Die double-ejector-pin series connection pressure collecting mechanism

Abstract

The invention discloses a mold double-ejector-pin series connection pressure acquisition mechanism, the front part of a first ejector pin extends into a mold plate and a mold core of a mold, a second ejector pin is coaxially arranged behind the first ejector pin and can abut against the first ejector pin, the rear part of the second ejector pin is arranged on a fixing plate of the mold, and a pressure sensor is arranged behind the second ejector pin and can abut against the second ejector pin. The pressure sensor is located at the end, away from the mold core, of the mold fixing plate and limited in the mold fixing plate through the fixing plate pressing block. Through the structural arrangement, the length of the second ejector pin can be prolonged in a continuous mode, so that the pressure sensor is installed in the fixing plate of the mold and located at the position close to the outer side face of the fixing plate, and when the pressure sensor needs to be disassembled, the pressure sensor can be disassembled only by disassembling the fixing plate pressing block from the outer side face of the fixing plate of the mold; therefore, manpower and material resources for dismounting the pressure sensor are reduced, the working intensity is reduced, the working efficiency is improved, and the influence of die repair on the sensor is greatly reduced.

Description

Technical Field

[0001] This invention belongs to the field of mold pressure acquisition devices, specifically, it relates to a mold double ejector pin series pressure acquisition mechanism. Background Technology

[0002] Mainstream manufacturers of in-mold signal acquisition systems typically choose either direct installation (where the sensor is directly inserted into the mold cavity) or indirect installation (installed after the ejector pin), where the pressure sensor is usually mounted below the existing ejector pin head, or an additional dummy ejector pin is added, with the pressure sensor placed below the dummy ejector pin head to collect the pressure transmitted from the ejector pin. Both installations place the pressure sensor inside the mold, meaning that removal or replacement requires mold disassembly. Mold disassembly is time-consuming, labor-intensive, and difficult to perform.

[0003] like Figure 1 As shown, there are two main methods for adding an indirect cavity pressure sensor to existing molds. One method involves installing the pressure sensor below the existing ejector pin, with the pressure acquisition module 9 or repeater mounted on the ejector plate 6. The sensor cable is connected to the pressure acquisition module 9 or repeater through the cable groove on the ejector plate 6. The second method involves installing the pressure sensor 3 inside the mold plate 43. A dummy ejector pin extending into the mold cavity formed by the mold core 44 is added to transmit the injection pressure to the pressure sensor 3. The bottom of the pressure sensor 3 is fixed and supported by a pressure block 10. After installing the pressure sensor 3 in the mold design, data from each mold trial and production run needs to be collected. However, before leaving the factory, the mold often undergoes overall machining. As a precision measuring component, overall machining (immersion in water or oil) often affects the pressure sensor and the acquisition system, reducing their service life or causing damage. Therefore, the sensor and other electronic modules installed inside the mold should be removed before overall machining. However, in both installation methods, the pressure sensor 3 is installed inside the mold. If the pressure sensor needs to be disassembled or replaced, the mold must be disassembled, which consumes a lot of manpower and is wasteful. In view of this, the present invention is proposed. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a mold double ejector pin series pressure acquisition mechanism, which can reduce the manpower and material resources consumed in disassembling and assembling pressure sensors. To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by the present invention is as follows: A mold double ejector pin series pressure acquisition mechanism includes: The first ejector pin extends into the mold template and mold core at its front. The second ejector pin is coaxially positioned behind the first ejector pin and can abut against it. The rear part of the second ejector pin is mounted on the mold's fixing plate. The pressure sensor is located behind the second ejector pin and can abut against each other. The pressure sensor is located at the end of the mold fixing plate away from the mold core, and the pressure sensor is restricted within the mold fixing plate by the fixing plate pressure block.

[0005] Furthermore, the rear part of the first ejector pin is located in the ejector plate.

[0006] Furthermore, the front part of the second ejector pin extends into the ejector plate.

[0007] Furthermore, the ejector plate includes a front ejector plate and a rear ejector plate that are overlapped and fixed. A first stepped hole is provided on the front ejector plate to place the first ejector pin. The depth of the large-diameter hole in the rear section of the first stepped hole is greater than the length of the first ejector pin blank. The rear ejector plate is provided with a second stepped hole. The diameter of the large-diameter hole at the front of the second stepped hole is larger than the diameter of the first ejector blank. The diameter of the small-diameter hole following the second stepped hole is smaller than the diameter of the first ejector blank, but larger than the diameter of the second ejector. The front part of the second ejector extends into the second stepped hole.

