Method and device for detecting chip test programming error or wrong material mixing

Abstract

The invention provides a method and device for detecting chip test programming errors or wrong material mixing, and relates to the technical field of chip detection.The method comprises the steps that a report checking system obtains a test data file obtained after a final test procedure of a current batch of chips is completed; and analyzing the test data file, extracting the programming value and the chip identifier of each chip in the current batch, and uploading the programming value and the chip identifier to a database. And comparing the programming value and the chip identifier of each chip in the current batch with corresponding data in a database, and judging whether programming errors or wrong material mixing exist in the current batch. And if the current batch has programming errors or wrong material mixing, the report checking system triggers an out-of-control action plan process in the manufacturing execution system. And if the current batch does not have the programming error and the wrong material mixing, the report checking system informs the manufacturing execution system of allowing the current batch of chips to pass the station normally, so that the detection efficiency and accuracy are improved, and the delivery quality of the chips is guaranteed.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a method and apparatus for detecting chip testing and programming errors or incorrect material mixing. Background Technology

[0002] In the semiconductor chip testing process, a final test (FT) is required to perform electrical tests on the chip and program the test program or configuration data into the chip. If a programming error or incorrect component mixing occurs, it will lead to malfunctions or batch discrepancies. Traditional methods rely on manual sampling, which is not only inefficient but also prone to missing detections, making it difficult to guarantee the quality of the chips before they leave the factory. Summary of the Invention

[0003] The purpose of this application is to provide a method and apparatus for detecting chip testing and programming errors or incorrect material mixing, so as to improve testing efficiency and accuracy and ensure the quality of chips leaving the factory.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows: On the one hand, this application provides a method for detecting chip test programming errors or incorrect component mixing, the method comprising the following steps: The report inspection system retrieves the test data file obtained after the final testing process is completed for the current batch of chips. The test data file is parsed to extract the programming values ​​and chip identifiers of each chip in the current batch, and then uploaded to the database. The programming value and chip identifier of each chip in the current batch are compared with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch. If there is a burning error or incorrect mixing of materials in the current batch, the report inspection system will trigger the out-of-control action plan process in the manufacturing execution system. If there are no programming errors or incorrect material mixing in the current batch, the report checking system notifies the manufacturing execution system to allow the chips in the current batch to pass through normally.

[0005] Further, the step of comparing the programmed value and chip identifier of each chip in the current batch with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch includes: The programming value of each chip in the current batch is compared with the corresponding programming target value in the database. If the programming value is inconsistent with the programming target value, it is determined that there is a programming error in the current batch. The chip identifier of each chip in the current batch is compared with the chip identifier of the historical batches in the database. If the chip identifier has a matching item in the historical batch record, it is determined that there is a mismixing of materials in the current batch.

[0006] Further, the step of comparing the programming value of each chip in the current batch with the corresponding programming target value in the database, and determining that there is a programming error in the current batch if the programming value is inconsistent with the programming target value, includes: Read the target value for programming the test item corresponding to the current chip from the database; Compare the current programming value of the chip with the programming target value; If the current programming value of the chip is inconsistent with the programming target value, it is determined that there is a programming error in the current chip. If at least one chip in the current batch is determined to have a programming error, then the current batch is determined to have a programming error.

[0007] Further, the step of comparing the chip identifier of each chip in the current batch with the chip identifiers of historical batches in the database to check for duplicates, and determining that there is a mismixing of materials in the current batch if a matching item exists in the historical batch record, includes: The chip identifier of the current chip is compared with the chip identifiers of the remaining chips in the current batch and the chip identifiers of all chips in the historical batches stored in the database for duplicate checking; If the chip identifier of the current chip has a matching item in the current batch or in the historical batch record, it is determined that the current chip has been mixed up. If at least one chip in the current batch is determined to be a mismixed component, then the current batch is determined to contain mismixed components.

[0008] Furthermore, the steps by which the report inspection system obtains the test data file of the current batch of chips after the final testing process are as follows: After completing the final testing process for the current batch of chips, the automatic testing machine generates a test data file and uploads the test data file to the data server. The report checking system reads the test data file from the data server.

[0009] Furthermore, the steps by which the report inspection system triggers the out-of-control action plan process in the manufacturing execution system include: The report checking system sends a detection failure signal to the manufacturing execution system; In response to the detection failure signal, the manufacturing execution system intercepts the current batch from passing through the station and initiates the out-of-control action plan process.

