X-ray back scattering signal acquisition circuit board of diffraction crystal
By integrating X-ray backscattering and crystal weak current signal acquisition units, and combining feature matching degree calculation and dynamic power consumption adjustment, the problems of signal analysis deviation and rigid power consumption management in the prior art are solved, and accurate signal discrimination and efficient operation of the circuit board are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI FJADE DETECTION TECH CO LTD
- Filing Date
- 2026-03-05
- Publication Date
- 2026-05-12
AI Technical Summary
Existing technologies neglect the auxiliary discrimination of weak current signals from the crystal during the acquisition of X-ray backscattered signals from diffraction crystals, leading to deviations in signal analysis results. Furthermore, the power consumption management of traditional acquisition circuit boards is rigid and cannot adapt to signal requirements.
It integrates an X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit, distinguishes between effective signals and interference signals through feature matching degree calculation, and constructs a dynamic power consumption intelligent adjustment system, dividing multiple working modes to adapt to the signal reliability level, thereby achieving stability in signal analysis and flexibility in power consumption management.
It achieves accurate discrimination and stable analysis of diffraction crystal signals, avoids the influence of environmental stray factors, ensures the true reflection of signals and efficient operation of circuit boards, and adapts to the signal acquisition needs of different scenarios.
Smart Images
Figure CN122016895A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of X-ray detection technology, specifically to an X-ray backscatter signal acquisition circuit board for a diffraction crystal. Background Technology
[0002] In modern materials science, semiconductor manufacturing, and geological exploration, the demand for structural characterization of diffractive crystals continues to grow. X-ray backscattering signal acquisition technology, as a core means of obtaining crystal lattice information, is widely used in key scenarios such as crystal defect detection and lattice parameter analysis. As related industries continue to increase their requirements for detection accuracy and stability, the application scenarios of diffractive crystal signal acquisition equipment are becoming more and more diverse, expanding from precise laboratory analysis to real-time detection in industrial settings, becoming an important support for promoting technological upgrades in related fields.
[0003] However, existing technologies for acquiring X-ray backscattered signals from diffractive crystals often employ a single signal acquisition method, focusing solely on acquiring and processing the X-ray backscattered signal. This neglects the auxiliary discriminative role of the weak current signal generated by the crystal under X-ray excitation, making it difficult to accurately distinguish between valid signals and environmental stray interference signals. This can easily lead to deviations in signal analysis results. Furthermore, the power management mode of traditional acquisition circuit boards is relatively rigid, unable to adjust the operating state according to the validity of the signal. They always perform acquisition operations in a fixed mode, lacking real-time power consumption monitoring and frequency fine-tuning mechanisms, thus failing to adapt the acquisition requirements to the operating state. Summary of the Invention
[0004] The purpose of this invention is to overcome the shortcomings of existing technologies and provide an X-ray backscatter signal acquisition circuit board for diffractive crystals. This invention integrates an X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit to simultaneously acquire and filter the two signals. After extracting the characteristic parameters of the two signals, the feature matching degree is calculated to distinguish the effective signal from the interference signal and form a signal analysis result. This process relies on the homogeneity of the two signals and uses feature matching to achieve accurate discrimination of the effective signal, avoiding the influence of environmental stray factors when acquiring a single signal. This ensures the stability and accuracy of the signal analysis process, allowing the acquired signal to truly reflect the lattice characteristics of the diffractive crystal and providing a stable and reliable signal basis for mode determination.
[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an X-ray backscattering signal acquisition circuit board for a diffraction crystal, the circuit board comprising:
[0006] Acquisition Unit Integration Module: Integrates an X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit to simultaneously acquire the X-ray backscatter signal and crystal weak current signal generated by the diffraction crystal under X-ray irradiation;
[0007] Signal processing module: Processes X-ray backscattered signals and weak crystal current signals, extracts characteristic parameters of the two signals, calculates feature matching degree, distinguishes between effective X-ray backscattered signals and interference signals of diffraction crystal, and forms signal analysis results;
[0008] Judgment Criteria Module: Sets the intensity threshold of the effective X-ray backscattered signal, clarifies the logic of the fusion judgment of the X-ray backscattered signal and the weak crystal current signal, and forms the threshold judgment criteria;
[0009] Power consumption system construction module: Based on signal analysis results and threshold judgment criteria, a dynamic power consumption intelligent adjustment system is constructed, which is divided into three working modes: high-speed acquisition, low-power standby, and sleep. A power consumption monitoring unit is configured to determine the fine-tuned execution frequency for each working mode based on the power consumption data.
