Slide stage drive

Abstract

This invention proposes a wafer stage driving device, including a wafer stage and a driving assembly. The wafer stage has a first direction and a bearing surface for placing wafers, the bearing surface being perpendicular to the first direction. The driving assembly includes a first piezoelectric ceramic, a second piezoelectric ceramic, and a support member. The first piezoelectric ceramic includes a first fixing part and a first driving part connected together, and the second piezoelectric ceramic includes a second fixing part and a second driving part connected together. The first fixing part is connected to the wafer stage, the second fixing part is connected to the first driving part, and the support member is connected to the second driving part and located on one side of the second driving part in the first direction. The first driving part and the second driving part can drive the support member to move back and forth perpendicular to the first direction, and enable the support member to move back and forth between one side and the other side of the bearing surface. The wafer stage driving device in this embodiment of the invention has a higher adjustment range and adjustment accuracy.

Description

Technical Field

[0001] This invention relates to the field of wafer testing technology, and more specifically to a wafer stage driving device. Background Technology

[0002] A wafer stage is used to place wafers and can adjust the angle of the placed wafers, thereby providing precise positioning for wafer testing, packaging and dicing.

[0003] In some technologies, the stage drive directly rotates the wafer stage via a motor. However, using a motor to rotate the stage results in low precision and is not conducive to adjusting the wafer angle. In other technologies, the stage drive directly rotates the stage by the extension and retraction of piezoelectric ceramics. However, the extension and retraction range of the piezoelectric ceramics themselves is small, resulting in a limited adjustment range. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes a stage driving device with a wider adjustment range.

[0005] According to a first aspect of the present invention, a stage driving device includes:

[0006] A wafer stage has a first direction and a support surface for placing a wafer in the first direction, the support surface being perpendicular to the first direction;

[0007] The driving assembly includes a first piezoelectric ceramic, a second piezoelectric ceramic, and a support member. The first piezoelectric ceramic includes a first fixing part and a first driving part connected to each other. The second piezoelectric ceramic includes a second fixing part and a second driving part connected to each other. The first fixing part is connected to the stage, the second fixing part is connected to the first driving part, and the support member is connected to the second driving part and located on one side of the second driving part in the first direction.

[0008] The first driving part can move relative to the first fixed part, thereby driving the second piezoelectric ceramic to move; the second driving part can move relative to the second fixed part, so that the first driving part and the second driving part can drive the support member to move back and forth perpendicular to the first direction, and the support member can move back and forth between one side of the bearing surface in the first direction and the side opposite to the first direction.

[0009] The stage driving device according to embodiments of the present invention has at least the following beneficial effects:

[0010] When the support member is moved by the drive component of the present invention, the end of the support member can move from the side opposite to the first direction of the bearing surface to the side of the first direction of the bearing surface, thereby supporting the wafer placed on the bearing surface, so that the part of the wafer supported by the end of the support member is lifted away from the bearing surface. When supporting the wafer, the support member moves along a direction perpendicular to the first direction. The end of the support member can drive the portion of the wafer supported by the end of the support member to move perpendicular to the first direction relative to the portion of the wafer not supported by the end of the support member, thereby realizing the rotation of the wafer. When the rotation reaches the travel limit of the first piezoelectric ceramic and the second piezoelectric ceramic, the end of the support member supporting the wafer can move from one side of the bearing surface in the first direction back to the side of the bearing surface opposite to the first direction, thereby placing the wafer back on the bearing surface. The end of the support member located on the side of the bearing surface opposite to the first direction can move back to its original position along a direction perpendicular to the first direction. The support member that has returned to its original position can move again from the side of the bearing surface opposite to the first direction to the side of the bearing surface in the first direction, thereby causing the end of the support member to support the other part of the wafer placed on the bearing surface, so that the portion of the wafer supported by the end of the support member is lifted off the bearing surface and can be moved by the support member, thereby causing the wafer to rotate again. The drive assembly, through the combined operation of the first and second piezoelectric ceramics, enables the wafer to rotate multiple times, allowing the wafer to rotate at an angle greater than the range of a single adjustment by the piezoelectric ceramics. It also utilizes the high precision of the piezoelectric ceramics to achieve higher rotational accuracy.

[0011] According to some embodiments of the present invention, the driving assembly further includes a rotating member rotatably connected to the slide stage, and the second fixing part is connected to the rotating member;

[0012] The first driving unit is connected to the rotating member and can drive the rotating member to rotate relative to the stage about a first rotation axis perpendicular to the first direction, so that the support member can move back and forth between the first side of the bearing surface and the side opposite to the first direction; the second driving unit can move closer to and further away from the first rotation axis.

[0013] According to some embodiments of the present invention, the rotating member has an abutment surface of the first rotation axis, and one end of the first driving part away from the first fixed part abuts against the abutment surface to drive the rotating member to rotate about the first rotation axis perpendicular to the first direction;

[0014] The drive assembly also includes an elastic element connected to the rotating element for resetting the rotating element.

