Integrated single-point touch cover plate and preparation method thereof

Abstract

The invention discloses an integrated single-point touch cover plate and a preparation method thereof.The integrated single-point touch cover plate comprises a glass substrate, and the back face of the glass substrate is provided with a silver paste wiring layer formed through direct printing; the silver paste wiring layer comprises at least one group of independent touch sensing units, signal wires electrically connected with the touch sensing units, and a binding pad area formed by gathering the tail ends of the signal wires; the touch sensing unit comprises at least one touch bonding pad; an ink shielding layer is further arranged on the back face of the glass substrate, the ink shielding layer completely covers the surface of the silver paste wiring layer, and a hollowed-out window is only formed in the corresponding position of the bonding pad binding area. Single-point touch control can be achieved by printing the silver paste on the back face of the glass substrate, an ITO sensor layer and FPC touch keys are omitted, the structure and procedures are simplified, and the problems that circuits are visible and air tightness is poor are solved.

Description

Technical Field

[0001] This invention relates to the field of capacitive touch technology, and in particular to an integrated single-point touch cover plate and its manufacturing method. Background Technology

[0002] Capacitive touchscreens, with their superior interactive performance, have been widely used in various electronic devices with touch interaction functions, such as consumer electronics, industrial control displays, and smart homes. Currently, mainstream capacitive touch solutions generally adopt a three-layer stacked structure of "cover plate + independent touch sensor + flexible circuit board (FPC)". The touch sensor typically uses ITO (indium tin oxide) etching technology to form the touch circuitry, and the FPC is used to transmit and process the touch signals.

[0003] CN201310241019A discloses a capacitive touchscreen using a copper-plated conductive substrate. This solution involves sputtering copper foil onto an independent conductive substrate using a coating process. Following dry film photoresist exposure, development, and etching, copper signal line patterns and transparent conductive film patterns are formed on the conductive substrate, creating an independent touch sensor. This sensor is then bonded to a cover plate using optical double-sided adhesive, and used in conjunction with a flexible circuit board to achieve touch functionality. This solution uses copper-plated film instead of traditional ITO material, reducing raw material costs to some extent, while achieving fine line widths and spacings of less than 50μm, adapting to the design requirements of narrow-bezel products. However, this solution still does not break away from the traditional layered stacking structure, and a separate sensor substrate layer must be set up. This not only increases the overall thickness and structural complexity of the touch module, but also requires an additional bonding process between the sensor and the cover plate, which is prone to introducing bonding bubbles, misalignment and other yield losses. At the same time, this solution still needs to be bound to a separate flexible circuit board (FPC), which cannot solve the problems of module opacity and poor airtightness after assembly caused by FPC. In addition, its core process relies on vacuum sputtering and wet etching, which requires large equipment investment, long process flow and high environmental costs, and cannot adapt to the needs of low cost and simple process single-point touch scenarios.

[0004] CN201810910826A discloses a sputtering process for a touchscreen bottom film. This method constructs an orthogonal electromagnetic field in a vacuum deposition chamber, and ionizes argon gas through glow discharge in a high vacuum environment, accelerating argon ions to bombard the target material, causing the target material atoms to deposit on the surface of an independent touchscreen bottom film to form a uniform coating. The target material can be made of materials such as ITO, copper, and aluminum. This method mainly optimizes the coating uniformity, coating adhesion, and substrate compatibility of the touchscreen bottom film, overcoming some defects of traditional electroplating and vacuum evaporation processes. However, this method only optimizes the coating process of the touch sensor bottom film and does not break away from the traditional structural framework of "independent sensor bottom film + cover plate". It still requires a separate sensor layer and a matching FPC, and cannot achieve integrated integration of touch function and cover plate. It cannot solve the core problems of high cost, poor airtightness, and complicated process caused by the layered structure. At the same time, its core process is vacuum sputtering, which requires a high vacuum environment and high-voltage start-up equipment. The process conditions are harsh and the production efficiency is low, making it difficult to meet the needs of large-scale low-cost production.

[0005] In summary, existing touch technology solutions cannot simultaneously solve the technical problems of visible ITO etched lines, complex layered stacking structures, high costs, poor airtightness, and cumbersome processes caused by independent sensors and FPCs. For single-point touch scenarios with simple structures and controllable costs, existing solutions have obvious performance and cost redundancy. There is an urgent need for a technical solution that can integrate the cover plate and touch function, simplify the structure and process, reduce production costs, and optimize touch reliability. Summary of the Invention

[0006] To address the shortcomings of the existing technology, the core improvement of this invention lies in breaking away from the existing layered stacking framework of "cover plate + independent touch sensor + FPC" and directly integrating silver paste touch circuitry on the back of the glass cover plate to achieve the integration of the cover plate and touch function.

