Method and device for evaluating glass fiber effect of PCB (Printed Circuit Board), electronic equipment and program product

Abstract

The invention discloses a PCB glass fiber effect evaluation method and device, electronic equipment and a program product, and the method comprises the steps: dividing a target PCB into a plurality of warp-wise and weft-wise glass fiber overlapping regions and a plurality of warp-wise glass fiber regions, and determining an equivalent RLGC model; extracting a first RLGC matrix parameter of the medium part through a two-dimensional field solver, calculating a second RLGC matrix parameter of the glass fiber part through a layer equivalent model and a parallel plate capacitance model, and determining a transmission parameter matrix; determining a target transmission parameter matrix of a complete differential transmission line structure of the target PCB according to the transmission parameter matrixes corresponding to the plurality of warp-wise and weft-wise glass fiber overlapping areas and the plurality of warp-wise glass fiber areas; and determining scattering parameters of the target PCB according to the target transmission parameter matrix, and calculating glass fiber effect performance parameters. On the premise of ensuring the precision, the efficiency of evaluating the glass fiber effect of the PCB is improved, the computing power resource is saved, and the method can be applied to the technical field of PCB design.

Description

Technical Field

[0001] This invention relates to the field of PCB design technology, and in particular to a method, apparatus, electronic device, and program product for evaluating the glass fiber effect of PCB materials. Background Technology

[0002] As communication system signal rates and frequencies continue to increase, signal integrity becomes crucial for ensuring system performance. Among the various factors affecting this performance, the fiber optic effect is becoming increasingly significant, directly impacting transmission line characteristic impedance, delay, and other performance parameters. The fiber optic effect affects high-speed signals primarily in two ways: firstly, it causes periodic fluctuations in the transmission line's characteristic impedance, leading to signal resonance; secondly, it generates transmission delay differences between differential transmission lines, disrupting the symmetry of the differential signal and causing signal integrity issues such as bit errors and mode switching.

[0003] To assess the specific impact of the glass fiber effect, appropriate modeling of the dielectric layer and transmission line structure of the printed circuit board is required. However, the cross-section of the glass fiber bundles is approximately elliptical, and the bundles are arranged in an interwoven pattern within the dielectric layer, resulting in a complex structure with microscopic periodicity. This complexity poses significant challenges to accurate modeling. Currently, modeling methods for the glass fiber effect are mainly divided into two types: three-dimensional modeling and two-dimensional modeling. 1) Three-dimensional modeling: This method aims to reconstruct the three-dimensional spatial structure of glass fiber in the dielectric layer and perform simulation analysis using three-dimensional full-wave simulation software; or simplify the cross-section of glass fiber to a rectangular cross-section, optimize the interlacing structure, balance the simulation complexity, and not sacrifice too much accuracy.

[0004] 2) Two-dimensional modeling: A modeling method proposed to address the efficiency bottleneck of three-dimensional modeling. This method focuses on the cross-sectional structure of the dielectric layer and transmission line. By analyzing the electromagnetic field distribution of the cross-sectional structure, it uses complex calculations to derive the corresponding performance parameters; or by using statistical principles, it uses a large number of physical samples with different relative positions of glass fiber and transmission line to statistically determine the variation law of the equivalent dielectric constant at each relative position and summarize the specific performance.

[0005] While the aforementioned modeling methods all have relatively complete processes, they all have shortcomings that urgently need to be addressed, limiting their widespread application in engineering practice. For 3D modeling methods, the drawback is that constructing the actual fiberglass structure is extremely cumbersome and error-prone. For mainstream commercial 3D electromagnetic simulation software, the built-in primitive libraries (such as cubes, cylinders, spheres, etc.) typically cannot directly generate fiberglass structures with approximately elliptical cross-sections and wavy, interwoven paths. Modelers often need to manually approximate these structures through complex Boolean operations and scanning operations. Furthermore, for elliptical cross-sections and interwoven dielectric layer cross-sections, extremely dense mesh generation is required to ensure the accuracy of the field solution. This directly leads to an exponential increase in computational resources (memory usage, CPU computation time), with a single simulation taking several hours. Even attempts to simplify the model do not change the fundamental nature of 3D simulation. Therefore, the problem of low efficiency in 3D simulation remains prominent, making this modeling method difficult to widely apply to circuit design scenarios requiring rapid iteration. While 2D modeling methods significantly improve computational efficiency compared to 3D modeling methods, they still have limitations in their application. These methods are either based on complex electromagnetic field theories, involving a large number of intricate calculus calculations, or require large-scale statistical sample analysis. This places high demands on the designers' theoretical knowledge and is not conducive to intuitive understanding or rapid verification.

[0006] In summary, existing technologies lack a method for evaluating the glass fiber effect in PCB boards that can achieve a good balance between computational accuracy, efficiency, and engineering practicality.

[0007] The above problems urgently need to be addressed.

[0008] Terminology Explanation: Glass fiber effect: The dielectric layer of a printed circuit board is composed of glass fiber bundles and resin, with the gaps between the glass fiber bundles filled with resin. Due to the significant difference in dielectric constant between the glass fiber (approximately 6) and the resin (approximately 3), the transmission lines near the glass fibers experience a higher dielectric constant, while those above the gaps between the glass fiber bundles experience a lower dielectric constant. This non-uniform structure of the glass fiber bundles causes localized variations in the relative dielectric constant of the dielectric layer, leading to a series of signal integrity problems during signal transmission. This phenomenon is called the glass fiber effect.

[0009] Warp and weft: The two mutually perpendicular directions of glass fiber in the dielectric layer of a printed circuit board. Summary of the Invention

[0010] The purpose of this invention is to at least partially solve one of the technical problems existing in the prior art.

