Circuit board thickness compensation method, circuit board SIP (Session Initiation Protocol) plastic packaging method and solder mask
By setting a thickness-compensating solder mask layer on the outer edge of the circuit board, the problem of uneven thickness during lamination is solved, ensuring the uniformity of circuit board thickness and improving the quality and yield of SIP molding.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENNAN CIRCUITS
- Filing Date
- 2026-01-06
- Publication Date
- 2026-05-12
AI Technical Summary
Uneven thickness of the circuit board during lamination can lead to poor adhesion between the mold and the PCB during subsequent SIP molding, resulting in excess adhesive and affecting product yield.
By setting a thickness-compensating solder resist layer in the outer edge area of the laminate, and calculating the compensation data based on the thickness detection data, the thickness of the outer edge and the center area is ensured to be consistent. The finished solder resist layer is set to improve the thickness uniformity.
It effectively avoids the problem of glue overflow caused by uneven circuit board thickness, improves the quality and yield of SIP molding, ensures that the mold and circuit board are fully pressed together, and avoids the formation of voids.
Smart Images
Figure CN122028329A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board processing technology, and in particular to a circuit board thickness compensation method, a circuit board SIP molding method, and a solder mask board. Background Technology
[0002] The collaborative manufacturing of PCBs (Printed Circuit Boards) and SIPs (System-in-Packages) is key to the miniaturization and high-density development of electronic devices. In multilayer PCB processing, the lamination process is the core step, which requires heating and pressurizing to melt PP (prepreg) resin and fill the gaps between layers to form a board with uniform thickness, laying the foundation for subsequent SIP molding.
[0003] However, in actual production, the PCB size is often smaller than the lamination platform. Even with filler material, gaps will still exist between the platform and the PCB edge. During lamination, the PP melts when heated and flows into the lower pressure gaps at the edges, resulting in insufficient resin in the outer edge area of the PCB. After curing, the board thickness is significantly less than that in the center area, creating a thickness difference of "thin at the edges and thick at the center".
[0004] This difference directly affects subsequent SIP molding: if the mold is designed according to the standard thickness of the PCB, and the edges are too thin, the mold will not fit tightly with the PCB (i.e., "not pressed tightly"), and the molding liquid will easily overflow along the gap when injected (i.e., "overflowing glue"), which will ultimately lead to material waste, contamination of components, and serious restriction on the yield of SIP products, becoming a key pain point in the process.
[0005] Therefore, the circuit boards in the related technologies have uneven thickness, which is not conducive to subsequent SIP molding. Summary of the Invention
[0006] To address the issue of uneven circuit board thickness in related technologies, which is detrimental to subsequent SIP molding, this invention provides a circuit board thickness compensation method.
[0007] The circuit board thickness compensation method of this invention includes the following operations: A laminated board component is obtained, the laminated board component having an outer edge region and a central region; Obtain the thickness data of the outer edge region and the thickness data of the center region of the laminate; Thickness compensation data is derived based on the edge thickness data of the laminate and the thickness data of the central region of the laminate. A thickness-compensating solder resist layer is provided in the outer edge region of the laminate according to the thickness compensation data. A finished solder resist layer is applied to the surface of the laminate to obtain a solder resist plate.
[0008] As mentioned earlier, in related technologies, the outer edge region of the laminated board may experience adhesive overflow during the lamination process, resulting in the outer edge region being thinner than the center region. Therefore, the circuit board thickness compensation method of this invention, by setting a thickness compensation solder mask layer on the outer edge region of the laminated board, can compensate for the thickness of the outer edge region, ensuring that the thickness of the outer edge region is consistent with that of the center region. This greatly improves the uniformity of the subsequent circuit board thickness. In the subsequent SIP molding process, the SIP molding mold and the circuit board can be fully pressed together without gaps, thus avoiding the adhesive overflow problem in the SIP molding process.
[0009] Meanwhile, before setting the thickness compensation solder mask layer on the outer edge area of the laminate, the thickness of the outer edge area and the thickness of the center area can be detected separately. The thickness of the thickness compensation solder mask layer can be set according to the thickness of the outer edge area and the thickness of the center area, which can further improve the accuracy of the thickness compensation solder mask layer thickness and further improve the uniformity of the circuit board thickness.
[0010] Therefore, the circuit board thickness compensation method of the present invention can avoid the problem of uneven thickness of the circuit board.
