Liquid cooling heat dissipation device for high-power electronic equipment and liquid cooling heat dissipation equipment
By introducing a diverting and splitting component and a bifractal flow equalization component into the liquid cooling heat dissipation device, the problem of uneven flow of coolant in the toothed liquid cooling plate is solved, achieving stable coolant flow rate and uniform flow distribution, thus improving the heat dissipation effect of high-power electronic equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SUZHOU SOBEIDE COMM TECH CO LTD
- Filing Date
- 2025-12-26
- Publication Date
- 2026-05-12
AI Technical Summary
In existing liquid cooling technologies, the coolant flow distribution within the toothed liquid cooling plate is uneven, resulting in uneven heat dissipation. This is especially true in high-power electronic devices, where traditional flow distribution structures cannot effectively solve the problems of eddies and uneven flow when the flow transitions from vertical to horizontal.
The system employs a combination of a diverting flow divider and a double-fractal flow equalizer. The diverting flow divider uses a conical flow divider to convert the coolant from a vertical to a horizontal flow direction, and the double-fractal flow equalizer performs secondary precise distribution to ensure stable coolant flow rate and uniform flow.
It effectively avoids eddy currents, ensuring uniform flow of coolant throughout the liquid-cooled heat sink, thus improving the heat dissipation uniformity and efficiency of high-power electronic devices.
Smart Images
Figure CN122028358A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of heat dissipation technology, and in particular to a liquid cooling heat dissipation device and liquid cooling heat dissipation equipment for high-power electronic devices. Background Technology
[0002] As data center servers (such as AI and GPU clusters), new energy vehicle electronic control systems (such as SiC modules), and power electronic devices (such as IGBT inverters) develop towards higher power densities, the heat dissipation density of chips and power devices has exceeded 500W / cm². 2 Traditional air cooling is gradually being replaced by liquid cooling technology due to insufficient heat exchange efficiency. Among them, the shovel-shaped liquid cooling plate has become the mainstream heat dissipation solution for high-power equipment because the "shovel-shaped protrusions" formed by milling and extrusion significantly increase the specific surface area of the flow channel.
[0003] Currently, the existing technologies in the industry for "cooled plate diversion with spade teeth" mainly fall into the following three categories: 1. The vertical inlet is directly connected to the horizontal toothed channel. The water flow is guided to change direction only through the rounded transition at the channel inlet. There are no additional diversion components. For example, in the patent application with patent publication number CN118763322A, the liquid inlet channel is directly connected to the liquid distribution channel. No flow guiding or diversion structure is set. The fluid turning and distribution are achieved by relying on the natural transition of the channel. When the vertical water flow turns to the horizontal, the kinetic energy is concentrated and it is easy to impact the side wall of the channel to form a vortex zone. This leads to uneven flow distribution in the horizontal channel. That is, the flow of the toothed channel near the inlet is excessive, while the flow of the channel far from the inlet is insufficient.
[0004] 2. A solid or hollow cone (tip facing upwards) is installed below the vertical inlet. The cone surface converts the vertical water flow into radial horizontal flow, eliminating the need for subsequent secondary diversion structures and directly connecting to multiple sub-channels. However, this cone-based diversion only achieves the "vertical to horizontal" flow conversion and does not solve the problem of "uniform distribution across multiple branch channels." The radial water flow exhibits a "sparse center, dense edge" distribution. Specifically, the water flow at the edge of the cone's base is faster due to centrifugal force and preferentially enters the toothed channels at the edge of the cold plate, while the water flow in the central area is slower, resulting in insufficient heat exchange in the central toothed channels.