[0011] Therefore, one objective of this invention is to provide a method for evaluating the glass fiber effect in PCB boards. This method enables rapid modeling and performance evaluation of the glass fiber effect without the need for complex three-dimensional full-wave simulation, and significantly simplifies the theoretical calculation process. While ensuring accuracy, it improves the efficiency of evaluating the glass fiber effect in PCB boards and saves computing resources.

[0012] Another objective of this invention is to provide a device for evaluating the glass fiber effect of PCB boards.

[0013] To achieve the above-mentioned technical objectives, the technical solutions adopted in the embodiments of the present invention include: On one hand, embodiments of the present invention provide a method for evaluating the glass fiber effect of PCB materials, including the following steps: The target PCB board is divided into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions are determined respectively. Based on the equivalent RLGC model, the first RLGC matrix parameters of the dielectric part are extracted by the two-dimensional field solver, and the second RLGC matrix parameters of the glass fiber part are calculated by the layer equivalent model and the parallel plate capacitance model. The transmission parameter matrix of the equivalent RLGC model is determined based on the first RLGC matrix parameters and the second RLGC matrix parameters; The target transmission parameter matrix of the complete differential transmission line structure of the target PCB board is determined based on the multiple warp and weft fiberglass overlapping regions and the transmission parameter matrix corresponding to the multiple warp fiberglass regions; The scattering parameters of the target PCB board are determined based on the target transmission parameter matrix, and then the glass fiber effect performance parameters of the target PCB board are calculated based on the scattering parameters.

[0014] Furthermore, in one embodiment of the present invention, the step of dividing the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and determining the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions respectively, specifically includes: The target PCB board is divided into multiple modeling units according to its length; Each modeling unit is defined as containing multiple warp and weft fiberglass overlap regions and multiple warp fiberglass regions. Construct the corresponding first equivalent RLGC model based on the geometric and dielectric parameters of the dielectric layer and transmission line in the warp and weft fiber overlap region; The corresponding second equivalent RLGC model is constructed based on the geometric and dielectric parameters of the dielectric layer and transmission line in the radial glass fiber region.

[0015] Further, in one embodiment of the present invention, the step of extracting the first RLGC matrix parameters of the dielectric portion using a two-dimensional field solver based on the equivalent RLGC model, and calculating the second RLGC matrix parameters of the glass fiber portion using the layer equivalent model and the parallel plate capacitance model, specifically includes: The equivalent RLGC model is divided into a dielectric portion containing only a homogeneous medium and a glass fiber portion containing both the medium and glass fiber. The linewidth, thickness, and conductivity of the medium portion are input into the two-dimensional field solver to obtain the parameters of the first RLGC matrix. The glass fibers within the glass fiber portion are equivalent to a glass fiber layer of constant thickness using a layer equivalence model. The changes in capacitance and conductivity caused by the glass fiber layer were calculated using a parallel plate capacitance model. The linewidth, dielectric thickness, and conductivity of the glass fiber portion are input into the two-dimensional field solver to obtain the parameters of the third RLGC matrix. The capacitance and conductance values ​​of the third RLGC matrix parameters are corrected based on the capacitance change and the conductance change to obtain the second RLGC matrix parameters.

[0016] Furthermore, in one embodiment of the present invention, determining the transmission parameter matrix of the equivalent RLGC model based on the first RLGC matrix parameters and the second RLGC matrix parameters specifically includes: The first RLGC matrix parameters and the second RLGC matrix parameters are converted into 4-port Z parameters to obtain the first transmission parameter matrix of the medium part and the second transmission parameter matrix of the fiber optic part. The transmission parameter matrix of the equivalent RLGC model is determined by multiplying the first transmission parameter matrix and the second transmission parameter matrix.

[0017] Furthermore, in one embodiment of the present invention, determining the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board material based on the transmission parameter matrix corresponding to the plurality of warp and weft fiberglass overlapping regions and the plurality of warp fiberglass regions specifically includes: The first unit transmission parameter matrix is ​​determined by multiplying the transmission parameter matrices corresponding to the multiple warp and weft fiber overlap regions contained in the modeling unit. The second unit transmission parameter matrix is ​​determined by the product of the transmission parameter matrices corresponding to the multiple meridional glass fiber regions included in the modeling unit; The unit transmission parameter matrix of the modeling unit is determined by multiplying the first unit transmission parameter matrix and the second unit transmission parameter matrix. The target transmission parameter matrix is ​​determined by multiplying the unit transmission parameter matrices corresponding to the multiple modeling units contained in the target PCB board.

[0018] Furthermore, in one embodiment of the present invention, the glass fiber effect performance parameters include at least one of differential insertion loss, common-mode rejection ratio, differential transmission line delay difference, and eye diagram.

[0019] On the other hand, embodiments of the present invention provide a device for evaluating the glass fiber effect of PCB boards, comprising: The region modeling module is used to divide the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and to determine the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions, respectively. The parameter solving module is used to calculate the first RLGC matrix parameters of the medium part extracted by the two-dimensional field solver according to the equivalent RLGC model, and to calculate the second RLGC matrix parameters of the glass fiber part through the layer equivalent model and the parallel plate capacitance model. The parameter concatenation module is used to determine the transmission parameter matrix of the equivalent RLGC model based on the first RLGC matrix parameters and the second RLGC matrix parameters; The parameter determination module is used to determine the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board based on the multiple warp and weft fiberglass overlapping regions and the transmission parameter matrix corresponding to the multiple warp fiberglass regions. The glass fiber effect evaluation module is used to determine the scattering parameters of the target PCB board based on the target transmission parameter matrix, and then calculate the glass fiber effect performance parameters of the target PCB board based on the scattering parameters.

[0020] On the other hand, embodiments of the present invention provide an electronic device, including: At least one processor; At least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements the above-described method for evaluating the glass fiber effect of PCB boards.

