Server

Abstract

The invention relates to the technical field of electronic power, in particular to a server which comprises a data processing device and a first radiator, the data processing device comprises a load group and a power supply module, the load group comprises at least two loads, and the power supply module supplies power to the loads; the first radiator is in thermal connection with the power supply module, at least part of projection of the first radiator in a first plane is located on the outer side of a load area, the first plane is parallel to the upper surface of the load, and the load area is a minimum outer contour projection area, capable of covering all the loads, of the load group in the first plane. The power supply module and the load can be separated for heat dissipation, the first radiator does not occupy the heat dissipation space of the load, and the good heat dissipation effect of the load is guaranteed; meanwhile, at least part of the projection of the first radiator in the first plane is located on the outer side of the load area, fluid flowing through the first radiator in the rear row is not preheated by the load radiator in the front row, the temperature of the cooling medium is kept low, and therefore the heat dissipation capacity of the first radiator is high.

Description

Technical Field

[0001] This disclosure relates to the field of electronic power technology, and in particular to a server. Background Technology

[0002] With the increasing demand for high computing power in industries such as artificial intelligence and cloud computing, power supply systems will need to adapt to kilowatt-level chips. Existing server power supply architectures primarily employ horizontal and vertical architectures. In horizontal power supply schemes, the current transmission path through the circuit board is relatively long, resulting in significant losses in the power delivery network (PDN) and lower system power efficiency. In vertical power supply schemes, heat sinks used to cool the power supply modules encroach on the load's cooling space, limiting the load's cooling capacity and impacting its computing power. Furthermore, the heat sinks of the rear power supply modules are affected by the heat sinks of the front load modules, leading to poor heat dissipation and failing to meet the cooling requirements of the power supply modules. Summary of the Invention

[0003] The purpose of this disclosure is to provide a server that meets the heat dissipation requirements of the power supply module and improves server performance.

[0004] To achieve the above objectives, this disclosure provides a server, including a data processing device and a first heat sink. The data processing device includes a load group and a power supply module. The load group includes at least two loads, and the power supply module supplies power to the load group. The first heat sink is thermally connected to the power supply module. At least a portion of the projection of the first heat sink in a first plane is located outside the load area. The load includes an upper surface and a lower surface disposed opposite to each other. The first plane is parallel to the upper surface of the load. The load area is the smallest outer contour projection area of ​​the load group in the first plane that can cover all the loads.

[0005] In one embodiment of this disclosure, at least 10% of the projection of the first heat sink in the first plane is located outside the load area.

[0006] In one embodiment of this disclosure, the portion of the first heat sink located outside the load region is distributed outside at least two edges of the load region.

[0007] In one embodiment of this disclosure, the server further includes a housing and a second heat sink, the second heat sink being located above the load for dissipating heat from the load; the first heat sink, the second heat sink, and the load assembly are all located within the housing; in the projection of the first plane, at least a portion of the first heat sink is located between a side wall of the housing and a side wall of the second heat sink disposed opposite to the side wall of the housing, and the width of the portion of the first heat sink located between the side wall of the housing and the side wall of the second heat sink is at least 10% of the distance between the side wall of the second heat sink and the side wall of the housing.

[0008] In one embodiment of this disclosure, at least a portion of the first heat sink is in contact with the housing.

[0009] In one embodiment of this disclosure, the power supply module includes at least one power supply module, and third heat sinks are respectively provided on both sides of the second heat sink. The third heat sink includes a third heat conduction part and a third heat dissipation part. The third heat conduction part is thermally connected to the power supply module, and the third heat dissipation part is thermally connected to the third heat conduction part. At least a portion of the projection of the third heat sink in the first plane is located within the load area.

[0010] In one embodiment of this disclosure, the third heat sink is an air guide shroud structure, the power supply module is thermally connected to the air guide shroud, and the air guide shroud is arranged around the circumference of the power supply module.

[0011] In one embodiment of this disclosure, the data processing device further includes a first carrier board, through which the power supply module supplies power to the load group;

[0012] The first carrier board is disposed between the load group and the power supply module, or the load group and the power supply module are both disposed on the same side of the first carrier board;

[0013] At least a portion of the first heat sink is located on the side of the power supply module away from the first carrier plate.

[0014] In one embodiment of this disclosure, the projection area of ​​the first carrier plate in the first plane is larger than the load area, and at least a portion of the projection of the first heat sink in the first plane is located between the load area and the projection area of ​​the first carrier plate in the first plane; or, at least a portion of the projection of the first heat sink in the first plane is located outside the projection area of ​​the first carrier plate in the first plane.

[0015] In one embodiment of this disclosure, the first carrier board includes at least two sub-carrier boards, which are respectively connected to at least two of the loads in the load group. The power supply module includes at least two power supply modules, which are respectively connected to the at least two sub-carrier boards. The projection area of ​​the first carrier board in the first plane is the smallest outer contour projection area of ​​the first carrier board that can cover all the sub-carrier boards in the first plane.

[0016] In one embodiment of this disclosure, the projection area of ​​the first carrier plate in the first plane is used as the load area.

[0017] In one embodiment of this disclosure, the server further includes a housing, and at least a portion of the first heat sink is located between the edge of the housing and the edge of the first carrier plate, wherein the width of the portion of the first heat sink located between the edge of the housing and the edge of the first carrier plate is at least 10% of the distance between the edge of the first carrier plate and the sidewall of the housing disposed opposite to the edge.

[0018] In one embodiment of this disclosure, the server further includes a second carrier board located below the first carrier board, and at least a portion of the first heat sink located above the second carrier board.

[0019] In one embodiment of this disclosure, the first heat sink includes a first heat-conducting part, the second carrier plate is provided with a first through hole, the first heat-conducting part includes a first protrusion, the first protrusion passes through the first through hole to dissipate heat from the power supply module.

[0020] In one embodiment of this disclosure, the first heat sink includes a first heat dissipation section, which is entirely disposed below the second carrier plate.

[0021] In one embodiment of this disclosure, the server further includes an additional heat source and a fourth heat sink, the additional heat source being disposed on the second carrier board;

[0022] The second carrier plate is provided with a second through hole, and the fourth heat sink includes a second protrusion, which passes through the second through hole and is thermally connected to the additional heat source.

[0023] And / or, the second carrier plate is provided with a third through hole, and a heat-conducting column is provided in the third through hole, and the additional heat source is thermally connected to the fourth heat sink through the heat-conducting column.

[0024] In one embodiment of this disclosure, the server further includes a second carrier board, wherein the load group and the power supply module are both disposed on the same side of the second carrier board, and the first heat sink is located above the power supply module.

[0025] In one embodiment of this disclosure, the power supply module includes at least one power supply module, the first heat sink includes a first heat-conducting part and a first heat-dissipating part, at least a portion of the first heat-conducting part is disposed below the power supply module, at least a portion of the first heat-dissipating part is located outside the load area, and the first heat-dissipating part is thermally connected to the first heat-conducting part.

[0026] In one embodiment of this disclosure, the first heat sink is an air guide shroud structure, the power supply module is thermally connected to the air guide shroud, and the air guide shroud is arranged circumferentially around the power supply module.

[0027] In one embodiment of this disclosure, the first heat-conducting part includes one or more of a heat pipe, a heat spreader, a metal heat-conducting plate, and a non-metallic heat-conducting structure.

[0028] In one embodiment of this disclosure, the first heat dissipation part includes one or more of the following: heat dissipation fins, water-cooled plate, metal plate, and non-metallic heat dissipation structure.

[0029] In one embodiment of this disclosure, the first heat sink is a one-piece molded structure, or the first heat sink includes multiple heat dissipation structures connected together.

[0030] In one embodiment of this disclosure, the load includes one or more of a GPU, CPU, NPU, DPU, ASIC, FPGA, APU, and TPU.

[0031] In one embodiment of this disclosure, the number of data processing devices is at least two, the at least two data processing devices are arranged along a first direction, and the at least two loads in the load group of each data processing device are arranged along a second direction, the first direction being perpendicular to the second direction, and both the first direction and the second direction being parallel to the first plane.

[0032] In one embodiment of this disclosure, the data processing device is an open computing acceleration module.

[0033] In one embodiment of this disclosure, the power supply module includes at least one power supply module, which in turn includes at least one power supply module.

