Equipment for detecting front-open type wafer transfer box and method for detecting defects of front-open type wafer transfer box

Abstract

The invention provides equipment for detecting a front open type wafer transfer box. The equipment comprises a detection chamber, a carrying table, a first image acquisition device and a plurality of second image acquisition devices, the detection chamber includes a bottom plate having a first opening, a first side plate connected to the bottom plate, a second side plate connected to the bottom plate and the first side plate, and a third side plate connected to the bottom plate and opposite to the second side plate. The carrying table moves up and down relative to the bottom plate through the first opening. The first image capturing device is arranged on the carrying table. The second image capturing devices are arranged at a plurality of corners in the detection chamber. According to the equipment for detecting the front-open type wafer conveying box, the automatic detection process of the front-open type wafer conveying box can be realized.

Description

Technical Field

[0001] This invention relates to a testing device and a testing method. More particularly, it relates to a device for testing front-opening wafer transfer boxes and a method for testing defects in front-opening wafer transfer boxes. Background Technology

[0002] Containers are used to hold and store semiconductor wafers. These containers are typically used to transport wafers between various locations within a wafer fab (i.e., a semiconductor manufacturing plant) during operation. One or more semiconductor wafers are removed from the container and received by processing tools, allowing the wafers to be processed and refined into semiconductor devices (e.g., semiconductor wafers, semiconductor dies, or some other similar or analogous type of semiconductor device). These containers are commonly referred to as front-opening universal pods (FOUPs) or cassettes and are used to hold one or more workpieces (e.g., unprocessed wafers, partially processed wafers, processed wafers, partially or fully processed wafer assemblies, or some other similar or analogous type of workpiece processed by the wafer fab) during operation. These FOUPs or cassettes are typically used to hold one or more semiconductor wafers during operation; these semiconductor wafers can be inserted into or removed from the FOUP or cassette for storage, transport, and processing. Summary of the Invention

[0003] One aspect of the present invention provides an apparatus for inspecting a front-opening wafer transfer box. The apparatus includes an inspection chamber, a stage, a first image capturing device, and a plurality of second image capturing devices. The inspection chamber includes a base plate having a first opening, a first side plate connected to the base plate, a second side plate connected to the base plate and the first side plate, and a third side plate connected to the base plate and opposite to the second side plate. The stage moves vertically relative to the base plate through the first opening. The first image capturing device is disposed on the stage. The plurality of second image capturing devices are disposed in multiple corners of the inspection chamber.

[0004] In some embodiments, the apparatus for inspecting a front-opening wafer transfer box further includes a third image capturing device disposed outside the inspection chamber and facing a second opening of the first side plate.

[0005] In some embodiments, the apparatus for inspecting a front-opening wafer transfer box further includes a fourth image capturing device disposed outside the inspection chamber and adjacent to the third image capturing device and facing the second opening of the first side plate.

[0006] In some embodiments, the fourth image capturing device is mounted on a telescopic, flexible, and rotatable robotic arm.

[0007] In some embodiments, the apparatus for inspecting a front-opening wafer transfer box further includes a fourth image capturing device disposed outside the inspection chamber and below the base plate.

[0008] In some embodiments, the number of the plurality of second image capturing devices is four, and the plurality of second image capturing devices are respectively disposed in the four corners of the detection chamber away from the first side plate.

[0009] In some embodiments, the apparatus for detecting a front-opening wafer transfer box further includes a plurality of fixing devices disposed around the first opening.

[0010] In some embodiments, the number of the plurality of fixing devices is four.

[0011] In some embodiments, the apparatus for inspecting a front-opening wafer transfer box further includes a loading port disposed next to the inspection chamber.

[0012] In some embodiments, the apparatus for inspecting a front-opening wafer transfer box further includes an automatic conveying device disposed between and connecting the loading port and the inspection chamber.

