Filtering assembly, inverter and vehicle

Abstract

The invention relates to a filtering assembly, an inverter and a vehicle, the filtering assembly comprises a connecting copper bar, a magnetic ring, a capacitor and a heat dissipation copper bar, the connecting copper bar is used for electric conduction, the magnetic ring sleeves a part of the connecting copper bar, the capacitor is electrically connected with the connecting copper bar, the capacitor is arranged at one side of the magnetic ring, and the heat dissipation copper bar is arranged at the other side of the magnetic ring. And a part of the heat dissipation copper bar is arranged between the capacitor and the magnetic ring, so that heat of the capacitor and the magnetic ring is transferred to the heat dissipation copper bar. A part of the heat dissipation copper bar of the filtering assembly is arranged between the capacitor and the magnetic ring, so that heat of the capacitor and the magnetic ring can be transmitted to the heat dissipation copper bar, and then through heat transmission of the heat dissipation copper bar, the temperature of the surrounding environment of the capacitor and the surrounding environment of the magnetic ring can be reduced, and the heat dissipation effect is achieved; the capacitor and the magnetic ring can be cooled in a targeted manner, and the reliability of the capacitor and the filter is improved.

Description

Technical Field

[0001] This disclosure relates to the field of vehicle manufacturing technology, and more particularly to a filter assembly, an inverter, and a vehicle. Background Technology

[0002] The filters in the related technologies do not have a heat dissipation design for the capacitors, resulting in the capacitors not being able to dissipate heat effectively and the heat dissipation effect being poor. Summary of the Invention

[0003] The purpose of this disclosure is to provide a filtering component, an inverter, and a vehicle to solve the problems in the aforementioned related technologies.

[0004] To achieve the above objectives, one aspect of this disclosure provides a filtering component, comprising: A connecting copper busbar, which is used for electrical conduction; A magnetic ring, wherein the magnetic ring is sleeved on a portion of the connecting copper busbar; A capacitor, which is electrically connected to the connecting copper busbar, is disposed on one side of the magnetic ring; A heat dissipation copper busbar, a portion of which is disposed between the capacitor and the magnetic ring, so that the heat from the capacitor and the magnetic ring can be transferred to the heat dissipation copper busbar.

[0005] In the above technical solution, heat dissipation is achieved through the placement of a heat dissipation copper busbar, which effectively increases the heat dissipation area and thus improves the heat dissipation effect. A portion of the heat dissipation copper busbar is positioned between the capacitor and the magnetic ring, allowing heat from the capacitor and magnetic ring to be transferred to the busbar. The heat is then dissipated through the busbar, reducing the temperature of the environment around the capacitor and magnetic ring, thus achieving heat dissipation. This targeted heat dissipation for the capacitor and magnetic ring improves the reliability of the capacitor and filter. Under high current and high heat sources, this filter component can both handle the "noise" effect caused by ripple current and effectively dissipate heat, ensuring the stability and lifespan of the filter component.

[0006] In some possible implementations, another portion of the heat dissipation copper busbar is disposed on one side of the capacitor, and in a direction perpendicular to the heat dissipation copper busbar, the projection of the capacitor falls on the other portion of the heat dissipation copper busbar, and at least a portion of the heat of the capacitor can be transferred to the heat dissipation copper busbar, so that the heat of the capacitor can be transferred to the heat dissipation copper busbar along two heat conduction paths.

[0007] This configuration enables two heat transfer paths, thereby improving heat dissipation.

[0008] In some possible implementations, the heat dissipation copper busbar includes a plate and a heat-absorbing part, the heat-absorbing part being connected to the plate, at least a portion of the heat-absorbing part being disposed between the capacitor and the magnetic ring, and the plate being disposed on one side of the capacitor; In this process, a portion of the heat from the capacitor is transferred to the plate through the heat-absorbing part, while another portion of the heat from the capacitor is directly transferred to the plate.

[0009] This setup facilitates the arrangement of the heat dissipation copper busbars.

[0010] In some possible implementations, the heat-absorbing portion is connected to the edge of the plate, the heat-absorbing portion is close to the capacitor, and is spaced apart from the capacitor.

[0011] This arrangement allows the heat-absorbing part to extend between the capacitor and the magnetic ring. With the heat-absorbing part positioned at the edge, the plate does not affect the arrangement of the capacitor or the magnetic ring. Furthermore, the spacing between the heat-absorbing part and the capacitor and magnetic ring does not affect their functionality.

[0012] In some possible implementations, in a direction perpendicular to the plate, the projection of the capacitor is set as a first projection, and the projection of the plate is set as a second projection, wherein the ratio of the area of ​​the second projection to the area of ​​the first projection is greater than or equal to 2.

[0013] This configuration increases the heat conduction area and improves heat dissipation.

[0014] In some possible implementations, the heat-absorbing part includes a first heat-absorbing element and a second heat-absorbing element, and the capacitor includes a first capacitor and a second capacitor, wherein the first heat-absorbing element corresponds to the first capacitor and the second heat-absorbing element corresponds to the second capacitor.