[0034] Through long-term observation, experimentation, and research, the inventors discovered that the poor heat dissipation performance of power supply modules in existing servers is mainly due to the following factors: Taking a vertical power supply architecture as an example, the internal structure of a typical AI (Artificial Intelligence) server is illustrated. In many common scenarios, an AI server contains a system board and multiple OAM (Open Computing Project Accelerator Modules) mounted on the system board. A single OAM module mainly includes an OAM board, a load, a load heatsink, and a power supply module. Electrical signal transmission is achieved between the system board and the individual OAM board via connectors. The power supply module is located on the bottom surface of the OAM board or indirectly electrically connected to the bottom surface of the OAM board via a carrier board. The load is located on the top surface of the OAM board. The projections of the power supply module and the load on the plane of the system board at least partially overlap, and the power supply module supplies power to the load. To prevent warping and deformation of the OAM board, reinforcing ribs are typically provided on the top and bottom surfaces. Current OAM module cooling solutions are based on individual OAM modules on a per-module basis. The load heatsink for a single load within each OAM module is located above the OAM board (above the load). If reinforcing ribs are present on the top surface, the load heatsink is located above the reinforcing ribs. The maximum on-board cooling space for a single OAM module is the space above the OAM board, overlapping the projection of the OAM board onto the system board. The load heatsink is located within this maximum on-board cooling space. The projection of the load heatsink onto the system board plane must at least cover the projection of the corresponding load onto the system board plane; that is, the entire area directly above the load is covered by a load heatsink. This increases the heat dissipation area of ​​the load heatsink. Positioning the heatsink perpendicular to the load minimizes the heat dissipation path, thereby enhancing the heat dissipation capacity of the load heatsink. To meet the high computing power requirements of the load, the load heat sink is often made as large as possible to meet the high power consumption requirements. Therefore, the load heat sink is usually set to occupy as much of the maximum heat dissipation space on the board as possible, that is, its projection on the system board overlaps with the projection of the OAM board on the system board as much as possible.

[0035] In server cooling solutions based on the aforementioned power supply architectures, a separate heatsink is often used for each individual load and its corresponding power supply module within each OAM module. In some cases, both the individual load and its corresponding power supply module share a common load heatsink, located within the maximum heat dissipation space on the board. This load heatsink needs to cool both the load and the power supply module simultaneously. However, the maximum heat dissipation space on the board is limited by the OAM board's size; some space is used for power supply module cooling, leaving less space for load cooling, thus limiting the load's cooling capacity. In other cases, a single load has its own heatsink, and its corresponding power supply module has its own heatsink. Both are located within the maximum heat dissipation space above the load. The power supply module heatsink further encroaches on the maximum heat dissipation space, resulting in less space for load cooling and limiting the load's cooling capacity, thus impacting its computing power. The heat dissipation area of ​​the load heatsink and the power supply module heatsink are mutually restrictive, and their cooling capacities conflict. In addition, each power supply module corresponding to a single load is equipped with a heat sink, which also has the disadvantages of having a large number of heat sinks and complicated processing and installation.

[0036] Furthermore, servers typically contain multiple OAM modules, meaning multiple loads and their corresponding power supply modules. The heat sinks for each load and the power supply module are alternately arranged above the loads, resulting in a mixed and unseparated cooling space for the loads and power supply modules. This means the power supply modules and loads cannot be isolated for heat dissipation, leading to low system cooling efficiency, limited load cooling capacity, and insufficient power supply module cooling causing temperatures to exceed their limits. Additionally, due to server width limitations, the multiple OAM modules (loads and their corresponding power supply modules) are often arranged in at least two rows. Cooling media, such as air, flows in from the front, first passing through the load and power supply module heat sinks in the first row, and then continuing into the second row of load and power supply module heat sinks. Since the heat sinks of each load and power supply module are located in the maximum heat dissipation space on their respective OAM modules, and the maximum heat dissipation spaces on the front and rear OAM modules overlap in the direction of cooling medium inflow, the load heat sinks of the front OAM modules preheat the air, resulting in a higher air temperature flowing into the power supply module heat sinks of the rear OAM modules. This leads to poor heat dissipation capacity of the power supply module heat sinks in the rear OAM modules, causing the temperature of the rear power supply modules to exceed their temperature limit requirements. The temperature difference between the power supply modules in the front and rear OAM modules is large, which in turn reduces the reliability and lifespan of the power supply modules.

[0037] Based on this, the main beneficial effects of this disclosure are:

[0038] The server disclosed herein provides a first heat sink capable of dissipating heat from power supply modules corresponding to at least two loads. Since at least a portion of the projection of the first heat sink onto the first plane is located outside the load area, the power supply modules and loads can be separated for heat dissipation. The first heat sink does not encroach on the heat dissipation space of the load, ensuring good heat dissipation for the load, thereby guaranteeing the computing power performance of the load and improving the performance of the server. At the same time, since at least a portion of the projection of the first heat sink onto the first plane is located outside the load area, the fluid flowing through the rear row of first heat sinks will not be preheated by the front row of load heat sinks, and the temperature of the cooling medium remains low. Therefore, the first heat sink has strong heat dissipation capacity, meets the heat dissipation requirements of the power supply modules, and effectively reduces the temperature of the power supply modules. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0040] Figure 1 A schematic diagram of the structure of a server provided in an embodiment of this disclosure;

[0041] Figure 2 This is a schematic diagram of the load area in an embodiment of this disclosure;

[0042] Figure 3 Another schematic diagram of the server structure provided in this embodiment of the disclosure;

[0043] Figure 4 This is a schematic diagram of a third server structure provided in an embodiment of the present disclosure;

[0044] Figure 5 This is a schematic diagram of a fourth server structure provided in an embodiment of the present disclosure;

[0045] Figure 6 A schematic diagram of a fifth structure of a server provided in an embodiment of this disclosure;

[0046] Figure 7 A sixth structural diagram of a server provided in an embodiment of this disclosure;

[0047] Figure 8 A seventh structural diagram of a server provided in an embodiment of this disclosure;

[0048] Figure 9 A schematic diagram of an eighth structure of a server provided in an embodiment of this disclosure;

[0049] Figure 10 A schematic diagram of the structure of a third heat sink in a server provided in an embodiment of this disclosure;

[0050] Figure 11 Another schematic diagram of the structure of a third heat sink in a server provided in an embodiment of this disclosure;

[0051] Figure 12 A ninth structural diagram of a server provided in an embodiment of this disclosure;

[0052] Figure 13 A schematic diagram of a tenth structure of a server provided in an embodiment of this disclosure;

[0053] Figure 14 This is a schematic diagram of the carrier plate area in an embodiment of this disclosure;

[0054] Figure 15 An eleventh structural diagram of a server provided in an embodiment of this disclosure;

[0055] Figure 16 This is a schematic diagram of the twelfth structure of the server provided in this embodiment of the disclosure;

[0056] Figure 17 A schematic diagram of the thirteenth structure of a server provided in this embodiment of the disclosure;

[0057] Figure 18 A schematic diagram of the fourteenth structure of a server provided in this embodiment of the disclosure;

[0058] Figure 19 This is a schematic diagram of the fifteenth structure of a server provided in an embodiment of this disclosure;

[0059] Figure 20 This is a sixteenth structural diagram of a server provided in an embodiment of the present disclosure;

[0060] Figure 21 This is a schematic diagram of the seventeenth structure of a server provided in an embodiment of the present disclosure;

[0061] Figure 22 A top view of a server provided for an embodiment of this disclosure (the number of data processing devices is multiple);

[0062] Figure 23 Another top view of a server provided in an embodiment of this disclosure (the number of data processing devices is multiple);

[0063] Figure 24 This is a schematic diagram of the eighteenth structure of a server provided in an embodiment of the present disclosure;

[0064] Figure 25 This is a schematic diagram of the nineteenth structure of a server provided in an embodiment of the present disclosure;

[0065] Figure 26 This is a schematic diagram of the twentieth structure of the server provided in this embodiment of the disclosure.