[0013] Another aspect of the present invention provides a method for detecting defects in a front-opening wafer transfer box, the method comprising the following steps: placing the front-opening wafer transfer box into a detection chamber of an apparatus for detecting the front-opening wafer transfer box, wherein the apparatus includes a detection chamber, a stage, and a first image capturing device. The detection chamber has a base plate, and the base plate has a first opening. The stage moves vertically relative to the base plate through the first opening. A plurality of fixing devices are disposed around the first opening. The first image capturing device is disposed on the stage. The front-opening wafer transfer box is fixed using the plurality of fixing devices. An image of the bottom appearance of the front-opening wafer transfer box is captured by the first image capturing device.

[0014] In some embodiments, the device further includes a plurality of second image capturing devices disposed in a plurality of corners of the detection chamber, and the method further includes the following step: capturing a plurality of surface appearance images of a front-opening wafer transfer box using the plurality of second image capturing devices.

[0015] In some embodiments, the device further includes a third image capturing device disposed outside the detection chamber and facing a second opening of the first side panel, and the method further includes the following step: capturing an image of the surface appearance of the lid of the front-opening wafer transfer case using the third image capturing device.

[0016] In some embodiments, the device further includes a fourth image capturing device disposed outside the inspection chamber and below a base plate, and the method further includes the following steps: After capturing an image of the surface appearance of the cover of the front-opening wafer transfer case using the third image capturing device, the cover of the front-opening wafer transfer case is opened. The cover is suspended below the base plate of the inspection chamber. An image of the inner surface of the cover is captured using the fourth image capturing device.

[0017] In some embodiments, the device further includes a fourth image capturing device mounted on a telescopic, flexible, and rotatable robotic arm, disposed outside the detection chamber and adjacent to the third image capturing device, the fourth image capturing device protruding from the second opening, and the method further includes the following steps: capturing images of multiple inner surfaces of a front-opening wafer transfer box using the fourth image capturing device.

[0018] In some embodiments, capturing multiple inner surface images of a front-opening wafer transfer box using a fourth image capturing device includes: bending a robotic arm to allow the fourth image capturing device to enter a detection chamber; and extending and rotating the robotic arm to allow the fourth image capturing device to enter the front-opening wafer transfer box and capture multiple inner surface images.

[0019] In some embodiments, the method for detecting defects in a front-opening wafer transfer box further includes the following steps: Using a deep learning object detection model to determine whether a defect exists in the bottom appearance image, thereby generating a detection result. Transmitting the detection result to the host computer of an automated material handling system.

[0020] In some embodiments, the method for detecting defects in a front-opening wafer transfer box further includes the following step: removing the front-opening wafer transfer box from the detection chamber of the equipment used for detecting the front-opening wafer transfer box using an automated material handling system.

[0021] In some embodiments, the method for detecting defects in a front-opening wafer transfer box further includes the following steps: The front-opening wafer transfer box is placed into the detection chamber of an apparatus for detecting front-opening wafer transfer boxes using an automated material handling system.

[0022] Therefore, the apparatus and method for detecting defects in front-opening wafer transfer boxes of the present invention can significantly reduce errors and costs caused by manual inspection. Compared with manual inspection, this apparatus and method for detecting defects in front-opening wafer transfer boxes can also utilize artificial intelligence algorithms to quickly acquire and analyze defect data.

[0023] The technical features and advantages of the present invention have been broadly summarized above to provide a better understanding of the detailed description of the invention below. Other technical features and advantages constituting the object of the claims of the present invention will be described below. Those skilled in the art to which this invention pertains will understand that the same purpose as the present invention can be achieved quite readily by utilizing the concepts and specific embodiments disclosed below as modifications or designs of other structures or processes. Those skilled in the art to which this invention pertains will also understand that such equivalent constructions cannot depart from the spirit and scope of the invention as defined by the appended claims. Attached Figure Description

[0024] The present invention can be more fully understood by reading the following detailed description of the embodiments and referring to the accompanying drawings.

[0025] Figure 1 This is a perspective view of an apparatus for inspecting a front-opening wafer transfer box according to some embodiments of the present invention.

[0026] Figure 2 This is a flowchart of a method for defect detection of a front-opening wafer transfer box according to some embodiments of the present invention.

