Full-band sensor and full-band detection device

Abstract

The invention discloses a full-band sensor and a full-band detection device.The full-band sensor comprises an HFCT layer set, an antenna layer set and a shielding layer set, the HFCT layer set comprises sensing units and a base body, a plurality of grooves are formed in the base body, the sensing units are installed in the corresponding grooves, and the multiple sensing units are sequentially connected in series to form a winding; the antenna layer group comprises a first insulating layer and a first conductor layer, the first insulating layer and the first conductor layer are stacked, and a first conductive pattern is arranged on the first conductor layer; the shielding layer group comprises a second insulating layer, a third insulating layer and a second conductor layer, the base body, the second insulating layer, the second conductor layer, the third insulating layer and the first conductor layer are sequentially stacked, the second conductor layer is provided with a copper layer, and the capacitive voltage divider is formed among the second conductor layer, the third insulating layer, the first conductor layer, the first insulating layer and the iron core. According to the invention, synchronous acquisition of high-frequency partial discharge, ultrahigh frequency, overvoltage, common frequency and harmonic signals thereof is realized.

Description

Technical Field

[0001] This invention relates to the field of transformer core grounding signal detection technology, and in particular to a full-band sensor and a full-band detection device. Background Technology

[0002] In current power systems, the detection of transformer core grounding signals mainly falls into two categories: one is high-frequency partial discharge detection, used to identify whether there is a partial discharge fault inside the transformer; the other is power frequency and its harmonic signal detection, mainly used to determine whether a multi-point grounding fault has occurred in the core. In practical applications, these two detection methods typically operate independently, lacking information fusion and correlation analysis mechanisms.

[0003] However, engineering practice and fault mechanism research show that there is a coupling relationship between partial discharge faults and core multi-point grounding faults. On the one hand, severe partial discharge may trigger arcing or metal particle migration, leading to core multi-point grounding; on the other hand, core multi-point grounding can increase circulating current and cause local overheating, accelerating the aging of insulation materials, thereby inducing or exacerbating partial discharge. In addition to the two types of signals mentioned above, the transformer core grounding circuit may also contain transient overvoltage signals caused by lightning strikes, switching operations, etc. Current technologies generally use isolated, single detection methods to process different types of signals separately, failing to achieve unified acquisition of four key signals: high-frequency partial discharge signals, power frequency and harmonic signals, and overvoltage signals. This results in the inability to fully utilize all the effective information in the core grounding signal during detection, making it difficult to determine whether there is a correlation between the four types of signals. Summary of the Invention

[0004] The technical problem to be solved by the present invention is that the existing technology generally adopts isolated and single detection methods to process different types of signals separately, and fails to achieve unified acquisition of four key signals such as high-frequency partial discharge signals, power frequency and harmonic signals, and overvoltage signals. As a result, it is impossible to fully utilize all the effective information in the core grounding signal during detection, and it is difficult to determine whether there is a correlation between the four types of signals.

[0005] To address the aforementioned technical problems, this invention provides a full-bandwidth sensor for detecting transformer core grounding signals. The full-bandwidth sensor comprises: The HFCT layer group is used to collect high-frequency partial discharge signals in the core grounding signal. The HFCT layer group includes multiple sensing units and a substrate composed of multiple first PCB boards stacked sequentially. The substrate has multiple grooves spaced apart along its length. The sensing units are installed in the corresponding grooves, and multiple sensing units are connected in series to form a winding. An antenna layer assembly includes a first insulating layer and a first conductive layer, the first insulating layer and the first conductive layer being stacked. A first conductive pattern, serving as an antenna, is disposed on the first conductive layer. The first conductive pattern is used to acquire ultra-high frequency signals, and the first conductive pattern is connected in series with the winding. The shielding layer assembly includes a second insulating layer, a third insulating layer, and a second conductor layer. The substrate, the second insulating layer, the second conductor layer, the third insulating layer, and the first conductor layer are stacked sequentially, and the second conductor layer is provided with a copper layer to form a shield. The second conductor layer, the third insulating layer, the first conductor layer, the first insulating layer, and the iron core together form a capacitive voltage divider to collect the power frequency and its harmonic signals, and overvoltage signals in the iron core grounding signal.