[0066] The annotations in the attached figures are explained as follows:

[0067] 1-Load; 2-Power supply module; 21-Power supply module; 3-First heat sink; 31-First heat conduction part; 311-First protrusion; 312-Heat conduction plate; 313-Population plate; 32-First heat dissipation part; 3a-First heat dissipation structure; 3b-Second heat dissipation structure; 4-Second heat sink; 5-Shell; 51-Base plate; 52-Side wall; 6-Third heat sink; 61-Third heat conduction part; 611-U-shaped heat pipe; 62-Third heat dissipation part; 621-U-shaped plate; 7-Subcarrier plate; 71-First reinforcing rib; 72-Second reinforcing rib; 8-Second carrier plate; 81-Heat conduction column; 9-Fourth heat sink; 91-Second protrusion; 10-Additional heat source; 20-System support plate. Detailed Implementation

[0068] The technical solutions of this disclosure will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0069] In the description of this disclosure, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0070] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0071] See Figures 1 to 26As shown, some embodiments of this invention provide a server, including a data processing device, a first heat sink 3, a second carrier board 8, and a second heat sink 4. The data processing device includes a load group, a power supply module, and a first carrier board. The load group includes at least two loads 1, each load 1 including an upper surface and a lower surface disposed opposite to each other. The power supply module includes at least two power supply modules 2. The first carrier board includes at least two sub-carrier boards 7. Each power supply module 2 is electrically connected to a load 1 through a sub-carrier board 7 to supply power to the load 1. The number of power supply modules 2 and loads 1 are the same and correspond one-to-one. The power supply module 2 includes at least two power supply modules 21. There is a first plane, which is parallel to the upper surface of the load 1. The lower surface of the load 1 is used for electrical connection. For example, when the power supply is vertical, the lower surface of the load 1 can be directly connected to the power supply module 2 or connected to the power supply module 2 through the sub-carrier board 7. For example, when the power supply is horizontal, the lower surface of the load 1 is connected to the first carrier board or the second carrier board 8. In a vertical system, the first plane can be a horizontal plane, and in a horizontal system, the first plane can be a vertical plane. In some embodiments of this invention, the load group and the power supply module 2 adopt a vertical power supply architecture. The load 1 and the power supply module 2 are stacked vertically through a carrier plate, that is, in the direction perpendicular to the first plane, i.e., in the vertical direction, the load 1 is above the power supply module 2; the projections of the power supply module 2 and the load 1 on the first plane at least partially overlap. Two second heat sinks 4 are respectively located above the two loads 1, and their projections on the first plane respectively cover the projections of the loads 1 on the first plane, and are located within the projection of the sub-carrier plate 7 on the first plane. The second heat sinks 4 are used to dissipate heat from the loads 1, and the second heat sinks 4 and the loads 1 are thermally connected, with a one-to-one correspondence between the second heat sinks 4 and the loads 1. Multiple loads 1 can be electrically connected to each other through the second carrier plate 8. The top and bottom surfaces of each sub-carrier plate 7 of the first carrier plate can be respectively provided with a first reinforcing rib 71 and a second reinforcing rib 72, which serve to provide structural support for each sub-carrier plate and prevent each sub-carrier plate from warping or deforming.

[0072] The power supply modules (e.g., four power supply modules 21) corresponding to the load groups (e.g., the two loads 1 in the figure) share a first heat sink 3. The first heat sink 3 includes a first heat-conducting part 31 and a first heat-dissipating part 32. The server also includes a system support plate 20, which is a structural component with a certain strength and can be made of metal or non-metal. The first heat-conducting part 31 can be partially embedded in the system support plate 20 (e.g., the two loads 1 in the figure). Figure 4 , Figure 13 and Figure 17 In this context, it can also completely replace the entire surface (e.g.) Figure 1 System support plate 20. The system support plate 20 is located below the second carrier plate 8 and is mechanically connected to the second carrier plate 8, serving as a structural support to prevent the second carrier plate 8 from bending and deforming.

[0073] At least a portion of the first heat-conducting part 31 is disposed below the power supply module 2 and extends from below the second carrier plate 8 to the outer side of the second carrier plate 8. In some embodiments of this invention, the first heat dissipation part 32 is located outside the load area, wherein the load area is the projection area of ​​the smallest outer contour of the area that can cover all loads 1 in the load group on the first plane. In other embodiments of this invention, the projection of the first heat dissipation part 32 on the first plane is entirely located outside the projection of the sub-carrier plate 7 on the first plane. In this way, the first heat sink 3 is located outside the maximum heat dissipation space on the OAM module, and the maximum heat dissipation space on the maximum board can be used entirely as the heat dissipation space for the load 1. The first heat sink 3 does not occupy the heat dissipation space of the load 1, the area of ​​the second heat sink 4 reaches the maximum, and the heat dissipation capacity of the second heat sink 4 reaches the maximum, thereby enabling the computing performance of the load 1 to reach the optimal level; moreover, the heat dissipation space of the power supply module and the heat dissipation space of the load 1 do not overlap and are completely independent of each other, thereby improving the heat dissipation efficiency of the server system and improving the heat dissipation capacity of the load 1 and the power supply module. This embodiment is suitable for situations where the load power consumption is extremely high, the power supply module loss is low, the load temperature is high, which limits the system performance, and the load heat dissipation is the system heat dissipation bottleneck. In some embodiments of this invention, both first heat dissipation portions 32 are fins, respectively disposed on the left and right outer sides of the second carrier plate 8, and the first heat dissipation portions 32 are thermally connected to the first heat-conducting portions 31. The upper surfaces of the two power supply modules 2 are respectively connected to a load 1 through a sub-carrier plate 7, and the lower surfaces of the two power supply modules 2 are thermally connected to the first heat-conducting portion 31 of a first heat sink 3, and the two power supply modules 2 share the first heat sink 3 for heat dissipation. Here, thermal connection can refer to direct contact thermal connection or indirect contact thermal connection through a thermal interface material.

[0074] In some embodiments of this case, the projection of the second heat sink 4 of the load 1 onto the first plane is located within the projection of the subcarrier board 7 onto the first plane, while the projection of the first heat sink 32 of the first heat sink 3 of the power supply module 2 onto the first plane is located outside the projection of the subcarrier board 7 onto the first plane. The power supply module 2 and the load 1 do not share the space directly above the subcarrier board 7 (OAM board) for heat dissipation. Therefore, the power supply module 2 does not encroach on the heat dissipation space of the load 1, creating more heat dissipation space for the load 1. The heat dissipation capabilities of the first heat sink 3 and the second heat sink 4 do not conflict, ensuring good heat dissipation for the load 1, thereby ensuring the computing performance of the load 1 and improving the server performance; moreover, as Figure 1 and Figure 9As shown, the projections of the second heat sink 4 onto the first plane are respectively located within the projection areas of the two sub-carrier plates 7 onto the first plane. The projections of the first heat sink 3's first heat dissipation part 32 (e.g., heat dissipation fins) onto the first plane are located on the left and right sides (perpendicular to the fluid inflow direction) outside the load area, and further outside the projection areas of the two sub-carrier plates 7 onto the first plane. This makes the heat dissipation spaces of the power supply module and the two load groups independent of each other, achieving separate heat dissipation. That is, on the plane perpendicular to the fluid inflow direction, the first heat dissipation part 32 of the first heat sink 3 is located on the left and right sides of the second heat sink 4, without overlap. Therefore, the fluid flowing through the rear row of first heat sink 3 will not be preheated by the front row of load heat sinks, and the temperature of the cooling medium remains low. Thus, the first heat sink 3 has strong heat dissipation capacity, which can effectively reduce the temperature of the power supply module and meet the heat dissipation requirements of the power supply module.

[0075] In some embodiments of this case, the projection of the first heat dissipation part 32 (e.g., heat dissipation fins) of the first heat sink 3 onto the first plane may be partially located within the projection area of ​​the first carrier plate on the first plane, but entirely outside the load area. In this way, the first heat sink 3 is at least partially located within the maximum heat dissipation space on the OAM module. The maximum heat dissipation space on the maximum plane cannot be entirely used as the heat dissipation space for the load. The heat dissipation space of the load 1 is smaller than the heat dissipation space on the maximum plane but larger than the heat dissipation space vertically above the load area. Compared to embodiments where the projection of the first heat sink onto the first plane is entirely outside the projection area of ​​the first carrier plate on the first plane, the area of ​​the first heat sink 3 can be increased, and the heat dissipation capacity of the first heat sink 3 is relatively larger. However, the heat dissipation capacity of the second heat sink 4 is relatively smaller. This embodiment is suitable for situations where the load power consumption is large, the power supply module loss is also large, and the load temperature and power supply temperature are both high, resulting in limited system performance.

[0076] In other embodiments of this case, the first heat dissipation part 32 (e.g., heat dissipation fins) of the first heat sink 3 is partially located within the load area and partially located outside the load area on the first plane. In this way, the first heat sink 3 is not only located within the maximum heat dissipation space on the OAM module, but its projection part in the first plane is also located within the load area. Thus, the heat dissipation space of the second heat sink 4 is smaller than the heat dissipation space vertically above the load area, but the heat dissipation area of ​​the first heat sink 3 can be further increased. Compared with the above two embodiments, the heat dissipation space of the load is the smallest, the heat dissipation capacity of the second heat sink 4 is the weakest, and the heat dissipation capacity of the first heat sink 3 is the strongest. This embodiment is suitable for situations where the load power consumption is small, the power supply module loss is large, and the power supply temperature is high, resulting in limited system performance.