[0015] According to some embodiments of the present invention, the first driving part has a spherical surface on the side away from the first fixing part, and the spherical surface abuts against the abutting surface.

[0016] According to some embodiments of the present invention, the first driving part is located on the side of the first fixing part perpendicular to the bearing surface, and the end of the first driving part is capable of reciprocating between the first fixing part on the bearing surface in the first direction and on the side opposite to the first direction; the second driving part is located on the side of the second fixing part in the direction parallel to the bearing surface, and is capable of reciprocating relative to the second fixing part in the direction parallel to the bearing surface.

[0017] Alternatively, the second driving part is located on the side of the second fixed part perpendicular to the bearing surface, and the end of the second driving part can reciprocate between the second fixed part on the side of the bearing surface in the first direction and the side opposite to the first direction; the first driving part is located on the side of the first fixed part in the direction parallel to the bearing surface, and can reciprocate relative to the first fixed part in the direction parallel to the bearing surface.

[0018] According to some embodiments of the present invention, the stage driving device includes at least two driving components, each of which is evenly distributed on the side edge of the bearing surface.

[0019] According to some embodiments of the present invention, the stage driving device includes at least three driving components, the support members of each driving component are located on the same circle, and the stage driving device is capable of synchronously driving the first driving part and the second driving part of each driving component to move synchronously, so that each support member can move tangentially back and forth along the same circle.

[0020] According to some embodiments of the present invention, the stage has a receiving groove that extends along the first direction to the bearing surface, and the drive assembly is received in the receiving groove.

[0021] According to some embodiments of the present invention, the receiving groove is located at the side edge of the bearing surface.

[0022] According to some embodiments of the present invention, the first piezoelectric ceramic, the second piezoelectric ceramic, and the support member are spaced apart from the stage.

[0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1This is an overall schematic diagram of a stage driving device according to some embodiments of the first aspect of the present invention;

[0026] Figure 2 for Figure 1 A magnified view shown at point A in the middle;

[0027] Figure 3 for Figure 1 Top view of the intermediate film stage drive unit;

[0028] Figure 4 for Figure 3 The enlarged view shown at point B in the middle;

[0029] Figure 5 for Figure 1 A schematic diagram of a wafer stage drive unit carrying a wafer;

[0030] Figure 6 for Figure 1 Voltage timing diagram of the first and second piezoelectric ceramics in operation;

[0031] Figure 7 for Figure 1 A schematic diagram showing the positions of the driving components and the wafer in the diagram;

[0032] Figure 8 for Figure 7 A schematic diagram of the elongation of the first piezoelectric ceramic in the process;

[0033] Figure 9 for Figure 8 A schematic diagram of the elongation of the second piezoelectric ceramic in the image;

[0034] Figure 10 for Figure 9 A schematic diagram of the shortening of the first piezoelectric ceramic in the middle;

[0035] Figure 11 for Figure 10 A schematic diagram of the shortening of the second piezoelectric ceramic.

[0036] Figure label:

[0037] Stage drive unit 10;

[0038] Stage 100, bearing surface 110, receiving groove 120;

[0039] Drive assembly 200, first piezoelectric ceramic 210, first fixing part 211, first driving part 212, spherical surface 213, second piezoelectric ceramic 220, second fixing part 221, second driving part 222, support member 230, rotating member 240, abutment surface 241, elastic member 250;

[0040] Wafer 20. Detailed Implementation

[0041] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0042] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0043] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0044] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0045] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0046] Please refer to Figures 1 to 11 As shown, the present invention proposes a wafer stage driving device 10, which includes a wafer stage 100 and a driving device.

[0047] Please refer to Figure 1 As shown, the stage 100 of the present invention has a first direction (i.e., Figure 1The stage 100 has a support surface 110 for placing the wafer 20 in a first direction, and the support surface 110 is perpendicular to the first direction. The wafer stage 100 supports the wafer 20 through the support surface 110 so that other devices can operate on the wafer 20 on the support surface 110. Without departing from the inventive concept of the present invention, those skilled in the art can adjust the structure of the wafer stage 100 to place the wafer 20. Exemplarily, in some embodiments, the interior of the wafer stage 100 is in communication with a vacuum pump, and the support surface 110 is provided with adsorption holes communicating with the interior of the wafer stage 100. The above embodiments can adsorb the wafer 20 placed on the support surface 110 by vacuum adsorption. In some embodiments, the support surface 110 is a smooth and flat surface. Operators can directly place the wafer 20 on the support surface 110 using equipment.

[0048] Please refer to Figure 2 , Figure 3 As shown, the drive assembly 200 of the present invention includes a first piezoelectric ceramic 210, a second piezoelectric ceramic 220, and a support member 230. The first piezoelectric ceramic 210 includes a first fixing part 211 and a first driving part 212 connected to each other. The second piezoelectric ceramic 220 includes a second fixing part 221 and a second driving part 222 connected to each other. The first fixing part 211 is connected to the stage 100, the second fixing part 221 is connected to the first driving part 212, and the support member 230 is connected to the second driving part 222 and is located on one side of the second driving part 222 in a first direction.