[0010] Mode switching module: Based on the judgment result of the threshold judgment criterion, it switches to the corresponding working mode, and adjusts the execution frequency of each working mode of the circuit board according to the fine-tuned execution frequency.
[0011] Furthermore, in the acquisition unit integration module, the X-ray backscatter signal acquisition unit uses a silicon drift detector as the detection element, and the crystal weak current signal acquisition unit is equipped with a low-noise preamplifier circuit. The X-ray backscatter signal acquisition unit and the crystal weak current signal acquisition unit perform acquisition operations synchronously through a timing trigger unit, and both adopt multi-layer wiring technology for circuit integration, so as to physically isolate the signal transmission path of the X-ray backscatter signal acquisition unit from the signal transmission path of the crystal weak current signal acquisition unit.
[0012] Furthermore, in the signal processing module, the X-ray backscattered signal and the crystal weak current signal are filtered respectively, and the amplitude characteristic parameters, pulse width characteristic parameters and rise edge characteristic parameters of the two signals after filtering are extracted. The feature matching degree of the two signals is calculated by the dual-mode signal feature matching degree formula. Based on the feature matching degree, the effective X-ray backscattered signal data is screened and integrated to form the signal analysis result.
[0013] Furthermore, in the signal processing module, the formula for the feature matching degree of the dual-mode signal is: ,in, For feature matching degree, The first X-ray backscattered signal One feature parameter, The first weak current signal of the crystal One feature parameter, , These are the mean values of the characteristic parameters of the two signals, respectively. , The weighting coefficients are determined based on the signal-to-noise ratio of the X-ray backscattered signal and the signal-to-noise ratio of the weak crystal current signal, respectively. Filtering effective X-ray backscattered signal data based on feature matching degree: when When, it is determined to be an effective X-ray backscattered signal from the diffraction crystal; when When the signal is detected as interference, a second acquisition is performed.
[0014] Furthermore, in the determination criterion module, the intensity threshold of the effective X-ray backscattered signal is... The signal intensity statistics of different diffraction crystals under standard X-ray doses are used to determine the signal fusion logic. The logic for determining the fusion of the two signals is based on dual parallel judgment conditions. The characteristic matching degree between the X-ray backscattered signal and the weak current signal of the crystal, and the adequacy of the effective X-ray backscattered signal intensity are used as quantitative judgment conditions for mode switching. The effective X-ray backscattered signal intensity is determined to be adequacy if both conditions are met simultaneously: Condition 1 is the characteristic matching degree between the X-ray backscattered signal and the weak current signal of the crystal. Condition two is the effective X-ray backscatter signal intensity. .
[0015] Furthermore, in the judgment criterion module, based on the premise that the dual parallel judgment conditions are met, the comprehensive judgment value of the effective signal is calculated using the dual-modal effective signal judgment value formula. Quantify the reliability of the effective signal, when When, it is a highly reliable and effective signal, when When, it is a reliable and effective signal, when When the signal is low reliability, a valid signal is generated, thus forming a complete threshold determination criterion.
[0016] Furthermore, in the determination criterion module, the formula for determining the effective dual-mode signal is: ,in, The comprehensive judgment value of the effective signal. For the intensity of the effective X-ray backscattered signal, The effective X-ray backscatter signal intensity threshold, The feature matching degree is 0.6 and 0.4, which are the determination coefficients, and are determined by fitting the statistical analysis results of historical diffraction crystal detection samples.
[0017] Furthermore, the power consumption system module is divided into three working modes: high-speed acquisition mode, low-power standby mode, and sleep mode, which correspond to the reliability of the effective signal, respectively. High-reliability effective signals correspond to high-speed acquisition mode, which performs signal acquisition and processing operations at the highest frequency; medium-reliability effective signals correspond to low-power standby mode, which reduces the execution frequency of signal acquisition and processing, and only maintains the basic signal monitoring capability; low-reliability effective signals correspond to sleep mode, which cuts off the main power supply circuit of each acquisition unit and only retains the low-power operation of the signal wake-up function.
[0018] Furthermore, in the power consumption system construction module, a power consumption monitoring unit collects power consumption data of the circuit board in different operating modes in real time. Based on the power consumption data, the fine-tuned execution frequency for each operating mode is determined using a dynamic frequency adjustment formula, which is as follows: ,in, This is the fine-tuned execution frequency. The initial execution frequency for each mode, The preset power consumption thresholds for each mode are determined based on historical power consumption test data for the corresponding operating mode, combined with the power consumption performance of diffraction crystal detection scenarios with different lattice structures. The power consumption data collected in real time by the power consumption monitoring unit.