[0077] In some embodiments of this invention, the first heat sink 3 can integrate the first heat-conducting part 31 and the first heat-dissipating part 32. In this case, the first heat sink 3 is in direct contact with the lower surface of the power supply module or in contact through a thermal interface material, and the first heat sink 3 is thermally connected to the power supply module. The first heat sink 3 can be located directly below the second carrier plate 8, such as... Figure 24 Alternatively, it can be positioned directly below the second carrier plate 8 and in the space beside the second carrier plate 8, such as... Figure 25 This satisfies heat dissipation requirements while simplifying installation procedures and making maintenance and assembly easier.

[0078] In other embodiments of this case, the second carrier plate 8, the second heat sink 4, and the reinforcing ribs may not be included.

[0079] In some embodiments of this invention, a power supply module includes at least one power supply module 2, and a power supply module 2 includes at least one power supply module 21. The first carrier board includes at least two sub-carrier boards 7, the number of which is not limited. The power supply module 2 is electrically connected to the load 1 through the sub-carrier boards 7 to supply power to the load 1.

[0080] In some other embodiments, the first carrier board may be omitted, allowing the electronic module 2 to be directly electrically connected to the load 1 to supply power to the load 1.

[0081] In some embodiments of this invention, the load group and power supply module can adopt a vertical power supply architecture, characterized by: the load 1 and the power supply module 2 being directly stacked vertically or stacked vertically via a carrier board, i.e., in the direction perpendicular to the first plane, i.e., in the vertical direction, the load 1 is above or below the power supply module 2; preferably, the projections of the power supply module 2 and the load 1 on the first plane at least partially overlap, minimizing the electrical transmission path between the load 1 and the power supply module 2, thereby reducing the power delivery network (PDN) loss and improving the system power supply efficiency, or there may be no overlap. Of course, in other embodiments of this invention, the load group and power supply module can also adopt a horizontal power supply architecture, i.e., the load 1 and the power supply module 2 are both disposed on the same plane or on the same side of the first carrier board 3 or the second carrier board 8.

[0082] In some embodiments, a load 1 (e.g., a GPU), a power supply module 2 disposed below the load 1, a first sub-carrier board (e.g., an OAM board) connecting the two, and a load heat sink above the load 1 together constitute an OAM module. Each data processing device includes at least two OAM modules, and the two OAM modules share a first heat sink 3. In the server provided in this embodiment, the first heat sink 3 can dissipate heat from the power supply modules 2 corresponding to at least two loads 1. Since at least a portion of the projection of the first heat sink 3 onto the first plane is located outside the load area, the maximum on-board heat dissipation space of a single OAM module is the space above the sub-carrier board (OAM board) of the OAM module, and the space where the projection onto the first plane overlaps with the projection of the sub-carrier board (OAM board) onto the first plane. The second heat sink 4 (load heat sink) is located within the maximum on-board heat dissipation space.

[0083] Taking a load group consisting of two loads (1) as an example, see [link / reference]. Figure 2 As shown, Figure 2 The dashed box in the diagram represents the first plane. Load 1 includes an upper surface and a lower surface that are positioned opposite each other. The upper surface of load 1 is parallel to the first plane, and the lower surface of load 1 is close to the power supply module 2. The area enclosed by the dashed box is the load area. Each dashed box can cover two loads 1. In this embodiment, the load area is defined as the smallest outer contour projection area within the first plane that can cover all loads 1.

[0084] In some embodiments of this invention, payload 1 may include one or more of the following: a graphics processing unit (GPU), a central processing unit (CPU), an embedded neural network processing unit (NPU), a data processing unit (DPU), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), an accelerated processing unit (APU), and a tensor processing unit (TPU).

[0085] The types of loads 1 in a load group can be at least partially the same, or they can all be different.

[0086] In some embodiments of this case, the power supply module 2 includes at least one power supply module. For example, such as... Figure 1As shown, the power supply module 2 in this embodiment includes two power supply modules 21, which supply power to the same load 1.

[0087] In some embodiments of this case, the data processing device may be an Open Computing Project (OCP) Accelerator Module.

[0088] In some embodiments of this invention, the power supply module includes only one power supply module 2, which supplies power to at least two loads 1 of the load group. The power supply module 2 includes at least one power supply module.

[0089] In some embodiments of this case, the first heat sink 3 can be a power module heat sink for cooling the power supply module, the second heat sink 4 can be a load heat sink for cooling the load 1, and the second carrier board 8 can be a system board.

[0090] In some embodiments of this case, see Figure 1 As shown, the first heat sink 3 includes a first heat-conducting part 31 and a first heat-dissipating part 32. At least a portion of the first heat-conducting part 31 is disposed below the power supply module, and at least a portion of the first heat-dissipating part 32 is located outside the load area. The first heat-dissipating part 32 is thermally connected to the first heat-conducting part 31. This thermal connection can refer to direct contact or indirect contact via a thermal interface material. The first heat-conducting part 31 can be partially embedded in the system support plate 20 (e.g., ...). Figure 4 , Figure 13 , Figure 17 As shown), it can also completely replace the system support plate 20 (as shown). Figure 1 The system support plate 20 is located below the second carrier plate 8 and is mechanically connected to the second carrier plate 8, serving as structural support and preventing the second carrier plate 8 from bending or deforming. The system support plate 20 is a structural component with a certain strength and can be made of metal or non-metal materials.

[0091] In some embodiments of this invention, the first heat-conducting part 31 can be one of a heat pipe, a vapor chamber, a metal heat-conducting plate, and a non-metallic heat-conducting structure. The first heat-conducting part 31 can also include a combination of at least two of the following: a heat pipe, a vapor chamber, a metal heat-conducting plate, and a non-metallic heat-conducting structure. The metal heat-conducting plate can be a copper plate, and the non-metallic heat dissipation structure can be a multilayer graphite film or a multilayer graphene heat-conducting film. The vapor chamber can be a vapor chamber vapor chamber plate.

[0092] For example, see Figure 3As shown, the first heat-conducting part 31 includes a heat spreader 313 and a heat-conducting plate 312. The heat-conducting plate 312 includes a horizontal plate and a vertical plate, which are fixedly connected. The horizontal plate is parallel to the surface of the load 1. The heat spreader 313 is located between the horizontal plate and the power supply module 2. The heat spreader 313 is used to quickly diffuse and spread the heat from the power supply module 2, achieving the effect of uniform temperature and eliminating local hot spots. The heat-conducting plate 312 is used to transfer the heat from the power supply module 2 to the heat dissipation part 32 through heat conduction. Then, the cooling medium flows through the heat dissipation part 32 to carry away the heat. The heat-conducting plate 312 is generally a metal plate, relying on the thermal conductivity of the metal itself to achieve heat diffusion. For example, the thermal conductivity of copper is 385 W / (mK), and the thermal conductivity of aluminum alloy (6063 series) is 201 W / (mK). The vapor chamber 313 is a closed cavity made of metal. A highly efficient phase-change heat transfer element, formed by capillary liquid injection and vacuuming within the cavity, is used. This element has a stronger heat diffusion capability than a metal plate; for example, a 2mm thick vapor chamber vapor chamber vapor chamber has an equivalent thermal conductivity of 5000–20000 W / (mk). A portion of the first heat-conducting part 31 is located below the power supply module 2, and another portion is located above it. For example, the vapor chamber 313 and the horizontal plate are located below the power supply module 2, a portion of the vertical plate is located below the power supply module 2, and another portion of the vertical plate is located above it. A portion of the projection of the first heat-conducting part 31 onto the first plane is located outside the load area, and another portion is located within the load area. It should be noted that "above" and "below" in this document refer to their relative position in the height direction, not that the two structures are limited to the same projection plane.

[0093] When there are multiple data processing devices, each data processing device can be equipped with a small heat spreader, or multiple data processing devices can share a heat spreader. The advantages of a small heat spreader are that it has small flatness and tolerance, lower contact thermal resistance between the heat spreader and the power supply module 2 after installation, better overall heat transfer effect, flexible configuration, and easy process implementation; the advantage of sharing a large heat spreader is that it is easy to install.

[0094] In some embodiments, the first heat dissipation part 32 can be one of heat dissipation fins, a water-cooled plate, a metal plate, and a non-metallic heat dissipation structure, or a combination of at least two of these structures. The metal plate can be a copper plate or an aluminum plate. It should be noted that the material of the first heat dissipation part 32 can also be a composite material composed of diamond and other materials, such as diamond copper or diamond silver, or graphene.