[0011] In some embodiments, the laminate includes multiple circuit board sub-regions arranged in an array; In the central region, an inner edge region for SIP molding is formed between two adjacent circuit board sub-regions; The outer edge region is formed by the outer edges of multiple circuit board sub-regions located at the edge, and the outer edge region is used for SIP molding.
[0012] In some embodiments, obtaining the thickness data of the outer edge region of the laminated sheet includes the following operations: Multiple edge thickness detection points are set within the outer edge region; Obtain the thickness values of multiple edge thickness detection points; The thickness data of the outer edge region of the laminate is obtained by taking the average of the thickness values of multiple edge thickness detection points.
[0013] In some embodiments, obtaining thickness data of the central region of the laminate includes the following operations: Multiple center thickness detection points are set in the central area, and the multiple center thickness detection points are located in the inner edge area; Obtain the thickness values of multiple center thickness detection points; The average of the thickness values at multiple center thickness detection points is taken to obtain the thickness data of the center region of the laminate.
[0014] In some embodiments, deriving thickness compensation data based on edge thickness data and central region thickness data of the laminate includes the following operations: The thickness compensation data is obtained by subtracting the edge thickness data of the laminate from the thickness data of the central region of the laminate.
[0015] In some embodiments, the outer edge region includes a first outer edge region and a second outer edge region, wherein the first outer edge region and the second outer edge region are respectively disposed on both sides of the laminate substrate in the thickness direction; The thickness compensation data includes first thickness compensation data and second thickness compensation data, and the sum of the first thickness compensation data and the second thickness compensation data is the thickness compensation data. Setting a thickness-compensated solder resist layer in the outer edge region of the laminate according to the thickness compensation data includes the following operations: A first thickness compensation solder resist layer is provided in the first outer edge region according to the first thickness compensation data, and the thickness of the first thickness compensation solder resist layer is equal to the first thickness compensation data. A second thickness compensation solder resist layer is provided in the second outer edge region according to the second thickness compensation data, and the thickness of the second thickness compensation solder resist layer is equal to the second thickness compensation data.
[0016] In some embodiments, when the first thickness compensation solder resist layer is provided, a first void area is provided between the thickness compensation solder resist layer in the first outer edge region and the outer edge of the first outer edge region; When the thickness-compensating solder resist layer is provided in the second outer edge region, a second gap area is provided between the second thickness-compensating solder resist layer and the outer edge of the second outer edge region.
[0017] In some embodiments, setting the first blank area and the first blank area includes the following operations: Solder resist ink is applied in both the first outer edge region and the second outer edge region; The solder resist ink strips in the first outer edge region are exposed and developed sequentially to obtain the first thickness compensation solder resist layer and the first void area in the first outer edge region. The solder resist ink strips in the second outer edge region are exposed and developed sequentially to obtain the second thickness compensation solder resist layer and the second void area in the second outer edge region. The laminated parts are dried.
[0018] In some embodiments, forming a finished solder resist layer on the surface of the laminate includes the following operations: Solder resist ink is applied to both sides of the laminate in the thickness direction; The solder resist ink on both sides of the laminate in the thickness direction is subjected to exposure and development processes in sequence. The laminated board is dried to obtain a solder resist board.
[0019] In some embodiments, after obtaining the solder resist plate, the following operations are further included: The solder mask board is divided into multiple circuit board sub-regions along the inner edge region to obtain multiple independent sub-circuit boards, at least some of the edges of the sub-circuit boards originating from the inner edge region and the outer edge region.
[0020] The present invention also provides a method for SIP molding of circuit boards.
[0021] The circuit board SIP molding method of this invention includes the following operations: Solder resist components are obtained using the circuit board thickness compensation method described in the above embodiments; The solder mask board is cut into sub-circuits; The sub-circuit board is encapsulated using SIP molding.
[0022] In some embodiments, SIP molding of the sub-circuit board includes the following operations: The edges of the sub-circuit board are pressed and sealed using a SIP molding die. Encapsulating adhesive is injected between the SIP molding die and the surface of the sub-circuit board and cured to form an encapsulation layer on the surface of the sub-circuit board.
[0023] The present invention also provides a solder resist plate.
[0024] The solder resist component of this invention includes a laminated board, wherein both sides of the laminated board in the thickness direction are provided with a finished solder resist layer; the laminated board has an outer edge region and a central region; the outer edge region is provided with a thickness compensation solder resist layer, which is located between the finished solder resist layer and the laminated board. Attached Figure Description
[0025] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the structure of the solder resist plate according to an embodiment of the present invention; Figure 2 This is a partial cross-sectional view of the solder resist plate according to an embodiment of the present invention.
