Industrial control power supply thick copper printed circuit board surface treatment device and treatment method thereof
By introducing a detachable mounting base and clamping mechanism into the surface treatment device for thick copper printed circuit boards in industrial control power supplies, the problem that the limiting device cannot adapt to different specifications of circuit boards is solved, and flexible clamping and efficient solder spraying are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGXI ZHONGLUO ELECTRONICS CO LTD
- Filing Date
- 2023-04-28
- Publication Date
- 2026-05-12
AI Technical Summary
In the existing technology, the limiting device of the thick copper printed circuit board of industrial control power supply cannot flexibly adapt to different specifications of circuit boards, resulting in poor tin spraying and hot air leveling effect, and the replacement of the limiting block is cumbersome.
It adopts a detachable mounting base and clamping mechanism, including a rear limiting plate, side pressing component, limiting rod, limiting sleeve, traction rope and sliding component, to achieve flexible limiting of the circuit board through manual operation, and to adapt to different specifications of circuit boards through displacement components and carrier plate structure, thereby enhancing the limiting effect.
It enables flexible and adaptable clamping of circuit boards of different specifications, improves the effect of soldering and hot air leveling, simplifies the replacement process, and improves operating efficiency.
Smart Images
Figure CN122028306A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board surface treatment, and more specifically to a surface treatment device and method for thick copper printed circuit boards used in industrial control power supplies. Background Technology
[0002] Industrial power supplies require printed circuit boards (PCBs) to be plated with a layer of copper foil on an epoxy resin substrate. Copper foil is typically available in four thicknesses: 18μm, 35μm, 55μm, and 70μm. PCB surface treatments generally fall into the following categories: tin plating, immersion tin plating, immersion gold plating, gold plating, and OSP (Optical Parts Plating). Tin plating is the most widely used and is the most common surface treatment process in the PCB industry. It offers good solderability and can be used in most electronic products.
[0003] Chinese patent CN202020837958.7 discloses a device for surface treatment of printed circuit boards, including a main body box, a paint spraying tank inside the main body box, collection boxes on both sides of the paint spraying tank, a collection trough inside the collection box, and an exhaust fan fixed inside the collection trough.
[0004] The above technical solution includes a limiting plate, a conveyor belt, an electric push rod, and a nozzle. The circuit board is placed on the conveyor belt, and the limiting plate limits the circuit board to prevent it from shifting during transport. However, with the limiting blocks in a fixed state, different limiting blocks need to be repeatedly replaced to accommodate circuit boards of different sizes, which is a relatively cumbersome process and not conducive to operator operation. Furthermore, if the spacing between the limiting blocks is determined before placing the circuit board, a proper fit cannot be achieved, which may cause the circuit board to shift during movement, thus affecting the subsequent soldering and hot air leveling effects. Summary of the Invention
[0005] The purpose of this invention is to provide a surface treatment device and method for thick copper printed circuit boards used in industrial control power supplies, thereby solving the above-mentioned technical problems.
[0006] The objective of this invention can be achieved through the following technical solutions: A surface treatment device for thick copper printed circuit boards for industrial control power supplies includes a conveying device, and a tin spraying device is installed on one side of the conveying device. The tin spraying device is used to spray tin onto the printed circuit boards on the conveying device. The conveying device is detachably fixed with multiple mounting seats, each equipped with a clamping mechanism for holding the circuit board to be soldered. The clamping mechanism limits the position of the circuit board to be soldered, thus accommodating circuit boards of different specifications.
[0007] As a further technical solution, the clamping mechanism includes: A rear limiting plate, which is fixed on the mounting base; Two side extrusion members are provided and symmetrically distributed on the mounting base; Limiting rods, the two limiting rods are respectively fixedly disposed on the side surface of the side extrusion member away from the mounting base; A limiting sleeve is provided, the other end of the limiting rod passes through the corresponding limiting sleeve, the limiting rod slides relative to the limiting sleeve, the limiting sleeve is installed on the mounting base, and a return spring is provided between the limiting sleeve and the side extrusion member; A traction rope, one end of which is fixedly connected to the side of the limiting rod that passes through the limiting sleeve and is attached to a sliding member. The sliding member is slidably connected in a slide rail groove provided on the mounting base. A front limiting plate is provided, which corresponds in position to the rear limiting plate and is mounted on the side of the sliding member facing the rear limiting plate. By manually pulling the sliding member, the clamping action on the circuit board is automatically released when the sliding member is pulled outward, and the clamping action on the circuit board is automatically restored when the sliding member is released.