[0021] On the other hand, embodiments of the present invention also provide a computer-readable storage medium storing a processor-executable computer program that, when executed by a processor, implements the above-described method for evaluating the glass fiber effect of PCB boards.

[0022] On the other hand, embodiments of the present invention also provide a computer program product, including a computer program that, when executed by a processor, implements the above-described method for evaluating the glass fiber effect of PCB boards.

[0023] The advantages and beneficial effects of the present invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention: This invention divides the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions. Equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions are determined respectively. Based on the equivalent RLGC models, the first RLGC matrix parameters of the dielectric portion are extracted using a two-dimensional field solver. The second RLGC matrix parameters of the fiberglass portion are calculated using the layer equivalent model and the parallel plate capacitance model. The transmission parameter matrix of the equivalent RLGC model is determined based on the first and second RLGC matrix parameters. The target transmission parameter matrix of the complete differential transmission line structure of the target PCB board is determined based on the transmission parameter matrices corresponding to the multiple warp and weft fiberglass overlapping regions and the multiple warp fiberglass regions. The scattering parameters of the target PCB board are determined based on the target transmission parameter matrix, and then the fiberglass effect performance parameters of the target PCB board are calculated based on the scattering parameters. This invention achieves rapid modeling and performance evaluation of the fiberglass effect without complex three-dimensional full-wave simulation, significantly simplifies the theoretical calculation process, improves the efficiency of PCB board fiberglass effect evaluation while ensuring accuracy, and saves computing resources. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments of the present invention are described below. It should be understood that the drawings described below are only for the convenience of clearly describing some embodiments of the technical solutions of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of a common differential stripline transmission line and a dielectric layer provided in an embodiment of the present invention; Figure 2 A three-dimensional schematic diagram of a simplified glass fiber physical structure model provided for an embodiment of the present invention; Figure 3 A schematic cross-sectional view of the overlapping portion of the warp and weft fiberglass provided in an embodiment of the present invention; Figure 4 A schematic cross-sectional view of only the warp fiber portion provided in an embodiment of the present invention; Figure 5 A schematic diagram of a modeling unit provided in an embodiment of the present invention; Figure 6 for Figure 3 The circuit diagram of the equivalent RLGC model of the overlapping section of the warp and weft fiberglass is shown. Figure 7 A schematic diagram of the layer equivalent model provided in an embodiment of the present invention; Figure 8 A flowchart illustrating the steps of a method for evaluating the glass fiber effect in PCB boards, provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of a specific process for evaluating the glass fiber effect of PCB boards according to an embodiment of the present invention; Figure 10 A comparison curve diagram of SDD11 provided for an embodiment of the present invention; Figure 11 A comparison curve diagram of SDD21 provided for an embodiment of the present invention; Figure 12 A schematic diagram of transmission delay difference in HFSS simulation provided for embodiments of the present invention; Figure 13 A schematic diagram of transmission delay difference provided for modeling and simulation in an embodiment of the present invention; Figure 14 A structural block diagram of a PCB board glass fiber effect evaluation device provided in an embodiment of the present invention; Figure 15 This is a structural block diagram of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the embodiments of this invention; they are merely examples of apparatuses and methods consistent with some aspects of the embodiments of this invention as detailed in the appended claims.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to limit the invention.

[0028] The PCB board glass fiber effect evaluation method provided in this invention can be applied to terminals, servers, or software running on terminals or servers. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, smart speaker, smartwatch, or vehicle terminal, but is not limited to these. The server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms. The server can also be a node server in a blockchain network. The software can be an application that implements the PCB board glass fiber effect evaluation method, but is not limited to the above forms.

[0029] This invention can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This invention can be described in the general context of computer-executable instructions, such as program modules, that are executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This invention can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0030] It should be noted that in various specific embodiments of the present invention, when processing data related to user identity or characteristics, such as user information, user behavior data, user historical data, and user location information, user permission or consent is obtained first. Furthermore, the collection, use, and processing of this data comply with relevant laws, regulations, and standards. In addition, when embodiments of the present invention require access to sensitive personal information of users, separate permission or consent from the user is obtained through pop-ups or redirection to a confirmation page. Only after obtaining the user's separate permission or consent is the necessary user-related data for the normal operation of the embodiments of the present invention acquired.

[0031] Reference Figure 8 This invention provides a method for evaluating the glass fiber effect in PCB materials, specifically including the following steps: S101. Divide the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and determine the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions respectively. S102. Based on the equivalent RLGC model, the first RLGC matrix parameters of the dielectric part are extracted by the two-dimensional field solver, and the second RLGC matrix parameters of the glass fiber part are calculated by the layer equivalent model and the parallel plate capacitance model. S103. Determine the transmission parameter matrix of the equivalent RLGC model based on the parameters of the first RLGC matrix and the parameters of the second RLGC matrix; S104. Determine the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board based on the transmission parameter matrix corresponding to the multiple warp and weft fiberglass overlapping regions and the multiple warp fiberglass regions. S105. Determine the scattering parameters of the target PCB board based on the target transmission parameter matrix, and then calculate the glass fiber effect performance parameters of the target PCB board based on the scattering parameters.

[0032] This invention addresses the pain points in modeling glass fiber effects by proposing a transmission line structure modeling method based on an equivalent RLGC circuit. While maintaining accuracy, it significantly improves computational efficiency and iteration speed, transforming complex three-dimensional full-wave simulations or complex field distribution calculations into simple two-dimensional field solving and matrix transformation calculations. This reduces modeling complexity and saves substantial hardware resources. By extracting and calculating equivalent circuit parameters through the geometric and dielectric parameters of the dielectric layer and transmission line, combined with a two-dimensional field solver, the corresponding transmission line performance parameters, such as scattering parameters (S-parameters), mixing mode S-parameters, transmission delay difference, and eye diagrams, can be derived through simple matrix operations. This allows for efficient and accurate assessment of the specific impact of glass fiber effects. Furthermore, this invention has universal applicability, applicable to commonly used glass fiber types on the market, significantly lowering the application threshold and cost, and facilitating widespread adoption within the industry.