[0019] Compared with existing technologies, this X-ray backscattering signal acquisition circuit board for a diffraction crystal has the following advantages:
[0020] I. This invention integrates an X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit to simultaneously acquire and filter the two signals. After extracting the characteristic parameters of the two signals, the feature matching degree is calculated to distinguish the effective signal from the interference signal and form a signal analysis result. This process relies on the common origin correlation of the two signals and uses feature matching to achieve accurate discrimination of the effective signal. It avoids the influence of environmental stray factors when acquiring a single signal, ensuring the stability and accuracy of the signal analysis process. The acquired signal can truly reflect the lattice characteristics of the diffraction crystal and provides a stable and reliable signal basis for mode determination.
[0021] Second, this invention constructs a dynamic power consumption intelligent adjustment system, divides multiple working modes and configures power consumption monitoring units, matches the corresponding working mode based on the reliability of the effective signal, and adjusts the execution frequency according to real-time power consumption data. This mechanism relies on the correspondence between signal reliability and working mode to achieve flexible switching of operating state. It uses power consumption monitoring data to dynamically adapt the execution frequency, so that the operating state of the circuit board matches the signal acquisition requirements, forming a collaborative mechanism for signal acquisition and power consumption control, ensuring the rationality of operation of each link, and enabling the circuit board to complete the acquisition task in an adapted state under different signal scenarios.
[0022] Other advantages, objectives and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be learned from the practice of the invention. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0024] Figure 1 A flowchart of an X-ray backscatter signal acquisition circuit board for a diffraction crystal;
[0025] Figure 2 A schematic diagram of a circuit board for acquiring X-ray backscattered signals using a diffraction crystal.
[0026] Figure 3 This is a flowchart of the judgment criterion module in an X-ray backscatter signal acquisition circuit board for a diffraction crystal. Detailed Implementation
[0027] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.
[0028] Example 1: In a laboratory environment for high-precision detection of lattice defects in single-crystal silicon wafers, stringent requirements are placed on the accuracy of signal acquisition, and factors such as stray X-rays and electromagnetic interference from the instrument operation exist. An integrated X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit are used. The X-ray backscatter signal acquisition unit employs a silicon drift detector as its core detection element, while the crystal weak current signal acquisition unit is equipped with a low-noise preamplifier circuit to reduce its own noise interference. After starting the single-crystal silicon wafer detection process, a timing trigger unit controls the two acquisition units to work synchronously, acquiring X-ray backscatter signals and crystal weak current signals from the single-crystal silicon wafer target under X-ray irradiation. Figure 1 As shown, the circuit integration of the two acquisition units is completed using multi-layer wiring technology, and the signal transmission paths of the two acquisition units are physically isolated to avoid interference from electromagnetic signals generated by the operation of other precision instruments in the laboratory, thus ensuring the purity of the two signals.
[0029] The synchronously acquired X-ray backscattered signal and crystal weak current signal underwent full-process processing. First, both signals were filtered to remove unwanted signals from stray X-rays and electromagnetic interference. Then, the amplitude, pulse width, and rise time characteristics of the two filtered signals were extracted. Finally, the feature matching degree of the two signals was calculated using the dual-mode signal feature matching degree formula, which is: ,in, For feature matching degree, The first X-ray backscattered signal One feature parameter, The first weak current signal of the crystal One feature parameter, , These are the mean values of the characteristic parameters of the two signals, respectively. , The weighting coefficients are determined based on the signal-to-noise ratio (SNR) of the X-ray backscattered signal and the SNR of the weak crystal current signal, respectively; valid X-ray backscattered signal data are screened based on feature matching degree: when When, it is determined to be an effective X-ray backscattered signal from the diffraction crystal; when When this is detected, it is identified as an interference signal, and a secondary acquisition process is initiated. Finally, all valid X-ray backscatter signal data are integrated to form a complete signal analysis result, such as... Figure 2 As shown, this provides data support for the analysis of lattice defects in single-crystal silicon wafers.