[0008] As a further technical solution, displacement components are provided on both sides of the mounting base. These displacement components are used to adjust the distance between the two limiting sleeves. This expands the original maximum distance between the two limiting sleeves, thereby adapting to the needs of suddenly enlarged circuit boards, providing convenience and speed.
[0009] As a further technical solution, the displacement component includes: The telescopic rod has one end fixed to the side wall of the mounting base and the other end fixedly connected to the mounting plate; The mounting plate is provided with a longitudinal sliding groove, and the mounting plate is flush with the upper surface of the mounting base; The slider is slidably installed in the longitudinal groove and is fixedly disposed at the bottom of the limiting sleeve.
[0010] A specific displacement structure is provided, in which the electric telescopic rods on both sides of the same mounting base extend synchronously, driving the connected mounting plates to move away from each other. The limiting sleeve, limiting rod and side extrusion parts follow the movement until the required specifications are reached and then stop. At this time, the distance between the two side extrusion parts is supplemented at the limit distance, thus adapting to the large-size circuit boards that are inserted.
[0011] As a further technical solution, the mounting plate has a bearing plate on the side opposite to the mounting base, and a rope loop is fixedly installed on the bearing plate. The rope loop has a two-way structure for the traction rope to pass through.
[0012] As a further technical solution, the bottom of the longitudinal chute is through-type, and the bottom end of the slider extends out of the mounting plate and is fixedly connected to the bearing plate. Two adjacent bearing plates are configured with corresponding inclined surfaces. A rope loop and bearing plate are added to the original design. The rope loop is used to constrain the traction rope, thereby maintaining the pulling angle of the limit rod and achieving better traction.
[0013] As a further technical solution, the mounting base is provided with symmetrical slots on both sides, and a sub-plate is slidably connected in the slot. The sub-plate is fixedly connected to the side of the mounting plate by a connecting rod. The upper surface of the sub-plate is provided with multiple protrusions, which are telescopic structures used to compensate for the difference between the upper surface of the sub-plate and the surface of the mounting base.
[0014] As a further technical solution, the protrusion includes a semi-circular arc head. The bottom end of the semi-circular arc head is a flat structure and is movably mounted in a groove on the upper surface of the sub-plate. A support spring connects the groove and the bottom end of the semi-circular arc head. The sub-plate and the mounting plate are integrated into a single structure via a connecting rod. This allows the sub-plate to move synchronously when the mounting plate and the limiting sleeve move in opposite directions to clamp a large-size circuit board. The protrusion further supplements the height of the sub-plate, increasing the support area at the bottom of the large-size circuit board.
[0015] A surface treatment method for thick copper printed circuit boards in industrial control power supplies, comprising the following specific steps: S1: Install the circuit board on the clamping mechanism. The operator can pull the sliding part outward with one hand to drive the connected front limit plate to move outward synchronously. At the same time, the sliding part acts on the traction ropes connected on both sides, causing the traction ropes to drive the connected limit rods to slide away from each other, expanding the space between the two side extrusion parts. S2: Use your other hand to place the circuit board to be processed on the mounting base, and then slowly release the sliding part. The return spring will drive the side pressing parts to move closer together under the action of the elastic force until it presses the horizontal ends of the circuit board to be processed. At this time, the sliding part is pulled inward by the traction rope. The front limit plate and the rear limit plate cooperate to achieve the longitudinal limit of the circuit board to be processed. S3: When inserting large-size circuit boards, activate the displacement component to expand the original spacing between the two side extrusion parts to accommodate the inserted large-size circuit boards. S4: The conveyor delivers the circuit board on the mounting base to the bottom of the solder spraying device and stops operating. It will resume operation after the solder spraying device has finished spraying solder.
