High performance CMP multi-disk apparatus

Abstract

A system is disclosed herein that may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion extending between the first portion and a base of the pocket. A diameter of the second portion may be greater than a diameter of the first portion. The system may include a plurality of adjustment disks, wherein each adjustment disk sits within the first portion of a respective pocket. The system may include a plurality of washers, wherein each washer sits within the second portion of a respective pocket. The system may include a plurality of O-rings, each O-ring disposed between a peripheral edge of an adjustment disc of the plurality of adjustment discs and a lateral wall of a pocket of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and an adjustment disc.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit and priority of U.S. Patent Application No. 18 / 483,070, filed on October 9, 2023, entitled “HIGH PERFORMANCE CMP MULTIDISKAPPARATUS”, which is incorporated herein by reference in its entirety. Technical Field

[0003] This technology relates to semiconductor systems, processes, and facilities. More specifically, this technology relates to apparatus for polishing films deposited on a substrate. Background Technology

[0004] Integrated circuits are typically formed on a substrate by sequentially depositing conductive layers, semiconductor layers, and / or insulating layers on a silicon wafer. Various manufacturing processes utilize planarization of layers on the substrate between processing steps. For example, for some applications, such as polishing metal layers to form vias, plugs, and / or lines in trenches of patterned layers, the overlay is planarized until the top surface of the patterned layer is exposed. In other applications, such as planarizing dielectric layers for use in photolithography, the overlay is polished until the desired thickness remains above the underlying layer.

[0005] Chemical mechanical polishing (CMP) is a common planarization method. This planarization method typically requires mounting the substrate on a carrier head or polishing head. The exposed surface of the substrate is usually placed against a rotating polishing pad. The carrier head provides a controlled load on the substrate to push it against the polishing pad. An abrasive polishing slurry is typically supplied to the surface of the polishing pad.

[0006] Because polishing pads are used in CMP processes, the pads and their effectiveness can deteriorate. Therefore, a CMP process using worn polishing pads may take longer than one using new polishing pads. One solution might be to utilize new polishing pads; however, this can be expensive and inefficient. Another solution might be to repair the polishing pads. Current systems and methods can partially repair polishing pads, but may lack proper contact between the adjustment disc and the polishing pad to effectively repair it. Therefore, there is a need to develop systems and methods that provide better contact between the adjustment disc and the polishing pad. Summary of the Invention

[0007] The system may include a universal joint defining a plurality of recesses, each recess including a first portion and a second portion extending between the first portion and a base of the recess. The diameter of the second portion may be larger than the diameter of the first portion. The system may include a plurality of adjustment discs, each of the plurality of adjustment discs being seated within the first portion of a corresponding recess among the plurality of recesses. The system may include a plurality of washers, each washer being seated within the second portion of a corresponding recess among the one or more recesses. The system may also include a plurality of O-rings, each O-ring being disposed between a peripheral edge of one of the plurality of adjustment discs and a side wall of one of the plurality of recesses. The system may include a plurality of shouldered screws, each shouldered screw coupling the universal joint to one of the plurality of washers and one of the plurality of adjustment discs.

[0008] In some embodiments, each washer and each O-ring is compressible during the repair process, thereby allowing each of the plurality of adjusting discs to move within a corresponding recess in the plurality of recesses. The O-rings may be pre-compressed prior to the repair process. Each adjusting disc may substantially fill a first segment of a corresponding recess in the plurality of recesses. The plurality of recesses may be arranged radially about the central axis of the universal joint. The plurality of recesses may also be arranged at regular intervals about the central axis of the universal joint base. Each of the plurality of adjusting discs may be capable of moving independently of any other adjusting disc. Each of the plurality of adjusting discs may comprise one or both of stainless steel and diamond-containing materials. The plurality of O-rings may comprise chemically resistant materials. Each of the plurality of washers may comprise at least one of polyethylene foam and neoprene rubber. Each of the plurality of adjusting discs may comprise a diameter ranging from 17 mm to 24 mm (inclusive).