[0008] Furthermore, the rear port wall of the second stepped hole in the rear ejector plate is chamfered.

[0009] Furthermore, the mold fixing plate is provided with a third stepped hole, and the rear part of the second ejector pin is located in the third stepped hole. The depth of the hole in the third stepped hole for placing the second ejector pin blank is greater than the length of the second ejector pin blank.

[0010] Furthermore, the rear part of the first ejector pin is set in the fourth step hole in the mold template and the mold core, and the first ejector pin is restricted in the template and the mold core by the template pressure block with through hole at the rear end of the first ejector pin; The template pressing block is located in the fourth step hole and does not protrude from the template surface. The through hole of the template pressing block is coaxial with the first ejector pin and the second ejector pin. The front end of the second ejector pin extends into this through hole and abuts against the first ejector pin.

[0011] Furthermore, a mold double ejector pin series pressure acquisition mechanism also includes an ejector sleeve, which passes through the third stepped hole of the fixed plate, the through hole of the ejector pin plate, and the through hole of the template pressure block. The second ejector pin is disposed in the ejector sleeve with its front and rear ends located outside the ejector sleeve. The through hole of the template pressure block is a stepped hole, with the front section being the first large diameter hole, the middle section being the small diameter hole, and the rear section being the second large diameter hole. The diameter of the first large diameter hole is larger than the diameter of the first ejector pin blank as a clearance space; the diameter of the small diameter hole is smaller than the diameter of the first ejector pin blank and matches the diameter of the front end of the second ejector pin; the diameter of the second large diameter hole matches the outer diameter of the ejector sleeve, and the rear end of the second large diameter hole has a chamfered wall.

[0012] Furthermore, the diameter of the third step hole in the mold fixing plate is slightly larger than the outer diameter of the ejector sleeve.

[0013] Furthermore, the fixing plate pressure block is fixed in the third step hole of the fixing plate by screws, and the diameter of the screw hole of the fixing plate pressure block is larger than the outer diameter of the screw.

[0014] By adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art.

[0015] This invention discloses a mold dual-ejector series pressure acquisition mechanism, employing the following structure: a first ejector pin, the front of which extends into the mold template and core; a second ejector pin, coaxially positioned behind the first ejector pin and capable of abutting against it; the rear of the second ejector pin is mounted on the mold's fixed plate; and a pressure sensor, positioned behind the second ejector pin and also abutting against it, is located at the end of the mold fixed plate away from the core, and is confined within the mold fixed plate by a fixing plate clamping block. This structural design allows the second ejector pin to be extended in a continuous manner, thereby installing the pressure sensor within the mold fixed plate and positioning it near the outer side of the fixed plate. When the pressure sensor needs to be removed, it can be removed simply by removing the fixing plate clamping block from the outer side of the mold fixed plate, without needing to disassemble other parts of the mold. When installing the pressure sensor, it is simply installed behind the second ejector pin, and the fixing plate clamping block is then installed on the fixed plate to secure the pressure sensor. This reduces the manpower and material resources required for pressure sensor installation and removal, decreases workload, and improves work efficiency.

[0016] The specific embodiments of the present invention will now be described in further detail with reference to the accompanying drawings. Attached Figure Description

[0017] The accompanying drawings, as part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention, but do not constitute an undue limitation of the invention. Obviously, the drawings described below are merely some embodiments, and those skilled in the art can obtain other drawings based on these drawings without creative effort. In the drawings: Figure 1 This is a schematic diagram of the installation of pressure sensors and ejector pins in an existing mold; Figure 2 This is a schematic diagram of the first installation method of a mold double ejector pin series pressure acquisition mechanism according to the present invention; wherein, the mold template and mold core are shown together; Figure 3 yes Figure 2 A magnified diagram of A; Figure 4 yes Figure 2 A magnified diagram of B; Figure 5This is a schematic diagram of the second installation method of the mold double ejector pin series pressure acquisition mechanism of the present invention; wherein, the mold template and mold core are shown together; Figure 6 yes Figure 5 A magnified diagram of C.

[0018] In the diagram: 1. First ejector pin; 11. First ejector pin blank; 2. Second ejector pin; 22. Second ejector pin blank; 3. Pressure sensor; 4. Template and mold core; 41. Fourth step hole; 42. Template pressing block; 43. Template; 44. Mold core; 5. Fixing plate; 51. Third step hole; 52. Fixing plate pressing block; 6. Ejector plate; 61. Front ejector plate; 611. First step hole; 62. Rear ejector plate; 621. Second step hole; 7. Sleeve; 8. Screw hole; 9. Pressure acquisition module; 10. Pressing block.

