Convenient wafer gluing equipment and gluing method

Abstract

The invention discloses convenient wafer gluing equipment and a gluing method, and relates to the field of wafer processing equipment technicians, the convenient wafer gluing equipment comprises a rotating workbench, the rotating workbench is provided with a plurality of placing grooves matched with wafer workpieces, and the bottoms of the placing grooves are provided with a plurality of placing plates abutting against the lower portions of the wafer workpieces; the placing groove moves along with the rotating workbench and sequentially passes through the feeding position, the gluing position and the discharging position, a lifting type rotating machine table is arranged below the gluing position, a gluing system is arranged above the gluing position, and the periphery of the lifting type rotating machine table keeps away from the placing plate and jacks up wafer workpieces. According to the gluing device, the automation degree of the gluing process can be improved while the positioning effect is guaranteed, so that the effect of improving the batch production efficiency is achieved.

Description

Technical Field

[0001] This invention relates to the field of wafer processing equipment technicians, and particularly to a convenient wafer coating equipment and coating method. Background Technology

[0002] A silicon wafer is a silicon chip used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer, or silicon wafer.

[0003] Photolithography is one of the key steps in wafer manufacturing. It requires a coating machine to uniformly coat the wafer surface with photoresist to provide a high-resolution photosensitive layer for subsequent exposure, development and other steps. During the coating process, the wafer needs to be fixed on a rotating platform. The high-speed rotation generates centrifugal force to make the photoresist spread evenly and form a thin film with controllable thickness. However, it is usually inefficient and not suitable for mass production. Summary of the Invention

[0004] The purpose of this invention is to provide a convenient wafer coating equipment and coating method that can improve the automation level of the coating process while ensuring the positioning effect, thereby improving the efficiency of mass production.

[0005] The above-mentioned technical objective of the present invention is achieved through the following technical solution: A convenient wafer coating equipment includes a rotating worktable with several placement slots adapted to wafer workpieces. The bottom of each placement slot has several placement plates that abut against the bottom of the wafer workpiece. The placement slots move with the rotating worktable and pass sequentially through a loading position, a coating position, and a unloading position. A lifting rotary table is located below the coating position and a coating system is located above it. The outer periphery of the lifting rotary table avoids the placement plates and lifts the wafer workpiece.

[0006] Furthermore, the placement plate is connected to the placement drive, which drives the placement plate to enter or leave the placement slot.

[0007] Furthermore, the placement drive includes a rotating gear disk with internal teeth on its inner circumference that mesh with a plurality of driven teeth, and a placement plate connected to the driven teeth.

[0008] Furthermore, the outer periphery of the rotating gear disk is provided with external teeth that mesh with the drive teeth, and the drive teeth are connected to the motor that drives its rotation.

[0009] Furthermore, there are several loading positions, gluing positions, and unloading positions, and one drive tooth drives the corresponding rotating gear disks of the loading position / gluing position / unloading position to rotate together.

[0010] Furthermore, the unloading position includes an unloading conveyor belt located below the placement slot, for the wafer workpiece to leave via the unloading conveyor belt after the placement plate leaves the placement slot.

[0011] Furthermore, the loading position includes a loading conveyor belt and a lifting platform located below the placement slot. The loading conveyor belt abuts against both sides below the wafer workpiece, and the lifting platform is located below the center of the wafer workpiece, lifting the wafer workpiece from the loading conveyor belt into the placement slot.

[0012] Furthermore, the feeding conveyor belt is also provided with corresponding arc-shaped grooves, and the corresponding side of the wafer workpiece is placed in the arc-shaped grooves and positioned and moved above the lifting platform.

[0013] Furthermore, a positioning area is provided between the coating area and the unloading area, where the wafer workpiece is inspected or dried.

[0014] The present invention also discloses a coating method, comprising the following steps: a wafer workpiece is positioned in a placement slot at a loading position and supported by a placement plate; Then the worktable rotates, and the wafer workpiece moves to the coating position. At the coating position, the wafer workpiece is lifted by the lifting rotary table. The coating system achieves uniform coating by adsorbing the wafer workpiece and driving it to rotate during coating and lifting. Finally, the rotating table continues to rotate, and the wafer workpiece moves to the unloading position and is removed.

[0015] In summary, the present invention has the following beneficial effects: The wafer workpiece is moved by rotating the worktable. The placement slot improves the positioning accuracy, allowing it to pass sequentially through the loading position, coating position, positioning position, and unloading position. The placement board enters or leaves the placement slot via the placement drive, enabling the wafer workpiece to enter or leave the placement slot. The loading position uses a loading conveyor belt and lifting platform to load the wafer. The coating position uses a lifting rotating machine and coating system to apply and evenly coat the wafer, and it is convenient to place the wafer back on the rotating worktable after coating. The positioning position can be equipped with inspection or drying equipment in the future. The unloading position uses an unloading conveyor belt to unload the wafer, improving the automation level of the production process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a convenient wafer coating equipment according to the present invention; Figure 2 This is a schematic diagram of the rotating worktable part in a convenient wafer coating equipment of the present invention.

