Polishing device for polishing semiconductor wafer

Abstract

According to the substrate polishing device, the occupied area for semiconductor wafer processing can be reduced. The polishing pad can be prevented from being affected by pollutants, and even in a limited space, all the components can smoothly operate without interference. A substrate loading / unloading position and a substrate polishing position are provided above a polishing table providing a polishing surface on which a polishing pad is mounted and a substrate is polished thereon. The polishing head alternately reciprocates between a substrate loading / unloading position and a substrate polishing position. At the substrate polishing position, the polishing head polishes the substrate on the polishing pad; in the substrate loading / unloading position, the polishing head exchanges the substrate with the substrate loading / unloading device. The polishing pad trimming arm is located below the substrate loading / unloading device and used for trimming the polishing pad. A substrate transfer device enters a space between the polishing head and the substrate loading / unloading device and exchanges substrates with the substrate loading / unloading device above the polishing table.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to the following Korean patent applications: Korean Patent Application Nos. 10-2023-0120760 and 10-2023-0120761, filed September 12, 2023; Korean Patent Application No. 10-2023-0124412, filed September 18, 2023; Korean Patent Application Nos. 10-2023-0133909 and 10-2023-0133914, filed October 9, 2023; Korean Patent Application No. 10-2023-0141588, filed October 21, 2023; and Korean Patent Application No. 10-2023-0141615, filed October 22, 2023; 20 The entire contents of the following Korean patent applications are incorporated herein by reference: Korean Patent Application No. 10-2023-0154891, filed on November 9, 2023; Korean Patent Application No. 10-2024-0030990, filed on March 4, 2024; Korean Patent Application No. 10-2024-0032396, filed on March 7, 2024; Korean Patent Application No. 10-2024-0038805, filed on March 21, 2024; Korean Patent Application No. 10-2024-0089299, filed on July 6, 2024; and Korean Patent Application No. 10-2024-0110148, filed on August 17, 2024. Invention Field

[0003] This invention relates to an apparatus and method for polishing a substrate during the manufacturing process of semiconductor devices.

[0004] Description of related technologies

[0005] Since substrate polishing equipment used for semiconductor substrates is typically installed in cleanroom environments, and cleanrooms have high construction and operating costs, a design with high space utilization efficiency is required to minimize the equipment's footprint. Therefore, the various components of the substrate polishing equipment, including the polishing table, one or more polishing heads, substrate loading / unloading devices, polishing pad dressing arms, and slurry supply arms, must be efficiently arranged within a limited space to avoid interference and ensure smooth operation.

[0006] Furthermore, accessibility should be fully considered to facilitate maintenance and upkeep by operators, and the design of the apparatus should protect the polishing pads from sources of contamination. Moreover, since substrate polishing equipment is capital-intensive, it is necessary to provide a structural design that helps reduce manufacturing costs. Invention Summary

[0007] According to one embodiment of the present invention, the substrate polishing apparatus includes a substrate polishing unit and a substrate conveying device for conveying a substrate to the substrate polishing unit. The substrate polishing unit includes: at least one polishing head; a polishing table configured to rotate about a first axis; a substrate polishing position on which a polishing pad is attached and polished by the at least one polishing head; a substrate loading / unloading position disposed above the polishing table; a substrate loading / unloading device disposed above the polishing table and configured to exchange substrates with the at least one polishing head at the substrate loading / unloading position; and a polishing pad trimming arm disposed below the substrate loading / unloading device and configured to trim the polishing pad. The at least one polishing head is movable between the substrate polishing position and the substrate loading / unloading position, thereby polishing the substrate at the substrate polishing position and exchanging substrates with the substrate loading / unloading device at the substrate loading / unloading position. The substrate processor of the substrate conveying device is configured to enter the space between the at least one polishing head and the substrate loading / unloading device and exchange substrates with the substrate loading / unloading device above the polishing table.

[0008] In one embodiment, the at least one polishing head is configured to move linearly along a linear guide to reciprocate between the substrate loading / unloading position and the substrate polishing position.

[0009] In another embodiment, the at least one polishing head is configured to rotate about a second axis to move between the substrate polishing position and the substrate loading / unloading position. The first axis and the second axis may be aligned with each other. The distance between the first axis and the second axis may be equal to or less than half the distance between the edge of the polishing table and the fence disposed along the periphery of the polishing table.

[0010] In one embodiment, the substrate loading / unloading device includes a sidewall extending upward from the base, the sidewall having an opening through which the substrate processor can enter.

[0011] In the above embodiment, the pivot axis of the polishing pad trimming arm can be located outside the polishing table, and its position is closer to virtual plane D than virtual plane C relative to virtual plane D. Virtual plane C includes the substrate polishing position and is perpendicular to virtual plane A, which includes the substrate polishing position and the substrate loading / unloading position. Virtual plane D is parallel to virtual plane C and is the virtual plane closest to virtual plane C among the virtual planes adjacent to the polishing table. The end of the polishing pad trimming arm can be located between virtual plane G and virtual plane F, wherein virtual plane G includes the substrate loading / unloading position and is perpendicular to virtual plane A, while virtual plane F is parallel to virtual plane G and is the virtual plane closest to virtual plane G among the virtual planes adjacent to the polishing table.

[0012] In this embodiment, the pivot axis of the polishing slurry supply arm can be located outside the polishing table, on the side opposite to the pivot axis of the polishing pad dressing arm relative to virtual plane A. The pivot axis of the polishing slurry supply arm can be located between virtual plane E and virtual plane K, wherein virtual plane E is located at the midpoint between virtual plane C and virtual plane D, and virtual plane K is parallel to virtual plane D and located across virtual plane D and on the opposite side relative to virtual plane C. The end of the polishing slurry supply arm can be located between virtual plane B and virtual plane C, on the side opposite to the polishing pad dressing arm relative to virtual plane A, wherein virtual plane B includes the rotation axis of the polishing table and is perpendicular to virtual plane A.

[0013] In this embodiment, the pivot axes of the polishing pad trimming arm and the polishing slurry supply arm are arranged opposite to each other relative to the virtual plane A, and are located between the virtual plane C and the virtual plane K.

[0014] According to another embodiment, the substrate loading / unloading device is arranged near the first surface of the circumscribed tetrahedron that contacts the polishing table and is located in the area above the polishing table defined by the polishing table, and the substrate transfer device is configured to exchange substrates with the substrate loading / unloading device through the first surface.

[0015] In one embodiment, at least a portion of the vertical axis of the substrate loading / unloading device may be disposed in the space between the circumscribed tetrahedron and the polishing stage, and adjacent to the first vertex adjacent to the first surface.

[0016] In one embodiment, at least a portion of the vertical axis of the polishing pad trimming arm may be disposed in the space between the circumscribed tetrahedron and the polishing table, and adjacent to the second vertex adjacent to the first surface.

[0017] In one embodiment, at least a portion of the vertical axis of the polishing slurry supply arm may be disposed in the space between the circumscribed tetrahedron and the polishing table, and adjacent to the fourth vertex of the circumscribed tetrahedron, the fourth vertex being located on the opposite side of the second vertex relative to the axis of rotation of the polishing table.

[0018] In one embodiment, the substrate polishing unit may further include a polishing pad dressing cleaning station, at least a portion of the vertical axis of the cleaning station being disposed in the space between the circumscribed tetrahedron and the polishing table, and adjacent to the third vertex of the circumscribed tetrahedron, wherein the third vertex is located on the opposite side of the first vertex relative to the rotation axis of the polishing table.

[0019] According to another embodiment, the substrate transfer device exchanges substrates with the substrate loading / unloading device via a first surface of a virtual tetrahedron surrounding the polishing stage, while the polishing pad trimming arm is disposed between a second surface sharing an edge with the first surface and the polishing stage. The pivot axis of the polishing pad trimming arm is disposed between virtual plane B and virtual plane C, wherein virtual plane C includes the substrate polishing position and is perpendicular to virtual plane A, which includes both the substrate polishing position and the substrate loading / unloading position, while virtual plane B includes the rotation axis of the polishing stage and is parallel to virtual plane C. In the parking position, the end of the polishing pad trimming arm is disposed between the first surface and virtual plane G, wherein virtual plane G is perpendicular to virtual plane A and includes the substrate polishing position.

[0020] In this embodiment, the pivot axis of the polishing slurry supply arm is disposed within the space defined by the third surface opposite to the first surface, the fourth surface opposite to the second surface, the virtual plane A, the virtual plane C, and the polishing table. In the parked position, the end of the polishing slurry supply arm is disposed within the space defined by the virtual plane B, the virtual plane C, the fourth surface, and the polishing table.

[0021] In this embodiment, the substrate transfer device exchanges substrates with the substrate loading / unloading device via a fourth surface of a virtual tetrahedron surrounding the polishing table. The pivot axis of the polishing pad trimming arm is disposed within a space defined by a first surface sharing an edge with the fourth surface, a second surface opposite the fourth surface, virtual plane A, virtual plane B, and the polishing table, and its position is closer to the first surface relative to virtual plane B. The pivot axis of the polishing slurry supply arm is disposed within a space defined by the second surface, a third surface opposite the first surface, virtual plane B, virtual plane A, and the polishing table, and its position is closer to the third surface relative to virtual plane B, and closer to virtual plane A relative to the second surface.

[0022] In one embodiment of the present invention, the substrate polishing apparatus can operate in a first polishing mode and a second polishing mode. In the first polishing mode, a first polishing head polishes the substrate on a polishing pad, while a second polishing head exchanges substrates with a substrate loading / unloading device disposed above the polishing pad. The substrate processor of the substrate transfer device enters the space between the second polishing head and the substrate loading / unloading device to perform the substrate exchange, and a polishing pad trimming arm trims the polishing pad below the substrate loading / unloading device. In the second polishing mode, the second polishing head polishes the substrate on a polishing pad, while the first polishing head exchanges substrates with a substrate loading / unloading device disposed above the polishing pad. The substrate processor enters the space between the first polishing head and the substrate loading / unloading device to perform the substrate exchange, and the polishing pad trimming arm trims the polishing pad below the substrate loading / unloading device. The switch from the first polishing mode to the second polishing mode is achieved by first moving the first polishing head vertically to a position higher than the combined height of the polishing pad trimming arm and the substrate loading / unloading device, and then moving the first polishing head horizontally to a position above the substrate loading / unloading device.

[0023] In one embodiment of the present invention, the substrate polishing unit includes: a polishing table with a polishing pad and a polishing surface for polishing a substrate; a polishing head configured to polish the substrate on the polishing pad; a substrate loading / unloading device disposed above the polishing surface and configured to move vertically to exchange substrates with the polishing head; and a polishing head cleaning unit disposed around the substrate loading / unloading device and configured to clean the polishing head. The substrate loading / unloading device is configured to move vertically relative to the polishing head cleaning unit.

[0024] In another embodiment of the present invention, the substrate polishing unit includes: a polishing table with a polishing pad and a polishing surface for polishing the substrate; a substrate polishing position disposed on the polishing surface; a substrate loading / unloading device disposed above the polishing surface; a polishing pad trimming arm disposed below the substrate loading / unloading device and configured to trim the polishing pad; and a polishing head configured to pick up a substrate from the substrate loading / unloading device, move it horizontally, and then descend vertically to polish the substrate at the substrate polishing position. The vertical descent distance of the polishing head is greater than the combined height of the polishing pad trimming arm and the substrate loading / unloading device.

[0025] In one embodiment of the present invention, the substrate polishing unit includes: a polishing table with a polishing pad and a polishing surface for polishing a substrate; a housing disposed above the polishing surface; a polishing head assembly supported by the housing; a substrate loading / unloading device disposed between the housing and the polishing surface; and a polishing pad trimming arm including a polishing pad trimmer disposed between the substrate loading / unloading device and the polishing surface and configured to trim the polishing pad. The polishing head assembly includes a polishing head vertical shaft, a rotary joint configured to supply fluid to the polishing head vertical shaft, a polishing head rotation drive device configured to drive the polishing head vertical shaft to rotate, and a polishing head connected to the lower end of the polishing head vertical shaft. The height of the housing is greater than the sum of the height of the rotary joint, the length of the polishing head vertical shaft, the height of the substrate loading / unloading device, and the height of the polishing pad trimming arm.