[0005] 3. Chisel-tooth cold plates with tree-like or chain-like single-flow branching, such as patent applications with publication numbers CN114630566A and CN117936972A. In these applications, the vertical water flow of the tree-like branching directly enters the primary main channel. Due to the high flow velocity in the main channel, the flow rate allocated to the upstream branch channels is high, while the flow rate of the downstream branches is insufficient, resulting in a temperature difference of "hot in the front and cold in the back". The vertical water flow of the chain-like branching does not turn and directly impacts the chain guide strips, causing the flow rate between the first set of guide strips to saturate. The flow rate between the subsequent guide strips decreases, and the guide strips are prone to fatigue deformation due to impact vibration. Summary of the Invention
[0006] The purpose of this disclosure is to overcome the shortcomings of the prior art and to provide a liquid cooling heat dissipation device and liquid cooling heat dissipation equipment for high-power electronic devices that effectively improves heat dissipation uniformity.
[0007] The purpose of this disclosure is achieved through the following technical solution: A liquid cooling heat dissipation device for high-power electronic devices includes: a liquid cooling heat dissipation box and a liquid cooling heat dissipation assembly; the liquid cooling heat dissipation box is used to connect to the heat-generating area of the high-power electronic device, the liquid cooling heat dissipation box has an inlet chamber, a return chamber and an outlet chamber connected in sequence, the liquid cooling heat dissipation box has an inlet port and an outlet port, the inlet port is connected to the inlet chamber and is used to inject coolant, the outlet port is connected to the outlet chamber and is used to discharge coolant; the liquid cooling heat dissipation assembly includes a diverting flow divider and a bifractal flow equalization component, the diverting flow divider and the bifractal flow equalization component are both located in the inlet chamber, the diverting flow divider is arranged opposite to the inlet port, the diverting flow divider is used to divert the flow path of the injected coolant, the bifractal flow equalization component is arranged adjacent to the diverting flow divider and is used to balance the flow velocity of the coolant after diversion.
[0008] In one embodiment, the diverting component includes a conical diverting column and a fixed connecting column, the fixed connecting column being connected to the bottom of the conical diverting column and the bottom of the liquid inlet chamber, respectively, and the top of the conical diverting column facing the liquid inlet.
[0009] In one embodiment, the diameter of the cone base of the conical diverter is larger than the diameter of the inlet.
[0010] In one embodiment, the cone apex angle of the conical diverter column is 30° to 60°.
[0011] In one embodiment, the ratio of the height of the conical diverter column to the diameter of the inlet is 1.2 to 1.5.
[0012] In one embodiment, the bifractal flow equalizer includes at least two first flow dividers, which are symmetrically arranged, with one end of each first flow divider located close to the bottom of the conical flow divider column.
[0013] In one embodiment, the bifractal flow equalization element further includes at least two second flow dividers, which are symmetrically arranged. One end of each second flow divider is located close to the bottom of the conical flow divider column, and the symmetrical centerline of the second flow divider coincides with the symmetrical centerline of the first flow divider.
[0014] In one embodiment, the length of the second diverter bar is less than the length of the first diverter bar.
[0015] In one embodiment, both the first and second diverter bars have a curved structure, and both the first and second diverter bars are curved toward the connection between the liquid inlet chamber and the return chamber.
[0016] A liquid cooling heat dissipation device includes the liquid cooling heat dissipation device for high-power electronic devices described in any of the above embodiments.
[0017] Compared with the prior art, this disclosure has at least the following advantages: After entering the liquid-cooled heat sink, the coolant is redirected by a diverting component, smoothing the flow path at the inlet and preventing eddies. This reduces initial flow velocity fluctuations and provides a stable flow rate. The coolant then undergoes a two-stage precise distribution process using a bifractal flow equalizer, further stabilizing the redirected flow velocity and preventing uneven flow. This ensures uniform coolant flow throughout the heat sink, effectively improving the heat dissipation uniformity for high-power electronic devices. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of a liquid cooling heat dissipation device for high-power electronic devices in one embodiment; Figure 2 for Figure 1 The diagram shows a cross-sectional view of a liquid cooling heat dissipation device for high-power electronic devices. Detailed Implementation
[0020] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.
