Multi-core-group molded ceramic capacitor and production method thereof

Abstract

The invention relates to a multi-core-group molded ceramic capacitor and a production method thereof, the molded ceramic capacitor comprises a capacitor body and a packaging body wrapping the periphery of the capacitor body, and the capacitor body comprises a first welding support, a second welding support, a plurality of middle support groups and two capacitor chip groups; the first welding bracket is provided with a plurality of first welding plates which are arranged at intervals; the second welding support is opposite to the first welding support, and a plurality of second welding plates are arranged on the second welding support at intervals. The multiple middle support sets are arranged between the first welding support and the second welding support at intervals. The two capacitor chip sets are oppositely arranged on the two sides of the first welding support, the second welding support and the multiple middle support sets. According to the invention, the structure of the multi-core-group molded ceramic capacitor is specifically limited, and the plurality of middle support groups are matched with the first welding support and the second welding support, so that the series-parallel connection of the plurality of capacitor chips is realized, and the obtained molded ceramic capacitor has better electrical performance parameters, reliability and structural strength.

Description

Technical Field

[0001] This invention belongs to the field of ceramic capacitor manufacturing, specifically relating to a multi-core molded ceramic capacitor and its production method. Background Technology

[0002] Driven by technological advancements, capacitors are evolving towards miniaturization, micro-miniaturization, and increased capacitance. However, simply changing the manufacturing process and materials used in production of a single molded capacitor makes it difficult to achieve significant improvements in capacitance, high voltage resistance, and low equivalent series resistance. Furthermore, directly using multiple molded capacitors in series or parallel within a circuit increases the complexity of the circuit design and the space they occupy on the circuit board, requiring further improvement. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a multi-core molded ceramic capacitor and its manufacturing method.

[0004] The present invention adopts the following technical solution: A multi-core molded ceramic capacitor includes a capacitor body and an encapsulation body covering the periphery of the capacitor body. The capacitor body includes a first welding bracket, a second welding bracket, a plurality of intermediate bracket groups, and two capacitor chip groups. The first welding support is provided with multiple first welding plates arranged at intervals; The second welding support is opposite to the first welding support, and multiple second welding plates are arranged at intervals on it. Multiple intermediate support groups are spaced apart between the first welding support and the second welding support. Each intermediate support group includes multiple intermediate supports arranged at intervals. The multiple intermediate supports are opposite to multiple first welding plates. Each intermediate support includes a support main board, two first electrode plates spaced apart on one side of the support main board, and a second electrode plate on the other side of the support main board. The two first electrode plates are located on both sides of an adjacent first welding plate or on both sides of a second electrode plate of an adjacent intermediate support. The second electrode plate is located between two adjacent second welding plates or between two first electrode plates of an adjacent intermediate support. Two capacitor chip groups are disposed opposite to each other on both sides of a first welding bracket, a second welding bracket, and a plurality of intermediate bracket groups. Each capacitor chip group includes a plurality of capacitor chips, which are disposed between the first welding plate and an adjacent first electrode plate, or between the second electrode plate and an adjacent first electrode plate, or between the second electrode plate and an adjacent second welding plate.

[0005] Furthermore, the plurality of second welding plates include two second side welding plates and two second intermediate welding plates located between the two second side welding plates. The second intermediate welding plates are provided with relief grooves extending inward from their ends, the relief grooves being opposite to the gaps between two adjacent intermediate supports in the same group.

[0006] Furthermore, the first welding bracket includes a first bracket body and a first connecting pin disposed on the outside of the first bracket body, a plurality of first welding plates are disposed at intervals on the inside of the first bracket body, and the first connecting pin extends outward to the outside of the package.

[0007] A method for producing a multi-core molded ceramic capacitor includes the following steps: Step 1: Place the lower chip positioning frame on the soldering base, then place multiple capacitor chips in the lower chip positioning frame according to the arrangement order of the capacitor chips in the capacitor chip group, and place two lower elastic members on the soldering base so that the lower chip positioning frame is positioned between the two lower elastic members. Step 2: After applying solder paste to the corresponding positions on the capacitor frame, place it in the soldering base, and then support the limiting frame on the capacitor frame. Step 3: Place the upper chip positioning frame in the limiting frame, place multiple capacitor chips in the upper chip positioning frame according to the arrangement order of the capacitor chips in the capacitor chip group, and place two upper elastic members in the limiting frame so that the upper chip positioning frame is placed between the two upper elastic members. Step 4: The assembled welding base is fed into the welding equipment so that the capacitor frame and multiple capacitor chips are welded together. After welding, part of the capacitor frame structure is removed to allow the capacitor body to be molded into a package. After molding, the remaining part of the capacitor frame structure is removed to obtain the multi-core molded ceramic capacitor.

