerates heat dissipation, and prevents localized heat accumulation from interfering with measurement accuracy. The silicon wall thickness between the temperature slot 401 and the heat dissipation slot 402 is optimized to create a low thermal resistance conduction path. This balances mechanical strength with a reduced heat transfer time constant, enabling the temperature sensor chip to quickly respond to the thermal state of the coal mining machine body conducted through the silicon-based carrier 4. This achieves low-delay tracking of the equipment's operating temperature, promptly detecting overheating risks and assisting in the system's thermal protection.
[0035] Please see the appendix Figure 2 -Appendix Figure 3 The vibration groove 408 and the accelerometer groove 407 are fitted to the bottom of the silicon-based carrier 4, and a gap of at least 1 mm is maintained between them to suppress signal crosstalk; the tilt groove 403 is located at the geometric center of the silicon-based carrier 4 to provide a stable attitude measurement reference.
[0036] The vibration groove 408 and the accelerometer groove 407 are arranged close to the bottom of the silicon-based carrier 4, shortening the signal transmission path and enhancing acoustic coupling, reducing medium attenuation, and improving the sensitivity of capturing the mechanical vibration characteristics of the coal mining machine. The distance between the two is at least 1 mm, which uses physical isolation to block the lateral diffusion of stress waves, suppress signal crosstalk, and ensure independent and accurate data. The tilt groove 403 is placed at the geometric center of the silicon-based carrier 4 to avoid the interference of centrifugal force and tangential acceleration caused by the eccentric position, eliminate the lever arm effect error, and provide a stable attitude measurement reference for monitoring the pitch and tilt angles of the equipment.
[0037] Please see the appendix Figure 1 -Appendix Figure 2 The fan-out wiring layer 7 includes a double-layer copper wiring structure, which integrates signal transmission lines, grounding lines and SPI bus conversion units. After converting the analog signals of each sensor chip into digital signals, the fan-out wiring layer 7 leads them out to the M12 screw interface 3 through a single differential signal line.
[0038] Fan-out wiring layer 7 employs a double-layer copper wiring structure, achieving high-density electrical interconnection within limited vertical space, reducing package size and parasitic capacitance and inductance, and improving signal integrity and integration. Built-in signal transmission lines, in conjunction with grounding lines, construct a shielded network to transmit high-frequency signals and provide a zero-potential reference, suppressing electromagnetic interference and improving the signal-to-noise ratio. The SPI bus conversion unit performs data protocol standardization and timing management, enabling multi-channel synchronous acquisition and resolving bus conflicts. This layer converts sensor analog signals into digital signals, achieving source-end digitization to avoid transmission attenuation and distortion, and improving measurement accuracy. Finally, a single differential signal line leads to the M12 screw-on interface 3, utilizing a high common-mode rejection ratio to resist downhole noise and ensure stable communication. The interface's high protection prevents water-coal slurry infiltration, ensuring connection reliability.
[0039] Please see the appendix Figure 1 -Appendix Figure 2 The explosion-proof protective layer 8 is made of polyimide composite material, which completely covers the surface of the fan-out wiring layer 7 and extends to the side of the silicon-based carrier 4; the annular metal explosion-proof ring 9 is embedded in the edge of the explosion-proof protective layer 8 and is insulated from the electrical pins of the M12 screw-on interface 3.
[0040] The explosion-proof protective layer 8 is made of polyimide composite material. Its excellent dielectric properties and chemical stability create an insulating barrier, isolating the internal and external environments to prevent electrical sparks from igniting explosive gases, thus achieving intrinsically safe explosion protection. This layer fully covers the fan-out wiring layer 7 and extends to the sides of the silicon-based carrier 4, forming a dense, sealed enclosure that blocks moisture, dust, and corrosive media from the well, enhancing the device's weather resistance and lifespan. An annular metal explosion-proof ring 9 is embedded at the edge of the explosion-proof protective layer 8, strengthening the edge's mechanical strength and resistance to deformation, preventing warping and peeling under thermal shock conditions, and maintaining a complete seal. Simultaneously, it provides insulation and isolation from the M12 screw-on interface 3 pins, ensuring electrical clearance, avoiding short circuits and interference, and guaranteeing stable operation of the electrical system.
[0041] Please see the appendix Figure 1 The bottom of the sensor housing 1 is integrated with several positioning protrusions made of ceramic material. The U-shaped slot 2 is a plug-in structure set on the side of the housing, which is used to cooperate with the coal mining machine mounting base for fixation.