[0033] It can be recognized that the embodiments of the present invention realize rapid modeling and performance evaluation of the glass fiber effect without the need for complex three-dimensional full-wave simulation, and significantly simplify the theoretical calculation process. While ensuring accuracy, it improves the efficiency of glass fiber effect evaluation of PCB boards and saves computing resources.

[0034] The specific process of the embodiments of the present invention will be described below with reference to the accompanying drawings.

[0035] As a further optional implementation, the target PCB board is divided into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions are determined respectively, specifically including: S1011. Divide the target PCB board into multiple modeling units according to its length; S1012. Determine the multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions contained in each modeling unit; S1013. Construct the corresponding first equivalent RLGC model based on the geometric and dielectric parameters of the dielectric layer and transmission line in the warp and weft fiber overlap region. S1014. Construct the corresponding second equivalent RLGC model based on the geometric and dielectric parameters of the dielectric layer and transmission line in the meridional glass fiber region.

[0036] Common schematic diagrams of strip differential transmission lines and dielectric layers are shown below. Figure 1 As shown, 11 and 12 are two mutually perpendicular glass fibers with approximately elliptical cross-sections and an interwoven structure. 11 is the warp fiber, and 12 is the weft fiber. 13 is the filling medium (resin), which, together with the glass fibers, forms the dielectric layer. 14 is a strip-shaped differential transmission line, running parallel to the warp fiber. 15 is the reference layer corresponding to the transmission line. Traditional 3D modeling and simulation methods involve reconstructing... Figure 1 The structure shown is simulated using 3D full-wave simulation software to obtain parameters reflecting the high-frequency performance of the signal, such as S-parameters and transmission delay. This method has very low simulation efficiency, extremely high hardware requirements, and a single simulation can take several hours.

[0037] To fundamentally improve simulation efficiency, one of the core ideas of this invention is to simplify the modeling of the glass fiber physical structure, aiming to retain key high-frequency characteristics while reducing the geometric complexity of the model. First, the cross-sectional shape is simplified by equivalent simplification. Considering the very large ratio of the width (major axis) to the height (minor axis) of the glass fiber cross-section, the cross-section is equivalent to a rectangle with a constant width and equal cross-sectional area. Second, the wavy interlacing structure of the glass fiber is ignored; the fiber direction is equivalent to a straight line, and the glass fiber is fixed in the middle position vertically to the dielectric layer. This simplifies the interlaced glass fiber into a cuboid, with almost no change in the glass fiber content or the relative position of the glass fiber to the transmission line. Therefore, the simplified glass fiber's impact on signal performance is essentially consistent with reality. Figure 2 As shown, 21 and 22 represent simplified rectangular warp and weft glass fibers, placed and superimposed in the middle of the dielectric layer at a vertical position. After simplification, the dielectric layer structure where the transmission line is located exhibits two alternating structures along the signal propagation direction: overlapping warp and weft glass fibers (shown in 23) and only warp glass fibers (shown in 24). The simplified glass fiber thickness... (Unit is) ) becomes: , These are the equivalent thicknesses of the warp and weft fiberglass fibers (unit: ...). (i.e., the minor semi-axis of the elliptical cross-section, ensuring that the amount of glass fiber remains unchanged before and after the equivalent.)

[0038] According to distributed circuit theory, transmission line circuit structures can be composed of multiple cascaded RLGC units. A single RLGC unit is called a small unit, and the unit length of a small unit must be less than one-tenth of the wavelength of the highest signal frequency. Therefore, based on the glass fiber content, two types of small unit structures can be distinguished: 1) The cross-sectional diagram of the overlapping area of ​​the warp and weft fibers is shown below. Figure 3 ,Depend on It consists of several small units, 31 is a differential transmission line, 32 is the corresponding reference layer, 33 is the filling resin, 34 is the weft fiberglass, and 35 is the overlapping part of the warp and weft fiberglass.

[0039] 2) For the section with only warp fiberglass, the corresponding cross-sectional diagram is as follows: Figure 4 As shown, by It consists of several small units, with 41 being a differential transmission line, 42 being the corresponding reference layer, 43 being the filling resin, and 44 being the warp fiber.

[0040] A complete modeling unit, i.e., a large unit, is composed of these two smaller units arranged in the actual physical order, such as... Figure 5 As shown. 51 represents the element length of the smaller element. Small units (53) in the overlapping areas of the warp and weft fiberglass and A small unit (54) consisting of only a longitudinal glass fiber region constitutes a large unit (55), 52 is the length of the large unit and the latitudinal glass fiber spacing, and 56 is the differential transmission line laid on the dielectric layer. and The specific value is determined by the specific parameters of the glass fiber and the unit length.

[0041] The next step is to model the small unit as an equivalent RLGC circuit. Taking the overlapping region of the warp and weft fiberglass as an example, its cross-sectional schematic diagram is as follows. Figure 3 The corresponding equivalent RLGC circuit model is as follows: Figure 6 As shown, (61), (62), (63), (64) represents the input current and input voltage of the differential transmission line. The parameters of the transmission line to the reference layer are represented by subscripts 1 and 2, and the coupling parameters between the differential transmission lines are represented by subscripts 1 and 2. It is indicated that, firstly, assuming the dielectric layer is a homogeneous pure resin (33), under this condition, the differential transmission line has a perfectly symmetrical RLGC parameter per unit length, i.e. (Unit is) ), (Unit: H) (Unit: S) (Unit: F) (Unit is) ), (Unit: H) (Unit: S) (Unit: F) represents the coupling parameters between the differential transmission lines in the pure resin portion. Next, glass fibers (34, 35) are introduced into the homogeneous dielectric layer. This is because the introduction of glass fibers essentially alters the dielectric constant of the local region in which they are located. With dielectric loss Therefore, reflected in the circuit parameters, the introduction of glass fiber will only change the capacitance. With conductivity The value of the resistance hardly changes. With inductance The value of the change caused by the glass fiber is represented in the RLGC equivalent circuit. ( 620, 621, 622 (unit: F) and ( 614, 615, 616 (unit: S) indicates that the dielectric layer can be broken down into a pure resin portion and a glass fiber portion, resulting in a final capacitance value. (Unit: F), final conductivity value (Unit: S) =1, 2, m.