[0049] When the first piezoelectric ceramic 210 is driven by voltage, the first driving part 212 of the present invention can extend relative to the first fixed part 211, thereby driving the second fixed part 221 connected to the first driving part 212 to move. The second driving part 222 connected to the second fixed part 221 and the support member 230 connected to the second driving part 222 will also move synchronously. When the second piezoelectric ceramic 220 is driven by voltage, the second driving part 222 of the present invention can extend relative to the second fixed part 221, thereby driving the support member 230 connected to the second driving part 222 to move. By setting the movement direction of the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220, the present invention enables the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 to drive the support member 230 to move along a preset direction within the movement stroke of the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220.

[0050] The first driving part 212 of the present invention can move relative to the first fixed part 211, and the second driving part 222 can move relative to the second fixed part 221, so that the first driving part 212 and the second driving part 222 can drive the support member 230 to move back and forth perpendicular to the first direction, and the end of the support member 230 can move back and forth between one side of the bearing surface 110 in the first direction and the side opposite to the first direction.

[0051] When the drive assembly 200 of the present invention drives the support member 230 to move, the end of the support member 230 can move from the side opposite to the first direction of the bearing surface 110 to the side of the first direction of the bearing surface 110, thereby supporting the wafer 20 placed on the bearing surface 110, so that the portion of the wafer 20 supported by the support member 230 is lifted away from the bearing surface 110. When supporting the wafer 20, the support member 230 moves in a direction perpendicular to the first direction, and the end of the support member 230 can drive the portion of the wafer 20 supported by the end of the support member 230 to move perpendicular to the first direction relative to the portion of the wafer 20 not supported by the end of the support member 230, thereby realizing the rotation of the wafer 20. The end of the support member 230 supporting the wafer 20 can move from one side of the bearing surface 110 in the first direction back to the side opposite to the first direction of the bearing surface 110, thereby placing the wafer 20 back on the bearing surface 110, located on the bearing surface 110. The end of the support member 230 on the opposite side of the first direction of the bearing surface 110 can move back to its original position in a direction perpendicular to the first direction. The returned support member 230 can then move from the opposite side of the first direction of the bearing surface 110 to the first direction side of the bearing surface 110, thereby supporting another portion of the wafer 20 placed on the bearing surface 110. This lifts the portion of the wafer 20 supported by the end of the support member 230 away from the bearing surface 110 and allows it to be moved by the support member 230, thus causing the wafer 20 to rotate again. The drive assembly 200, through the coordinated operation of the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220, enables the wafer 20 to rotate multiple times, allowing the wafer 20 to rotate at angles greater than the range of a single adjustment by the piezoelectric ceramic. Furthermore, the high precision of the piezoelectric ceramic results in higher rotational accuracy.

[0052] Without departing from the inventive concept of this invention, those skilled in the art can adjust the structure of the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 so that the support member 230 can rotate the wafer 20 by the movement of the first driving part 212 and the movement of the second driving part 222.

[0053] In some embodiments, the first driving part 212 is located on the side of the first fixing part 211 perpendicular to the bearing surface 110, and the end of the first driving part 212 is capable of reciprocating relative to the first fixing part 211 between one side of the bearing surface 110 in a first direction and the side opposite to the first direction. The second driving part 222 is located on the side of the second fixing part 221 in a direction parallel to the bearing surface 110, and is capable of reciprocating relative to the second fixing part 221 in a direction parallel to the bearing surface 110.

[0054] In the above embodiment, when the support member 230 is moved by the movement of the first driving part 212 and the second driving part 222, the first driving part 212 can first move the end of the support member 230 from the side opposite to the first direction of the bearing surface 110 to the side of the first direction of the bearing surface 110, thereby making the end of the support member 230 support the wafer 20. Then, the second driving part 222 can move the support member 230 in a direction parallel to the bearing surface 110, causing the part of the wafer 20 supported by the end of the support member 230 to rotate until the second driving part 222 moves to the upper limit of the stroke. Then, the first driving part 212 can move the end of the support member 230 from the side of the first direction of the bearing surface 110 to the side opposite to the first direction of the bearing surface 110. Then, the second driving part 222 can move in a direction parallel to the bearing surface 110 to return the end of the support member 230 to its original position.

[0055] When the end of the support member 230 returns to its original position, the first drive unit 212 can drive the end of the support member 230, which is in its original position, to move from the side opposite to the first direction of the bearing surface 110 to the side of the bearing surface 110 in the first direction, thereby causing the end of the support member 230 to support different parts of the wafer 20. Then, the second drive unit 222 drives the support member 230 to move in a direction parallel to the bearing surface 110, causing the part of the wafer 20 supported by the end of the support member 230 to rotate until the second drive unit 222 moves to the upper limit of its stroke again. Then, the first drive unit 212 drives the end of the support member 230 to move from the side of the bearing surface 110 in the first direction to the side opposite to the first direction of the bearing surface 110. Then, the second drive unit 222 moves in a direction parallel to the bearing surface 110 to make the end of the support member 230 return to its original position. By repeating the above steps, the above embodiment enables the support member 230 to drive the wafer 20 to rotate multiple times through the cyclic movement of the first drive unit 212 and the second drive unit 222, thereby giving the stage drive device 10 a larger adjustment range.