[0019] It should be noted that these accompanying drawings and textual descriptions are not intended to limit the scope of the invention in any way, but rather to illustrate the concept of the invention to those skilled in the art by referring to specific embodiments. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0021] In the description of this invention, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only to facilitate the description of this invention and to simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0022] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0023] Combination Figure 2-6As shown, the present invention discloses a mold double-ejector series pressure acquisition mechanism, comprising: a first ejector pin 1, the front of which extends into the mold template and mold core 4; a second ejector pin 2, which is coaxially disposed behind the first ejector pin 1 and can abut against each other, the rear of the second ejector pin 2 being disposed on the mold fixing plate 5; and a pressure sensor 3, disposed behind the second ejector pin 2 and can abut against each other, the pressure sensor 3 being located at the end of the mold fixing plate 5 away from the mold core, and the pressure sensor 3 being confined within the mold fixing plate 5 by a pressure block of the fixing plate 5. As shown in the figure, both the first ejector pin 1 and the second ejector pin 2 include a blank head located at the rear end and an ejector rod connected to the front of the blank head, the diameter of the blank head being larger than the diameter of the ejector rod.

[0024] In this application, ejector pins are set on the mold in two different ways.

[0025] The first approach is to drill a hole behind the first ejector pin 1 when the desired location for installing the pressure sensor 3 is at the existing position of the first ejector pin 1. A second ejector pin 2 can be installed from the mold's fixing plate 5. The pressure sensor 3 can then be installed directly behind the head of this second ejector pin 2, and the pressure sensor 3 can be fixed to the fixing plate 5 using the clamping block. Figure 2 As shown, the rear section of the second ejector pin 2 is disposed in the fixing plate 5, and the front section of the second ejector pin 2 is inserted into the ejector plate and abuts against the rear end of the first ejector pin 1.

[0026] The specific installation structure in this installation method is as follows: Figure 2 As shown, holes are made in the mold template and mold core 4. The front part of the first ejector pin 1 is inserted into the hole in the template and mold core 4, and the rear part of the first ejector pin 1 is set in the ejector plate.

[0027] The ejector plate includes a front ejector plate 61 and a rear ejector plate 62 that are overlapped and fixed. A first stepped hole 611 is provided on the front ejector plate 61 to accommodate the rear part of the first ejector pin 1. To prevent burrs caused by improper machining of the ejector plate or the first ejector pin 1 from pushing the first ejector pin 1 rearward and generating additional pressure on the pressure sensor 3, the following measures are taken: the depth of the large-diameter hole at the rear section of the first stepped hole 611 is greater than the length of the first ejector pin blank 11. This adds an axial dimension as clearance space in front of the first ejector pin blank 11. Figure 3 In this embodiment, the large-diameter hole at the rear section of the first stepped hole 611 has an additional 0.2mm clearance space in front of the first ejector pin head 11. The rear ejector plate 62 is provided with a second stepped hole 621. The diameter of the large-diameter hole at the front section of the second stepped hole 621 is larger than the diameter of the first ejector blank 11. This large-diameter hole serves as a clearance space. Figure 3The large-diameter hole with an axial length of 0.5mm is provided at the front of the second stepped hole 621 to avoid faults such as pin detachment and glue leakage due to the sensor not being installed.

[0028] Following the large-diameter hole at the front of the second stepped hole 621, the diameter of the small-diameter hole following the second stepped hole 621 is smaller than the diameter of the first ejector pin 11, but larger than the diameter of the front section of the second ejector pin 2. The front part of the second ejector pin 2 extends into the second stepped hole 621 in the rear ejector plate 62 and abuts against the rear end of the first ejector pin 11. Since the front and rear ejector plates 62 will move as a whole during mold operation, the front end of the second ejector pin 2 on the fixed plate 5 may sometimes detach from the stepped hole of the rear ejector plate 62. Therefore, the diameter of the small-diameter hole of the rear ejector plate 62 should be larger than the diameter of the front section of the second ejector pin 2, but smaller than the diameter of the first ejector pin 11. At the same time, the rear end of the second stepped hole 621 of the rear ejector plate 62 is chamfered to prevent the ejector plate from impacting the second ejector pin 2 during movement, which could damage the pressure sensor 3 and the second ejector pin 2.

