Laminating module wiring system based on layout design

Abstract

The invention provides a laminated module wiring system based on layout design, relates to the technical field of liquid crystal display devices and manufacturing processes, and aims to solve the problems that OCA (Optical Clear Adhesive) filling is nonuniform and the production cost is low due to step difference between an upper polaroid and a peripheral structure in a liquid crystal display module. And a traditional remedy scheme excessively depends on fitting process parameters, so that the mass production consistency is poor. According to the system, a segment difference flush coefficient Pqx and a comprehensive fitting filling coefficient Ttx are calculated through virtual stacking and fluid parameter collection, and segment difference elimination is guided from the source in the digital design stage. And meanwhile, the system associates and fits the two to obtain a fitting yield evaluation index Lpz, and performs double-layer closed-loop evaluation and graded early warning by using a preset yield threshold. The method thoroughly gets rid of high dependence on equipment process parameters and the environment, effectively avoids the risks of bubbles, glue overflow and stress concentration, greatly widens the process window, and practically guarantees high yield of mass production and product reliability.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal display devices and manufacturing processes, specifically to a bonding module wiring system based on layout design. Background Technology

[0002] Liquid crystal display (LCD) modules are typically composed of layers of liquid crystal panels, polarizers, backlights, and driving circuits. Image display is achieved by controlling the orientation of liquid crystal molecules between upper and lower substrates. With the increasing demands for display quality in smartphones, tablets, and automotive displays, optical full lamination technology is widely used to reduce reflections and improve contrast and visibility. In this process, OCA optical adhesive is used to firmly bond the cover plate or touch panel to the LCD module; its uniformity of filling and interface quality directly affect the optical performance and appearance quality of the display module.

[0003] However, in existing structural designs, there is often a height difference between the upper polarizer and the surrounding or adjacent liquid crystal display module structures (such as bezels, support structures, etc.), forming a stepped gap. OCA optical adhesive needs to cross this step gap area during the bonding process. Due to limitations in adhesive thickness, flowability, and bonding pressure, it is difficult to fully fill the gap, easily resulting in incompletely covered local gaps near the step, especially noticeable near the visible area.

[0004] Existing technologies typically attempt to remedy the situation by adjusting bonding process parameters, such as increasing bonding pressure, extending bonding time, or raising process temperature, in order to improve the flowability and filling capacity of OCA. However, these measures are highly sensitive to material batches, environmental conditions, and equipment status, have narrow process windows, and suffer from poor mass production consistency. If not properly controlled, not only may air bubble defects still occur in the visible area, affecting the display appearance and light transmittance, but new problems such as adhesive overflow and localized stress concentration may also be introduced, making it difficult to consistently guarantee product reliability and yield. Summary of the Invention

[0005] The purpose of this invention is to provide a wiring system for a bonding module based on layout design, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A bonding module wiring system based on layout design, comprising: The virtual structure stacking module is used to perform three-dimensional proportional modeling of each functional layer, peripheral wiring and upper polarizer inside the pre-set liquid crystal display module, to create a visual demonstration model of the bonding module structure for designers, and to display the data of the three-dimensional morphology of the simulated OCA optical adhesive bonding interface. The layout parameter acquisition module is used to monitor and record the height of the outer surface of the upper polarizer and the height data of the surrounding structure of the adjacent liquid crystal display module in real time when the system is performing structural stacking and wiring design, so as to construct a set of height ratio states, and monitor and record the OCA colloid flow performance data under different height ratios in real time, so as to construct a set of fluid filling. The data processing module is used to preprocess both the high-ratio state set and the fluid filling set, and then transmit them to the cloud platform for data standardization processing. The step difference alignment analysis module is used to analyze the relative height difference between the outer surface of the upper polarizer and the bonding reference surface of the liquid crystal display module based on the height ratio state set, so as to construct and evaluate the step difference alignment coefficient Pqx, and issue a structural warning command. When the structural warning command is received, the module layout design interface is monitored and corresponding thickness or position adjustment prompts are made to eliminate the step difference from the source of the structure. The OCA filling simulation module is used to analyze the dynamic filling state of OCA optical adhesive in the visible area and the non-visible transition area based on the fluid filling set. Based on the filling state of OCA optical adhesive in different areas, it comprehensively analyzes the overall bonding filling coefficient Ttx of the current layout design to avoid the generation of local air bubbles and voids that are not fully covered. The bonding yield assessment module correlates the step alignment coefficient Pqx with the comprehensive bonding fill coefficient Ttx to obtain the bonding yield assessment index Lpz. It also sets a yield threshold W in advance for comparative analysis to comprehensively assess the mass production consistency level of the current module wiring system and generate a corresponding structural optimization report based on the level.

[0007] Furthermore, the virtual structure stacking module includes virtual 3D units and interface display units; The virtual three-dimensional unit is used to simulate the internal stacking structure of the virtual liquid crystal display module in proportion to the actual touch display module parameters, and superimposes the height ratio information during the actual simulation process to help designers understand the flush status of the upper polarizer with the surrounding cover glass and wiring reference surface in real time. It is also equipped with a tolerance analyzer that matches the actual bonding equipment. The interface display unit is used to provide designers with an intuitive interface observation experience using 3D rendering technology. Designers can interact with the virtual stacking environment by inputting commands. At the same time, several sets of virtual probes are used to collect interface flatness data during the stacking process. The flatness data includes, but is not limited to, visible segment differences and edge step differences. The flatness data is fed back to the cloud platform in real time, and a heat map interface is displayed on the monitor for designers. The heat map interface includes, but is not limited to, stress concentration marks, high bubble areas, and thickness adjustment suggestions.