[0009] A method for adjusting a polishing pad may include positioning a universal joint of a pad adjustment system above the polishing pad, the universal joint being attached to a universal joint base with a plurality of adjusting discs, each adjusting disc disposed in a corresponding recess in the universal joint base and in contact with the polishing pad. The method may include rotating the universal joint relative to the polishing pad. The method may include at least partially repairing the polishing pad by removing material from the polishing pad via the adjusting discs.

[0010] In some embodiments, the edge of at least one of the plurality of adjusting discs may be tilted relative to a corresponding recess in the range of -1° to 1° (inclusive). One or more shouldered screws may be vertically movable relative to the gimbal base in response to movement of the corresponding adjusting disc. The gimbal base may include six adjusting discs arranged in six corresponding recesses, the recesses being spaced 60° apart around the central axis of the gimbal base. Each of the adjusting discs may be characterized by a diameter in the range of 17 mm to 24 mm (inclusive).

[0011] The pad adjustment system may include a gimbal base. The system may include a gimbal supported by the gimbal base and may include six corresponding recesses arranged at 60° intervals around the center of the gimbal. The system may include an adjustment disc disposed within a first corresponding recess of the six corresponding recesses, wherein the adjustment disc is tiltable relative to the gimbal within the first corresponding recess. In some embodiments, the adjustment disc may comprise diamond. The adjustment disc is attached to the gimbal by a shoulder screw. The adjustment disc is characterized by a diameter ranging from 17 mm to 24 mm (inclusive). Attached Figure Description

[0012] Figure 1 The illustration shows a universal support base with recesses according to some embodiments.

[0013] Figure 2 A bottom view of the universal support base with the adjustment disc set in the recess is shown.

[0014] Figure 3 The illustration shows a pad repair system and a polishing pad according to some embodiments.

[0015] Figure 4A The illustration shows a pad adjustment system with the adjustment pad in its original position according to some embodiments.

[0016] Figure 4B The illustration shows a pad adjustment system with the adjustment disc in a second position according to some embodiments.

[0017] Figure 5 The illustration shows a flowchart of a method for repairing a polishing pad according to certain embodiments.

[0018] Several of the accompanying drawings are included as schematic diagrams. It should be understood that these drawings are for illustrative purposes only and should not be considered as drawn to scale unless specifically stated otherwise. Furthermore, as schematic diagrams, these drawings are provided to aid understanding and may not include all aspects or information compared to realistic representations, and may include material exaggerated for illustrative purposes.

[0019] In the accompanying drawings, similar parts and / or features may have the same reference numerals. Furthermore, various parts of the same type can be distinguished by adding letters after the reference numerals to differentiate them. If only the first reference numeral is used in the specification, the description applies to any similar part having the same first reference numeral, regardless of the lettering. Detailed Implementation

[0020] Chemical mechanical polishing (CMP) is a critical component of some semiconductor manufacturing processes. After a film is deposited on a substrate, a slurry comprising chemicals and abrasives is applied to the substrate. The slurry can then be used to polish the substrate by rotating a polishing pad while it contacts the substrate, causing the chemicals and abrasives in the slurry to remove material from the film and / or the substrate. The polishing pad can be made of a fibrous material with an uneven surface. When the polishing pad is rotated, this uneven surface may help move the slurry on the substrate. However, during the CMP process, the polishing pad may wear or deteriorate. The surface of the polishing pad in contact with the substrate may become smoother and therefore no longer effectively move the slurry on the substrate. Therefore, CMP processes using worn polishing pads may take longer and / or result in uneven polishing of the substrate, leading to inconsistencies in the final semiconductor product.

[0021] However, worn polishing pads can be repaired to restore at least some of their previous properties. A repair process can be performed on the worn polishing pad, making its surface rougher and thus enabling more efficient slurry movement. During the repair process, a gimbal can be positioned above the worn polishing pad. The gimbal can include one or more adjusting discs seated within it. These adjusting discs can be made of stainless steel or another suitable metal, and at least one surface of the adjusting disc includes a diamond-containing material. The gimbal can then be lowered and rotated, causing the adjusting discs to grind the worn polishing pad. The gimbal allows the entire system to pivot and tilt in response to any uneven wear on the worn polishing pad. However, when the gimbal is tilted, one adjusting disc may apply greater pressure than the other. This pressure difference can lead to hot and cold spots on the worn pad, and uneven repair of the workpiece polishing pad. Furthermore, when the gimbal is tilted, the adjusting discs may apply uneven pressure along their diameter. For example, if the gimbal is tilted in a first direction (e.g., in response to the high point of the wear polishing pad in the direction opposite to the first direction), the adjustment disc can apply greater pressure on the edge of the adjustment disc corresponding to the first direction than on the edge corresponding to the opposite direction. This may result in more hot and cold spots, as well as uneven wear on the adjustment disc.