[0007] Compared with CN201310241019A and CN201810910826A, this invention does not require a separate sensor substrate layer, eliminating the bonding process between the sensor and the cover plate, thus avoiding yield losses due to bonding bubbles and misalignment at the source. At the same time, the silver paste touch pads directly printed on the cover plate replace the touch buttons on the FPC, requiring only a very small bonding area to achieve signal conduction, solving the problems of opacity and poor airtightness caused by the full-surface bonding of traditional FPCs. In addition, this invention uses a printing process to form the circuit, eliminating the need for complex processes such as vacuum sputtering and wet etching, greatly simplifying the process flow and solving the pain points of cumbersome processes and large equipment investment in existing technologies.

[0008] The first aspect of this invention discloses an integrated single-point touch cover plate, comprising a glass substrate, wherein a silver paste wiring layer formed by direct printing is provided on the back side of the glass substrate, the silver paste wiring layer comprising at least one set of independent touch sensing units, signal lines electrically connected to the touch sensing units, and bonding pad areas formed by the ends of the signal lines; the touch sensing unit comprises at least one touch pad; the back side of the glass substrate is further provided with an ink masking layer, the ink masking layer fully covering the surface of the silver paste wiring layer, and having a cutout window only at the corresponding position of the bonding pad area.

[0009] As an optional implementation, the touch pad is circular, triangular, or irregularly shaped.

[0010] As another optional implementation, multiple touch pads are provided, and each touch pad is connected to an independent signal trace. The signal traces are insulated from each other and do not conduct to each other.

[0011] As another optional implementation, the pitch, line width, and line spacing of the silver paste wiring layer are all greater than or equal to their respective preset limit control values; the dyne value of the back surface of the glass substrate is greater than 36mN / m.

[0012] As another optional implementation, the bonding pad area corresponds to the position of the cutout window of the ink masking layer, and is used to press-fit and electrically connect with the flexible circuit board carrying the touch control chip.

[0013] As another alternative implementation, the ink masking layer completely covers the touch pads and signal traces of all touch sensing units, exposing the bonding pad area only through a cutout window.

[0014] The second aspect of this invention discloses a method for preparing an integrated single-point touch cover, used to prepare the integrated single-point touch cover described in the first aspect of this invention, comprising the following steps: S1. Clean and surface activate the back side of the glass substrate; S2. Conductive silver paste is printed on the back side of the glass substrate and cured to form a silver paste wiring layer. The silver paste wiring layer includes at least one set of independent touch sensing units, signal lines electrically connected to the touch sensing units, and bonding pad areas formed by the ends of the signal lines. The touch sensing unit includes at least one touch pad. S3. A masking ink is printed on the back of the glass substrate and cured to form an ink masking layer. The ink masking layer completely covers the surface of the silver paste trace layer, with a cutout window reserved only at the corresponding position of the bonding pad area to obtain an integrated single-point touch cover.

[0015] As an optional implementation, in step S1, the dyne value on the back side of the glass substrate after surface activation treatment is greater than 36 mN / m, and the interval between the completion of glass substrate cleaning and conductive silver paste printing is controlled within 30 minutes.

[0016] As another optional implementation, in step S2, the conductive silver paste is cured using a hot air curing process with a curing temperature of 130℃~150℃ and a curing time of 20min~40min; in step S3, the masking ink is cured using a hot air curing process with a curing temperature of 120℃~140℃ and a curing time of 15min~30min.

[0017] As another optional implementation, step S4 is also included: pressing and bonding the manufactured integrated single-point touch cover plate to the flexible circuit board carrying the touch control chip through the bonding pad area, confirming and solidifying the bonding machine parameters, and then fully bonding it with the liquid crystal display module, and calibrating the touch sensitivity through hardware debugging. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of an integrated single-point touch cover disclosed in an embodiment of the present invention; Figure 2 This is a schematic flowchart of a method for preparing an integrated single-point touch cover plate disclosed in an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a fabrication device for an integrated single-point touch cover disclosed in an embodiment of the present invention. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Example 1 See Figure 1This invention discloses an integrated single-point touch cover plate, comprising a glass substrate 1, a silver paste wiring layer 2 formed by direct printing on the back side of the glass substrate 1, the silver paste wiring layer 2 including at least one set of independent touch sensing units, signal lines 21 electrically connected to the touch sensing units, and bonding pad areas 4 formed by the ends of the signal lines 21; the touch sensing unit includes at least one touch pad 22; the back side of the glass substrate 1 is also provided with an ink masking layer 3, the ink masking layer 3 fully covering the surface of the silver paste wiring layer 2, and a cutout window 31 is provided only at the corresponding position of the bonding pad area 4 at the end of the signal lines 21.