[0027] Figure 3 This is a perspective view of a traditional FOUP, commonly found in the semiconductor industry.

[0028] Figure 4 This is a perspective view of a device for inspecting a front-opening wafer transfer box during operation, according to some embodiments of the present invention.

[0029] Figure 5 This is a perspective view of a traditional FOUP after the lid is opened.

[0030] Figure 6 This is an enlarged and enhanced view of the inner surface image of the FOUP lid, captured by the fourth image capturing device.

[0031] Figure 7 It is an enlarged and enhanced view of multiple inner surface images of the FOUP captured by one of multiple third image capturing devices.

[0032] Figure 8 This is a schematic diagram of the mechanical operation of a robotic arm that carries multiple third-party image capturing devices.

[0033] Figure 9 This is a block diagram of an automated material handling system according to some embodiments of the present invention.

[0034] Figure 10 This is a schematic diagram of an image displayed on a user interface according to some embodiments of the present invention. Detailed Implementation

[0035] The embodiments or examples of the disclosed content shown in the accompanying drawings are described in a specific language. It should be understood that this is not intended to limit the scope of the invention. Any variations or modifications to the embodiments and any further applications of the principles described herein are to be apparent to those skilled in the art. Component symbols may be repeated in various embodiments, but even if they have the same component symbols, features in one embodiment are not necessarily used in another embodiment.

[0036] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, or sections, these elements, components, regions, layers, or sections should not be limited to these terms. These terms are only used to distinguish one element, component, region, layer, or section from another region, layer, or section. Therefore, the first element, component, region, layer, or section described below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the inventive concept of this invention.

[0037] The terminology used in this invention is for the purpose of describing specific exemplary embodiments only and is not intended to limit the concept of the invention. As used herein, the singular forms “a” and “the” are also used to include the plural forms, unless otherwise expressly indicated herein. It should be understood that the word “comprising” as used in the specification refers specifically to the presence of the stated feature, integer, step, operation, element, or component, but does not exclude the presence of one or more other features, integers, steps, operations, elements, components, or groups thereof.

[0038] With the continuous advancement of manufacturing technology, the requirements for front-opening wafer assemblies (FOUPs) are becoming increasingly stringent. Even minor contamination, damage, or defects can severely impact product quality, even leading to the scrapping of an entire batch. Therefore, achieving accurate inspection of FOUPs has become a significant challenge. Currently, most inspection methods rely on manual operation. This process is not only time-consuming but also susceptible to subjective human factors, resulting in reduced reliability of the results. Furthermore, as the number of FOUPs increases, the workload of manual inspection also increases. Therefore, the equipment and method for inspecting front-opening wafer assemblies provided by this invention not only enable automated inspection of FOUPs but also reduce human error, increase inspection speed, and thus ensure the accuracy of the inspection results.

[0039] Figure 1 This is a perspective view of a device 100 for inspecting a front-opening wafer transfer box according to some embodiments of the present invention. (See also...) Figure 1The apparatus 100 for inspecting front-opening wafer transfer boxes includes an inspection chamber 110, a stage 120, a first image capturing device 140, and a plurality of second image capturing devices 130. Specifically, the inspection chamber 110 includes a base plate 112 having a first opening 1122, a first side plate 114 connected to the base plate 112, a second side plate 116 connected to the base plate 112 and the first side plate 114, and a third side plate 118 connected to the base plate 112 and opposite to the second side plate 116. The stage 120 moves vertically relative to the base plate 112 through the first opening 1122. The first image capturing device 140 is disposed on the stage 120. The plurality of second image capturing devices 130 are disposed in a plurality of corners of the inspection chamber 110.

[0040] In detail, the stage 120 can move up and down (e.g., along the Z-axis) to protrude from the first opening 1122 of the base plate 112. In some embodiments, the first image capturing device 140 is fixed and disposed at the center of the stage 120. In other words, the first image capturing device 140 can move up and down with the stage 120 (e.g., along the Z-axis) and protrude from the first opening 1122.