[0056] In some embodiments, the second driving part 222 is located on the side of the second fixing part 221 perpendicular to the bearing surface 110, and the end of the second driving part 222 can move back and forth relative to the second fixing part 221 between the side of the bearing surface 110 in the first direction and the side opposite to the first direction; the first driving part 212 is located on the side of the first fixing part 211 in the direction parallel to the bearing surface 110, and can move back and forth relative to the first fixing part 211 in the direction parallel to the bearing surface 110.

[0057] In the above embodiment, when the support member 230 is moved by the movement of the first driving part 212 and the second driving part 222, the second driving part 222 can first drive the end of the support member 230 from the side opposite to the first direction of the bearing surface 110 to the side of the bearing surface 110 in the first direction, thereby causing the end of the support member 230 to support the wafer 20. Then, the first driving part 212 drives the support member 230 to move in a direction parallel to the bearing surface 110, causing the part of the wafer 20 supported by the end of the support member 230 to rotate until the first driving part 212 moves to the upper limit of the stroke. Then, the second driving part 222 drives the end of the support member 230 from the side of the bearing surface 110 in the first direction to the side opposite to the first direction of the bearing surface 110. Finally, the first driving part 212 moves in a direction parallel to the bearing surface 110 to return the end of the support member 230 to its original position.

[0058] When the end of the support member 230 returns to its original position, the second drive unit 222 can drive the end of the support member 230, which is in its original position, to move from the side opposite to the first direction of the bearing surface 110 to the side of the bearing surface 110 in the first direction. This causes the end of the support member 230 to support different parts of the wafer 20. Then, the first drive unit 212 drives the support member 230 to move in a direction parallel to the bearing surface 110, causing the part of the wafer 20 supported by the end of the support member 230 to rotate until the first drive unit 212 moves to the upper limit of its stroke again. Then, the second drive unit 222 drives the end of the support member 230 to move from the side of the bearing surface 110 in the first direction to the side opposite to the first direction. Then, the movement of the first drive unit 212 in a direction parallel to the bearing surface 110 causes the end of the support member 230 to return to its original position. By repeating the above steps, the above embodiment enables the support member 230 to drive the wafer 20 to rotate multiple times through the cyclic movement of the first drive unit 212 and the second drive unit 222, thereby giving the stage drive device 10 a larger adjustment range.

[0059] As a preferred embodiment, please refer to Figure 2 As shown, in some embodiments, the drive assembly 200 further includes a rotating member 240, which is rotatably connected to the stage 100, and a second fixing part 221 is connected to the rotating member 240. A first drive part 212 is drively connected to the rotating member 240 and can drive the rotating member 240 to rotate relative to the stage 100 with a first rotation axis perpendicular to the first direction, so that the support member 230 can move back and forth between one side of the bearing surface 110 in the first direction and the side opposite to the first direction; the second drive part 222 can move closer to and further away from the first rotation axis.

[0060] Through the above scheme, the first driving unit 212 can drive the rotating member 240 to rotate by its own movement, thereby driving the second fixed part 221, the second driving unit 222, and the support member 230 connected to the rotating member 240 to rotate. This allows the end of the support member 230 to move back and forth between one side of the bearing surface 110 in the first direction and the side opposite to the first direction. The end of the support member 230 can support the wafer 20 on the bearing surface 110 and can put the supported wafer 20 back onto the bearing surface 110. Since the first rotation axis is perpendicular to the first direction, when the second driving unit 222 approaches and moves away from the first rotation axis, it can adjust the position of the support member 230 in the direction parallel to the bearing surface 110, thereby changing the position of the part of the wafer 20 supported by the end of the support member 230 in the direction parallel to the bearing surface 110, and realizing the rotation of the wafer 20.

[0061] Furthermore, in some embodiments, the second driving part 222 is further away from the rotating member 240 relative to the first driving part 212. This arrangement results in the second driving part 222 having a greater displacement when the rotating member 240 rotates than the first driving part 212 drives the rotating member 240 to rotate. This makes it easier for the second driving part 222 to move from the side of the bearing surface 110 opposite to the first direction to the side of the bearing surface 110 in the first direction, which helps to reduce the elongation of the first piezoelectric ceramic 210, reduce the space occupied by the first piezoelectric ceramic 210, and reduce the space occupied by the transmission assembly.

[0062] To help those skilled in the art further understand the process of rotating the wafer 20 in the above embodiments, the following describes an operation process of the driving component 200 in conjunction with some embodiments.