[0095] In some embodiments, see Figure 3As shown, the first heat dissipation part 32 is a heat dissipation fin, which is connected to the vertical plate. Heat from the electronic module 2 is conducted to the heat dissipation fins via the heat spreader 313, the horizontal plate, and the vertical plate. See also, for an example... Figure 3 As shown, the heat dissipation fins are located above the power supply module 2 and outside the load area.

[0096] In other embodiments, see Figure 4 As shown, the first heat dissipation part 32 can be a cold plate, with flow channels inside and a circulation pump and pipeline outside to circulate coolant within it. The cold plate is used to exchange heat with the power supply module 2 to dissipate heat from the power supply module 2. See, for an example, [example not provided]. Figure 4 As shown, in the height direction (indicated by the direction of arrow Z), the cold plate is located below the power supply module 2. Part of the cold plate is located outside the load area, and another part is located within the load area, further increasing the heat dissipation area and improving the heat dissipation capacity.

[0097] In some embodiments, see Figure 5 and Figure 7 As shown, the first heat sink 3 is a one-piece molded structure. The one-piece molded first heat sink 3 can be a heat dissipation structure made of heat dissipation fins, water cooling plate, heat spreader, copper plate, aluminum plate, or graphene, diamond copper, or diamond silver materials. The thermal conductivity of the first heat sink 3 is not less than 45 W / m·K.

[0098] It should be understood that, Figure 4 , Figure 5 and Figure 26 The server shown may also include a second heat sink 4.

[0099] In other embodiments, see Figure 8 As shown, the first heat sink 3 includes multiple heat dissipation structures, which are connected together. These multiple heat dissipation structures can be fixed together by welding or bonding, riveting, or fasteners such as bolts and nuts.

[0100] For example, the heat dissipation structure can be one or more of the following: heat dissipation fins, water-cooled plates, heat spreaders, copper plates, aluminum plates, graphene heat dissipation structures, diamond copper heat dissipation structures, and diamond silver heat dissipation structures. Specifically, the number of heat dissipation structures is at least two. When the number of heat dissipation structures is two, the two heat dissipation structures can be the same or different. When the number of heat dissipation structures is three or more, all heat dissipation structures can be one of the following: heat dissipation fins, water-cooled plates, heat spreaders, copper plates, aluminum plates, graphene heat dissipation structures, diamond copper heat dissipation structures, and diamond silver heat dissipation structures. Alternatively, some heat dissipation structures can use the same structure, or all heat dissipation structures can use different structures.

[0101] In some other embodiments, the first heat sink 3 includes a first heat dissipation structure 3a and a second heat dissipation structure 3b. The first heat dissipation structure 3a can be a heat spreader, and the second heat dissipation structure 3b can be heat dissipation fins.

[0102] In other embodiments, the first heat sink 3 can also be a shroud structure, allowing the power supply module 2 to be thermally connected to the shroud. This thermal connection can be achieved by using a thermal interface material between the shroud and the power supply module 2, allowing heat to be conducted from the power supply module to the shroud through the thermal interface material. The thermal interface material can significantly reduce the contact thermal resistance between the power supply module 2 and the shroud, greatly improving heat transfer efficiency. Thermal interface materials generally include materials such as silicone grease, thermal conductive gel, and thermal pads. The shroud is arranged circumferentially around the power supply module 2, perpendicular to the airflow direction. By fully utilizing the shroud structure for heat dissipation, the shroud serves both airflow guidance and heat dissipation functions, eliminating the need for a separate heat sink.

[0103] like Figure 10 As shown, the air guide structure includes a U-shaped heat pipe 611 and a U-shaped plate 621. The U-shaped heat pipe 611 is thermally connected to the power supply module 2, and the U-shaped plate 621 is thermally connected to the U-shaped heat pipe 611. The U-shaped heat pipe 611 includes a horizontal section and two vertical sections. The power supply module 2 is installed in the horizontal section. The openings of the U-shaped heat pipe 611 and the U-shaped plate 621 are opposite each other, and the two vertical sections are respectively fixedly connected to the outer surfaces of the two side plates of the U-shaped plate 621.

[0104] The U-shaped heat pipe 611 is thermally connected to the power supply module 21, and the U-shaped plate 621 is thermally connected to the U-shaped heat pipe 611. This means that the heat from the power supply module can be conducted to the U-shaped heat pipe 611, and then from the U-shaped heat pipe 611 to the U-shaped plate 621.

[0105] In one embodiment, at least 10% of the projection of the first heat sink 3 onto the first plane is located outside the load area. This 10% projection can refer to 10% of the projected area of ​​the first heat sink 3 onto the first plane; however, considering the generally regular structure of the heat sink and for the sake of actual heat dissipation and ease of illustration, this 10% projection can also refer to 10% of the projected width of the first heat sink 3 onto the first plane. See also Figure 1 As shown, A is the width of the projection of the portion of the first heat sink 3 located on the outer side of one edge of the load area in the first plane, and B is the width of the projection of the portion of the first heat sink 3 located on the outer side of the other edge of the load area in the first plane, wherein A+B≥10% of the width of the projection of the first heat sink 3 in the first plane.

[0106] In this embodiment, the portion of the first heat sink 3 located outside the load area is distributed on the outer side of at least two edges of the load area. For example, the load area is rectangular with four edges, and the portion of the first heat sink 3 located outside the load area can be distributed on the outer side of at least two edges. When the width on one side is limited by the structure and cannot meet 10% of the projection width of the first heat sink 3 in the first plane, the sum of the widths on both sides meeting 10% can still guarantee a certain heat dissipation area, thereby ensuring a certain heat dissipation capacity and ultimately meeting the heat dissipation requirements of the power supply module 2.

[0107] See Figure 1 As shown, within the field of view, the portion of the first radiator 3 located outside the load area is distributed on the left and right sides of the load area. Of course, the portion of the first radiator 3 located outside the load area can also be distributed on the left and front sides of the load area, or in other locations outside the load area.

[0108] Thermal simulation analysis was performed on a model where 10% of the first heat sink 3 was distributed in the projected area outside the load 1. Under the same heat dissipation and airflow conditions, the temperature of the power supply module 2 was 25°C lower than that in the prior art where the load and power supply modules share a heat dissipation structure or heat dissipation area space, thus meeting the temperature limit requirements of the power supply module 2. When there is sufficient free space outside the load group, arranging as many first heat sinks 3 as possible on the outer side of the load area, i.e., when the projection width of the first heat sink 3 in the first plane is greater than or equal to 10%, the first heat sink 3 will have better heat dissipation performance.

[0109] In one embodiment, the server further includes a housing 5 and a second heat sink 4, which is located above the load 1 and is used to dissipate heat from the load 1. The first heat sink 3, the second heat sink 4 and the load group are all located inside the housing 5. At least a portion of the projection of the first heat sink 3 in the first plane is located outside the load area. The fluid flowing through the rear row of the first heat sink will not be preheated by the front row of load heat sinks, and the temperature of the cooling medium remains low. Therefore, the first heat sink 3 has strong heat dissipation capacity and can meet the heat dissipation requirements of the power supply module 2, thereby effectively reducing the temperature of the power supply module 2.

[0110] Since there is sufficient height space at the bottom of the load assembly, it can be used to arrange the first heat sink 3. Meanwhile, the area between the side wall of the housing 5 and the second heat sink 4 is a region with high cooling medium flow velocity. According to thermal simulation analysis, the flow velocity of the cooling medium in this area is approximately 5.5 m / s, while the flow velocity in other locations is approximately 2.6 m / s. Arranging as many first heat sinks 3 as possible in areas with high flow velocity helps to further reduce the temperature of the power supply module 2. In particular, thermal simulation analysis of a model where 10% of the first heat sinks 3 are distributed in the projected area outside the load 1 shows that, under the same heat dissipation and airflow conditions, the temperature of the power supply module 2 is 25°C lower than in existing technologies where the load and power supply module share a heat dissipation structure or heat dissipation area space. Therefore, the power supply module 2 meets its temperature limit requirements.

[0111] In some embodiments of this invention, within the projection of the first plane, at least a portion of the first radiator 3 is located between the side wall of the housing 5 and the side wall of the second radiator 4, which is disposed opposite to the side wall of the housing, and the width of the portion of the first radiator 3 located between the side wall of the housing and the side wall of the second radiator 4 is at least 10% of the distance between the side wall of the second radiator 4 and the side wall of the housing 5.

[0112] For example, see Figure 6 As shown, the housing 5 includes a right side wall 52 and a bottom plate 51. At least a portion of the first radiator 3 is located between the right side wall 52 of the housing 5 and the side wall of the second radiator 4 near the right side wall 52. The side wall of the second radiator 4 is disposed opposite to the right side wall 52 of the housing 5.