[0015] This configuration allows for heat dissipation of both the first and second capacitors, ensuring effective heat dissipation for different capacitors.

[0016] In some possible implementations, the first heat-absorbing element is configured as a plate, and the first heat-absorbing element is angled to the plate. One side of the first capacitor faces the first heat-absorbing element, and the other side of the first capacitor faces the plate, so that the heat of the first capacitor can be transferred to the first heat-absorbing element and the plate respectively.

[0017] This design minimizes space requirements, allows for easy insertion between the magnetic ring and the first capacitor, avoids interference with the magnetic ring and the first capacitor, and facilitates space arrangement.

[0018] In some possible implementations, the second heat absorber includes a pin, one end of which is connected to the plate body, one side of the second capacitor faces the plate body, and the other side of the second capacitor faces the pin, so that a portion of the heat from the second capacitor is transferred to the pin and the plate body; The other end of the pin is provided with a connector, and the second capacitor is provided with a fourth lead. The fourth lead is connected to the connector so that another part of the heat of the second capacitor is transferred to the connector through the fourth lead. In this process, a portion of the heat from the second capacitor is directly transferred to the pin and the board, while another portion of the heat from the second capacitor is transferred to the pin through the fourth lead, and then to the board through the pin.

[0019] This configuration facilitates electrical conduction with the second capacitor and heat transfer.

[0020] In some possible implementations, the second heat absorber includes a pin, an extension plate is formed on one side of the plate, one end of the pin is connected to the extension plate to shorten the length of the pin, one side of the second capacitor faces the plate, and the other side of the second capacitor faces the pin, so that a portion of the heat of the second capacitor is transferred to the pin and the plate. The other end of the pin is provided with a connector, and the second capacitor is provided with a fourth lead. The fourth lead is connected to the connector so that another part of the heat of the second capacitor is transferred to the connector through the fourth lead. In this process, a portion of the heat from the second capacitor is directly transferred to the pin and the board, while another portion of the heat from the second capacitor is transferred to the pin through the fourth lead, and then to the board through the pin.

[0021] This configuration reduces pin size, lowers line resistance, and improves capacitor filtering capability.

[0022] In some possible implementations, the filter assembly further includes a base, the heat dissipation copper busbar is provided with a mounting part, the mounting part is connected to the base, the heat dissipation copper busbar is transferred to the base, and the heat dissipation copper busbar is used to ground through the base; The heat from the capacitor and the magnetic ring is transferred to the heat dissipation copper busbar, which then directs the heat to the mounting portion and the base.

[0023] This setup enables grounding, allowing heat to be transferred to the base, which facilitates heat dissipation and achieves a heat dissipation effect.

[0024] In some possible implementations, the connecting copper busbar is provided with a connecting portion, the capacitor is provided with a lead, and the lead is connected to the connecting portion; The capacitor includes a first capacitor and a second capacitor, the connecting copper busbar includes a positive copper busbar and a negative copper busbar, and the lead wire includes a first lead wire, a second lead wire, a third lead wire, and a fourth lead wire. One end of the first lead and one end of the second lead are connected to the first capacitor, the other end of the first lead is connected to the connection part of the positive copper busbar, and the other end of the second lead is connected to the connection part of the negative copper busbar. The heat of the positive copper busbar can be transferred to the first capacitor through the first lead and then to the heat dissipation copper busbar through the first capacitor. The heat of the negative copper busbar can be transferred to the first capacitor through the second lead and then to the heat dissipation copper busbar through the first capacitor. The number of the second capacitors is at least two, and each second capacitor is provided with the third lead and the fourth lead. The third lead of at least one second capacitor is connected to the positive copper busbar, and the third lead of at least one second capacitor is connected to the negative copper busbar. The fourth lead of each second capacitor is connected to the heat dissipation copper busbar. The heat from the positive copper busbar and the negative copper busbar can be transferred to the second capacitor through the third lead, and then transferred to the heat dissipation copper busbar through the second capacitor.

[0025] This setup enables mutual electrical conduction and heat dissipation for the connecting copper busbars, creating two heat transfer paths and improving heat dissipation.

[0026] In some possible implementations, the connecting copper busbar includes a busbar and a transition busbar, the transition busbar being integrally formed or welded to the busbar.

[0027] This setup allows for electrical conduction with different components.

[0028] A second aspect of this disclosure also provides an inverter including the aforementioned filtering components.

[0029] In the above technical solution, the heat dissipation copper busbar greatly improves the heat dissipation of the capacitor, which can achieve targeted heat dissipation of the capacitor, thereby improving the reliability and service life of the entire inverter. This inverter is suitable for high power density and can handle the "noise" effect caused by ripple current under high current and high heat source, while effectively dissipating heat to maintain the stability of the inverter and extend its service life.

[0030] A third aspect of this disclosure also provides a vehicle including the aforementioned filter assembly or the aforementioned inverter.