[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0023] This disclosure relates to a liquid cooling heat dissipation device for high-power electronic devices. In one embodiment, the liquid cooling heat dissipation device for high-power electronic devices includes a liquid cooling heat dissipation box and a liquid cooling heat dissipation assembly; the liquid cooling heat dissipation box is used to connect to the heat-generating area of the high-power electronic device, and the liquid cooling heat dissipation box has an inlet chamber, a reflux chamber and an outlet chamber connected in sequence. The liquid cooling heat dissipation box has an inlet port and an outlet port. The inlet port is connected to the inlet chamber and is used to inject coolant. The outlet port is connected to the outlet chamber and is used to discharge coolant; the liquid cooling heat dissipation assembly includes a diverting and diverting component and a bifractal flow equalization component. The diverting and diverting component and the bifractal flow equalization component are both located in the inlet chamber. The diverting and diverting component is disposed opposite to the inlet port. The diverting and diverting component is used to divert the flow path of the injected coolant. The bifractal flow equalization component is disposed adjacent to the diverting and diverting component and is used to balance the flow velocity of the coolant after diversion. After entering the liquid-cooled heat sink, the coolant is redirected by a diverting component, smoothing the flow path at the inlet and preventing eddies. This reduces initial flow velocity fluctuations and provides a stable flow rate. The coolant then undergoes a two-stage precise distribution process using a bifractal flow equalizer, further stabilizing the redirected flow velocity and preventing uneven flow. This ensures uniform coolant flow throughout the heat sink, effectively improving the heat dissipation uniformity for high-power electronic devices.
[0024] Please see Figure 1 This is a schematic diagram of the structure of a liquid cooling heat dissipation device for high-power electronic devices according to an embodiment of the present disclosure.
[0025] One embodiment of a liquid cooling heat dissipation device 10 for high-power electronic devices includes a liquid cooling heat sink 100. The liquid cooling heat sink 100 is used to connect to the heat-generating area of the high-power electronic device; please refer to the accompanying documentation. Figure 2 The liquid-cooled heat sink 100 has a liquid inlet chamber 102, a reflux chamber 104 and a liquid outlet chamber 106 connected in sequence. The liquid-cooled heat sink 100 has a liquid inlet 108 and a liquid outlet 101. The liquid inlet 108 is connected to the liquid inlet chamber 102 and is used to inject coolant. The liquid outlet 101 is connected to the liquid outlet chamber 106 and is used to discharge coolant. The liquid cooling heat dissipation device 10 for high-power electronic devices further includes a liquid cooling heat dissipation component 200. The liquid cooling heat dissipation component 200 includes a diverting and diverting component 210 and a double fractal flow equalizing component 220. Both the diverting and diverting component 210 and the double fractal flow equalizing component 220 are located in the liquid inlet chamber 102. The diverting and diverting component 210 is disposed opposite to the liquid inlet 108. The diverting and diverting component 210 is used to divert the flow path of the injected coolant. The double fractal flow equalizing component 220 is disposed adjacent to the diverting and diverting component 210. The double fractal flow equalizing component 220 is used to balance the flow rate of the coolant after diversion.
[0026] In this embodiment, after the coolant enters the liquid-cooled heat sink 100, the diverting and splitting component 210 reverses the flow direction of the coolant, making the liquid flow channel at the inlet 108 smooth and avoiding eddy currents. This reduces the initial flow velocity fluctuation of the coolant, providing a stable coolant flow rate. The coolant then undergoes secondary precise distribution by the bifractal flow equalizer 220, further stabilizing the flow velocity after the diversion and preventing uneven coolant flow. This ensures uniform coolant flow velocity throughout the liquid-cooled heat sink 100, effectively improving the heat dissipation uniformity for high-power electronic devices.