[0008] Furthermore, the capacitor frame includes a frame body and a welding unit. The welding unit includes a welding assembly, a plurality of first connecting ribs, a plurality of second connecting ribs, and a plurality of third connecting ribs. The welding assembly includes a first welding bracket, a second welding bracket, and a plurality of intermediate bracket groups. The plurality of first connecting ribs are respectively disposed between the frame body and the first welding bracket. The plurality of second connecting ribs are respectively connected between the frame body and the opposite first electrode plate. The plurality of third connecting ribs are respectively connected between two adjacent intermediate brackets in the same group. The outer sides of the first welding bracket and the second welding bracket are respectively connected to the frame body.

[0009] Furthermore, in step 4, after welding is completed, multiple second connecting ribs and multiple third connecting ribs are first removed in order to mold the capacitor body into an encapsulation. After molding is completed, multiple first connecting ribs are then removed to obtain the multi-core molded ceramic capacitor.

[0010] Furthermore, the first and second connecting ribs are arranged in a trapezoidal shape, the third connecting rib is arranged in a triangular shape, and the end of the third connecting rib is connected to the opposite first electrode plate.

[0011] Furthermore, the welding base is provided with a lower positioning groove for placing the lower chip positioning frame and an mounting groove for mounting the capacitor frame, and the limiting frame is provided with an upper positioning groove for placing the upper chip positioning frame, with the lower positioning groove and the upper positioning groove being arranged vertically opposite each other.

[0012] Furthermore, the welding base is also provided with two opposing limiting blocks, and the limiting frame is supported on the capacitor frame and located between the two limiting blocks.

[0013] Furthermore, the upper chip positioning frame is provided with a plurality of upper product slots for placing capacitor chips, and the lower chip positioning frame is provided with a plurality of lower product slots for placing capacitor chips.

[0014] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: The present application specifically defines the structure of the multi-core molded capacitor, and sets multiple intermediate support groups to cooperate with the first welding support and the second welding support to realize the series and parallel connection of multiple capacitor chips, so that the obtained molded ceramic capacitor has better electrical performance parameters, reliability and structural strength; at the same time, it specifically defines the production method of the molded ceramic capacitor, and by setting elastic elements between the upper chip positioning frame and the limiting frame, and between the lower chip positioning frame and the welding base, the expansion deformation during the welding process is buffered to ensure the quality of the capacitor body after welding, and further defines the structure of the capacitor frame, so that it can not only have series and parallel connection functions, but also meet the design conditions for simple and quick mass production, which greatly improves production efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a multi-core molded ceramic capacitor; Figure 2 This is an exploded view of a multi-core molded ceramic capacitor. Figure 3 This is a schematic diagram of the capacitor body. Figure 4 This is a schematic diagram of the welding device. Figure 5 Schematic diagram of the welding apparatus Figure 1 ; Figure 6 Schematic diagram of the welding apparatus Figure 2 ; Figure 7 This is a schematic diagram of the welding base structure; Figure 8 This is a schematic diagram of the capacitor frame structure; Figure 9 This is a partial structural diagram of the capacitor frame; In the diagram, 1. Capacitor body; 2. Package; 3. Capacitor frame; 4. Welding base; 5. Lower chip positioning frame; 6. Lower elastic element; 7. Limiting frame; 8. Upper chip positioning frame; 9. Upper elastic element; 11. First welding bracket; 111. First bracket body; 112. First connecting pin; 113. First welding plate; 12. Second welding bracket; 121. Second bracket body; 122. Second connecting pin; 123. Second welding plate; 24. Clearance slot; 13. Intermediate support; 131. Support mainboard; 132. First electrode plate; 133. Second electrode plate; 14. Capacitor chip; 31. Frame body; 32. Welding unit; 33. First connecting rib; 34. Second connecting rib; 35. Third connecting rib; 36. Positioning hole; 41. Lower positioning slot; 42. Mounting slot; 43. Limiting block; 44. Heat dissipation hole; 51. Lower product slot; 71. Upper positioning slot; 81. Upper product slot. Detailed Implementation

[0016] The present invention will be further described below through specific embodiments.

[0017] Reference Figures 1 to 9 As shown, a multi-core molded ceramic capacitor includes a capacitor body 1 and an encapsulation body 2 covering the outer periphery of the capacitor body 1. The capacitor body 1 includes a first welding bracket 11, a second welding bracket 12, a plurality of intermediate bracket groups 13, and two capacitor chip groups.