[0041] In some embodiments, the number of the plurality of second image capturing devices 130 is four, and these four second image capturing devices 130 are respectively disposed at the four corners of the detection chamber 110 away from the first side plate 114. In some embodiments, each second image capturing device 130 can adjust its angle to capture the desired image range.

[0042] In some embodiments, the device 100 for detecting a front-opening wafer transfer box further includes a plurality of fixing devices 150 disposed around the first opening 1122. In some embodiments, the number of the plurality of fixing devices 150 is four. Although Figure 1 Four fixing devices 150 are shown, but the number of fixing devices 150 is not limited to this. For example, the number of fixing devices 150 can be 2, 3, 5, 6 and / or more. After the FOUP enters the detection chamber 110, the fixing devices 150 can fix the FOUP in a predetermined position, such as the center of the detection chamber 110, but are not limited to this.

[0043] In some embodiments, the apparatus 100 for inspecting a front-opening wafer transfer box further includes a third image capturing device 160 disposed outside the inspection chamber 110 and facing a second opening 1142 of the first side plate 114, such that the third image capturing device 160 can be exposed from the second opening 1142 of the first side plate 114. In some embodiments, the third image capturing device 160 can adjust its angle and / or position through the second opening 1142 of the first side plate 114 to capture a desired image range. For example, the third image capturing device 160 can be mounted on a movable support 162, allowing the third image capturing device 160 to move along the Y-axis. In some embodiments, the movable support 162 can be an element such as a slide rail.

[0044] In some embodiments, the apparatus 100 for inspecting a front-opening wafer transfer box further includes a fourth image capturing device 170 disposed outside the inspection chamber 110 and adjacent to the third image capturing device 160, facing a second opening 1142 of the first side panel 114. Specifically, the fourth image capturing device 170 is mounted on a telescopic, flexible, and rotatable robotic arm 172. As described in more detail below, the fourth image capturing device 170 can enter the front-opening wafer transfer box.

[0045] In some embodiments, the third image capturing device 160 is positioned further away from the first side plate 114 than the fourth image capturing device 170. In other words, both the third image capturing device 160 and the fourth image capturing device 170 are disposed on the same YZ plane. Furthermore, the third image capturing device 160 and the fourth image capturing device 170 are also disposed on the same XZ plane.

[0046] In some embodiments, the apparatus 100 for inspecting a front-opening wafer transfer box further includes a fifth image capturing device 180 disposed outside the inspection chamber 110 and below the base plate 112. In some embodiments, the fifth image capturing device 180 may adjust its angle and / or position to capture a desired image range. As described in more detail below, the fifth image capturing device 180 may allow capturing an image of the lid of the front-opening wafer transfer box.

[0047] In some embodiments, the apparatus 100 for inspecting front-opening wafer transfer boxes further includes a loading port 190 disposed beside the inspection chamber 110. In some embodiments, the apparatus 100 for inspecting front-opening wafer transfer boxes further includes an automatic conveying device 192 disposed between the loading port 190 and the inspection chamber 110 and connecting the loading port 190 and the inspection chamber 110. Specifically, the automatic conveying device 192 generates a linear motion, causing the front-opening wafer transfer box to enter the inspection chamber 110 from the loading port 190 through the third opening 1182 of the third side plate 118.

[0048] Although the following uses the series of actions or steps described in this disclosed method, the order of such actions or steps shown should not be considered as limiting the invention. For example, certain actions or steps may be performed in a different order and / or simultaneously with other steps. Furthermore, it is not necessary to perform all steps to achieve the embodiments depicted in the invention. In addition, each operation or procedure described herein may comprise several sub-steps or actions.

[0049] Figure 2 This is a flowchart of a method 200 for defect detection of a front-opening wafer transfer box according to some embodiments of the present invention. Figure 3 This is a perspective view of a traditional front-opening wafer transfer box (FOUP) 300, which is common in the semiconductor industry. Figure 4 This is a perspective view of an apparatus 100 for detecting defects in a front-opening wafer transfer box during operation, according to some embodiments of the present invention. A method 200 for detecting defects in a front-opening wafer transfer box includes at least operations 202, 204, 206, 208, 210, 212, 214, 216, 218, 220, and 222.