[0008] Furthermore, the layout parameter acquisition module includes a first acquisition unit and a second acquisition unit; The first acquisition unit is used to monitor and record the mutual height coordination status between the structural layers in the module in real time, so as to obtain relevant height ratio status data information. The relevant height ratio status data information includes the upper polarizer, the height polarizer, and the height of the liquid crystal display module in the surrounding structure of the adjacent liquid crystal display module in each monitoring sampling point. Based on the upper polarizer, the height polarizer, and the height of the liquid crystal display module in the surrounding structure of the adjacent liquid crystal display module in each monitoring sampling point, and combined with the statistical averaging algorithm, the average height of the upper polarizer and the average height of the liquid crystal display module in the surrounding structure of the liquid crystal display module in the monitoring period are calculated respectively. The second acquisition unit is used to monitor and record the continuous state data of the OCA bonding interface under each stacking scheme, as well as the filling performance data under the corresponding state. The continuous state data includes the fully flush state in the visible area and the locally stepped buffer state in the non-visible area, and records the horizontal gap of the module in the flush state and the vertical drop in the stepped buffer state, respectively. The filling performance data under the corresponding state includes the horizontal filling rate deviation value Sppc and the vertical filling rate deviation value Czpc of the OCA colloid at different positions in the flush state, and the horizontal stress deviation value Spc and the vertical stress deviation value Czc of the OCA colloid at different positions in the stepped buffer state.

[0009] Furthermore, the step alignment analysis module includes an alignment response analysis unit, a structure early warning unit, and an adjustment notification unit; The alignment response analysis unit is used to calculate and obtain the step alignment coefficient Pqx based on the height ratio state set, through the height of the upper polarizer H polarizer and the height of the surrounding structure of the adjacent liquid crystal display module H liquid crystal display module. Specifically, for each monitoring sampling point, a first ratio and a second ratio are calculated. The first ratio is the absolute value of the difference between the height of the upper POL at that sampling point and the average height of the surrounding structures of the LCM during the monitoring period, divided by the average height of the upper POL during the monitoring period. The second ratio is the absolute value of the difference between the height of the adjacent surrounding structures of the LCM at that sampling point and the average height of the upper POL during the monitoring period, divided by the average height of the surrounding structures of the LCM during the monitoring period. Multiply the first ratio by the first weighting coefficient, multiply the second ratio by the second weighting coefficient, and add the products of the two to obtain the single-point alignment value of the sampling point; finally, sum the single-point alignment values ​​corresponding to all monitoring sampling points, and the sum is the step alignment coefficient.

[0010] Furthermore, the structural early warning unit is used to pre-set an alignment threshold Q, and by comparing and analyzing the alignment threshold Q with the step alignment coefficient Pqx, to preliminarily determine whether there is a risk of local gaps in the current system layout design when facing the OCA optical adhesive bonding process, specifically including: If the step difference alignment coefficient Pqx exceeds the alignment threshold Q, it is initially determined that the bonding interface caused by the current stacking design is not aligned, indicating that there is a high risk of step difference and bubble generation in the current module design. It cannot be remedied by adjusting bonding pressure or temperature and other process parameters alone. At this time, a structural warning command will be issued. If the step alignment coefficient Pqx does not exceed the alignment threshold Q, it is preliminarily determined that the bonding reference planes corresponding to the current stacking design are in the same plane or basically aligned, indicating that the current structure has eliminated the step risk at the source, and there is no need to issue additional structural warning instructions.

[0011] Furthermore, the adjustment notification unit is used to monitor and record the parameter settings of each functional layer in the module design interface in a timely manner after receiving the structural early warning instruction issued by the structural early warning unit. This includes checking the thickness of the transparent adjustment layer between the display panel and the upper polarizer, the height of the frame adhesive, and the parameters of the lower support frame or optical compensation layer. It also checks whether the height ratio of the support structure is problematic, causing a step difference between the outer surface of the upper polarizer and the corresponding LCD module bonding reference surface of the OCA adhesive layer. If the support structure has abnormal parameters, the thickness will be automatically matched and the height difference will be repaired. If the support structure does not have abnormal parameters, the designer will be provided with a visual prompt through the display screen of the design interface, prompting the designer to actively add an intermediate buffer layer or locally change the thickness of the upper polarizer to eliminate the risk of step difference.

[0012] Furthermore, the OCA filling simulation module includes a region state analysis unit and a fluid precision analysis unit; the region state analysis unit is used to analyze the filling deformation of OCA adhesive in the visible area of ​​the module, i.e., the flush state, and the stress distribution in the non-visible area, i.e. the step buffer state, through the fluid filling set, so as to calculate the visible area filling factor Vtc and the non-visible area filling factor Ntc of the corresponding area respectively. The methods for obtaining the viewport fill factor include: For each sampling distance within the visible area, the vertical and horizontal deviation values ​​of the interface fluctuation at that distance are obtained. The square root of the sum of the squares of the vertical and horizontal deviation values ​​is obtained to get the comprehensive deviation base of the visible area. The vertical deviation value is divided by the comprehensive deviation base of the visible area, and then multiplied by the third weighting coefficient. Finally, the calculation results obtained at all sampling distances within the visible area are summed to obtain the visible area fill factor. The method for obtaining the non-visual area filling factor includes: for each sampling distance in the non-visual area, obtaining the vertical deviation value and horizontal deviation value of the stress at that distance; adding the square of the vertical deviation value and the square of the horizontal deviation value and taking the square root to obtain the non-visual area comprehensive deviation base; dividing the vertical deviation value by the non-visual area comprehensive deviation base, multiplying it by the fourth weighting coefficient, and finally summing the calculation results obtained at all sampling distances in the non-visual area to obtain the non-visual area filling factor.

