Metal particle detection device and detection method for basin-type insulator
By combining infrared thermal imaging and microwave heating, the problem of detecting metal particles on the surface of basin-type insulators has been solved, enabling active, sensitive, and safe detection of particles at the hundred-micron level, thus improving the detection efficiency and safety of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- STATE GRID HENAN ELECTRIC POWER ELECTRIC POWER SCI RES INST
- Filing Date
- 2026-02-05
- Publication Date
- 2026-05-12
AI Technical Summary
Existing technologies cannot safely and sensitively detect metal particles of hundreds of micrometers on the surface of basin insulators, which leads to the risk of failure in gas-insulated switchgear.
By combining infrared thermal imaging technology with microwave heating, the imaging module acquires baseline and heated infrared images, the image processing module identifies metal particles, and the control module controls the heating parameters, thus achieving active and sensitive detection of metal particles.
It enables proactive, sensitive, and safe detection of metal particles on the surface of basin-type insulators, improving the efficiency and safety of manufacturing quality inspection and operation and maintenance of gas-insulated switchgear.
Smart Images
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Abstract
Description
Technical Field
[0001] This application generally relates to the field of non-destructive testing technology for high-voltage electrical equipment. More specifically, this application relates to a device and method for detecting metallic particles in pot-type insulators. Background Technology
[0002] Basin-type insulators are critical insulating components in gas-insulated switchgear, and their surface cleanliness directly affects the insulation reliability of the equipment. During manufacturing, assembly, or operation, metal particles of hundreds of micrometers in size may be generated and adsorbed onto the insulator surface. These tiny metal particles may move or jump under the influence of an electric field, inducing partial discharge and even causing insulation flashover, which is a significant cause of failure in gas-insulated switchgear.
[0003] Currently, the detection of surface defects in insulators mainly relies on X-ray imaging, ultrasonic testing, and conventional infrared thermography. These methods each have the following drawbacks: (1) X-ray imaging equipment is expensive, poses radiation safety risks, and has insufficient contrast for low-density, small metal particles; (2) Ultrasonic testing has poor coupling effect on flat-surfaced basin insulators and is difficult to identify tiny particles; (3) Conventional infrared thermal imaging detection relies on the heating of the equipment itself. For basin insulators that have no current flowing through them and no obvious heating, it is not possible to effectively detect the cold metal particles adsorbed on their surface.
[0004] Therefore, there is an urgent need for a solution that can actively, sensitively, and safely detect hundreds of micrometer-sized metal particles on the surface of basin insulators. Summary of the Invention
[0005] In order to at least solve one or more of the technical problems mentioned above, this application proposes a device and method for detecting metal particles in basin insulators in several aspects.
[0006] In the first aspect, the device for detecting metallic particles in pot-type insulators provided in this application includes: The imaging module is used to acquire infrared images of the surface of the insulator under test before heating, obtain a reference temperature field distribution image, and acquire infrared images of the surface of the insulator under test after heating in real time, to obtain a temperature field distribution image sequence.
[0007] The heating module is used to provide uniform and controllable thermal radiation excitation to the surface area of the basin insulator to be tested.
[0008] The control module is electrically connected to the heating module and is used to control the heating temperature and heating time of the heating module.
[0009] An image processing module, electrically connected to the infrared thermal imaging module, is used to identify and locate metal particles on the surface of the area to be detected of the basin insulator based on the reference temperature field distribution image and the temperature field distribution image sequence.
[0010] In some examples, the vertical distance between the lens of the imaging module and the surface of the area to be detected of the basin insulator is 0.5m.
[0011] In some examples, the vertical distance between the radiant port of the heating module and the surface of the area to be tested of the basin insulator is 0.5m.
[0012] In some examples, the angle between the first line connecting the lens of the imaging module to the surface of the basin insulator to be tested and the second line connecting the radiation port of the heating module to the surface of the basin insulator to be tested is 20-25°.
[0013] In some examples, the image processing module is also used for: The temperature difference between each pixel in each image of the temperature field distribution image sequence and the corresponding pixel in the reference temperature field distribution image is calculated to obtain multiple difference values. Each of the multiple differences is determined to be greater than a preset threshold. If so, the corresponding pixel is determined to be a metal particle. The position of the metal particle is determined based on the coordinates of the pixel.