[0027] In the picture: 100. Solder mask board; 200. Laminated board; 201. Circuit board sub-area; 1. Outer edge region; 101. First outer edge region; 102. Second outer edge region; 2. Central area; 3. Inner edge region; 4. Finished solder resist layer; 5. Thickness-compensating solder resist layer; 501. First thickness-compensating solder resist layer; 502. Second thickness-compensating solder resist layer; 6. First blank area; 7. Second blank area; 8. Center thickness detection point; 9. Edge thickness detection point. Detailed Implementation
[0028] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0029] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.
[0030] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal encapsulation of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0031] To address the issue of uneven circuit board thickness in related technologies, which is detrimental to subsequent SIP molding, this invention provides a circuit board thickness compensation method.
[0032] The circuit board thickness compensation method of this invention includes the following operations: Step S100: Obtain a laminated board, which has an outer edge region and a central region; Step S200: Obtain the thickness data of the outer edge region and the thickness data of the center region of the laminate; Step S300: Obtain thickness compensation data based on the edge thickness data and the thickness data of the central area of the laminate; Step S400: Apply a thickness-compensating solder resist layer to the outer edge area of the laminate component according to the thickness compensation data; Step S500: A finished solder resist layer is applied to the surface of the laminate to obtain a solder resist plate.
[0033] It is understandable that the outer edge region of the laminate is the annular region of the outer edge of the laminate, and the central region of the laminate is the region located inside the outer edge region. The outer edge region and the central region together form the planar region of the laminate.
[0034] As mentioned earlier, in related technologies, the outer edge region of the laminated board may experience adhesive overflow during the lamination process, resulting in the outer edge region being thinner than the center region. Therefore, the circuit board thickness compensation method of this invention, by setting a thickness compensation solder mask layer on the outer edge region of the laminated board, can compensate for the thickness of the outer edge region, ensuring that the thickness of the outer edge region is consistent with that of the center region. This greatly improves the uniformity of the subsequent circuit board thickness. In the subsequent SIP molding process, the SIP molding mold and the circuit board can be fully pressed together without gaps, thus avoiding the adhesive overflow problem in the SIP molding process.
[0035] Meanwhile, before setting the thickness compensation solder mask layer on the outer edge area of the laminate, the thickness of the outer edge area and the thickness of the center area can be detected separately. The thickness of the thickness compensation solder mask layer can be set according to the thickness of the outer edge area and the thickness of the center area, which can further improve the accuracy of the thickness compensation solder mask layer thickness and further improve the uniformity of the circuit board thickness.
[0036] Therefore, the circuit board thickness compensation method of the present invention can avoid the problem of uneven thickness of the circuit board.
[0037] In some embodiments, the laminate includes multiple circuit board sub-regions arranged in an array. That is, the multiple circuit board sub-regions of the laminate can be divided to form multiple sub-circuit boards. In order to improve processing efficiency, multiple sub-circuit boards are assembled into a relatively large laminate, with one circuit board sub-region corresponding to one sub-circuit board. In the central region, an inner edge region for SIP molding is formed between two adjacent circuit board sub-regions. That is, the inner edge region between two adjacent circuit board sub-regions is partly located in one circuit board sub-region and partly located in the other circuit board sub-region. The inner edge region in the circuit board sub-region can be understood as an inner edge sub-region, that is, the inner edge sub-regions of multiple circuit board sub-regions form the inner edge region. At the same time, the outer edge region is formed by the outer edges of multiple circuit board sub-regions located at the edge, and the outer edge region is used for SIP molding.
[0038] Therefore, both the inner and outer edge regions are areas used for SIP molding and pressing. By setting a thickness-compensating solder mask layer on the outer edge region of the laminate, the thickness of the outer edge region of the laminate can be compensated, so that the thickness of the outer edge region of the laminate is consistent with that of the central region. This greatly improves the uniformity of the thickness of the subsequent circuit board. In the subsequent SIP molding process, the SIP molding mold and the circuit board can be fully pressed together without gaps, thus avoiding the problem of glue overflow in the SIP molding process.
[0039] In some embodiments, in step S200, obtaining the thickness data of the outer edge region of the laminate includes the following operations: setting multiple edge thickness detection points in the outer edge region; obtaining the thickness values of the multiple edge thickness detection points; taking the average value of the thickness values of the multiple edge thickness detection points to obtain the thickness data of the outer edge region of the laminate.