[0031] The above technical solutions can improve vehicle reliability and reduce the probability of malfunctions.

[0032] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0033] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the structure of a filter component according to one embodiment of the present disclosure.

[0034] Figure 2 This is a schematic diagram of the connection relationship between the capacitor and the heat sink copper busbar according to one embodiment of the present disclosure.

[0035] Figure 3 This is a schematic diagram of the structure of a heat dissipation copper busbar according to one embodiment of the present disclosure.

[0036] Figure 4 This is a schematic diagram of a heat transfer path of a heat dissipation copper busbar according to one embodiment of the present disclosure.

[0037] Figure 5 This is a schematic diagram of another heat transfer path of the heat dissipation copper busbar according to one embodiment of the present disclosure.

[0038] Figure 6 This is a schematic diagram of the connection relationship between the connecting copper busbar and the magnetic ring according to one embodiment of the present disclosure.

[0039] Figure 7 This is a schematic diagram of the structure of a heat dissipation copper busbar according to another embodiment of the present disclosure.

[0040] Figure 8 This is a schematic diagram of the structure of a filter component according to another embodiment of this disclosure.

[0041] Explanation of reference numerals in the attached figures 1. Connecting copper busbar; 11. Connecting part; 12. Positive copper busbar; 13. Negative copper busbar; 14. Busbar; 15. Adapter busbar; 2. Magnetic ring; 3. Capacitor; 31. First capacitor; 32. Second capacitor; 4. Copper heat dissipation busbar; 41. Plate body; 42. Heat absorption part; 421. First heat absorption element; 422. Second heat absorption element; 423. Connector; 44. Mounting part; 45. Extension support plate. 5. Base; 6. Lead wire, 61. First lead wire, 62. Second lead wire, 63. Third lead wire, 64. Fourth lead wire. Detailed Implementation

[0042] The specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit this disclosure.

[0043] In this disclosure, unless otherwise stated, directional terms such as "upper" and "lower" are generally defined by the orientation of the accompanying drawings, and "inner" and "outer" refer to the inner and outer parts of the relevant components. Furthermore, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0044] In the description of this disclosure, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can be a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0045] When a large current flows through the copper busbar, the environment is already high temperature. In addition, the ripple current of the large current will cause the capacitor to generate additional heat. The combination of these two factors will make the capacitor temperature even higher. If the capacitor works in a high temperature or overheated environment for a long time, its reliability will be greatly reduced, which will lead to a significant reduction in the noise reduction function of the filter. Therefore, it is necessary to dissipate heat from the capacitor.

[0046] The filters in related technologies lack heat dissipation design for the capacitors, resulting in ineffective heat dissipation and poor overall cooling performance. Specifically, the filters in these technologies primarily rely on grounding copper busbars for heat dissipation, which have a very small surface area, leading to insignificant heat dissipation and an inability to guide heat transfer, causing the capacitors to easily accumulate heat.

[0047] Therefore, such as Figures 1-5 As shown, one aspect of this disclosure provides a filtering component, including a connecting copper busbar 1, a magnetic ring 2, a capacitor 3, and a heat dissipation copper busbar 4.

[0048] The connecting copper busbar 1 is used for electrical conduction. The magnetic ring 2 is sleeved on part of the connecting copper busbar 1. The capacitor 3 is electrically connected to the connecting copper busbar 1 and is located on one side of the magnetic ring 2. A part of the heat dissipation copper busbar 4 is located between the capacitor 3 and the magnetic ring 2 so that the heat from the capacitor 3 and the magnetic ring 2 can be transferred to the heat dissipation copper busbar 4.

[0049] The magnetic ring 2 and capacitor 3 work together to achieve filtering, while the connecting copper busbar 1 enables electrical conduction. The magnetic ring 2 can be a nanocrystalline magnetic ring.

[0050] In the above technical solution, the heat dissipation copper busbar 4 has low thermal resistance, allowing heat to be transferred towards it, thus effectively increasing the heat dissipation area and improving the heat dissipation effect. A portion of the heat dissipation copper busbar 4 is positioned between the capacitor 3 and the magnetic ring 2, enabling heat from these components to be transferred to the busbar 4. The heat is then dissipated through the busbar 4, reducing the temperature around the capacitor 3 and the magnetic ring 2, achieving a targeted heat dissipation effect. This improves the reliability of the capacitor 3 and the filter. Furthermore, the heat dissipation copper busbar 4 also provides insulation between the capacitor 3 and the magnetic ring 2, preventing their heat from affecting each other. Under high current and high heat sources, this filter component can effectively handle the "noise" caused by ripple current while also effectively dissipating heat, ensuring the stability and lifespan of the filter component.