[0022] To address these issues, the system may include a universal joint supported by a universal joint base. The universal joint and / or the universal joint base may include a plurality of recesses (e.g., 3, 4, 6, etc.) evenly arranged around the center of the universal joint. An adjustment disc may be disposed in a corresponding recess among the plurality of recesses. A washer may be disposed in the corresponding recess between the universal joint and the adjustment disc. The washer may be made of rubber or another suitable material, such that the washer can be compressed and return to its original shape. An O-ring may be disposed within a channel around the circumference of the corresponding recess. The O-ring may also be made of rubber or another suitable material, such that the O-ring can be compressed and return to its original shape. The adjustment disc may be attached to the universal joint, such that the adjustment disc can tilt and / or move within the recess. Because the universal joint tilts during the repair process, the adjustment disc may also tilt (relative to the corresponding recess), thereby maintaining more uniform pressure with the abrasive polishing pad. When the gimbal returns to the neutral position, the adjusting disc may also return to the neutral position (relative to the corresponding recess), thereby maintaining more even pressure with the worn polishing pad. In other words, regardless of the gimbal's position, the adjusting disc can apply uniform pressure to the worn polishing pad throughout the repair process. Therefore, hot and cold spots on the worn polishing pad can be reduced or minimized, and the adjusting disc may wear more evenly. Consequently, worn polishing pads can be repaired more effectively.

[0023] Figure 1 The illustration shows a gimbal base 100 having recesses 114a to 114f according to some embodiments. The gimbal base 100 can be a component of a pad adjustment system for repairing worn polishing pads during a repair process. The gimbal base 100 may include a bottom surface 102, a top surface 104, and a side surface 106. During the repair process, the bottom surface 102 can be positioned toward the worn polishing pad. The top surface 104 may include holes 110a to 110f. The holes 110a to 110f can be configured to receive screws or other such fasteners to attach the gimbal base 100 to a gimbal. The side surface 106 may define the height of the gimbal base 100. This height can range from 6 mm to 15 mm (inclusive).

[0024] Recesses 114a to 114f may open at the bottom surface 102. Recesses 114a to 114f may be recessed volumes defined in the universal joint base 100, having a depth equal to or less than the height of the universal joint base 100. For example, the depth of recesses 114a to 114f may range from 5 mm to 14 mm (inclusive). Each recess 114a to 114f may also include a diameter ranging from 18 mm to 25 mm (inclusive). Each recess among recesses 114a to 114f may include mounting holes 124a to 124f and 134a to 134f extending through the top surface 104. For example, recess 114a may include mounting holes 124a to 124f and 134a to 134f. Although each of the recesses 114a to 114f is illustrated as having two mounting holes 124a to 124f and 134a to 134f, any number of mounting holes may be present (e.g., 3, 5, etc.). The mounting holes 124a to 124f and 134a to 134f may be configured to receive shouldered screws for attaching the adjustment disc to the universal joint and the universal joint base 100, such that the adjustment disc is positioned within the corresponding recess in the recesses 114a to 114f. In some embodiments, the shouldered screws or other fasteners may be arranged linearly (or a single fastener may be used) to facilitate tilting of the adjustment disc during repair operations.

[0025] The recesses 114a to 114f can be arranged at regular intervals around the central axis of the gimbal base 100. For example, the recesses 114a to 114f can be arranged at 60° intervals around the central axis of the gimbal base 100 with a constant radius. In other instances, the recesses 114a to 114f can be arranged at 60° intervals with different radii. In other instances, there may be only three recesses, which are arranged at 120° intervals with a constant or varying radius. In various embodiments, other numbers of recesses 114 may be provided.