[0029] The mold fixing plate 5 is provided with a third step hole 51. The opening diameter of the third step hole 51 on the fixing plate 5 should meet the requirement that the second ejector pin 2 can slide smoothly while ensuring guiding accuracy.

[0030] Combination Figure 2 , 4 As shown, the rear of the second ejector pin 2 is positioned within the third stepped hole 51. The depth of the hole in the third stepped hole 51 for placing the second ejector pin blank 22 is greater than the length of the second ejector pin blank 22. Specifically, when the second ejector pin 2 can abut against the first ejector pin 1, the actual position of the second ejector pin blank 22, the depth of the hole in the third stepped hole 51 for placing the second ejector pin blank 22 should be increased axially by a length c from the actual position of the second ejector pin blank 22. This adds an axial clearance space of length c in the hole in the third stepped hole 51 for placing the second ejector pin blank 22, avoiding installation risks caused by machining problems. In this embodiment, c is taken as 0.2 mm.

[0031] The second approach is to install the pressure sensor 3 at a location not found in the existing ejector pin positions of the mold, or where the plate behind the existing ejector pin positions cannot be drilled. In this case, a suitable location can be chosen to drill holes in the mold plate or mold core to install the first ejector pin 1 as a dummy ejector pin. A perforated mold plate clamping block 42 is used to fix the first ejector pin 1 behind the mold plate to prevent it from coming loose during use. An ejector sleeve 7 is installed on the fixing plate 5. The second ejector pin 2 passes through the ejector plate formed by the front ejector plate 61 and the rear ejector plate 62, as well as the perforated mold plate clamping plate on the mold plate, and abuts behind the first ejector pin blank 11. Then, the pressure sensor 3 is installed directly behind the blank of the second ejector pin 2 and fixed with the clamping block of the fixing plate 5. In existing molds, the main function of ejector pins is to push the molded product out of the mold cavity. Therefore, the so-called dummy ejector pin in this application refers to the first ejector pin 1, which is not used to eject the product but is only set up for pressure measurement. Detailed explanation follows.

[0032] like Figure 5 As shown, the first ejector pin 1 is integrally set in the fourth stepped hole 41 within the mold template and mold core 4, and is constrained within the mold template and mold core 4 by a template pressing block 42 with a through hole at its rear end. The template template has a reserved thickness for the template pressing block 42 at the rear of the fourth stepped hole 41. Screw holes 8 with axes parallel to the through hole axis are respectively provided on both sides of the through hole of the template pressing block 42. The template pressing block 42 is fixed within the fourth stepped hole 41 of the template by screws, and neither the template pressing block 42 nor the screws protrude from the surface of the template.

[0033] like Figure 6 As shown, the hole in the fourth stepped hole 41 where the first ejector blank 11 is placed is increased in depth by a length d in front of the first ejector blank 11 along the axial direction. In this way, an axial clearance space of length d is added in the hole in the fourth stepped hole 41 where the first ejector blank 11 is placed. In this embodiment, the value of d is 0.2mm.

[0034] In the second installation scheme, a mold double ejector pin series pressure acquisition mechanism also includes an ejector sleeve 7, combined with... Figure 5 , 6 As shown, the third stepped hole 51 of the fixing plate 5, the through hole of the ejector plate, and the through hole of the template pressing block 42 are coaxial. The ejector sleeve 7 is inserted into the third stepped hole 51 of the fixing plate 5, the through hole of the ejector plate, and the through hole of the template pressing block 42 along the axial direction. The second ejector pin 2 is set in the ejector sleeve 7 and the front and rear ends of the second ejector pin 2 are located outside the ejector sleeve 7, respectively.

[0035] Combination Figure 5 , 6 As shown, the through hole of the template block 42 is a stepped hole, with the front section being the first large diameter hole, the middle section being the small diameter hole, and the rear section being the second large diameter hole.

[0036] like Figure 6As shown, the diameter of the first large-diameter hole of the template pressing block 42 is larger than the diameter of the first ejector pin head 11. The first large-diameter hole has a certain depth e as a clearance space. In this embodiment, e is 0.5mm.

[0037] The small diameter of the through hole of the template pressure block 42 is smaller than the diameter of the first ejector pin blank 11 and matches the diameter of the front end of the second ejector pin 2, and is slightly larger than the diameter of the front end rod of the second ejector pin 2; the large diameter of the through hole of the template pressure block 42 matches the outer diameter of the sleeve 7 to ensure a certain assembly accuracy, and the chamfer on the rear end wall of the large diameter hole ensures smooth installation.