[0022] This invention eliminates the need for a separate sensor substrate layer, thus avoiding the bonding process between the sensor and the cover plate and fundamentally preventing yield losses due to bonding bubbles and misalignment. Furthermore, by replacing the touch buttons on the FPC with silver paste touch pads directly printed on the cover plate, signal conduction can be achieved with only a very small bonding area, solving the problems of opacity and poor airtightness caused by traditional full-surface FPC bonding. In addition, this invention uses a printing process to form the circuit, eliminating the need for complex processes such as vacuum sputtering and wet etching, significantly simplifying the process and addressing the pain points of cumbersome processes and high equipment investment in existing technologies.

[0023] The back side of the glass substrate 1 in this embodiment refers to the side of the glass substrate 1 facing the liquid crystal display module (LCM), which is not the front side for user touch operation. The ink masking layer 3 in this embodiment is an insulating masking ink, which is a common dielectric material in the field of capacitive touch. It fully covers the surface of the silver paste trace layer 2 and does not block the capacitive sensing signal, nor does it affect the normal implementation of the single-point touch function. This design has been verified by touch sensitivity testing.

[0024] In an optional embodiment, the touch pad 22 is circular, triangular, or irregularly shaped.

[0025] The shape of the touch pad 22 can be flexibly adjusted according to the size of the cover plate, the layout of the frame, and the number of touch buttons required, adapting to product designs of different specifications and having strong versatility; the circular touch pad 22 can form a uniform and stable sensing capacitance, ensuring the consistency of the touch trigger threshold and reducing the probability of false triggering; the triangular and irregular structures can adapt to special layout spaces such as the corners of the cover plate, improving the utilization rate of the cover plate space.

[0026] The touch pad 22 described in this embodiment is the core sensing structure for realizing single-point touch function. Each touch pad 22 corresponds to an independent single-point touch button.

[0027] In another optional embodiment, multiple touch pads 22 are provided, and each touch pad 22 is connected to an independent signal trace 21. The signal traces 21 are insulated from each other and do not conduct to each other.

[0028] Each touch pad 22 corresponds to an independent and insulated signal trace 21, which enables independent triggering of multiple single-point touch buttons. The touch signals between each button do not interfere with each other, ensuring the accuracy and stability of touch recognition in multi-button scenarios. The independent and insulated trace design can reduce signal crosstalk and improve the stability of touch signal transmission, which is conducive to passing reliability tests such as high and low temperature and high and low humidity, and there is no abnormal attenuation of touch sensitivity.

[0029] In another optional embodiment, the pitch, line width, and line spacing of the silver paste trace layer 2 are all greater than or equal to their respective preset limit control values; the back surface dyne value of the glass substrate 1 is greater than 36 mN / m.

[0030] Setting the pitch, line width, and line spacing of the silver paste lines to be greater than or equal to the corresponding preset limit control values ​​can ensure the stable formation of silver paste lines under the screen printing process, avoid forming defects such as broken lines and short circuits, and improve the mass production yield. The dyne value on the back side of the glass substrate 1 is controlled above 36mN / m, which can improve the adhesion between the silver paste and the glass substrate 1, prevent the silver paste from falling off, ensure the reliability of the product, and pass the reliability test to verify that the silver paste did not fall off.

[0031] In another optional embodiment, the bonding pad area 4 corresponds to the cutout window 31 of the ink masking layer 3, and is used to press-fit and electrically connect with the flexible circuit board carrying the touch control chip.

[0032] All signal traces 21 converge to form bonding pad area 4, which enables one-time pressing and bonding with flexible printed circuit board (FPC), simplifying the bonding process and reducing alignment difficulty. The bonding pad area 4 corresponds to the position of ink cutout window 31, ensuring that the bonding pad is not covered by insulating ink. After pressing with ACF conductive adhesive, stable electrical conduction between silver paste traces and FPC can be achieved, avoiding bonding failure.

[0033] In another alternative embodiment, the ink masking layer 3 completely covers the touch pads 22 and signal traces 21 of all touch sensing units, with the bonding pad area 4 exposed only through the cutout window 31.