[0040] It is understandable that multiple white edge thickness detection points can be set at intervals along the extension direction of the outer edge region, which can improve the accuracy of the data. At the same time, taking the average of the thickness values of multiple edge thickness detection points to obtain the thickness data of the outer edge region of the laminate can further improve the accuracy of the data.
[0041] In some embodiments, in step S200, obtaining the thickness data of the central region of the laminate includes the following operations: setting multiple center thickness detection points in the central region, the multiple center thickness detection points being located in the inner edge region; obtaining the thickness values of the multiple center thickness detection points; taking the average of the thickness values of the multiple center thickness detection points to obtain the thickness data of the central region of the laminate.
[0042] like Figure 1As shown, the inner edge region can be distributed in a grid pattern with alternating rows and columns. For example, if the inner edge region includes multiple rows and columns, then center thickness detection points can be set at the intersections of the rows and columns of the inner edge region. Since there are multiple intersections of the rows and columns of the inner edge region, multiple center thickness detection points can be set, which can provide a data foundation for subsequent data processing and thus improve the accuracy of the data.
[0043] Simultaneously taking the average of the thickness values from multiple center thickness detection points to obtain the thickness data of the center region of the laminate can further improve the accuracy of the data.
[0044] In some embodiments, in step S300, deriving thickness compensation data based on the edge thickness data of the laminate and the thickness data of the central region of the laminate includes the following operation: subtracting the edge thickness data of the laminate and the thickness data of the central region of the laminate to obtain the thickness compensation data.
[0045] By calculating the difference between the average thickness of the outer edge region and the average thickness of the center region of the laminate, the specific thickness of the thickness-compensating solder mask layer to be applied in the outer edge region can be determined. This precise calculation ensures that the thickness-compensating solder mask layer precisely compensates for the thickness difference between the outer edge and center regions, resulting in a uniform thickness across the entire laminate. In practice, setting the thickness-compensating solder mask layer based on this data effectively avoids defects such as adhesive overflow during subsequent SIP molding processes due to uneven circuit board thickness, thereby improving the quality and yield of the circuit board products.
[0046] In some embodiments, the outer edge region includes a first outer edge region and a second outer edge region, which are respectively disposed on both sides in the thickness direction of the laminate substrate; The thickness compensation data includes first thickness compensation data and second thickness compensation data, and the sum of the first thickness compensation data and the second thickness compensation data is the thickness compensation data. Applying a thickness-compensated solder resist layer to the outer edge region of the laminate based on thickness compensation data includes the following operations: A first thickness compensation solder resist layer is set in the first outer edge region according to the first thickness compensation data, and the thickness of the first thickness compensation solder resist layer is equal to the first thickness compensation data. A second thickness compensation solder resist layer is set in the second outer edge region according to the second thickness compensation data, and the thickness of the second thickness compensation solder resist layer is equal to the second thickness compensation data.
[0047] It is understandable that the first thickness compensation data and the second thickness compensation data can be equal, that is, the thickness compensation data can be obtained by dividing the thickness compensation data equally. At the same time, setting the first thickness compensation data and the second thickness compensation data to be equal can better balance the thickness of the laminate and ensure that both sides are flat in the thickness direction. This can effectively avoid defects such as glue overflow in the subsequent SIP molding process due to uneven circuit board thickness, and improve the quality and yield of circuit board products.
[0048] In some embodiments, when a first thickness compensation solder resist layer is provided, a first void area is provided between the thickness compensation solder resist layer in the first outer edge region and the outer edge of the first outer edge region. When a thickness-compensating solder resist layer is provided in the second outer edge region, a second gap area is provided between the second thickness-compensating solder resist layer and the outer edge of the second outer edge region.
[0049] By setting a first blanking area and a second blanking area, that is, setting a first blanking area and a second blanking area on both sides in the thickness direction of the laminate, and not setting a solder resist layer in the first blanking area and the second blanking area, it is convenient to handle the laminate in the future.
[0050] In some embodiments, setting the first blank area and the first blank area includes the following operations: setting solder resist ink in both the first outer edge region and the second outer edge region; sequentially performing an exposure process and a development process on the solder resist ink strip in the first outer edge region to obtain a first thickness compensation solder resist layer and a first blank area in the first outer edge region; sequentially performing an exposure process and a development process on the solder resist ink in the second outer edge region to obtain a second thickness compensation solder resist layer and a second blank area in the second outer edge region; and drying the laminate.