[0016] The beneficial effects of this invention are: This invention achieves automatic release of the clamping action on the circuit board when the slider is pulled outward by manually pulling the slider, and automatic clamping action on the circuit board when the slider is released. For fixed limiting blocks, it can be effectively adapted to circuit boards of different specifications, and can limit the four sides of the circuit board to achieve a better limiting effect. After the electric telescopic rods on both sides of the same mounting base extend synchronously, they drive the connected mounting plates to move away from each other. The limiting sleeve, limiting rod and side extrusion parts follow the movement until the required specifications are reached and then stop. At this time, the distance between the two side extrusion parts is supplemented at the limit distance, so as to adapt to the large-size circuit board that is inserted. Compared with the existing technology, the clamping and processing needs can be met without temporarily replacing the large-size mounting base, which is more flexible. This invention utilizes the inclined structure between two support plates. When the electric telescopic rod extends further, the support plate and the adjacent support plate engage with the inclined structure, causing the connected slider to shift within the longitudinal groove to avoid collisions. This not only prevents collisions between the two support plates but also increases the length of the support plate itself based on the original specifications, further expanding the distance between the two extrusion parts, thus making it suitable for larger-sized circuit boards to be processed. Attached Figure Description
[0017] The invention will now be further described with reference to the accompanying drawings.
[0018] Figure 1 This is a three-dimensional view of the entire invention; Figure 2 This is a schematic diagram of the mounting base and clamping mechanism in this invention; Figure 3 This is a schematic diagram showing the position between two adjacent bearing plates in this invention; Figure 4 This is a schematic diagram of the protrusion structure in this invention; Figure 5 This is a diagram illustrating the method steps of the present invention.
[0019] Figure Descriptions: 1. Conveying device; 2. Tin spraying device; 3. Mounting base; 4. Clamping mechanism; 41. Rear limiting plate; 42. Side extrusion component; 43. Limiting rod; 44. Limiting sleeve; 45. Return spring; 46. Traction rope; 47. Sliding component; 48. Slide rail groove; 49. Front limiting plate; 5. Displacement assembly; 51. Telescopic rod; 52. Mounting plate; 53. Longitudinal slide groove; 54. Slider; 55. Bearing plate; 56. Rope loop; 57. Inclined surface; 6. Groove; 7. Sub-plate; 8. Connecting rod; 9. Protrusion; 91. Semi-circular arc head; 92. Groove; 93. Support spring. Implementation
[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0021] Please see Figure 1-5 As shown, the present invention is a surface treatment device for thick copper printed circuit boards for industrial control power supplies. Example
[0022] The system includes a conveyor device 1, on one side of which a solder spraying device 2 is mounted. The solder spraying device 2 is used to apply solder to the printed circuit boards on the conveyor device 1. Multiple mounting seats 3 are detachably fixed to the conveyor device 1, and each mounting seat 3 is equipped with a clamping mechanism 4 for clamping the circuit board to be soldered. In this embodiment, by providing the clamping mechanism 4 on the mounting seat 3, the clamping mechanism 4 limits the position of the circuit board to be soldered, thus achieving the function of matching circuit boards of different specifications. The conveyor device 1 is existing technology and can be a belt conveyor or a chain conveyor.
[0023] The clamping mechanism 4 includes: Rear limiting plate 41, the rear limiting plate 41 is fixed on the mounting base 3; Two side extrusion members 42 are provided and symmetrically distributed on the mounting base 3; Limiting rods 43, the two limiting rods 43 are respectively fixedly disposed on the side surface of the side extrusion member 42 away from the mounting base 3; The limiting sleeve 44, the other end of the limiting rod 43 passes through the corresponding limiting sleeve 44, the limiting rod 43 slides relative to the limiting sleeve 44, the limiting sleeve 44 is installed on the mounting base 3, and a return spring 45 is provided between the limiting sleeve 44 and the side extrusion member 42; The traction rope 46 has one end fixedly connected to the limiting rod 43 through the limiting sleeve 44 and to the sliding member 47. The sliding member 47 is slidably connected in the slide rail groove 48 opened on the mounting base 3. A front limiting plate 49 is positioned corresponding to the rear limiting plate 41 and is mounted on the side of the sliding member 47 facing the rear limiting plate 41.