[0010] Furthermore, the step of the report inspection system notifying the manufacturing execution system to allow the current batch of chips to pass through normally includes: The report checking system sends a pass signal to the manufacturing execution system; The manufacturing execution system responds to the detection pass signal, allowing the current batch of chips to pass through the station normally and proceed to the next process.

[0011] Furthermore, the report inspection system communicates with the manufacturing execution system via an application programming interface.

[0012] Furthermore, the method also includes: After performing the comparison of the burned values ​​and the comparison of the chip identifiers, the report inspection system generates a log file and stores it in a preset local path; wherein, the log file contains the detection time, batch number, inspection results of each test item and abnormal chip number; When it is determined that there is a burning error or incorrect mixing of materials in the current batch, the report inspection system will send the log file to a preset recipient email address via email.

[0013] On the other hand, this application also provides an apparatus for detecting chip test programming errors or incorrect component mixing, applied to the report inspection system. The apparatus is used to perform the method for detecting chip test programming errors or incorrect component mixing as described in any of the foregoing embodiments. The apparatus includes: The acquisition module is used to acquire the test data file obtained after the final testing process of the current batch of chips is completed; The parsing module is used to parse the test data file, extract the programming values ​​and chip identifiers of each chip in the current batch, and upload them to the database; The comparison module is used to compare the programming value and chip identifier of each chip in the current batch with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch. The linkage module is used to trigger the runaway action plan process in the manufacturing execution system when there is a programming error or incorrect mixing in the current batch; when there is no programming error or incorrect mixing in the current batch, it notifies the manufacturing execution system to allow the chips of the current batch to pass through normally.

[0014] Compared with the prior art, this application has the following advantages: The method for detecting chip programming errors or incorrect component mixing provided in this application includes the following steps: First, the report inspection system obtains the test data file obtained after the final testing process of the current batch of chips. Next, the test data file is parsed to extract the programming value and chip identifier of each chip in the current batch, and uploaded to the database. Second, the programming value and chip identifier of each chip in the current batch are compared with the corresponding data in the database to determine whether there are programming errors or incorrect component mixing in the current batch. If programming errors or incorrect component mixing exist in the current batch, the report inspection system triggers the runaway action plan process in the manufacturing execution system. If there are no programming errors or incorrect component mixing in the current batch, the report inspection system notifies the manufacturing execution system to allow the chips in the current batch to pass through the station normally.

[0015] Compared to traditional manual sampling inspection, this application utilizes a report inspection system to automatically check the test data of each chip in each batch, offering advantages such as fast test data inspection speed and comprehensive and accurate data. Furthermore, by linking with the Manufacturing Execution System (MES), it enables real-time monitoring and closed-loop management of programming quality throughout the entire semiconductor chip testing process. This mechanism ensures that the programming information of each chip produced by the semiconductor testing plant is unique and traceable, effectively preventing mismixing and ensuring the quality of chips leaving the factory. Attached Figure Description

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0017] Figure 1 This is one of the flowcharts illustrating a method for detecting chip testing and programming errors or incorrect material mixing provided in this application; Figure 2 This application provides a schematic diagram of a semiconductor chip testing process; Figure 3 This is a flowchart illustrating the sub-steps of step S10 in this application; Figure 4 This is a flowchart illustrating the sub-steps of step S30 in this application; Figure 5This is a flowchart illustrating the sub-steps of step S40 in this application; Figure 6 This application provides a schematic diagram of an out-of-control action plan process; Figure 7 This is a flowchart illustrating the sub-steps of step S50 in this application; Figure 8 The second flowchart illustrates a method for detecting chip testing and programming errors or incorrect material mixing provided in this application. Figure 9 A schematic diagram of the operating interface of a report inspection system provided in this application; Figure 10 This application provides a structural block diagram of a device for detecting chip programming errors or incorrect material mixing.

[0018] Icons: 100 - Device for detecting chip test programming errors or incorrect material mixing; 110 - Acquisition module; 120 - Analysis module; 130 - Comparison module; 140 - Linkage module. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0021] As described in the background section, after the final testing process, issues such as programming errors or incorrect material mixing can easily lead to malfunctions in the chips or batch discrepancies. Existing testing methods rely on manual sampling, which is not only inefficient but also prone to missed detections, making it difficult to guarantee the quality of the chips before they leave the factory.