[0027] In one embodiment, please refer to Figure 2The diverting component 210 includes a conical diverting column 212 and a fixed connecting column (not shown). The fixed connecting column is connected to the bottom of the conical diverting column 212 and the bottom of the liquid inlet chamber 102, respectively. The top of the conical diverting column 212 faces the liquid inlet 108. In this embodiment, the conical diverter column 212 serves as a primary diverter for the coolant. The apex of the conical diverter column 212 corresponds to the inlet 108. After the coolant enters the liquid-cooled heat sink 100 through the inlet 108, it first contacts the apex of the conical diverter column 212. The coolant is then diverted in multiple directions through the apex of the conical diverter column 212. Specifically, the vertical flow of the coolant is guided along the generatrix of the cone of the conical diverter column 212, causing the coolant to change to a horizontal flow direction. This achieves a smooth transition of the coolant from vertical to horizontal flow, eliminates vortex regions, reduces initial horizontal flow velocity fluctuations, and lays a stable flow foundation for subsequent diversion. The fixed connecting post is connected to the cone bottom of the conical diverting post 212. The fixed connecting post installs the conical diverting post 212 at the bottom of the liquid inlet chamber 102. For example, the fixed connecting post is a threaded post, so that the conical diverting post 212 is screwed to the bottom of the liquid inlet chamber 102 through the fixed connecting post.
[0028] Furthermore, the diameter of the cone base of the conical diverter column 212 is larger than the diameter of the liquid inlet 108. In this embodiment, the conical diverter column 212 is a primary diverting component for the coolant. The cone apex of the conical diverter column 212 corresponds to the liquid inlet 108. After the coolant enters the liquid-cooled heat sink 100 through the liquid inlet 108, it first contacts the cone apex of the conical diverter column 212. The cone apex of the conical diverter column 212 diverts the coolant in multiple directions, achieving a smooth transition from vertical to horizontal flow to avoid eddy currents. The cone base and cone apex of the conical diverter column 212 are arranged opposite each other. The diameter of the cone base of the conical diverter column 212 determines the bottom distribution area of the conical diverter column 212. Moreover, the diameter of the cone base of the conical diverter column 212 also determines the steepness of the conical diverter column 212, facilitating the adjustment of the degree of coolant diversion. By designing the diameter of the cone bottom of the conical diverter column 212 to be larger than the diameter of the liquid inlet 108, specifically, the ratio of the diameter of the liquid inlet 108 to the diameter of the cone bottom of the conical diverter column 212 is 0.8, the area of the cone bottom of the conical diverter column 212 is larger than the area of the liquid inlet 108. This allows the coolant to flow through the generatrix of the conical diverter column 212 after passing through the liquid inlet 108. Under the guidance of the generatrix of the conical diverter column 212, the flow rate of the coolant after turning is more stable.
[0029] In another embodiment, the included angle of the cone apex of the conical diverter column 212 is 30° to 60°. In this embodiment, the conical diverter column 212 is a primary diverting component for the coolant. The cone apex of the conical diverter column 212 corresponds to the liquid inlet 108. After the coolant enters the liquid-cooled heat sink 100 through the liquid inlet 108, it first contacts the cone apex of the conical diverter column 212. The cone apex of the conical diverter column 212 diverts the coolant in multiple directions, achieving a smooth transition from vertical to horizontal flow to avoid eddy currents. The cone apex of the conical diverter column 212 changes the flow direction through its sharp end structure. That is, after the coolant impacts the cone apex of the conical diverter column 212, it diffuses outwards along the generatrix of the conical diverter column 212. Moreover, while diverting the coolant, the conical diverter column 212 also needs to divert and stabilize the flow through the generatrix of the conical diverter column 212. The apex of the conical diverter column 212 faces the inlet 108. As the part that first contacts the coolant, the apex of the conical diverter column 212 bears the greatest pressure from the coolant. The included angle of the apex of the conical diverter column 212 is related to the inlet pressure. For example, the included angle of the apex of the conical diverter column 212 is positively correlated with the inlet pressure; that is, the higher the inlet pressure, the larger the included angle of the apex of the conical diverter column 212. For instance, when the inlet pressure is between 0.2 MPa and 0.5 MPa, the included angle of the apex of the conical diverter column 212 is 45°. Thus, by adjusting the included angle of the apex of the conical diverter column 212 to adapt to different inlet pressures, the flow velocity of the coolant after passing through the conical diverter column 212 is kept stable within a specified range, thereby achieving stable flow velocity after the coolant is redirected.