[0026] In one embodiment of the present invention, the substrate polishing unit includes: a polishing table with a polishing pad and providing a polishing surface; a substrate polishing position disposed on the polishing surface; a substrate loading / unloading device disposed above the polishing surface; at least one polishing head configured to pick up a substrate from the substrate loading / unloading device, move the substrate to the substrate polishing position, polish the substrate on the polishing surface, and return the substrate to the substrate loading / unloading device; and a shielding plate disposed between the substrate loading / unloading device and the polishing pad, the shielding plate being configured to block particles or cleaning water falling from the substrate loading / unloading device onto the polishing pad.

[0027] In this embodiment, the shielding plate may include a first shielding plate and a vertical shielding plate extending upward from the first shielding plate, wherein the vertical shielding plate is configured to at least partially block the space between the substrate loading / unloading device and the substrate polishing position.

[0028] In this embodiment, the shielding plate may further include a second shielding plate extending above the substrate polishing position. The first shielding plate is disposed in the space between the substrate loading / unloading device and the polishing table, and the second shielding plate is disposed above the first shielding plate and above the substrate polishing position, with the vertical shielding plate blocking the space between the first and second shielding plates. The second shielding plate may include a through-hole through which the polishing head can move upward from the substrate polishing position to the space above the second shielding plate, and then move towards the substrate loading / unloading device via the space above.

[0029] In this embodiment, filtered clean air can be supplied to the space defined between the second shielding plate and the polishing pad.

[0030] In one embodiment of the present invention, the substrate polishing unit includes: a polishing table with a polishing pad and a polishing surface for polishing the substrate; a substrate loading / unloading device configured to reciprocate between a first and a second substrate loading / unloading position; a first polishing head configured to move vertically between the first polishing position and the first substrate loading / unloading position to polish the substrate at the first polishing position and exchange substrates with the substrate loading / unloading device at the first substrate loading / unloading position; a second polishing head configured to move vertically between the second polishing position and the second substrate loading / unloading position to polish the substrate at the second polishing position and exchange substrates with the substrate loading / unloading device at the second substrate loading / unloading position; and a polishing pad trimming arm disposed below the substrate loading / unloading device and configured to trim the polishing pad. The substrate loading / unloading device reciprocates between the first and second substrate loading / unloading positions by rotating about a rotation axis, and the rotation axis may coincide with the rotation axis of the polishing table.

[0031] In one embodiment, the substrate loading / unloading device includes a nozzle configured to spray cleaning water toward the polishing head and a drain configured to discharge the cleaning water. The drain moves with the substrate loading / unloading device and is configured to discharge the cleaning water into the space between the polishing table and a fence surrounding the polishing table.

[0032] In one embodiment, the substrate polishing unit further includes an polishing slurry supply arm configured to supply polishing slurry to the first and second polishing slurry supply positions. The polishing slurry supply arm is disposed on a side opposite to the polishing pad trimming arm, the relative relationship being based on a virtual plane located between the first and second substrate polishing positions. The polishing slurry supply arm may include a first and a second polishing slurry supply arm respectively disposed on both sides of a virtual plane including the axis of the polishing pad trimming arm and the axis of the polishing stage. The first polishing slurry supply arm is configured to supply polishing slurry to a first polishing slurry supply position near the first polishing head, and the second polishing slurry supply arm is configured to supply polishing slurry to a second polishing slurry supply position near the second polishing head.

[0033] In one embodiment, the axis of the polishing pad trimming arm is configured to move along a linear guide between a first and a second trimming position. The polishing pad trimming arm trims the polishing pad at the first trimming position below the first polishing head and the substrate loading / unloading device, and trims the polishing pad at the second trimming position below the second polishing head and the substrate loading / unloading device.

[0034] In this embodiment, a polishing pad trimmer cleaning station is provided near the guide rail. When the axis of the polishing pad trimmer arm moves close to the first trimmer position, the polishing pad trimmer arm can rotate to move the polishing pad trimmer suspended at its end into the polishing pad trimmer cleaning station.

[0035] The substrate polishing unit is configured to perform a first and a second polishing mode. In the first polishing mode, the first polishing head is configured to exchange substrates with the base of the substrate loading / unloading device at the first substrate loading / unloading position, the second polishing head is configured to polish the substrate at the second polishing position, the polishing pad trimming arm is configured to trim the polishing pad below the first polishing head and the base of the substrate loading / unloading device, and the polishing slurry supply arm is configured to supply polishing slurry to the second polishing slurry supply position. In the second polishing mode, the second polishing head is configured to exchange substrates with the base of the substrate loading / unloading device at the second substrate loading / unloading position, the first polishing head is configured to polish the substrate at the first polishing position, the polishing pad trimming arm is configured to trim the polishing pad below the second polishing head and the base of the substrate loading / unloading device, and the polishing slurry supply arm is configured to supply polishing slurry to the first polishing slurry supply position.

[0036] In this embodiment, the polishing slurry supply arm may include a first polishing slurry supply arm and a second polishing slurry supply arm, wherein the first polishing slurry supply arm is configured to supply slurry to a first polishing slurry supply position, and the second polishing slurry supply arm is configured to supply slurry to a second polishing slurry supply position.

[0037] In this embodiment, the polishing table is configured to rotate in a first direction during a first polishing mode and to rotate in a direction opposite to the first direction during a second polishing mode.

[0038] In this embodiment, the polishing pad trimming arm may include a first polishing pad trimming arm and a second polishing pad trimming arm. The axis of the first polishing pad trimming arm is disposed on the outside of the polishing table near the first polishing head and adjacent to a virtual plane A containing the first and second substrate loading / unloading positions; the axis of the second polishing pad trimming arm is disposed on the outside of the polishing table near the second polishing head and also adjacent to the virtual plane A. When the first polishing head is located at the substrate loading / unloading device and the second polishing head is polishing the substrate, the first polishing pad trimming arm is configured to rotate about its axis below the substrate loading / unloading device to trim the polishing pad. When the second polishing head is located at the substrate loading / unloading device and the first polishing head is polishing the substrate, the second polishing pad trimming arm is configured to rotate about its axis below the substrate loading / unloading device to trim the polishing pad.

[0039] In this embodiment, the substrate polishing unit may include first and second polishing slurry supply arms. The first polishing slurry supply arm is configured to supply slurry to a first polishing slurry supply position when the first polishing head polishes the substrate, and the second polishing slurry supply arm is configured to supply slurry to a second polishing slurry supply position when the second polishing head polishes the substrate. The first and second polishing slurry supply positions are arranged opposite each other with the rotation axis of the polishing table as the center. The axis of the first polishing slurry supply arm may be located near the axis of the first polishing pad dressing arm, and the axis of the second polishing slurry supply arm may be located near the axis of the second polishing pad dressing arm.

[0040] Brief description of the attached figures

[0041] Figure 1 This is a side view of a substrate polishing unit according to an embodiment of the present invention, showing the structure of the substrate polishing unit and its operating state.

[0042] Figures 2(a) and 2(b) are side views of a substrate polishing unit according to an embodiment of the present invention, showing a first polishing mode and a second polishing mode of the substrate polishing unit.

[0043] Figure 3This is a side view of a substrate polishing apparatus according to an embodiment of the present invention, showing the state in which the substrate transfer unit transports the substrate to the substrate loading / unloading device.

[0044] Figure 4 This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing the substrate loading / unloading position.

[0045] Figure 5 This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing the positions of the polishing pad trimming arm and the polishing slurry supply arm.

[0046] Figure 6 This is a side view of a substrate polishing module according to an embodiment of the present invention, showing the structure of the substrate polishing module.

[0047] Figures 7(a) to 7(c) This is a top view showing the operation process of a substrate polishing module according to an embodiment of the present invention.

[0048] Figure 8 This is a top view of a substrate polishing module with a shielding plate according to an embodiment of the present invention.

[0049] Figure 9(a) is a top view of a substrate polishing unit according to an embodiment of the present invention, and Figure 9(b) is a side view thereof.

[0050] Figure 10(a) is a cross-sectional view of a polishing head assembly according to an embodiment of the present invention, and Figure 10(b) is a perspective view of the substrate loading / unloading device shown in Figure 10(a).

[0051] Figure 11 This is a top view of a substrate polishing unit according to an embodiment of the present invention.

[0052] Figure 12 This is a side view of a substrate polishing unit according to an embodiment of the present invention.

[0053] Figure 13 This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing the... Figure 5 Polishing pad trimming arms and polishing fluid supply arms are positioned at different locations.

[0054] Figure 14(a) is a vertical cross-sectional view of a substrate loading / unloading device according to an embodiment of the present invention, and Figure 14(b) is a top cross-sectional view thereof.

[0055] Figures 15(a) to 15(f) This is a side cross-sectional view of the process by which a substrate loading / unloading device attaches a substrate to a polishing head, as shown sequentially according to an embodiment of the present invention.

[0056] Figure 16This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing a substrate loading / unloading device.

[0057] Figure 17 yes Figure 16 Side view of the substrate polishing unit shown.

[0058] Figure 18 This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing the positions of the polishing pad trimming arm, the substrate loading / unloading device, and the polishing slurry supply arm.

[0059] Figure 19 This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing the... Figure 5 Polishing pad trimming arms, substrate loading / unloading devices, and polishing slurry supply arms are located in different positions.

[0060] Figure 20 yes Figure 19 Side view of the substrate polishing unit shown.

[0061] Figure 21 This is a top view of a substrate polishing apparatus according to an embodiment of the present invention.

[0062] Figure 22 This is a top view of a substrate polishing unit according to an embodiment of the present invention, showing the... Figure 19 Polishing pad trimming arms, substrate loading / unloading devices, and polishing slurry supply arms are located in different positions.

[0063] Figure 23 yes Figure 22 Side view of the substrate polishing unit shown.

[0064] Figure 24 This is a side cross-sectional view of a substrate polishing unit according to an embodiment of the present invention.

[0065] Figure 25 yes Figure 24 A three-dimensional view of the substrate polishing unit shown.

[0066] Figure 26 This is a top view of a substrate polishing unit provided with a shielding plate according to an embodiment of the present invention.

[0067] Figure 27 yes Figure 26 The side cross-sectional view of the substrate polishing unit shown.

[0068] Figure 28 This is a side cross-sectional view of a substrate polishing unit according to an embodiment of the present invention.

[0069] Figure 29 This is a side cross-sectional view of a substrate polishing unit according to an embodiment of the present invention.

[0070] Figures 30(a) and 30(b) are top views of a substrate polishing unit according to an embodiment of the present invention.

[0071] Figures 31(a) and 31(b) are top views of a substrate polishing unit according to an embodiment of the present invention.

[0072] Figure 32 This is a top view of a substrate polishing unit according to an embodiment of the present invention.

[0073] Detailed description

[0074] The following embodiments are primarily based on Korean Patent Application No. 10-2023-0120760, which serves as the priority basis for this application, and may also be referenced to other Korean patent applications.

[0075] See Figure 1 The following describes a substrate polishing unit 500 according to an embodiment of the present invention. Figure 1 This is a side view of the substrate polishing unit 500, including a cross-sectional view. The substrate polishing unit 500 includes a frame 140, a polishing head drive unit 1, a substrate loading / unloading device 50, and a polishing table 10. The substrate polishing unit 500 includes a substrate loading / unloading position 30 and a substrate polishing position 32. The substrate loading / unloading position 30 is the position where the polishing heads 20a and 20b exchange substrates with the substrate loading / unloading device 50. The substrate polishing position 32 is the position of the polishing heads 20a and 20b when the substrate W is polished on the polishing pad 11.

[0076] The polishing head drive unit 1 includes a housing 100 and at least one polishing head assembly, namely, first and second polishing head assemblies 110a and 110b. The housing 100 is a structure that supports the first and second polishing head assemblies 110a and 110b. The housing 100 rotates about axis 2.

[0077] The substrate loading / unloading device 50 is a device for attaching the substrate W to the polishing heads 20a and 20b and receiving the substrate W detached from the polishing heads 20a and 20b, and it is disposed between the lower part of the housing 100 and the polishing table 10. The polishing table 10 rotates about the vertical axis 12, and a polishing pad 11 is attached to its upper surface, thereby providing a polishing surface for polishing the substrate.