[0022] In view of this, please refer to Figure 1 and Figure 2 This application provides a method for detecting chip test programming errors or incorrect component mixing, the method comprising the following steps: Step S10: The Report Check System (RCS) obtains the test data file of the current batch of chips after the Final Test (FT) process is completed.

[0023] Step S20: Parse the test data file, extract the programming values ​​and chip identifiers of each chip in the current batch, and upload them to the database.

[0024] Step S30: Compare the programming value and chip identifier (Die ID) of each chip in the current batch with the corresponding data in the database to determine whether there are programming errors or incorrect material mixing in the current batch.

[0025] Step S40: If there is a burning error or incorrect mixing of materials in the current batch, the report check system triggers the Out of Control Action Plan (OCAP) process in the Manufacturing Execution System (MES).

[0026] In step S50, if there are no programming errors or incorrect material mixing in the current batch, the report checking system notifies the manufacturing execution system to allow the chips of the current batch to pass through normally.

[0027] Understandably, the RCS system (report inspection system) in this application automatically reads and parses the test data file obtained after the FT (final test) is completed. By linking with the SQL database, it extracts the programming value and chip identifier of each chip in the current batch and compares them with the corresponding data in the database (such as programming target value and historical batch chip identifier), thereby realizing automated and high-precision detection of chip programming errors and mismatched materials.

[0028] In addition, the RCS system is linked with the MES system (Manufacturing Execution System). When the inspection fails (i.e., the current batch has programming errors or incorrect mixing of materials), it can trigger the OCAP process (Out of Control Action Plan) in the MES system to locate the root cause and implement corrective measures such as reprogramming. When the inspection passes (i.e., the current batch does not have programming errors or incorrect mixing of materials), it notifies the MES system to automatically release the chips, allowing the batch of chips to pass through the station normally and enter subsequent processes such as EQC (Appearance Quality Inspection), FQL (Final Quality Inspection), and OQC (Outgoing Quality Inspection), ultimately ensuring that the chip quality meets the requirements and is packaged and shipped.

[0029] Compared to traditional manual sampling inspection, this application utilizes the RCS system to automatically check the test data of each chip in each batch, offering advantages such as fast test data checking speed and comprehensive and accurate data. Furthermore, by integrating with the MES system, it enables real-time monitoring and closed-loop management of programming quality throughout the entire semiconductor chip testing process. This mechanism ensures that the programming information of each chip produced by the semiconductor testing plant is unique and traceable, effectively preventing mismixing and ensuring chip quality upon delivery.

[0030] For a better understanding, please refer to Figure 3 In one optional implementation, step S10 of the report inspection system obtaining the test data file obtained after the final testing process of the current batch of chips includes sub-steps S11 and S12.

[0031] Step S11: After completing the final testing process for the current batch of chips, the automatic testing machine generates a test data file and uploads the test data file to the data server.

[0032] Step S12: The report checking system reads the test data file from the data server.

[0033] Understandably, after completing the final testing process for the current batch of chips, the Automated Test Equipment (ATE) will generate test data files and automatically upload them to a data server (FTP). These test data files can be in STDF, CSV, or TXT format.

[0034] The data server stores the test data files generated by the automated testing machine and automatically uploads the test data to the manufacturing execution system. Furthermore, the report verification system reads the test data files from the data server to perform subsequent data parsing and a series of algorithm verifications.

[0035] Further, please refer to Figure 4 The step S30, which compares the programming value and chip identifier of each chip in the current batch with the corresponding data in the database to determine whether there is a programming error or incorrect mixing of materials in the current batch, includes sub-steps S31 and S32.

[0036] Step S31: Compare the programming value of each chip in the current batch with the corresponding programming target value in the database. If the programming value is inconsistent with the programming target value, it is determined that there is a programming error in the current batch.

[0037] Specifically, the method for determining if a chip in the current batch has a programming error is as follows: For each chip in the current batch, first, the programming target value for the corresponding test item of that chip (i.e., the current chip) is read from the database. Then, the actual programming value (i.e., the programming value of the current chip) is compared with the programming target value. If the two are inconsistent, the chip is determined to have a programming error. If at least one chip in the current batch is determined to have a programming error, the entire batch is considered to have a programming error.