[0030] Based on statistical data of signal intensity of monocrystalline silicon material under standard X-ray dose irradiation, an intensity threshold for effective X-ray backscattered signal is set. The logic for fusing the X-ray backscattered signal and the weak crystal current signal is defined as a dual parallel judgment condition. Only when both the feature matching degree and the effective X-ray backscattered signal intensity meet the standard can the signal be judged as having met the standard. Combining this dual parallel judgment condition, the comprehensive judgment value of the effective signal is calculated using the dual-modal effective signal judgment value formula. The dual-modal effective signal judgment value formula is as follows: ,in, The comprehensive judgment value of the effective signal. For the intensity of the effective X-ray backscattered signal, The effective X-ray backscatter signal intensity threshold, The feature matching degree is defined by coefficients 0.6 and 0.4, which are determined by fitting statistical analysis results of historical diffraction crystal detection samples; thus quantifying the reliability of the effective signal. When, it is a highly reliable and effective signal, when When, it is a reliable and effective signal, when When the signal is of low reliability and effectiveness, a complete threshold determination criterion is formed, such as... Figure 3 As shown.
[0031] Based on signal analysis results and threshold judgment criteria, a dynamic power consumption intelligent adjustment system is constructed, dividing the system into three working modes: high-speed acquisition, low-power standby, and sleep mode. These modes correspond to the reliability of the effective signal, respectively. High-reliability effective signals correspond to the high-speed acquisition mode, which performs signal acquisition and processing operations at the highest frequency. Medium-reliability effective signals correspond to the low-power standby mode, which reduces the execution frequency of signal acquisition and processing, maintaining only basic signal monitoring capabilities. Low-reliability effective signals correspond to the sleep mode, which cuts off the main power supply circuits of each acquisition unit, retaining only the low-power operation of the signal wake-up function, and simultaneously configuring a power consumption monitoring unit. Since the laboratory single-crystal silicon wafer lattice defect detection has high requirements for data accuracy and real-time performance, the comprehensive judgment value of the acquired effective signals is consistently at the high-reliability effective signal standard. Therefore, the circuit board is matched with the high-speed acquisition mode, which performs signal acquisition and processing operations at the highest frequency.
[0032] Based on the threshold judgment criterion, the circuit board operates stably in high-speed acquisition mode. On this basis, the power consumption monitoring unit collects the power consumption data of the circuit board in this mode in real time, and determines the fine-tuned execution frequency through a dynamic frequency adjustment formula. The dynamic frequency adjustment formula is as follows: ,in, This is the fine-tuned execution frequency. The initial execution frequency for each mode, The preset power consumption thresholds for each mode are determined based on historical power consumption test data for the corresponding operating mode, combined with the power consumption performance of diffraction crystal detection scenarios with different lattice structures. The power consumption data is collected in real time by the power consumption monitoring unit; the circuit board adjusts its operating status according to the fine-tuned execution frequency, which not only ensures the continuous and stable operation of the single crystal silicon wafer lattice defect detection work, but also avoids unnecessary power consumption waste caused by excessive frequency.
[0033] In summary, to meet the high-precision detection requirements of lattice defects in single-crystal silicon wafers in the laboratory, this method simultaneously acquires X-ray backscattered signals and weak crystal current signals. After signal filtering and feature extraction, it distinguishes between effective and interference signals. Then, it fused and quantified the reliability of the effective signal, matched the corresponding working mode, and adjusted the operating status based on real-time power consumption data. This approach avoids the impact of environmental interference factors on signal acquisition while ensuring the stability and accuracy of the detection process, providing reliable data support for the analysis of lattice defects in single-crystal silicon wafers.
[0034] Example 2: In the scenario of online lattice monitoring of polycrystalline alloy materials in an industrial production line, continuous operation is required for extended periods, and strong electromagnetic interference sources such as motors and frequency converters exist on-site. Furthermore, high power consumption control is required. An X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit are integrated. The X-ray backscatter signal acquisition unit uses a silicon drift detector as the detection element, while the crystal weak current signal acquisition unit is paired with a low-noise preamplifier circuit to cope with the complex electromagnetic environment of the industrial site. After the industrial production line starts, a timing trigger unit drives the two acquisition units to synchronously acquire the two signals generated by the polycrystalline alloy material under X-ray irradiation on the production line. Multilayer wiring technology is used to integrate the circuits of the two acquisition units, physically isolating the signal transmission paths of the two acquisition units to avoid the impact of strong electromagnetic interference on signal acquisition and ensure the accuracy of the acquired signals.
