Aluminum plate processing device and processing technology thereof

Abstract

The aluminum plate machining device comprises an equipment base, a frame used for supporting plates is arranged on the equipment base, and the frame comprises a plurality of supporting pieces arranged in a sliding mode and a machining module. The machining module comprises a laser used for laser cutting, a taper hole device used for taper hole machining and a pressure plate unit, the pressure plate unit comprises a pressure plate piece and a delivery device, and a guide piece is arranged on the laser. According to the aluminum plate machining device and the machining technology thereof, in the hole positioning process, the supporting piece is moved to the position below the machining hole, the periphery of the hole is supported, the machining area is pressed through the pressing disc piece, a plate is in a pressed state during machining, and the machining efficiency is improved. And the machining head is provided with a machining space for penetrating and machining the hole downwards, so that taper hole machining of the plate is directly completed in the laser cutting process, errors caused by secondary positioning are avoided, and meanwhile the machining efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of aluminum plate technology, and in particular to an aluminum plate processing apparatus and its processing technology. Background Technology

[0002] Aluminum sheets, due to their excellent lightweight properties, good mechanical strength, corrosion resistance, and machinability, are widely used in aerospace, precision instrument manufacturing, electronic equipment, and high-end equipment fields. Especially in applications with extremely high weight sensitivity, such as aircraft fuselage structures, spacecraft components, and high-precision instrument housings, aluminum sheets, as core structural materials, significantly reduce the overall load on the equipment due to their light weight, meeting the design requirements of high strength and low energy consumption. Meanwhile, precision instruments have extremely stringent requirements for the dimensional accuracy, surface flatness, and stress distribution of aluminum sheets. Riveting connections, due to their structural stability and uniform stress transmission, have become the mainstream process for assembling aluminum sheet components. Among these, countersunk riveting holes, as a key connection structure, must ensure hole position accuracy, hole diameter consistency, and hole wall smoothness to avoid problems such as assembly stress concentration, sealing failure, or reduced structural strength.

[0003] However, a significant technical bottleneck exists in current aluminum plate processing technology: while laser cutting technology is widely used for initial hole drilling in aluminum plates (such as contour cutting or preliminary positioning holes), the resulting hole surface has burrs, irregular bumps, and micro-roughness, leading to uneven hole edges. In subsequent processing of countersunk riveting holes, secondary positioning processing (i.e., fine finishing or enlarging based on the laser-cut hole) is required. However, due to the roughness of the laser-cut hole, it is difficult to accurately establish a positioning reference. Specifically, during secondary positioning, the positioning device (such as a drill bit or fixture) relies on the geometric features of the laser-cut hole as a reference, but the rough hole wall easily causes positioning offset, thus causing the countersunk hole position to shift. Summary of the Invention

[0004] This invention addresses the shortcomings of existing technologies by providing an aluminum plate processing apparatus and its processing technology. This application eliminates the need for secondary positioning by directly performing tapered hole processing after laser hole processing.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an aluminum plate processing device, comprising a base, a frame for supporting the plate, the frame including multiple slidably arranged support members, a processing module including a laser for laser cutting and a tapered hole device for tapered hole processing, a pressure plate unit including a pressure plate component and a feeding device, a guide member on the laser for guiding the support members to move below the hole to be processed when the laser is making a positioning hole, the feeding device for feeding the pressure plate component to the hole position of the plate, cooperating with the support members to press the plate together, and the tapered hole device performing tapered hole processing on the hole after the laser has finished cutting the hole.

[0006] Its beneficial effect is that, during the hole positioning process, the support is moved to the bottom of the hole to form support around the hole, and the processing area is pressed by the pressure plate, so that the plate is in a pressed state during processing, and the processing head has processing space to penetrate the hole.

[0007] In the above scheme, preferably, the support member includes a first telescopic member and a support rod. The support rod is used to support the plate when the outer contour is cut. When the hole is cut, the first telescopic member extends to support the plate, and the support rod sinks into the first telescopic member. A machining hole for the tapered hole device to descend is formed on the first telescopic member.

[0008] In the above scheme, preferably, the bottom of the support member is equipped with multiple universal ball joints for sliding on the frame and magnetic components for locking after positioning, and each support member is connected by a flexible cloth to close and isolate the sliding area on the frame.