[0078] The substrate W is placed on the base 54 of the substrate loading / unloading device 50. The base 54 is connected to the vertical drive device 53 via a vertical shaft 52. The vertical drive device 53 drives the vertical shaft 52 to move vertically, thereby allowing the substrate W on the base 54 to adhere to the polishing heads 20a and 20b. The vertical shaft 52 of the substrate loading / unloading device 50 can be disposed in the space between the polishing table 10 and the enclosure 14 surrounding the polishing table 10. The enclosure 14 is disposed around the polishing table 10 to prevent polishing fluid from splashing outside the enclosure 14.

[0079] The housing 100 houses the first and second polishing head assemblies 110a and 110b. Each polishing head assembly 110a and 110b includes polishing heads 20a and 20b, polishing head shafts 21a and 21b, and rotary drive devices 22a and 22b. The rotary drive devices 22a and 22b drive the polishing head shafts 21a and 21b to rotate, thereby causing the polishing heads 20a and 20b to rotate about vertical axes 27a and 27b. The lower part of the housing 100 is provided with two through holes 104a and 104b. Each polishing head shaft 21a and 21b passes downward through the corresponding through holes 104a and 104b, and its lower end is connected to the polishing head 20a and 20b, respectively.

[0080] The polishing head drive unit 1 is configured to reciprocate polishing heads 20a and 20b between a substrate loading / unloading position 30 and a substrate polishing position 32. This reciprocating movement is achieved by a horizontal rotational motion 20h and a vertical movement 20v of the polishing heads 20a and 20b. The horizontal rotational motion 20h of the polishing heads 20a and 20b is achieved by a housing rotation drive device 114. A housing support member 112 is connected to the upper surface of the housing 100. The rotation drive device 114 rotates the housing support member 112 about the housing axis 2, thereby causing the first and second polishing heads 20a and 20b supported by the housing 100 to move horizontally about the housing axis 2.

[0081] To achieve a vertical movement of 20v in the polishing heads 20a and 20b, the substrate polishing unit 500 includes servo motors 23a and 23b, ball screws 24a and 24b, and nuts 25a and 25b. Nuts 25a and 25b are fixed to the rotation drive devices 22a and 22b of the polishing head assemblies 110a and 110b. When the servo motors 23a and 23b are driven, the ball screws 24a and 24b rotate, thereby driving the polishing head assemblies 110a and 110b connected to the nuts 25a and 25b to move vertically by 20v.

[0082] When polishing the substrate at the substrate polishing position 32, polishing heads 20a and 20b are designed to perform a linear reciprocating (oscillating) motion 20s in the horizontal direction. The lower ends of ball screws 24a and 24b are fixed to horizontal plates 18a and 18b via fixing parts 26a and 26b. The horizontal plates 18a and 18b are connected to the lower linear guide rails 19a and 19b via guide blocks 17, allowing them to move horizontally. The upper ends of ball screws 24a and 24b are connected to linear guide rails 16a and 16b fixed to the upper part of the housing 100 via guide blocks 17, allowing them to move horizontally. Polishing head shafts 21a and 21b are connected to the horizontal plates 18a and 18b, allowing them to move vertically and rotary. The linear reciprocating motion of polishing heads 20a and 20b is achieved by the linear drive devices 28a and 28b causing the horizontal plates 18a and 18b to perform linear reciprocating motion.

[0083] The substrate polishing unit 500 also includes a polishing pad trimming arm 70, which is disposed between the substrate loading / unloading device 50 and the polishing table 10, for trimming the polishing pad 11. The polishing pad trimming arm 70 moves above the polishing pad 11, and a polishing pad trimmer 74 suspended at its end trims the polishing pad 11.

[0084] exist Figure 1 In this configuration, the first polishing head 20a is located at the substrate loading / unloading position 30, and the second polishing head 20b is located at the substrate polishing position 32. The substrate loading / unloading position 30 is positioned between the polishing table 10 and the housing 100, and is aligned with the axis 27a of the first polishing head 20a. The substrate polishing position 32 is positioned near the polishing pad 11 and is aligned with the axis 27b of the second polishing head 20b. This configuration corresponds to the first mode shown in FIG. 2(a).

[0085] Referring to FIG2, the polishing process of a first mode and a second mode according to an embodiment of the present invention is described below. FIG2(a) and FIG2(b) are side cross-sectional views showing the first mode and the second mode of the substrate polishing unit 500, respectively. In the first mode shown in FIG2(a), the first polishing head 20a is located at the substrate loading / unloading position 30 and exchanges substrate W with the base 54 of the substrate loading / unloading device 50, while the second polishing head 20b is located at the substrate polishing position 32 and polishes the substrate W. The axis 27a of the first polishing head 20a passes through the substrate loading / unloading position 30, and the axis 27b of the second polishing head 20b passes through the substrate polishing position 32. The polishing pad trimming arm 70 trims the polishing pad 11 below the substrate loading / unloading device 50.

[0086] In the second mode shown in Figure 2(b), the second polishing head 20b is located at the substrate loading / unloading position 30, where it exchanges substrate W with the base 54 of the substrate loading / unloading device 50, while the first polishing head 20a is located at the substrate polishing position 32, where it polishes substrate W. The axis 27b of the second polishing head 20b passes through the substrate loading / unloading position 30, and the axis 27a of the first polishing head 20a passes through the substrate polishing position 32. The polishing pad trimming arm 70 trims the polishing pad 11 below the substrate loading / unloading device 50.

[0087] The process of switching from the first mode to the second mode can be achieved by the following steps: raising the second polishing head 20b from the polishing position 32 to a height at least above the substrate loading / unloading position 30; rotating the first and second polishing heads 20a and 20b about the housing axis 2 by 180°; and then lowering the first polishing head 20a to the substrate polishing position 32.

[0088] During the polishing process in the first and second modes, the polishing pad trimmer 74 can trim the surface of the polishing pad 11 attached to the polishing table 10 from below the base 54 of the substrate loading / unloading device 50.

[0089] Figure 3 This is another side cross-sectional view of the substrate polishing unit 500. See also Figure 3 When the substrate transporter 42 of the substrate transport device 40 exchanges substrates W with the base 54 of the substrate loading / unloading device 50, the polishing head 20a can be raised to a substrate exchange position 30' higher than the substrate loading / unloading position 30. The substrate transporter 42 exchanges substrates W between the polishing head 20a located at the substrate exchange position 30' and the base 54 of the substrate loading / unloading device 50. Alternatively, instead of raising the polishing head 20a to the substrate exchange position 30', the base 54 of the substrate loading / unloading device 50 can be lowered, thereby creating a space between the polishing head 20a and the base 54 for the substrate transporter 42 to enter.

[0090] See Figure 1The substrate polishing unit 500 may further include a polishing head cleaning unit 60. The polishing head cleaning unit 60 is configured to surround the base 54 of the substrate loading / unloading device 50. The polishing head cleaning unit 60 includes a sidewall 62 extending upward from the edge of the base 61. A drain outlet 66 is provided at the bottom of the base 61 of the polishing head cleaning unit 60. The drain outlet 66 faces the space between the polishing table 10 and the guardrail 14. The vertical axis 52 of the substrate loading / unloading device 50 may be disposed within the drain outlet 66. The base 61 of the polishing head cleaning unit 60 may be fixed to a frame 140 outside the polishing table 10. The base 54 of the substrate loading / unloading device 50 may move vertically independently relative to the polishing head cleaning unit 60 to exchange substrates W with the polishing heads 20a, 20b.

[0091] The polishing head cleaning unit 60 may further include a sidewall 62 surrounding the polishing heads 20a and 20b. A deionized water (DI water) supply nozzle 64 is provided on the sidewall 62. When the polishing head 20 is stationary at the substrate loading / unloading device 50, DI water can be sprayed through the DI water supply nozzle 64 to clean the polishing head 20.

[0092] See Figure 4 The diagram shows a substrate loading / unloading position 30 and a substrate polishing position 32 according to an embodiment of the present invention. Figure 4 The diagram illustrates the position of the substrate W when the first and second polishing heads 20a and 20b are located at substrate polishing position 32 and substrate loading / unloading position 30, respectively. (See attached diagram.) Figure 1 As shown in Figure 2, the substrate polishing position 32 and the substrate loading / unloading position 30 are respectively arranged along the axes 27a and 27b of the polishing heads 20a and 20b. The center of the substrate W attached to the polishing heads 20a and 20b is also aligned with the axes 27a and 27b.

[0093] exist Figure 4 In the top view, the substrate polishing position 32 and the substrate loading / unloading position 30 are arranged opposite each other with the axis 12 of the polishing table 10 as the center. The axis 27a of the first polishing head 20a, the axis 12 of the polishing table 10, and the axis 2 of the housing 100 are all located on the same axis. Figure 4 (Not shown in the diagram) and the axis 27b of the second polishing head 20b can be arranged in the order described above. In one embodiment, the axis 2 of the housing 100 can be aligned with the axis 12 of the polishing table 10. In another embodiment, the axis 2 of the housing 100 can be disposed around the axis 12 of the polishing table 10, and the distance between it and the axis 12 of the polishing table does not exceed x / 2. The axis 2 of the housing 100 can be disposed within a circle 38 with a radius of x / 2, where x is the shortest distance between the polishing table 10 and the guardrail 14. The x can correspond to the shortest distance between the polishing table 10 and the guardrail 14 at the position closest to the substrate loading / unloading position 30.

[0094] In one embodiment, the substrate loading / unloading position 30 may be configured such that the substrate W does not extend beyond the perimeter of the fence 14 when in this position. Furthermore, when the substrate W is in the substrate loading / unloading position 30, its center (27b) may be located within the range of the polishing stage 10.

[0095] Reference Figure 5 The arrangement of the polishing pad trimming arm 70 and the polishing slurry supply arm 80 in a substrate polishing unit 500 according to an embodiment of the present invention will be described using virtual planes A, B, C, D, E, F, G, and K. Figure 5 In the plan view, planes A, B, C, D, E, F, G and K are represented by straight lines, and the polishing pad dressing arm 70 and the polishing fluid supply arm 80 are in their respective parking positions.

[0096] Plane A includes the substrate loading / unloading position 30, the substrate polishing position 32, and the axis 12 of the polishing stage 10, and is perpendicular to the polishing stage 10. Planes B, C, D, E, F, G, and K are all perpendicular to plane A. Plane B passes through the axis 12 of the polishing stage 10, and plane C passes through the substrate polishing position 32. Plane G passes through the substrate loading / unloading position 30. Plane D contains the tangent of the polishing stage 10 closest to the substrate polishing position 32, and plane F contains the tangent of the substrate loading / unloading position 30 closest to the substrate loading / unloading position 30. Plane E is located between planes C and D. Plane K is located on the opposite side of plane C, with plane D as the intermediate plane.

[0097] The polishing pad dressing arm 70 and the polishing slurry supply arm 80 are arranged opposite each other with plane A as the axis of symmetry. The rotation axis 72 of the polishing pad dressing arm 70 and the rotation axis 82 of the polishing slurry supply arm 80 are located on opposite sides of plane A, and are arranged between plane C and plane K. The rotation axis 72 of the polishing pad dressing arm 70 is located outside the polishing table 10 and is positioned between plane C and plane D. The rotation axis 82 of the polishing slurry supply arm 80 can be positioned between plane E and plane K, or between plane E and plane D. The other end 70′ of the polishing pad dressing arm 70 is located between plane F and plane G, while the other end 80′ of the polishing slurry supply arm 80 is located between plane C and plane B.

[0098] Reference Figure 6 Figure 7 and the substrate polishing module 600 of an embodiment of the present invention will be described. Figure 6 Figure 7 is a side sectional view of the substrate polishing module 600, and a plan view showing the sequential processing of the substrate within the substrate polishing module 600.

[0099] like Figure 6As shown, the substrate polishing module 600 includes two substrate polishing units 500a and 500b, which share a substrate loading / unloading device 50. The substrate loading / unloading device 50 is mounted so as to be horizontally movable along a linear guide rail 152. The linear guide rail 152 is arranged parallel to the straight line direction of the substrate loading / unloading position 30 connecting the first substrate polishing unit 500a and the second substrate polishing unit 500b.

[0100] The substrate loading / unloading device 50 includes a substrate support plate 156 disposed on its base 54. A fluid chamber 158 is formed between the base 54 and the substrate support plate 156. By introducing a fluid such as gas or liquid into the fluid chamber 158, the substrate support plate 156 rises; conversely, by discharging fluid, the substrate support plate 156 descends. When attaching the substrate W to the polishing heads 20a and 20b, fluid can be supplied to the fluid chamber 158 to raise the substrate support plate 156, thereby feeding the substrate W into the retaining ring 29 of the polishing heads 20a and 20b.