[0026] Figure 2 The diagram shows a bottom view of the universal joint base 200, wherein adjustment discs 208a to 208f are disposed in recesses 214a to 214f. The universal joint base 200 can be coupled with... Figure 1 The universal bracket base 100 is similar and includes similar features and functionality. For example, adjustment discs 208a to 208f can be attached to the universal bracket base via mounting holes (e.g., mounting holes 124a to 124f and 134a to 134f) within each of the recesses 214a to 214f. As described above, each recess 214a to 214f ​​may include a diameter in the range of 18 mm to 25 mm. Therefore, the diameter of each adjustment disc 208a to 208f may be smaller than the diameter of the recesses 214a to 214f ​​(e.g., 17 mm to 24 mm, including end values).

[0027] Adjustment discs 208a to 208f can be made of stainless steel or any other suitable metal. The bottom surfaces of adjustment discs 208a to 208f, corresponding to the bottom surface 204 of the universal joint base 200, may include a diamond-containing material. When used in a repair process, the diamond-containing material may abrade the worn polishing pad, thereby repairing the worn polishing pad.

[0028] Since the adjusting discs 208a to 208f are disposed in the recesses 214a to 214f, the adjusting discs 208a to 208f can be arranged radially around the central axis of the universal joint base 404. The adjusting discs 208a to 208f can also be arranged at regular intervals around the central axis of the universal joint base. For example, the adjusting discs 208a to 208f can be arranged at 60° intervals around the central axis of the universal joint base 100 with a constant radius. In other examples, the adjusting discs 208a to 208f can be arranged at 60° intervals with different radii. In other examples, there may be only three recesses, which are arranged at 120° intervals with a constant or varying radius. Those skilled in the art will recognize many different possibilities and configurations.

[0029] Figure 3 The illustration shows a pad repair system 300 and a polishing pad 350 according to some embodiments. The pad repair system may include a universal joint 302 and a universal joint base 304. The universal joint base 304 can be coupled with… Figure 2 The universal bracket base 200 shown is similar. The universal bracket 302 can be secured by one or more screws, bolts, or other such fasteners (e.g., via...). Figure 1 The mounting holes 124a to 124f and 134a to 134f are attached to the universal bracket base 304. The universal bracket base 304 may include recesses 306a to 306b. Recesses 306a to 306b may include a bottom section having a first radius and a top section having a second radius. The bottom section of each recess 306a to 306b may be configured to receive adjustment discs 308a to 308b respectively. Therefore, the first radius may be larger than the radius of the corresponding adjustment discs 308a to 308b. The adjustment discs 308a to 308b may be made of stainless steel and include one or more surfaces having a diamond-containing material. The top section of the recesses 306a to 306b may be configured to receive washers 312a to 312b. The second radius may be larger than the first radius to allow the corresponding washer 312 seated therein to expand laterally when vertically compressed. Adjustment discs 308a to 308b and washers 312a to 312b can be attached to universal bracket 402 and / or universal bracket base 404 by means of shoulder screws 310a and 320a.

[0030] The bottom sections of recesses 306a to 306b may also include corresponding channels 307a to 307b surrounding the circumference of recesses 306a to 306b. For example, each channel 307a to 307b may be defined and / or otherwise formed within the radial or transverse sidewall of the corresponding recess 306. Each corresponding channel may accommodate O-rings 314a to 314b. O-rings 314a to 314b may be made of a rubber-containing material, polyethylene foam, polyurethane, or other suitable material. O-rings 314a to 314b may be made of a chemically resistant material. O-rings 314a to 314b may be characterized by a hardness between 60 and 80 (inclusive). When seated in channels 307a to 307b, O-rings 314a to 314b may each partially protrude into the recesses 306a to 306b. Therefore, when the adjusting discs 308a to 308b are inserted into the recesses 306a to 306b as part of the manufacturing process, the O-rings 314a to 314b may be partially compressed. Since the O-rings 314a to 314b may be partially compressed, lateral translation of the adjusting discs 308a to 308b can be limited or eliminated, while simultaneously preventing excessive wear on the universal bracket base 304 and / or the adjusting discs 308a to 308b by friction or other forces.