[0006] Furthermore, the sensing unit includes a magnetic core and a wire. The magnetic core is disposed in the corresponding groove, and the inner wall of the groove is provided with a second conductive pattern as a wire to surround the outer periphery of the magnetic core. Multiple second conductive patterns are connected in series.

[0007] Furthermore, the groove is rectangular, and the wire is composed of multiple layers of concentric ring-shaped second wire patterns connected sequentially.

[0008] Furthermore, both ends of the winding are connected to sampling resistors.

[0009] Furthermore, the HFCT layer group also includes a fourth insulating layer, which is stacked on the side of the substrate opposite to the second insulating layer.

[0010] Furthermore, it also includes a BNC connector, to which the winding, the first conductive pattern, and the capacitive voltage divider are all electrically connected.

[0011] Furthermore, the antenna layer group also includes a fifth insulating layer, which is stacked on the side of the first conductor layer opposite to the first insulating layer.

[0012] Furthermore, the capacitive voltage divider includes a first capacitor and a second capacitor. The first conductor layer, the first insulating layer, and the iron core form a first-stage capacitor, and the second conductor layer, the third insulating layer, and the first conductor layer form a second-stage capacitor.

[0013] Furthermore, it also includes an outer casing, the inner wall of which is provided with a sixth insulating layer to form an insulating cavity, and the HFCT layer group, the antenna layer group and the shielding layer group are disposed within the insulating cavity.

[0014] The present invention also provides a full-band detection device, including a filter, a protection module, a data acquisition device, and a full-band sensor as described above, wherein the full-band sensor, the protection module, the filter, and the data acquisition device are electrically connected in sequence.

[0015] Compared with the prior art, the full-band sensor and full-band detection device of this invention have the following advantages: This invention integrates an HFCT, antenna, and capacitor voltage divider structure into a single unit using a multilayer PCB board. This allows for the synchronous acquisition of high-frequency partial discharge, ultra-high frequency, overvoltage, and common frequency and harmonic signals in a compact device. Furthermore, when measuring high-frequency partial discharge signals, the ultra-high frequency signal can be used to determine whether the high-frequency partial discharge signal measured by the HFCT layer group is interference within the same signal segment, thus avoiding the problem that independent measurements cannot correlate and analyze the four types of signals. Attached Figure Description

[0016] The present application will be further described in detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will appreciate that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be construed as limiting the scope of the present application. Furthermore, unless specifically indicated, the drawings are intended only to conceptually represent the composition or structure of the described objects and may contain exaggerated representations, and the drawings are not necessarily drawn to scale.

[0017] Figure 1 This is a first cross-sectional view of the full-band sensor provided in an embodiment of the present invention; Figure 2 This is a second cross-sectional view of the full-band sensor provided in an embodiment of the present invention; Figure 3 This is a top view of the full-band sensor provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the substrate provided in an embodiment of the present invention; Figure 5 This is a top view of the first conductor layer provided in an embodiment of the present invention; Figure 6 This is a spectrum diagram of the power frequency and harmonic signals extracted by the full-band detection device provided in this embodiment of the invention; Figure 7 This is a waveform diagram of the extracted pulse signal from the full-band detection device provided in this embodiment of the invention; Figure 8 This is a pulse response diagram of the identification pulse signal of the full-band detection device provided in this embodiment of the invention; Figure 9 This is a graph showing the power frequency voltage test results of the full-band detection device provided in this embodiment of the invention; Figure 10This is a graph showing the lightning impulse test results of the full-band detection device provided in this embodiment of the invention; Figure 11 This is a diagram showing the operational impact test results of the full-band detection device provided in this embodiment of the invention; Figure 12 This is a partial discharge detection result diagram of the full-band detection device provided in this embodiment of the invention; In the diagram, 1. HFCT layer group; 11. Sensing unit; 111. Magnetic core; 112. Wire; 12. Substrate; 121. Groove; 13. Fourth insulating layer; 2. Antenna layer group; 21. First insulating layer; 22. First conductor layer; 221. First conductive pattern; 23. Fifth insulating layer; 3. Shielding layer group; 31. Second insulating layer; 32. Third insulating layer; 33. Second conductor layer; 4. BNC connector; 5. Sixth insulating layer. Detailed Implementation