[0018] The first welding bracket 11 includes a first bracket body 111, a first connecting pin 112 disposed on the outside of the first bracket body 111, and a plurality of first welding plates 113 disposed at intervals on the inside of the first bracket body 111. The first connecting pin 112 is L-shaped and extends outward to the outside of the package 2.

[0019] The second welding bracket 12, opposite to the first welding bracket 11, includes a second bracket body 121, a second connecting pin 122 disposed on the outside of the second bracket body 121, and a plurality of second welding plates 123 spaced apart on the inside of the second bracket body 121. The second connecting pin 122 is L-shaped and is disposed on both sides of the package 2 opposite to the first connecting pin 112. Specifically, the plurality of second welding plates 123 include two second side welding plates and two second intermediate welding plates located between the two second side welding plates. The second intermediate welding plates are provided with relief grooves 124 extending inward from their ends.

[0020] Multiple intermediate support groups are spaced apart between the first welding support 11 and the second welding support 12. Specifically, each intermediate support group includes multiple intermediate supports 13 spaced apart, which are spaced along the length of the first welding support 11 and opposite to the multiple first welding plates 113. Further, each intermediate support 13 includes a support main board 131, two first electrode plates 132 spaced apart on one side of the support main board 131, and a second electrode plate 133 on the other side of the support main board 131, with the second electrode plate 133 located between the two first electrode plates 132. The first electrode plates 132 are located on either side of an adjacent first welding plate 113 or on either side of a second electrode plate 133 of an adjacent intermediate support, and the second electrode plate 133 is located between two adjacent second welding plates 123 or between two first electrode plates 132 of an adjacent intermediate support. A clearance groove 124 is aligned with the gap between two adjacent intermediate supports 13 in the same group to ensure the installation of the capacitor chip assembly. Two capacitor chip groups are disposed opposite to each other on the top and bottom surfaces of the first welding bracket 11, the second welding bracket 12 and multiple intermediate bracket groups. Specifically, the capacitor chip group includes multiple capacitor chips 14, which are disposed between the first welding plate 113 and the adjacent first electrode plate 132, or between the second electrode plate 133 and the adjacent first electrode plate 132, or between the second electrode plate 133 and the adjacent second welding plate 123.

[0021] A method for producing a multi-core molded ceramic capacitor, based on a welding device, includes the following steps: Step 1: Place the lower chip positioning frame 5 on the soldering base 4, and then place multiple capacitor chips 14 in the lower chip positioning frame 5 according to the arrangement order of capacitor chips 14 in the capacitor chip group. Place two lower elastic members 6 on the soldering base 4 so that the lower chip positioning frame 5 is positioned between the two lower elastic members 6. Step 2: After applying solder paste to the corresponding position of the capacitor frame 3, place it in the soldering base 4, and then support the limiting frame 7 on the capacitor frame 3. Step 3: Place the upper chip positioning frame 8 in the limiting frame 7, place multiple capacitor chips 14 in the upper chip positioning frame 8 according to the arrangement order of capacitor chips 14 in the capacitor chip group, and place two upper elastic members 9 in the limiting frame 7 so that the upper chip positioning frame 8 is placed between the two upper elastic members 9. Step 4: The assembled welding base 4 is sent into the welding equipment so that the capacitor frame 3 and multiple capacitor chips 14 are welded together. After welding, part of the structure of the capacitor frame 3 is cut off so that the capacitor body 1 can be molded to form a package 2. After molding, the remaining part of the structure of the capacitor frame 3 is cut off to obtain the multi-core molded ceramic capacitor.

[0022] In the above steps, the capacitor frame 3 includes a frame body 31 and multiple welding units 32. The multiple welding units 32 are spaced apart on the frame body 31. Specifically, each welding unit 32 includes a welding assembly, multiple first connecting ribs 33, multiple second connecting ribs 34, and multiple third connecting ribs 35. The welding assembly includes a first welding bracket 11, a second welding bracket 12, and multiple intermediate bracket groups in the capacitor body 1. The multiple first connecting ribs 33 are respectively connected between the frame body 31 and the first welding bracket 11. The multiple second connecting ribs 34 are respectively connected between the frame body 31 and the first welding bracket 11. Between the electrode plates 132; multiple third connecting ribs 35 are respectively connected between two adjacent intermediate supports 13 in the same group, that is, between the first electrode plate 132 and the first electrode plate 132 of the adjacent intermediate supports 13 in the same group; the outer sides of the first welding support 11 and the second welding support 12 are respectively connected to the frame body 31; by defining the structure of the capacitor frame 3, it can simultaneously produce and mold multiple capacitor bodies 1, and its first connecting ribs 33, second connecting ribs 34, and third connecting ribs 35 can respectively enhance the strength of the first welding support 11, the second welding support 12, and the intermediate support 13 on the frame body 31. Furthermore, the frame body 31 is also provided with circular positioning holes 36 for positioning during the molding of the capacitor body 1 or for positioning during batch removal of connecting ribs.