[0014] In some examples, the imaging module is an infrared thermal imager.
[0015] In some examples, the heating module is a microwave heater.
[0016] In some examples, the image processing module is a host computer.
[0017] In some examples, the control module includes a feedback unit, a control unit, and a power regulation unit.
[0018] In the second aspect, the metal particle detection method based on the metal particle detection device disclosed in the first aspect provided in this application includes the following steps: The basin-type insulator is fixedly placed on the testing fixture; Using the software built into the image processing module, the heating temperature and heating duration of the heating module, as well as the sampling frame rate of the imaging module, are set. Adjust the position and angle of the imaging module and the heating module respectively so that the surface of the area to be tested of the basin insulator is clearly imaged in the field of view of the imaging module; In the absence of thermal excitation, an infrared image of the surface of the area to be tested of the basin insulator is acquired using an imaging module as a reference temperature field distribution image. The heating module is activated to continuously or periodically heat the surface of the basin insulator to be tested with preset heating parameters until the heating ends and a cooling process is acquired. At the same time, the imaging module is controlled by the control module to continuously acquire images of the surface of the basin insulator to be tested, and a temperature field distribution image sequence is obtained. The image processing module analyzes the acquired image sequence, compares the temperature difference between each pixel in each image of the temperature field distribution image sequence and each pixel in the reference temperature field distribution image, and obtains multiple difference values; it is determined whether each of the multiple differences is greater than a preset threshold. If so, the corresponding pixel is determined to be a metal particle; the position of the metal particle is determined according to the coordinates of the pixel.
[0019] Compared with existing technologies, this application enables the active, sensitive, and safe detection of hundreds of micrometer-level metal particles on the surface of basin insulators, providing a powerful tool for manufacturing quality inspection and operation and maintenance of gas-insulated switchgear. Attached Figure Description
[0020] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, and the same or corresponding reference numerals denote the same or corresponding parts, wherein: Figure 1 A schematic diagram of the structure of the metal particle detection device for basin insulators provided in an embodiment of this application is shown. Figure 2 This diagram illustrates the infrared image generated by the metal particle detection device for basin insulators provided in the embodiments of this application. Figure 3 A schematic flowchart of the metal particle detection method provided in the embodiments of this application is shown; Figure 4 An exemplary structural block diagram of an electronic device according to some embodiments of this application is shown. Detailed Implementation
[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0022] It should be understood that the terms "comprising" and "including" used in the specification and claims of this application indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.
[0023] It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this specification and claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this specification and claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes such combinations.
[0024] As used in this specification and claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if [described condition or event] is detected" may be interpreted, depending on the context, as "once determined," "in response to determination," "once [described condition or event] is detected," or "in response to detection of [described condition or event]."
[0025] The specific embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0026] Example 1 like Figure 1 As shown, the metal particle detection device for basin-type insulators provided in this application includes: The imaging module is used to acquire infrared images of the surface of the insulator under test area before heating, obtain a reference temperature field distribution image, and acquire infrared images of the surface of the insulator under test area after heating in real time (e.g., ...). Figure 2 As shown in the figure, a sequence of temperature field distribution images was obtained.
[0027] In some examples, the imaging module is an infrared thermal imager. Specifically, the infrared thermal imager has a resolution of no less than 640×480 and a thermal sensitivity better than 0.05℃.
[0028] The heating module is used to provide uniform and controllable thermal radiation excitation to the surface area of the basin insulator to be tested.
[0029] In some examples, the heating module is a microwave heater.
[0030] Specifically, the imaging module and the heating module are mounted together on a programmable 3D moving platform to enable automated scanning.
[0031] The vertical distance between the lens of the imaging module and the radiation port of the heating module and the surface of the basin-type insulator to be inspected is 0.5m. The angle between the first line connecting the lens of the imaging module and the surface of the basin-type insulator to be inspected and the second line connecting the radiation port of the heating module and the surface of the basin-type insulator to be inspected is 20-25°. Experiments show that the imaging effect is optimal when the vertical distance between the lens of the imaging module and the radiation port of the heating module and the surface of the basin-type insulator to be inspected is 0.5m and the angle between the first line connecting the lens of the imaging module and the surface of the basin-type insulator to be inspected and the second line connecting the radiation port of the heating module and the surface of the basin-type insulator to be inspected is 20-25°.