[0063] Please refer to Figure 7 As shown, where Figure 7 The diagram illustrates a portion of the structure of the stage drive unit 10, showing the relative positional relationship between the drive assembly 200 and the wafer 20 during operation. In some embodiments, the bearing surface 110 is positioned facing and perpendicular to a first direction (i.e., the first direction is...). Figure 7 (above the middle), the first drive unit 212 is located in the opposite direction of the first fixed unit 211 in the first direction (the first direction being opposite is also known as the reverse direction). Figure 7 The second drive part 212 is connected to the rotating member 240 in a transmission connection, and the second fixed part 221 is connected to the rotating member 240. The second drive part 222 is located on the side of the bearing surface 110 in the opposite direction of the first direction.

[0064] When it is necessary to rotate wafer 20, please refer to... Figure 8As shown, when the support member 230 is moved by the movement of the first driving part 212 and the second driving part 222, the first driving part 212 can first move in the opposite direction of the first direction to drive the rotating part 240 to rotate, so that the second piezoelectric ceramic 220 and the support member 230 rotate synchronously, the support member 230 moves in the first direction, and the end of the support member 230 moves from the side opposite to the first direction of the bearing surface 110 to the side of the first direction, and supports the wafer 20 on the bearing surface 110.

[0065] Please refer to Figure 9 As shown, after the support member 230 supports the wafer 20 on the bearing surface 110, the second drive unit 222 moves away from the first rotation axis, causing the position of the support member 230 in the direction parallel to the bearing surface 110 to be adjusted towards the first rotation direction. This causes the position of the part of the wafer 20 supported by the end of the support member 230 to change in the direction parallel to the bearing surface 110. The position of the part of the wafer 20 supported by the end of the support member 230 relative to other parts in the direction parallel to the bearing surface 110 also changes, causing the wafer 20 to rotate towards the first rotation direction.

[0066] Please refer to Figure 10 As shown, when the wafer 20 is rotated by the support member 230 until the second drive unit 222 moves to the upper limit of the stroke, the first drive unit 212 moves along the first direction, causing the rotating member 240 to rotate in the opposite direction, causing the second piezoelectric ceramic 220 and the support member 230 to rotate synchronously. The support member 230 moves in the opposite direction of the first direction, and the end of the support member 230 moves from one side of the bearing surface 110 in the first direction to the side opposite to the first direction, and the supported wafer 20 is placed back on the bearing surface 110.

[0067] Please refer to Figure 11 As shown, after the support member 230 repositions the supported wafer 20 onto the bearing surface 110, the movement of the second drive unit 222 near the first rotation axis causes the position of the support member 230 in the direction parallel to the bearing surface 110 to be adjusted in the opposite direction of the first rotation direction, so that the end of the support member 230 returns to its original position. The drive assembly 200 can repeatedly execute the above steps, thereby driving the wafer 20 to rotate in the first rotation direction multiple times.

[0068] It should be noted that those skilled in the art can control the movement of the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 according to existing technology, thereby realizing the process of driving the component 200 to rotate the wafer 20. For example, based on the above embodiments, please refer to... Figure 6 As shown, Figure 6The voltage timing of the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 during operation is shown. In some embodiments, the stage drive device 10 can supply power to the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 respectively, thereby enabling the first drive unit 212 to move relative to the first fixed unit 211 and the second drive unit 222 to move relative to the second fixed unit 221.

[0069] When it is necessary to rotate wafer 20, please refer to... Figure 6 , Figure 8 As shown, the stage drive device 10 first supplies power to the first piezoelectric ceramic 210, causing the first drive part 212 to extend relative to the first fixed part 211. The first drive part 212 drives the rotating part 240 to rotate in the opposite direction of the first direction, causing the second piezoelectric ceramic 220 and the support member 230 to rotate synchronously. The support member 230 moves in the first direction, from the side of the bearing surface 110 opposite to the first direction to the side of the first direction, and supports the wafer 20 on the bearing surface 110.

[0070] Please refer to Figure 6 , Figure 9 As shown, after supplying power to the first piezoelectric ceramic 210 for a period of time, the stage drive device 10 supplies power to the second piezoelectric ceramic 220, causing the second drive unit 222 to move away from the first rotation axis. This causes the position of the support member 230 in the direction parallel to the bearing surface 110 to be adjusted towards the first rotation direction, thereby causing the position of the portion of the wafer 20 supported by the end of the support member 230 in the direction parallel to the bearing surface 110 to change. The position of the portion of the wafer 20 supported by the end of the support member 230 relative to other portions in the direction parallel to the bearing surface 110 also changes, causing the wafer 20 to rotate towards the first rotation direction.

[0071] Please refer to Figure 6 , Figure 10 As shown, after supplying power to the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 for a period of time, the stage drive device 10 stops supplying power to the first piezoelectric ceramic 210, thereby causing the first drive unit 212 to move along the first direction, causing the rotating member 240 to rotate in the opposite direction, causing the second piezoelectric ceramic 220 and the support member 230 to rotate synchronously, and the support member 230 to move in the opposite direction of the first direction. The end of the support member 230 moves from one side of the bearing surface 110 in the first direction to the side opposite to the first direction, and the supported wafer 20 is placed back on the bearing surface 110.

