Radio frequency front end and antenna array integrated packaging device for millimeter wave radar

Abstract

A radio frequency front end and antenna array integrated packaging device for a millimeter wave radar disclosed by the present invention comprises a mainboard, a radar chip and an antenna module, the radar chip and the antenna module are distributed and installed on the upper surface and the lower surface of the mainboard, the outer sides of the radar chip and the antenna module are both provided with baffle plates, and the baffle plates are arranged on the upper surface and the lower surface of the mainboard. The inner side faces of the baffles are each provided with a frame, a sealing cavity is formed between each frame and the corresponding baffle, the radar chip and the antenna module are sleeved with the sealing cavities, the sealing cavities package the radar chip and the antenna module, the opposite faces of the baffles are each provided with a transverse rod, the two sides of each transverse rod are each provided with a protection piece, and one side of the mainboard is provided with a driving mechanism for driving the protection pieces to stretch outwards. According to the invention, the structure is simple, normal packaging protection of the radar chip and the antenna module is realized through the movable protection sheet and the sealing cavity structure, temporary protection of other electronic components on the mainboard can be rapidly formed during maintenance, and the safety and maintenance convenience of equipment are improved.

Description

Technical Field

[0001] This invention relates to the field of radar technology, and more specifically to an integrated packaging device for a radio frequency front-end and antenna array used in millimeter-wave radar. Background Technology

[0002] Millimeter-wave radar is a sensor technology that uses electromagnetic waves in the millimeter-wave frequency band for detection, ranging, velocity measurement, and imaging. It obtains target information by transmitting millimeter-wave signals and receiving the echoes reflected from targets, and by analyzing the time difference (ranging), frequency changes (velocity measurement, Doppler effect), and phase difference (shape and angle identification) of the echoes.

[0003] Currently, the radio frequency front-end (radar chip) and antenna array (antenna module) inside millimeter-wave radar lack external encapsulation, resulting in direct exposure, which affects safety. Furthermore, during subsequent disassembly, there is a lack of protection for the electronic components on the motherboard, making them prone to scratches and damage during movement and removal. Summary of the Invention

[0004] To address the aforementioned problems, this invention provides an integrated packaging device for a radio frequency front-end and antenna array used in millimeter-wave radar, which can enclose and package the radar chip and antenna module to solve the problems mentioned in the background art.

[0005] This invention is achieved through the following technical solution: an integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar, comprising a motherboard, a radar chip, and an antenna module. The radar chip and antenna module are distributed and installed on the upper and lower surfaces of the motherboard. A baffle is provided on the outer side of the radar chip and the antenna module, and a frame is installed on the inner side of the baffle. A sealed cavity is formed between the frame and the baffle. The sealed cavity is fitted over the radar chip and the antenna module and encapsulates them. A crossbar is installed on the opposite side of the baffle, and protective plates are installed on both sides of the crossbar. A drive mechanism is installed on one side of the motherboard to pull the protective plates outward.

[0006] As a preferred technical solution, the drive mechanism includes a gripping rod and multiple lead screws. Connecting seats are installed on both sides of the protective plate. Each connecting seat on one side is provided with a lead screw hole. The crossbar is provided with mounting holes directly opposite the lead screw holes. A first bearing is installed in each mounting hole. The lead screws are installed in the inner ring of the first bearings. Both ends of the lead screws are threaded to the lead screw holes. One end of one of the lead screws is fixedly connected to the gripping rod.

[0007] As a preferred technical solution, each of the connectors on the other side is provided with a positioning hole, into which a positioning frame is inserted. Connectors are installed at both ends of the positioning frame, and one end of the connector is installed at the corner of the motherboard.

[0008] As a preferred technical solution, a fixing seat is installed at the corner of the motherboard. The fixing seat is arranged in a "T" shape. Except for the end of the fixing seat that is connected to the motherboard, the remaining two ends are embedded with second bearings. The end of the lead screw away from the handle is installed in the inner ring of the second bearing.

[0009] As a preferred technical solution, a timing pulley is installed at the end of the lead screw near the grip, and a timing belt is installed on the two timing pulleys.

[0010] As a preferred technical solution, multiple support seats are installed at both ends of the motherboard in the width direction. The bottom surface of the support seat is lower than the bottom surface of the crossbar below. Each support seat has a vertical fixing hole that passes through it.

[0011] As a preferred technical solution, the protective sheets are serpentine in shape and contracted together, and all the protective sheets are made of rubber material.

[0012] As a preferred technical solution, rubber layers are installed on the opposite surfaces of the frame, and the rubber layers are in contact with the upper and lower surfaces of the motherboard.

[0013] As a preferred technical solution, positioning grooves are provided on both sides of the motherboard along its length, and the inner side of the baffle protrudes to form positioning parts opposite to the positioning grooves, and the positioning parts are inserted into the positioning grooves.