[0038] The through hole of the template pressure block 42 is coaxial with the first ejector pin 1 and the second ejector pin 2. After the whole assembly is installed, the front end of the second ejector pin 2 extends into the through hole of the template pressure block 42 and abuts against the rear end of the first ejector pin 1 to support the first ejector pin 1 in place. The rear end of the second ejector pin 2 contacts the pressure sensor 3.

[0039] During installation, the front end of the ejector sleeve 7 is embedded in the second large diameter hole of the template pressure block 42, at which time the front end of the second ejector pin 2 is aligned with the center of the first ejector pin blank 11.

[0040] The diameter of the third step hole 51 in the mold fixing plate 5 is slightly larger than the outer diameter of the ejector sleeve 7 to ensure smooth installation. A blind hole is provided in the middle of the fixing plate 5 pressure block. The blind hole is a stepped hole with its opening facing forward. The blank head of the second ejector pin 2 and the pressure sensor 3 are placed sequentially from front to back in the blind hole in the middle of the fixing plate 5 pressure block. Screw holes 8 are provided on both sides of the blind hole with the axis parallel to the axis of the blind hole. The fixing plate 5 pressure block is fixed in the third stepped hole 51 of the fixing plate 5 with screws, and then the pressure sensor 3 is fixed by the fixing plate 5 pressure block. The diameter of the screw hole 8 of the fixing plate 5 pressure block is larger than the outer diameter of the screw, that is, the screw hole of the fixing plate 5 pressure block increases the clearance. In addition, the diameter of the third stepped hole 51 of the mold fixing plate 5 is slightly larger than the outer diameter of the ejector sleeve 7, which ensures that the position of the ejector sleeve 7 and the pressure sensor 3 can be easily adjusted during installation, compensates for mold installation errors, and makes the axis of the pressure sensor 3, the axis of the second ejector pin 2, and the axis of the first ejector pin 1 consistent.

[0041] In this second installation scheme, the ejector sleeve 7 needs to pass through the fixing plate 5, the rear ejector plate 62, and the front ejector plate 61, and then be fixed in the second large-diameter hole at the rear end of the through hole of the template pressure block 42. In order to facilitate installation and avoid the impact of mold processing and assembly deviations on the installation of the ejector sleeve 7, the opening diameter of the fixing plate 5 and the outer diameter of the screw hole 8 of the fixing plate 5 are specially increased in the design. This allows the tail of the ejector sleeve 7 to have a certain amount of room to move on the fixing plate 5 during installation, making it convenient to adjust the top of the ejector sleeve 7 to enter the through hole of the template pressure block 42, and at the same time adjust the position of the second ejector pin 2 so that its axis is consistent with the axis of the first ejector pin 1.

[0042] A pressure sensor 3 is installed on the mold fixing plate 5. By adding a second ejector pin 2, the injection pressure applied to the original ejector pin is transmitted to the outer surface of the mold, thus achieving the purpose of installing the external pressure sensor 3.

[0043] When using a dummy ejector pin in the template, a perforated template pressure block 42 and an ejector sleeve 7 are used to maintain a certain installation accuracy between the ejector sleeve 7 and the template pressure block 42. This design also increases the diameter of the third-step hole 51 in the fixing plate 5 and the installation clearance of the screw holes 8 in the fixing plate 5. This design not only ensures installation accuracy but also facilitates processing and assembly.

[0044] This invention transmits the force to be measured to the outer surface of the mold through a double-ejector series mechanism, allowing the pressure sensor 3 to be installed through an opening on the outer surface of the mold. This enables the sensor to be easily disassembled and reassembled during mold repair, simplifying the process and significantly reducing the impact of mold repair on the sensor. The pressure acquisition module is connected to the pressure sensor via a wire. The pressure acquisition module can be installed outside the mold or embedded in a slot on the outer surface of the fixing plate, ensuring that the pressure acquisition module does not protrude from the mold.