[0032] The control module is electrically connected to the heating module and is used to control the heating temperature and heating time of the heating module.
[0033] In some examples, the control module includes a feedback unit, a control unit, and a power regulation unit. The core component of the control unit is a microcontroller (such as a single-chip microcomputer or a programmable logic controller, PLC), responsible for receiving external instructions (or autonomously generating "start / stop signals" and "target power or target temperature" instructions according to a preset program), and coordinating the work of other units. The power regulation unit is electrically connected to the heating module (such as an infrared heating tube or ceramic heating element), adjusting the input power of the heating module through voltage regulation, current regulation, or pulse width modulation, thereby controlling its thermal radiation power. The feedback unit typically integrates a temperature sensor (such as a thermocouple or infrared temperature probe) to collect the output temperature of the heating module or the actual heated area of the basin insulator in real time, feeding the data back to the control logic subunit. After comparing with the target temperature, the power is dynamically adjusted to ensure the uniformity and stability of thermal radiation.
[0034] Simply put, the control module is not a simple "power supply module", but an electrothermal linkage control unit with "instruction processing + power regulation + temperature closed loop". The purpose is to make the output of the heating module accurately match the detection requirements (such as stabilizing at a certain temperature and maintaining uniform thermal excitation at a specific power).
[0035] Specifically, by employing a control module, the average temperature rise of the basin-type insulator body does not exceed 20°C during the heating process, in order to avoid the performance degradation of the insulation material or the generation of thermal stress due to overheating.
[0036] The image processing module, electrically connected to the infrared thermal imaging module, is used to identify and locate metal particles on the surface of the area to be detected of the basin insulator based on the reference temperature field distribution image and the temperature field distribution image sequence. By actively thermally exciting the particles, the difficult-to-detect metal particles are transformed into significant temperature contrast signals. Combined with infrared thermal imaging technology, active and effective detection of metal particles at the hundred-micron level is achieved. It has the advantages of being non-contact, highly sensitive, and highly safe, providing a powerful tool for the manufacturing quality inspection and operation and maintenance of gas-insulated switchgear.
[0037] In some examples, the image processing module is specifically used for: The temperature difference between each pixel in each image of the temperature field distribution image sequence and the corresponding pixel in the reference temperature field distribution image is calculated to obtain multiple difference values. Each of the multiple differences is determined to be greater than a preset threshold (e.g., 0.5℃). If so, the corresponding pixel is determined to be a metal particle. The position of the metal particle is determined based on the coordinates of the pixel.
[0038] Specifically, the image processing module is a host computer with built-in image sequence processing software.
[0039] The working principle of the metal particle detection device for basin-type insulators provided in this application is as follows: When the surface of a basin-type insulator is uniformly and gently heated using a heating module, the thermal conductivity of the metal particles is much higher than that of insulating materials such as epoxy resin. In the initial (transient) heating phase, heat is rapidly conducted through the metal particles, causing the temperature of the particles themselves and the local area directly beneath them to rise more quickly, appearing as "hot spots" in infrared images. As heating continues until a quasi-steady state is reached, the metal particles, due to their excellent thermal conductivity, become "thermal short-circuit" paths, potentially causing their surface temperature to converge with the surrounding area or differ due to variations in surface emissivity. Analyzing the dynamic temperature field throughout the entire heating-cooling process clearly reveals the presence of the metal particles.