[0051] Optionally, in one embodiment of this disclosure, another part of the heat dissipation copper busbar 4 is disposed on one side of the capacitor 3, and in a direction perpendicular to the heat dissipation copper busbar 4, the projection of the capacitor 3 falls on the other part of the heat dissipation copper busbar 4, so that at least part of the heat of the capacitor 3 can be transferred to the heat dissipation copper busbar 4, so that the heat of the capacitor 3 can be transferred to the heat dissipation copper busbar 4 along two heat conduction paths.

[0052] It is understandable that capacitor 3 and another part of the heat sink 4 are also positioned opposite each other. This relative positioning allows the heat from capacitor 3 to be directly transferred to the heat sink 4, increasing the area over which heat is transferred from capacitor 3 to the heat sink 4, thus improving the heat dissipation effect of capacitor 3. Therefore, some of the heat from capacitor 3 can be transferred to the heat sink 4 via one part of the heat sink 4, and some heat can be transferred to the heat sink 4 via the other part, achieving two heat transfer paths and thus improving the heat dissipation effect.

[0053] It should be noted that the projection perpendicular to the heat sink 4 means that the projection of capacitor 3 falls on the heat sink 4 along the direction perpendicular to its surface. In other words, the projection of capacitor 3 at least partially overlaps with the heat sink 4, thus ensuring that heat is transferred from capacitor 3 to the heat sink 4. The projection of capacitor 3 falling on the heat sink 4 can be either completely or partially overlapping. In some examples, capacitor 3 is located above or below another part of the heat sink 4, and vertically, capacitor 3 is directly opposite this other part of the heat sink 4.

[0054] Optionally, in one embodiment of this disclosure, the heat dissipation copper busbar 4 includes a plate 41 and a heat-absorbing part 42, the heat-absorbing part 42 being connected to the plate 41, at least a portion of the heat-absorbing part 42 being disposed between the capacitor 3 and the magnetic ring 2, and the plate 41 being disposed on one side of the capacitor 3. A portion of the heat from the capacitor 3 is transferred to the plate 41 through the heat-absorbing part 42, while another portion of the heat from the capacitor 3 is directly transferred to the plate 41.

[0055] The plate 41 serves as the main structure and is used for heat conduction. The area of ​​the plate 41 can be set relatively large to facilitate heat transfer. The heat transfer rate is directly proportional to the heat dissipation area; as the area of ​​the plate 41 increases, the heat transfer rate also increases, thus accelerating heat transfer and improving the heat dissipation effect. The plate 41 is positioned on one side of the capacitor 3, allowing the heat from the capacitor 3 to be directly transferred to the plate 41, and then dissipated outwards through the plate 41, achieving heat dissipation.

[0056] The heat-absorbing part 42, located between the capacitor 3 and the magnetic ring 2, absorbs heat, allowing heat from the capacitor 3 and magnetic ring 2 to be transferred to the heat-absorbing part 42, and then to the plate 41, where it is dissipated outwards. In some examples, the heat-absorbing part 42 and the plate 41 are integrally formed. It should be noted that "another part of the heat from the capacitor 3 being directly transferred to the plate 41" means that another part of the heat from the capacitor 3 can be transferred to the plate 41 without passing through the heat-absorbing part 42.

[0057] Optionally, in one embodiment of this disclosure, the heat-absorbing part 42 is connected to the edge of the plate 41, close to and spaced apart from the capacitor 3, and also spaced apart from the magnetic ring 2. This arrangement allows the heat-absorbing part 42 to extend between the capacitor 3 and the magnetic ring 2. The position of the heat-absorbing part 42 at the edge ensures that the plate 41 does not affect the arrangement of the capacitor 3 or the magnetic ring 2. Furthermore, the spaced arrangement of the heat-absorbing part 42 with the capacitor 3 and magnetic ring 2 does not affect their functionality. It also allows the heat-absorbing part 42 to be encased in a plastic shell for insulation, and provides space for the capacitor 3 and magnetic ring 2 to be arranged within the plastic shell. One end of the heat-absorbing part 42 is connected to the side of the edge of the plate 41, thus placing the capacitor 3 close to the edge of the plate 41. The capacitor 3 can then transfer heat to the heat-absorbing part 42 and the plate 41.

[0058] Optionally, in one embodiment of this disclosure, the projection of the capacitor 3 is set as a first projection in the direction perpendicular to the plate 41, and the projection of the plate 41 is set as a second projection, wherein the ratio of the area of ​​the second projection to the area of ​​the first projection is greater than or equal to 2. This arrangement increases the heat-conducting area of ​​the plate 41, thereby improving the heat conduction of the plate 41 and thus enhancing the heat dissipation effect. The specific dimensions of the plate 41 can be designed to be as large as possible based on the available space.

[0059] Optionally, in one embodiment of this disclosure, the heat-absorbing part 42 includes a first heat-absorbing element 421 and a second heat-absorbing element 422, and the capacitor 3 includes a first capacitor 31 and a second capacitor 32. The first heat-absorbing element 421 corresponds to the first capacitor 31, and the second heat-absorbing element 422 corresponds to the second capacitor 32.