[0024] This embodiment provides a specific clamping structure. In use, the operator pulls the sliding member 47 outward with one hand, causing the connected front limiting plate 49 to move outward synchronously. Simultaneously, the sliding member 47 acts on the traction ropes 46 connected to both sides, causing the traction ropes 46 to move the connected limiting rods 43 away from each other, expanding the space between the two side pressing members 42. At this time, the other hand places the circuit board to be processed onto the mounting base 3, and then slowly releases the sliding member 47. The return spring 45, under its elastic force, causes the side pressing members 42 to move closer together until they are pressed against the surface to be processed. The circuit board is moved horizontally to both ends. At this time, the sliding member 47 is pulled inward by the traction rope 46. The front limit plate 49 and the rear limit plate 41 cooperate to limit the longitudinal movement of the circuit board to be processed. The present invention achieves automatic release of the clamping action on the circuit board when the sliding member 47 is pulled outward by manually pulling the sliding member 47, and automatic clamping action on the circuit board when the sliding member 47 is released. For the fixed limit block, it can be effectively adapted to circuit boards of different specifications, and can limit the four sides of the circuit board to achieve a better limiting effect. Example
[0025] Both sides of the mounting base 3 are provided with displacement components 5, which are used to adjust the distance between the two limiting sleeves 44. To address the issue that during production, due to customer needs or other requirements, large-size circuit boards may suddenly need to be inserted for soldering, and existing processes require cumbersome fixture changes to achieve clamping and limiting, this invention adds displacement components 5 to the mounting base 3 to expand the original limit distance between the two limiting sleeves 44. This adapts to the need for suddenly larger circuit boards, offering convenience, speed, and high practical value.
[0026] The displacement component 5 includes: Telescopic rod 51, one end of which is fixed to the side wall of the mounting base 3, and the other end is fixedly connected to the mounting plate 52; Mounting plate 52, which is provided with a longitudinal sliding groove 53 and is flush with the upper surface of the mounting base 3; The slider 54 is slidably installed in the longitudinal groove 53 and is fixedly disposed at the bottom of the limiting sleeve 44.
[0027] This invention provides a specific displacement structure. After the electric telescopic rods 51 on both sides of the same mounting base 3 extend synchronously, they drive the connected mounting plates 52 to move away from each other. The limiting sleeve 44, the limiting rod 43, and the side pressing member 42 follow the movement until the required specifications are reached and then stop. At this time, the distance between the two side pressing members 42 is supplemented at the limit distance, thereby adapting to the large-size circuit boards that are inserted. Compared with the prior art, the clamping and processing requirements can be met without temporarily replacing the large-size mounting base 3, which is more flexible.
[0028] The mounting plate 52 has a bearing plate 55 on the side opposite to the mounting base 3. A rope loop 56 is fixedly installed on the bearing plate 55. The rope loop 56 has a two-way structure for the traction rope 46 to pass through.
[0029] The bottom of the longitudinal groove 53 is through, the bottom end of the slider 54 extends out of the mounting plate 52 and is fixedly connected to the bearing plate 55, and two adjacent bearing plates 55 are configured as corresponding inclined surface 57 structures. In this embodiment, a rope loop 56 and a bearing plate 55 are added to the original structure. The rope loop 56 is used to constrain the traction rope 46, thereby maintaining the pulling angle of the limiting rod 43 and achieving a better traction effect. At the same time, the inclined surface 57 structure between the two bearing plates 55 is used in conjunction with the electric telescopic rod 51. As the electric telescopic rod 51 extends further, the bearing plate 55 and the adjacent bearing plate 55 engage with the inclined surface 57, causing the connected slider 54 to shift within the longitudinal groove 53 to achieve mutual avoidance. This avoids collision between the two bearing plates 55 and allows for further increase in the length of the bearing plate 55 based on the original specifications, further expanding the distance between the two extrusion parts 42, thus making it suitable for larger-sized circuit boards to be processed. During installation, the automatic avoidance between the two bearing plates 55 allows the bearing plate 55 and the displacement component 5 to be modularly integrated, reducing the assembly difficulty between the two adjacent mounting seats 3 during installation. Example
[0030] The mounting base 3 has symmetrical slots 6 on both sides. A sub-plate 7 is slidably connected in the slots 6. The sub-plate 7 is fixedly connected to the side of the mounting plate 52 by a connecting rod 8. The upper surface of the sub-plate 7 is provided with multiple protrusions 9. The protrusions 9 are telescopic structures used to compensate for the difference between the upper surface of the sub-plate 7 and the surface of the mounting base 3.