[0018] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0019] It should be noted that, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "fixing," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. When a component is referred to as being "on" or "below" another component, that component can be located "directly" or "indirectly" on the other component, or there may be one or more intermediary components.

[0020] Furthermore, the terms "first," "second," "third," "fourth," etc., are used only for the convenience of describing this technical solution and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," "third," "fourth," etc., may explicitly or implicitly include one or more of that feature. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] like Figures 1 to 5As shown, this invention provides a full-band sensor for detecting transformer core grounding signals. The full-band sensor includes an HFCT layer group 1, an antenna layer group 2, and a shielding layer group 3. The HFCT layer group 1 is used to collect high-frequency partial discharge signals in the core grounding signal. The HFCT layer group 1 includes multiple sensing units 11 and a substrate 12 composed of multiple first PCB boards stacked sequentially. The substrate 12 has multiple grooves 121 spaced apart along its length. The sensing units 11 are installed in the corresponding grooves 121 (e.g., ...). Figure 4 As shown, multiple sensing units 11 are connected in series to form a winding for capturing high-frequency pulse currents generated by partial discharge. When a high-frequency partial discharge current flows through the iron core grounding wire, it generates a changing magnetic flux as it flows through the sensing unit 11, causing the winding to convert it into a corresponding voltage signal and output it. The antenna layer group 2 includes a first insulating layer 21 and a first conductor layer 22, which are stacked together. The first conductor layer 22 has a first conductive pattern 221 as an antenna. The first conductive pattern 221 is used to acquire ultra-high frequency signals, and the first conductive pattern 221 is connected in series with the winding to form an output signal VOUT. When acquiring high-frequency partial discharge signals, the signals of the two are added together for output; the shielding layer group 3 includes a second insulating layer 31, a third insulating layer 32 and a second conductor layer 33. The substrate 12, the second insulating layer 31, the second conductor layer 33, the third insulating layer 32 and the first conductor layer 22 are stacked in sequence, and the second conductor layer 33 is provided with a copper layer to form a shield to ensure that the HFCT layer group 1 and the antenna layer group 2 do not interfere with each other; wherein, the second conductor layer 33, the third insulating layer 32, the first conductor layer 22, the first insulating layer 21 and the iron core form a capacitive voltage divider to acquire the power frequency and its harmonic signals and overvoltage signals in the iron core grounding signal.

[0022] In this embodiment, the full-band sensor integrates the HFCT, antenna, and capacitor voltage divider structure into one unit through a multi-layer PCB board. This enables the synchronous acquisition of high-frequency partial discharge, ultra-high frequency, overvoltage, and common frequency and harmonic signals in a compact device. At the same time, when measuring high-frequency partial discharge signals, the UHF signal can be used to determine whether the high-frequency partial discharge signal measured by HFCT layer group 1 is interference within the same signal segment, avoiding the problem that independent measurements cannot correlate and analyze the four types of signals.

[0023] Understandably, this embodiment integrates the above functions into a single sensor for detecting transformer core grounding signals, reducing the complexity of the equipment and the difficulty of installation, while also lowering costs.