[0113] For example, the sidewall of the second radiator 4 is parallel to the right sidewall 52 of the housing 5, and the width of the portion of the first radiator 3 located between the right sidewall 52 of the housing 5 and the sidewall of the second radiator 4 is I1, which is at least the distance between the sidewall of the second radiator 4 and the right sidewall 52 of the housing 5 is d1, where I1 ≥ 10%d1.

[0114] Since the area between the sidewall of the housing and the second heat sink 4 near the sidewall of the housing is a region with a high cooling medium flow rate, at least a portion of the first heat sink 3 is disposed between at least one sidewall of the housing and the second heat sink 4, and there is a vertical plane perpendicular to the bottom plate 51 of the housing. This vertical plane intersects both the first heat sink 3 and the two second heat sinks 4. On this vertical plane, the common airflow design inside the chassis is adopted. Thermal simulation analysis is performed on the model with I1 = 10%d1. Under the same heat dissipation and airflow conditions, the temperature of the power supply module 2 is 25°C lower than that in the prior art where the load and the power supply module share the heat dissipation structure or heat dissipation area space. The power supply module 2 meets its temperature limit requirements.

[0115] It should be noted that when the side wall of the second radiator 4 is not parallel to the right side wall 52 of the housing 5, d1 is the minimum distance between the side wall of the second radiator 4 and the right side wall 52 of the housing 5.

[0116] In one embodiment, at least a portion of the first heat sink 3 is in contact with the housing 5. See also Figure 6 As shown, the surface of the first heat sink 3 near the bottom plate 51 of the housing is in contact with the bottom plate 51 of the housing 5, which increases the heat dissipation path. The heat of the power supply module is dissipated to the outside of the server through the first heat sink 3 and the housing 5, further reducing the temperature of the power supply module 2, thereby further improving the electrical transmission efficiency of the power supply module 2.

[0117] In one embodiment, see Figure 9 As shown, a third heat sink 6 is provided on each side of the second heat sink 4. The third heat sink 6 includes a third heat-conducting part 61 and a third heat-dissipating part 62. The third heat-conducting part 61 is thermally connected to the power supply module 2, and the third heat-dissipating part 62 is thermally connected to the third heat-conducting part 61. At least a portion of the projection of the third heat sink 6 in the first plane is located within the load area.

[0118] By providing a third heat sink 6, the heat dissipation path for the power supply module 2 can be increased, which can be used to dissipate heat from the power supply module 2 with higher power consumption. In this embodiment, the heat from the power supply module 2 can be dissipated not only through the first heat sink 3, but also through the third heat sink 6.

[0119] The third heat-conducting part 61 can be one or a combination of at least two of the following: an integrated bent heat spreader, a common heat pipe, an ultra-thin array heat pipe, a copper plate, an aluminum plate, diamond copper, diamond silver, graphene, etc. The third heat dissipation part 62 can be a heat dissipation mechanism made of metal, such as a toothed heat sink, a snap-fit ​​heat sink, a copper plate, an aluminum plate, a water-cooled plate, diamond copper, diamond silver, graphene, etc.

[0120] The third heat-conducting part 61 and the third heat-dissipating part 62 can be integrally formed or separately formed.

[0121] In this embodiment, the first heat sink 3 and the third heat sink 6 can share a portion of the heat-conducting part, that is, a part of the first heat-conducting part 31 and a part of the third heat-conducting part 61 are attached to or integrally disposed.

[0122] In some embodiments, the third heat sink 6 is an air guide shroud structure, which provides thermal connection between the electronic module 2 and the air guide shroud, and the air guide shroud is arranged around the circumference of the electronic module 2.

[0123] For example, see Figure 9 and Figure 10As shown, the third heat-conducting part 61 includes a U-shaped heat pipe 611, which includes a horizontal section and two vertical sections, for the electronic module 2 to be installed on the horizontal section; the third heat dissipation part 62 includes a U-shaped plate 621, with the opening of the U-shaped heat pipe 611 facing the opening of the U-shaped plate 621, and the two vertical sections are respectively fixedly connected to the outer surface of the two side plates of the U-shaped plate 621. The U-shaped plate 621 and the U-shaped heat pipe 611 together form a wind guide shroud structure.

[0124] For example, see Figure 10 As shown, the U-shaped plate 621 is a split structure; for example, the U-shaped plate 621 includes two L-shaped plates arranged opposite each other; or, see also... Figure 11 As shown, the U-shaped plate 621 is an integral structure.

[0125] exist Figure 9 Within the field of view shown, the air guide shroud is arranged around the circumference of the power supply module 2, meaning that the air guide shroud is arranged around the power supply module 2 in four directions (up, down, left, and right) to enhance the heat dissipation effect.

[0126] It should be noted that, see Figure 12 As shown, the third heat sink 6 can also be a 3DVC (Three Dimensional Vapor Chamber) heat sink. The 3DVC heat sink includes a third heat-conducting part 61 and a third heat-dissipating part 62.

[0127] In some embodiments of this invention, the data processing apparatus further includes a first carrier board through which the electronic module 2 supplies power to the load 1; at least a portion of the first heat sink 3 is located on the side of the electronic module 2 away from the first carrier board.

[0128] like Figure 9 As shown, in one possible design, the first carrier board is disposed between the load 1 and the power supply module 2. In this case, the data processing device is a vertical power supply architecture. A portion of the first heat sink 3 is located on the side of the power supply module 2 away from the first carrier board, and another portion is located on the side of the power supply module 2 close to the first carrier board. The power supply module 2 and the load 1 overlap at least partially in the direction perpendicular to the first carrier board.

[0129] In another possible design, see Figure 18 As shown, the load 1 and the power supply module 2 are both located on the same side of the first carrier board. At this time, the data processing device has a horizontal power supply architecture, and the first heat sink 3 is located on the side of the power supply module 2 away from the first carrier board, that is, all of them are located above the power supply module 2.

[0130] In this embodiment, the first carrier board can be a PCB (Printed Circuit Board), a DBC (Direct Bond Copper) board, or an OAM (OCP (Open Computing Project) Accelerator Module) board.

[0131] In some embodiments, a load 1 (such as a GPU), an electronics supply module 2 disposed below the load 1, a first subcarrier board (such as an OAM board) connecting the two, a load heat sink above the load 1, etc., together constitute an OAM module. Each data processing device includes at least two OAM modules.

[0132] like Figure 15 As shown, in one embodiment, the projection area of ​​the first carrier plate in the horizontal plane is larger than the load area, and at least a portion of the projection of the first heat sink 3 in the first plane is located between the load area and the projection area of ​​the first carrier plate in the first plane.

[0133] For low-power load 1 and water cooling solution, the projection size of the second heat sink 4 in the first plane can be designed to be the size of the load area. At this time, the first heat sink 3 can be arranged in the space within the projection area of ​​the first carrier board and outside the load area, thus making the arrangement of the first heat sink 3 simple and flexible and the process simplified.

[0134] In other embodiments, at least a portion of the projection of the first heat sink 3 onto the first plane may also be located outside the projection area of ​​the first carrier plate onto the first plane. This is suitable for cases where the load 1 has higher power consumption, creating more heat dissipation space for the load 1. For example, the entire space above the first carrier plate can be used for the load heat sink, improving the heat dissipation effect of the load 1, thereby improving the computing performance of the load 1 and thus improving the performance of the server. Since at least a portion of the projection of the first heat sink 3 onto the first plane is outside the projection area of ​​the first carrier plate, the load 1 and the power supply module 2 are cooled separately, and the heat dissipation capacities of the load heat sink and the power supply module heat sink do not conflict. Furthermore, the fluid here is not preheated by the front-row load heat sinks, resulting in a lower cooling medium temperature. Therefore, the first heat sink 3 has a strong heat dissipation capacity, leading to a lower temperature for the power supply module 2, which meets its heat dissipation requirements.

[0135] In one embodiment, see Figure 13 As shown, the first carrier plate includes at least two sub-carrier plates 7, and the at least two sub-carrier plates 7 are respectively connected to at least two loads 1 in the load group. The projection area of ​​the first carrier plate in the first plane is the smallest outer contour projection area of ​​the first carrier plate in the first plane that can cover all the sub-carrier plates 7.

[0136] The two sub-carrier plates 7 can be set separately or as a single piece.

[0137] See Figure 14 As shown, taking the first carrier plate as an example, which includes two sub-carrier plates 7, Figure 14 The thick double-dotted line box in the diagram represents the projection area of ​​the first carrier plate onto the first plane. For ease of description, the projection area of ​​the first carrier plate onto the first plane is simply referred to as the carrier plate area.