[0013] Furthermore, the fluid precision analysis unit is used to comprehensively evaluate the overall leveling coverage of OCA optical adhesive based on the visible area fill factor Vtc and the non-visible area fill factor Ntc, so as to analyze and calculate the comprehensive bonding fill coefficient Ttx of the current layout. The specific calculation process includes calculating the difference between the visible area fill factor at each visible area sampling distance and the mean value of the visible area fill factor in the simulation process, squaring the difference and multiplying it by the fifth weighting coefficient to obtain the single-point variance weighted value of the visible area. Calculate the difference between the non-visual area fill factor at each sampling distance and the mean non-visual area fill factor during the simulation. Square the difference and multiply it by the sixth weighting coefficient to obtain the single-point variance weighted value of the non-visual area. The weighted variance values ​​of single points within all visible areas are summed, and the weighted variance values ​​of single points outside all non-visible areas are summed. The results of these two summations are added together to obtain the comprehensive fitting and filling coefficient.

[0014] Furthermore, the bonding yield evaluation module includes a comprehensive analysis unit and a yield estimation unit; the comprehensive analysis unit is used to correlate the step alignment coefficient Pqx with the comprehensive bonding filling coefficient Ttx, and after dimensionless processing, to fit and calculate the bonding yield evaluation index Lpz. Specifically, the acquisition method includes multiplying the step alignment coefficient by a seventh weighting coefficient to obtain a first evaluation component, multiplying the comprehensive bonding filling coefficient by an eighth weighting coefficient to obtain a second evaluation component; and summing the first evaluation component, the second evaluation component, and a preset correction constant to obtain the bonding yield evaluation index.

[0015] Furthermore, the yield estimation unit is used to preset a yield threshold W, including a first yield threshold W1 and a second yield threshold W2, wherein the first yield threshold W1 is greater than the second yield threshold W2. The bonding yield evaluation index Lpz is compared and analyzed with the first yield threshold W1 and the second yield threshold W2 to comprehensively evaluate the mass production consistency level of the current module wiring system, and a corresponding structural optimization report is generated based on the level, specifically including: If the bonding yield evaluation index Lpz ≥ the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in an unqualified state (i.e., it relies heavily on process parameters for compensation and has poor stability). At this time, a return feedback report for this design will be provided to the design team, pointing out the specific locations of excessive step differences and thickness modification suggestions, and forcibly requiring a readjustment of the height ratio of the LCD module stacking structure; If the second yield threshold W2 ≤ the bonding yield evaluation index Lpz < the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in a critical state (i.e., there is a local yield risk). At this time, an optimization feedback report for this design will be provided to the design team, pointing out the specific edge areas that need improvement, and carrying out special optimization design for the height gradient transition layer from the non-visible area to the visible area; If the bonding yield evaluation index Lpz is less than the second yield threshold W2, it indicates that the bonding yield of the current module layout design is excellent, the interface is continuous and flat, and the OCA optical adhesive can completely fill the visible area. At this time, a feedback report on the approval of this design will be provided to the design team, affirming the overall structural stacking scheme, and then the final module layout drawings for mass production trial production will be output.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention acquires the height ratio state set and fluid filling set through a virtual structure stacking module and a layout parameter acquisition module. It uses a step difference alignment analysis module to accurately calculate the step difference alignment coefficient Pqx and issues a structural warning command in a timely manner when the step difference alignment coefficient Pqx exceeds the alignment threshold Q to guide the elimination of step differences from the source. At the same time, in conjunction with the OCA filling simulation module, it scientifically calculates the comprehensive bonding filling coefficient Ttx based on the visible area filling factor Vtc and the non-visible area filling factor Ntc. This allows R&D personnel to accurately grasp and optimize the dynamic filling state of OCA optical adhesive during the digital design stage, thereby completely avoiding incomplete coverage gaps caused by adhesive layer thickness and flowability limitations, ensuring sufficient filling of step difference gaps and extremely high flatness of the visible area interface. This invention also uses a bonding yield evaluation module to correlate the step alignment coefficient Pqx with the comprehensive bonding fill coefficient Ttx and calculate the bonding yield evaluation index Lpz. This system performs a rigorous two-layer comparative analysis between the bonding yield evaluation index Lpz and preset first yield threshold W1 and second yield threshold W2. When the bonding yield evaluation index Lpz is greater than or equal to the first yield threshold W1, the system forcibly reverts to readjusting the height ratio of the liquid crystal display module stacking structure. When the second yield threshold W2 is less than or equal to the bonding yield evaluation index Lpz and less than the first yield threshold W1, the system automatically adjusts the height ratio of the liquid crystal display module stacking structure. The system guides localized optimization of the gradient transition layer from the non-visible area to the visible area. Only when the bonding yield evaluation index Lpz is less than the second yield threshold W2 is it judged as excellent and the final module layout drawing is output. This pre-emptive closed-loop hierarchical evaluation and optimization mechanism completely frees the module design from the high sensitivity and excessive dependence on material batches, environmental conditions and equipment status. It resolves potential risks such as glue overflow and stress concentration at the source, greatly broadens the process window of the actual production line, and ensures extremely stable overall display appearance, light transmittance, reliability and mass production yield of the product. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall system framework of the present invention. Detailed Implementation