[0050] Please see Figures 1 to 4 In operation 202, it will be as follows Figure 3 The front-opening wafer transport cassette (FOUP) 300 shown is placed in the inspection chamber 110 of the apparatus 100 for inspecting front-opening wafer transport cassettes as described above. In some embodiments, the FOUP 300 can be placed in the inspection chamber 110 of the apparatus 100 for inspecting front-opening wafer transport cassettes using an automated material handling system (AMHS). In other embodiments, the front-opening wafer transport cassette 300 can also be loaded into the inspection chamber 110 manually. In some embodiments, the positional relationships of the various components in the apparatus for inspecting front-opening wafer transport cassettes have been described above and will not be repeated here.

[0051] Automated Material Handling Systems (AMHS) ensure efficient material transport within manufacturing areas—whether within the same department or bay, at opposite ends of the manufacturing floor, or even between two different buildings. AMHS utilizes route and process information provided by the Manufacturing Execution System (MES) to move materials via conveyors, vertical lifts, and autonomous vehicles. Material identification can be achieved through various technologies, such as radio-frequency identification (RFID), barcoding, top flanges, optical character recognition (OCR), near-field communication (NFC), or ultra-wideband indoor tracking, to determine the location of materials or carriers for transport by AMHS. AMHS uses vehicle and material tracking systems to detect materials placed by operators at "pickup points," processes material identification codes to determine the next destination, and then delivers the materials. In a fully implemented Automated Material Handling System (AMHS), no human intervention is required for the handling equipment, transport system, or materials. AMHS will independently handle the identification, routing, and delivery of materials to the appropriate equipment, and can even place materials on or remove materials from the loading port of the equipment.

[0052] In some embodiments, the FOUP 300 has a base plate 350, a top plate 330 opposite to the base plate 350, three sidewalls 310, 320, and 340 connecting the base plate 350 and the top plate 330, and a cover 360 opposite to the sidewall 310, such as Figure 3 As shown. Furthermore, the top plate 330 of the FOUP 300 is equipped with a top flange 370, which can be clamped by automated equipment to facilitate the transfer of the FOUP between different workstations or semiconductor manufacturing equipment. More specifically, after the FOUP 300 enters the inspection chamber 110, the cover 360 of the FOUP 300 faces the first side plate 114, while the bottom plate 350 of the FOUP 300 faces the stage 120. It is worth noting that the FOUP 300 used for defect inspection is empty. In other words, the FOUP 300 used for defect inspection does not contain any wafers.

[0053] In operation 204, the FOUP 300 is secured using the securing device 150. In some embodiments, the securing device 150 can secure the FOUP 300 in a predetermined position after the FOUP 300 enters the detection chamber 110.

[0054] In operation 206, the first image capturing device 140 captures an image of the bottom exterior of the FOUP 300. Specifically, after the FOUP 300 is fixed, the first image capturing device 140 and the stage 120 are lowered together to a predetermined distance, such as... Figure 4 As shown, the first image capturing device 140 can then capture the bottom appearance image of the FOUP 300. More specifically, the bottom appearance image of the FOUP 300 captured by the first image capturing device 140 includes the appearance image of the outer surface of the bottom plate 350 of the FOUP 300.

[0055] In operation 208, multiple surface appearance images of the FOUP 300 are captured by a second image capturing device 130 located in a corner of the detection chamber 110. More specifically, the multiple surface appearance images of the FOUP 300 captured by the second image capturing device 130 include the appearance images of the outer surfaces of the three side walls 310, 320, 340 and the top plate 330.

[0056] In operation 210, a third image capturing device 160, located outside the detection chamber and facing the second opening of the first side plate connected to the bottom plate, captures an image of the surface appearance of the FOUP 300's lid. More specifically, the image of the FOUP 300's lid surface appearance captured by the third image capturing device 160 includes an image of the appearance of the outer surface of the FOUP 300's lid 360.