[0042] As a further optional implementation, based on the equivalent RLGC model, the first RLGC matrix parameters of the dielectric portion are extracted using a two-dimensional field solver, and the second RLGC matrix parameters of the glass fiber portion are calculated using the layer equivalent model and the parallel plate capacitance model. Specifically, this includes: S1021. Divide the equivalent RLGC model into a dielectric part containing only a homogeneous medium and a glass fiber part containing both a dielectric and glass fiber. S1022. Input the linewidth, thickness and conductivity of the medium into the two-dimensional field solver to obtain the parameters of the first RLGC matrix; S1023. The glass fiber in the glass fiber section is equivalent to a glass fiber layer with constant thickness by using the layer equivalent model; S1024. Calculate the changes in capacitance and conductivity caused by the glass fiber layer using the parallel plate capacitance model. S1025. Input the linewidth, dielectric thickness, and conductivity of the glass fiber section into the two-dimensional field solver to obtain the parameters of the third RLGC matrix. S1026. Correct the capacitance and conductance values ​​of the third RLGC matrix parameters based on the changes in capacitance and conductance to obtain the second RLGC matrix parameters.

[0043] Specifically, the next step is to extract and calculate the specific parameters of the RLGC equivalent model. For the pure resin part, the medium is homogeneous and invariant. By using a mature two-dimensional field solver, the element length RLGC matrix parameters can be extracted quickly and accurately, thus obtaining the first RLGC matrix parameters.

[0044] Then, the specific changes in capacitance and conductance caused by the glass fiber were calculated. and First, the effective region needs to be defined. This region is where the electric field energy is concentrated and the electric field lines are densely distributed. This division ensures that the effective region captures the distribution of the main conductive field as much as possible, thus making the calculation of the equivalent dielectric parameter more accurate. Second, using a layer equivalent model, the glass fiber within the effective region is further simplified, equivalent to a glass fiber layer of constant thickness. The division of the effective region is as follows: Figure 7 As shown, 71 and 72 represent the effective region of the self-inductance parameter of the differential line relative to the reference layer. This region encompasses most of the ground electric field lines between the transmission line and the reference layer, and its width is equal to the width of the transmission line. (Unit: mil) and differential transmission line spacing The sum of (unit: mil), where the height is the total thickness of the dielectric layer, is used for calculation. , , and ; 73 represents the effective region for calculating coupling parameters. This region encompasses the vast majority of the electric field lines interacting with the differential transmission lines, and its width is [missing information]. The height changes with the thickness of the dielectric layer.

[0045] Taking the effective region 71 as an example, the specific parameters of the equivalent layer model are calculated. This region is the effective region for the transmission line self-inductance parameters. 74 and 75 are the glass fibers within the effective region, and 76 and 77 are schematic diagrams of the equivalent glass fibers after layers 74 and 75 are shown, with parameters as follows: as well as The parameters of the dielectric layers other than 76 and 77 are respectively , as well as .

[0046] Discrete, discontinuous glass fibers are equivalent to a continuous, uniform dielectric layer of constant thickness, with a height of:

[0047] Subsequently, the equivalent dielectric constant after adding glass fiber was calculated using a parallel plate capacitance model. With the imaginary part of the equivalent dielectric loss , is represented as: , , , , and The calculation formula is as follows:

[0048]

[0049]

[0050]

[0051] Based on the definitions of capacitance and conductance, under the premise that other physical conditions remain unchanged, capacitance... electrical conductivity ,therefore and The following calculation can be used, where and This represents the dielectric constant of the resin and the imaginary part of the dielectric loss.

[0052] ,

[0053] ,

[0054] After calculating the changes in capacitance and conductivity caused by the glass fiber layer, the third RLGC matrix parameters of the pure resin part of the glass fiber section are solved using a two-dimensional field solver. Then, the capacitance and conductivity values ​​are corrected according to the changes in capacitance and conductivity to obtain the second RLGC matrix parameters.

[0055] As a further optional implementation, the transfer parameter matrix of the equivalent RLGC model is determined based on the first RLGC matrix parameters and the second RLGC matrix parameters, specifically including: S1031. Convert the first RLGC matrix parameters and the second RLGC matrix parameters into 4-port Z parameters respectively to obtain the first transmission parameter matrix of the medium part and the second transmission parameter matrix of the fiber optic part. S1032. Determine the transmission parameter matrix of the equivalent RLGC model based on the product of the first transmission parameter matrix and the second transmission parameter matrix.

[0056] Specifically, the next step is to convert the RLGC parameters of the cell into the Z parameters of the 4-port cell. express When the circuit outside the port is broken, The voltage at the port and The ratio of port currents is given by the following formula:

[0057]

[0058]

[0059]

[0060]

[0061]

[0062] ,

[0063] The first transmission parameter matrix of the medium part and the second transmission parameter matrix of the glass fiber part are obtained by the above formula. The product of the two is the transmission parameter matrix of the equivalent RLGC model of the warp and weft glass fiber overlapping region or the warp glass fiber region.