[0014] The beneficial effects of this invention are: the invention has a simple structure, and the sealed cavity formed by the combination of baffle and frame can cover and encapsulate the radar chip and antenna module, avoiding direct external impact. When disassembling for maintenance, the grip can be rotated, and the rotation of the grip drives two lead screws, which in turn drive the connecting seat, causing the connecting seat to move outward synchronously along the positioning frame. During the movement, the protective plate that retracts together is driven, and the extended protective plate can cover the electronic components on the upper and lower surfaces of the motherboard, greatly reducing the probability of collision with electronic components during disassembly and movement. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a bottom view of the present invention; Figure 3 This is a schematic diagram of the structure of the present invention behind the personnel barrier and the frame; Figure 4This is a side view of the baffle and frame of the present invention.

[0017] The components are as follows: 1. Main board; 2. Baffle; 3. Frame; 4. Crossbar; 5. Connecting seat; 6. Lead screw; 7. Handle; 8. Synchronous pulley; 9. Synchronous belt; 10. Fixing seat; 11. Protective plate; 12. Positioning frame; 13. Connector; 14. Support seat; 15. Radar chip; 16. Positioning part; 17. Positioning groove. Detailed Implementation

[0018] All features disclosed in this specification, or all steps in all disclosed methods or processes, may be combined in any way, except for mutually exclusive features and / or steps.

[0019] Any feature disclosed in this specification (including any appended claims, abstract, and drawings) may be replaced by other equivalent or similar features for a similar purpose, unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is merely one example of a series of equivalent or similar features.

[0020] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, an integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar includes a motherboard 1, a radar chip 15, and an antenna module. The radar chip 15 and the antenna module are distributed and installed on the upper and lower surfaces of the motherboard 1. A baffle 2 is provided on the outer side of the radar chip 15 and the antenna module. A frame 3 is installed on the inner side of the baffle 2. A sealed cavity is formed between the frame 3 and the baffle 2. The sealed cavity is fitted over the radar chip 15 and the antenna module and encapsulates them. A crossbar 4 is installed on the opposite side of the baffle 2. Protective plates 11 are installed on both sides of the crossbar 4. A drive mechanism is installed on one side of the motherboard 1 to drive the protective plates 11 to stretch outward.

[0021] In this embodiment, the driving mechanism includes a gripping rod 7 and multiple lead screws 6. Connecting seats 5 are installed on both sides of the protective plate 11. Each connecting seat 5 on one side is provided with a lead screw hole. The crossbar 4 is provided with mounting holes directly opposite the lead screw holes. A first bearing is installed in each mounting hole. The lead screws 6 are installed in the inner ring of the first bearing. Both ends of the lead screws 6 are threadedly connected to the lead screw holes. One end of one lead screw 6 is fixedly connected to the gripping rod 7.

[0022] In this embodiment, each of the connecting seats 5 on the other side is provided with a positioning hole, into which a positioning frame 12 is inserted. Connectors 13 are installed at both ends of the positioning frame 12, and one end of the connector 13 is installed at the corner of the motherboard 1.

[0023] In this embodiment, a fixing seat 10 is installed at the corner of the main board 1. The fixing seat 10 is arranged in a "T" shape. Except for the end of the fixing seat 10 that is connected to the main board 1, the remaining two ends are embedded with second bearings. The end of the lead screw 6 away from the handle 7 is installed in the inner ring of the second bearing.

[0024] In this embodiment, a timing pulley 8 is installed on one end of the lead screw 6 near the handle 7, and a timing belt 9 is installed on the two timing pulleys 8.

[0025] In this embodiment, multiple support seats 14 are installed at both ends of the motherboard 1 in the width direction. The bottom surface of the support seat 14 is lower than the bottom surface of the lower crossbar 4. Each support seat 14 is provided with a vertical fixing hole that penetrates the support seat 14. The motherboard 1 is stably placed on the mounting surface by the support bases 14 on both sides, and the fixing holes at the bottom of the support bases 14 can be used for screw fixing.

[0026] Since the bottom surface of the support base 14 is lower than the bottom surface of the crossbar 4 below, the crossbar 4 will not directly contact the mounting surface, thus avoiding interference with the movement of the protective plate 11.

[0027] In this embodiment, the protective sheet 11 is serpentine and contracted together. All protective sheets 11 are made of rubber material, which avoids electrical conduction between the protective sheet and electronic components and increases safety.

[0028] In this embodiment, rubber layers are installed on opposite surfaces of the frame 3, and the rubber layers are in contact with the upper and lower surfaces of the motherboard 1.

[0029] In this embodiment, positioning grooves 17 are provided on both sides of the motherboard 1 along its length. The inner side of the baffle 2 protrudes from the positioning grooves 17 to form positioning parts 16, and the positioning parts 16 are inserted into the positioning grooves 17.