[0023] Furthermore, the first connecting rib 33 and the second connecting rib 34 are arranged in a trapezoidal shape, and the third connecting rib 35 is arranged in a triangular shape. This results in a small connection area between the first connecting rib 33 and the frame body 31, or between the first connecting rib 33 and the first welding bracket 11, or between the second connecting rib 34 and the first electrode plate 132, or between the second connecting rib 34 and the frame body 31, or between the third connecting rib 35 and the intermediate bracket 13. This facilitates manual removal or batch removal using a special mold. In step 4, after welding is completed, multiple second connecting ribs 34 and multiple third connecting ribs 35 are first removed to mold the capacitor body 1 into a package 2. After molding, multiple first connecting ribs 33 are then removed to form a multi-core molded ceramic capacitor. When molding the package 2, the first connecting ribs 33 are retained to ensure the frame body 31 supports the capacitor body 1 and ensures the stability of the capacitor body 1 during the molding process.

[0024] The welding base 4 includes a lower positioning groove 41 for placing the lower chip positioning frame 5, a mounting groove 42 for mounting the capacitor frame 3, and two limiting blocks 43 arranged opposite to each other; wherein, the welding base 4 is made of synthetic stone material; and heat dissipation holes 44 are respectively provided on both sides of the lower positioning groove 41 to ensure the heat dissipation effect of the capacitor body 1 during the welding process.

[0025] The upper chip positioning frame 8 is provided with multiple upper product slots 81 for placing capacitor chips 14; the lower chip positioning frame 5 is provided with multiple lower product slots 51 for placing capacitor chips 14; the limiting frame 7 is provided with an upper positioning slot 71 for placing the upper chip positioning frame 8; when the capacitor chips 14 located on the bottom surface are installed and fixed, the lower chip positioning frame 5 is placed in the corresponding lower positioning slot 41, and then multiple capacitor chips 14 are placed in the multiple lower product slots 51 respectively; after the capacitor frame 3 is glued and placed in the mounting slot 42, the limiting frame 7 is supported on the capacitor frame 3 so that it is located between the two limiting blocks 43, then the upper chip positioning frame 8 is placed in the corresponding upper positioning slot 71, and then multiple capacitor chips 14 are placed in the multiple upper product slots 81 respectively to complete the installation and fixing of the capacitor chips 14.

[0026] Both the upper elastic element 9 and the lower elastic element 6 can be spring sheets. By setting the spring sheets, the upper chip positioning frame 8 or the lower chip positioning frame 5 can be limited during high-temperature welding, and the expansion and deformation of the upper chip positioning frame 8, the lower chip positioning frame 5 and the welding base 4 can be relieved, so as to ensure the quality of the capacitor body 1 after welding.

[0027] This application specifically defines the structure of a multi-core molded capacitor, setting multiple intermediate support groups to cooperate with the first welding support 11 and the second welding support 12 to realize the series and parallel connection of multiple capacitor chips 14, so that the obtained molded ceramic capacitor has better electrical performance parameters, reliability and structural strength. At the same time, it specifically defines the production method of the molded ceramic capacitor, by setting elastic elements between the upper chip positioning frame 8 and the limiting frame 7, and between the lower chip positioning frame 5 and the welding base 4, to buffer the expansion deformation during the welding process, ensuring the quality of the capacitor body 1 after welding, and further defining the structure of the capacitor frame 3, so that it can not only have series and parallel connection functions, but also meet the design conditions for simple and quick mass production, greatly improving production efficiency.