[0057] It should be noted that operations 206, 208 and 210 can be executed simultaneously or separately.

[0058] In operation 212, open the cover 360 of FOUP 300, as follows: Figure 5 As shown. More specifically, the cover 360 of the FOUP 300 can be opened after performing operations 206, 208, and / or 210. In some embodiments, after opening the cover 360 of the FOUP 300, the cover 360 is suspended below the base plate 112 of the detection chamber 110. In some embodiments, the cover 360 can be opened first along the X-axis and then along the negative Z-axis, which can be achieved manually or automatically.

[0059] In operation 214, the fifth image capturing device 180 captures an image of the inner surface of the lid 360, such as... Figure 6As shown. More specifically, after operation 212, the angle and / or position of the fifth image capturing device 180 can be adjusted so that the fifth image capturing device 180 can capture the entire inner surface of the cover 360. Generally, the inner surface of the cover 360 has a pattern 362, which serves as a positioning point for the wafer.

[0060] In operation 216, an image of the inner surface of the FOUP 300 is captured by the fourth image capturing device 170. The robotic arm 172, equipped with the fourth image capturing device 170, can perform mechanical movements such as extension, bending, and / or rotation to allow the fourth image capturing device 170 to enter the front-opening wafer transfer box, such as... Figure 7 As shown. In some embodiments, the robotic arm 172 can be bent so that the fourth image capturing device 170 can enter the detection chamber 110, and the robotic arm 172 can further extend, retract, and rotate so that the fourth image capturing device 170 can enter the front-opening wafer transfer box, and move along as shown. Figure 7 Move in the direction of the arrow shown to capture an image of the inner surface.

[0061] More specifically, see also Figure 1 and Figure 8 One end of the robotic arm 172 is fixed to the outside of the detection chamber 110 and adjacent to the first side plate 114. A fourth image capturing device 170 is disposed at the other end of the robotic arm 172. In some embodiments, one segment of the robotic arm 172 can be bent, for example, from the negative X-axis to the negative Z-axis. In some embodiments, another segment of the robotic arm 172 can extend or retract, for example, by linear movement along the Z-axis. In some embodiments, a further segment of the robotic arm 172 can rotate, for example, by moving around a fixed point in the YZ plane.

[0062] It should be noted that operations 214 and 216 can be executed simultaneously or separately.

[0063] In operation 218, a deep learning object detection model 410 (such as...) is used. Figure 9 (As shown) The system determines whether there are defects in the bottom appearance image, thereby generating a detection result. More specifically, the deep learning object detection model will determine whether there are any defects in the surface appearance image, bottom appearance image, lid surface appearance image, lid inner surface image, and inner surface image. In some embodiments, the first image capturing device 140, the second image capturing device 130, the third image capturing device 160, the fourth image capturing device 170, and the fifth image capturing device 180 can be used with an automated material handling system 400 (illustrated in [illustration missing]) that includes the deep learning object detection model. Figure 9Electrical connections are made. In some embodiments, the deep learning object detection model includes multiple normal appearance data of the FOUP 300 and multiple abnormal appearance (also referred to as defects) data of the FOUP 300.

[0064] In operation 220, the test results are transmitted to the AMHS host.

[0065] In some embodiments, the method 200 for detecting defects in a front-opening wafer transfer box may further include operation 222, namely, removing the front-opening wafer transfer box 300 from the inspection chamber 110 by means of an automated material handling system. In other embodiments, the front-opening wafer transfer box 300 may also be removed from the inspection chamber 110 by manual operation.

[0066] Figure 9 This is a block diagram of an automated material handling system 400 according to some embodiments of the present invention. (See also...) Figure 9 The automated material handling system 400 can be used in the method 200 for detecting defects in front-opening wafer transfer cassettes. The automated material handling system 400 includes a deep learning object detection model 410. In some embodiments, the automated material handling system 400 may also include other components, depending on the specific application. Specifically, the automated material handling system 400 is coupled to a first image capturing device 140, a second image capturing device 130, a third image capturing device 160, a fourth image capturing device 170, and a fifth image capturing device 180 of the device 100 for detecting defects in front-opening wafer transfer cassettes. The automated material handling system 400 is also coupled to a user interface 500.