[0031] Washers 312a to 312b may be made of rubber-containing materials, polyethylene foam, vinyl foam, polyurethane, or any other suitable material. Washers 312a to 312b may be characterized in part by their hardness values ​​and / or compression ratios. For example, the hardness value of a rubber-containing material may be between 5 and 40 (inclusive). In another example, the compression ratio of polyethylene foam may be 4 psi for a 25% compression rate. Other compression ratios are also considered (e.g., 4 psi / 30% compression, 4 psi / 25% compression, 3 psi / 25% compression, etc.). In practice, washers 312a to 312b are made of a material that allows adjusting discs 308a to 308b to move vertically into recesses 306a to 306b.

[0032] For example, during the repair process, the adjusting disc 308a may be positioned such that its surface contacts the polishing pad 350. During the repair process, the adjusting disc may encounter non-uniformities on the polishing pad 350. Due to these non-uniformities, the adjusting disc 308a may tilt or otherwise move within the recess 306a. The washer 312a may then compress. When the adjusting disc 308a no longer encounters non-uniformities on the polishing pad 350, the washer 312a may expand, thereby forcing the adjusting disc back to its original position. Because each adjusting disc 308 can move independently, each adjusting disc 308 can apply more uniform pressure, thus repairing the polishing pad 350 more effectively. Furthermore, since the adjusting discs 308a to 308b are located within the corresponding recesses 306a to 306b, the movement of the adjusting disc 308a may not affect the movement of the adjusting disc 308b. In other words, each adjustment disc 308a to 308b can move independently of each other, thereby allowing each adjustment disc 308a to 308b to apply more uniform pressure during the repair process.

[0033] Figure 4A The illustration shows a pad adjustment system 400 with the adjustment disc 408 in its original position according to some embodiments. Figure 4B The illustration shows a pad adjustment system 400 with the adjustment disc 408 in a second position according to some embodiments. The pad adjustment system (“system”) 400 may be similar to the one described above. Figure 3 The system 300 described includes similar components and functionality. Therefore, system 400 may include a universal joint 402, a universal joint base 404, a recess 406, and a channel 407. An adjusting disc 408 and a washer 412 may be disposed within the recess 406. An O-ring 414 may be disposed within the channel 407 such that a portion of the O-ring 414 protrudes into the recess 406. The adjusting disc 408 and the washer 412 may be attached to the universal joint 402 and / or the universal joint base 404 by shoulder screws 410 and 420. The shoulder screws 410 and 420 may be allowed to move vertically in response to movement of the adjusting disc 408.

[0034] exist Figure 4A In this process, the adjusting disc 408 can be in its original position. The adjusting disc 408 protrudes from the recess 406 by a distance ranging from 1 mm to 4 mm (inclusive). The surface of the adjusting disc 408 protruding from the recess 406 may include a diamond-containing material. During the repair process, the surface including the diamond-containing material may be used with a polishing pad (e.g., Figure 3 The polishing pad 350 in the middle contacts and grinds the polishing pad, so that the polishing pad is repaired.

[0035] In its original position, the adjusting disc 408 can be substantially parallel to the universal joint base 404. The O-ring 414 can be positioned as described above. Figure 3The gasket 412 may also be pre-compressed (e.g., compressed to 5%, 10%, etc.). Therefore, when pressure is applied to the adjusting disc 408 to drive it into the recess 406, the gasket 412 may provide some resistance.

[0036] exist Figure 4B In this process, the left side of the adjusting disc 408 may be driven upward into the recess 406 (e.g., due to unevenness of the polishing pad encountered during the repair process). When the adjusting disc 408 is driven into the recess 406, the washer 412 may be vertically compressed. In response, the washer 412 may extend laterally into the recess 406. Furthermore, the shoulder screw 420 may move vertically to accommodate the movement of the adjusting disc 408. The shoulder screw 410 may also move vertically (or tilt) in response to the movement of the adjusting disc 408. When the adjusting disc 408 no longer encounters unevenness (e.g., the unevenness has worn away or the adjusting disc 408 has moved to another part of the polishing pad), the washer 412 may decompress, thereby applying force to the adjusting disc 408, causing the adjusting disc 408 to return to its original position.