[0051] By exposing and developing the solder resist ink in the first outer edge region once, the solder resist ink in the first outer edge region can be corrected, and excess solder resist ink can be removed, thereby forming a first blank area in the first outer edge region; similarly, by exposing and developing the solder resist ink in the second outer edge region once, the solder resist ink in the second outer edge region can be corrected, and excess solder resist ink can be removed, thereby forming a second blank area in the second outer edge region.
[0052] In some embodiments, setting a finished solder resist layer on the surface of a laminate includes the following operations: setting solder resist ink on both sides of the laminate in the thickness direction; sequentially performing an exposure process and a development process on the solder resist ink on both sides of the laminate in the thickness direction; and drying the laminate.
[0053] By applying solder resist ink to both sides of the laminate in the thickness direction and performing sequential exposure and development processes, the distribution and thickness of the solder resist ink can be precisely controlled, ensuring the quality and stability of the finished solder resist layer. Subsequently, the laminate is dried to cure the solder resist ink, forming a robust and durable finished solder resist layer that effectively protects the circuit board from environmental factors, improves the quality of the circuit board, and extends its service life.
[0054] In some embodiments, after obtaining the solder resist plate, the following operations are further included: The solder mask board is divided into multiple circuit board sub-regions along the inner edge region to obtain multiple independent sub-circuit boards, at least some of which have edges from the inner edge region and the outer edge region.
[0055] It is understandable that, in order to improve processing efficiency, multiple sub-circuit boards are assembled into a relatively large laminate, with one circuit board sub-area corresponding to one sub-circuit board. After obtaining the solder mask board, the multiple circuit board sub-areas are divided to obtain multiple sub-circuit boards.
[0056] It is understandable that by setting a thickness-compensating solder mask layer on some sub-circuit boards, including the outer edge area, the problem of adhesive overflow can be avoided in the subsequent SIP molding process.
[0057] The present invention also provides a method for SIP molding of circuit boards.
[0058] The circuit board SIP molding method of this embodiment of the invention further includes the following operations: Solder mask components are obtained using the circuit board thickness compensation method described in the above embodiments; The solder mask board is cut into sub-circuits; The sub-circuit board is encapsulated using SIP molding.
[0059] The circuit board SIP molding method of this invention obtains solder mask components by adopting the circuit board thickness compensation method described in the above embodiments, which can avoid the problem of glue leakage during the molding process and improve the quality and yield of circuit board products.
[0060] In some embodiments, SIP molding includes the following operations: pressing and sealing the edges of a sub-circuit board using a SIP molding mold, injecting encapsulating adhesive between the SIP molding mold and the surface of the sub-circuit board, and curing to form an encapsulation layer on the surface of the sub-circuit board.
[0061] This SIP encapsulation process creates a uniform, dense, and high-performance encapsulation layer on the surface of the sub-circuit board, effectively protecting the internal circuit structure and preventing external environmental factors such as moisture and dust from affecting the circuit.
[0062] The present invention also provides a solder resist plate.
[0063] The solder resist component of this invention includes a laminated board, and both sides of the laminated board in the thickness direction are provided with finished solder resist layers; the laminated board has an outer edge region and a central region; the outer edge region is provided with a thickness compensation solder resist layer, which is located between the finished solder resist layer and the laminated board.
[0064] This solder mask board, by setting a thickness-compensating solder mask layer on the outer edge of the laminated board, can effectively adjust the thickness of different areas of the solder mask board, so that the stress on each part is uniform during the subsequent SIP molding process, avoiding the occurrence of glue leakage due to thickness differences, thereby improving the quality and yield of circuit board products.
[0065] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.
Claims
1. A method for compensating the thickness of a circuit board, characterized in that, This includes the following operations: A laminated board component is obtained, the laminated board component having an outer edge region and a central region; Obtain the thickness data of the outer edge region and the thickness data of the center region of the laminate; Thickness compensation data is derived based on the edge thickness data of the laminate and the thickness data of the central region of the laminate. A thickness-compensating solder resist layer is provided in the outer edge region of the laminate according to the thickness compensation data. A finished solder resist layer is applied to the surface of the laminate to obtain a solder resist plate.
2. The circuit board thickness compensation method according to claim 1, characterized in that, The laminated board includes multiple circuit board sub-regions arranged in an array; In the central region, an inner edge region for SIP molding is formed between two adjacent circuit board sub-regions; The outer edge region is formed by the outer edges of multiple circuit board sub-regions located at the edge, and the outer edge region is used for SIP molding.