[0045] This invention discloses a mold dual-ejector series pressure acquisition mechanism, employing the following structure: a first ejector pin, the front of which extends into the mold template and core; a second ejector pin, coaxially positioned behind the first ejector pin and capable of abutting against it; the rear of the second ejector pin is mounted on the mold's fixed plate; and a pressure sensor, positioned behind the second ejector pin and also abutting against it, is located at the end of the mold fixed plate away from the core, and is confined within the mold fixed plate by a fixing plate clamping block. This structural design allows the second ejector pin to be extended in a continuous manner, thereby installing the pressure sensor within the mold fixed plate and positioning it near the outer side of the fixed plate. When the pressure sensor needs to be removed, it can be removed simply by removing the fixing plate clamping block from the outer side of the mold fixed plate, without needing to disassemble other parts of the mold. When installing the pressure sensor, it is simply installed behind the second ejector pin, and the fixing plate clamping block is then installed on the fixed plate to secure the sensor. This reduces the manpower and material resources required for pressure sensor installation and removal, decreases workload, improves work efficiency, and significantly reduces the impact of mold repair on the sensor.

[0046] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present invention. The implementation schemes in the above embodiments can also be further combined or replaced. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A mold double ejector pin series pressure acquisition mechanism, characterized in that: include: The first ejector pin extends into the mold template and mold core at its front. The second ejector pin is coaxially positioned behind the first ejector pin and can abut against it. The rear part of the second ejector pin is mounted on the mold's fixing plate. The pressure sensor is located behind the second ejector pin and can abut against each other. The pressure sensor is located at the end of the mold fixing plate away from the mold core, and the pressure sensor is restricted within the mold fixing plate by the fixing plate pressure block.

2. The mold double ejector pin series pressure acquisition mechanism according to claim 1, characterized in that: The rear part of the first ejector pin is located in the ejector plate.

3. The mold double ejector pin series pressure acquisition mechanism according to claim 2, characterized in that: The front part of the second ejector pin extends into the ejector plate.

4. The mold double ejector pin series pressure acquisition mechanism according to claim 3, characterized in that: The ejector plate includes a front ejector plate and a rear ejector plate that are overlapped and fixed. A first stepped hole is provided on the front ejector plate to place the first ejector pin. The depth of the large-diameter hole in the rear section of the first stepped hole is greater than the length of the first ejector pin blank. The rear ejector plate is provided with a second stepped hole. The diameter of the large-diameter hole at the front of the second stepped hole is larger than the diameter of the first ejector blank. The diameter of the small-diameter hole following the second stepped hole is smaller than the diameter of the first ejector blank, but larger than the diameter of the second ejector. The front part of the second ejector extends into the second stepped hole.

5. The mold double ejector pin series pressure acquisition mechanism according to claim 4, characterized in that: The rear port wall of the second stepped hole of the rear ejector plate is chamfered.

6. The mold double ejector pin series pressure acquisition mechanism according to claim 5, characterized in that: The mold's fixing plate has a third stepped hole, and the rear part of the second ejector pin is located in the third stepped hole. The depth of the hole in the third stepped hole for placing the second ejector pin blank is greater than the length of the second ejector pin blank.

7. The mold double ejector pin series pressure acquisition mechanism according to claim 1, characterized in that: The rear part of the first ejector pin is set in the fourth step hole in the mold template and the mold core, and the first ejector pin is restricted in the template and the mold core by the template pressure block with through hole at the rear end of the first ejector pin; The template pressing block is located in the fourth step hole and does not protrude from the template surface. The through hole of the template pressing block is coaxial with the first ejector pin and the second ejector pin. The front end of the second ejector pin extends into this through hole and abuts against the first ejector pin.

8. The mold double ejector pin series pressure acquisition mechanism according to claim 7, characterized in that: It also includes a ejector sleeve, which passes through the third stepped hole of the fixing plate, the through hole of the ejector plate, and the through hole of the template pressing block. The second ejector pin is set in the ejector sleeve with its front and rear ends located outside the ejector sleeve. The through hole of the template pressure block is a stepped hole, with the front section being the first large diameter hole, the middle section being the small diameter hole, and the rear section being the second large diameter hole. The diameter of the first large diameter hole is larger than the diameter of the first ejector pin blank as a clearance space; the diameter of the small diameter hole is smaller than the diameter of the first ejector pin blank and matches the diameter of the front end of the second ejector pin; the diameter of the second large diameter hole matches the outer diameter of the ejector sleeve, and the rear end of the second large diameter hole has a chamfered wall.

9. A mold double ejector pin series pressure acquisition mechanism according to claim 8, characterized in that: The diameter of the third step hole in the mold fixing plate is slightly larger than the outer diameter of the ejector sleeve.

10. A mold double ejector pin series pressure acquisition mechanism according to claim 9, characterized in that: The fixing plate pressure block is fixed in the third step hole of the fixing plate by screws, and the diameter of the screw hole of the fixing plate pressure block is larger than the outer diameter of the screw.

Images