[0009] In the above scheme, preferably, the frame is equipped with a flexible limiting member for resetting the support member. The flexible limiting member divides the frame into multiple regions by a warp and weft arrangement. Each region is equipped with a support member. The support member is moved to its initial position by tightening the flexible limiting member.

[0010] In the above scheme, preferably, the delivery device includes a storage compartment and a pusher. The storage compartment stores a magnetically attracted pressure plate. The pusher is driven by a telescopic component to move back and forth to attract the pressure plate in the storage compartment and push it to the area below the laser. After the hole is positioned, the pressure plate is delivered to the upper surface of the plate.

[0011] In the above scheme, preferably, the processing module further includes a pressing device, and the tapered hole device includes a power component equipped with a processing head. The pressing device is used to drive the processing head downward to perform tapered hole processing on the hole.

[0012] In the above scheme, preferably, the processing module also includes a detection unit. The detection unit and the tapered hole device are synchronously guided and slidably configured below the pressing device, and the work position is switched through the telescopic component. After the tapered hole is processed, the detection unit moves to the bottom of the pressing device so that the detection head on the detection unit moves down to detect the tapered hole.

[0013] In the above scheme, preferably, the detection unit also includes a recovery component, which is used to adsorb the pressure plate component after the detection is qualified, and to move the pressure plate component above the pusher component when the work station is switched, so that the pusher component can send the pressure plate component back to the storage compartment.

[0014] In the above scheme, preferably, the upper end of the storage compartment is equipped with a pulling device, which is used to lift the pressure plate in the storage compartment upward when the pushing member pushes the pressure plate into the storage compartment, and to open the rear limit of the storage compartment so that the pushing member can send the pressure plate into the storage compartment.

[0015] A processing technology for an aluminum plate processing device: S1: The operator places the aluminum plate that needs to be tapered inside the frame.

[0016] S2: The three-axis moving base drives the laser to process the contour of the sheet metal.

[0017] S3: During the laser positioning process in the hole, the support component near the hole is first guided and moved to the bottom of the hole to be processed by the guide component.

[0018] S4: The laser then performs initial hole processing, and then the tapered hole device performs tapered hole processing on the hole.

[0019] The beneficial effects of the present invention are as follows: The present invention provides an aluminum plate processing device and its processing technology. During the hole positioning process, the support member is moved to the bottom of the processing hole to form support around the hole, and the processing area is pressed by the pressure plate member, so that the plate is in a pressed state during processing, and the processing head has processing space to penetrate the hole. This allows the plate to directly complete the tapered hole processing during the laser cutting process, avoiding the errors caused by secondary positioning, and improving processing efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the present invention.

[0021] Figure 2 This is a schematic diagram of part of the device of the present invention.

[0022] Figure 3 This is a schematic diagram of the support unit of the present invention.

[0023] Figure 4 This is a partially enlarged cross-sectional view of the support unit of the present invention.

[0024] Figure 5 This is a schematic diagram of the processing module of the present invention.

[0025] Figure 6 This is a cross-sectional view showing the direction of movement of the pusher component of the present invention.

[0026] Figure 7 This is a cross-sectional view of the conical hole device and detection unit of the present invention in the direction of switching.

[0027] Figure 8 This is a schematic diagram of the internal parts of the processing module of the present invention. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments: Example 1:

[0029] See Figures 1-6 An aluminum plate processing device includes a base 1 and a processing module 2. The base 1 has a processing area specifically for hole processing. This processing area includes a support unit for supporting the processed plate. The processing module 2 is mounted on a three-coordinate moving base and is moved above the base 1 by the three-coordinate moving base. The processing module 2 includes a laser 21 for laser cutting the plate.

[0030] The support unit includes a frame 11, a support member 12, and a flexible limiting member 13. The frame 11 is fixedly configured on the equipment base 1. The frame 11 is a right-angled quadrilateral frame with an open top. Multiple winding devices are arranged on two adjacent right-angled sidewalls of the frame 11. One end of the flexible limiting member 13 is wound onto the winding device, and the other end is fixedly positioned on the opposite sidewall corresponding to the winding device. When the flexible limiting member 13 is tightened, it forms a straight line, and all the flexible limiting members 13 combine to form a grid. The support member 12 has two through holes on its sidewall, and the two through holes are perpendicular to each other. The two perpendicular flexible limiting members 13 are respectively inserted into the two through holes. Therefore, the support member 12 is initially positioned at the intersection of the grid lines. When hole processing is performed, the winding device stops working, and the flexible limiting member 13 can be stretched, allowing the support member 12 to move. When the flexible limiting member 13 is tightened, the support member 12 returns to its initial position.