3. The circuit board thickness compensation method according to claim 2, characterized in that, Obtaining the thickness data of the outer edge region of the laminated board includes the following operations: Multiple edge thickness detection points are set within the outer edge region; Obtain the thickness values of multiple edge thickness detection points; The thickness data of the outer edge region of the laminate is obtained by taking the average of the thickness values of multiple edge thickness detection points.
4. The circuit board thickness compensation method according to claim 3, characterized in that, Obtaining the thickness data of the central region of the laminated board includes the following operations: Multiple center thickness detection points are set in the central area, and the multiple center thickness detection points are located in the inner edge area; Obtain the thickness values of multiple center thickness detection points; The average of the thickness values at multiple center thickness detection points is taken to obtain the thickness data of the center region of the laminate.
5. The circuit board thickness compensation method according to claim 1, characterized in that, The thickness compensation data is derived based on the edge thickness data and the central region thickness data of the laminate, including the following operations: The thickness compensation data is obtained by subtracting the edge thickness data of the laminate from the thickness data of the central region of the laminate.
6. The circuit board thickness compensation method according to claim 1, characterized in that, The outer edge region includes a first outer edge region and a second outer edge region, which are respectively located on both sides of the laminate substrate in the thickness direction. The thickness compensation data includes first thickness compensation data and second thickness compensation data, and the sum of the first thickness compensation data and the second thickness compensation data is the thickness compensation data. Setting a thickness-compensated solder resist layer in the outer edge region of the laminate according to the thickness compensation data includes the following operations: A first thickness compensation solder resist layer is provided in the first outer edge region according to the first thickness compensation data, and the thickness of the first thickness compensation solder resist layer is equal to the first thickness compensation data. A second thickness compensation solder resist layer is provided in the second outer edge region according to the second thickness compensation data, and the thickness of the second thickness compensation solder resist layer is equal to the second thickness compensation data.
7. The circuit board thickness compensation method according to claim 6, characterized in that, When the first thickness compensation solder resist layer is set, a first gap area is set between the thickness compensation solder resist layer in the first outer edge region and the outer edge of the first outer edge region. When the thickness-compensating solder resist layer is provided in the second outer edge region, a second gap area is provided between the second thickness-compensating solder resist layer and the outer edge of the second outer edge region.
8. The circuit board thickness compensation method according to claim 7, characterized in that, Setting the first blank area and the first blank area includes the following operations: Solder resist ink is applied in both the first outer edge region and the second outer edge region; The solder resist ink strips in the first outer edge region are exposed and developed sequentially to obtain the first thickness compensation solder resist layer and the first void area in the first outer edge region. The solder resist ink strips in the second outer edge region are exposed and developed sequentially to obtain the second thickness compensation solder resist layer and the second void area in the second outer edge region. The laminated parts are dried.
9. The circuit board thickness compensation method according to claim 1, characterized in that, The process of applying a finished solder resist layer to the surface of the laminated component includes the following steps: Solder resist ink is applied to both sides of the laminate in the thickness direction; The solder resist ink on both sides of the laminate in the thickness direction is subjected to exposure and development processes in sequence. The laminated board is dried to obtain a solder resist board.
10. The circuit board thickness compensation method according to claim 2, characterized in that, After obtaining the solder mask plate, the following operations are also included: The solder mask board is divided into multiple circuit board sub-regions along the inner edge region to obtain multiple independent sub-circuit boards, at least some of the edges of the sub-circuit boards originating from the inner edge region and the outer edge region.
11. A method for SIP molding of a circuit board, characterized in that, This includes the following operations: Solder mask components are obtained using the circuit board thickness compensation method as described in any one of claims 1-10; The solder mask board is cut into sub-circuits; The sub-circuit board is encapsulated using SIP molding.
12. The circuit board SIP molding method according to claim 11, characterized in that, SIP encapsulation of the sub-circuit board includes the following operations: The edges of the sub-circuit board are pressed and sealed using a SIP molding die. Encapsulating adhesive is injected between the SIP molding die and the surface of the sub-circuit board and cured to form an encapsulation layer on the surface of the sub-circuit board.
13. A solder resist plate, characterized in that, include: A laminated board, wherein both sides of the laminated board in the thickness direction are provided with a finished solder resist layer; the laminated board has an outer edge region and a central region; the outer edge region is provided with a thickness-compensating solder resist layer, which is located between the finished solder resist layer and the laminated board.