[0060] The first heat-absorbing element 421 corresponds to the first capacitor 31, allowing heat from the first capacitor 31 to be transferred to the first heat-absorbing element 421, and then to the plate 41. The first heat-absorbing element 421 is positioned between the first capacitor 31 and the magnetic ring 2, with the two elements spaced apart. The second heat-absorbing element 422 corresponds to the second capacitor 32, allowing heat from the second capacitor 32 to be transferred to the second heat-absorbing element 422, and then to the plate 41. This arrangement provides two heat transfer paths, enabling heat dissipation for both the first capacitor 31 and the second capacitor 32, ensuring effective heat dissipation for different capacitors 3. Both the first capacitor 31 and the second capacitor 32 are safety capacitors 3; the first capacitor 31 can be an X-type capacitor 3, and the second capacitor 32 can be a Y-type capacitor 3. It should be noted that the capacitance values ​​of the first capacitor 31 and the second capacitor 32 can be set as needed, without further restrictions.

[0061] Optionally, in one embodiment of this disclosure, the first heat-absorbing element 421 is configured as a plate, and the first heat-absorbing element 421 is angled to the plate body 41. One side of the first capacitor 31 faces the first heat-absorbing element 421, and the other side of the first capacitor 31 faces the plate body 41, so that the heat of the first capacitor 31 can be transferred to the first heat-absorbing element 421 and the plate body 41 respectively.

[0062] The first heat-absorbing element 421 is designed as a plate, which occupies little space and allows it to easily extend between the magnetic ring 2 and the first capacitor 31, avoiding interference with either component. This also facilitates spatial arrangement and avoids excessive space occupation. Furthermore, the plate shape of the first heat-absorbing element 421 allows one side to face the first capacitor 31 and the other side to face the magnetic ring 2, creating a face-to-face arrangement. This increases the heat absorption area, facilitating the transfer of heat from the capacitor 3 and the magnetic ring 2 to the first heat-absorbing element 421 for better heat dissipation.

[0063] In this design, the first heat-absorbing element 421 is angled to the plate 41, allowing the first capacitor 31 to be positioned between the first heat-absorbing element 421 and the plate 41. This allows the first capacitor 31 to face both the first heat-absorbing element 421 and the plate 41, facilitating heat transfer to both the first heat-absorbing element 421 and the plate 41, increasing the heat transfer area and thus improving heat dissipation. In some examples, the angle between the first heat-absorbing element 421 and the plate 41 is 90°, and the first heat-absorbing element 421 is perpendicular to the plate 41. Of course, in other examples, the angle between the first heat-absorbing element 421 and the plate 41 can be other angles.

[0064] Optionally, in another embodiment of this disclosure, the first heat absorber 421 is configured as fins, and the first heat absorber 421 is angled to the plate 41. One side of the first capacitor 31 faces the first heat absorber 421, and the other side of the first capacitor 31 faces the plate 41. By configuring the first heat absorber 421 as fins, the heat transfer area can be increased, heat transfer can be improved, and thus the heat dissipation effect can be improved.

[0065] Optionally, in one embodiment of this disclosure, the second heat-absorbing element 422 includes a pin, one end of which is connected to the plate 41. One side of the second capacitor 32 faces the plate 41, and the other side of the second capacitor 32 faces the pin, so that a portion of the heat from the second capacitor 32 is transferred to the pin and the plate 41.

[0066] The other end of the pin is provided with a connector 423, and the second capacitor 32 is provided with a fourth lead 64. The fourth lead 64 is connected to the connector 423 so that another part of the heat of the second capacitor 32 is transferred to the connector 423 through the fourth lead 64. In this process, a portion of the heat from the second capacitor 32 is directly transferred to the pins and the board 41, while another portion of the heat from the second capacitor 32 is transferred to the pins via the fourth lead 64, and then to the board 41 via the pins.

[0067] The pins are extended structures and can be integrally formed with the board body 41. These pins facilitate the connection of the second capacitor 32 to the pin connector 423 via the fourth lead 64, enabling electrical conduction. Furthermore, heat from the second capacitor 32 can be transferred to the pins via the fourth lead 64, and then to the board body 41, thus achieving heat transfer. Heat from electronic components connected to the second capacitor 32 can be transferred to the second capacitor 32, and then to the board body 41, thereby dissipating heat. In some examples, the pins are connected to the side edge of the board body 41 to facilitate the placement of the second capacitor 32. The pins are angled relative to the board body 41, with the angle between the pins and the board body 41 being 90°, and the pins are perpendicular to the board body 41. Of course, in other examples, the angle between the pins and the board body 41 can be other angles.

[0068] In addition, one side of the second capacitor 32 faces the board 41, allowing the heat from the second capacitor 32 to be directly transferred to the board 41 for heat dissipation. Thus, the second capacitor 32 can achieve heat transfer through two paths: the heat from the second capacitor 32 can be transferred to the board 41 through the fourth lead 64 and the pins, or it can be transferred directly to the board 41.