[0072] Please refer to Figure 6 , Figure 11As shown, after supplying power to the second piezoelectric ceramic 220 for a period of time, the stage drive device 10 stops supplying power to the second piezoelectric ceramic 220, causing the second drive unit 222 to move closer to the first rotation axis. This causes the position of the support member 230 in the direction parallel to the bearing surface 110 to be adjusted in the opposite direction to the first rotation direction, so that the end of the support member 230 returns to its original position. The stage drive device 10 can cyclically supply power to the first piezoelectric ceramic 210 and the second piezoelectric ceramic 220 according to the above power supply process, thereby enabling the drive assembly 200 to drive the wafer 20 to rotate in the first rotation direction multiple times.

[0073] Without departing from the inventive concept of this invention, the drive component 200 can also drive the wafer 20 to rotate in other ways. Please refer to... Figure 7 As shown, in some embodiments, the bearing surface 110 is disposed facing and perpendicular to the first direction (the first direction is also known as...). Figure 7 (above the middle), the first drive unit 212 is located in the opposite direction of the first fixed unit 211 in the first direction (the first direction being opposite is also known as the reverse direction). Figure 7 The second drive part 212 is connected to the rotating member 240 in a transmission connection, and the second fixed part 221 is connected to the rotating member 240. The second drive part 222 is located on the side of the bearing surface 110 in the opposite direction of the first direction.

[0074] When it is necessary to rotate the wafer 20, when the support member 230 is moved by the movement of the first drive unit 212 and the second drive unit 222, the second drive unit 222 can be rotated away from the first rotation axis first, so that the position of the support member 230 in the direction parallel to the bearing surface 110 is adjusted towards the first rotation direction.

[0075] Then, the first driving part 212 drives the rotating part 240 to rotate in the opposite direction of the first direction, so that the second piezoelectric ceramic 220 and the support 230 rotate synchronously, the support 230 moves in the first direction, and the end of the support 230 moves from the side of the bearing surface 110 opposite to the first direction to the side of the first direction, and supports the wafer 20 on the bearing surface 110.

[0076] After the support member 230 supports the wafer 20 on the bearing surface 110, the second drive unit 222 rotates close to the first rotation axis, causing the position of the support member 230 in the direction parallel to the bearing surface 110 to be adjusted in the opposite direction of the first rotation direction. This causes the position of the part of the wafer 20 supported by the end of the support member 230 to change in the direction parallel to the bearing surface 110. The position of the part of the wafer 20 supported by the end of the support member 230 relative to other parts in the direction parallel to the bearing surface 110 also changes, and the wafer 20 rotates in the opposite direction of the first rotation direction.

[0077] As the wafer 20 is rotated by the support member 230 until the second drive unit 222 moves to its lower limit of travel, the first drive unit 212 moves along the first direction, causing the rotating member 240 to rotate in the opposite direction. This causes the second piezoelectric ceramic 220 and the support member 230 to rotate synchronously. The support member 230 moves in the opposite direction of the first direction, and its end moves from one side of the bearing surface 110 in the first direction to the side opposite to the first direction, returning to its original position and repositioning the supported wafer 20 onto the bearing surface 110. The drive assembly 200 can repeatedly perform the above steps, thereby driving the wafer 20 to rotate in the second rotation direction multiple times.

[0078] It should be noted that the present invention does not impose any restrictions on the structure of the rotating member 240. In some embodiments, the rotating member 240 is rotatably connected to the stage 100 via a mechanical hinge, and the first driving part 212 is fixedly connected to the rotating member 240. During the movement of the first driving part 212, the rotating member 240 can drive the second piezoelectric ceramic 220 and the support member 230 to rotate synchronously.

[0079] As a preferred option, please refer to Figure 2 As shown, in some embodiments, the rotating member 240 has an abutment surface 241 parallel to the first rotation axis. The end of the first driving part 212 away from the first fixed part 211 abuts against the abutment surface 241 to drive the rotating member 240 to rotate about the first rotation axis perpendicular to the first direction. The driving assembly 200 also includes an elastic member 250 connected to the rotating member 240 for resetting the rotating member 240. Through this scheme, when the first driving part 212 is away from the first fixed part 211, it can push the rotating member 240 to rotate by abutment. When the first driving part 212 is close to the first fixed part 211, the elastic member 250 can drive the rotating member 240 to rotate in the opposite direction. This scheme can maintain the rotating member 240 continuously abutting against the first driving part 212, ensuring that the first driving part 212 can stably push the rotating member 240 to rotate when it moves, thus improving the stability of the adjustment process.