[0030] In another embodiment, the ratio of the height of the conical diverter column 212 to the diameter of the liquid inlet 108 is 1.2 to 1.5. In this embodiment, the conical diverter column 212 is a primary diverting component for the coolant. The apex of the conical diverter column 212 corresponds to the liquid inlet 108. After the coolant enters the liquid-cooled heat sink 100 through the liquid inlet 108, it first contacts the apex of the conical diverter column 212. The apex of the conical diverter column 212 diverts the coolant in multiple directions, achieving a smooth transition of the coolant from vertical to horizontal flow, thus avoiding eddy currents. The height of the conical diverter column 212 affects the generatrix length of the conical diverter column 212. By adjusting the height of the conical diverter column 212, the flow path of the coolant on the conical diverter column 212 can be changed, which facilitates the adjustment of the degree of sudden change in the flow rate of the coolant when turning. Setting the height of the conical diverter column 212 to 1.2 to 1.5 times the diameter of the inlet 108 reduces the degree of sudden change in the flow rate of the coolant when turning, thereby making the flow rate of the coolant more stable after turning.
[0031] In one embodiment, please refer to Figure 2 The bifractal flow equalization element 220 includes at least two first flow dividers 222, which are symmetrically arranged. One end of each first flow divider 222 is located near the bottom of the conical flow divider column 212. In this embodiment, the first flow dividers 222 are arranged adjacent to the conical flow divider column 212. Specifically, one end of the first flow divider 222 faces the bottom of the conical flow divider column 212, and the other end faces the side wall of the liquid-cooled heat sink 100. Moreover, the symmetrical first flow dividers 222 are distributed towards different side walls of the liquid-cooled heat sink 100, so that the first flow dividers 222 divide the coolant flowing down from the conical flow divider column 212. The formed flow channels can flow along the two side walls of the first flow dividers 222, which facilitates the division of the flow channels generated at the bottom of the conical flow divider column 212, thereby making the flow rate of each flow equal and improving the uniformity of the flow velocity after division.
[0032] Further, please refer to Figure 2 The bifractal flow equalization element 220 further includes at least two second flow dividers 224, which are symmetrically arranged. One end of each second flow divider 224 is positioned close to the bottom of the conical flow divider column 212, and the symmetrical centerline of the second flow divider 224 coincides with the symmetrical centerline of the first flow divider 222. In this embodiment, the second flow dividers 224 are positioned adjacent to the conical flow divider column 212. Specifically, one end of the second flow divider 224 faces the bottom of the conical flow divider column 212, and the other end faces the sidewall of the liquid-cooled heat sink 100. Moreover, the symmetrical second flow dividers 224 are distributed towards different sidewalls of the liquid-cooled heat sink 100, so that the second flow dividers 224 divide the coolant flowing down from the conical flow divider column 212. The formed flow channels can flow along the two sidewalls of the second flow dividers 224, which facilitates the division of the flow channels generated at the bottom of the conical flow divider column 212. The symmetrical distribution of the second diverter bar 224 is the same as that of the first diverter bar 222, that is, they share the same symmetrical center line. This allows the second diverter bar 224 to perform secondary diversion of the coolant diverted by the first diverter bar 222, thereby making the flow rate of each diverted stream more equal and further improving the uniformity of the flow velocity after diversion.
[0033] Furthermore, the length of the second diverter bar 224 is shorter than the length of the first diverter bar 222. In this embodiment, the second diverter bar 224 and the first diverter bar 222 together perform multi-stage diversion of the coolant after it turns on the conical diverter column 212, achieving multi-stage uniform flow distribution. The first diverter bar 222 serves as the first-stage diversion, and the coolant flow after the turn is relatively large. By extending the length of the first diverter bar 222, the flow path of the coolant after the turn is extended, which facilitates the flow distribution of the large flow of coolant, thus buffering the diversion of coolant and stabilizing the flow velocity of coolant after passing through the first diverter bar 222. Setting the length of the second diverter bar 224 to be shorter allows for rapid secondary diversion of the stable flow velocity coolant after the previous stage of diversion, which not only further evenly distributes the flow but also rapidly distributes the coolant to improve heat dissipation efficiency.