[0069] In some examples, connector 423 may be a groove formed at the end of the pin away from the plate 41, so that the pin forms a "harpoon"-like structure, which can facilitate the fixing of the fourth lead 64, so that the fourth lead 64 can be soldered to the pin.

[0070] Alternatively, in another embodiment of this disclosure, the second heat absorber 422 includes pins, an extension support plate 45 is formed on one side of the plate 41, one end of the pin is connected to the extension support plate 45 to shorten the length of the pin, one side of the second capacitor 32 faces the plate 41, and the other side of the second capacitor 32 faces the pins, so that a portion of the heat of the second capacitor 32 is transferred to the pins and the plate 41.

[0071] The other end of the pin is provided with a connector 423, and the second capacitor 32 is provided with a fourth lead 64. The fourth lead 64 is connected to the connector 423 so that another part of the heat of the second capacitor 32 is transferred to the connector 423 through the fourth lead 64.

[0072] In this circuit, a portion of the heat from the second capacitor 32 is directly transferred to the pins and the board 41, while another portion of the heat is transferred to the pins via the fourth lead 64, and then to the board 41. The pins allow the second capacitor 32 to connect to the pin connector 423 via the fourth lead 64, thus enabling electrical conduction. Furthermore, the heat from the second capacitor 32 can be transferred to the pins via the fourth lead 64, and then to the board 41, achieving heat transfer. This allows heat from electronic components connected to the second capacitor 32 to be transferred to the second capacitor 32, and then to the board 41, thus dissipating heat.

[0073] The extension plate 45 is a structure extending from one side of the plate 41. The extension plate 45 is used to arrange the pins, allowing for a reduction in pin size while still ensuring that the second capacitor 32 is connected to the pin connector 423 via the fourth lead 64, achieving electrical conduction and heat transfer. The reduced pin size shortens the grounding path, reduces line resistance, and improves the filtering capability of capacitor 3. In some examples, the extension plate 45 can be a Z-shaped bent plate, allowing the pins to be shortened while still maintaining a connection with the plate 41, achieving electrical conduction and heat transfer. It should be noted that the size of the extension plate 45 can be adjusted as needed, allowing the pin positions to be changed to meet different product requirements.

[0074] The pins are extensions that can be integrally formed with the extension plate 45. In some examples, the extension plate 45 is connected to the side edge of the plate 41, and the pins are also connected to the side edge of the extension plate 45, facilitating the placement of the second capacitor 32. The pins are angled relative to the extension plate 45, with the angle between the pins and the extension plate 45 being 90°, and the pins are perpendicular to the extension plate 45. Of course, in other examples, the angle between the pins and the extension plate 45 can be other angles.

[0075] In addition, one side of the second capacitor 32 faces the board 41, allowing the heat from the second capacitor 32 to be directly transferred to the board 41 for heat dissipation. Thus, the second capacitor 32 can achieve heat transfer through two paths: the heat from the second capacitor 32 can be transferred to the board 41 through the fourth lead 64 and the pins, or it can be transferred directly to the board 41.

[0076] In some examples, connector 423 may be a groove formed at the end of the pin away from the plate 41, so that the pin forms a "harpoon"-like structure, which can facilitate the fixing of the fourth lead 64, so that the fourth lead 64 can be soldered to the pin.

[0077] Optionally, in one embodiment of this disclosure, the filter assembly further includes a base 5, and a heat dissipation copper busbar 4 is provided with a mounting part 44, which is connected to the base 5. The heat from the heat dissipation copper busbar 4 is transferred to the base 5, and the heat dissipation copper busbar 4 is grounded through the base 5. Grounding through the base 5 allows heat to be transferred to the base 5, which facilitates heat dissipation and achieves a heat dissipation effect. This allows the heat dissipation copper busbar 4 to integrate multiple functions such as heat dissipation, grounding, electrical conduction, and installation and fixation, thereby reducing the arrangement of related components and saving costs. Specifically, the heat from the capacitor 3 and the magnetic ring 2 is transferred to the heat dissipation copper busbar 4, which then guides the heat to the mounting part 44 and then to the base 5.

[0078] In some examples, the mounting part 44 can be a through hole formed on the plate 41 of the heat dissipation copper busbar 4. A threaded post is provided on the base 5, and a threaded hole is provided inside the threaded post. The threaded hole communicates with the through hole, allowing a screw to pass through the through hole and engage with the threaded hole, thus mounting the heat dissipation copper busbar 4 on the base 5 for grounding and heat transfer. In other examples, the mounting part 44 can be a welding head, which can be welded to the base 5 for fixation.

[0079] Optionally, in one embodiment of this disclosure, the connecting copper busbar 1 is provided with a connecting part 11, and the capacitor 3 is provided with a lead 6, which is connected to the connecting part 11. This enables electrical conduction between the connecting copper busbar 1 and the capacitor 3, and the heat from the connecting copper busbar 1 can also be transferred to the capacitor 3 through the lead 6, and then transferred to the heat dissipation copper busbar 4 through the capacitor 3, thereby achieving heat dissipation for the connecting copper busbar 1.