[0080] It should be noted that the present invention does not impose limitations on the structure of the elastic member 250. In some embodiments, when the first driving member moves away from the first fixed part 211, it can drive the rotating member 240 to rotate clockwise. The elastic member 250 is a torsion spring, one end of which is connected to the plate stage 100 and the other end is connected to the rotating member 240, thereby providing a counterclockwise rotational force to the rotating member 240.

[0081] As a preferred embodiment, please refer to Figure 2As shown, the elastic element 250 is a flexible hinge, and the rotating element 240 is connected to the stage 100 through the flexible hinge. When the first driving part 212 pushes the rotating element 240 to rotate, the rotating element 240 can rotate around the flexible hinge, thereby driving the second piezoelectric ceramic 220 and the support 230 to rotate. When the first driving part 212 returns to its original position, the flexible hinge can also drive the rotating element 240 to rotate back to its original position.

[0082] Further, please refer to Figure 2 As shown, in some embodiments, the side of the first driving part 212 away from the first fixed part 211 has a spherical surface 213, which abuts against the abutment surface 241. Since the side of the first driving part 212 away from the first fixed part 211 abuts against the abutment surface 241 via the spherical surface 213, the first driving part 212 can maintain its pushing force on the rotating member 240 during movement by abutting against the abutment surface 241 at different positions on the spherical surface 213. This makes the rotation of the rotating member 240 smoother and improves the stability of the adjustment process.

[0083] This invention does not limit the number of drive components 200. As a preferred embodiment, please refer to... Figure 3 , Figure 4 As shown, in some embodiments, the stage driving device 10 includes at least two driving components 200, each driving component 200 being evenly distributed on the side edge of the bearing surface 110. Through this scheme, the stage driving device 10 can synchronously drive the first driving portion 212 of each driving component 200 to move synchronously, and can synchronously drive the second driving portion 222 of each driving component 200 to move synchronously, so that the ends of each support member 230 jointly drive the wafer 20 on the bearing surface 110 to rotate. Since the ends of each support member 230 jointly drive the wafer 20 on the bearing surface 110 to rotate, and because the first driving portion 212 and the second driving portion 222 of each driving component 200 can drive the ends of multiple support members 230 to support different parts of the wafer 20, the wafer 20 as a whole can be detached from the bearing surface 110, avoiding friction between the wafer 20 and the bearing surface 110 during rotation and reducing wear on the wafer 20 during adjustment.

[0084] Those skilled in the art can adjust the position and orientation of each drive component 200 according to the scheme described above, which uses a single drive component 200 to drive the wafer 20 to rotate, so that multiple support members 230 can jointly drive the wafer 20 on the bearing surface 110 to rotate.

[0085] Exemplarily, in some embodiments, the stage driving device 10 includes two driving components 200, which are respectively disposed on both sides of the stage 100 perpendicular to the first direction. Through the synchronous movement of the first driving part 212 and the second driving part 222, the ends of each support member 230 can move along the first direction and jointly support the wafer 20. Then, through the movement of each support member 230 along a direction parallel to the bearing surface 110, the wafer 20 is driven to rotate clockwise. Then, each support member 230 moves synchronously in the opposite direction along the first direction to place the wafer 20 on the bearing surface 110. Finally, each support member 230 returns to its original position. By cyclically executing the above process, the stage driving device 10 can make the wafer 20 rotate continuously in a single direction, with a wider range of angle adjustment.

[0086] Further, please refer to Figure 3 As shown, the wafer stage driving device 10 includes at least three driving components 200. The support members 230 of each driving component 200 are located on the same circle parallel to the bearing surface 110. The wafer stage driving device 10 can synchronously drive the first driving part 212 and the second driving part 222 of each driving component 200 to move synchronously, so that each support member 230 can move tangentially along the same circle parallel to the bearing surface 110. The above solution, by having the ends of the support members 230 of the three driving components 200 jointly support and rotate the wafer 20, helps to further increase the stability of the wafer 20 rotation.

[0087] For details, please refer to Figure 3 As shown, where, Figure 3The first rotation direction is counterclockwise. Taking some embodiments as examples, the stage driving device 10 includes three driving components 200. The three driving components 200 are evenly distributed on the side edge of the bearing surface 110. Each driving component 200 includes a rotating member 240. Each rotating member 240 is rotatably connected to the stage 100. Each second fixing part 221 is connected to the rotating member 240 under the same driving component 200. Each first driving part 212 is drivenly connected to the rotating member 240 under the same driving component 200 and can drive the rotating member 240 to rotate relative to the first rotation axis of the stage 100 perpendicular to the first direction, so that the ends of each support member 230 can move back and forth between one side of the bearing surface 110 in the first direction and the side opposite to the first direction. Each second driving part 222 is located on one side of each second fixing part 221 in the counterclockwise direction and can move closer to or away from the second fixing part 221. Through the synchronous movement of the first driving unit 212 and the second driving unit 222, each support member 230 can move along the first direction and jointly support the wafer 20. Then, through the tangential direction of each support member 230 along the same circle parallel to the bearing surface 110, different parts of the wafer 20 are rotated in the tangential direction, thereby causing the wafer 20 to rotate counterclockwise as a whole. In the above process, since the three support members 230 are evenly distributed on the side edge of the bearing surface 110, the wafer 20 is less likely to flip during rotation, and the stability of the wafer 20 rotation is stronger.