[0101] Referring to Figure 7(a), when the substrate loading / unloading device 50 is located between the substrate loading / unloading positions 30 of the first and second substrate polishing units 500a and 500b, the substrate transporter 42 of the substrate transfer device can transfer the substrate W to the substrate loading / unloading device 50. As shown in Figure 7(b), after receiving the substrate W from the substrate transporter 42, the substrate loading / unloading device 50 moves to the substrate loading / unloading position 30 of the first polishing unit 500a and delivers the substrate W to the first polishing head 20a. After receiving the substrate W, the first polishing head 20a rotates horizontally about the housing axis 2 to above the substrate polishing position 32, and then moves downward to the polishing pad 11 to polish the substrate W. While the first polishing head 20a is polishing the substrate W, the second polishing head 20b receives a new substrate W from the substrate loading / unloading device 50 at the substrate loading / unloading position 30.

[0102] As shown in Figure 7(c), after receiving the substrate W from the substrate transporter 42, the substrate loading / unloading device 50 can also move to the substrate loading / unloading position 30 of the second polishing unit 500b to deliver the substrate W to the first polishing head 20a. After receiving the substrate W, the first polishing head 20a also rotates horizontally around the housing axis 2 to above the substrate polishing position 32 and moves downward to the polishing pad 11 to polish the substrate W. During this process, the second polishing head 20b receives a new substrate W from the substrate loading / unloading device 50 at the substrate loading / unloading position 30.

[0103] Reference Figure 8 A shielding plate 220 may be provided between the substrate loading / unloading device 50 of the first and second polishing units 500a and 500b and the polishing table 10. Figure 8This is a plan view of a substrate polishing module 600 including a shielding plate 220. The shielding plate 220 is configured to spatially isolate the lower portions of the polishing heads 20a and 20b located at the substrate loading / unloading position 30 from the polishing table 10. The shielding plate 220 is arranged so that it does not extend below the polishing heads 20a and 20b located at the substrate polishing position 32. For reference, in Korean Patent Application No. 10-2023-0133909, on which this application has a priority, the shielding plate 220 is referred to as "fence 220", and in Korean Patent Application No. 10-2024-0110148, it is referred to as "cover plate 30". In this application, the term "shielding plate 220" is used consistently to avoid confusion.

[0104] The exchange of substrates between the polishing heads 20a, 20b and the substrate loading / unloading device 50 takes place above the shielding plate 220. Horizontal movement of the substrate loading / unloading device 50 also occurs above the shielding plate 220. The shielding plate 220 prevents polishing slurry residue, particles, or other contaminants from the substrate loading / unloading device 50 or the polishing heads 20a, 20b located at the substrate loading / unloading position 30 from falling onto the polishing table 10. A linear guide rail 152 may also be disposed above the shielding plate 220.

[0105] The following embodiments are primarily based on Korean Patent Application No. 10-2023-0133909, which serves as the basis for priority of this application, and may also be referenced to other Korean patent applications.

[0106] Referring to FIGS. 9(a) and 9(b), a substrate polishing unit 500 according to an embodiment of the present invention will be described. FIG. 9(a) is a plan view of the substrate polishing unit 500, and FIG. 9(b) is a side view thereof. As shown in FIG. 9(a), the substrate polishing unit 500 includes a polishing table 10, at least one polishing head, namely a first and second polishing head 20a, 20b, a substrate loading / unloading device 50, a polishing pad trimming arm 70, and an polishing slurry supply means 180 (polishing slurry supply arm).

[0107] Referring to Figure 9(b), a substrate loading / unloading position 30, a substrate loading / unloading standby position 30", a polishing position 32, and a polishing standby position 32" are sequentially arranged above the polishing stage 10. The polishing position 32 is the position where the polishing heads 20a and 20b polish the substrate W on the polishing pad 11 attached to the polishing stage 10, and the polishing standby position 32" is located above the polishing position 32. The substrate loading / unloading position 30 is the position where the first and second polishing heads 20a and 20b exchange substrate W with the substrate loading / unloading device 50, and the substrate loading / unloading standby position 30" is located above the substrate loading / unloading position 30.

[0108] The substrate loading / unloading standby position 30" and the polishing standby position 32" are arranged opposite each other with respect to the housing axis 2 located between the first and second polishing heads 20a and 20b. The first and second polishing heads 20a and 20b can swing about the housing axis 2 and move between the substrate loading / unloading standby position 30" and the polishing standby position 32". The first and second polishing heads 20a and 20b reciprocate between the substrate loading / unloading position 30, the substrate loading / unloading standby position 30", the polishing standby position 32", and the polishing position 32. At the substrate loading / unloading position 30, they exchange substrate W with the substrate loading / unloading device 50, and at the polishing position 32, they polish the substrate W on the polishing pad 11.

[0109] Referring again to Figure 9(a), when the polishing head 20a or 20b is in the substrate loading / unloading standby position 30", the substrate transporter 42 of the substrate transfer device can enter the space between itself and the substrate loading / unloading device 50 to exchange substrates W with the substrate loading / unloading device 50. The polishing pad trimming arm 70 swings (79) around the rotation axis 72 below the substrate loading / unloading device 50 to trim the polishing pad 11 attached to the polishing table 10.

[0110] The polishing slurry supply means 180 is suspended above the substrate loading / unloading device 50 and is used to supply polishing slurry to the polishing head 20a or 20b located at the polishing position 32. The polishing slurry supply means 180 may be configured as an arcuate structure surrounding the outer periphery of the polishing head 20a, 20b. The polishing slurry supply means 180 is arranged to extend from the substrate loading / unloading device 50 to the side opposite to the polishing pad trimming arm 70 to avoid interference with the oscillating polishing pad trimming arm 70.

[0111] Referring to Figures 10(a) and 10(b), the process of the substrate transporter 42 transferring the substrate W to the substrate loading / unloading device 50 is described. Figure 10(a) is a vertical cross-sectional view of the first polishing head assembly 110a and the substrate loading / unloading device 50, and Figure 10(b) is a perspective view of the substrate loading / unloading device 50. Figure 10(a) shows the state in which the first polishing head 20a is located in the substrate loading / unloading standby position 30", and the substrate loading / unloading device 50 is located below it. Figure 10(b) shows the situation in which the substrate transporter 42 transfers the substrate W to the substrate loading / unloading device 50.

[0112] The substrate loading / unloading device 50 includes an upwardly extending sidewall 62. The sidewall 62 has an opening 69 through which the substrate transporter 42 enters. The width of the opening 69 is set to be greater than the width of the substrate transporter 42, and may also be greater than the diameter of the substrate W. The substrate transporter 42 and the substrate W can enter or exit the substrate loading / unloading device 50 through the opening 69.

[0113] The following embodiments are primarily based on Korean patent applications No. 10-2023-0133909 and No. 10-2023-0124412, which form the basis of the priority of this application, and may also be referenced to other Korean patent applications.

[0114] Reference Figure 11 and Figure 12 The substrate polishing unit 500 of one embodiment of the present invention will be described. Figure 11 This is a plan view of the substrate polishing unit 500. The first and second polishing head assemblies 110a and 110b are mounted on the annular track 130 via their respective guide blocks 414a and 414b and can rotate along the annular track. The first and second polishing head assemblies 110a and 110b are suspended below the annular track 130 and can rotate about the housing axis 2 of the annular track 130 to change their positions.

[0115] Figure 12 To observe from the opposite side of the polishing pad trimming arm 70 Figure 11 Side view of the substrate polishing unit 500 shown. (Refer to...) Figure 12 The first and second polishing head assemblies 110a and 110b are fixed to the upper support plate 168, which is connected to the annular track 130 fixed to the upper frame 140 via guide blocks 414a and 414b, respectively. A magnet array 452 is disposed around the annular track 130 on the lower surface of the upper frame 140, and electromagnets 450 and 450" are disposed on the upper surface of the upper support plate 168. By controlling the alternating current supplied to the electromagnets 450 and 450", the first and second polishing head assemblies 110a and 110b suspended on the upper support plate 168 can rotate along the annular track 130.

[0116] In another embodiment, the first and second polishing head assemblies 110a and 110b may be connected to the annular track 130 via their guide blocks 414a and 414b, respectively, instead of via the upper support plate 168. In this embodiment, the first and second polishing head assemblies 110a and 110b can swing independently on the annular track 130 by means of their respective electromagnets 450 and 450″.

[0117] Reference Figure 12 The polishing slurry supply channel 184 can pass through the interior of the substrate loading / unloading device 50 and is connected to the polishing slurry supply device 180. The substrate loading / unloading standby position 30″ is located above the substrate loading / unloading device 50, which is located above the polishing pad trimming arm 70. Therefore, the distance 30h from the polishing pad 11 to the substrate loading / unloading standby position 30″ can be set to be greater than the sum of the polishing pad trimming arm height 70h and the substrate loading / unloading device height 50h.

[0118] Reference Figure 13 This describes the configuration of the polishing pad trimming arm 70 according to an embodiment of the present invention. Figure 13 This is a plan view of the substrate polishing unit 500. The swing axis 72 of the polishing pad trimming arm 70 is located near the polishing stage 10, between plane B and plane C. Plane B is perpendicular to plane A, which includes the substrate polishing position 32 and the substrate loading / unloading position 30, and is a virtual plane containing the center 12 of the polishing stage 10. Plane C is parallel to plane B and passes through the polishing position 32.

[0119] A polishing pad dresser 74 is suspended at the distal end of the polishing pad dressing arm 70. The polishing pad dressing arm 70 swings (79) around the center 12 of the polishing table 10 and along the edge of the polishing table 10, thereby allowing the polishing pad dresser 74 to dress the polishing pad 11. A polishing pad dresser cleaning station 76 is provided around the polishing table 10 for cleaning the polishing pad dresser 74. The polishing pad dresser cleaning station 76 is located near the polishing table 10, between plane F and plane G. Plane G is parallel to plane B and includes the substrate loading / unloading position 30. Plane F is parallel to plane B and is one of the planes that contacts the edge of the polishing table 10, and is closer to plane G.

[0120] Reference Figure 11 The aforementioned grinding fluid supply device 180 can be used as follows: Figure 13 The polishing pad trimming arm 70 is replaced by a polishing slurry supply arm 80. The oscillating axis 82 of the polishing slurry supply arm 80 is located on the other side of the polishing table 10, opposite to the polishing pad trimming arm 70. The polishing slurry supply arm 80 is connected to a vertical axis 86 and can rotate about the oscillating axis 82. The oscillating axis 82 is located near plane B and adjacent to the polishing table 10, and the vertical axis 86 of the polishing slurry supply arm 80 can extend across plane B. When no polishing slurry is supplied, the distal end of the polishing slurry supply arm 80 moves outward from the polishing table 10 to a resting position 80P near plane D. Plane D is one of the planes that contacts the edge of the polishing table 10, parallel to plane B and closer to plane C. When the polishing slurry supply arm 80 is in the resting position 80P, its distal end 80′ is near plane D. During the movement of the polishing slurry supply arm 80 to the resting position 80P, the polishing head 20a moves upward from the substrate polishing position 32, allowing the polishing slurry supply arm 80 to pass under the polishing head 20a and reach the resting position 80P.

[0121] Referring to Figures 14(a) and 14(b), a substrate loading / unloading apparatus 50 according to an embodiment will be described. Figure 14(a) is a side sectional view of the substrate loading / unloading apparatus 50, and Figure 14(b) is a planar sectional view of the substrate loading / unloading apparatus 50, showing the state in which the substrate W and polishing heads 20a and 20b are located above the substrate loading / unloading apparatus 50.

[0122] As shown in Figure 14(a), the substrate loading / unloading device 50 may include a substrate support plate 156 and a first fluid cavity 158. The first fluid cavity 158 is disposed between the base 54 and the substrate support plate 156. When a fluid such as gas or liquid is supplied to the first fluid cavity 158, the substrate support plate 156 rises; conversely, when fluid is discharged from the first fluid cavity 158, the substrate support plate 156 falls. When transferring a substrate to the polishing head 20a or 20b, the substrate support plate 156 is raised by supplying fluid to the first fluid cavity 158, thereby feeding the substrate into the pressure ring 29 of the polishing head 20a or 20b.