[0031] The protrusion 9 includes a semi-circular arc head 91. The bottom end of the semi-circular arc head 91 is a planar structure and is movably installed in a groove 92 opened on the upper surface of the sub-plate 7. A support spring 93 is connected between the groove 92 and the bottom end of the semi-circular arc head 91. In this embodiment, the sub-plate 7 and the mounting plate 52 are integrated into a single structure via the connecting rod 8. This allows the sub-plate 7 to move synchronously when the mounting plate 52 and the limiting sleeve 44 move away from each other to clamp a large-size circuit board. The protrusion 9 supplements the height of the sub-plate 7, increasing the bottom support area of the large-size circuit board and ensuring its flatness, thus improving the quality of subsequent solder plating. The protrusion 9 provides support by lifting the semi-circular head 91 upwards under the support of the support spring 93 during the process of detaching from the pressure on the top surface of the slot 6, creating the protrusion 9 on the top surface of the sub-plate 7. This provides height compensation for the sub-plate 7. When the sub-plate 7 returns to the slot 6, the semi-circular head 91 automatically presses into the groove 92 due to its characteristics. Furthermore, the support force of the support spring 93 creates static pressure on the top surface of the slot 6, effectively preventing the sub-plate 7 from automatically detaching from the slot 6 during the movement of the mounting base 3.
[0032] A surface treatment method for thick copper printed circuit boards in industrial control power supplies, comprising the following specific steps: S1: Install the circuit board on the clamping mechanism 4. The operator pulls the sliding member 47 outward with one hand, which will drive the connected front limit plate 49 to move outward synchronously. At the same time, the sliding member 47 acts on the traction ropes 46 connected on both sides, causing the traction ropes 46 to drive the connected limit rods 43 to slide away from each other, expanding the space between the two side extrusion members 42. S2: Use the other hand to place the circuit board to be processed on the mounting base 3, and then slowly release the sliding member 47. The return spring 45 drives the side pressing member 42 to move closer and closer under the action of the elastic force until it presses to both ends of the circuit board to be processed in the horizontal direction. At this time, the sliding member 47 is pulled inward by the traction rope 46. The front limit plate 49 and the rear limit plate 41 cooperate to achieve the longitudinal limit of the circuit board to be processed. S3: When inserting large-size circuit boards, activate displacement component 5 to expand the original spacing between the two side extrusion pieces 42 to accommodate the inserted large-size circuit boards. S4: The conveying device 1 delivers the circuit board on the mounting base 3 to the bottom of the solder spraying device 2 and stops operating. After the solder spraying device 2 finishes soldering, it resumes operation.