[0024] Further, the sensing unit 11 includes a magnetic core 111 and a wire 112. The magnetic core 111 can be made of a soft magnetic material with high magnetic permeability and low loss, which is used to concentrate and guide the alternating magnetic field generated by the high-frequency current in the grounding wire. The magnetic core 111 is disposed in the corresponding groove 121, and the inner wall of the groove 121 is provided with a second conductive pattern serving as the wire 112. The second conductive pattern surrounds the outer peripheral side of the magnetic core 111 to sense the magnetic field change and output a voltage signal. A plurality of second conductive patterns are connected in series in sequence to form a series-wound winding loop, which can enhance the output of the induced voltage and improve the signal-to-noise ratio.

[0025] Based on the above structure, when a high-frequency pulse current generated by partial discharge flows through the grounding wire of the transformer core, a rapidly changing magnetic field will be generated in the magnetic core 111. The second conductive pattern surrounding the magnetic core 111 induces a voltage signal, so that the above high-frequency signal can be collected and analyzed. It can be understood that the soft magnetic material in this embodiment is ferrite or amorphous alloy. In addition, the second conductive pattern in this embodiment can be formed on the inner wall surface of the groove 121 by etching, or can be arranged by welding the wire 112 or other means, and no special limitation is imposed on this here.

[0026] Further, the groove 121 is rectangular, and the shape of the groove 121 matches the magnetic core 111 to ensure that the magnetic core 111 can be stably installed in the groove 121. The wire 112 is composed of a plurality of second wire 112 patterns in a multi-layered figure-eight shape connected in sequence. That is, a spiral wire similar to a figure-eight is arranged on the substrate 12, and each layer is a figure-eight coil, forming a complete multi-turn coil to improve the integration degree of the HFCT layer group 1.

[0027] Through the above structure, a planar structure layer with HFCT function in this embodiment is constituted, making it more suitable for measuring the core grounding signal. Based on the above planar structure layer, it is convenient to combine with the antenna layer group 2 and the shielding layer group 3 to form a full-band sensor. It can be understood that one layer of winding in this embodiment is one figure-eight coil, and the total number of winding turns is the number of layers of the figure-eight coil multiplied by the number of magnetic cores 111.

[0028] Further, both ends of the winding are respectively connected to a sampling resistor to form a closed loop to convert the induced current into a measurable voltage signal. It can be understood that a high-frequency current will be induced in the winding. By connecting a sampling resistor in the winding loop and using Ohm's law, the induced current is converted into a voltage signal proportional to it, which is convenient for subsequent processing and analysis.

[0029] The voltage output at both ends of the sampling resistor in this embodiment is used as the first PCB output signal of this full-band sensor. When the antenna collects the ultra-high frequency signal and outputs a voltage signal, it is used as the second PCB output signal.

[0030] Furthermore, the HFCT layer group 1 also includes a fourth insulating layer 13, which is stacked on the side of the substrate 12 away from the second insulating layer 31, in order to cooperate with other insulating layers to maintain the stability of the electromagnetic field and reduce the impact of external interference on high-frequency signal detection.

[0031] Specifically, in this embodiment, the fourth insulating layer 13 is an aluminum foil, which is used to cover the surface of the substrate 12 to prevent external magnetic field interference.

[0032] Furthermore, the antenna layer group 2 also includes a fifth insulating layer 23, which is stacked on the side of the first conductor layer 22 opposite to the first insulating layer 21.

[0033] In this embodiment, insulating layers are provided on both sides of the first conductor layer 22 to facilitate the integration of the antenna with the HFCT layer group 1 and the shielding layer group 3. Furthermore, the thickness and dielectric constant of the insulating layer directly affect the input impedance of the antenna; by providing insulating layers on both sides, impedance matching design can be performed more flexibly.

[0034] Understandably, the fifth insulating layer 23 in this embodiment can also be used in conjunction with grounding to form a shield, reducing external interference or preventing the antenna from coupling to other signal lines.