[0067] Figure 10 This is a schematic diagram of images displayed on a user interface according to some embodiments of the present invention. For example, multiple images captured by these image capturing devices can be transmitted to a deep learning object detection model 410 of an automated material handling system 400, and then the deep learning object detection model 410 determines whether these images have defects. The determination result can be transmitted to the user interface 500 and displayed as an image, such as... Figure 10 As shown, so that the relevant operators can repair and / or discard the FOUP.

[0068] Accordingly, the equipment and method for detecting defects in front-opening wafer transfer boxes provided by this invention can automate the detection process of front-opening wafer transfer boxes, thereby improving detection efficiency and accuracy. It allows operators to remotely confirm the presence of defects in the front-opening wafer transfer boxes via a user interface, thus improving work efficiency and ensuring the safety of using the front-opening wafer transfer boxes. In other words, the equipment and method for detecting defects in front-opening wafer transfer boxes provided by this invention not only reduce the rework steps originally performed separately in the cleaning and measurement stations, but also significantly reduce manual operation, time, and visual defect detection errors, thereby improving detection efficiency and reducing production costs.

[0069] While the invention and its advantages have been described in detail, it should be understood that various changes, substitutions, and alternatives can be made without departing from the spirit and scope of the invention as defined in the claims. For example, many of the processes described above can be implemented using different methods, and other processes or combinations thereof can be substituted for many of the processes described above.

[0070] Furthermore, the scope of this application is not limited to the specific embodiments of the processes, machinery, manufacturing, material composition, means, methods, and steps described in the specification. Those skilled in the art will understand from the disclosure of this invention that existing or future processes, machinery, manufacturing, material composition, means, methods, or steps that have the same function or achieve substantially the same results as the corresponding embodiments described herein can be used according to this invention. Accordingly, such processes, machinery, manufacturing, material composition, means, methods, or steps are included within the scope of the claims of this application.

[0071] [Symbol Explanation] 100: Equipment 110: Inspection chamber 112: Base Plate 1122: First Opening 114: First side plate 1142: Second opening 116: Second side panel 118: Third side panel 1182: Third opening 120: Platform 130: Second image capturing device 140: First image capturing device 150: Fixture 160: Third image capturing device 162: Movable support component 170: Fourth image capturing device 172: Robotic Arm 180: Fifth Image Capture Device 190: Loading port 192: Automatic conveyor system 200: Method 202: Operation 204: Operation 206: Operation 208: Operation 210: Operation 212: Operation 214: Operation 216: Operation 218: Operation 220: Operation 222: Operation 300: Front-opening wafer transport box, FOUP 310: Sidewall 320: Sidewall 330: Top plate 340: Sidewall 350: Base Plate 360: Lid 362: Pattern 370: Top flange 400: Automated Material Handling System, AMHS 410: Deep learning object detection model 500: User Interface X: Axis Y: axis Z: Axis.

Claims

1. A device for inspecting a front-opening wafer transfer box, characterized in that, include: The detection chamber includes a base plate with a first opening, a first side plate connected to the base plate, a second side plate connected to the base plate and the first side plate, and a third side plate connected to the base plate and opposite to the second side plate. The platform moves up and down relative to the base plate through the first opening; A first image capturing device is mounted on the platform; and Multiple second image capturing devices are located in multiple corners of the detection chamber.

2. The apparatus for inspecting a front-opening wafer transfer box according to claim 1, wherein, Further includes: The third image capturing device is disposed outside the detection chamber and facing the second opening of the first side plate.

3. The apparatus for inspecting a front-opening wafer transfer box according to claim 2, wherein, Further includes: A fourth image capturing device is disposed outside the detection chamber, adjacent to the third image capturing device, and facing the second opening of the first side plate.