[0138] In one embodiment, at least 10% of the projection of the first heat sink 3 into the first plane is located outside the carrier plate region. See also Figure 15 As shown, M is the width of the projection of the portion of the first heat sink 3 located on the outer side of one edge of the carrier plate area in the first plane, and N is the width of the projection of the portion of the first heat sink 3 located on the outer side of the other edge of the carrier plate area in the first plane, wherein M+N≥10% of the width of the projection of the first heat sink 3 in the first plane. Thermal simulation analysis was performed on a model where 10% of the first heat sink 3 is distributed in the projection area outside the first carrier plate. Under the same heat dissipation and airflow conditions, the temperature of the power supply module 2 is 25℃ lower than that in the prior art where the load and power supply modules share a heat dissipation structure or heat dissipation area space, thus the power supply module 2 meets its temperature limit requirements.

[0139] See Figure 15 As shown, within the field of view, the portion of the first heat sink 3 located outside the carrier plate area is distributed on the left and right sides of the carrier plate area. Of course, the portion of the first heat sink 3 located outside the carrier plate area can also be distributed on the left and front sides of the carrier plate area, or in other positions outside the carrier plate area.

[0140] It should be understood that the projection of the first heat sink 3 in the first plane can also be entirely located within the carrier plate area.

[0141] In one embodiment, see Figure 16 As shown, the server also includes a housing 5, at least a portion of the first heat sink 3 is located between the edge of the housing 5 and the edge of the first carrier plate, and the width of the portion of the first heat sink 3 located between the edge of the housing 5 and the edge of the first carrier plate is at least 10% of the distance between the edge of the first carrier plate and the side wall of the housing 5 disposed opposite to the edge.

[0142] For example, see Figure 16 As shown, the first carrier plate includes a right edge, the housing 5 includes a right side wall 52 and a bottom plate 51, the right side wall 52 is disposed opposite to the right edge, and at least a portion of the first heat sink 3 is located between the right edge of the first carrier plate and the right side wall of the housing 5.

[0143] For example, the right edge of the first carrier plate is parallel to the right side wall of the housing 5, the width of the portion of the first heat sink 3 located between the right edge of the first carrier plate and the right side wall of the housing 5 is I2, and the distance between the right edge of the first carrier plate and the right side wall of the housing 5 is d2, where I2 ≥ 10%d2.

[0144] When the right edge of the first carrier plate is not parallel to the right side wall of the housing 5, d2 is the minimum distance between the right edge of the first carrier plate and the right side wall of the housing 5.

[0145] In some embodiments, see Figure 17 As shown, the server also includes a second carrier board 8, which is located below the first carrier board, and at least a portion of the first heat sink 3 is located above the second carrier board 8.

[0146] By setting the second carrier board 8, it is possible to realize the electrical connection of multiple loads 1 inside the data processing device and the electrical connection of multiple power supply modules 2.

[0147] See Figure 17 As shown, a portion of the first heat sink 3 is located above the second carrier plate 8. The first heat sink 3 includes a first heat-conducting part 31. The second carrier plate 8 is provided with a first through hole. The first heat-conducting part 31 includes a first protrusion 311, which passes through the first through hole to conduct heat to the power supply module 2. The first heat sink 3 also includes a first heat dissipation part 32. In the height direction (indicated by the arrow direction Z), the first heat dissipation part 32 is located above the second carrier plate 8, but the projection of the first heat dissipation part 32 in the first plane is not necessarily entirely within the projection area of ​​the second carrier plate 8 in the first plane. See also Figure 17 As shown, the projection of the first heat dissipation part 32 in the first plane can be entirely located outside the projection area of ​​the second carrier plate 8 in the first plane.

[0148] See Figure 18 As shown, the first heat sink 3 is entirely located above the second carrier plate 8, and at this time, the data processing device has a horizontal power supply architecture. It should be noted that the terms "above" and "below" in this article refer to their relative position in the height direction, rather than limiting the two structures to being on the same projection plane.

[0149] In other embodiments, see Figure 20 As shown, the first heat dissipation part 32 of the first heat sink 3 is located below the first heat conduction part 31, and the first heat dissipation part 32 is entirely disposed below the second carrier plate 8. This can make full use of the space between the second carrier plate 8 and the bottom plate of the housing for heat dissipation, meeting the heat dissipation requirements of the power supply module 2. There is no need to arrange the power supply module heat sink between the second carrier plate 8 and the side wall of the housing, which helps to reduce the size of the server in the width direction, wherein the width direction is consistent with the arrangement direction of the two loads 1.

[0150] In one embodiment, see Figure 21 As shown, the server also includes an additional heat source 10, which is disposed on the second carrier board 8. The first heat sink 3 can dissipate heat for the power supply module 2 and also for the additional heat source 10.

[0151] The additional heat source 10 may include a control module, a power module, a PCIe (Peripheral Component Interconnect Express) processor, an EXP (Expansion Card module) module, etc. Since the space at the bottom of the server can be used to arrange the first heat sink 3, and the second carrier board 8 is arranged above at least a portion of the first heat sink 3, the heat source on the second carrier board 8, such as the power supply module 2, can directly contact the first heat sink 3 for heat dissipation. For heat sources that cannot directly contact the first heat sink 3, a fourth heat sink 9 can be provided. The fourth heat sink 9 is arranged on the upper side of the second carrier board 8. For example, the fourth heat sink 9 can be arranged above the additional heat source 10 and in contact with the additional heat source 10 to dissipate heat from the additional heat source 10.

[0152] The fourth heat sink 9 can also be located on the side of the second carrier plate 8 away from the auxiliary heat source 10. The second carrier plate 8 is provided with a second through hole. The fourth heat sink 9 includes a second protrusion 91, which passes through the second through hole and is thermally connected to the auxiliary heat source 10. The second carrier plate 8 is provided with a third through hole, and a heat-conducting column 81 is provided in the third through hole. The auxiliary heat source 10 is thermally connected to the fourth heat sink 9 through the heat-conducting column 81.

[0153] In other embodiments, either the second through hole or the third through hole may be provided.

[0154] It should be noted that a via can also be directly provided on the second carrier plate 8, and a third protrusion can be provided on the side of the first heat sink 3 near the second carrier plate 8. The third protrusion extends from the via to the side of the auxiliary heat source 10, contacts the auxiliary heat source 10 and dissipates heat.

[0155] In one embodiment, see Figure 19 As shown, for a horizontal power supply architecture, the server may also include a second carrier board 8, omitting the first carrier board, thereby shortening the signal transmission path and improving the signal transmission rate and efficiency. In this case, the load 1 and the power supply module 2 are both located on the same side of the second carrier board 8, and the first heat sink 3 is located above the power supply module 2.

[0156] It should be understood that, in the height direction, the first heat sink 3 is located above the second carrier plate 8, and the projection of the first heat sink 3 in the first plane is not necessarily entirely within the projection of the second carrier plate 8 in the first plane.

[0157] In this embodiment, at least a portion of the first heat sink 3 is located between the edges of the housing 5 and the second carrier plate 8, and the width of the portion of the first heat sink 3 located between the edges of the housing 5 and the second carrier plate 8 is at least 10% of the distance between the edge of the second carrier plate 8 and the sidewall of the housing 5 disposed opposite to that edge.

[0158] In one embodiment, the number of data processing devices is at least two, and the at least two data processing devices are arranged along a first direction. At least two load cells 1 in the load group of each data processing device are arranged along a second direction. The first direction is perpendicular to the second direction, and both the first and second directions are parallel to a first plane. In this embodiment, both the first and second directions are perpendicular to the height direction of the server, one of which is the length direction of the server, and the other is the width direction of the server.

[0159] In one possible design, see Figure 22 As shown, the arrow direction X represents the first direction, the arrow direction Y represents the second direction, the thick solid line box represents the data processing device, and the dashed line box represents the load group in the data processing device. There are four data processing devices. Among them, the two data processing devices on the left are arranged along the first direction within the field of view. The load group in the two data processing devices on the left each includes two loads 1, and the two loads 1 are arranged along the second direction.

[0160] Since at least a portion of the projection of the first heat sink 3 onto the first plane is located outside the load area, the power supply module 2 and the load 1 can be separated for heat dissipation. This ensures that the heat from the power supply module 2 in the front-row data processing unit is transferred independently from the outside of the data processing unit to the rear-row data processing unit. The inflow temperature of the first heat sink 3 in the rear-row data processing unit is lower, resulting in stronger heat dissipation capacity. This further ensures that the temperature of the power supply module 2 in the rear-row data processing unit is lower, avoiding uneven current and unstable power supply caused by excessive temperature difference between the power supply modules 2 of the front and rear-row data processing units. The front-row data processing unit refers to the data processing unit located below within the field of view.