[0123] Referring to Figures 14(a) and 14(b), the substrate loading / unloading device 50 may further include a substrate alignment device 160. The substrate alignment device 160 is annular and has an arcuate structure with an opening 191. At both ends of the opening 191, a first pin 192a and a second pin 192b are fixedly disposed relative to each other. A shaft 196 is fixed to the first pin 192a, while the second pin 192b has a through hole through which the shaft 196 is connected to the linear drive unit 190. The second pin 192b is fixed to a base 54. Near the first pin 192a, a stop plate 194 is fixed on the base 54 to restrict the movement of the first pin 192a. When the linear drive unit 190 extends the shaft 196, the first pin 192a moves toward the stop plate 194, thereby opening the substrate alignment device 160; conversely, when the shaft 196 retracts, the first pin 192a moves toward the second pin 192b, thereby closing the substrate alignment device 160.

[0124] Referring to FIG14(a), the substrate alignment device 160 includes: an upper vertical surface 161 in contact with the outer peripheral surface of the pressure ring 29 of the polishing heads 20a and 20b; an upper horizontal surface 162 in contact with the lower surface of the pressure ring 29; a lower vertical surface 163 in contact with the outer peripheral surface of the substrate W; and a lower horizontal surface 164 in contact with the lower surface of the substrate W. The substrate loading / unloading device 50 may further include an annular support plate 170 for supporting the substrate alignment device 160. The substrate alignment device 160 can be freely deformed on the support plate 170 and is opened and closed by a linear drive unit 190. An annular second fluid cavity 155 may be provided between the support plate 170 and the base 54. When a fluid such as gas or liquid is supplied to the second fluid cavity 155, the substrate alignment device 160 on the support plate 170 can move in the vertical direction.

[0125] Reference Figures 15(a) to 15(f) This describes a method for mounting the substrate W onto the polishing head 20a using the substrate loading / unloading device 50. Figures 15(a) to 15(f) The following are side cross-sectional views of the substrate loading / unloading device 50 during substrate mounting.

[0126] In the step shown in Figure 15(a), with the substrate alignment device 160 in the open state, the substrate support plate 156 rises, and the substrate processor 42 of the substrate transfer device (not shown) places the substrate W to be polished onto the substrate support plate 156. In the step shown in Figure 15(b), the substrate support plate 156 falls, so that the substrate W is placed on the lower horizontal surface 164 of the substrate alignment device 160.

[0127] In the step shown in Figure 15(c), the polishing head 20a descends, or the substrate loading / unloading device 50 ascends, so that the retaining ring 29 of the polishing head 20a is located within the substrate alignment device 160. In the step shown in Figure 15(d), the substrate alignment device 160 closes, so that its upper vertical surface 161 contacts the retaining ring 29 of the polishing head 20a. At this time, the substrate W is automatically aligned and positioned within the retaining ring 29 by the lower vertical surface 163 of the substrate alignment device 160. In the step shown in Figure 15(e), the substrate support plate 156 ascends, so that the substrate W is attached to the lower surface of the polishing head 20a and located within the retaining ring 29. In the step shown in Figure 15(f), the substrate support plate 156 descends, and the substrate alignment device 160 opens, then the polishing head 20a ascends and moves out of the substrate loading / unloading device 50.

[0128] Reference Figure 16 and Figure 17 This describes a substrate polishing unit 500 according to an embodiment of the present invention. Figure 16 This is a plan view of the substrate polishing unit 500. Figure 17 This is a side sectional view. The substrate polishing unit 500 includes a polishing table 10, first and second polishing heads 20a and 20b, a substrate loading / unloading device 50, a polishing head cleaning unit 60, a polishing pad trimming arm 70, and a polishing slurry supply arm 80. Figure 16 In the illustration, the first polishing head 20a and the substrate W below it are partially removed.

[0129] Reference Figure 16 A substrate processor 42 of a substrate transfer device is disposed below the first polishing head 20a. Below the substrate processor 42, a substrate W, a substrate loading / unloading device base 54, a polishing head cleaning unit 60, a polishing pad trimming arm 70, and a polishing pad 11 are disposed sequentially. The substrate loading / unloading device base 54 is annular, and its upper surface is provided with a pin 57 for placing the substrate W. The base 54 is connected to a vertical axis 52 via an arm 261, and the vertical axis 52 is configured to move up and down along a central axis 56.

[0130] Reference Figure 16 and Figure 17The polishing head cleaning unit 60 includes a first wall 62 and a second wall 68 erected upwards from the cleaning base 61. The first wall 62 is located on one side facing the axis 12 of the polishing table 10, and the second wall 68 is located on the side facing the substrate processor 42. Both the first wall 62 and the second wall 68 are arc-shaped, and the height of the second wall 68 is designed to be lower than that of the first wall 62. An ultrapure water nozzle 64 is provided on the first wall 62 for spraying ultrapure water onto the polishing heads 20a and 20b. The cleaning base 61 includes a drainage channel 265 that extends from below the arm 261 of the substrate loading / unloading device 50 to the space between the polishing table 10 and the guardrail 14, for discharging the cleaning water from the polishing head cleaning unit 60 into this space. The cleaning base 61 and the drainage channel 265 are inclined toward the guardrail 14 to facilitate the smooth discharge of cleaning water.

[0131] The polishing head cleaning unit 60 is connected to the polishing slurry supply device 180 (polishing slurry supply arm). The polishing slurry supply device 180 extends from the polishing head cleaning unit 60 to the polishing position 32 and is arranged around the polishing head 20a or 20b being polished at the polishing position 32. The polishing pad dressing arm 70 swings about its swing axis 72, and a polishing pad dresser (not shown) suspended at the distal end of the polishing pad dressing arm 70 dresses the polishing pad 11 located below the polishing head cleaning unit 60.

[0132] The substrate loading / unloading device base 54 is connected to the vertical movement drive device 53 via a vertical axis 52, thereby enabling vertical movement above the polishing head cleaning unit 60 to mount the substrate W onto the polishing head 20a or 20b, or to receive substrates detached from the polishing head 20a or 20b. The substrate processor 42 of the substrate transfer device passes over the top of the second wall 68 of the polishing head cleaning unit 60 and enters the space between the polishing head 20a or 20b and the substrate loading / unloading device 50 to exchange substrates with the substrate loading / unloading device base 54.

[0133] When the substrate processor 42 delivers the substrate W to the substrate loading / unloading device base 54, the base 54 moves down to receive the substrate W; when the substrate W is delivered to the polishing head 20a, the base 54 rises, so that the substrate W is attached to the lower surface of the polishing head 20a.

[0134] Reference Figure 17 The first polishing head 20a is located at the substrate loading / unloading position 30, and the second polishing head 20b is located at the substrate polishing position 32. When the first and second polishing heads 20a and 20b exchange positions, both rise to the first wall 62 of the polishing head cleaning unit 60, and then rotate along the annular track 130 and move to their respective positions.

[0135] The following embodiments are primarily based on Korean patent applications No. 10-2023-0141588 and No. 10-2023-0154891, which claim priority, but may also refer to other Korean patent applications.

[0136] Reference Figure 18 The diagram shows a plan view of a substrate polishing unit 500 according to an embodiment of the present invention. A substrate loading / unloading device 50 is disposed near a first face 120A of a virtual circumscribed tetrahedron 120 surrounding a polishing stage 10. The circumscribed tetrahedron 120 includes the polishing stage 10 and is composed of four faces 120A, 120B, 120C, and 120D, each tangent to the outer periphery of the polishing stage 10. The central axis of the tetrahedron is parallel to the axis 12 of the polishing stage 10.

[0137] In the following description, the space between the circumscribed tetrahedron 120 and the polishing table 10 refers to the space between the virtual cylinder extending upward from the surface of the polishing table 10 and the four faces 120A, 120B, 120C, and 120D of the circumscribed tetrahedron 120. In other words, it represents the space between the polishing table 10, shown by solid lines, and the circumscribed tetrahedron 120, shown by dashed lines.

[0138] The substrate processor 42 approaches the substrate loading / unloading device 50 via the first surface 120A of the external tetrahedron 120 and exchanges substrates with it. The first surface 120A and plane A (refer to...) Figure 13 The first surface 120A is perpendicular to the plane A, and the angle between the first surface 120A and the plane A can be 80° to 100°.

[0139] The central axis 56 of the vertical axis 52 of the substrate loading / unloading device 50 is located near the first edge 121 between the first face 120A and the adjacent second face 120B of the circumscribed tetrahedron 120. At least a portion of the vertical axis 52 may be arranged in the space between the circumscribed tetrahedron 120 and the polishing table 10, near the first edge 121.

[0140] The swing axis 72 of the polishing pad trimming arm 70 is located near the second edge 122 between the first face 120A and the fourth face 120D, wherein the fourth face 120C is opposite to the second face 120B. At least a portion of the vertical axis 75 of the polishing pad trimming arm 70 may be arranged in the space between the circumscribed tetrahedron 120 and the polishing table 10, near the second edge 122. The swing axis 72 of the polishing pad trimming arm 70 may also be located in this space, near the second edge 122.

[0141] The substrate polishing unit 500 may further include a polishing pad dressing station 76 disposed above the polishing table 10. At least a portion of the polishing pad dressing station 76 is located above the polishing table 10. The polishing pad dressing station 76 is mounted on a vertical axis 276 via an arm 274, the vertical axis 276 being connected to a vertical drive device 278. The vertical drive device 278 enables the polishing pad dressing station 76 to move along the vertical axis 272 to a first position 76a ( Figure 18 The polishing pad 11 moves between a first position 76a (shown) and a higher second position (not shown). When cleaning the polishing pad dresser 74, the polishing pad dresser cleaning station 76 is in the first position 76a; during polishing pad dressing, the polishing pad dresser cleaning station 76 rises to the second position to avoid interference with the polishing pad dressing arm 70. In the second position, the polishing pad dressing arm 70 passes under the polishing pad dresser cleaning station 76 and dresses the polishing pad 11. Furthermore, the vertical axis 276 of the polishing pad dresser cleaning station 76 is connected to a rotary drive 278, allowing it to swing about the vertical axis 272 away from the polishing table 10, thereby avoiding interference with the polishing pad dressing arm 70.

[0142] The vertical axis 272 of the polishing pad dresser cleaning station 76 is located near the third edge 123 of the circumscribed tetrahedron 120. The third edge 123 is located opposite the first edge 121, and the axis 12 of the polishing table 10 is sandwiched between them. At least a portion of the vertical axis 276 of the polishing pad dresser cleaning station 76 may be located in the space between the circumscribed tetrahedron 120 and the polishing table 10, near the third edge 123; similarly, its vertical axis 272 may also be located in this space.

[0143] The process of moving the polishing pad dresser 74 to the polishing pad dresser cleaning station 76 is as follows: the polishing pad dressing arm 70 is located between the first polishing head 20a and the polishing pad dresser cleaning station 76 (position 70a), then it is raised and rotated above the first position 76a around the swing axis 72, and finally lowered so that the polishing pad dresser 74 is placed on the polishing pad dresser cleaning station 76.

[0144] The substrate polishing unit 500 may further include an polishing slurry supply arm 80. One end of the polishing slurry supply arm 80 is mounted on a vertical axis 86 that can rotate about a swing axis 82, and the other end is provided with a polishing slurry spray nozzle. The swing axis 82 of the polishing slurry supply arm 80 is located near the fourth edge 124 of the circumscribed tetrahedron 120, which is located on the axis 12 spanning the polishing table 10 and opposite to the second edge 122. At least a portion of the vertical axis 86 of the polishing slurry supply arm 80 may be located in the space between the polishing table 10 and the circumscribed tetrahedron 120, near the fourth edge 124; its swing axis 82 may also be located in this space.

[0145] In this embodiment, by placing the polishing pad trimmer cleaning station 76 above the polishing table 10 and providing a structure to avoid collisions with the polishing pad trimmer arm 70 and polishing heads 20a and 20b, the floor space of the substrate polishing unit 500 can be effectively reduced.

[0146] As described above, by arranging the vertical axis 52 of the substrate loading / unloading device 50, the swing axis 72 of the polishing pad trimming arm 70, the vertical axis 276 of the polishing pad trimmer cleaning station 76, and the swing axis 82 of the polishing slurry supply arm 80 near the four edges of the circumscribed tetrahedron 120, space can be utilized efficiently, thereby reducing the floor area of ​​the substrate polishing unit 500.