[0035] Furthermore, the capacitive voltage divider includes a first capacitor and a second capacitor. The first conductor layer 22, the first insulating layer 21, and the iron core constitute the first stage capacitor; that is, the iron core acts as the lower plate, the first conductor layer 22 acts as the upper plate, and the first insulating layer 21 acts as the dielectric. Together, they form a parallel-plate capacitor. The second conductor layer 33, the third insulating layer 32, and the first conductor layer 22 constitute the second stage capacitor; that is, the first conductor layer 22 acts as the lower plate, the second conductor layer 33 acts as the upper plate, and the third insulating layer 32 acts as the dielectric. Together, they form another parallel-plate capacitor.

[0036] The capacitive voltage divider in this embodiment constructs a two-stage series capacitor using a first conductor layer 22, a second conductor layer 33, a first insulating wire, and a third insulating layer 32. Understandably, the iron core may carry a floating potential or induced voltage of several thousand volts, which poses a danger if measured directly. By isolating this potential with an insulating medium in the capacitive voltage divider, voltage sensing without direct electrical connection is achieved, ensuring the safety of the monitoring system. Simultaneously, the first conductor layer 22 serves as both an antenna and the intermediate electrode of the capacitive voltage divider, while the second conductor layer 33 serves as both the shielding layer group 3 and the grounding terminal of the voltage divider. This results in a high degree of integration in the capacitive voltage divider structure, eliminating the need for additional structures to collect power frequency and harmonic signals, as well as overvoltage signals, from the iron core grounding signal. This makes the overall structure more compact, reducing the space required for installation.

[0037] In practical applications, the size of the two capacitors can be controlled by controlling the thickness of the first insulating layer 21 and the third insulating layer 32, thereby controlling the voltage division ratio. This allows the shielding layer group 3 to output the voltage signal flowing through the iron core grounding wire proportionally, which is used to monitor the iron core grounding status. When the iron core experiences multiple grounding points, an overvoltage will be generated on the iron core grounding wire. The abnormal voltage signal can be collected by the capacitive voltage divider formed by the shielding layer group 3 and the PCB, indicating that the transformer may be malfunctioning. This is the third PCB output signal.

[0038] Furthermore, it also includes a coaxial BNC connector 4, and the winding, the first conductive pattern 221, and the capacitive voltage divider are all electrically connected to the BNC connector 4.

[0039] In this embodiment, the winding, the first conductive pattern 221, and the capacitive voltage divider are all electrically connected to the BNC connector 4. The composite signal is output to external monitoring equipment through this BNC connector 4, eliminating the need for multiple connectors for different frequency bands, saving space, reducing costs, and improving reliability. It can be understood that the BNC connector 4 in this embodiment has a coaxial structure, comprising a central coaxial body and a shell. The central coaxial body is a solid cylinder, and the shell is a hollow cylinder. This coaxial structure provides good shielding, preventing electromagnetic interference to high-frequency signals during transmission and ensuring that weak signals such as partial discharge are not distorted.

[0040] Specifically, in this embodiment, the first and second PCB output signals are connected in series to form a single output signal, while the third PCB output signal is a separate output signal. These three signals together constitute the signal output of the full-bandwidth sensor, and the overall output is achieved through the BNC connector 4. In this embodiment, the output signal of the full-bandwidth sensor can be acquired by collecting the signal from the BNC connector 4.

[0041] Furthermore, it also includes an outer casing, on the inner side wall of which a sixth insulating layer 5 is provided to form an insulating cavity. The HFCT layer group 1, the antenna layer group 2, and the shielding layer group 3 are disposed in the insulating cavity to protect the HFCT layer group 1, the antenna layer group 2, and the shielding layer group 3, and at the same time prevent electrical breakdown or leakage between the internal HFCT layer group 1, the antenna layer group 2, and the shielding layer group 3 and the outer casing, respectively.