[0017] In the diagram, 1. Rotating worktable; 11. Placement trough; 2. Placement plate; 21. Rotating gear disc; 22. Driven gear; 23. Drive gear; 3. Lifting rotating machine platform; 4. Glue application system; 5. Unloading conveyor belt; 6. Loading conveyor belt; 61. Arc-shaped trough; 7. Lifting platform. Detailed Implementation

[0018] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings. These embodiments do not constitute a limitation of the present invention. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this application.

[0019] A convenient wafer coating device, such as Figure 1 As shown, the device includes a rotating worktable 1, which has several placement slots 11 adapted to the wafer workpieces. The bottom of each placement slot 11 has several placement plates 2 that abut against the wafer workpieces. The placement slots 11 rotate clockwise with the rotating worktable 1 and pass through the loading position, the coating position, the positioning position, and the unloading position in sequence. The wafer workpieces are loaded at the loading position, coated at the coating position, inspected or dried at the positioning position, and unloaded at the unloading position. The loading position, coating position, positioning position and unloading position are each set with two or more adjacent positions, so that two or more wafer workpieces can perform the above work simultaneously. The rotating worktable 1 is driven and transported by a motor and gear transmission at the bottom rotating shaft, which can also be replaced by other rotary drive components.

[0020] like Figure 1 and Figure 2 As shown, the placement plate 2 is connected to the placement drive component, which drives the placement plate 2 to enter (rotate radially) or leave (rotate tangentially) the placement slot 11. Specifically, the placement plate 2 is rotatably connected to the bottom of the rotating worktable 1. The placement drive component includes a rotating gear disk 21, which is rotatably connected to the bottom of the rotating worktable 1. The rotating gear disk 21 has internal teeth on its inner circumference and meshes with several driven teeth 22. The placement plate 2 is fixedly connected to the corresponding driven teeth 22, so that the rotating gear disk 21 can drive the multiple driven teeth 22 and the placement plate 2 to rotate. The outer periphery of the rotating gear disk 21 is provided with external teeth that mesh with the drive teeth 23. The drive teeth 23 are located between two loading positions / coating positions / positioning positions / unloading positions. The drive teeth 23 are connected to the motor that drives them to rotate, so that one drive tooth 23 drives the two rotating gear disks corresponding to the loading position / coating position / positioning position / unloading position to rotate together, synchronously driving two wafer workpieces to work. It can also be set with more loading positions, etc., and drive adjacent rotating gear disks 21 in the same group to rotate together through gear and other transmission structures, so that multiple wafer workpieces can be processed synchronously.

[0021] like Figure 1 and Figure 2 As shown, the loading position includes a loading conveyor belt 6 and a lifting platform 7 located below the placement slot 11. In this embodiment, the loading conveyor belt 6 includes drive rollers at both ends and several parallel belts outside the drive rollers. The drive rollers are driven by a synchronous belt or the like. The drive rollers are also provided with a limiting groove to limit the position of the synchronous belt. Each parallel belt of the loading conveyor belt 6 abuts against the two sides below the wafer workpiece. The lifting platform 7 is located below the middle of the wafer workpiece (between adjacent parallel belts, the outer periphery is located inside each placement plate 2. No matter where the placement plate 2 is moved, the lifting platform 7 can pass up or down). The wafer workpiece is lifted from the loading conveyor to the placement slot 11. The lifting platform can be lifted by a hydraulic cylinder, a pneumatic cylinder or an electric cylinder or the like. To improve the positioning effect, the feeding conveyor belt 6 is also provided with a corresponding arc groove 61. The wafer workpiece is placed in the arc groove 61 on the corresponding side and positioned and moved above the lifting platform 7. Alternatively, a positioning baffle can be set at the end position of the feeding conveyor belt to abut against the outside of the wafer workpiece, so that it is positioned and then lifted by the lifting platform 7 to the placement groove 11 to improve the positioning effect.

[0022] like Figure 1 and Figure 2 As shown, the coating position is located 90 degrees clockwise from the loading position. Below it is a lifting rotary table 3 and above it is a coating system 4. The lifting rotary table 3 can achieve the overall lifting action through hydraulic cylinders, air cylinders or electric cylinders. The lifting rotary table 3 includes an upper plate and a lower rotating shaft. The rotating shaft is driven by a motor and connected to a vacuum suction port. The vacuum suction port is connected to the plate, so that the outer periphery of the lifting rotary table 3 avoids the placement plate 2 and lifts up the wafer workpiece to hold and drive it to rotate. The coating system 4 applies the adhesive. The specific coating and driving principles of the coating system 4 and the lifting rotary table 3 are existing technologies and will not be described in detail here. The upper plate of the lifting rotary table 3 can be adapted to the placement slot 11, and the loading and unloading of materials can be achieved by the movement of the placement plate 2. Alternatively, it can be directly adapted to the placement plate 2, so that the lifting rotary table 3 can pass through the placement plate 2 upward or downward no matter where the placement plate 2 is moved.