[0147] The following embodiments are primarily based on Korean Patent Application No. 10-2024-0030990, which claims priority, and may also be referenced to other Korean patent applications.

[0148] Reference Figure 19 and Figure 20 This describes the substrate polishing unit 500 according to this embodiment. Figure 19 Its floor plan, Figure 20 This is its side view.

[0149] like Figure 19 As shown, the structure and arrangement of the substrate polishing unit 500 are described using a virtual tetrahedron 260 with four vertical faces. The first to fourth faces 260a to 260d are mutually perpendicular virtual vertical planes, and the first to fourth edges 262a to 262d are edges formed between these planes. A frame structure 140 for supporting the components of the substrate polishing unit 500 can be disposed on the first to fourth faces 260a to 260d. The first face 260a and plane A (refer to...) Figure 13 The included angle between the two sides can be 80° to 100°.

[0150] The substrate processor 42 approaches the substrate loading / unloading device 50 via the first surface 260a. The first surface 260a is located between the polishing stage 10 and the substrate processor 42, and is closest to the substrate loading / unloading device 50 and the substrate processor 42 among the first to fourth surfaces 260a to 260d.

[0151] The polishing pad trimming arm 70, its swing axis 72, and its resting position 70P are disposed within the space between the second surface 260b and the polishing table 10. The second surface 260b shares the first edge 262a with the first surface 260a. When the polishing pad trimming arm 70 is in the resting position 70P, it is located between the polishing table 10 and the second surface 260b, and the polishing pad trimmer 74 mounted at its end is located in the polishing pad trimmer resting position 74P. The polishing pad trimmer resting position 74P is located near the first edge 262a and is located in plane G (refer to...). Figure 13The space between the first surface 260a and the polishing table 10.

[0152] The swing shaft 72 of the polishing pad dressing arm 70 is located on the second surface 260b, the polishing table 10, and the reference. Figure 13 Within the space between plane B and plane C, the polishing pad trimming arm 70 swings about the swing axis 72 from its resting position 70P located below the substrate loading / unloading device 50. During the trimming of the polishing pad 11, the polishing pad trimmer 74 reciprocates between the center 12 of the polishing pad 11 and the edge near the first edge 262a.

[0153] The oscillating shaft 82 of the polishing slurry supply arm 80 is located within the space between the third surface 260c and the polishing table 10, and is closer to the fourth surface 260d than the second surface 260b. The third surface 260c is opposite to the first surface 260a, and the fourth surface 260d is opposite to the second surface 260b. The polishing slurry supply arm 80 is located on the opposite side of the polishing table 10, opposite to the polishing pad dressing arm 70. The oscillating shaft 82 of the polishing slurry supply arm 80 and the polishing pad dressing position 74P are positioned opposite each other across the axis 12 of the polishing table 10.

[0154] The swing axis 82 of the polishing slurry supply arm 80 is located in the space between plane A, plane C, third surface 260c, fourth surface 260d and polishing table 10. In the stationary position, the end 80' of the polishing slurry supply arm 80 is positioned between the polishing table 10 and the fourth surface 260d, and is closer to the third surface 260c than the first surface 260a. In the stationary position, the end 80' is located in the space between plane B, plane C, fourth surface 260d and polishing table 10.

[0155] The substrate loading / unloading device 50 is supported by a support plate 136, which is connected to a frame 140 disposed on the second and / or fourth surfaces 260b, 260d via a connecting portion 138 that allows vertical movement. The substrate loading / unloading device 50 can move vertically to mount the substrate to the first and second polishing heads 20a, 20b.

[0156] Operators can easily access the polishing pad 11 through the third side 260c and perform maintenance on the polishing pad trimming arm 70 and the polishing fluid supply arm 80.

[0157] Reference Figure 20The polishing table 10 can reciprocate along the first direction 106 via a linear drive device 252. The polishing pad trimming arm 70 and the polishing slurry supply arm 80 can also reciprocate along the first direction 106 together with the polishing table 10. For this purpose, the vertical axis 108 and rotary drive device 105 of the polishing table 10, the vertical axis 75 and oscillation drive device 77 of the polishing pad trimming arm 70, and the vertical axis and oscillation drive device (not shown) of the polishing slurry supply arm 80 are all fixedly mounted on the polishing table base 250. The polishing table base 250 reciprocates along the first direction 106 via the linear drive device 252. (Refer to...) Figure 19 The first direction 106 is parallel to the polishing surface of the polishing pad 11 on plane A.

[0158] Reference Figure 21 The illustration shows a substrate polishing apparatus 1000 according to an embodiment of the present invention, wherein substrate polishing units 500 and 500' with identical structural designs are arranged opposite to each other, and a substrate transfer robot 40 is provided therebetween. The substrate transfer robot 40 moves within a substrate transfer space 44 and transports the substrate to or removes it from the substrate loading / unloading device 50 of the substrate polishing units 500 and 500'.

[0159] The second substrate polishing unit 500' is the structure of the first substrate polishing unit 500 rotated 180 degrees, and its design is the same as that of the first substrate polishing unit 500. Symbols 6a and 6b represent the orientation of the first and second substrate polishing units 500 and 500', respectively, indicating that they have been rotated 180 degrees relative to each other. Symbol 6a indicates that the substrate polishing unit 500 is facing the 12 o'clock direction, and symbol 6b indicates that the substrate polishing unit 500 is facing the 6 o'clock direction.

[0160] By efficiently arranging the components of the substrate polishing unit 500—including polishing heads 20a and 20b, substrate loading / unloading device 50, polishing pad trimming arm 70, and polishing slurry supply arm 80—close to the polishing table 10, the footprint of the substrate polishing apparatus 1000 can be reduced. This structure also improves maintenance convenience, allowing operators to access the components of each substrate polishing unit 500, 500' through the third side 260c. Furthermore, by arranging identical substrate polishing units 500 in a 180-degree rotational configuration, it is unnecessary to design different units for the left and right sides of the substrate transfer device 40, thereby reducing manufacturing costs.

[0161] Reference Figure 22 and Figure 23 This describes a substrate polishing unit 500a according to an embodiment of the present invention. Figure 22 This is a plan view of the substrate polishing unit 500a. Figure 23This is a side view of the substrate polishing unit 500a as seen from the second side 260b.

[0162] Figure 22 The substrate polishing unit 500a shown is... Figure 19 The differences between the substrate polishing units 500 shown are as follows: Figure 19 In the substrate polishing unit 500, the substrate processor 42 approaches the substrate loading / unloading device 50 via the first side 260a closest to the substrate loading / unloading device 50; while Figure 22 In the substrate polishing unit 500a shown, the substrate processor 42 approaches the substrate loading / unloading device 50 through the fourth side 260d, which is adjacent to the first side 260a closest to the substrate loading / unloading device 50 and shares the fourth side 262d.

[0163] The rotation axis 72 of the polishing pad trimming arm 70 and its resting position 70P are located within the space between the second side 260b and the polishing table 10. When the polishing pad trimming arm 70 is in the resting position 70P, it is located within the space between the second side 260b and the polishing table 10. The rotation axis 72 of the polishing pad trimming arm 70 is located near the first side 262a, which is the common side of the first side 260a and the second side 260b.

[0164] The dresser 74, located at the distal end of the polishing pad dressing arm 70, is positioned at a dresser resting position 74P, which is situated within the space between the second side 260b and the polishing table 10, and closer to the third side 260c than the first side 260a. The dresser resting position 74P can be positioned within the space defined by side A, side B, the polishing table 10, and the second side 262b, and closer to side B (260b). The polishing pad dressing arm 70 reciprocates 79 about its rotation axis 72 along the direction of the second side 260b, moving from the center 12 of the polishing table 10 to its edge, so that the dresser 74 dresses the polishing pad 11.

[0165] The rotation axis 82 of the polishing slurry supply arm 80 is disposed within the space between the third side 260c and the polishing table 10, and is closer to the second side 260b than the fourth side 260d. When the polishing slurry supply arm 80 is in its resting position 80P, its distal end 80′ is located within the space between the polishing table 10 and the second side 260b, and is closer to the third side 260c than the first side 260a. The polishing slurry supply arm 80 rotates 89 about the rotation axis 82, moves toward the center of the polishing table 10, and supplies polishing slurry to the polishing pad 11. The resting position 80P of the polishing slurry supply arm 80 is located within the space defined by side A, side B, the second side 260b, the third side 260c, and the polishing table 10.

[0166] When the polishing pad trimming arm 70 and the polishing slurry supply arm 80 move from their respective resting positions 70P and 80P toward the polishing pad 11, in order to avoid interference between the two, the polishing pad trimming arm 70 moves first, followed by the polishing slurry supply arm 80; conversely, when returning from the polishing pad 11 to their respective resting positions 70P and 80P, the polishing slurry supply arm 80 moves first, followed by the polishing pad trimming arm 70.

[0167] As described above, when the polishing pad dressing arm 70 and the polishing slurry supply arm 80 are in their respective resting positions 70P and 80P, both are positioned within the space between the second side 260b and the polishing table 10. When the polishing slurry supply arm 80 is in resting position 80P, its distal end 80′ is located adjacent to the dresser resting position 74P. The operator can easily access the dresser 74 for replacement or maintenance of the polishing slurry supply arm 80 via the second side 260b.

[0168] Reference Figure 22 and Figure 23 The substrate loading / unloading device 50 is supported by a support plate 136 connected to a connecting portion 138, which is vertically movable relative to a frame 140 disposed on a first side 260a. The substrate loading / unloading device 50 can be configured to move vertically when mounting a substrate to the first and second polishing heads 20a, 20b.

[0169] The substrate polishing apparatus 500 can be further configured such that the substrate loading / unloading device 50 performs a horizontal reciprocating movement 59 between the substrate loading / unloading position 30 and the substrate exchange position 58. The substrate exchange position 58 is located between the substrate loading / unloading position 30 and the fourth side surface 260d, and the fourth side surface 260d is the entry direction of the substrate processor 42. In this embodiment, after the substrate loading / unloading device 50 receives the substrate from the polishing heads 20a and 20b at the substrate loading / unloading position 30 and moves to the substrate exchange position 58, the substrate processor 42 can remove the substrate from the substrate loading / unloading device 50, thereby shortening the length and stroke of the robotic arm of the substrate processor 42. After the substrate processor 42 removes the substrate at the substrate exchange position 58 and delivers a new substrate, the substrate loading / unloading device 50 returns to the substrate loading / unloading position 30 to deliver the substrate to the polishing heads 20a and 20b.

[0170] Figure 22 The substrate polishing unit 500a shown can be used with Figure 19 The substrate polishing units 500 shown have the same orientation and are in Figure 21 The substrate polishing apparatus 1000 shown is arranged in a 180-degree rotation manner to form the substrate polishing apparatus 1000.

[0171] The following embodiments primarily refer to and assert priority of Korean Patent Application No. 10-2024-0089299, and may also refer to other Korean patent applications.

[0172] Reference Figure 24 and Figure 25 This describes the substrate polishing unit 500 in this embodiment. Figure 24 This is a side sectional view. Figure 25 This is a perspective view of the substrate polishing unit 500. The substrate polishing unit 500 includes a housing 100, which is rotatable about the housing axis 2. The housing 100 may include a panel that at least partially surrounds its internal space, or be configured as a frame structure for suspending and supporting polishing heads 21a, 21b.

[0173] The housing 100 includes a top surface 100A, a bottom surface 100B, an upper side portion 100C, a lower side portion 100D, and a stepped portion 100E disposed between the upper side portion 100C and the lower side portion 100D. The upper side portion 100C constitutes the upper part 100C of the housing, and the lower side portion 100D constitutes the lower part 100D of the housing. The lower side portion 100D is smaller in dimension in the direction of the housing axis 2 than the upper side portion 100C, so that the stepped portion 100E is disposed downward. The housing 100 is configured such that its stepped portion 100E is supported on the rotating part 322 of the turntable bearing 320 fixed on the frame structure 140 of the substrate polishing unit 500. The housing 100 is supported by the turntable bearing 320 and can rotate about the housing axis 2. First and second polishing head assemblies 110a and 110b are disposed inside the housing 100. Each polishing head assembly 110a, 110b includes rotary joints 123a, 123b, which deliver fluid to polishing heads 20a, 20b via rotating vertical shafts 21a, 21b.