[0038] Step S32: Compare the chip identifier of each chip in the current batch with the chip identifier of the historical batches in the database. If there is a matching item in the historical batch record, it is determined that there is a mismixing of materials in the current batch.

[0039] Specifically, the method for determining if a chip in the current batch is mismixed is as follows: For each chip in the current batch, the die ID of that chip (i.e., the current chip) is compared with the die IDs of the remaining chips in the current batch and all chips in historical batches stored in the database. If a duplicate die ID is found within the current batch or in historical batch records (i.e., the die ID of the current chip has a match within the current batch or in historical batch records), then that chip is determined to be mismixed. If at least one chip in the current batch is determined to be mismixed, then the entire batch is considered to have mismixed components.

[0040] Therefore, this application achieves accurate determination of programming errors by comparing the actual programmed value of each chip with the target programmed value. Simultaneously, by performing dual deduplication comparisons between the chip identifier and records within the current batch and historical batches, it effectively identifies data duplication within a batch and physical mixing issues across batches. This verification mechanism uses a single chip as the smallest detection unit, performs checks through a series of comparison algorithms, and links with the manufacturing execution system based on the check results, forming a complete logical closed loop from individual anomaly identification to automatic batch interception. This provides the semiconductor chip testing industry with a high-precision, high-coverage automated chip inspection solution.

[0041] Optionally, the report checking system communicates with the manufacturing execution system via an application programming interface (API).

[0042] In one alternative implementation, please refer to Figure 5 The step S40 of the report inspection system triggering the out-of-control action plan process in the manufacturing execution system includes sub-steps S41 and S42.

[0043] Step S41: The report inspection system sends a detection failure signal to the manufacturing execution system.

[0044] In step S42, the manufacturing execution system responds to the detection failure signal by intercepting the current batch passing through the station and initiating the out-of-control action plan process.

[0045] Understandably, if the current batch has programming errors or incorrect material mixing, the report checking system sends a failure signal to the manufacturing execution system via the API interface. In response to this failure signal, the manufacturing execution system immediately intercepts the current batch from passing through the station, and automatically initiates the OCAP process to generate an exception handling task and assign it to the corresponding engineer, so as to ensure that the abnormal batch is handled in a timely manner, the root cause is effectively investigated, and corrective measures are implemented.

[0046] For example, please refer to Figure 6 , Figure 6 This application provides an embodiment of the OCAP flowchart for handling verification anomalies in an FT test station RCS system. The specific flowchart is as follows: Step 1: After the production operator confirms that the RCS system report is abnormal, proceed to Step 2.

[0047] Step 2: The product engineer confirms the cause of the report anomaly and verifies whether the data in the machine's datalog (summary, txt, csv, stdf) matches the actual product. After confirmation, proceed to Step 3.

[0048] Step 3: The product engineer determines whether the test results are affected and assesses the extent of the impact of the data anomaly on the product; if it is determined that there is no impact or the impact is controllable, proceed to step 4; if it is determined that there is an impact, proceed to step 5.

[0049] Step 4: The product engineer corrects the anomaly and re-imports it into the system. After the correction is completed, proceed to step 7.

[0050] Step 5: Notify the customer for confirmation, and have the customer evaluate the abnormal RCS batch. After the evaluation is completed, proceed to Step 6.

[0051] Step 6: The product engineer performs the work according to the customer's instructions. After the work is completed, proceed to Step 7.

[0052] Step 7: Production operators resume production according to the product engineer's instructions, thus ending the OCAP process.

[0053] The aforementioned OCAP process, by clearly defining the responsible departments and handling actions at each stage, forms a standardized closed-loop operation from anomaly confirmation, cause analysis, impact assessment, customer handling, correction and re-entry to resumption of production, ensuring that RCS verification anomaly batches are handled in a standardized and traceable manner.

[0054] In another alternative implementation, please refer to Figure 7The step S50, in which the report inspection system notifies the manufacturing execution system to allow the current batch of chips to pass through the station normally, includes sub-steps S51 and S52.

[0055] Step S51: The report inspection system sends a pass signal to the manufacturing execution system.

[0056] In step S52, the manufacturing execution system responds to the detection pass signal and allows the chips of the current batch to pass through the station normally and enter the next process.