[0064] As a further optional implementation, the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board is determined based on the transmission parameter matrix corresponding to the multiple warp and weft fiberglass overlapping regions and the multiple warp fiberglass regions. Specifically, this includes: S1041. Determine the transmission parameter matrix of the first unit based on the product of the transmission parameter matrices corresponding to the multiple warp and weft fiber overlap regions contained in the modeling unit. S1042. Determine the transmission parameter matrix of the second unit based on the product of the transmission parameter matrices corresponding to the multiple meridional glass fiber regions included in the modeling unit. S1043. Determine the unit transmission parameter matrix of the modeling unit based on the product of the first unit transmission parameter matrix and the second unit transmission parameter matrix. S1044. Determine the target transmission parameter matrix based on the product of the unit transmission parameter matrices corresponding to the multiple modeling units contained in the target PCB board.

[0065] Specifically, small units need to be cascaded multiple times to obtain a complete differential transmission line model. Therefore, the unit Z-parameters need to be transformed into cascadeable transmission parameters, which can be quickly achieved using matrix transformation formulas. The advantage of transmission parameters is that the total transmission parameter matrix after multiple networks are cascaded is equal to the product of the transmission parameter matrices of each unit.

[0066] like Figure 9 The diagram shown is a schematic flowchart of a method for evaluating the glass fiber effect of PCB board provided by an embodiment of the present invention. The transmission parameters corresponding to the pure resin part and the transmission parameters of the glass fiber part are cascaded to obtain the unit transmission parameters. The unit transmission parameters of the overlapping sections of the fiberglass are cascaded and then connected with... The transmission parameters of each unit, consisting only of units with radial glass fibers, are cascaded to obtain the transmission parameters of the modeling unit. These cascades are then combined to form the complete differential transmission line length, yielding the transmission parameters of the complete differential transmission line structure. The transmission parameters of the complete structure can then be transformed using matrix transformations to obtain the S-parameters of the complete structure. This allows for the calculation of a series of key performance parameters to accurately assess the impact of glass fiber effects, including but not limited to: mixed-mode S-parameters, such as differential insertion loss and common-mode rejection ratio; delay parameters, such as differential transmission line delay difference; and eye diagrams to evaluate the signal integrity of the complete differential transmission line structure.

[0067] As an optional implementation, the glass fiber effect performance parameters include at least one of differential insertion loss, common-mode rejection ratio, differential transmission line delay difference, and eye diagram.

[0068] It should be noted that the process of determining the scattering parameters of the target PCB board based on the target transmission parameter matrix and calculating the glass fiber effect performance parameters of the target PCB board based on the scattering parameters is existing technology, and will not be described in detail here in the embodiments of the present invention.

[0069] The method steps of the embodiments of the present invention have been described above. It can be understood that the embodiments of the present invention achieve rapid modeling and performance evaluation of the glass fiber effect without the need for complex three-dimensional full-wave simulation, and significantly simplify the theoretical calculation process. While ensuring accuracy, it improves the efficiency of glass fiber effect evaluation of PCB boards and saves computing resources.

[0070] The present invention will be further described below with reference to two specific embodiments.

[0071] 1. Taking a classic fiberglass model as an example, compare the mixed-mode S-parameters and transmission delay parameters modeled in the three-dimensional full-wave simulation with those modeled in this invention.

[0072] The effectiveness of this invention was verified using 106 glass fiber, and its specific geometric and dielectric parameters were set as follows: ( , , , , , , , , , , , , , ) = (3.7 mil, 5 mil, 0.6 mil, 2 mil, 215 μm, 392 μm, 457 μm, 446 μm, 14.92 μm, 12.57 μm, 5.88, 3.4, 0.0078, 0.0115), where, It's the line width. It is the thickness of a single dielectric layer. This refers to the thickness of the transmission line. This embodiment presents an extreme scenario of asymmetrical differential signal lines: one differential transmission line is positioned above the warp fiber, while the other is positioned above the warp fiber gap, maximizing the difference in dielectric layer environment and dielectric parameters between the two differential transmission lines. The RLGC extraction of the pure resin portion is achieved using a two-dimensional field solver, followed by calculation of the perturbation caused by the glass fiber. and The calculations and subsequent matrix transformations were performed with a transmission line length of 89.2 mm and an element length of 0.5 mm. m, the signal frequency range is 0-40 GHz. Furthermore, a three-dimensional full-wave simulation was used for comparison, with simulation parameter settings completely consistent with those described above.

[0073] The differential signal parameters SDD obtained by modeling in this invention 11 The differential signal parameters SDD obtained from the three-dimensional full-wave simulation 11 For example Figure 10 As shown; SDD 21 For example Figure 11 As shown. The results exhibit high consistency, and the SDD caused by the glass fiber effect is also significant. 21 The significant dip in the curve can be accurately captured. SDD 21 The frequencies at the concave points of the curves are 16.79 GHz and 17.39 GHz, with an error of 3.57%; the concave amplitudes are -35.49 dB and -33.50 dB, with an error of 5.63%.

[0074] For the transmission delay difference verification, an excitation signal with a rise time of 1 ns and an amplitude of 1 V is applied to the P and N terminals of the differential signal line respectively, and the transmission delay difference between the differential signal lines is simulated. Figure 12 and Figure 13 As shown, the transmission delay difference in the three-dimensional full-wave simulation is 29.56 ps, while the delay difference modeled in this invention is 30.04 ps, with an error of 1.64%. This embodiment fully verifies the accuracy of the invention.

[0075] 2. By comparing the transmission delay difference and simulation time of multiple fiberglass models, the speed and accuracy of the present invention are verified.

[0076] This invention was applied to different fiberglass models, and the transmission delay difference and simulation time were compared between the modeling simulation of this invention and the 3D full-wave simulation. The comparison results are shown in Table 1 below. The fiberglass types cover the core categories in the current market. To ensure the fairness of the comparison, all simulations were run in a unified hardware environment.