[0174] The height 100h of the housing 100 is designed to be greater than the length of the rotary joint 123a, the polishing head rotation drive 22a, the polishing head vertical axis 21a, the substrate loading / unloading device 50, and the polishing pad trimming arm 70 including the trimmer 74. When the polishing head rotation drive 22a is not arranged on the same axis as the polishing head vertical axis 21a but is arranged beside it, the rotary joint 123a can be directly connected to the polishing head vertical axis 21a. In this embodiment, the height 100h of the housing 100 is designed to be greater than the total height of the rotary joint 123a, the polishing head vertical axis 21a, the substrate loading / unloading device 50, and the polishing pad trimming arm 70 including the trimmer 74.

[0175] Polishing heads 20a and 20b can move vertically a distance d, which is greater than the combined height of the substrate loading / unloading device 50 and the polishing pad trimming arm 70. Therefore, the length of the vertical axes 21a and 21b of the polishing heads is designed to be greater than this distance d. The turntable bearing 320 supporting the housing 100 can suppress vibration, thereby improving or preventing vibration of the vertical axes 21a and 21b of the polishing heads supported by the housing 100. If, unlike this embodiment, the bottom surface 100B of the housing 100 is fixed to the turntable bearing 320 instead of the stepped portion 100E, interference (collision) may occur between the polishing heads 20a and 20b and the turntable bearing 320 during vertical movement.

[0176] The following embodiments primarily refer to and claim priority to Korean patent applications Nos. 10-2024-0110148 and 10-2023-0133914, and may also refer to other Korean patent applications.

[0177] Reference Figures 26 to 28 , for combination Figure 8 An embodiment of the shielding plate 220 will be described. Figure 26 This is a plan view of the substrate polishing unit 500. Figure 27 and Figure 28 For along Figure 26 A lateral sectional view obtained from side A.

[0178] Reference Figure 26 and Figure 27 The shielding plate 220 is configured to extend from the edge of the polishing table 10, pass through the space below the substrate loading / unloading device 50, and extend towards the substrate polishing position 32. When viewed vertically from above the polishing pad 11, the area of ​​the shielding plate 220 is designed to be larger than the area of ​​the substrate loading / unloading device 50, thereby shielding the substrate loading / unloading device 50 from the shielding plate 220. The shielding plate 220 prevents particles generated by the polishing head 21a or the substrate loading / unloading device 50, or cleaning water sprayed from the substrate loading / unloading device 50 onto the polishing head 21a, from falling onto the polishing pad 11, thereby preventing the polishing pad 11 from becoming contaminated.

[0179] The shielding plate 220 may include a first shielding plate 230 disposed below the substrate loading / unloading device 50, and a vertical shielding plate 232 extending vertically or obliquely upward from the first shielding plate 230. The vertical shielding plate 232 is configured to at least partially block the space between the substrate loading / unloading device 50 and the substrate polishing position 32 to prevent particles or cleaning water from being dispersed into the substrate polishing position 32. The shielding plate 220 may further include a second shielding plate 234. The first and second shielding plates 230 and 234 are disposed above the polishing table 10 and extend in a direction parallel to the polishing table 10. The second shielding plate 234 is disposed at a position higher than the first shielding plate 230, and the vertical shielding plate 232 is disposed between the first and second shielding plates 230 and 234 to block the space between them. The area of ​​the first and second shielding plates 230 and 234 may be designed to be larger than the area of ​​the polishing pad 11.

[0180] Reference Figure 27 A first shielding plate 230 is disposed in the space between the substrate loading / unloading device 50 and the polishing table 10, and a second shielding plate 234 is disposed above the substrate polishing position 32. The substrate loading / unloading device 50 is isolated from the polishing pad 11 by the vertical shielding plate 232, the first shielding plate 230, and the polishing pad 11. The first shielding plate 230 can be attached to the bottom surface of the substrate loading / unloading device 50. The second shielding plate 234 has a through hole 237 through which the polishing head 20a can move vertically 238, and the size of the through hole 237 is larger than the bottom surface size of the polishing head 20a. When the polishing head 20a moves from the substrate polishing position 32 to the substrate loading / unloading device 50, it first rises vertically 238 through the through hole 237 of the second shielding plate 234, and then moves horizontally 214 to above the substrate loading / unloading device 50. This horizontal movement 214 can be along the side A (including the substrate loading / unloading position 30 and the substrate polishing position 32). Figure 26 The linear movement of ) or the rotational movement about axis 2.

[0181] Reference Figure 26The first and second shielding plates 230 and 234 are respectively placed on the first and second mounting seats 240 and 242, which are positioned above the polishing table 10. The user can place or remove the first and second shielding plates 230 and 234 from the corresponding mounting seats 240 and 242 from the third side 260c. A cleaning water spraying device (not shown) can be provided above the shielding plate 220 for cleaning the upper surface of the shielding plate 220. The used cleaning water can be discharged into a drainage structure surrounding the polishing table 10 through a drain port provided on the shielding plate 220. In one embodiment, the shielding plate 220 may only include the first shielding plate 230, excluding the vertical shielding plate 232 and the second shielding plate 234, and extend from the first shielding plate 230 above the substrate polishing position 32 and the through hole 237.

[0182] Reference Figure 27 A dresser 74 for dressing the polishing pad 11 may be disposed below the shielding plate 220. The dresser 74 is configured to reciprocate horizontally below the shielding plate 220 to dress the polishing pad 11. Filtered clean air may be supplied to the space 239 between the second shielding plate 234 and the polishing pad 11.

[0183] Reference Figure 28 This describes a substrate polishing unit 800 according to an embodiment of the present invention. In the substrate polishing unit 800, the polishing head assembly 110 is mounted on a linear guide rail 116 via a guide block 118, thereby enabling linear movement 214 along the linear guide rail 116 (see [link to documentation]). Figure 27 A linear guide rail 116 is parallel to a virtual side surface A, which includes a substrate polishing position 32 and a substrate loading / unloading position 30. The substrate loading / unloading position 30 and the substrate loading / unloading device 50 are positioned above the polishing table 10. A first shielding plate 230 is positioned between the polishing pad trimming arm 70 and the substrate loading / unloading device 50, and a second shielding plate 234 is positioned above the polishing position 30 and includes a through hole 237. The polishing head 20 is lifted upwards from the substrate polishing position 32 through the through hole 237, and then moves horizontally 214 along the linear guide rail 116 to the substrate loading / unloading position 30. The polishing pad trimming arm 70 is positioned below the substrate loading / unloading device 50 and is used to trim the polishing pad 11. Figure 28 The components designated by numbers 20, 21, 22, 23, 24, and 110 have functions respectively as follows: Figure 1 The same as 20a, 21a, 22a, 23a, 24a and 110a mentioned above.

[0184] The following embodiments primarily refer to and claim priority to Korean patent applications Nos. 10-2023-0120761, 10-2023-0124412, 10-2023-0133914, 10-2024-0032396 and 10-2024-0038805, but may also refer to other Korean patent applications.

[0185] In the following description, the first and second substrate loading / unloading positions 20a′, 20b′ and the first and second substrate polishing positions 20a″, 20b″ correspond to the center positions of the first and second polishing heads 20a, 20b. The first and second polishing heads 20a, 20b polish the substrates on the polishing pad 11 at the first and second substrate polishing positions 20a″, 20b″, respectively, and exchange substrates with the base 54 of the substrate loading / unloading device 50 at the first and second substrate loading / unloading positions 20a′, 20b′.

[0186] The base 54 of the substrate loading / unloading device 50 is disposed at the first and second substrate loading / unloading positions 20a′ and 20b′, indicating that the base 54 is located below the first and second polishing heads 20a and 20b, and substrates are exchanged with the first and second polishing heads 20a and 20b at this position.

[0187] Reference Figure 29 This describes the substrate polishing unit 900 of the present invention. (In conjunction with...) Figure 1 Unlike the substrate polishing unit 500 described above, the first and second polishing head assemblies 110a and 110b of the substrate polishing unit 900 do not rotate around axis 2; instead, the substrate loading / unloading device 50 rotates around axis 2. Furthermore, the polishing stage 10 can rotate around axis 12 in opposite first rotation directions 10a and second rotation directions 10b.

[0188] The substrate polishing unit 900 includes first and second substrate loading / unloading positions 20a′ and 20b′, and first and second substrate polishing positions 20a″ and 20b″. The first substrate loading / unloading position 20a′ is located above the polishing stage 10 and on the axis 27a of the first polishing head 20a, and the first substrate polishing position 20a″ is located below the first substrate loading / unloading position 20a′ and on the axis 27a. The second substrate loading / unloading position 20b′ is located above the polishing stage 10 and on the axis 27b of the second polishing head 20b, and the second substrate polishing position 20b″ is located below the second substrate loading / unloading position 20b′ and on the axis 27b. The first vertical drive unit 23a moves the first polishing head 20a vertically along the ball screw 24a between the first substrate polishing position 20a″ and the first substrate loading / unloading position 20a′; similarly, the second vertical drive unit 23b moves the second polishing head 20b vertically along the ball screw 24b between the second substrate polishing position 20b″ and the second substrate loading / unloading position 20b′.

[0189] The base 54 of the substrate loading / unloading device 50 is mounted on a vertical shaft 252, which is connected to a swing rotation drive unit 253. The vertical shaft 252 passes downward through a linear ball bearing 268 disposed in a frame 140a and is fixed to the frame 140a, thereby enabling vertical movement and rotation. The swing rotation drive unit 253 causes the vertical shaft 252 to swing and rotate, thereby moving the base 54 to positions close to the first and second substrate loading / unloading positions 20a′ and 20b′.

[0190] A vertical drive unit 256 fixed on the frame 140 is used to vertically move the vertical axis 252 of the substrate loading / unloading device 50, thereby adjusting the height of the base 54 between a first height position H1 and a second height position H2. By raising the base 54 from the first height position H1 to the second height position H2, the substrate W placed on the base 54 can be attached to the bottom surface of the polishing heads 20a and 20b.

[0191] The substrate loading / unloading device 50 may include a sidewall 62 surrounding the polishing heads 20a and 20b on a base 54, an ultrapure water (UPW) nozzle 64 disposed inside the sidewall 62, and a drain outlet 66 disposed on the bottom surface of the base 54. A UPW supply pipe 269 is disposed within a vertical shaft 252, supplying ultrapure water to the UPW nozzle 64 through a fluid channel within the vertical shaft 252. When the polishing heads 20a and 20b are resting on the base 54 of the substrate loading / unloading device 50, ultrapure water can be sprayed through the UPW nozzle 64 to clean the polishing heads 20a and 20b. The drain outlet 66 is configured to guide cleaning waste liquid into the space between the enclosure 14 and the polishing table 10. When the base 54 of the substrate loading / unloading device swings about axis 2, the drain outlet 66 moves accordingly, discharging cleaning waste liquid into the space between the enclosure 14 and the polishing table 10.

[0192] In the first polishing mode, such as Figure 29 As shown, the first polishing head 20a removes the polished substrate W1 from the base 54 of the substrate loading / unloading device 50 at the first substrate loading / unloading position 20a′, while the second polishing head 20b polishes the substrate W2 at the second substrate polishing position 20b″. The polishing table 10 rotates along the first rotation direction 10a. The substrate W1, unloaded onto the base 54, is removed by the substrate processor 42 (not shown). When the substrate processor 42 delivers a new substrate W3 (not shown) to the base 54, the first polishing head 20a picks up the new substrate W3 from the base 54. The polishing pad trimming arm 70 moves to a position below the base 54 of the substrate loading / unloading device 50 at the first substrate loading / unloading position 20a′ to trim the polishing pad 11.

[0193] In the second polishing mode, the second polishing head 20b unloads the substrate W2 from the base 54 at the second substrate loading / unloading position 20b′, while the first polishing head 20a polishes the substrate W3 at the first substrate polishing position 20a″. The substrate W2 unloaded onto the base 54 is removed by the substrate processor 42. When the substrate processor 42 delivers a new substrate W4 (not shown) to the base 54, the second polishing head 20b picks up the new substrate W4 from the base 54. The polishing table 10 can rotate along the first or second rotation directions 10a, 10b. The polishing pad trimming arm 70 moves to a position below the base 54 at the second substrate loading / unloading position 20b′ to trim the polishing pad 11.