[0018] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0019] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0020] Please see Figure 1 This invention provides a technical solution: a bonding module wiring system based on layout design, comprising: The virtual structure stacking module is used to perform three-dimensional proportional modeling of each functional layer, peripheral wiring and upper polarizer inside the pre-set liquid crystal display module, to create a visual demonstration model of the bonding module structure for designers, and to display the data of the three-dimensional morphology of the simulated OCA optical adhesive bonding interface. The layout parameter acquisition module is used to monitor and record the height of the outer surface of the upper polarizer and the height data of the surrounding structure of the adjacent liquid crystal display module in real time when the system is performing structural stacking and wiring design, so as to construct a set of height ratio states, and monitor and record the OCA colloid flow performance data under different height ratios in real time, so as to construct a set of fluid filling. The data processing module is used to preprocess both the high-ratio state set and the fluid filling set, and then transmit them to the cloud platform for data standardization processing. The step difference alignment analysis module is used to analyze the relative height difference between the outer surface of the upper polarizer and the bonding reference surface of the liquid crystal display module based on the height ratio state set, so as to construct and evaluate the step difference alignment coefficient Pqx, and issue a structural warning command. When the structural warning command is received, the module layout design interface is monitored and corresponding thickness or position adjustment prompts are made to eliminate the step difference from the source of the structure. The OCA filling simulation module is used to analyze the dynamic filling state of OCA optical adhesive in the visible area and the non-visible transition area based on the fluid filling set. Based on the filling state of OCA optical adhesive in different areas, it comprehensively analyzes the overall bonding filling coefficient Ttx of the current layout design to avoid the generation of local air bubbles and voids that are not fully covered. The bonding yield assessment module correlates the step alignment coefficient Pqx with the comprehensive bonding fill coefficient Ttx to obtain the bonding yield assessment index Lpz. It also sets a yield threshold W in advance for comparative analysis to comprehensively assess the mass production consistency level of the current module wiring system and generate a corresponding structural optimization report based on the level.

[0021] The virtual structure stacking module includes virtual 3D units and interface display units; The virtual three-dimensional unit is used to simulate the internal stacking structure of the virtual liquid crystal display module in proportion to the actual touch display module parameters, and superimposes the height ratio information during the actual simulation process to help designers understand the flush status of the upper polarizer with the surrounding cover glass and wiring reference surface in real time. It is also equipped with a tolerance analyzer that matches the actual bonding equipment. The interface display unit is used to provide designers with an intuitive interface observation experience using 3D rendering technology. Designers can interact with the virtual stacking environment by inputting commands. At the same time, several sets of virtual probes are used to collect interface flatness data during the stacking process. The flatness data includes, but is not limited to, visible segment differences and edge step differences. The flatness data is fed back to the cloud platform in real time, and a heat map interface is displayed on the monitor for designers. The heat map interface includes, but is not limited to, stress concentration marks, high bubble areas, and thickness adjustment suggestions.

[0022] The layout parameter acquisition module includes a first acquisition unit and a second acquisition unit; The first acquisition unit is used to monitor and record the mutual height coordination status between the structural layers in the module in real time, so as to obtain relevant height ratio status data information. The relevant height ratio status data information includes the upper polarizer, the height polarizer, and the height of the liquid crystal display module in the surrounding structure of the adjacent liquid crystal display module in each monitoring sampling point. Based on the upper polarizer, the height polarizer, and the height of the liquid crystal display module in the surrounding structure of the adjacent liquid crystal display module in each monitoring sampling point, and combined with the statistical averaging algorithm, the average height of the upper polarizer and the average height of the liquid crystal display module in the surrounding structure of the liquid crystal display module in the monitoring period are calculated respectively. The second acquisition unit is used to monitor and record the continuous state data of the OCA bonding interface under each stacking scheme, as well as the filling performance data under the corresponding state. The continuous state data includes the fully flush state in the visible area and the locally stepped buffer state in the non-visible area, and records the horizontal gap of the module in the flush state and the vertical drop in the stepped buffer state, respectively. The filling performance data under the corresponding state includes the horizontal filling rate deviation value Sppc and the vertical filling rate deviation value Czpc of the OCA colloid at different positions in the flush state, and the horizontal stress deviation value Spc and the vertical stress deviation value Czc of the OCA colloid at different positions in the stepped buffer state.

[0023] The step alignment analysis module includes an alignment response analysis unit, a structure early warning unit, and an adjustment notification unit. The alignment response analysis unit is used to calculate and obtain the step alignment coefficient Pqx based on the height ratio state set, through the height of the upper polarizer H polarizer and the height of the surrounding structure of the adjacent liquid crystal display module H liquid crystal display module. Specifically, for each monitoring sampling point, a first ratio and a second ratio are calculated. The first ratio is the absolute value of the difference between the height of the upper POL at that sampling point and the average height of the surrounding structures of the LCM during the monitoring period, divided by the average height of the upper POL during the monitoring period. The second ratio is the absolute value of the difference between the height of the adjacent surrounding structures of the LCM at that sampling point and the average height of the upper POL during the monitoring period, divided by the average height of the surrounding structures of the LCM during the monitoring period. Multiply the first ratio by the first weighting coefficient, multiply the second ratio by the second weighting coefficient, and add the products of the two to obtain the single-point alignment value of the sampling point; finally, sum the single-point alignment values ​​corresponding to all monitoring sampling points, and the sum is the step alignment coefficient.

[0024] The segment alignment coefficient Pqx is obtained using the following formula:

[0025] In the formula, i = 1, 2, 3, ..., n, where n represents the number of monitoring sampling points. This represents the height of the upper polarizer within the i-th sampling point. Represented as the height of the surrounding structure of the adjacent liquid crystal display module within the i-th sampling point. The value shown is the average height of the upper polarizer during the monitoring period. This represents the average height of the surrounding structure of the LCD module during the monitoring period. and All are represented as weighting coefficients.

[0026] The structural early warning unit is used to pre-set an alignment threshold Q, and by comparing and analyzing the alignment threshold Q with the step alignment coefficient Pqx, to preliminarily determine whether there is a risk of local gaps in the current system layout design when facing the OCA optical adhesive bonding process, specifically including: If the step difference alignment coefficient Pqx exceeds the alignment threshold Q, it is initially determined that the bonding interface caused by the current stacking design is not aligned, indicating that there is a high risk of step difference and bubble generation in the current module design. It cannot be remedied by adjusting bonding pressure or temperature and other process parameters alone. At this time, a structural warning command will be issued. If the step alignment coefficient Pqx does not exceed the alignment threshold Q, it is preliminarily determined that the bonding reference planes corresponding to the current stacking design are in the same plane or basically aligned, indicating that the current structure has eliminated the step risk at the source, and there is no need to issue additional structural warning instructions.