[0031] The lower end face of the support member 12 is equipped with casters for sliding on the bottom surface of the frame 11, and casters are also provided at each of the four corners to ensure smooth sliding on the bottom surface of the frame 11. Simultaneously, the support member 12 is equipped with an electromagnetic component 123 for magnetic attraction with the bottom surface of the frame 11. The electromagnetic component 123 is elastically slidably disposed on the bottom surface of the support member 12. When energized, it slides downwards and magnetically attracts the bottom surface of the frame 11, thus fixing the support member 12 and preventing further sliding. When the electromagnetic component 123 is de-energized, it automatically and elastically retracts into the bottom surface of the support member 12, thereby disengaging the electromagnetic component 123 from the bottom surface of the frame 11, allowing the support member 12 to slide freely.

[0032] The support member 12 is also equipped with a first telescopic member 121 and a support rod 122. The telescopic rod on the first telescopic member 121 is a hollow push rod. The bottom of the support rod 122 is fixedly connected to the bottom of the support member 12. The hollow hole of the first telescopic rod 121 is slidably disposed on the support member 12. When the first telescopic member 121 retracts, the upper end of the support member 12 extends out of the upper end face of the first telescopic member 121. When the first telescopic member 121 extends, the hollow telescopic rod 1211 rises upward, exceeding the upper end of the support member 12. The upper end face of the hollow telescopic rod 1211 supports the plate to be processed.

[0033] In the initial state, the first telescopic member 121 is in a retracted state, and the support rod 122 extends beyond the upper end face of the first telescopic member 121. In the initial state, the support rod 122 is used to support the plate for contour cutting. After the contour cutting is completed, the first telescopic member 121 rises, and the hollow telescopic rod 1211 abuts against the lower end face of the plate. The support rod 122 is located inside the hollow telescopic rod 1211, and a concave hole is formed in the middle of the hollow telescopic rod 1211. During the rising process, all the support members 12 extend out of the first telescopic member 121 simultaneously, so the plate will not shift during the support conversion process.

[0034] A flexible cloth 14 is also disposed between the support members 12 to prevent the cutting particles from falling downwards. The flexible cloth 14 is always in a relaxed state to prevent the particles from falling downwards onto the bottom surface of the frame 11 when the laser 21 is cutting.

[0035] The processing module 2 includes a laser 21 for laser cutting, a tapered hole device 22 for tapered hole processing, a guide 26, a pressing device 24, and a support 25. The laser 21 is independently configured on a three-axis moving base for contour cutting and hole processing of the sheet metal. The support 25 is fixedly configured on the three-axis moving base, and the support 25 has a first processing hole 251 and a second processing hole 252. The guide 26 is configured on the laser 21 and rises and falls with the laser 21. The first processing hole 251 is located below the laser 21 to provide space for the laser 21 to extend downwards.

[0036] The guide 26 is an electromagnetic component that generates magnetic attraction when energized and has no magnetic attraction when de-energized. When the laser 21 cuts the contour of the plate, the guide 26 does not generate magnetic attraction. After the contour cutting is completed, the hollow telescopic rod 1211 rises upward. The upper end of the hollow telescopic rod 1211 is equipped with a magnetic attraction component, and an induction switch is configured on the magnetic attraction component. The induction switch is used to control the first telescopic component 121 to descend to a set height, so that the upper end of the hollow telescopic rod 1211 at this position is disengaged from the plate.