[0040] like Figure 3 As shown, the metal particle detection method based on the metal particle detection device disclosed in Embodiment 1 provided in this application includes the following steps: S101, the basin-type insulator is fixedly placed on the testing fixture (programmable three-dimensional moving platform); S102, using the software built into the image processing module, sets the heating temperature (e.g., 50℃), heating duration, and sampling frame rate of the imaging module. S103, adjust the position and angle of the imaging module and the heating module respectively, so that the surface of the area to be tested of the basin insulator is clearly imaged in the field of view of the imaging module; S104, In the absence of thermal excitation, the infrared image of the surface of the area to be tested of the basin insulator is acquired by the imaging module as a reference temperature field distribution image. S105, start the heating module to continuously or periodically heat the surface of the basin insulator to be tested with preset heating parameters. At the same time, use the control module to control the imaging module to continuously acquire images of the surface of the basin insulator to be tested, continue until the heating ends and continue to acquire images of a cooling process to obtain a temperature field distribution image sequence. S106, the image processing module analyzes the acquired image sequence, compares the temperature difference between each pixel in each image of the temperature field distribution image sequence and each pixel in the reference temperature field distribution image, and obtains multiple differences; determines whether each difference is greater than a preset threshold, and if so, determines that the corresponding pixel is a metal particle; and determines the position of the metal particle based on the coordinates of the pixel.
[0041] On the other hand, embodiments of this application also provide an electronic device, see [link to relevant documentation]. Figure 4 , Figure 4 This is an exemplary structural block diagram of an electronic device according to an embodiment of this application, such as... Figure 4 As shown, the electronic device includes a processor and a memory, the memory storing computer instructions, and the processor executing the computer instructions to perform the method provided in this application.
[0042] Specifically, processor 601 may include a central processing unit (CPU) or a graphics processing unit (GPU), or an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement the embodiments of this application. Memory 602 may include memory for data or instructions. For example, memory 602 may be at least one of the following: a hard disk drive (HDD), read-only memory (ROM), random access memory (RAM), floppy disk drive, flash memory, optical disk, magneto-optical disk, magnetic tape, universal serial bus (USB) drive, or other physical / tangible memory storage device. Alternatively, memory 602 may include removable or non-removable (or fixed) media. Furthermore, memory 602 may be internal or external to the integrated gateway disaster recovery device. Memory 602 may be non-volatile solid-state memory. In other words, typically memory 602 includes a tangible (non-transitory) computer-readable storage medium (such as a memory device) encoded with executable instructions, wherein the stored executable instructions, when executed by processor 601 (e.g., by one or more processors), can implement the methods in the embodiments of this application.
[0043] In one example Figure 4 The illustrated electronic device may also include a communication interface 603 and a bus 610. The processor 601, memory 602, and communication interface 603 are connected via bus 610 and communicate with each other. Communication interface 603 is primarily used to enable communication between modules, devices, units, and / or equipment within the electronic device. Bus 610, including hardware, software, or both, couples components of the online data flow metering device together. For example, the bus may include at least one of the following: Accelerated Graphics Port (AGP) or other graphics bus, Enhanced Industry Standard Architecture (EISA) bus, Front Side Bus (FSB), HyperTransport (HT) interconnect, Industry Standard Architecture (ISA) bus, Infinite Bandwidth Interconnect, Low Pin Count (LPC) bus, memory bus, Microchannel Architecture (MCA) bus, Peripheral Component Interconnect (PCI) bus, PCI-Express (PCI-X) bus, Serial Advanced Technology Attachment (SATA) bus, Video Electronics Standards Association Local (VLB) bus, or other suitable buses. Bus 610 may include one or more buses. Although specific buses are described or illustrated in the embodiments of this application, any suitable bus or interconnection method may be considered in the embodiments of this application.
[0044] In another aspect, embodiments of this application also provide a computer-readable storage medium storing computer program instructions that, when executed by a processor, implement the aforementioned method. The computer-readable storage medium may be, for example, a classic computer-readable storage medium, such as a read-only memory (ROM), random access memory (RAM), disk storage media, optical storage media, flash memory, or other electrical, optical, or other physical / tangible memory storage devices.
[0045] In another aspect, embodiments of this application also provide a computer program product, which includes computer program instructions that, when executed by a processor, implement the method provided in embodiments of this application. This computer program product may be, for example, a software installation package, a plug-in compatible with a related software system, etc.