[0035] The two acquired signals are processed by first performing filtering operations to remove unwanted signals caused by interference factors such as electromagnetic noise and mechanical vibration in the industrial environment. Then, the amplitude, pulse width, and rise time characteristics of the two filtered signals are extracted. Finally, the feature matching degree is calculated using the dual-mode signal feature matching degree formula, which is: Valid X-ray backscattered signal data are filtered based on feature matching degree: when When, it is determined to be an effective X-ray backscattered signal from the diffraction crystal; when When an interference signal is detected, a secondary acquisition process is triggered to obtain a valid X-ray backscatter signal. Finally, all valid X-ray backscatter signal data are integrated to form a signal analysis result, providing a basis for real-time monitoring of the lattice quality of polycrystalline alloy materials on the production line.
[0036] Based on statistical data of signal intensity of different types of polycrystalline alloy materials under standard X-ray doses, an intensity threshold for effective X-ray backscattered signal is set, and a dual parallel condition for the fusion judgment of the two signals is defined. Only when both the feature matching degree and the effective X-ray backscattered signal intensity meet the standard can the effective signal be judged. Based on this dual parallel condition, the comprehensive judgment value of the effective signal is calculated using the dual-modal effective signal judgment value formula. The dual-modal effective signal judgment value formula is as follows: ; thereby quantifying the reliability of the effective signal, when When, it is a highly reliable and effective signal, when When, it is a reliable and effective signal, when When the signal is low reliability and effective, a complete threshold determination criterion is formed.
[0037] A dynamic power consumption intelligent adjustment system is constructed based on signal analysis results and threshold judgment criteria. It is divided into three working modes: high-speed acquisition, low-power standby, and sleep mode. A power consumption monitoring unit is configured to collect real-time power consumption data of the circuit board in different modes. When the crystal structure of the polycrystalline alloy material in the production line is stable and the comprehensive judgment value of the effective signal is a high-reliability effective signal, the circuit board switches to high-speed acquisition mode, performing signal acquisition and processing operations at the highest frequency to ensure the real-time nature of the monitoring data. When the production line is in a stable operating state and the comprehensive judgment value of the effective signal drops to a medium-reliability effective signal, the circuit board switches to low-power standby mode, reducing the execution frequency of signal acquisition and processing, maintaining only basic signal monitoring capabilities. When the production line is shut down for maintenance and there is no effective polycrystalline alloy material signal, and the comprehensive judgment value of the effective signal drops to a low-reliability effective signal, the circuit board switches to sleep mode, cutting off the main power supply circuits of each acquisition unit, retaining only the low-power operation of the signal wake-up function.
[0038] Based on the threshold judgment criteria, the circuit board flexibly switches between three operating modes. Simultaneously, the power consumption monitoring unit collects power consumption data in real time for each mode and calculates the fine-tuned execution frequency using a dynamic frequency adjustment formula. The dynamic frequency adjustment formula is as follows: The circuit board adjusts the operating parameters according to the fine-tuned execution frequency, which not only meets the online monitoring needs of polycrystalline alloy materials in industrial sites, but also achieves reasonable control of operating power consumption, ensuring that the equipment can operate stably and continuously for a long time.
[0039] In summary, for the online lattice monitoring scenario of polycrystalline alloy materials in industrial production lines, this method simultaneously collects two types of signals and performs targeted processing to accurately screen effective signals. Then, it flexibly switches the working mode based on the reliability of the effective signals and adjusts the operating frequency with the help of power consumption monitoring data. This effectively copes with complex electromagnetic interference in industrial sites and achieves intelligent switching between high-speed acquisition, low-power standby, and sleep modes. While meeting the long-term uninterrupted monitoring needs of the production line, it also reasonably controls the power consumption of the equipment and ensures the stable operation of the monitoring work.
[0040] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.
Claims
1. A circuit board for acquiring X-ray backscattered signals using a diffraction crystal, characterized in that, The circuit board includes: Acquisition Unit Integration Module: Integrates an X-ray backscatter signal acquisition unit and a crystal weak current signal acquisition unit to simultaneously acquire the X-ray backscatter signal and crystal weak current signal generated by the diffraction crystal under X-ray irradiation; Signal processing module: Processes X-ray backscattered signals and weak crystal current signals, extracts characteristic parameters of the two signals, calculates feature matching degree, distinguishes between effective X-ray backscattered signals and interference signals of diffraction crystal, and forms signal analysis results; Judgment Criteria Module: Sets the intensity threshold of the effective X-ray backscattered signal, clarifies the logic of the fusion judgment of the X-ray backscattered signal and the weak crystal current signal, and forms the threshold judgment criteria; Power consumption system construction module: Based on signal analysis results and threshold judgment criteria, a dynamic power consumption intelligent adjustment system is constructed, which is divided into three working modes: high-speed acquisition, low-power standby, and sleep. A power consumption monitoring unit is configured to determine the fine-tuned execution frequency for each working mode based on the power consumption data. Mode switching module: Based on the judgment result of the threshold judgment criterion, it switches to the corresponding working mode, and adjusts the execution frequency of each working mode of the circuit board according to the fine-tuned execution frequency.
2. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 1, characterized in that, In the acquisition unit integrated module, the X-ray backscatter signal acquisition unit uses a silicon drift detector as the detection element, and the crystal weak current signal acquisition unit is equipped with a low-noise preamplifier circuit. The X-ray backscatter signal acquisition unit and the crystal weak current signal acquisition unit perform acquisition operations synchronously through a timing trigger unit, and both adopt multi-layer wiring technology for circuit integration, so that the signal transmission path of the X-ray backscatter signal acquisition unit and the signal transmission path of the crystal weak current signal acquisition unit are physically isolated.
3. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 1, characterized in that, In the signal processing module, the X-ray backscattered signal and the crystal weak current signal are filtered respectively, and the amplitude characteristic parameters, pulse width characteristic parameters and rise edge characteristic parameters of the two signals are extracted. The feature matching degree of the two signals is calculated by the dual-mode signal feature matching degree formula. Based on the feature matching degree, the effective X-ray backscattered signal data is screened and integrated to form the signal analysis result.
4. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 3, characterized in that, In the signal processing module, the formula for the feature matching degree of the dual-mode signal is: ,in, Feature matching degree The first X-ray backscattered signal One feature parameter, The first weak current signal of the crystal One feature parameter, , These are the mean values of the characteristic parameters of the two signals, respectively. , These are the weighting coefficients; Filtering effective X-ray backscattered signal data based on feature matching degree: when When, it is determined to be an effective X-ray backscattered signal from the diffraction crystal; when When the signal is detected as interference, a second acquisition is performed.
5. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 1, characterized in that, In the determination criterion module, the intensity threshold of the effective X-ray backscattered signal is: The signal intensity statistics of different diffraction crystals under standard X-ray doses are used to determine the signal fusion logic. The logic for determining the fusion of the two signals is based on dual parallel judgment conditions. The characteristic matching degree between the X-ray backscattered signal and the weak current signal of the crystal, and the adequacy of the effective X-ray backscattered signal intensity are used as quantitative judgment conditions for mode switching. The effective X-ray backscattered signal intensity is determined to be adequacy if both conditions are met simultaneously: Condition 1 is the characteristic matching degree between the X-ray backscattered signal and the weak current signal of the crystal. Condition two is the effective X-ray backscatter signal intensity. .
6. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 5, characterized in that, In the judgment criterion module, based on the premise that the dual parallel judgment conditions are met, the comprehensive judgment value of the effective signal is calculated using the dual-modal effective signal judgment value formula. Quantify the reliability of the effective signal, when When, it is a highly reliable and effective signal, when When, it is a reliable and effective signal, when When the signal is low reliability and effective, a complete threshold determination criterion is formed.
7. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 6, characterized in that, In the determination criterion module, the formula for determining the effective dual-mode signal is: ,in, The comprehensive judgment value of the effective signal. For the intensity of the effective X-ray backscattered signal, The effective X-ray backscatter signal intensity threshold, 0.6 and 0.4 are the feature matching degree and the determination coefficients.
8. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 1, characterized in that, The power consumption system construction module is divided into three working modes: high-speed acquisition mode, low-power standby mode, and sleep mode, which correspond to the reliability of the effective signal, respectively. The high-reliability effective signal corresponds to the high-speed acquisition mode, which performs signal acquisition and processing operations at the highest frequency. Medium-reliability valid signals correspond to low-power standby mode, reducing the execution frequency of signal acquisition and processing, and maintaining only basic signal monitoring capabilities; low-reliability valid signals correspond to sleep mode, cutting off the main power supply circuits of each acquisition unit, and retaining only the low-power operation of the signal wake-up function.
9. The X-ray backscatter signal acquisition circuit board for a diffraction crystal according to claim 1, characterized in that, In the power consumption system construction module, a power consumption monitoring unit collects power consumption data of the circuit board in real time under different operating modes. Based on the power consumption data, the fine-tuned execution frequency for each operating mode is determined using a dynamic frequency adjustment formula. The dynamic frequency adjustment formula is as follows: ,in, This is the fine-tuned execution frequency. The initial execution frequency for each mode, The preset power consumption thresholds for each mode, The power consumption data collected in real time by the power consumption monitoring unit.