Temperature-insensitive silicon-based hybrid fully-integrated active optical frequency laser regeneration relay chip, optical frequency transmission system and method

By integrating a silicon-based passive waveguide layer with a thin-film lithium niobate active waveguide layer, the problems of large size and high environmental sensitivity of optical frequency laser regeneration relay systems are solved. This achieves full integration of key active devices and temperature-insensitive optical frequency transmission, improving the system's stability and transmission capability.

CN122018097APending Publication Date: 2026-05-12SHANGHAI JIAOTONG UNIV
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Patent Information

Application Number
CN202610190995.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-02-10
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing optical frequency laser regeneration relay systems are large in size, highly sensitive to the environment, have low integration of key active components, and the out-of-band phase noise introduced by temperature changes severely degrades the system stability.

Method used

A hybrid heterogeneous integration of silicon-based passive waveguide layers and thin-film lithium niobate active waveguide layers is adopted. The phase noise introduced by temperature changes is suppressed through strict length matching design, and the full integration of key active devices is achieved, including the hybrid integration of distributed feedback laser gain chip, frequency shifter and polarization controller.

Benefits of technology

A miniaturized, low-power, and highly stable optical frequency transmission system has been achieved, which can effectively suppress phase noise introduced by temperature changes and supports a full-function on-chip laser regeneration relay chip for cascaded optical frequency transmission.

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Abstract

The invention discloses a temperature-insensitive silicon-based hybrid integrated active optical frequency laser regeneration relay chip, which is suitable for a photon integrated optical frequency cascade transmission system. The chip can carry out on-chip regeneration amplification on a received previous-stage optical signal, and outputs an optical frequency signal with a stable phase to a next stage. According to the invention, the low-loss passive silicon-based waveguide is extremely low, and strict length matching is carried out on the out-of-band waveguide path in the chip, so that out-of-band phase noise caused by temperature change can be effectively inhibited, and the environmental adaptability of the chip is improved. Meanwhile, by means of advanced processes such as micro transfer printing, heterogeneous hybrid integration is carried out on a high-efficiency on-chip frequency shifter and a polarization controller which are realized on the basis of high-electro-optical coefficient materials such as thin-film lithium niobate, so that the on-chip optical frequency laser regeneration relay chip with complete functions is constructed. The chip has the advantages of being compact in structure, low in power consumption, high in environmental adaptability and the like, and is suitable for construction of a next-generation miniaturized optical frequency transfer network.
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