[0034] The ink masking layer 3 completely covers all touch pads 22 and signal traces 21, so users cannot see the internal metal circuits from the front of the cover, which improves the appearance consistency of the product. The ink masking layer 3 can provide physical protection for the silver paste trace layer 2, reduce the risk of the silver paste traces being scratched or oxidized, improve the product's service life and environmental tolerance, and help to pass reliability tests such as high and low temperature and damp heat.

[0035] This solution achieves single-point touch control based on the capacitive touch sensing principle. The complete signal chain is as follows: When a user's finger touches the position on the front of the glass substrate 1 corresponding to the touch pad 22, a coupling capacitor is formed between the human body electric field and the touch pad 22, causing a change in the capacitance value of the touch pad 22. This capacitance change signal is transmitted to the bonding pad area 4 at the end through the signal trace 21 connected to the touch pad 22. Then, through the bonding pad area 4 and the flexible circuit board, the signal is sent to the touch control chip on the flexible circuit board. After the chip recognizes the signal, it completes the trigger response of the corresponding single-point touch button.

[0036] Example 2 See Figure 2 This invention discloses a method for preparing an integrated single-point touch cover plate, used to prepare the integrated single-point touch cover plate described in Embodiment 1, comprising the following steps: S1. Clean and surface activate the back side of the glass substrate.

[0037] S2. Conductive silver paste is printed on the back side of the glass substrate and cured to form a silver paste wiring layer. The silver paste wiring layer includes at least one set of independent touch sensing units, signal lines electrically connected to the touch sensing units, and bonding pad areas formed by the ends of the signal lines. The touch sensing unit includes at least one touch pad. S3. A masking ink is printed on the back of the glass substrate and cured to form an ink masking layer. The ink masking layer completely covers the surface of the silver paste trace layer, with a cutout window reserved only at the corresponding position of the bonding pad area to obtain an integrated single-point touch cover.

[0038] This method directly forms touch circuits on the cover plate by printing conductive silver paste, replacing the complex processes of ITO sputtering and wet etching in traditional solutions. This significantly simplifies the process and improves production efficiency and yield. This method can directly integrate touch functionality on the glass substrate, eliminating the need for a separate ITO touch sensor layer in traditional solutions. It also replaces the button structure on the flexible printed circuit board (FPC), reducing raw material and processing costs. The design of the ink masking layer fully covering the silver paste traces solves the visible appearance defects of traditional ITO etched circuits, while avoiding the problems of opacity and poor airtightness caused by the full-surface lamination of traditional FPCs.

[0039] The back side of the glass substrate mentioned in this method refers to the inner surface of the glass substrate facing the liquid crystal display module (LCM), not the front side where the user touches the screen. The silver paste wiring layer and the ink masking layer are both formed on this inner surface, without affecting the appearance or tactile feel of the front side of the cover plate. The masking ink used in this method is an insulating, opaque ink, a common dielectric material in the field of capacitive touch control. It completely covers the surface of the silver paste wiring layer without blocking the capacitive sensing signal and does not affect the normal implementation of single-point touch functionality. This design has been verified through touch sensitivity testing. The printing order of steps S2 and S3 cannot be reversed; the silver paste wiring layer must be formed first, followed by the ink masking layer, to avoid ink covering the silver paste lines, which could lead to touch signal transmission failure and the bonding pads becoming unconductive.

[0040] In an optional embodiment, in step S1, the dyne value on the back side of the glass substrate after surface activation treatment is greater than 36 mN / m, and the interval between the completion of glass substrate cleaning and conductive silver paste printing is controlled within 30 minutes.

[0041] This embodiment significantly improves the adhesion between conductive silver paste and glass substrate by controlling the surface dyne value of the glass substrate to be greater than 36 mN / m, thus preventing the silver paste traces from falling off during subsequent processing and reliability testing. By controlling the interval between cleaning and silver paste printing to be within 30 minutes, the surface of the glass substrate can be prevented from being contaminated by environmental dust and oil, thus preventing the surface dyne value from decaying rapidly and ensuring the molding quality and adhesion of the silver paste printing.

[0042] Optionally, the glass substrate can be cleaned using ultrasonic cleaning technology commonly used in the touch industry to remove surface dust, oil, and impurities; the surface activation treatment can use plasma activation technology, which is a conventional and mature method in the industry to improve the dyne value of the glass surface; if the interval exceeds 30 minutes, the glass substrate can be re-activated to ensure that the surface dyne value meets the control requirements.