[0194] The process of switching from the first polishing mode to the second polishing mode includes: raising the second polishing head 20b from the second substrate polishing position 20b″ to the second substrate loading / unloading position 20b′; swinging and rotating the base 54 of the substrate loading / unloading device 50 around axis 2 to below the second polishing head 20b; and lowering the first polishing head 20a to the first substrate polishing position 20a″.

[0195] Referring to Figures 30(a) and 30(b), an embodiment of the substrate polishing unit 900 is described. Figure 30(a) shows a first polishing mode, and Figure 30(b) shows a second polishing mode. A polishing pad trimming arm 70 and an abrasive slurry supply arm 80 are disposed on opposite sides of the polishing table 10. The substrate polishing unit 900 includes first and second abrasive slurry supply positions 84a and 84b on the polishing pad 11. The first abrasive slurry supply position 84a is located near the central axis 12 between the first polishing head 20a and the polishing table 10, and the second abrasive slurry supply position 84b is located near the central axis 12 between the second polishing head 20b and the polishing table 10. The abrasive slurry supply arm 80 rotates about a rotation axis 82 to move to the first and second abrasive slurry supply positions 84a and 84b.

[0196] In the first polishing mode shown in Figure 30(a), the second polishing head 20b polishes the substrate, while the first polishing head 20a remains above the base 54 of the substrate loading / unloading device 50. The polishing pad trimming arm 70 rotates 74a below the first polishing head 20a and below the base 54 to trim the polishing pad 11. The polishing slurry supply arm 80 moves to the second polishing slurry supply position 84b to supply polishing slurry. The polishing table 10 rotates along a second rotation direction 10b, corresponding to the direction in which polishing slurry flows from the second polishing slurry supply position 84b to the second polishing head 20b. The substrate processor 42 enters between the first polishing head 20a and the base 54 to remove or deliver the substrate.

[0197] In the second polishing mode shown in Figure 30(b), the first polishing head 20a polishes the substrate, while the second polishing head 20b rests above the base 54 of the substrate loading / unloading device 50. The base 54 moves from below the first polishing head 20a to below the second polishing head 20b. The polishing pad trimming arm 70 rotates 74b around the position below the second polishing head 20b and below the base 54 to trim the polishing pad 11. The polishing slurry supply arm 80 moves to the first polishing slurry supply position 84a to supply polishing slurry. The first rotation direction 10a corresponds to the direction in which the polishing slurry flows from the first polishing slurry supply position 84a to the first polishing head 20a. The substrate processor 42 enters between the second polishing head 20b and the base 54 to remove or deliver the substrate.

[0198] The polishing pad trimming arm 70 is mounted on a linear guide rail 270 and can reciprocate between a first trimming position 272 and a second trimming position 274 located at both ends of the linear guide rail 270. In the first polishing mode, the rotation axis 72 of the polishing pad trimming arm 70 moves to the first trimming position 272 to trim the first polishing head 20a and the polishing pad 11 below the substrate loading / unloading device 50; in the second polishing mode, the rotation axis 72 moves to the second trimming position 274 to trim the second polishing head 20b and the polishing pad 11 below the substrate loading / unloading device 50.

[0199] The dressing station 76 is located near the linear guide rail 270. When the rotation axis 72 of the polishing pad dressing arm 70 moves to a position close to the first dressing position 272, the polishing pad dressing arm 70 can be rotated so that the dressing 74 suspended at its end is positioned at the dressing station 76.

[0200] Referring to FIG31, the substrate polishing unit 900 may include a polishing pad trimming arm 70 and first and second polishing slurry supply arms 80a and 80b. The first and second polishing slurry supply arms 80a and 80b are disposed on opposite sides of the polishing pad trimming arm 70, separated by a plane A. The rotation axis 72 of the polishing pad trimming arm 70 is disposed near the plane A. The plane A includes the axes 27a and 27b of the first and second polishing heads 20a and 20b, and is perpendicular to the polishing table 10. The first and second polishing slurry supply arms 80a and 80b are disposed opposite each other, separated by a plane B, which is perpendicular to the plane A and includes the axis 12 of the polishing table 10.

[0201] In the first polishing mode shown in Figure 31(a), the second polishing head 20b polishes the substrate W, while the second polishing slurry supply arm 80b moves to the second polishing slurry supply position 84b to supply polishing slurry. The polishing table 10 rotates along the second rotation direction 10b. The polishing pad trimming arm 70 rotates 74a below the first polishing head 20a and below the base 54 of the substrate loading / unloading device 50 to trim the polishing pad 11.

[0202] In the second polishing mode shown in Figure 31(b), the first polishing head 20a polishes the substrate W, while the first slurry supply arm 80a moves to the first slurry supply position 84a to supply slurry. The polishing table 10 rotates along the first rotation direction 10a. The polishing pad trimming arm 70 rotates 74b below the second polishing head 20b and below the base 54 of the substrate loading / unloading device 50 to trim the polishing pad 11.

[0203] Reference Figure 32 A substrate polishing apparatus 900 according to an embodiment of the present invention includes two polishing pad trimming arms 70a and 70b. Figure 32The state of the polishing pad trimming arms in their respective parking positions is shown. The substrate processor 42 transports the substrate between the substrate loading / unloading device 50 and the outside along a first plane 260a parallel to plane A. The substrate loading / unloading device 50 is disposed below the first polishing head 20a.

[0204] The rotation axis 72a of the first polishing pad trimming arm 70a is positioned near plane A, between the first polishing head 20a and the second plane 260b of the tetrahedral frame 260. The end 70a′ of the first polishing pad trimming arm 70a is located near the edge between the second plane 260b and the third plane 260c, or near the edge between the first plane 260a and the second plane 260b. The first polishing pad trimming arm 70a moves toward the first substrate loading / unloading position 20a′ and rotates 79a below the first polishing head 20a to trim the polishing pad 11.

[0205] The rotation axis 72b of the second polishing pad trimming arm 70b is positioned near plane A, between the second polishing head 20b and the fourth plane 260d of the tetrahedral frame 260. The end 70b′ of the second polishing pad trimming arm 70b is located near the edge between the fourth plane 260d and the first plane 260a, or near the edge between the third plane 260c and the fourth plane 260d. The second polishing pad trimming arm 70b moves toward the second substrate loading / unloading position 20b′ and rotates 79b below the second polishing head 20b to trim the polishing pad 11.

[0206] The substrate polishing unit 900 operates alternately between a first polishing mode and a second polishing mode. For example... Figure 32 As shown, in the first polishing mode, the first polishing head 20a exchanges substrate W with the substrate loading / unloading device 50 above the device, while the second polishing head 20b polishes the substrate W on the polishing pad 11. The first polishing pad trimming arm 70a pivots 79a below the substrate loading / unloading device 50 to trim the polishing pad 11, while the second polishing pad trimming arm 70b remains in a parking position outside the polishing table 10.

[0207] After the first polishing mode is completed, the second polishing head 20b rises to the second substrate loading / unloading position 20b', and the substrate loading / unloading device 50 moves below the second polishing head 20b. The first polishing pad trimming arm 70a moves to a resting position outside the polishing table 10. Subsequently, in the second polishing mode, the second polishing head 20b exchanges substrate W with the substrate loading / unloading device 50 above the device, while the first polishing head 20a polishes substrate W on polishing pad 11. The second polishing pad trimming arm 70b pivots 79b below the substrate loading / unloading device 50 to trim the polishing pad 11, while the first polishing pad trimming arm 70a remains in the resting position outside the polishing table 10.

[0208] The substrate polishing unit 900 may include first and second polishing slurry supply arms 80a and 80b. For example... Figure 32 As shown, each polishing slurry supply arm is positioned at its respective resting position outside the polishing table 10. At its resting position, the pivot 82a of the first polishing slurry supply arm 80a is located near the pivot 72a of the first polishing pad trimming arm 70a, with its distal end 80a' located between the first plane 260a and plane B. The pivot 82b of the second polishing slurry supply arm 80b is located near the pivot 72b of the second polishing pad trimming arm 70b, with its distal end 80b' located between the third plane 260c and plane B. The pivots 82a and 82b of the first and second polishing slurry supply arms 80a and 80b are arranged opposite each other with respect to the axis 12 of the polishing table 10.

[0209] In the second polishing mode, when the first polishing head 20a polishes the substrate, the first polishing slurry supply arm 80a rotates 89a about its pivot axis 82a, supplying polishing slurry to the first polishing slurry supply position 84a. In the first polishing mode, when the second polishing head 20b polishes the substrate, the second polishing slurry supply arm 80b rotates 89b about its pivot axis 82b, supplying polishing slurry to the second polishing slurry supply position 84b. The first and second polishing slurry supply positions 84a and 84b are arranged opposite each other with the axis 12 of the polishing table 10 as the center. In both the first and second polishing modes, the polishing table 10 rotates in the same direction 10a.

[0210] According to this embodiment of the present invention, in a substrate polishing apparatus in which two polishing heads 20a and 20b alternately polish a substrate on a single polishing pad 11, two polishing pad trimming arms 70a and 70b can alternately trim the polishing pad. Furthermore, two abrasive slurry supply arms 80a and 80b can also alternately supply abrasive slurry to the polishing pad 11.

[0211] This application integrates 13 previously filed Korean patent applications. In some of the previous applications, the same parts used different reference numerals. In this application, the same reference numerals are used for the same parts. Reference numerals that used different methods in the earlier applications have also been standardized in this application.

[0212] Although the present invention has been described in conjunction with preferred embodiments, the scope of protection of the present invention is not limited to the specific embodiments described above. All modifications, alterations, or improvements falling within the scope of the technical concept of the present invention, especially those falling within the scope defined by the claims, should be included within the scope of protection of the present invention.

Claims

1. A substrate polishing apparatus, comprising a substrate polishing unit and a substrate conveying device for conveying a substrate to the substrate polishing unit, characterized in that, The substrate polishing unit includes: A polishing table, which is equipped with a polishing pad and provides a polishing surface for polishing a substrate, is configured to rotate about a first rotation axis; The substrate polishing position is located above the polishing surface; A polishing head is used to polish the substrate at the substrate polishing location. The substrate loading / unloading position is located above the polishing stage; and A substrate loading / unloading device is disposed above the polishing stage and configured to exchange substrates with the polishing head at the substrate loading / unloading position; The polishing head reciprocates between the substrate polishing position and the substrate loading / unloading position, and is configured to polish the substrate on the polishing pad at the substrate polishing position, and exchange substrates with the substrate loading / unloading device at the substrate loading / unloading position. Furthermore, the substrate conveying device can extend into the space between the polishing head and the substrate loading / unloading device, and exchange substrates with the substrate loading / unloading device above the polishing table.

2. The substrate polishing apparatus according to claim 1, characterized in that, The polishing head reciprocates along a linear guide rail between the substrate polishing position and the substrate loading / unloading position.

3. The substrate polishing apparatus according to claim 1, characterized in that, The polishing head reciprocates between the substrate polishing position and the substrate loading / unloading position by rotating about a second rotation axis disposed between the substrate loading / unloading position and the substrate polishing position.

4. The substrate polishing apparatus according to claim 3, characterized in that, The shortest straight-line distance between the first rotation axis and the second rotation axis is equal to or less than half the distance between the edge of the polishing table and the fence set around the perimeter of the polishing table.

5. The substrate polishing apparatus according to claim 1, characterized in that, It also includes a polishing pad trimming arm that moves below the substrate loading / unloading device to trim the polishing pad.

6. The substrate polishing apparatus according to claim 1, characterized in that, The polishing head is connected to a vertical shaft that protrudes downward from the inside of a housing, the housing including a downwardly protruding stepped portion, and the stepped portion being carried and supported by a turntable bearing.

7. The substrate polishing apparatus according to claim 1, characterized in that, It also includes a shielding plate disposed between the lower part of the substrate loading / unloading device and the polishing table, wherein the substrate exchange between the polishing head and the substrate loading / unloading device is performed above the shielding plate.

8. The substrate polishing apparatus according to claim 7, characterized in that, The shielding plate extends above the polished position of the substrate.

9. The substrate polishing apparatus according to claim 7, characterized in that, The polishing pad trimming arm trims the polishing pad below the shielding plate.

10. The substrate polishing apparatus according to claim 5, characterized in that, The polishing head is configured to first rise vertically a distance greater than the sum of the height of the substrate loading / unloading device and the height of the polishing pad trimming arm at the substrate polishing position to avoid interference, and then move to the substrate loading / unloading position.

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