[0042] The bottom of the sensor housing 1 integrates several ceramic positioning protrusions, which are embedded into the pre-set holes on the coal mining machine during installation to assist in centering and limiting. The ceramic's insulating properties also block leakage current from the machine body, preventing vibration-induced displacement and eliminating common-mode interference, thus ensuring installation stability and measurement accuracy. The U-shaped slot 2 on the side of the housing uses a plug-in structure to cooperate with the coal mining machine mounting base, enabling quick assembly and disassembly through mechanical snap-fit. This simplifies the maintenance process in the confined underground space, significantly improving maintenance efficiency while reducing labor intensity.
[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A silicon-based landfill fan-out integrated packaging structure for multi-parameter sensors in coal mining machines, characterized in that, include: The sensor housing (1) has a U-shaped slot (2) and an M12 screw-on interface (3) on its side. The silicon-based carrier (4) is located inside the sensor housing (1), and the silicon-based carrier (4) has multiple slots for accommodating different types of sensor chips. The sensor filling layer (5) is filled in the groove and surface of the silicon-based carrier (4) to fix the sensor core. An insulating layer (6) covers the sensor filling layer (5); Fan-out wiring layer (7) is located above the insulating layer (6), and is electrically connected to the sensor core in the sensor embedding layer (5) through conductive vias, and converges multiple sensor signals to the M12 screw interface (3). An explosion-proof protective layer (8) covers the fan-out wiring layer (7) and an annular metal explosion-proof ring (9) is provided at the edge of the encapsulation structure.
2. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 1, characterized in that, The grooves on the silicon-based carrier (4) are modularly distributed, specifically including: Temperature bath (401) located in the edge region; A grid-shaped heat dissipation groove (402) is provided adjacent to the temperature groove (401); An inclined groove (403) located at the center of the carrier; In addition, there are gas troughs (404), signal conditioning chip troughs (406), accelerometer troughs (407), vibration troughs (408) and two reserved troughs (409) distributed in other areas of the carrier.
3. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 2, characterized in that, The bottom or corresponding position of the gas tank (404) is provided with a gas flow hole (405) that penetrates the silicon-based carrier (4); the gas flow hole (405) is a micropore array structure composed of multiple micropores, which is used to connect the external environment with the gas sensor core installed in the gas tank (404).
4. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 1, characterized in that, The sensor embedding layer (5) adopts a differentiated packaging structure, including: A semi-enclosed package (502) is applied to a sensor chip installed in a gas trough (404), wherein the semi-enclosed package (502) exposes the gas-sensitive surface of the sensor chip or is covered only with a thin layer of breathable material. Full-wrap encapsulation (503) is used for sensor chips other than gas sensors, so that they are completely covered by encapsulation material.
5. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 4, characterized in that, A thermally conductive buffer layer (501) is also provided between the bottom of the sensor embedding layer (5) and the silicon-based carrier (4). The thermally conductive buffer layer (501) is made of a thermally conductive and elastic material to conduct heat and absorb vibration impact.
6. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 2, characterized in that, The heat dissipation groove (402) is etched with a silicon-based heat dissipation grid with a depth of 100μm, and the silicon wall thickness between the temperature groove (401) and the heat dissipation groove (402) enables the temperature sensor core to quickly sense the thermal state of the coal mining machine body conducted through the silicon-based carrier (4).
7. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 2, characterized in that, The vibration groove (408) and the accelerometer groove (407) are attached to the bottom of the silicon-based carrier (4) and a gap of at least 1 mm is maintained between them to suppress signal crosstalk; the tilt groove (403) is located at the geometric center of the silicon-based carrier (4) to provide a stable attitude measurement reference.
8. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 1, characterized in that, The fan-out wiring layer (7) includes a double-layer copper wiring structure, which integrates signal transmission lines, grounding lines and SPI bus conversion units. The fan-out wiring layer (7) converts the analog signals of each sensor chip into digital signals and leads them out to the M12 screw interface (3) through a single differential signal line.
9. The silicon-based landfill fan-out integrated packaging structure for a multi-parameter sensor of a coal mining machine according to claim 1, characterized in that, The explosion-proof protective layer (8) is made of polyimide composite material, which completely covers the surface of the fan-out wiring layer (7) and extends to the side of the silicon-based carrier (4); the annular metal explosion-proof ring (9) is embedded in the edge of the explosion-proof protective layer (8) and is insulated from the electrical pins of the M12 screw-on interface (3).
10. The silicon-based landfill fan-out integrated packaging structure for the multi-parameter sensor of a coal mining machine according to claim 1, characterized in that, The bottom of the sensor housing (1) is integrated with several positioning protrusions made of ceramic material. The U-shaped slot (2) is a plug-in structure set on the side of the housing, which is used to cooperate with the coal mining machine mounting base for fixation.