[0027] The adjustment notification unit is used to monitor and record the parameter settings of each functional layer in the module design interface in a timely manner after receiving the structural early warning instruction issued by the structural early warning unit. This includes checking the thickness of the transparent adjustment layer between the display panel and the upper polarizer, the height of the frame adhesive, and the parameters of the lower support frame or optical compensation layer. It also checks whether the height ratio of the support structure is problematic, causing a step difference between the outer surface of the upper polarizer and the corresponding LCD module bonding reference surface of the OCA adhesive layer. If the support structure has abnormal parameters, the thickness will be automatically matched and the height difference will be repaired. If the support structure does not have abnormal parameters, the designer will be provided with a visual prompt through the display screen of the design interface, prompting the designer to actively add an intermediate buffer layer or locally change the thickness of the upper polarizer to eliminate the risk of step difference.

[0028] The OCA filling simulation module includes a region state analysis unit and a fluid precision analysis unit. The region state analysis unit is used to analyze the filling deformation of OCA adhesive in the visible area of ​​the module, i.e., the flush state, and the stress distribution in the non-visible area, i.e. the step buffer state, through the fluid filling set, so as to calculate the visible area filling factor Vtc and the non-visible area filling factor Ntc of the corresponding area respectively. The methods for obtaining the viewport fill factor include: For each sampling distance within the visible area, the vertical and horizontal deviation values ​​of the interface fluctuation at that distance are obtained. The square root of the sum of the squares of the vertical and horizontal deviation values ​​is obtained to get the comprehensive deviation base of the visible area. The vertical deviation value is divided by the comprehensive deviation base of the visible area, and then multiplied by the third weighting coefficient. Finally, the calculation results obtained at all sampling distances within the visible area are summed to obtain the visible area fill factor. The method for obtaining the non-visual area filling factor includes: for each sampling distance in the non-visual area, obtaining the vertical deviation value and horizontal deviation value of the stress at that distance; adding the square of the vertical deviation value and the square of the horizontal deviation value and taking the square root to obtain the non-visual area comprehensive deviation base; dividing the vertical deviation value by the non-visual area comprehensive deviation base, multiplying it by the fourth weighting coefficient, and finally summing the calculation results obtained at all sampling distances in the non-visual area to obtain the non-visual area filling factor.

[0029] Specifically, it is obtained according to the following calculation formula:

[0030]

[0031] In the formula, Zvk represents the vertical deviation value of the interface fluctuation when the sampling distance is k and the module is in the visible area, Xvk represents the corresponding horizontal deviation value, Znj represents the vertical deviation value of the stress when the sampling distance is j and the module is in the non-visible step buffer state, Xnj represents the corresponding horizontal deviation value. and All are weighting coefficients.

[0032] The fluid precision analysis unit is used to comprehensively evaluate the overall leveling coverage of OCA optical adhesive based on the visible area fill factor Vtc and the non-visible area fill factor Ntc, so as to analyze and calculate the comprehensive bonding fill coefficient Ttx of the current layout. The specific calculation process includes calculating the difference between the visible area fill factor at the sampling distance of each visible area and the mean value of the visible area fill factor in the simulation process, squaring the difference and multiplying it by the fifth weighting coefficient to obtain the single-point variance weighted value of the visible area. Calculate the difference between the non-visual area fill factor at each sampling distance and the mean non-visual area fill factor during the simulation. Square the difference and multiply it by the sixth weighting coefficient to obtain the single-point variance weighted value of the non-visual area. The weighted variance values ​​of single points within all visible areas are summed, and the weighted variance values ​​of single points outside all non-visible areas are summed. The results of these two summations are added together to obtain the comprehensive fitting and filling coefficient.

[0033] Specifically, obtain it using the following methods:

[0034] In the formula, m represents different sampling distances within the visible area, k=1,2,3,...,m; g represents different sampling distances within the non-visible area, j=1,2,3,...,g; Vtc_avg represents the mean of the fill factor of the visible area during the simulation; and Ntc_avg represents the mean of the fill factor of the non-visible area during the simulation. and All are weighting coefficients.

[0035] The bonding yield evaluation module includes a comprehensive analysis unit and a yield estimation unit. The comprehensive analysis unit is used to correlate the step alignment coefficient Pqx with the comprehensive bonding filling coefficient Ttx, and after dimensionless processing, to fit and calculate the bonding yield evaluation index Lpz. Specifically, the acquisition method includes multiplying the step alignment coefficient by a seventh weighting coefficient to obtain a first evaluation component, and multiplying the comprehensive bonding filling coefficient by an eighth weighting coefficient to obtain a second evaluation component. The first evaluation component, the second evaluation component, and a preset correction constant are added together to obtain the bonding yield evaluation index.

[0036] The bonding yield evaluation index Lpz is obtained through the following formula:

[0037] In the formula, μ1 and μ2 are both weighting coefficients, and C represents the correction constant.