[0046] The flowcharts and / or block diagrams of the methods and systems of embodiments of this application have been described above by way of example, and related aspects have been described. It should be understood that each block or combination thereof in the flowcharts and / or block diagrams can be implemented by computer program instructions, by dedicated hardware performing a specified function or action, or by a combination of dedicated hardware and computer instructions. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc.; when implemented in software, it is a program or code segment used to perform the required task. The program or code segment can be stored in memory or transmitted over a transmission medium or communication link via data signals carried in a carrier wave. The code segment can be downloaded via a computer network such as the Internet, an intranet, etc.
[0047] While this application has shown and described numerous embodiments, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will arise for those skilled in the art without departing from the spirit and intent of this application. It should be understood that various alternatives to the embodiments of this application described herein may be employed in the practice of this application. The appended claims are intended to define the scope of protection of this application and therefore cover equivalents or alternatives within the scope of these claims.
Claims
1. A device for detecting metallic particles in basin-type insulators, characterized in that, include: The imaging module is used to acquire infrared images of the surface of the insulator under test area before heating, obtain a reference temperature field distribution image, and acquire infrared images of the surface of the insulator under test area after heating in real time, obtain a temperature field distribution image sequence. The heating module is used to provide uniform and controllable thermal radiation excitation to the surface area of the basin insulator to be tested; A control module, electrically connected to the heating module, is used to control the heating temperature and heating duration of the heating module; An image processing module, electrically connected to the infrared thermal imaging module, is used to identify and locate metal particles on the surface of the area to be detected of the basin insulator based on the reference temperature field distribution image and the temperature field distribution image sequence.
2. The metal particle detection device according to claim 1, characterized in that, The vertical distance between the lens of the imaging module and the surface of the area to be tested of the basin-type insulator is 0.5m.
3. The metal particle detection device according to claim 2, characterized in that, The vertical distance between the radiation port of the heating module and the surface of the area to be tested of the basin insulator is 0.5m.
4. The metal particle detection device according to claim 3, characterized in that, The angle between the first line connecting the lens of the imaging module to the surface of the basin-type insulator to be tested and the second line connecting the radiation port of the heating module to the surface of the basin-type insulator to be tested is 20-25°.
5. The metal particle detection device according to claim 1, characterized in that, The image processing module is also used for: The temperature difference between each pixel in each image of the temperature field distribution image sequence and the corresponding pixel in the reference temperature field distribution image is calculated to obtain multiple difference values. Each of the multiple differences is determined to be greater than a preset threshold. If so, the corresponding pixel is determined to be a metal particle. The position of the metal particle is determined based on the coordinates of the pixel.
6. The metal particle detection device according to claim 1, characterized in that, The imaging module is an infrared thermal imager.
7. The metal particle detection device according to claim 1, characterized in that, The heating module is a microwave heater.
8. The metal particle detection device according to claim 1, characterized in that, The image processing module is a host computer.
9. The metal particle detection device according to claim 1, characterized in that, The control module includes a feedback unit, a control unit, and a power regulation unit.
10. A method for detecting metal particles based on the metal particle detection device according to any one of claims 1-9, comprising the following steps: The basin-type insulator is fixedly placed on the testing fixture; Using the software built into the image processing module, the heating temperature and heating duration of the heating module, as well as the sampling frame rate of the imaging module, are set. Adjust the position and angle of the imaging module and the heating module respectively so that the surface of the area to be tested of the basin insulator is clearly imaged in the field of view of the imaging module; In the absence of thermal excitation, an infrared image of the surface of the area to be tested of the basin insulator is acquired using an imaging module as a reference temperature field distribution image. The heating module is activated to continuously or periodically heat the surface of the basin insulator to be tested with preset heating parameters until the heating ends and a cooling process is acquired. At the same time, the imaging module is controlled by the control module to continuously acquire images of the surface of the basin insulator to be tested, and a temperature field distribution image sequence is obtained. The image processing module analyzes the acquired image sequence, compares the temperature difference between each pixel in each image of the temperature field distribution image sequence and each pixel in the reference temperature field distribution image, and obtains multiple difference values; it is determined whether each of the multiple differences is greater than a preset threshold. If so, the corresponding pixel is determined to be a metal particle; the position of the metal particle is determined according to the coordinates of the pixel.