[0033] Working principle of the invention: In this embodiment, by providing a clamping mechanism 4 on the mounting base 3, the clamping mechanism 4 is used to limit the circuit board to be soldered, thereby achieving the function of matching circuit boards of different specifications. The conveying device 1 is the prior art and can be a belt conveyor or a chain conveyor. In use, the operator pulls the sliding member 47 outward with one hand, which drives the connected front limit plate 49 to move outward synchronously. At the same time, the sliding member 47 acts on the traction ropes 46 connected on both sides, causing the traction ropes 46 to drive the connected limit rods 43 to slide away from each other, expanding the space between the two side pressing members 42. At this time, the operator places the circuit board to be processed on the mounting base 3 with the other hand, and then slowly releases the sliding member 47. Under the action of the spring force, the return spring 45 drives the side pressing members 42 to move closer together until they press against the horizontal ends of the circuit board to be processed. At this time, the sliding member 47 is pulled inward by the traction rope 46, and the front limit plate 49 and the rear limit plate 42 move inward. The positioning plate 41 cooperates to achieve longitudinal positioning of the circuit board to be processed; the present invention achieves automatic release of the clamping action on the circuit board when the sliding member 47 is pulled outward by manually pulling the sliding member 47, and automatic clamping action on the circuit board when the sliding member 47 is released. For the fixed positioning block, it can be effectively adapted to circuit boards of different specifications, and can limit the four sides of the circuit board to achieve better positioning effect; the present invention adds a displacement component 5 to the mounting base 3 to expand the limit distance between the two limiting sleeves 44, thereby adapting to the needs of suddenly larger circuit boards, which is convenient, fast and has high practical value; Specifically, after the electric telescopic rods 51 on both sides of the same mounting base 3 extend synchronously, they drive the connected mounting plates 52 to move away from each other. The limiting sleeve 44, the limiting rod 43, and the side extrusion piece 42 follow the movement until the required specifications are reached and then stop. At this time, the distance between the two side extrusion pieces 42 is supplemented at the limit distance, so as to adapt to the large-size circuit board that is inserted. Compared with the existing technology, the clamping and processing requirements can be met without temporarily replacing the large-size mounting base 3, which is more flexible. Based on the original design, a rope loop 56 and a bearing plate 55 were added. The rope loop 56 is used to constrain the traction rope 46, thereby maintaining the pulling angle of the limit rod 43 and achieving a better traction effect. At the same time, the inclined surface 57 structure between the two bearing plates 55 is used in conjunction with the electric telescopic rod 51. As the electric telescopic rod 51 extends further, the bearing plate 55 and the adjacent bearing plate 55 engage with the inclined surface 57, causing the connected slider 54 to shift within the longitudinal groove 53 to achieve mutual avoidance. This avoids collision between the two bearing plates 55 and allows for further increase in the length of the bearing plate 55 based on the original specifications, further expanding the distance between the two extrusion parts 42, thus making it suitable for larger-sized circuit boards to be processed. During installation, due to the automatic avoidance between the two bearing plates 55, the bearing plate 55 and the displacement component 5 are modularly integrated, reducing the assembly difficulty between the two adjacent mounting bases 3 during installation. The connecting rod 8 integrates the sub-plate 7 and the mounting plate 52 into a single structure. This allows the sub-plate 7 to move synchronously when the mounting plate 52 and the limiting sleeve 44 move away from each other to clamp a large-size circuit board. The protrusion 9 supplements the height of the sub-plate 7, increasing the bottom support area of the large-size circuit board and ensuring its flatness, thus improving the quality of subsequent soldering. The protrusion 9 provides support by lifting the semi-circular head 91 upwards under the support of the support spring 93 during the process of detaching from the pressure on the top surface of the slot 6, creating the protrusion 9 on the top surface of the sub-plate 7 and thus compensating for its height. When the sub-plate 7 returns to the slot 6, the semi-circular head 91 automatically presses into the groove 92 due to its characteristics. Furthermore, the support force of the support spring 93 creates static pressure on the top surface of the slot 6, effectively preventing the sub-plate 7 from automatically detaching from the slot 6 during the movement of the mounting base 3.
[0034] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.
Claims
1. A surface treatment device for thick copper printed circuit boards of industrial control power supplies, comprising a conveying device (1), wherein a tin spraying device (2) is installed on one side of the conveying device (1), and the tin spraying device (2) is used to spray tin onto the printed circuit boards on the conveying device (1); Its features are, The conveying device (1) is detachably fixed with multiple mounting seats (3), and the mounting seats (3) are provided with clamping mechanisms (4), which are used to clamp the circuit board to be soldered.
2. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 1, characterized in that, The clamping mechanism (4) includes: Rear limiting plate (41), the rear limiting plate (41) is fixed on the mounting base (3); Two side extrusion members (42) are provided and symmetrically distributed on the mounting base (3); Limiting rods (43), the two limiting rods (43) are respectively fixedly disposed on the side surface of the side extrusion member (42) away from the mounting base (3); A limiting sleeve (44) is provided, and the other end of the limiting rod (43) passes through the corresponding limiting sleeve (44). The limiting rod (43) slides relative to the limiting sleeve (44). The limiting sleeve (44) is installed on the mounting base (3). A return spring (45) is provided between the limiting sleeve (44) and the side extrusion member (42). The traction rope (46) has one end fixedly connected to the side of the limiting rod (43) that passes through the limiting sleeve (44) and is attached to the sliding member (47). The sliding member (47) is slidably connected to the slide rail groove (48) opened on the mounting base (3). A front limiting plate (49) is positioned corresponding to the rear limiting plate (41) and is mounted on the side of the sliding member (47) facing the rear limiting plate (41).
3. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 2, characterized in that, The mounting base (3) is provided with displacement components (5) on both sides, and the displacement components (5) are used to adjust the distance between the two limiting sleeves (44).
4. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 3, characterized in that, The displacement component (5) includes: Telescopic rod (51), one end of which is fixed to the side wall of the mounting base (3), and the other end is fixedly connected to the mounting plate (52); Mounting plate (52), which is provided with a longitudinal sliding groove (53) and is flush with the upper surface of the mounting base (3); The slider (54) is slidably installed in the longitudinal groove (53) and the slider (54) is fixedly installed at the bottom of the limiting sleeve (44).
5. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 4, characterized in that, The mounting plate (52) has a bearing plate (55) on the side opposite to the mounting base (3). A rope loop (56) is fixedly installed on the bearing plate (55). The rope loop (56) has a two-way structure for the traction rope (46) to pass through.
6. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 5, characterized in that, The bottom of the longitudinal groove (53) is through, the bottom end of the slider (54) extends out of the mounting plate (52) and is fixedly connected to the bearing plate (55), and the two adjacent bearing plates (55) are configured as corresponding inclined surface (57) structures.
7. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 4, characterized in that, The mounting base (3) has symmetrical slots (6) on both sides. A sub-plate (7) is slidably connected in the slot (6). The sub-plate (7) is fixedly connected to the side of the mounting plate (52) by a connecting rod (8). The upper surface of the sub-plate (7) is provided with multiple protrusions (9). The protrusions (9) are telescopic structures used to compensate for the difference between the upper surface of the sub-plate (7) and the surface of the mounting base (3).
8. The surface treatment device for thick copper printed circuit boards of industrial control power supplies according to claim 7, characterized in that, The protrusion (9) includes a semi-circular arc head (91), the bottom end of which is a planar structure and is movably installed in a groove (92) opened on the upper surface of the sub-plate (7). A support spring (93) is connected between the groove (92) and the bottom end of the semi-circular arc head (91).
9. A method for surface treatment of thick copper printed circuit boards for industrial control power supplies, characterized in that: The processing method is applicable to the surface treatment device for thick copper printed circuit boards of industrial control power supplies as described in any one of claims 1-8, and the specific steps are as follows: S1: Install the circuit board on the clamping mechanism (4). The operator pulls the sliding part (47) outward with one hand, which will drive the connected front limit plate (49) to move outward synchronously. At the same time, the sliding part (47) acts on the traction rope (46) connected on both sides, so that the traction rope (46) drives the connected limit rod (43) to slide away from each other, expanding the space between the two side extrusion parts (42). S2: Use your other hand to place the circuit board to be processed on the mounting base (3), and then slowly release the sliding member (47). The return spring (45) drives the side pressing member (42) to move closer and closer under the action of the elastic force until it presses to both ends of the circuit board to be processed. At this time, the sliding member (47) is pulled inward by the traction rope (46). The front limit plate (49) and the rear limit plate (41) cooperate to achieve the longitudinal limit of the circuit board to be processed. S3: When inserting large-size circuit boards, activate the displacement component (5) to expand the original spacing between the two side extrusion pieces (42) to accommodate the inserted large-size circuit boards. S4: The conveying device (1) delivers the circuit board on the mounting base (3) to the bottom of the solder spraying device (2) and stops operating. After the solder spraying device (2) finishes soldering, it resumes operation.