[0034] In another embodiment, both the first diverter bar 222 and the second diverter bar 224 have curved structures, and both are curved toward the connection between the inlet chamber 102 and the return chamber 104. In this embodiment, the first diverter bar 222 and the second diverter bar 224 serve as primary and secondary diversions for the coolant after it has turned on the conical diverter column 212, making the flow rate of the coolant uniform after turning. The curved shape of the first diverter bar 222 and the second diverter bar 224 makes the flow of the coolant on the first diverter bar 222 and the second diverter bar 224 smoother, making it easier to maintain a balanced flow rate of the coolant at each position, and further improving the uniformity of the flow rate of the coolant in each path.
[0035] During the process of regulating the flow rate of the coolant, after the dual fractal flow equalizer 220 performs multi-stage flow division of the coolant, such as the secondary flow division of the first flow divider 222 and the second flow divider 224, although the flow rate of the coolant is equal in each path, the flow direction of the coolant on the plane is chaotic, that is, there are multiple flow directions at different angles, which makes it difficult to collect the coolant in a concentrated manner, resulting in a decrease in the utilization rate of the coolant.
[0036] To improve the efficiency of coolant recirculation, please refer to [link / reference needed]. Figure 2 The liquid cooling heat dissipation assembly 200 further includes a plurality of tree chain diversion fins 230, which are spaced apart and arranged in parallel to form a plurality of diversion channels 202, wherein the diversion channels 202 are connected to the return cavity 104; the end of each tree chain diversion fin 230 near the double fractal flow equalizer 220 has an arc to form a chain diversion guide groove 204, and the groove opening of the chain diversion guide groove 204 faces the double fractal flow equalizer 220.
[0037] In this embodiment, the tree chain diversion fin 230 is located at the end of the double fractal flow equalizer 220 away from the turning diversion fin 210, that is, the tree chain diversion fin 230 is located at the diversion end of the double fractal flow equalizer 220, and the tree chain diversion fin 230 guides the coolant that is diverted and stabilized by the double fractal flow equalizer 220. The diversion channel 202 serves as a channel for guiding the coolant, and the diversion channel 202 orients the flow of the coolant. Specifically, multiple diversion channels 202 are kept parallel to each other, so that the coolant flows in a specified direction, thereby fixing the flow direction of the coolant, balancing the flow velocity through the gap throttling effect, and ultimately reducing the flow deviation into the return cavity 104. Furthermore, the chain-type diversion guide groove 204 is located close to the double fractal flow equalizer 220, that is, the chain-type diversion guide groove 204 is located at the starting end of the tree chain diversion fin 230, and the groove opening of the chain-type diversion guide groove 204 is aligned with the end of the double fractal flow equalizer 220. Under the arc-shaped groove structure of the chain-type diversion guide groove 204, the coolant flowing in multiple directions is guided by the chain-type diversion guide groove 204, which facilitates the concentration of the randomly flowing coolant to multiple diversion channels 202. Under the directional guidance of multiple diversion channels 202, the flow direction of the coolant moves towards the predetermined direction, so that the flow direction of the coolant is concentrated in the same direction, thereby facilitating the convergence of coolant and the centralized recovery of coolant, effectively improving the return utilization rate of coolant.
[0038] Further, please refer to Figure 2 The liquid-cooled heat dissipation box 100 includes a box body 110, a layered plate 120, a partition plate 130, and a plurality of heat dissipation fins 140. The layered plate 120, the partition plate 130, and the plurality of heat dissipation fins 140 are all disposed within the box body 110. The layered plate 120 is connected to the side wall of the box body 110, and a return cavity 104 is formed between the layered plate 120 and the bottom of the box body 110. The plurality of heat dissipation fins 140 are spaced apart and arranged parallel to each other within the return cavity 104. The partition plate 130 is connected to the top of the box body 110 and the layered plate 120, respectively. The two side walls of the partition plate 130 and the two side walls of the box body 110 respectively form the liquid inlet cavity 102 and the liquid outlet cavity 106.