[0042] This invention also provides a full-band detection device, including a filter, a protection module, a data acquisition device, and a full-band sensor as described above. The full-band sensor, protection module, filter, and data acquisition device are electrically connected in sequence. In practical applications, the full-band sensor can be installed on the transformer core grounding wire simply by rolling a strip.

[0043] In practical applications, full-band sensors are directly exposed to the external environment, which may introduce high voltage or strong interference. Therefore, a protection module is set up to provide electrical protection for subsequent circuits or equipment, preventing damage to sensitive components due to abnormal signals such as overvoltage, overcurrent, surge, and electrostatic discharge (ESD). Specifically, this embodiment uses a TVS diode as a protection measure to prevent the full-band sensor output signal from being too large and damaging subsequent filters and acquisition devices.

[0044] Before the signal enters the acquisition device, the filter performs frequency-selective processing on the raw signal output by the full-band sensor. Understandably, in practical applications, only specific frequency bands may be needed, or interference noise (such as power frequency interference, high-frequency noise, etc.) may need to be filtered out. If it is necessary to analyze a certain type of signal separately, the filter is used to filter it out, including power frequency and its harmonic filtering (1kHz low-pass filter); overvoltage filtering (1MHz low-pass filter); high-frequency partial discharge signal filtering (1-100MHz band-pass filter); ultra-high frequency filtering (300MHz high-pass filter). That is, the filter removes useless frequency bands or noise, thereby improving the acquisition quality and dynamic range.

[0045] Finally, the conditioned analog signal is converted into a digital signal by the acquisition device and recorded, stored or transmitted. In this embodiment, a signal acquisition card is used to acquire the signal with a bandwidth of 200MHz and a sampling rate of 100M / s.

[0046] In practical applications, signal calculations for full-band sensor signals can be performed using the following methods: like Figure 6 As shown, when extracting power frequency and harmonic signals, wavelet multi-scale decomposition and windowed interpolation FFT can be combined to extract power frequency and harmonic signals. This method combines multi-level bandwidth compression with refined spectral analysis, effectively suppressing broadband noise and non-target frequency components while ensuring the accuracy of harmonic parameter estimation. Specifically: First, the original high-sampling-rate core grounding current signal is resampled with anti-aliasing to reduce the data size. Then, the resampled signal undergoes a first discrete wavelet decomposition to extract low-frequency components containing the power frequency and major harmonics. Next, windowed interpolation FFT is performed on the target frequency band signal to obtain the frequency, amplitude, and phase of the power frequency and harmonics. Finally, a second wavelet decomposition is performed on the low-frequency components to reconstruct the power frequency and low-order harmonic signals. In this embodiment, the power frequency and harmonic signals can be obtained by performing the above calculations on the output VOUT of the full-bandwidth sensor.

[0047] like Figure 7 As shown, in addition, when extracting pulse signals, pulses can be detected and extracted based on Hilbert envelope analysis and adaptive threshold determination, which can stably extract high-frequency impact pulses, as detailed below: First, the original signal is subjected to DC removal and low-pass filtering to suppress baseline drift and broadband noise. Then, the signal envelope is calculated based on Hilbert transform and smoothed. Next, the background signal characteristics are determined by a sliding reference window, and the window with the smallest first-order variance is selected to adaptively generate the detection threshold. At the same time, bidirectional boundary search is performed starting from the envelope peak to determine the start and end positions of a single pulse. Finally, adjacent pulses are merged in the time domain to obtain the final effective pulse set.

[0048] like Figure 8 As shown, this embodiment can also use SVM technology to perform pulse identification on the signal acquired from the VOUT output, clarifying the pulse source and improving accuracy. Finally, the transformer core grounding signal is detected using the aforementioned full-band sensor, and the test results are as follows. Figures 9 to 12 As shown in the figure, the test results show that the full-band sensor can detect the core grounding current signal under four operating conditions: power frequency voltage, lightning impulse, switching impulse, and partial discharge. The detected waveform is consistent with the flaw-indicating resistor, indicating that the full-band sensor meets the measurement requirements of the core grounding current across the entire frequency band.