[0038] The yield estimation unit is used to preset the yield threshold W, including a first yield threshold W1 and a second yield threshold W2, wherein the first yield threshold W1 is greater than the second yield threshold W2. The bonding yield evaluation index Lpz is compared and analyzed with the first yield threshold W1 and the second yield threshold W2 to comprehensively evaluate the mass production consistency level of the current module wiring system, and a corresponding structural optimization report is generated based on the level, specifically including: If the bonding yield evaluation index Lpz ≥ the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in an unqualified state (i.e., it relies heavily on process parameters for compensation and has poor stability). At this time, a return feedback report for this design will be provided to the design team, pointing out the specific locations of excessive step differences and thickness modification suggestions, and forcibly requiring a readjustment of the height ratio of the LCD module stacking structure; If the second yield threshold W2 ≤ the bonding yield evaluation index Lpz < the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in a critical state (i.e., there is a local yield risk). At this time, an optimization feedback report for this design will be provided to the design team, pointing out the specific edge areas that need improvement, and carrying out special optimization design for the height gradient transition layer from the non-visible area to the visible area; If the bonding yield evaluation index Lpz is less than the second yield threshold W2, it indicates that the bonding yield of the current module layout design is excellent, the interface is continuous and flat, and the OCA optical adhesive can completely fill the visible area. At this time, a feedback report on the approval of this design will be provided to the design team, affirming the overall structural stacking scheme, and then the final module layout drawings for mass production trial production will be output.

[0039] In this embodiment, the virtual structure stacking module performs three-dimensional proportional modeling of each functional layer, peripheral wiring, and upper polarizer inside the liquid crystal display module. It uses several sets of virtual probes to collect interface flatness data and displays a heat map interface on the display, helping designers to intuitively grasp the three-dimensional morphology of the bonding interface, such as stress concentration marks and areas with high bubble incidence. The layout parameter acquisition module monitors the height of the outer surface of the upper polarizer and the height of the surrounding structure in real time during the structure stacking design to construct a set of height ratio states. It also records the horizontal filling rate deviation value Sppc, vertical filling rate deviation value Czpc, horizontal stress deviation value Spc, and vertical stress deviation value Czc of OCA colloid under different states to construct a fluid filling set, providing complete underlying data support for digital simulation and accurate calculation. The data processing module preprocesses the aforementioned height ratio state set and fluid filling set and transmits them to the cloud platform for standardized processing, ensuring the standardization of the flow of massive state data within the system and the efficiency of cloud-based evaluation. The step difference alignment analysis module, based on the height ratio state set, combines the upper polarizer height Hpol,i at the i-th sampling point, the surrounding structure height Hlcm,i of the adjacent liquid crystal display module, and their respective average values ​​Hpol_avg and Hlcm_avg within the monitoring period, with the aid of weighting coefficients αi and βi, to accurately calculate the step difference alignment coefficient Pqx for n sampling points. When the step difference alignment coefficient Pqx exceeds the alignment threshold Q, a structural warning command is issued, prompting designers to proactively add an intermediate buffer layer or locally change the film thickness, eliminating step differences from the structural source and completely avoiding excessive reliance on subsequent adjustments to bonding pressure and other process parameters. The OCA filling simulation module is based on a fluid filling set. By analyzing the vertical deviation value Zvk and horizontal deviation value Xvk of the interface fluctuation at sampling distance k, and the vertical deviation value Znj and horizontal deviation value Xnj of the stress at sampling distance j, and with the help of weighting coefficients γk and λj, it accurately calculates the visible area filling factor Vtc and the non-visible area filling factor Ntc. At the same time, it combines the factor mean values ​​Vtc_avg and Ntc_avg corresponding to m sampling distances in the visible area and g sampling distances in the non-visible area, as well as the weighting coefficients ωk and φj, to comprehensively calculate the overall bonding filling coefficient Ttx of the current layout. This allows R&D personnel to accurately evaluate and optimize the overall leveling coverage of OCA optical adhesive during the design stage, fundamentally avoiding the generation of incompletely covered local air bubbles and voids. The bonding yield evaluation module correlates the step alignment coefficient Pqx and the comprehensive bonding filling coefficient Ttx with weighting coefficients μ1, μ2 and correction constant C to fit the bonding yield evaluation index Lpz. The bonding yield evaluation index Lpz is then compared with the preset first yield threshold W1 and second yield threshold W2 in a two-layer comparison analysis. When the bonding yield evaluation index Lpz ≥ the first yield threshold W1, a forced return feedback report is provided to readjust the height ratio. When the second yield threshold W2 ≤ the bonding yield evaluation index Lpz < the first yield threshold W1, an optimization feedback report is provided to perform specific optimization for the gradient transition layer. When the bonding yield evaluation index Lpz < the second yield threshold W2, it is judged as an excellent state and the final module layout drawing is directly output. This pre-closed-loop mass production consistency level evaluation mechanism effectively avoids local yield risks and ultimately achieves high stability and excellent structural bonding effect in module mass production. It should be noted that all calculation formulas in this application employ regression analysis, including but not limited to machine learning algorithms, to deeply analyze the collected parameters and identify their natural trends and interrelationships. Specialized software, such as Python's Scikit-learn library or the R language, is used to automatically generate mathematical models that match the data. Then, cross-validation and other methods are used to objectively evaluate the model performance, and continuous feedback and optimization are combined to ensure that the created formulas truly reflect the inherent laws of the data, thereby guaranteeing their effectiveness and accuracy. In all calculation formulas in this application, the parameters in each formula undergo dimensionless processing within a consistent range to ensure that different physical quantities are compared on the same scale; dimensionless processing techniques include, but are not limited to, min-max-normalization and Z-score standardization. The technical solution of this invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as a computer floppy disk, read-only memory (ROM), random-access memory (RAM), flash memory, hard disk, or optical disk, etc., including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods of various embodiments of this invention.