[0077]

[0078] Table 1 As can be seen, the average error between the time delay difference in the 3D full-wave simulation and the simulation time delay difference of this invention is 3.05%, and the maximum error is 6.57%. The average simulation time for the 3D full-wave simulation is 3.8 hours, while the average time for this invention is less than 1.5 minutes. This invention can accurately model the impact of fiber optic effects on signal integrity, greatly save simulation time and computational resources, and has universal applicability to different fiber optic models.

[0079] Reference Figure 14 This invention provides a device for evaluating the glass fiber effect of PCB boards, comprising: The region modeling module is used to divide the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and to determine the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions, respectively. The parameter solving module is used to calculate the first RLGC matrix parameters of the dielectric part extracted by the two-dimensional field solver based on the equivalent RLGC model, and to calculate the second RLGC matrix parameters of the glass fiber part through the layer equivalent model and the parallel plate capacitance model. The parameter cascading module is used to determine the transmission parameter matrix of the equivalent RLGC model based on the parameters of the first RLGC matrix and the parameters of the second RLGC matrix. The parameter determination module is used to determine the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board based on the transmission parameter matrix corresponding to multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions. The glass fiber effect evaluation module is used to determine the scattering parameters of the target PCB board based on the target transmission parameter matrix, and then calculate the glass fiber effect performance parameters of the target PCB board based on the scattering parameters.

[0080] It is understood that the content of the above method embodiments is applicable to the present device embodiments. The specific functions implemented by the present device embodiments are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0081] Reference Figure 15 This invention provides an electronic device, comprising: At least one processor; At least one memory for storing at least one program; When the above-mentioned at least one program is executed by the above-mentioned at least one processor, the above-mentioned at least one processor implements the above-mentioned method for evaluating the glass fiber effect of PCB board.

[0082] It is understood that the content of the above method embodiments is applicable to this device embodiment. The specific functions implemented by this device embodiment are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0083] This invention also provides a computer-readable storage medium storing a processor-executable computer program that, when executed by a processor, implements the above-described method for evaluating the glass fiber effect of PCB boards.

[0084] This invention provides a computer-readable storage medium that can execute a PCB board glass fiber effect evaluation method provided in the method embodiment of this invention. It can execute any combination of the implementation steps of the method embodiment and has the corresponding functions and beneficial effects of the method.

[0085] This invention also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method for evaluating the glass fiber effect of PCB boards.

[0086] It is understood that the content of the above method embodiments is applicable to the embodiments of this program product. The specific functions implemented by the embodiments of this program product are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0087] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0088] The embodiments described in this invention are for the purpose of more clearly illustrating the technical solutions of the embodiments of this invention, and do not constitute a limitation on the technical solutions provided by the embodiments of this invention. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this invention are also applicable to similar technical problems.

[0089] The terms "first," "second," "third," "fourth," etc. (if present) in the specification and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0090] In some alternative embodiments, the functions / operations mentioned in the block diagrams may not occur in the order shown in the operation diagrams. For example, depending on the functions / operations involved, two consecutively shown blocks may actually be executed substantially simultaneously, or the aforementioned blocks may sometimes be executed in reverse order. Furthermore, the embodiments presented and described in the flowcharts of this invention are provided by way of example to provide a more comprehensive understanding of the technology. The disclosed methods are not limited to the operations and logic flows presented herein. Alternative embodiments are contemplated in which the order of various operations is changed and sub-operations described as part of a larger operation are executed independently.

[0091] Furthermore, although the invention has been described in the context of functional modules, it should be understood that, unless otherwise stated, one or more of the aforementioned functions and / or features may be integrated into a single physical device and / or software module, or one or more functions and / or features may be implemented in a separate physical device or software module. It is also understood that a detailed discussion of the actual implementation of each module is unnecessary for understanding the invention. Rather, given the properties, functions, and internal relationships of the various functional modules in the apparatus disclosed herein, the actual implementation of the module will be understood within the scope of conventional skill of an engineer. Therefore, those skilled in the art can implement the invention as set forth in the claims using ordinary techniques without excessive experimentation. It is also understood that the specific concepts disclosed are merely illustrative and not intended to limit the scope of the invention, which is determined by the full scope of the appended claims and their equivalents.

[0092] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0093] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by, or in conjunction with, an instruction execution system, apparatus, or device (such as a computer-based system, a processor-including system, or other system that can fetch and execute instructions from, an instruction execution system, apparatus, or device). For the purposes of this specification, "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transmit programs for use by, or in conjunction with, an instruction execution system, apparatus, or device.

[0094] More specific examples (a non-exhaustive list) of computer-readable media include: electrical connections (electronic devices) having one or more wires, portable computer disk drives (magnetic devices), random access memory (RAM), read-only memory (ROM), erasable and editable read-only memory (EPROM or flash memory), fiber optic devices, and portable optical disc read-only memory (CDROM). Furthermore, computer-readable media can even be paper or other suitable media on which the aforementioned program can be printed, because the aforementioned program can be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, interpreting, or otherwise processing as necessary, and then stored in computer memory.

[0095] It should be understood that various parts of the present invention can be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, it can be implemented using any one or a combination of the following techniques known in the art: discrete logic circuits having logic gates for implementing logical functions on data signals, application-specific integrated circuits (ASICs) having suitable combinational logic gates, programmable gate arrays (PGAs), field-programmable gate arrays (FPGAs), etc.