[0080] Optionally, capacitor 3 includes a first capacitor 31 and a second capacitor 32, connecting copper busbar 1 includes a positive copper busbar 12 and a negative copper busbar 13, and lead wire 6 includes a first lead wire 61, a second lead wire 62, a third lead wire 63 and a fourth lead wire 64.

[0081] One end of the first lead 61 and the second lead 62 are connected to the first capacitor 31, and the other end of the first lead 61 is connected to the connection part 11 of the positive copper busbar 12. The other end of the second lead 62 is connected to the connection part 11 of the negative copper busbar 13. Through the first lead 61 and the second lead 62, the positive copper busbar 12 and the negative copper busbar 13 are electrically connected to the first capacitor 31. At the same time, the heat from the positive copper busbar 12 and the negative copper busbar 13 can also be transferred to the first capacitor 31 through the first lead 61 and the second lead 62, and then transferred to the heat dissipation copper busbar 4 through the first capacitor 31.

[0082] The number of second capacitors 32 is at least two. Each second capacitor 32 is provided with a third lead 63 and a fourth lead 64. The third lead 63 of at least one second capacitor 32 is connected to the positive copper busbar 12, the third lead 63 of at least one second capacitor 32 is connected to the negative copper busbar 13, and the fourth lead 64 of each second capacitor 32 is connected to the heat dissipation copper busbar 4.

[0083] The system utilizes the third lead 63 and the fourth lead 64 to electrically connect the positive copper busbar 12 and the negative copper busbar 13 to the two second capacitors 32, respectively. Then, the two second capacitors 32 are electrically connected to the heat dissipation copper busbar 4 to achieve grounding. The heat from the positive copper busbar 12 and the negative copper busbar 13 can also be transferred to the second capacitors 32 through the third lead 63, and then to the heat dissipation copper busbar 4 through the second capacitors 32 and the fourth lead 64, thus achieving heat dissipation.

[0084] Therefore, the heat transfer path between the positive copper busbar 12 and the negative copper busbar 13 can be transferred to the first capacitor 31 via the first lead 61 and the second lead 62, and then to the heat dissipation copper busbar 4 via the first capacitor 31. Alternatively, it can be transferred to the second capacitor 32 via the third lead 63, and then to the heat dissipation copper busbar 4 via the second capacitor 32 and the fourth lead 64. Since the magnetic ring 2 is fitted onto the positive copper busbar 12 and the negative copper busbar 13, the heat from the magnetic ring 2 can also be transferred to the positive copper busbar 12 and the negative copper busbar 13, and then to the heat dissipation copper busbar 4 via the aforementioned heat transfer path. Furthermore, the heat from the magnetic ring 2 can also be directly transferred to the first heat-absorbing element 421, and then to the plate 41 via the first heat-absorbing element 421.

[0085] Optionally, in one embodiment of this disclosure, the connecting copper busbar 1 includes a busbar 14 and a transition busbar 15, wherein the transition busbar 15 is integrally formed or welded to the busbar 14. Electrical conduction with different components can be achieved through the busbar 14 and the transition busbar 15, and relevant components can be arranged as needed. That is, both the busbar 14 and the transition busbar 15 have positive and negative terminals.

[0086] Optionally, in one embodiment of this disclosure, the filter assembly may further include a plastic housing that encloses the connecting copper busbar 1 and the heat dissipation copper busbar 4, thereby integrating and fixing the connecting copper busbar 1 and the heat dissipation copper busbar 4 together to meet insulation and withstand voltage requirements. Additionally, the plastic housing may be provided with a receiving cavity for accommodating the magnetic ring, and sealed and fixed with potting compound.

[0087] A second aspect of this disclosure provides an inverter including the filtering components described above.

[0088] A third aspect of this disclosure provides a vehicle including the aforementioned filter assembly or the aforementioned inverter.

[0089] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0090] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0091] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A filtering component, characterized in that, include: A connecting copper busbar, which is used for electrical conduction; A magnetic ring, wherein the magnetic ring is sleeved on a portion of the connecting copper busbar; A capacitor, which is electrically connected to the connecting copper busbar, is disposed on one side of the magnetic ring; A heat dissipation copper busbar, a portion of which is disposed between the capacitor and the magnetic ring, so that the heat from the capacitor and the magnetic ring can be transferred to the heat dissipation copper busbar.

2. The filtering component according to claim 1, characterized in that, Another part of the heat dissipation copper busbar is disposed on one side of the capacitor, and in a direction perpendicular to the heat dissipation copper busbar, the projection of the capacitor falls on the other part of the heat dissipation copper busbar, so that at least part of the heat of the capacitor can be transferred to the heat dissipation copper busbar, so that the heat of the capacitor can be transferred to the heat dissipation copper busbar along two heat conduction paths.