[0040] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-including system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wiring system for a bonding module based on layout design, characterized in that, include: The virtual structure stacking module is used to perform three-dimensional proportional modeling of each functional layer, peripheral wiring and upper polarizer inside the pre-set liquid crystal display module, to create a visual demonstration model of the bonding module structure for designers, and to display the data of the three-dimensional morphology of the simulated OCA optical adhesive bonding interface. The layout parameter acquisition module is used to monitor and record the height of the outer surface of the upper polarizer and the height data of the surrounding structure of the adjacent liquid crystal display module in real time when the system is performing structural stacking and wiring design, so as to construct a set of height ratio states, and monitor and record the OCA colloid flow performance data under different height ratios in real time, so as to construct a set of fluid filling. The data processing module is used to preprocess both the high-ratio state set and the fluid filling set, and then transmit them to the cloud platform for data standardization processing. The step difference alignment analysis module is used to analyze the relative height difference between the outer surface of the upper polarizer and the bonding reference surface of the liquid crystal display module based on the height ratio state set, so as to construct and evaluate the step difference alignment coefficient Pqx, and issue a structural warning command. When the structural warning command is received, the module layout design interface is monitored and corresponding thickness or position adjustment prompts are made to eliminate the step difference from the source of the structure. The OCA filling simulation module is used to analyze the dynamic filling state of OCA optical adhesive in the visible area and the non-visible transition area based on the fluid filling set. Based on the filling state of OCA optical adhesive in different areas, it comprehensively analyzes the overall bonding filling coefficient Ttx of the current layout design to avoid the generation of local air bubbles and voids that are not fully covered. The bonding yield assessment module correlates the step alignment coefficient Pqx with the comprehensive bonding fill coefficient Ttx to obtain the bonding yield assessment index Lpz. It also sets a yield threshold W in advance for comparative analysis to comprehensively assess the mass production consistency level of the current module wiring system and generate a corresponding structural optimization report based on the level.

2. The bonding module wiring system based on layout design according to claim 1, characterized in that: The virtual structure stacking module includes virtual 3D units and interface display units; The virtual three-dimensional unit is used to simulate the internal stacking structure of the virtual liquid crystal display module in proportion to the actual touch display module parameters, and superimposes the height ratio information during the actual simulation process to help designers understand the flush status of the upper polarizer with the surrounding cover glass and wiring reference surface in real time. It is also equipped with a tolerance analyzer that matches the actual bonding equipment. The interface display unit is used to provide designers with an intuitive interface observation experience using 3D rendering technology. Designers can interact with the virtual stacking environment by inputting commands. At the same time, several sets of virtual probes are used to collect interface flatness data during the stacking process. The flatness data includes, but is not limited to, visible segment differences and edge step differences. The flatness data is fed back to the cloud platform in real time, and a heat map interface is displayed on the monitor for designers. The heat map interface includes, but is not limited to, stress concentration marks, high bubble areas, and thickness adjustment suggestions.

3. The bonding module wiring system based on layout design according to claim 1, characterized in that: The layout parameter acquisition module includes a first acquisition unit and a second acquisition unit; The first acquisition unit is used to monitor and record the mutual height coordination status between the structural layers in the module in real time, so as to obtain relevant height ratio status data information. The relevant height ratio status data information includes the upper polarizer, the height polarizer, and the height of the liquid crystal display module in the surrounding structure of the adjacent liquid crystal display module in each monitoring sampling point. Based on the upper polarizer, the height polarizer, and the height of the liquid crystal display module in the surrounding structure of the adjacent liquid crystal display module in each monitoring sampling point, and combined with the statistical averaging algorithm, the average height of the upper polarizer and the average height of the liquid crystal display module in the surrounding structure of the liquid crystal display module in the monitoring period are calculated respectively. The second acquisition unit is used to monitor and record the continuous state data of the OCA bonding interface under each stacking scheme, as well as the filling performance data under the corresponding state. The continuous state data includes the fully flush state in the visible area and the locally stepped buffer state in the non-visible area, and records the horizontal gap of the module in the flush state and the vertical drop in the stepped buffer state, respectively. The filling performance data under the corresponding state includes the horizontal filling rate deviation value Sppc and the vertical filling rate deviation value Czpc of the OCA colloid at different positions in the flush state, and the horizontal stress deviation value Spc and the vertical stress deviation value Czc of the OCA colloid at different positions in the stepped buffer state.

4. The bonding module wiring system based on layout design according to claim 3, characterized in that: The step alignment analysis module includes an alignment response analysis unit, a structure early warning unit, and an adjustment notification unit. The alignment response analysis unit is used to calculate and obtain the step alignment coefficient Pqx based on the height ratio state set, through the height of the upper polarizer H polarizer and the height of the surrounding structure of the adjacent liquid crystal display module H liquid crystal display module. Specifically, for each monitoring sampling point, a first ratio and a second ratio are calculated. The first ratio is the absolute value of the difference between the height of the upper POL at that sampling point and the average height of the surrounding structures of the LCM during the monitoring period, divided by the average height of the upper POL during the monitoring period. The second ratio is the absolute value of the difference between the height of the adjacent surrounding structures of the LCM at that sampling point and the average height of the upper POL during the monitoring period, divided by the average height of the surrounding structures of the LCM during the monitoring period. Multiply the first ratio by the first weighting coefficient, multiply the second ratio by the second weighting coefficient, and add the products of the two to obtain the single-point alignment value of the sampling point; finally, sum the single-point alignment values ​​corresponding to all monitoring sampling points, and the sum is the step alignment coefficient.

5. A bonding module wiring system based on layout design according to claim 4, characterized in that: The structural early warning unit is used to pre-set an alignment threshold Q, and by comparing and analyzing the alignment threshold Q with the step alignment coefficient Pqx, to preliminarily determine whether there is a risk of local gaps in the current system layout design when facing the OCA optical adhesive bonding process, specifically including: If the step difference alignment coefficient Pqx exceeds the alignment threshold Q, it is initially determined that the bonding interface caused by the current stacking design is not aligned, indicating that there is a high risk of step difference and bubble generation in the current module design. It cannot be remedied by adjusting bonding pressure or temperature and other process parameters alone. At this time, a structural warning command will be issued. If the step alignment coefficient Pqx does not exceed the alignment threshold Q, it is preliminarily determined that the bonding reference planes corresponding to the current stacking design are in the same plane or basically aligned, indicating that the current structure has eliminated the step risk at the source, and there is no need to issue additional structural warning instructions.