[0030] Working principle: When the radar is in normal working condition, the radar chip 15 on the upper surface of the main board 1 and the antenna module on the lower surface are completely covered by the sealed cavity formed by the corresponding baffle 2 and frame 3. The side of the frame 3 that contacts the main board 1 is provided with a rubber layer, which can enhance the sealing performance, prevent dust, moisture and other substances from entering, and at the same time buffer vibration and impact.

[0031] The positioning grooves 17 on both sides of the motherboard 1 cooperate with the positioning part 16 on the inner side of the baffle 2 to ensure that the position between the baffle 2 and the motherboard 1 is accurate and secure. At this time, the protective plate 11 is in a serpentine retracted state, closely attached to both sides of the crossbar 4, without occupying extra space, and also exposing the electronic components and interfaces, without affecting subsequent wiring and other operations.

[0032] When it is necessary to repair or replace the radar chip 15 or the antenna module, the operator can manually rotate the lever 7 to drive the lead screw 6 fixedly connected to it to rotate. Through the transmission of the synchronous pulley 8 and the synchronous belt 9, the other lead screw 6 rotates synchronously.

[0033] The lead screw 6 is threaded into the lead screw hole on the connecting seat 5. Since the other side of the connecting seat 5 is slidably connected to the positioning frame 12 through the positioning hole, the rotation of the lead screw 6 will drive the connecting seats 5 on both sides to move outward synchronously along the positioning frame 12.

[0034] The movement of the connecting seat 5 causes the protective plate 11 to gradually stretch outward from its retracted state.

[0035] Finally, the protective plates 11 on the top and bottom sides are fully pulled open, covering and protecting other electronic components on the motherboard 1 except for the radar chip 15 and the antenna module area, effectively reducing collisions or scratches during disassembly and movement.

[0036] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions conceived without inventive effort should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. An integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar, characterized in that: The system includes a motherboard (1), a radar chip (15), and an antenna module. The radar chip (15) and the antenna module are distributed and installed on the upper and lower surfaces of the motherboard (1). The radar chip (15) and the antenna module are provided with baffles (2) on their outer sides. A frame (3) is installed on the inner side of the baffles (2). A sealed cavity is formed between the frame (3) and the baffles (2). The sealed cavity is fitted over the radar chip (15) and the antenna module and encapsulates them. A crossbar (4) is installed on the opposite side of the baffles (2). Protective plates (11) are installed on both sides of the crossbars (4). A drive mechanism that drives the protective plates (11) to stretch outward is installed on one side of the motherboard (1).

2. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 1, characterized in that: The drive mechanism includes a grip (7) and multiple lead screws (6). Connecting seats (5) are installed on both sides of the protective plate (11). Each connecting seat (5) on one side is provided with a lead screw hole. The crossbar (4) is provided with mounting holes directly opposite the lead screw holes. A first bearing is installed in each mounting hole. The lead screws (6) are installed in the inner ring of the first bearing. Both ends of the lead screws (6) are threaded to the lead screw holes. One end of one of the lead screws (6) is fixedly connected to the grip (7).

3. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 2, characterized in that: The connector (5) on the other side is provided with positioning holes, and a positioning frame (12) is inserted into the positioning hole. Connectors (13) are installed at both ends of the positioning frame (12), and one end of the connector (13) is installed at the corner of the motherboard (1).

4. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 2, characterized in that: A mounting base (10) is installed at the corner of the main board (1). The mounting base (10) is set in a "T" shape. Except for the end of the mounting base (10) that is connected to the main board (1), the remaining two ends are embedded with second bearings. The end of the lead screw (6) away from the handle (7) is installed in the inner ring of the second bearing.

5. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 2, characterized in that: Synchronous pulleys (8) are installed on the end of the lead screw (6) near the handle (7), and synchronous belts (9) are installed on the two synchronous pulleys (8).

6. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 1, characterized in that: Multiple support bases (14) are installed at both ends of the motherboard (1) in the width direction. The bottom surface of the support base (14) is lower than the bottom surface of the crossbar (4) below. Each support base (14) has a vertical fixing hole that passes through it.

7. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 1, characterized in that: The protective sheet (11) is serpentine and contracted together. All of the protective sheets (11) are made of rubber material.

8. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 1, characterized in that: Rubber layers are installed on the opposite surfaces of the frame (3), and the rubber layers are in contact with the upper and lower surfaces of the motherboard (1).

9. The integrated packaging device for radio frequency front-end and antenna array for millimeter-wave radar according to claim 1, characterized in that: The motherboard (1) has positioning grooves (17) on both sides along its length. The inner side of the baffle (2) protrudes from the positioning grooves (17) to form positioning parts (16), and the positioning parts (16) are inserted into the positioning grooves (17).

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