[0037] In the initial state, the support members 12 are all in fixed positions. During the process of moving the laser 21 to the coordinates of the hole to be positioned, the three-coordinate moving base first moves to the support member 12 closest to the hole. At this time, the guide member 26 is energized, and then the guide member 26 magnetically connects with the magnetic suction member at the upper end of the hollow telescopic rod 1211. Simultaneously, the induction switch also senses the upward magnetic force, thereby controlling the first telescopic member 121 at this position to descend a set height, causing the upper end of the hollow telescopic rod 1211 to disengage from the plate. However, the magnetic suction member at the upper end of the hollow telescopic rod 1211 is still connected to the guide member 1211. The guide 26 is magnetically connected. When the laser 21 moves, it moves the support 12 to below the processing hole. After it moves into place, the guide 26 is de-energized, and the magnetic force on the support 12 disappears. Then, the inductive switch controls the hollow telescopic rod 1211 to rise, and its upper end face touches the lower end face of the plate again. At this time, the laser 21 begins to perform preliminary processing on the hole, i.e., cutting and perforating. The cut material falls into the hollow hole of the hollow telescopic rod 1211. After the hollow telescopic rod 1211 falls, the support rod 122 pushes the particles out of the support 12.

[0038] The support base 25 is also equipped with a pressure plate unit 3. The pressure plate unit 3 includes a pressure plate component 31 and a delivery device 32. The pressure plate component 31 is annular and the same size as the magnetic component. It is made of iron material, so when it is placed above the magnetic component, it can be attracted by the magnetic component. The delivery device 32 includes a storage compartment 321 and a pusher 322. The storage compartment 321 stores a magnetically oriented pressure plate 31. The storage compartment 321 is in a cylindrical state, with a limiting opening 3211 at the lower end facing the laser 21 for one pressure plate 31 to pass through. The pusher 322 is driven by a telescopic component to move back and forth. Each time it pushes forward, it pushes the lowermost pressure plate 31 of the storage compartment 321 below the laser 21. After the laser 21 completes the initial hole processing on the plate, the laser 21 retracts upward into the support base 25. At this time, the pusher 322, controlled by the telescopic component, pushes the lowermost pressure plate 31 in the storage compartment 321 below the laser 21, that is, above the first processing hole 251. Under its own gravity, it falls downward and is magnetically attracted by the magnetic component on the hollow telescopic rod 1211 across the plate, thereby magnetically pressing the plate with the pressure plate 31.

[0039] To ensure the pressure plate 31 falls smoothly downwards, an electromagnetic component is installed on the pusher 322. During the pushing process, the electromagnetic component 31 is magnetically attracted to the pusher 322. After it reaches the first processing hole 251, the electromagnetic component on the pusher 322 is de-energized, causing the pressure plate 31 to fall downwards parallel to the plate. To prevent the pressure plate 31 from hitting the plate surface during the fall, a flexible coating is applied to the surface of the pressure plate 31 so that it will not damage the plate surface when it comes into contact with it.

[0040] The support base 25 is equipped with a tapered hole device 22 and a pressing device 24. The tapered hole device 22 includes a power component 221, which is guided and slidably disposed on the support base 25. A rotating shaft 2212 is vertically guided and slidably disposed on the power component 221. The power component 221 can drive the rotating shaft 2212 to rotate, and the rotating shaft 2212 can also slide vertically relative to the power component 221. A processing head 2211 for tapering the plate is installed at the lower end of the rotating shaft 2212. The pressing device 24 is disposed above the second processing hole 252 and above the tapered hole device 22. The pressing device 24 is an electrically telescopic component. When it extends downward, it presses against the rotating shaft 2212, thereby causing the processing head 2211 to extend downward out of the support base 25. The power component 221 provides rotational force to the processing head 2211, enabling it to taper the hole below.

[0041] After the pressure plate 31 presses the plate tightly, the three-coordinate moving seat drives the support seat 25 to move, so that the second processing hole 252 on it is aligned with the cut hole. At this time, the power component 221 starts to rotate, which in turn drives the processing head 2211 to rotate together. At the same time, the pressing device 24 starts to extend downward, which causes the processing head 2211 to extend downward out of the support seat 25 and act on the cut hole to perform tapered hole processing.

[0042] Its working principle or usage method is as follows: When it is necessary to cut a plate with a tapered hole, the operator places the plate in the area of ​​the frame 11. At this time, the first telescopic member 121 is in a retracted state, and the support rod 122 extends beyond the upper end face of the first telescopic member 121. The support rod 122 is used to support the plate for contour cutting.

[0043] The three-coordinate moving base drives the laser 21 to cut the contour of the plate. After the contour is cut, the first telescopic member 121 rises, and the hollow telescopic rod 1211 abuts against the lower end surface of the plate. The support rod 122 retracts into the hollow telescopic rod 1211. A concave hole is formed in the middle of the hollow telescopic rod 1211. During the rising process, all the support members 12 extend the first telescopic member 121 simultaneously. The plate is raised to a set height synchronously, and the support points operate synchronously. Therefore, the plate will not shift during the support conversion process.