[0161] In another possible design, see Figure 23 As shown, the arrow direction X represents the first direction, the arrow direction Y represents the second direction, the thick solid line box represents the data processing device, and the dashed line box represents the load group in the data processing device. There are four data processing devices, which are arranged along the first direction. Each data processing device's load group includes two loads 1, which are arranged along the second direction.

[0162] It should be understood that when the number of data processing devices is three or more, all data processing devices may be arranged along the first direction, or at least two of them may be arranged along the first direction, and the remaining data processing devices may be arranged along the second direction with either of the two data processing devices.

[0163] See Figure 26 As shown, the server provided in this embodiment may also omit the second carrier board 8 and the second heat sink 4. Specifically, the server may include a data processing device and a first heat sink 3. The data processing device includes a load group and a power supply module. The load group includes at least two loads 1, and the power supply module supplies power to the load group. The first heat sink 3 is thermally connected to the power supply module. At least a portion of the projection of the first heat sink 3 in the first plane is located outside the load area. The load 1 includes an upper surface and a lower surface that are disposed opposite to each other. The first plane is parallel to the upper surface of the load. The load area is the smallest outer contour projection area of ​​the load group in the first plane that can cover all loads.

[0164] The server provided in this embodiment has a first heat sink that can dissipate heat for the power supply modules corresponding to at least two loads. Since at least a portion of the projection of the first heat sink in the first plane is located outside the load area, the power supply module and the load can be separated for heat dissipation. The first heat sink does not encroach on the heat dissipation space of the load, ensuring good heat dissipation effect of the load, thereby ensuring the computing power performance of the load and improving the performance of the server. At the same time, since at least a portion of the projection of the first heat sink in the first plane is located outside the load area, the fluid flowing through the rear row of first heat sinks will not be preheated by the front row of load heat sinks, and the temperature of the cooling medium remains low. Therefore, the first heat sink has strong heat dissipation capacity, meets the heat dissipation requirements of the power supply module, and effectively reduces the temperature of the power supply module.

[0165] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A server, characterized in that, The device includes a data processing unit and a first heat sink. The data processing unit includes a load group and a power supply module. The load group includes at least two loads, and the power supply module supplies power to the load group. The first heat sink is thermally connected to the power supply module. At least a portion of the projection of the first heat sink in a first plane is located outside the load area. The load includes an upper surface and a lower surface that are disposed opposite to each other. The first plane is parallel to the upper surface of the load. The load area is the smallest outer contour projection area of ​​the load group that can cover all the loads in the first plane.

2. The server according to claim 1, characterized in that, At least 10% of the projection of the first heat sink in the first plane is located outside the load area.

3. The server according to claim 1, characterized in that, The portion of the first heat sink located outside the load area is distributed outside at least two edges of the load area.

4. The server according to any one of claims 1 to 3, characterized in that, It also includes a housing and a second radiator, the second radiator being located above the load for dissipating heat from the load; the first radiator, the second radiator, and the load assembly are all located within the housing; in the projection of the first plane, at least a portion of the first radiator is located between the side wall of the housing and the side wall of the second radiator, which is disposed opposite to the side wall of the housing, and the width of the portion of the first radiator located between the side wall of the housing and the side wall of the second radiator is at least 10% of the distance between the side wall of the second radiator and the side wall of the housing.

5. The server according to claim 4, characterized in that, At least a portion of the first heat sink is in contact with the housing.

6. The server according to claim 4, characterized in that, The power supply module includes at least one power supply module. A third heat sink is provided on each side of the second heat sink. The third heat sink includes a third heat conduction part and a third heat dissipation part. The third heat conduction part is thermally connected to the power supply module, and the third heat dissipation part is thermally connected to the third heat conduction part. At least a portion of the projection of the third heat sink in the first plane is located within the load area.

7. The server according to claim 6, characterized in that, The third heat sink is a wind guide shroud structure. The power supply module is thermally connected to the wind guide shroud, and the wind guide shroud is arranged around the circumference of the power supply module.

8. The server according to any one of claims 1 to 3, characterized in that, The data processing device further includes a first carrier board, through which the power supply module supplies power to the load group; The first carrier board is disposed between the load group and the power supply module, or the load group and the power supply module are both disposed on the same side of the first carrier board; At least a portion of the first heat sink is located on the side of the power supply module away from the first carrier plate.

9. The server according to claim 8, characterized in that, The projection area of ​​the first carrier plate in the first plane is larger than the load area, and at least a portion of the projection of the first heat sink in the first plane is located between the load area and the projection area of ​​the first carrier plate in the first plane; or, at least a portion of the projection of the first heat sink in the first plane is located outside the projection area of ​​the first carrier plate in the first plane.

10. The server according to claim 8, characterized in that, The first carrier board includes at least two sub-carrier boards, which are respectively connected to at least two of the loads in the load group. The power supply module includes at least two power supply modules, which are respectively connected to the at least two sub-carrier boards. The projection area of ​​the first carrier board in the first plane is the smallest outer contour projection area of ​​the first carrier board that can cover all the sub-carrier boards in the first plane.

11. The server according to claim 8, characterized in that, It also includes a housing, wherein at least a portion of the first heat sink is located between the edge of the housing and the edge of the first carrier plate, and the width of the portion of the first heat sink located between the edge of the housing and the edge of the first carrier plate is at least 10% of the distance between the edge of the first carrier plate and the sidewall of the housing disposed opposite to the edge.

12. The server according to claim 8, characterized in that, It also includes a second carrier plate located below the first carrier plate, and at least a portion of the first heat sink located above the second carrier plate.

13. The server according to claim 12, characterized in that, The first heat sink includes a first heat-conducting part, and the second carrier plate is provided with a first through hole. The first heat-conducting part includes a first protrusion, which passes through the first through hole to dissipate heat from the power supply module.

14. The server according to claim 12, characterized in that, The first heat sink includes a first heat dissipation section, which is entirely disposed below the second carrier plate.

15. The server according to claim 12, characterized in that, It also includes an additional heat source and a fourth heat sink, the additional heat source being disposed on the second carrier plate; The second carrier plate is provided with a second through hole, and the fourth heat sink includes a second protrusion, which passes through the second through hole and is thermally connected to the additional heat source. And / or, the second carrier plate is provided with a third through hole, and a heat-conducting column is provided in the third through hole, and the additional heat source is thermally connected to the fourth heat sink through the heat-conducting column.

16. The server according to any one of claims 1 to 3, characterized in that, It also includes a second carrier board, wherein the load group and the power supply module are both disposed on the same side of the second carrier board, and the first heat sink is located above the power supply module.

17. The server according to any one of claims 1 to 3, characterized in that, The power supply module includes at least one power supply module, the first heat sink includes a first heat-conducting part and a first heat-dissipating part, at least a portion of the first heat-conducting part is disposed below the power supply module, at least a portion of the first heat-dissipating part is located outside the load area, and the first heat-dissipating part is thermally connected to the first heat-conducting part.

18. The server according to claim 17, characterized in that, The first heat sink is a wind guide structure, and the power supply module is thermally connected to the wind guide, which is arranged around the circumference of the power supply module.

19. The server according to claim 17, characterized in that, The first heat-conducting part includes one or more of the following: heat pipe, heat spreader, metal heat-conducting plate, and non-metallic heat-conducting structure.

20. The server according to claim 17, characterized in that, The first heat dissipation part includes one or more of the following: heat dissipation fins, water cooling plate, metal plate, and non-metallic heat dissipation structure.

21. The server according to any one of claims 1 to 3, characterized in that, The first heat sink is a one-piece molded structure, or the first heat sink includes multiple heat dissipation structures connected together.

22. The server according to any one of claims 1 to 3, characterized in that, The workload includes one or more of GPU, CPU, NPU, DPU, ASIC, FPGA, APU and TPU.

23. The server according to any one of claims 1 to 3, characterized in that, The number of data processing devices is at least two, and the at least two data processing devices are arranged along a first direction. The at least two loads in the load group of each data processing device are arranged along a second direction. The first direction is perpendicular to the second direction, and both the first direction and the second direction are parallel to the first plane.

24. The server according to any one of claims 1 to 3, characterized in that, The data processing device is an open computing acceleration module.

25. The server according to any one of claims 1 to 3, characterized in that, The power supply module includes at least one power supply module, and the power supply module includes at least one power supply module.

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