[0043] In another optional embodiment, in step S2, the PITCH, line width, and line spacing of the silver paste trace layer are all controlled to be greater than or equal to their respective preset limit control values; the touch pads of the touch sensing unit are set as circular, triangular, or irregular shapes.

[0044] By controlling the pinch, line width, and line spacing of the silver paste traces to be greater than or equal to the corresponding preset limit control values, the stable molding of the silver paste traces can be guaranteed, avoiding molding defects such as broken lines, short circuits, and uneven line widths, thereby improving mass production yield. The touch pads can be flexibly set to circular, triangular, or irregular shapes to adapt to different cover plate frame layouts and touch button quantity requirements, making them highly versatile.

[0045] Optionally, the conductive silver paste can be printed using existing processes such as screen printing. Screen printing is suitable for the planar circuit forming requirements of this solution, has high process maturity, good mass production capability, does not require vacuum equipment or chemical etching agents, and has low processing costs.

[0046] In another optional embodiment, step S4 is also included: pressing and bonding the manufactured integrated single-point touch cover plate to the flexible circuit board carrying the touch control chip through the bonding pad area, confirming and solidifying the bonding machine parameters, and then fully bonding it with the liquid crystal display module and calibrating the touch sensitivity through hardware debugging.

[0047] This embodiment achieves full electrical conductivity of the touch channel by bonding a centralized bonding pad area to the flexible printed circuit board (FPC) with only a very small bonding area. It eliminates the need for a cover plate to adhere to the entire FPC surface, fundamentally solving the problems of opacity and poor airtightness in traditional FPC solutions. By confirming and solidifying the bonding machine parameters, the yield and consistency of the bonding process in mass production can be guaranteed. By calibrating the touch sensitivity through hardware debugging, the stable triggering of the touch function can be guaranteed, adapting to the usage requirements in different environments.

[0048] Optionally, the flexible circuit board and the bonding pad area are bonded using an ACF (Anisotropic Conductive Fiber) thermoforming process, a mature and conventional manufacturing method commonly used in the touch industry. Hardware debugging and calibration refers to adjusting the parameters of the touch control chip, such as the touch trigger threshold and sensitivity, to ensure that the touch function is normal.

[0049] In another optional embodiment, step S5 is further included: performing a reliability test on the calibrated touch module, the reliability test including high temperature operation test, low temperature operation test, high temperature storage test, low temperature storage test, high temperature and high humidity test and thermal shock test; the conditions for the high temperature operation test are 70℃ for 240h, the conditions for the low temperature operation test are -20℃ for 240h, the conditions for the high temperature storage test are 80℃ for 240h, the conditions for the low temperature storage test are -30℃ for 240h, the conditions for the high temperature and high humidity test are 60℃ for 90%RH for 240h, and the conditions for the thermal shock test are -30℃ to 80℃ for 10 cycles, with a high and low temperature holding time of 30min and a room temperature transition time of 5min for each cycle.

[0050] This embodiment verifies the performance stability of the touch module under extreme environments such as high and low temperatures, humidity and heat, and temperature shock through full-project reliability testing, ensuring that the product meets the usage requirements of different application scenarios.

[0051] In another optional embodiment, after the reliability test is completed, the touch module is subjected to silver paste trace adhesion test, flexible circuit board and silver paste bonding end pull test and touch sensitivity retest to ensure that the silver paste trace layer does not fall off and the touch sensitivity does not abnormally decrease.

[0052] By conducting silver paste adhesion tests and bonding end pull tests, the bonding force between the silver paste and the glass substrate and the structural reliability of the FPC bonding can be verified, ensuring that the product will not experience functional failures due to silver paste detachment or loose bonding during use. By conducting touch sensitivity retests, the stability of the touch function after extreme environment testing can be verified, ensuring that the touch performance meets the standards throughout the product's entire life cycle.

[0053] Optionally, the method for determining the preset limit control value may include the following steps: 1. Design multiple test schemes for silver paste routing with different pitches, line widths, and line spacings, and prepare test samples using the same screen printing process and curing conditions as mass production; 2. Conduct visual inspection and conductivity tests on the test samples, screen out samples with no broken wires, no short circuits, and qualified conductivity, and determine the minimum parameter values ​​that can be stably formed. 3. Conduct touch sensitivity testing and bonding process testing on qualified samples to verify that the parameters can meet the touch signal transmission requirements and bonding continuity requirements; 4. The minimum parameter value that passes the final verification is determined as the preset limit control value for the corresponding PITCH, line width, and line spacing.