[0049] In summary, the embodiments of the present invention provide a full-band sensor and a full-band detection device, which integrates an HFCT, an antenna, and a capacitor voltage divider structure into one unit through a multi-layer PCB board. This enables the synchronous acquisition of high-frequency partial discharge, ultra-high frequency, overvoltage, and common frequency and harmonic signals in a compact device. At the same time, when measuring high-frequency partial discharge signals, the high-frequency partial discharge signal measured by HFCT layer group 1 can be used to determine whether it is interference in the same signal segment by using the ultra-high frequency signal, thus avoiding the problem that independent measurements cannot correlate and analyze the four types of signals.

[0050] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A full-bandwidth sensor, characterized in that, The full-band sensor is used for detecting transformer core grounding signals, and the full-band sensor includes: The HFCT layer group is used to collect high-frequency partial discharge signals in the core grounding signal. The HFCT layer group includes multiple sensing units and a substrate composed of multiple first PCB boards stacked sequentially. The substrate has multiple grooves spaced apart along its length. The sensing units are installed in the corresponding grooves, and multiple sensing units are connected in series to form a winding. An antenna layer assembly includes a first insulating layer and a first conductive layer, the first insulating layer and the first conductive layer being stacked. A first conductive pattern, serving as an antenna, is disposed on the first conductive layer. The first conductive pattern is used to acquire ultra-high frequency signals, and the first conductive pattern is connected in series with the winding. The shielding layer assembly includes a second insulating layer, a third insulating layer, and a second conductor layer. The substrate, the second insulating layer, the second conductor layer, the third insulating layer, and the first conductor layer are stacked sequentially, and the second conductor layer is provided with a copper layer to form a shield. The second conductor layer, the third insulating layer, the first conductor layer, the first insulating layer, and the iron core together form a capacitive voltage divider to collect the power frequency and its harmonic signals, and overvoltage signals in the iron core grounding signal.

2. The full-band sensor according to claim 1, characterized in that, The sensing unit includes a magnetic core and a wire. The magnetic core is disposed in the corresponding groove, and the inner wall of the groove is provided with a second conductive pattern as a wire to surround the outer periphery of the magnetic core. Multiple second conductive patterns are connected in series.

3. The full-band sensor according to claim 2, characterized in that, The groove is rectangular, and the wire is composed of multiple layers of a square-shaped second wire pattern connected sequentially.

4. The full-band sensor according to claim 1, characterized in that, The two ends of the winding are respectively connected to the sampling resistor.

5. The full-band sensor according to claim 1, characterized in that, The HFCT layer group further includes a fourth insulating layer, which is stacked on the side of the substrate opposite to the second insulating layer.

6. The full-band sensor according to claim 1, characterized in that, It also includes a coaxial BNC connector, and the winding, the first conductive pattern and the capacitive voltage divider are all electrically connected to the BNC connector.

7. The full-band sensor according to claim 1, characterized in that, The antenna layer group further includes a fifth insulating layer, which is stacked on the side of the first conductor layer opposite to the first insulating layer.

8. The full-band sensor according to claim 1, characterized in that, The capacitive voltage divider includes a first capacitor and a second capacitor. The first conductor layer, the first insulating layer and the iron core form a first-stage capacitor, and the second conductor layer, the third insulating layer and the first conductor layer form a second-stage capacitor.

9. The full-band sensor according to claim 1, characterized in that, It also includes an outer casing, the inner wall of which is provided with a sixth insulating layer to form an insulating cavity, and the HFCT layer group, the antenna layer group and the shielding layer group are disposed within the insulating cavity.

10. A full-band detection device, characterized in that, It includes a filter, a protection module, a data acquisition device, and a full-band sensor as described in any one of claims 1-9, wherein the full-band sensor, the protection module, the filter, and the data acquisition device are electrically connected in sequence.

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