6. The bonding module wiring system based on layout design according to claim 4, characterized in that: The adjustment notification unit is used to monitor and record the parameter settings of each functional layer in the module design interface in a timely manner after receiving the structural early warning instruction issued by the structural early warning unit. This includes checking the thickness of the transparent adjustment layer between the display panel and the upper polarizer, the height of the frame adhesive, and the parameters of the lower support frame or optical compensation layer. It also checks whether the height ratio of the support structure is problematic, causing a step difference between the outer surface of the upper polarizer and the corresponding LCD module bonding reference surface of the OCA adhesive layer. If the support structure has abnormal parameters, the thickness will be automatically matched and the height difference will be repaired. If the support structure does not have abnormal parameters, the designer will be provided with a visual prompt through the display screen of the design interface, prompting the designer to actively add an intermediate buffer layer or locally change the thickness of the upper polarizer to eliminate the risk of step difference.

7. A bonding module wiring system based on layout design according to claim 3, characterized in that: The OCA filling simulation module includes a region state analysis unit and a fluid precision analysis unit. The region state analysis unit is used to analyze the filling deformation of OCA adhesive in the visible area of ​​the module, i.e., the flush state, and the stress distribution in the non-visible area, i.e. the step buffer state, through the fluid filling set, so as to calculate the visible area filling factor Vtc and the non-visible area filling factor Ntc of the corresponding area respectively. The methods for obtaining the viewport fill factor include: For each sampling distance within the visible area, the vertical and horizontal deviation values ​​of the interface fluctuation at that distance are obtained. The square root of the sum of the squares of the vertical and horizontal deviation values ​​is obtained to get the comprehensive deviation base of the visible area. The vertical deviation value is divided by the comprehensive deviation base of the visible area, and then multiplied by the third weighting coefficient. Finally, the calculation results obtained at all sampling distances within the visible area are summed to obtain the visible area fill factor. The method for obtaining the non-visual area filling factor includes: for each sampling distance in the non-visual area, obtaining the vertical deviation value and horizontal deviation value of the stress at that distance; adding the square of the vertical deviation value and the square of the horizontal deviation value and taking the square root to obtain the non-visual area comprehensive deviation base; dividing the vertical deviation value by the non-visual area comprehensive deviation base, multiplying it by the fourth weighting coefficient, and finally summing the calculation results obtained at all sampling distances in the non-visual area to obtain the non-visual area filling factor.

8. A bonding module wiring system based on layout design according to claim 7, characterized in that: The fluid precision analysis unit is used to comprehensively evaluate the overall leveling coverage of OCA optical adhesive based on the visible area fill factor Vtc and the non-visible area fill factor Ntc, so as to analyze and calculate the comprehensive bonding fill coefficient Ttx of the current layout. The specific calculation process includes calculating the difference between the visible area fill factor at the sampling distance of each visible area and the mean value of the visible area fill factor in the simulation process, squaring the difference and multiplying it by the fifth weighting coefficient to obtain the single-point variance weighted value of the visible area. Calculate the difference between the non-visual area fill factor at each sampling distance and the mean non-visual area fill factor during the simulation. Square the difference and multiply it by the sixth weighting coefficient to obtain the single-point variance weighted value of the non-visual area. The weighted variance values ​​of single points within all visible areas are summed, and the weighted variance values ​​of single points outside all non-visible areas are summed. The results of these two summations are added together to obtain the comprehensive fitting and filling coefficient.

9. A bonding module wiring system based on layout design according to claim 1, characterized in that: The bonding yield evaluation module includes a comprehensive analysis unit and a yield estimation unit. The comprehensive analysis unit is used to correlate the step alignment coefficient Pqx with the comprehensive bonding filling coefficient Ttx, and after dimensionless processing, to fit and calculate the bonding yield evaluation index Lpz. Specifically, the acquisition method includes multiplying the step alignment coefficient by a seventh weighting coefficient to obtain a first evaluation component, and multiplying the comprehensive bonding filling coefficient by an eighth weighting coefficient to obtain a second evaluation component. The first evaluation component, the second evaluation component, and a preset correction constant are added together to obtain the bonding yield evaluation index.

10. A bonding module wiring system based on layout design according to claim 9, characterized in that: The yield estimation unit is used to preset the yield threshold W, including a first yield threshold W1 and a second yield threshold W2, wherein the first yield threshold W1 is greater than the second yield threshold W2. The bonding yield evaluation index Lpz is compared and analyzed with the first yield threshold W1 and the second yield threshold W2 to comprehensively evaluate the mass production consistency level of the current module wiring system, and a corresponding structural optimization report is generated based on the level, specifically including: If the bonding yield evaluation index Lpz ≥ the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in an unqualified state (i.e., it relies heavily on process parameters for compensation and has poor stability). At this time, a return feedback report for this design will be provided to the design team, pointing out the specific locations of excessive step differences and thickness modification suggestions, and forcibly requiring a readjustment of the height ratio of the LCD module stacking structure; If the second yield threshold W2 ≤ the bonding yield evaluation index Lpz < the first yield threshold W1, it indicates that the bonding yield of the current module layout design is in a critical state (i.e., there is a local yield risk). At this time, an optimization feedback report for this design will be provided to the design team, pointing out the specific edge areas that need improvement, and carrying out special optimization design for the height gradient transition layer from the non-visible area to the visible area; If the bonding yield evaluation index Lpz is less than the second yield threshold W2, it indicates that the bonding yield of the current module layout design is excellent, the interface is continuous and flat, and the OCA optical adhesive can completely fill the visible area. At this time, a feedback report on the approval of this design will be provided to the design team, affirming the overall structural stacking scheme, and then the final module layout drawings for mass production trial production will be output.

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