[0057] Understandably, if there are no programming errors or incorrect component mixing in the current batch, the report checking system sends a pass signal to the manufacturing execution system via the API interface. In response to this pass signal, the manufacturing execution system allows the batch of chips to pass through the station normally and automatically flows to the next production process, ensuring the smooth flow of qualified batches of chips.

[0058] Furthermore, to achieve traceability of the inspection process and real-time synchronization of anomaly information, in one optional implementation method, please refer to [link to implementation details]. Figure 8 The method for detecting chip programming errors or incorrect material mixing provided in this application embodiment further includes the following steps: In step S60, after completing the comparison of the burned values ​​and the chip identifier, the report inspection system generates a log file and stores it in a preset local path. The log file contains the detection time, batch number, inspection results for each test item, and the abnormal chip number.

[0059] In step S70, when it is determined that there is a burning error or incorrect mixing of materials in the current batch, the report inspection system will send the log file to the preset recipient email address via email.

[0060] Understandably, by automatically generating and storing log files locally, the system fully records the key information of each inspection, providing reliable data support for subsequent quality traceability and anomaly analysis. At the same time, the report inspection system can proactively trigger email alerts when an anomaly is detected, and can synchronize the anomaly information to relevant engineers in real time, ensuring that anomalies are responded to and handled in a timely manner, thereby improving the efficiency of anomaly handling and closed-loop management capabilities.

[0061] Please see Figure 9 , Figure 9 This illustration shows a schematic diagram of the operating interface of an RCS system (i.e., a report inspection system) provided in an embodiment of this application. The RCS system integrates an automatic STDF / CSV test data parsing module, an SQL database processing module, a verification algorithm processing module, a data linkage module with the MES system API interface, an automatic email sending module, and more.

[0062] In summary, this application achieves accurate detection of programming errors and incorrect component mixing by automatically parsing FT test data through the RCS system and comparing the programming values ​​of each chip with the chip identifier using the SOL database. Simultaneously, through linkage with the MES system, it automatically intercepts abnormal batches and triggers the OCAP process, forming a closed-loop control system of detection, interception, handling, and release. This application effectively improves testing efficiency and accuracy, ensuring the quality of chips leaving the factory.

[0063] Based on the above methodological concept, in one optional implementation, please refer to... Figure 10 This application also provides an apparatus 100 for detecting chip test programming errors or incorrect component mixing in an embodiment. This apparatus is applied to a report checking system and is used to perform the method for detecting chip test programming errors or incorrect component mixing as described in any of the foregoing embodiments. Specifically, the apparatus includes: The acquisition module 110 is used to acquire the test data file obtained after the final testing process of the current batch of chips is completed.

[0064] The parsing module 120 is used to parse the test data file, extract the programming values ​​and chip identifiers of each chip in the current batch, and upload them to the database.

[0065] The comparison module 130 is used to compare the programming value and chip identifier of each chip in the current batch with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch.

[0066] The linkage module 140 is used to trigger the runaway action plan process in the manufacturing execution system when there is a burning error or incorrect mixing in the current batch; when there is no burning error or incorrect mixing in the current batch, it notifies the manufacturing execution system to allow the chips of the current batch to pass through normally.

[0067] Specific limitations regarding the device 100 for detecting chip programming errors or incorrect component mixing can be found in the above-described limitations regarding the method for detecting chip programming errors or incorrect component mixing, and will not be repeated here. Each module in the aforementioned device 100 for detecting chip programming errors or incorrect component mixing can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in the electronic device in hardware form, or stored in the memory of the electronic device in software form, so that the processor can call and execute the corresponding operations of each module.

[0068] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0069] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A method for detecting chip testing and programming errors or incorrect component mixing, characterized in that, The method includes the following steps: The report inspection system retrieves the test data file obtained after the final testing process is completed for the current batch of chips. The test data file is parsed to extract the programming values ​​and chip identifiers of each chip in the current batch, and then uploaded to the database. The programming value and chip identifier of each chip in the current batch are compared with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch. If there is a burning error or incorrect mixing of materials in the current batch, the report inspection system will trigger the out-of-control action plan process in the manufacturing execution system. If there are no programming errors or incorrect material mixing in the current batch, the report checking system notifies the manufacturing execution system to allow the chips in the current batch to pass through normally.