[0037] although Figure 4B The adjustment disc 408 is shown tilted to the left, but other movements are also possible. For example, the adjustment disc 408 can be tilted to the right, causing the shoulder screw 410, instead of the shoulder screw 420, to be raised. The adjustment disc 408 can also be tilted forward or backward, and / or translated vertically within the recess 406, alternatively or alternatively. The adjustment disc 408 can also be moved vertically, thereby further compressing the O-ring 414. Those skilled in the art will recognize many different possibilities and configurations.

[0038] Figure 5 The illustration shows a flowchart of a method 500 for repairing a polishing pad according to certain embodiments. Method 500 may be performed by some or all of the systems and devices described herein (such as...). Figure 3 The method is executed by system 300 in Figure 300 and system 400 in Figure 4. Some steps in method 500 may be performed in a different order than described, or may be combined with other steps. In some embodiments, some steps may be skipped entirely.

[0039] At step 502, method 500 may include adjusting the pad (e.g., Figure 3 The gimbal of system 300 is positioned above a polishing pad (e.g., polishing pad 350). The gimbal may be attached to a gimbal base (e.g., gimbal 402 and gimbal base 404). The gimbal base may include a plurality of adjustment discs disposed in corresponding recesses within the gimbal base. The adjustment discs may contact the polishing pad. For example, the surface of the adjustment discs may include a diamond-containing material. This surface may contact the polishing pad.

[0040] In some embodiments, the gimbal base may include six adjusting discs arranged in six corresponding recesses. These six corresponding recesses may be spaced 60° apart around the central axis of the gimbal base. The adjusting discs may be fastened to the gimbal and / or the gimbal base by one or more shouldered screws. The one or more shouldered screws may be vertically movable relative to the gimbal base in response to movement of the adjusting discs. In some embodiments, the adjusting discs may be characterized by a diameter in the range of 17 mm to 24 mm (inclusive).

[0041] At step 504, method 500 may include a rotatable universal joint relative to the polishing pad. Since the adjusting discs are disposed in recesses included in the universal joint base, the adjusting discs can also rotate relative to the polishing pad. Furthermore, since each adjusting disc can move individually within its respective recess (e.g., system 400 in FIG. 4), each adjusting disc can provide more uniform pressure.

[0042] At step 506, method 50 may include repairing the polishing pad at least partially by removing material from the polishing pad via an adjustment disc. For example, the diamond-containing material of the adjustment disc may be in contact with the polishing pad. The material can be removed when the adjustment disc is rotated over the surface of the polishing pad. Thus, a worn polishing pad may be roughened and able to better hold the slurry during the CMP process.

[0043] In the foregoing description, numerous details have been set forth for illustrative purposes to facilitate understanding of various embodiments of the present technology. However, it will be apparent to those skilled in the art that certain embodiments may be implemented without some of these details or with additional details.

[0044] Given that several embodiments have been disclosed, those skilled in the art will recognize that various modifications, alternative constructions, and equivalents can be used without departing from the spirit of the embodiments. Furthermore, to avoid unnecessarily obscuring the present technology, many well-known processes and elements have not been described. Therefore, the above description should not be considered as limiting the scope of the present technology.

[0045] Where a numerical range is provided, it should be understood that, unless the context explicitly specifies otherwise, each intermediate value between the upper and lower limits of the range is also specifically disclosed, accurate to the smallest fraction of the lower limit unit. This encompasses any narrower range between any specified or unspecified intermediate value within the specified range and any other specified or intermediate value within that specified range. The upper and lower limits of such narrower ranges may be independently included or excluded from the range, and each range that includes, excludes, or includes both limits is also covered by the technique, provided that any explicitly excluded limits within the specified range are complied with. When a specified range includes one or both of these limits, it also includes ranges that exclude one or both of these limits.

[0046] As used herein and in the appended claims, unless the context clearly specifies otherwise, the singular forms “a”, “an”, and “the” include a plural reference. Thus, for example, a reference to “a heater” includes a plurality of such heaters, and a reference to “the protrusion” includes a reference to one or more protrusions and their equivalents known to those skilled in the art, etc.