[0028] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A multi-core molded ceramic capacitor, comprising a capacitor body and an encapsulation covering the periphery of the capacitor body, characterized in that: The capacitor body includes a first welding bracket, a second welding bracket, multiple intermediate bracket groups, and two capacitor chip groups. The first welding support is provided with multiple first welding plates arranged at intervals; The second welding support is opposite to the first welding support, and multiple second welding plates are arranged at intervals on it. Multiple intermediate support groups are spaced apart between the first welding support and the second welding support. Each intermediate support group includes multiple intermediate supports arranged at intervals. The multiple intermediate supports are opposite to multiple first welding plates. Each intermediate support includes a support main board, two first electrode plates spaced apart on one side of the support main board, and a second electrode plate on the other side of the support main board. The two first electrode plates are located on both sides of an adjacent first welding plate or on both sides of a second electrode plate of an adjacent intermediate support. The second electrode plate is located between two adjacent second welding plates or between two first electrode plates of an adjacent intermediate support. Two capacitor chip groups are disposed opposite to each other on both sides of a first welding bracket, a second welding bracket, and a plurality of intermediate bracket groups. Each capacitor chip group includes a plurality of capacitor chips, which are disposed between the first welding plate and an adjacent first electrode plate, or between the second electrode plate and an adjacent first electrode plate, or between the second electrode plate and an adjacent second welding plate.

2. The multi-core molded ceramic capacitor according to claim 1, characterized in that: The plurality of second welding plates include two second side welding plates and two second intermediate welding plates located between the two second side welding plates. The second intermediate welding plates are provided with relief grooves extending inward from their ends, the relief grooves being opposite to the gaps between two adjacent intermediate supports in the same group.

3. A multi-core molded ceramic capacitor according to claim 1, characterized in that: The first welding bracket includes a first bracket body and a first connecting pin disposed on the outside of the first bracket body. A plurality of first welding plates are disposed at intervals on the inside of the first bracket body, and the first connecting pin extends outward to the outside of the package.

4. The method for producing a multi-core molded ceramic capacitor according to claim 1, characterized in that: Includes the following steps: Step 1: Place the lower chip positioning frame on the soldering base, then place multiple capacitor chips in the lower chip positioning frame according to the arrangement order of the capacitor chips in the capacitor chip group, and place two lower elastic members on the soldering base so that the lower chip positioning frame is positioned between the two lower elastic members. Step 2: After applying solder paste to the corresponding positions on the capacitor frame, place it in the soldering base, and then support the limiting frame on the capacitor frame. Step 3: Place the upper chip positioning frame in the limiting frame, place multiple capacitor chips in the upper chip positioning frame according to the arrangement order of the capacitor chips in the capacitor chip group, and place two upper elastic members in the limiting frame so that the upper chip positioning frame is placed between the two upper elastic members. Step 4: The assembled welding base is fed into the welding equipment so that the capacitor frame and multiple capacitor chips are welded together. After welding, part of the capacitor frame structure is removed to allow the capacitor body to be molded into a package. After molding, the remaining part of the capacitor frame structure is removed to obtain the multi-core molded ceramic capacitor.

5. The method for producing a multi-core molded ceramic capacitor according to claim 4, characterized in that: The capacitor frame includes a frame body and a welding unit. The welding unit includes a welding assembly, a plurality of first connecting ribs, a plurality of second connecting ribs and a plurality of third connecting ribs. The welding assembly includes a first welding bracket, a second welding bracket and a plurality of intermediate bracket groups. Multiple first connecting ribs are respectively disposed between the frame body and the first welding bracket; multiple second connecting ribs are respectively connected between the frame body and the opposite first pole plate; multiple third connecting ribs are respectively connected between two adjacent intermediate brackets in the same group; the outer sides of the first welding bracket and the second welding bracket are respectively connected to the frame body.

6. The method for producing a multi-core molded ceramic capacitor according to claim 5, characterized in that: In step 4, after welding is completed, multiple second connecting ribs and multiple third connecting ribs are first removed in order to mold the capacitor body into a package. After molding is completed, multiple first connecting ribs are then removed to obtain the multi-core molded ceramic capacitor.

7. The method for producing a multi-core molded ceramic capacitor according to claim 5, characterized in that: The first and second connecting ribs are arranged in a trapezoidal shape, and the third connecting rib is arranged in a triangular shape. The end of the third connecting rib is connected to the opposite first electrode plate.

8. The method for producing a multi-core molded ceramic capacitor according to claim 4, characterized in that: The welding base is provided with a lower positioning groove for placing the lower chip positioning frame and an mounting groove for installing the capacitor frame. The limiting frame is provided with an upper positioning groove for placing the upper chip positioning frame. The lower positioning groove and the upper positioning groove are arranged vertically opposite each other.

9. A method for producing a multi-core molded ceramic capacitor according to claim 8, characterized in that: The welding base is also provided with two limiting blocks arranged opposite to each other, and the limiting frame is supported on the capacitor frame and located between the two limiting blocks.

10. A method for producing a multi-core molded ceramic capacitor according to claim 4, characterized in that: The upper chip positioning frame is provided with multiple upper product slots for placing capacitor chips, and the lower chip positioning frame is provided with multiple lower product slots for placing capacitor chips.

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