[0044] Then, the coordinate measuring machine begins to move the laser 21 to the position of the hole to be positioned. During the movement, it first moves to the support 12 closest to the positioning hole. At this time, the guide 26 is energized, and the guide 26 is magnetically connected to the magnetic suction part at the upper end of the hollow telescopic rod 1211. At the same time, the induction switch also senses the upward magnetic force, thereby controlling the first telescopic part 121 at this position to descend a set height, so that the upper end of the hollow telescopic rod 1211 is disengaged from the plate. The magnetic component still has a magnetic connection with the guide component 26. At this time, the laser 21 moves, driving the support component 12 to move below the processing hole position. After moving into place, the guide component 26 is de-energized, and the magnetic attraction force on the support component 12 disappears. Then, the inductive switch controls the hollow telescopic rod 1211 to rise, and its upper end face touches the lower end face of the plate again. The concave hole formed by the hollow telescopic rod 1211 is aligned with the hole to be processed by the laser 21. At this time, the laser 21 begins to perform preliminary processing on the hole, that is, cutting and perforating.

[0045] After the cutting and perforation are completed, the laser 21 retracts upward into the support base 25. At this time, the pusher 322 is controlled by the telescopic member to push the lowest pressure plate 31 in the storage compartment 321 to below the laser 21, that is, to above the first processing hole 251. Under its own gravity, it falls downward and is magnetically attracted by the magnetic attraction on the hollow telescopic rod 1211 across the plate, thereby causing the pressure plate 31 to magnetically press the plate.

[0046] At this time, the three-coordinate moving seat drives the support seat 25 to move, so that the second machining hole 252 on it is aligned with the cut hole. At this time, the power component 221 starts to rotate, which in turn drives the machining head 2211 to rotate together. At the same time, the pressing device 24 starts to extend downward, which causes the machining head 2211 to extend downward out of the support seat 25 and act on the cut hole to perform tapered hole machining.

[0047] Example 2:

[0048] See Figures 1-6 This embodiment makes the following further improvements based on embodiment 1: The processing module 2 further includes a detection unit 23, which includes a detection head 231 and a recovery component 232. The detection head 231 is configured to slide on the outer shell derivative plate of the power component 221. At the same time, a transverse guide rod 253 is configured on the support base 25. The outer shell of the power component 221 is guided and slidably configured on the guide rod 253. The power component 221 is controlled to reciprocate along the axis of the guide rod 253 by a telescopic component.

[0049] The forward and backward movement causes the detection head 231 or the processing head 2211 to alternately align with the second processing hole 252, i.e., located below the pressing device 24. When the processing head 2211 is located below the pressing device 24, the pressing device 24 moves downward to perform tapered hole processing on the plate. After processing is completed, the pressing device 24 retracts upward, and the rotating shaft 2212 returns to its initial position under the action of the elastic element. At this time, the telescopic element controls the movement of the power element 221, causing the detection head 231 to align with the second processing hole 252. Then, the pressing device 24 moves downward again, and the detection head 231 detects the tapered hole on the plate.

[0050] A recovery component 232 is configured on the detection head 231. The recovery component 232 is also an electromagnetic component. When energized, it can generate a magnetic attraction force. If the detection head 231 detects the conical hole of the plate as qualified, the recovery component 232 will start to be energized. Then, the recovery component 232 will attract the pressure plate component 31 located on the plate. After the pressing device 24 returns to the upward, the detection head 231 will also return to its initial position under the action of the elastic component. At the same time, the magnetic attraction force of the recovery component 232 on the pressure plate component 31 is greater than the magnetic attraction force of the hollow telescopic rod 1211 on the pressure plate component 31. Therefore, during the return process of the detection head 231, the pressure plate component 31 is attracted to the recovery component 232 and moves with the recovery component 232.

[0051] At this time, the telescopic component drives the power component 221 to move, so that the processing head 2211 is back below the pressing device 24, preparing for the next taper hole processing. The pushing component 322 includes a front semi-circular pushing plate 3221 and a rear support plate 3222. The semi-circular pushing plate 3221 is equipped with an electromagnetic component to attract the pressure plate component 31 when it is pushed out, while the support plate 3222 is equipped with a magnetic component to attract the pressure plate component 31. When the pushing component 322 retracts, the support plate 3222 is located below the retracted detection head 231.