2. The method for detecting chip programming errors or incorrect material mixing according to claim 1, characterized in that, The steps of comparing the programmed values ​​and chip identifiers of each chip in the current batch with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch include: The programming value of each chip in the current batch is compared with the corresponding programming target value in the database. If the programming value is inconsistent with the programming target value, it is determined that there is a programming error in the current batch. The chip identifier of each chip in the current batch is compared with the chip identifier of the historical batches in the database. If the chip identifier has a matching item in the historical batch record, it is determined that there is a mismixing of materials in the current batch.

3. The method for detecting chip programming errors or incorrect material mixing according to claim 2, characterized in that, The steps for comparing the programming value of each chip in the current batch with the corresponding programming target value in the database, and determining that there is a programming error in the current batch if the programming value is inconsistent with the programming target value, include: Read the target value for programming the test item corresponding to the current chip from the database; Compare the current programming value of the chip with the programming target value; If the current programming value of the chip is inconsistent with the programming target value, it is determined that there is a programming error in the current chip. If at least one chip in the current batch is determined to have a programming error, then the current batch is determined to have a programming error.

4. The method for detecting chip programming errors or incorrect material mixing according to claim 2, characterized in that, The steps of comparing the chip identifier of each chip in the current batch with the chip identifiers of historical batches in the database to check for duplicates, and determining that there is a mismixing of materials in the current batch if a matching entry exists in the historical batch records, include: The chip identifier of the current chip is compared with the chip identifiers of the remaining chips in the current batch and the chip identifiers of all chips in the historical batches stored in the database for duplicate checking; If the chip identifier of the current chip has a matching item in the current batch or in the historical batch record, it is determined that the current chip has been mixed up. If at least one chip in the current batch is determined to be a mismixed component, then the current batch is determined to contain mismixed components.

5. The method for detecting chip programming errors or incorrect material mixing according to claim 1, characterized in that, The steps by which the report inspection system obtains the test data file of the current batch of chips after the final testing process are as follows: After completing the final testing process for the current batch of chips, the automatic testing machine generates a test data file and uploads the test data file to the data server. The report checking system reads the test data file from the data server.

6. The method for detecting chip programming errors or incorrect material mixing according to claim 1, characterized in that, The steps by which the report inspection system triggers the out-of-control action plan process in the manufacturing execution system include: The report checking system sends a detection failure signal to the manufacturing execution system; In response to the detection failure signal, the manufacturing execution system intercepts the current batch from passing through the station and initiates the out-of-control action plan process.

7. The method for detecting chip programming errors or incorrect component mixing according to claim 1, characterized in that, The steps by which the report checking system notifies the manufacturing execution system to allow the current batch of chips to pass through normally include: The report checking system sends a pass signal to the manufacturing execution system; The manufacturing execution system responds to the detection pass signal, allowing the current batch of chips to pass through the station normally and proceed to the next process.

8. The method for detecting chip programming errors or incorrect material mixing according to claim 1, characterized in that, The report checking system communicates with the manufacturing execution system via an application programming interface.

9. The method for detecting chip programming errors or incorrect material mixing according to claim 1, characterized in that, The method further includes: After performing the comparison of the burned values ​​and the comparison of the chip identifiers, the report inspection system generates a log file and stores it in a preset local path; wherein, the log file contains the detection time, batch number, inspection results of each test item and abnormal chip number; When it is determined that there is a burning error or incorrect mixing of materials in the current batch, the report inspection system will send the log file to a preset recipient email address via email.

10. An apparatus for detecting chip testing and programming errors or incorrect component mixing, characterized in that, Applied to the report inspection system, the apparatus is used to perform the method for detecting chip test programming errors or mismixing as described in any one of claims 1-9, the apparatus comprising: The acquisition module is used to acquire the test data file obtained after the final testing process of the current batch of chips is completed; The parsing module is used to parse the test data file, extract the programming values ​​and chip identifiers of each chip in the current batch, and upload them to the database; The comparison module is used to compare the programming value and chip identifier of each chip in the current batch with the corresponding data in the database to determine whether there are programming errors or incorrect mixing of materials in the current batch. The linkage module is used to trigger the runaway action plan process in the manufacturing execution system when there is a programming error or incorrect mixing in the current batch; when there is no programming error or incorrect mixing in the current batch, it notifies the manufacturing execution system to allow the chips of the current batch to pass through normally.

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