[0047] Furthermore, when used in this specification and the following claims, the terms “comprise(s) / comprising,” “contain(s) / containing,” and “include(s) / including” are intended to specify the presence of the specified feature, integer, component, or operation, but they do not exclude the presence or addition of one or more other features, integers, components, operations, actions, or groups.

Claims

1. A system for adjusting a polishing pad, the system comprising: A universal bracket defining a plurality of recesses, wherein each recess includes a first portion and a second portion extending between the first portion and a base of the recess, wherein the diameter of the second portion is greater than the diameter of the first portion. A plurality of adjusting discs, wherein each of the plurality of adjusting discs is seated within the first portion of a corresponding recess in the plurality of recesses; A plurality of washers, wherein each washer is seated within the second portion of a corresponding recess in one or more recesses; Multiple O-rings, wherein each O-ring is disposed between the peripheral edge of one of the multiple adjusting discs and the lateral wall of one of the multiple recesses; as well as A plurality of shouldered screws, wherein each shouldered screw couples the universal joint to one of the plurality of washers and one of the plurality of adjustment discs.

2. The system of claim 1, wherein each washer and each O-ring are compressible during the repair process, thereby allowing each of the plurality of adjusting discs to move within a corresponding recess in the plurality of recesses.

3. The system of claim 2, wherein the O-ring is pre-compressed prior to the repair process.

4. The system of claim 1, wherein each adjusting disc substantially fills a first portion of a corresponding recess among the plurality of recesses.

5. The system of claim 1, wherein the plurality of recesses are arranged radially about the central axis of the universal joint.

6. The system of claim 5, wherein the plurality of recesses are arranged at regular intervals around the central axis of the universal bracket base.

7. The system of claim 1, wherein each of the plurality of adjustment discs is movable independently of any other adjustment disc.

8. The system of claim 1, wherein each of the plurality of adjustment discs comprises one or both of stainless steel and diamond-containing materials.

9. The system of claim 1, wherein the plurality of O-rings comprise a chemically resistant material.

10. The system of claim 1, wherein each of the plurality of washers comprises at least one of polyethylene foam and neoprene rubber.

11. The system of claim 1, wherein the diameter of each of the plurality of adjustment discs is in the range of 17 mm to 24 mm, including the end value.

12. A method for adjusting a polishing pad, the method comprising: The universal bracket of the pad adjustment system is positioned above the polishing pad. The universal bracket is attached to the universal bracket base. The universal bracket has multiple adjustment discs, each of which is disposed in a corresponding recess in the universal bracket base and contacts the polishing pad. The universal bracket rotates relative to the polishing pad; as well as The polishing pad is at least partially repaired by removing material from the polishing pad using the adjustment disc.

13. The method of claim 12, wherein the edge of at least one of the plurality of adjusting discs may be tilted relative to the corresponding recess in a range of -1° to 1°, the range including the end value.

14. The method of claim 12, wherein one or more shoulder screws move vertically relative to the universal joint base in response to movement of the corresponding adjustment disc.

15. The method of claim 12, wherein the universal support base includes six adjustment discs arranged in six corresponding recesses, the six corresponding recesses being arranged at 60° intervals around the central axis of the universal support base.

16. The method of claim 12, wherein each of the adjustment discs is characterized in that its diameter is in the range of 17 mm to 24 mm, the range including the end values.

17. A pad adjustment system, the pad adjustment system comprising; Universal bracket base; A universal bracket, supported by a universal bracket base and including six corresponding recesses, the six corresponding recesses being arranged at 60° intervals around the center of the universal bracket; and An adjustment disc is disposed in a first corresponding recess among the six corresponding recesses, wherein the adjustment disc is tiltable relative to the universal bracket within the first corresponding recess.

18. The pad adjustment system of claim 17, wherein the adjustment disc comprises diamond.

19. The pad adjustment system of claim 17, wherein the adjustment disc is attached to the universal joint by a shoulder screw.

20. The pad adjustment system of claim 17, wherein the adjustment disc is characterized in that its diameter is in the range of 17 mm to 24 mm, the range including the extreme values.

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