[0039] In this embodiment, the housing 110 provides space for coolant flow and also absorbs heat from high-power electronic devices. The layered plate 120 divides the internal space of the housing 110 into upper and lower layers. Specifically, the two sides of the layered plate 120 are connected to two opposing inner walls of the housing 110, and the two ends of the layered plate 120 are spaced apart from the inner walls of the housing 110 to facilitate communication between the upper and lower layers. The partition plate 130 and the heat dissipation fins 140 are located on opposite sides of the layered plate 120; for example, the partition plate 130 is located in the upper layer of the layered plate 120, and the heat dissipation fins 140 are located in the lower layer of the layered plate 120. The partition plate 130 provides a secondary division of the upper space, facilitating the formation of the inlet chamber 102 and the outlet chamber 106 on both sides of the partition plate 130. This allows both the inlet chamber 102 and the outlet chamber 106 to communicate with the lower return chamber 104, thereby facilitating the formation of coolant circulation channels. Multiple heat dissipation fins 140 are evenly distributed within the return chamber 104. These fins serve as the primary heat exchangers, and the channels between them allow coolant flow. Under the flow stabilization effect of the diverting and splitting component 210 and the double-fractal flow equalization component 220, the coolant flow through the heat dissipation fins 140 is more uniform, facilitating rapid heat conduction from high-power electronic devices and improving heat dissipation efficiency.
[0040] Furthermore, the sidewall of the heat dissipation fins is provided with at least one groove, and the groove openings of two adjacent heat dissipation fins are arranged opposite each other. In this embodiment, the groove is a micro-grooved structure of the heat dissipation fins, which causes the coolant to flow turbulently, increases the heat dissipation contact area of the coolant, and improves the heat exchange efficiency. Moreover, the coolant after heat exchange collects along the heat dissipation fins to the outlet chamber and is discharged through the outlet to complete the heat dissipation cycle. The groove is formed by etching.
[0041] In another embodiment, the first diversion bar, the second diversion bar, the heat dissipation fins, and the tree chain diversion fins are all installed using a plug-in connection, i.e., a sheet steel plate plug-in method, which facilitates replacement and adjustment of the channel size for coolant flow.
[0042] In another embodiment, the housing includes a cold plate cover and a base connected to each other, specifically, the cold plate cover and the base are connected by brazing.
[0043] In another embodiment, coolant enters the inlet chamber through the inlet port. The vertically entering coolant is redirected to a horizontal direction by the action of the conical diverter column. The conical diverter column can be replaced with one of different cone angles depending on the flow rate at the inlet port; this is the first diversion, which reduces the kinetic energy loss caused by the coolant directly impacting the incoming liquid. The horizontally flowing coolant is divided into five channels by the first and second diverter bars; this is the second diversion. The diverted coolant then passes through a chain-type diversion guide groove and tree-chain diversion fins, further dividing into several channels; this is the third diversion. After three diversions, each channel of the coolant maintains a consistent velocity, enters the return chamber, uniformly carries away heat, and exits from the outlet chamber through the outlet port. The conical diverter column is CNC machined and threaded to the layered plate; the first and second diverter bars are integrally formed using CNC machining; and the chain-type diversion guide groove is CNC machined.