[0052] In normal operation, the pusher 322 is always retracted into the storage compartment 321. At this time, the support plate 3222 is located below the retracted detection head 231, and the pressure plate 31 is magnetically attached to the recovery part 232 of the retracted detection head 231. When the recovery part 232 is de-energized, the pressure plate 31 falls onto the support plate 3222 and is then attracted by the magnetic attachment on the support plate 322.

[0053] The storage compartment 321 is equipped with a pulling device 33 at its upper end. The pulling device 33 includes a lifting magnetic 331, a pull rope 332, and a lifting winding component. The lifting winding component is disposed at the upper end of the storage compartment 321. The lifting magnetic 331 is located inside the storage compartment 321 and is connected to the lifting winding component through the pull rope 332. The lifting winding component rotates to gather and wind the pull rope 332, thereby driving the lifting magnetic 331 to move upward.

[0054] The lifting magnetic chuck 331 is located at the top of the storage compartment 321, and the pressure plate 31 is attracted to the lifting magnetic chuck 331. At the same time, the magnetic attraction of the lifting magnetic chuck 331 is configured to attract all the columnar pressure plate 31s stacked in sequence in the storage compartment 321. The lifting winding member lifts the magnetic chuck 331 upward through the pull rope 332, thereby causing the bottommost pressure plate 31 to leave the bottom surface of the support base 25. When the storage compartment 321 is full, the lifting magnetic chuck 331 can still lift at least two pressure plate 31s upward.

[0055] In normal operation, the lifting winding component is in a de-energized and relaxed state. Therefore, the pressure plates 31 within the pressure plate component 31 are stacked together and press against the bottom surface of the support base 25. The thickness of the pushing component 322 is the same as the thickness of one pressure plate component 31. Therefore, when the dragging component 322 moves back and forth in and out of the storage compartment 321, it can push the pressure plate component 31 in the storage compartment 321 forward to below the laser 21. During the recycling operation, the storage bin 321 has a recycling opening 3212 with two pressure plate components 31 thicknesses at its rear end. An inclined blocking component 323 is elastically slidably disposed on the recycling opening 3212. The inclined surface of the inclined blocking component 323 faces downward, and the recycling component 232 transfers the pressure plate component 31 to the direction of the support plate 322. Therefore, when the support plate 322 moves towards the storage bin 321 with the pressure plate component 31, the side wall of the pressure plate component 31 touches the inclined surface of the inclined blocking component 323, thereby causing the inclined blocking component 323 to move upward. After it passes, it automatically falls down, preventing the support plate 322 from moving backward and transferring the pressure plate component 31 in the storage bin 321 backward.

[0056] After the conical hole inspection is passed, the lifting winding component is energized, which causes the pressure plate component 31 in the storage compartment 321 to move upward, providing clearance for the support plate 322 to move the recovered pressure plate component 31 into the storage compartment 321. After the support plate 322 moves backward back to the initial position, the lifting winding component is de-energized, which causes the pressure plate component 31 to fall. Then, the lifting magnetic suction component 331 establishes a magnetic connection with the recovered pressure plate component 31 through the magnetic force conduction of the pressure plate component 31.

[0057] Its working principle or usage method is as follows: After the tapered hole device completes the tapered hole processing of the hole, the power component 221 is controlled by the telescopic component to move along the axis of the guide rod 253, so that the detection head 231 is aligned with the second processing hole 252. At this time, the pressing device 24 moves down again, and the detection head 231 detects the tapered hole on the plate.

[0058] If the detection head 231 detects the conical hole of the plate as qualified, the recycling component 232 will be energized, and then the recycling component 232 will attract the pressure plate component 31 located on the plate. After the pressing device 24 returns to the upward position, the detection head 231 will also return to its initial position under the action of the elastic element. The pressure plate component 31 will be attracted to the recycling component 232 and move together with the recycling component 232.

[0059] If the detection head 231 fails to detect the conical hole in the sheet metal, the operation to recover the pressure plate 31 will not proceed, an alarm will be triggered, and the operator will be notified to repair or replace the processing head 2211. The sheet metal to be processed will then be transferred to manual processing. After the processing head 2211 has been repaired or replaced, the equipment will restart cutting new sheet metal.