4. The apparatus for inspecting a front-opening wafer transfer box according to claim 3, wherein the fourth image capturing device is mounted on a telescopic, flexible and rotatable robotic arm.

5. The apparatus for inspecting a front-opening wafer transfer box according to claim 2, wherein, Further includes: The fourth image capturing device is located outside the detection chamber and below the base plate.

6. The apparatus for inspecting a front-opening wafer transfer box according to claim 1, wherein the plurality of second image capturing devices are four in number, and the plurality of second image capturing devices are respectively disposed in the four corners of the inspection chamber away from the first side plate.

7. The apparatus for inspecting a front-opening wafer transfer box according to claim 6, wherein, Further includes: Multiple fixing devices are arranged around the first opening.

8. The apparatus for detecting a front-opening wafer transfer box according to claim 7, wherein the number of the plurality of fixing devices is four.

9. The apparatus for inspecting a front-opening wafer transfer box according to claim 1, wherein, Further includes: The loading port is located next to the testing chamber.

10. The apparatus for inspecting a front-opening wafer transfer box according to claim 9, wherein, Further includes: An automatic conveying device is installed between the loading port and the detection chamber and connects the loading port and the detection chamber.

11. A method for detecting defects in a front-opening wafer transfer box, characterized in that, The method includes: The front-opening wafer transfer box is placed into the detection chamber of a device for detecting the front-opening wafer transfer box, wherein the device includes: The detection chamber has a base plate, and the base plate has a first opening; The platform moves up and down relative to the base plate through the first opening; Multiple fixing devices are arranged around the first opening; and A first image capturing device is mounted on the platform; The front-opening wafer transfer box is secured using multiple fixing devices; and The first image capturing device captures an image of the bottom appearance of the front-opening wafer transfer box.

12. The method of claim 11, wherein the device further comprises a plurality of second image capturing devices disposed at a plurality of corners in the detection chamber, and the method further comprises: Multiple surface appearance images of the front-opening wafer transfer box are captured by the multiple second image capturing devices.

13. The method of claim 12, wherein the device further comprises a third image capturing device disposed outside the detection chamber and facing a second opening of a first side plate connected to the base plate, and the method further comprises: The third image capturing device captures an image of the surface appearance of the lid of the front-opening wafer transfer box.

14. The method of claim 13, wherein the device further comprises a fourth image capturing device disposed outside the detection chamber and below the base plate, and the method further comprises: After capturing an image of the surface appearance of the cover of the front-opening wafer transfer box using the third image capturing device, the cover of the front-opening wafer transfer box is opened. The cover is suspended below the bottom plate of the detection chamber; and The fourth image capturing device captures an image of the inner surface of the lid.

15. The method of claim 13, wherein the device further comprises a fourth image capturing device mounted on a telescopic, flexible, and rotatable robotic arm and disposed outside the detection chamber and adjacent to the third image capturing device, the fourth image capturing device protruding from the second opening, and the method further comprises: The fourth image capturing device captures multiple images of the inner surface of the front-opening wafer transfer box.

16. The method of claim 15, wherein capturing the plurality of inner surface images of the front-opening wafer transfer cassette via the fourth image capturing device comprises: The robotic arm is bent to allow the fourth image capturing device to enter the detection chamber; as well as The robotic arm extends, retracts, and rotates to allow the fourth image-capturing device to enter the front-opening wafer transfer box and capture images of the multiple inner surfaces.

17. The method according to claim 11, wherein, Further includes: A deep learning object detection model is used to determine whether there are defects in the bottom appearance image, thereby generating detection results; and The test results are then transmitted to the host computer of the automated material handling system.

18. The method according to claim 11, wherein, Further includes: The front-opening wafer transfer box is removed from the inspection chamber of the device used for inspecting the front-opening wafer transfer box by an automated material handling system.

19. The method according to claim 11, wherein, Further includes: The front-opening wafer transfer box is placed into the testing chamber of the device used to test the front-opening wafer transfer box using an automated material handling system.

Images