[0096] In the foregoing description of this specification, references to terms such as "one embodiment," "another embodiment," or "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0097] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

[0098] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A method for evaluating the glass fiber effect in PCB materials, characterized in that, Includes the following steps: The target PCB board is divided into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions are determined respectively. Based on the equivalent RLGC model, the first RLGC matrix parameters of the dielectric part are extracted by the two-dimensional field solver, and the second RLGC matrix parameters of the glass fiber part are calculated by the layer equivalent model and the parallel plate capacitance model. The transmission parameter matrix of the equivalent RLGC model is determined based on the first RLGC matrix parameters and the second RLGC matrix parameters; The target transmission parameter matrix of the complete differential transmission line structure of the target PCB board is determined based on the multiple warp and weft fiberglass overlapping regions and the transmission parameter matrix corresponding to the multiple warp fiberglass regions; The scattering parameters of the target PCB board are determined based on the target transmission parameter matrix, and then the glass fiber effect performance parameters of the target PCB board are calculated based on the scattering parameters.

2. The method for evaluating the glass fiber effect of PCB materials according to claim 1, characterized in that, The step of dividing the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and determining the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions respectively, specifically includes: The target PCB board is divided into multiple modeling units according to its length; Each modeling unit is defined as containing multiple warp and weft fiberglass overlap regions and multiple warp fiberglass regions. Construct the corresponding first equivalent RLGC model based on the geometric and dielectric parameters of the dielectric layer and transmission line in the warp and weft fiber overlap region; The corresponding second equivalent RLGC model is constructed based on the geometric and dielectric parameters of the dielectric layer and transmission line in the radial glass fiber region.

3. The method for evaluating the glass fiber effect of PCB materials according to claim 1, characterized in that, The step of extracting the first RLGC matrix parameters of the dielectric portion using a two-dimensional field solver based on the equivalent RLGC model, and calculating the second RLGC matrix parameters of the glass fiber portion using the layer equivalent model and the parallel plate capacitance model, specifically includes: The equivalent RLGC model is divided into a dielectric portion containing only a homogeneous medium and a glass fiber portion containing both the medium and glass fiber. The linewidth, thickness, and conductivity of the medium portion are input into the two-dimensional field solver to obtain the parameters of the first RLGC matrix. The glass fibers within the glass fiber portion are equivalent to a glass fiber layer of constant thickness using a layer equivalence model. The changes in capacitance and conductivity caused by the glass fiber layer were calculated using a parallel plate capacitance model. The linewidth, dielectric thickness, and conductivity of the glass fiber portion are input into the two-dimensional field solver to obtain the parameters of the third RLGC matrix. The capacitance and conductance values ​​of the third RLGC matrix parameters are corrected based on the capacitance change and the conductance change to obtain the second RLGC matrix parameters.

4. The method for evaluating the glass fiber effect of PCB boards according to claim 1, characterized in that, The step of determining the transmission parameter matrix of the equivalent RLGC model based on the first RLGC matrix parameters and the second RLGC matrix parameters specifically includes: The first RLGC matrix parameters and the second RLGC matrix parameters are converted into 4-port Z parameters to obtain the first transmission parameter matrix of the medium part and the second transmission parameter matrix of the fiber optic part. The transmission parameter matrix of the equivalent RLGC model is determined by multiplying the first transmission parameter matrix and the second transmission parameter matrix.

5. The method for evaluating the glass fiber effect of PCB materials according to claim 2, characterized in that, The step of determining the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board based on the multiple warp and weft fiberglass overlapping regions and the transmission parameter matrix corresponding to the multiple warp fiberglass regions specifically includes: The first unit transmission parameter matrix is ​​determined by multiplying the transmission parameter matrices corresponding to the multiple warp and weft fiber overlap regions contained in the modeling unit. The second unit transmission parameter matrix is ​​determined by the product of the transmission parameter matrices corresponding to the multiple meridional glass fiber regions included in the modeling unit; The unit transmission parameter matrix of the modeling unit is determined by multiplying the first unit transmission parameter matrix and the second unit transmission parameter matrix. The target transmission parameter matrix is ​​determined by multiplying the unit transmission parameter matrices corresponding to the multiple modeling units contained in the target PCB board.

6. A method for evaluating the glass fiber effect of PCB boards according to any one of claims 1 to 5, characterized in that: The glass fiber effect performance parameters include at least one of the following: differential insertion loss, common-mode rejection ratio, differential transmission line delay difference, and eye diagram.

7. A device for evaluating the glass fiber effect of PCB boards, characterized in that, include: The region modeling module is used to divide the target PCB board into multiple warp and weft fiberglass overlapping regions and multiple warp fiberglass regions, and to determine the equivalent RLGC models corresponding to the warp and weft fiberglass overlapping regions and the warp fiberglass regions, respectively. The parameter solving module is used to calculate the first RLGC matrix parameters of the medium part extracted by the two-dimensional field solver according to the equivalent RLGC model, and to calculate the second RLGC matrix parameters of the glass fiber part through the layer equivalent model and the parallel plate capacitance model. The parameter concatenation module is used to determine the transmission parameter matrix of the equivalent RLGC model based on the first RLGC matrix parameters and the second RLGC matrix parameters; The parameter determination module is used to determine the target transmission parameter matrix of the complete differential transmission line structure of the target PCB board based on the multiple warp and weft fiberglass overlapping regions and the transmission parameter matrix corresponding to the multiple warp fiberglass regions. The glass fiber effect evaluation module is used to determine the scattering parameters of the target PCB board based on the target transmission parameter matrix, and then calculate the glass fiber effect performance parameters of the target PCB board based on the scattering parameters.

8. An electronic device, characterized in that, include: At least one processor; At least one memory for storing at least one program; When the at least one program is executed by the at least one processor, the at least one processor implements a method for evaluating the glass fiber effect of PCB boards as described in any one of claims 1 to 6.

9. A computer-readable storage medium storing a processor-executable program, characterized in that, The processor-executable program, when executed by the processor, is used to perform a method for evaluating the glass fiber effect of PCB boards as described in any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements a method for evaluating the glass fiber effect of PCB boards as described in any one of claims 1 to 6.

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