3. The filtering component according to claim 2, characterized in that, The heat dissipation copper busbar includes a plate and a heat absorption part. The heat absorption part is connected to the plate. At least a portion of the heat absorption part is disposed between the capacitor and the magnetic ring. The plate is disposed on one side of the capacitor. In this process, a portion of the heat from the capacitor is transferred to the plate through the heat-absorbing part, while another portion of the heat from the capacitor is directly transferred to the plate.

4. The filtering component according to claim 3, characterized in that, The heat-absorbing part is connected to the edge of the plate, and the heat-absorbing part is close to the capacitor and spaced apart from the capacitor.

5. The filtering component according to claim 3, characterized in that, In a direction perpendicular to the plate, the projection of the capacitor is set as a first projection, and the projection of the plate is set as a second projection. The ratio of the area of ​​the second projection to the area of ​​the first projection is greater than or equal to 2.

6. The filtering component according to claim 3, characterized in that, The heat-absorbing part includes a first heat-absorbing element and a second heat-absorbing element, and the capacitor includes a first capacitor and a second capacitor. The first heat-absorbing element corresponds to the first capacitor, and the second heat-absorbing element corresponds to the second capacitor.

7. The filtering component according to claim 6, characterized in that, The first heat-absorbing element is plate-shaped and is angled to the plate. One side of the first capacitor faces the first heat-absorbing element, and the other side of the first capacitor faces the plate, so that the heat of the first capacitor can be transferred to the first heat-absorbing element and the plate respectively.

8. The filtering component according to claim 6, characterized in that, The second heat-absorbing element includes a pin, one end of which is connected to the plate body. One side of the second capacitor faces the plate body, and the other side of the second capacitor faces the pin, so that a portion of the heat from the second capacitor is transferred to the pin and the plate body. The other end of the pin is provided with a connector, and the second capacitor is provided with a fourth lead. The fourth lead is connected to the connector so that another part of the heat of the second capacitor is transferred to the connector through the fourth lead. In this process, a portion of the heat from the second capacitor is directly transferred to the pin and the board, while another portion of the heat from the second capacitor is transferred to the pin through the fourth lead, and then to the board through the pin.

9. The filtering component according to claim 6, characterized in that, The second heat-absorbing element includes a pin, an extension support plate is formed on one side of the plate, one end of the pin is connected to the extension support plate to shorten the length of the pin, one side of the second capacitor faces the plate, and the other side of the second capacitor faces the pin, so that a portion of the heat of the second capacitor is transferred to the pin and the plate. The other end of the pin is provided with a connector, and the second capacitor is provided with a fourth lead. The fourth lead is connected to the connector so that another part of the heat of the second capacitor is transferred to the connector through the fourth lead. In this process, a portion of the heat from the second capacitor is directly transferred to the pin and the board, while another portion of the heat from the second capacitor is transferred to the pin through the fourth lead, and then to the board through the pin.

10. The filtering component according to claim 1, characterized in that, The filter assembly also includes a base, and the heat dissipation copper busbar is provided with a mounting part. The mounting part is connected to the base, and the heat dissipation copper busbar is transferred to the base. The heat dissipation copper busbar is used to ground through the base. The heat from the capacitor and the magnetic ring is transferred to the heat dissipation copper busbar, which then directs the heat to the mounting portion and the base.

11. The filtering component according to claim 1, characterized in that, The connecting copper busbar is provided with a connecting part, and the capacitor is provided with a lead wire, which is connected to the connecting part; The capacitor includes a first capacitor and a second capacitor, the connecting copper busbar includes a positive copper busbar and a negative copper busbar, and the lead wire includes a first lead wire, a second lead wire, a third lead wire, and a fourth lead wire. One end of the first lead and one end of the second lead are connected to the first capacitor, the other end of the first lead is connected to the connection part of the positive copper busbar, and the other end of the second lead is connected to the connection part of the negative copper busbar. The heat of the positive copper busbar can be transferred to the first capacitor through the first lead and then to the heat dissipation copper busbar through the first capacitor. The heat of the negative copper busbar can be transferred to the first capacitor through the second lead and then to the heat dissipation copper busbar through the first capacitor. The number of the second capacitors is at least two, and each second capacitor is provided with the third lead and the fourth lead. The third lead of at least one second capacitor is connected to the positive copper busbar, and the third lead of at least one second capacitor is connected to the negative copper busbar. The fourth lead of each second capacitor is connected to the heat dissipation copper busbar. The heat from the positive copper busbar and the negative copper busbar can be transferred to the second capacitor through the third lead, and then transferred to the heat dissipation copper busbar through the second capacitor.

12. The filtering component according to any one of claims 1-11, characterized in that, The connecting copper busbar includes a main busbar and a transition busbar, wherein the transition busbar is integrally formed or welded to the main busbar.

13. An inverter, characterized in that, Includes the filtering component as described in any one of claims 1-12.

14. A vehicle, characterized in that, It includes the filter component as described in any one of claims 1-12, or the inverter as described in claim 13.

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