[0054] Optionally, the curing treatment of the conductive silver paste in step S2 can be as follows: adopt the hot air curing process commonly used in the touch industry, with a curing temperature of 130℃~150℃ and a curing time of 20min~40min to ensure that the silver paste is completely cured and that the conductivity and adhesion meet the standards.

[0055] Optionally, the curing treatment of the masking ink in step S3 can be as follows: a hot air curing process is adopted, with a curing temperature of 120℃~140℃ and a curing time of 15min~30min, to ensure that the ink is completely cured and the masking effect and insulation performance meet the standards.

[0056] Optionally, the screen printing process in step S2 can be as follows: a special screen for touch silver paste is used, with a mesh count of 200~400 mesh, which can ensure the accuracy of the line forming.

[0057] Example 3 Please see Figure 3 , Figure 3This is a schematic diagram of the structure of an integrated single-point touch cover fabrication device disclosed in an embodiment of the present invention, including a memory 201, a processor 202 and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps in the method disclosed in Embodiment 2.

[0058] Example 4 This invention discloses a computer-readable storage medium storing a computer program thereon, which, when executed by a processor, implements the steps of the method disclosed in Embodiment 2.

[0059] The content disclosed in the embodiments of this invention is only a preferred embodiment of the invention and is used only to illustrate the technical solutions of the invention, not to limit it. Although the invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this invention.

Claims

1. An integrated single-point touch cover, comprising a glass substrate, characterized in that, The back side of the glass substrate is provided with a silver paste trace layer formed by direct printing. The silver paste trace layer includes at least one set of independent touch sensing units, signal traces electrically connected to the touch sensing units, and bonding pad areas formed by the ends of the signal traces. The touch sensing unit includes at least one touch pad. The back side of the glass substrate is also provided with an ink masking layer, which fully covers the surface of the silver paste trace layer and has cutout windows only at the corresponding positions of the bonding pad areas.

2. The integrated single-point touch cover plate according to claim 1, characterized in that, The touch pads are circular, triangular, or irregularly shaped.

3. The integrated single-point touch cover plate according to claim 2, characterized in that, The touch pads are provided in multiple ways, and each touch pad is connected to an independent signal trace. The signal traces are insulated from each other and do not conduct electricity.

4. The integrated single-point touch cover plate according to claim 1, characterized in that, The pitch, line width, and line spacing of the silver paste trace layer are all greater than or equal to their respective preset limit control values; the dyne value of the back surface of the glass substrate is greater than 36 mN / m.

5. The integrated single-point touch cover plate according to claim 1, characterized in that, The bonding pad area corresponds to the position of the cutout window in the ink masking layer and is used to press and electrically connect with the flexible circuit board carrying the touch control chip.

6. The integrated single-point touch cover plate according to claim 5, characterized in that, The ink masking layer completely covers the touch pads and signal traces of all touch sensing units, with the bonding pad area only exposed through a cutout window.

7. A method for preparing an integrated single-point touch cover, characterized in that, The method for preparing the integrated single-point touch cover plate according to any one of claims 1-6 includes the following steps: S1. Clean and surface activate the back side of the glass substrate; S2. Conductive silver paste is printed on the back side of the glass substrate and cured to form a silver paste wiring layer. The silver paste wiring layer includes at least one set of independent touch sensing units, signal lines electrically connected to the touch sensing units, and bonding pad areas formed by the ends of the signal lines. The touch sensing unit includes at least one touch pad. S3. A masking ink is printed on the back of the glass substrate and cured to form an ink masking layer. The ink masking layer completely covers the surface of the silver paste trace layer, with a cutout window reserved only at the corresponding position of the bonding pad area to obtain an integrated single-point touch cover.

8. The preparation method according to claim 7, characterized in that, In step S1, the dyne value on the back side of the glass substrate after surface activation treatment is greater than 36 mN / m, and the interval between cleaning the glass substrate and printing the conductive silver paste is controlled within 30 minutes.

9. The preparation method according to claim 7, characterized in that, In step S2, the PITCH, line width, and line spacing of the silver paste trace layer are all controlled to be greater than or equal to their respective preset limit control values; the touch pads of the touch sensing unit are set as circular, triangular, or irregular shapes.

10. The preparation method according to claim 7, characterized in that, In step S2, the conductive silver paste is cured using a hot air curing process with a curing temperature of 130℃~150℃ and a curing time of 20min~40min; in step S3, the masking ink is cured using a hot air curing process with a curing temperature of 120℃~140℃ and a curing time of 15min~30min.

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