[0044] In one embodiment, this disclosure also provides a liquid cooling heat dissipation device, including the liquid cooling heat dissipation device for high-power electronic devices described in any of the above embodiments. In this embodiment, the liquid cooling heat dissipation device for high-power electronic devices includes a liquid cooling heat dissipation box and a liquid cooling heat dissipation assembly; the liquid cooling heat dissipation box is used to connect to the heat-generating area of the high-power electronic device, the liquid cooling heat dissipation box has an inlet chamber, a reflux chamber and an outlet chamber connected in sequence, the liquid cooling heat dissipation box has an inlet port and an outlet port, the inlet port is connected to the inlet chamber and is used to inject coolant, the outlet port is connected to the outlet chamber and is used to discharge coolant; the liquid cooling heat dissipation assembly includes a diverting and diverting component and a bifractal flow equalization component, the diverting and diverting component and the bifractal flow equalization component are both located in the inlet chamber, the diverting and diverting component is disposed opposite to the inlet port, the diverting and diverting component is used to divert the flow path of the injected coolant, the bifractal flow equalization component is disposed adjacent to the diverting and diverting component, the bifractal flow equalization component is used to balance the flow rate of the coolant after diversion. After entering the liquid-cooled heat sink, the coolant is redirected by a diverting component, smoothing the flow path at the inlet and preventing eddies. This reduces initial flow velocity fluctuations and provides a stable flow rate. The coolant then undergoes a two-stage precise distribution process using a bifractal flow equalizer, further stabilizing the redirected flow velocity and preventing uneven flow. This ensures uniform coolant flow throughout the heat sink, effectively improving the heat dissipation uniformity for high-power electronic devices.
[0045] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.
Claims
1. A liquid cooling heat dissipation device for high-power electronic devices, characterized in that, include: A liquid-cooled heat sink is used to connect to the heat-generating area of a high-power electronic device. The liquid-cooled heat sink has an inlet chamber, a reflux chamber, and an outlet chamber connected in sequence. The liquid-cooled heat sink has an inlet port and an outlet port. The inlet port is connected to the inlet chamber and is used to inject coolant. The outlet port is connected to the outlet chamber and is used to discharge coolant. A liquid cooling heat dissipation assembly includes a diverting and diverting component and a double fractal flow equalizing component. Both the diverting and diverting component and the double fractal flow equalizing component are located within the liquid inlet chamber. The diverting and diverting component is disposed opposite to the liquid inlet. The diverting and diverting component is used to divert the flow path of the injected coolant. The double fractal flow equalizing component is disposed adjacent to the diverting and diverting component. The double fractal flow equalizing component is used to balance the flow velocity of the coolant after the diversion.
2. The liquid cooling heat dissipation device for high-power electronic devices according to claim 1, characterized in that, The diverting component includes a conical diverting column and a fixed connecting column. The fixed connecting column is connected to the bottom of the conical diverting column and the bottom of the liquid inlet chamber, respectively. The top of the conical diverting column faces the liquid inlet.
3. The liquid cooling heat dissipation device for high-power electronic devices according to claim 2, characterized in that, The diameter of the cone base of the conical diverter column is larger than the diameter of the liquid inlet.
4. The liquid cooling heat dissipation device for high-power electronic devices according to claim 2, characterized in that, The cone apex angle of the conical diverter column is 30° to 60°.
5. The liquid cooling heat dissipation device for high-power electronic devices according to claim 2, characterized in that, The ratio of the height of the conical diverter column to the diameter of the inlet is 1.2 to 1.
5.
6. The liquid cooling heat dissipation device for high-power electronic devices according to claim 2, characterized in that, The bifurcation flow equalization component includes at least two first flow dividers, which are symmetrically arranged, with one end of each first flow divider located close to the bottom of the conical flow divider column.
7. The liquid cooling heat dissipation device for high-power electronic devices according to claim 6, characterized in that, The bifurcation flow equalization component further includes at least two second flow dividers, which are symmetrically arranged. One end of each second flow divider is located close to the bottom of the conical flow divider column, and the symmetrical centerline of the second flow divider coincides with the symmetrical centerline of the first flow divider.
8. The liquid cooling heat dissipation device for high-power electronic devices according to claim 7, characterized in that, The length of the second diverter bar is less than the length of the first diverter bar.
9. The liquid cooling heat dissipation device for high-power electronic devices according to claim 7, characterized in that, Both the first and second diverter bars have a curved structure, and both the first and second diverter bars are curved toward the connection between the liquid inlet chamber and the return chamber.
10. A liquid-cooled heat dissipation device, characterized in that, Including liquid cooling heat dissipation devices for high-power electronic devices as described in any one of claims 1 to 9.