[0088] Further, please refer to Figure 2 , Figure 4 As shown, in some embodiments, the stage 100 has a receiving groove 120 that extends along a first direction to the bearing surface 110, and the drive assembly 200 is received in the receiving groove 120. The above solution utilizes the receiving groove 120 to house the drive assembly 200, which helps to reduce the space occupied by the stage drive device 10.

[0089] As a preferred option, please refer to Figure 2 , Figure 4 , Figure 5 As shown, in some embodiments, the receiving groove 120 is located on the side edge of the bearing surface 110. With the above solution, the driving component 200 is located circumferentially on the bearing surface 110, so that the support member 230 can drive the portion of the wafer 20 near the outside to rotate during movement, avoiding the device area on the wafer 20, which helps to ensure the quality of the wafer 20.

[0090] Furthermore, in some embodiments, the first piezoelectric ceramic 210, the second piezoelectric ceramic 220, and the support member 230 are all spaced apart from the stage 100. Through this design, the first drive unit 212, the second drive unit 222, and the support member 230 can avoid contact with the stage 100 during movement, preventing wear on these components and improving the stability of the adjustment process.

[0091] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A slide stage drive apparatus characterized by, include: A wafer stage has a first direction and a support surface for placing a wafer in the first direction, the support surface being perpendicular to the first direction; The driving assembly includes a first piezoelectric ceramic, a second piezoelectric ceramic, and a support member. The first piezoelectric ceramic includes a first fixing part and a first driving part connected to each other. The second piezoelectric ceramic includes a second fixing part and a second driving part connected to each other. The first fixing part is connected to the stage, the second fixing part is connected to the first driving part, and the support member is connected to the second driving part and located on one side of the second driving part in the first direction. The first driving part is movable relative to the first fixed part to drive the second piezoelectric ceramic to move; the second driving part is movable relative to the second fixed part so that the first driving part and the second driving part can drive the support member to move back and forth perpendicular to the first direction, and the end of the support member can move back and forth between one side of the bearing surface in the first direction and the side opposite to the first direction.

2. The stage driving device according to claim 1, characterized in that, The driving assembly further includes a rotating component, which is rotatably connected to the slide stage, and the second fixing part is connected to the rotating component; The first driving unit is connected to the rotating member and can drive the rotating member to rotate relative to the stage about a first rotation axis perpendicular to the first direction, so that the support member can move back and forth between the first side of the bearing surface and the side opposite to the first direction; the second driving unit can move closer to and further away from the first rotation axis.

3. The stage driving device according to claim 2, characterized in that, The rotating member has an abutting surface of the first rotation axis, and the end of the first driving part away from the first fixed part abuts against the abutting surface to drive the rotating member to rotate around the first rotation axis perpendicular to the first direction. The drive assembly also includes an elastic element connected to the rotating element for resetting the rotating element.

4. The stage driving device according to claim 3, characterized in that, The first driving part has a spherical surface on the side away from the first fixing part, and the spherical surface abuts against the abutting surface.

5. The stage driving device according to claim 1, characterized in that, The first driving part is located on the side of the first fixed part perpendicular to the bearing surface, and the end of the first driving part can reciprocate between the first fixed part on the first side of the bearing surface in the first direction and the side opposite to the first direction; the second driving part is located on the side of the second fixed part in the direction parallel to the bearing surface, and can reciprocate relative to the second fixed part in the direction parallel to the bearing surface. Alternatively, the second driving part is located on the side of the second fixed part perpendicular to the bearing surface, and the end of the second driving part is capable of reciprocating between the second fixed part on the side of the bearing surface in the first direction and the side opposite to the first direction; the first driving part is located on the side of the first fixed part in the direction parallel to the bearing surface, and is capable of reciprocating relative to the first fixed part in the direction parallel to the bearing surface.

6. The stage driving device according to any one of claims 1 to 5, characterized in that, The stage drive device includes at least two drive components, each of which is evenly distributed on the side edge of the bearing surface.

7. The stage driving device according to claim 6, characterized in that, The stage drive device includes at least three drive components, and the support members of each drive component are located on the same circle. The stage drive device can synchronously drive the first drive part and the second drive part of each drive component to move synchronously, so that each support member can move back and forth tangentially along the same circle.

8. The stage driving device according to claim 1, characterized in that, The stage has a receiving groove that extends along the first direction to the bearing surface, and the drive assembly is received in the receiving groove.

9. The stage driving device according to claim 8, characterized in that, The receiving groove is located on the side edge of the bearing surface.

10. The stage driving device according to claim 1, characterized in that, The first piezoelectric ceramic, the second piezoelectric ceramic, and the support member are all spaced apart from the stage.

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