[0060] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An aluminum plate processing device, characterized in that: Includes a device base (1), on which a frame (11) for supporting the plate is disposed, the frame (11) including a plurality of slidingly disposed support members (12); The processing module (2) includes a laser (21) for laser cutting and a tapered hole device (22) for tapered hole processing. The pressure plate unit (3) includes a pressure plate component (31) and a delivery device (32). The laser (21) is equipped with a guide (26). The guide (26) is used to guide the support (12) to move below the hole to be processed when the laser (21) is making a positioning hole. The delivery device (32) is used to deliver the pressure plate component (31) to the hole position of the plate and cooperate with the support (12) to press the plate. The tapered hole device (22) performs tapered hole processing on the hole after the laser (21) has finished cutting the hole.

2. The aluminum plate processing device according to claim 1, characterized in that: The support member (12) includes a first telescopic member (121) and a support rod (122). The support rod (122) is used to support the plate when the outer contour is cut. When the hole is cut, the first telescopic member (121) extends to support the plate, and the support rod (122) sinks into the first telescopic member (121). A machining hole for the tapered hole device (22) to descend is formed on the first telescopic member (121).

3. The aluminum plate processing device according to claim 1, characterized in that: The bottom of the support member (12) is provided with a universal ball for sliding on the frame (11) and a magnetic member for locking after positioning. Each support member (12) is connected by a flexible cloth to close and isolate the sliding area on the frame (11).

4. The aluminum plate processing device according to claim 1, characterized in that: The frame (11) is provided with a flexible limiting member (13) for resetting the support member (12). The flexible limiting member (13) divides the frame (11) into multiple regions by a latitude and longitude arrangement. Each region is provided with a support member (12). The support member (12) is moved to the initial position by tightening the flexible limiting member (13).

5. The aluminum plate processing device according to claim 1, characterized in that: The delivery device (32) includes a storage compartment (321) and a pusher (322). The storage compartment (321) stores a magnetically attracted pressure plate (31). The pusher (322) is driven by a telescopic component to move back and forth to attract the pressure plate (31) in the storage compartment (321) and push it to the bottom of the laser (21). After the hole is positioned, the pressure plate (31) is placed on the upper surface of the plate.

6. The aluminum plate processing device according to claim 5, characterized in that: The processing module (2) also includes a pressing device (24), and the tapered hole device (22) includes a power component (221) equipped with a processing head (2211). The pressing device (24) is used to drive the processing head (2211) downward to perform tapered hole processing on the hole.

7. The aluminum plate processing device according to claim 6, characterized in that: The processing module (2) also includes a detection unit (23). The detection unit (23) and the tapered hole device (22) are synchronously guided and slidably configured below the pressing device (24), and the work position is switched through the telescopic component. After the tapered hole is processed, the detection unit (23) moves to the lower part of the pressing device (24) so ​​that the detection head (231) on the detection unit (23) moves down to detect the tapered hole.

8. The aluminum plate processing device according to claim 7, characterized in that: The detection unit (23) also includes a recovery component (232) for adsorbing the pressure plate component (31) after the detection is qualified, and moving the pressure plate component (31) above the pusher component (322) when the work station is switched, and sending the pressure plate component (31) back to the storage compartment (321) by the pusher component (322).

9. The aluminum plate processing device according to claim 8, characterized in that: The upper end of the storage compartment (321) is provided with a pulling device (33) to lift the pressure plate (31) in the storage compartment (321) upward when the pusher (322) pushes the pressure plate (31) into the storage compartment (321), and to open the rear limit of the storage compartment (321) so that the pusher (322) can send the pressure plate (31) into the storage compartment (321).

10. The processing technology using the aluminum plate processing apparatus as described in claim 1, characterized in that: S1: The operator places the aluminum plate that needs to be tapered into the frame (11); S2: The three-coordinate moving seat drives the laser (21) to perform contour processing of the plate; S3: During the positioning of the laser (21) in the hole, the support (12) at the nearest position of the hole is first guided by the guide (26) to move to the bottom of the hole to be processed; S4: The laser (21) performs initial hole processing, and then the conical hole device (22) performs conical hole processing on the hole.

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