[0023] like Figure 1 As shown, the position to be positioned is located after rotating the glue application position 90 degrees clockwise, and the unloading position is located after rotating the position to be positioned 90 degrees clockwise. The position to be positioned may be used to place drying equipment, etc. The unloading position includes an unloading conveyor belt 5 located below the placement tank 11, which allows the wafer workpiece to fall onto the unloading conveyor belt 5 after the placement plate 2 leaves the placement tank 11, and then be conveyed away by the unloading conveyor belt 5.

[0024] This embodiment also discloses an adhesive application method, including the following steps: The placement plate 2 at the loading position rotates to the tangential direction. At the same time, the wafer workpieces are conveyed by the loading conveyor belt 6. After the two wafer workpieces are conveyed to the position, the two lifting platforms 7 lift up and position the corresponding wafer workpieces upward and send them into the placement slot 11. Then the placement plate 2 rotates to the radial direction and the two lifting platforms 7 fall down, so that the two wafer workpieces are supported by the corresponding placement plate 2. Then the rotating worktable 1 rotates, and the two wafer workpieces move to the coating position. At the coating position, the wafer workpieces are lifted by the corresponding lifting rotating machine table 3. The two coating systems 4 achieve coating, and the two lifting rotating machine tables 3 adsorb the wafer workpieces and drive them to rotate, so as to achieve uniform coating. Then the worktable 1 rotates, and the two wafer workpieces move to the positioning. As needed, a detection mechanism or drying equipment is set up to perform detection, drying or de-drying work. Finally, the rotating worktable 1 continues to rotate, and the two wafer workpieces move to the unloading position. The placement plate 2 rotates to the tangential position, and the wafer workpieces fall downward onto the unloading conveyor belt 5 and are conveyed away by the unloading conveyor belt 5.

[0025] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art can make various modifications or equivalent substitutions to the present invention within the scope of its essence and protection. Such modifications or equivalent substitutions should also be considered to fall within the protection scope of the present invention.

Claims

1. A convenient wafer coating equipment, characterized in that: It includes a rotating worktable with several placement slots adapted to the wafer workpieces. The bottom of the placement slots has several placement plates that abut against the bottom of the wafer workpieces. The placement slots move with the rotating worktable and pass through the loading position, the coating position and the unloading position in sequence. Below the coating position is a lifting rotating machine and above it is a coating system. The outer periphery of the lifting rotating machine avoids the placement plates and lifts the wafer workpieces.

2. The convenient wafer coating equipment according to claim 1, characterized in that: The placement plate is connected to the placement drive component, which drives the placement plate to enter or leave the placement slot.

3. The convenient wafer coating equipment according to claim 2, characterized in that: The placement drive includes a rotating toothed disk with internal teeth on its inner circumference that mesh with a plurality of driven teeth, and a placement plate connected to the driven teeth.

4. The convenient wafer coating equipment according to claim 3, characterized in that: The rotating gear disk has external teeth on its outer periphery that mesh with the drive teeth, which are connected to the motor that drives its rotation.

5. A convenient wafer coating equipment according to claim 4, characterized in that: There are several loading positions, gluing positions, and unloading positions. One drive tooth drives the rotating toothed discs corresponding to the loading position / gluing position / unloading position to rotate together.

6. A convenient wafer coating equipment according to claim 2, characterized in that: The unloading position includes an unloading conveyor belt located below the placement slot, which allows the wafer workpiece to leave the placement slot via the unloading conveyor belt after the placement plate leaves the placement slot.

7. A convenient wafer coating equipment according to claim 2, characterized in that: The loading station includes a loading conveyor belt and a lifting platform located below the placement slot. The loading conveyor belt abuts against the lower sides of the wafer workpiece, and the lifting platform is located below the middle of the wafer workpiece, lifting the wafer workpiece from the loading conveyor belt into the placement slot.

8. A convenient wafer coating equipment according to claim 7, characterized in that: The feeding conveyor belt is also provided with corresponding arc-shaped grooves, and the wafer workpiece is placed in the corresponding arc-shaped grooves on the corresponding side and positioned and moved above the lifting platform.

9. A convenient wafer coating equipment according to claim 1, characterized in that: There is also a positioning area between the coating area and the unloading area, where the wafer workpiece is inspected or dried.

10. A coating method, employing a convenient wafer coating device as described in claim 1, characterized in that: The process includes the following steps: the wafer workpiece is positioned in the placement slot at the loading position and supported by the placement plate; Then the worktable rotates, and the wafer workpiece moves to the coating position. At the coating position, the wafer workpiece is lifted by the lifting rotary table. The coating system achieves uniform coating by adsorbing the wafer workpiece and driving it to rotate during coating and lifting. Finally, the rotating table continues to rotate, and the wafer workpiece moves to the unloading position and is removed.

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