Thermal management integration module and energy storage system

Abstract

The invention provides a heat management integration module and an energy storage system. The heat management integration module comprises a double-drive pump and can form a first liquid guide loop and a second liquid guide loop. One of the two driving mechanisms of the double-drive pump is used for driving the cooling medium in the first liquid guide loop, and the other driving mechanism of the double-drive pump is used for driving the cooling medium in the second liquid guide loop. According to the structure, the double-drive pump is used for driving a cooling medium to flow in the first liquid guide loop and the second liquid guide loop respectively, and specifically, two driving mechanisms of the same double-drive pump drive the cooling medium in the first liquid guide loop and the second liquid guide loop respectively; the double-drive pump not only can avoid heat transfer between the first liquid guide loop and the second liquid guide loop and avoid energy waste between the two loops, but also can meet the power requirements of the two loops only by arranging one double-drive pump, and does not need to be provided with a water pump for each loop, so that the number of parts of the heat management integrated module can be reduced, and the cost is reduced. And integration setting of the heat management integration module is facilitated.

Description

Technical Field

[0001] This application relates to the field of thermal management technology, specifically to a thermal management integrated module and an energy storage system. Background Technology

[0002] With the rapid development of industries such as energy storage and electric vehicles, the efficiency of energy conversion has been greatly improved. The heat generated by batteries, PCS (Power Conversion System, energy storage converter) during operation has also increased significantly. In order to effectively dissipate heat from batteries and PCS to ensure their working efficiency and safety, a thermal management system is needed for energy management.

[0003] Currently, in the integrated structure of thermal management systems, various components are integrated onto the same flow channel plate, and the flow channel plate is divided into different independent areas to form different cooling circuits. Each area requires a water pump to guide the cooling medium in different circuits, resulting in a large number of components in the thermal management system, which is not conducive to integrated setup. Summary of the Invention

[0004] In view of this, this application provides a thermal management integrated module that can reduce the number of components in the thermal management system and facilitates integrated setup.

[0005] To achieve the above objectives, this application provides the following technical solution: A thermal management integrated module includes a dual-drive pump, and the thermal management integrated module is capable of forming a first liquid guiding circuit and a second liquid guiding circuit; wherein, one of the two drive mechanisms of the dual-drive pump is used to drive the cooling medium in the first liquid guiding circuit, and the other is used to drive the cooling medium in the second liquid guiding circuit.

[0006] Optionally, in the above-mentioned thermal management integrated module, the thermal management integrated module includes a first flow channel plate and a second flow channel plate that are thermally insulated from each other. The flow channels of the first liquid guiding circuit and the second liquid guiding circuit each include a low-temperature flow channel section for guiding low-temperature cooling medium that has not absorbed heat, and a high-temperature flow channel section for guiding high-temperature cooling medium that absorbs heat. The low-temperature flow channel section and the high-temperature flow channel section are respectively located on the first flow channel plate and the second flow channel plate.

[0007] Optionally, in the above-mentioned thermal management integrated module, the thermal management integrated module includes a condenser-side component and an evaporator-side component, the condenser-side component is disposed on the first flow channel plate, and the evaporator-side component is disposed on the second flow channel plate; Furthermore, the dual-drive pump is disposed between the first flow channel plate and the second flow channel plate, and the two drive mechanisms are respectively connected to the first flow channel plate and the second flow channel plate.

[0008] Optionally, in the above-mentioned thermal management integrated module, the first flow channel plate and the second flow channel plate are arranged in parallel, and: The condenser-side assembly includes a compressor, a condenser plate heat exchanger, and a third flow channel plate disposed on the side of the first flow channel plate away from the second flow channel plate; The evaporation-side assembly includes an electromagnetic expansion valve disposed on the side of the second flow channel plate away from the first flow channel plate, an evaporation plate heat exchanger, a dehumidifying evaporator, and a fourth flow channel plate; The compressor, the condenser plate heat exchanger, the third flow channel plate, the electromagnetic expansion valve, the evaporator plate heat exchanger, the dehumidifying evaporator, and the fourth flow channel plate form a third liquid guiding circuit. The third liquid guiding circuit exchanges heat with the first liquid guiding circuit through the condenser plate heat exchanger and with the second heat guiding circuit through the evaporator plate heat exchanger.

[0009] Optionally, the above-mentioned thermal management integration module also includes: An electric heater located in the second liquid guiding circuit, the electric heater being disposed between the first flow channel plate and the second flow channel plate; The reservoir is located in the third liquid guiding circuit, and the reservoir is disposed on the side of the first flow channel plate away from the second flow channel plate; A medium replenishment container located in the first liquid guiding circuit and / or the second liquid guiding circuit, the medium replenishment container being disposed between the first flow channel plate and the second flow channel plate, and connected to the first flow channel plate and the second flow channel plate.

[0010] Optionally, in the above-mentioned thermal management integrated module, a connecting pipe and a multi-way valve are provided between the first flow channel plate and the second flow channel plate. The multi-way valve forms the first liquid guiding circuit and the second liquid guiding circuit by connecting different interfaces, and connects the first liquid guiding circuit and the second liquid guiding circuit by connecting different interfaces and the connecting pipe to form a fourth liquid guiding circuit.

[0011] An energy storage system includes a battery cluster, an energy storage converter, an air cooler, and a thermal management integrated module for exchanging heat with the battery cluster and the energy storage converter, wherein the thermal management integrated module is the aforementioned thermal management integrated module. Furthermore, the air cooler and the energy storage converter are connected to the first liquid guiding circuit of the thermal management integrated module, and the battery cluster is connected to the second liquid guiding circuit of the thermal management integrated module.

[0012] Optionally, in the above energy storage system, the operating mode of the thermal management integrated module includes a high-temperature cooling mode, in which: The multi-way valve of the thermal management integrated module allows the first liquid guiding circuit and the second liquid guiding circuit to guide the coolant independently. The two drive mechanisms of the dual-drive pump of the thermal management integrated module drive the coolant flow in the first liquid guiding circuit and the second liquid guiding circuit respectively. Furthermore, the third liquid guiding circuit of the thermal management integrated module exchanges heat with the first liquid guiding circuit through the condenser plate and with the second liquid guiding circuit through the evaporator plate.

[0013] Optionally, in the above energy storage system, the operating mode of the thermal management integrated module includes a medium-temperature cooling mode, wherein in the medium-temperature cooling mode: The multi-way valve of the thermal management integrated module connects the first liquid guiding circuit and the second liquid guiding circuit to form a fourth liquid guiding circuit. The two drive mechanisms of the dual-drive pump of the thermal management integrated module drive the coolant flow at different positions in the fourth liquid guiding circuit.

[0014] Optionally, in the above energy storage system, the operating mode of the thermal management integrated module includes a low-temperature heating mode, in which: The multi-way valve of the thermal management integrated module makes the first liquid guiding circuit and the second liquid guiding circuit independent of each other. One of the drive mechanisms of the dual-drive pump of the thermal management integrated module drives the flow of coolant in the second liquid guiding circuit. Furthermore, the electric heater of the thermal management integrated module heats the coolant in the second liquid guiding circuit.

[0015] The thermal management integrated module provided in this application uses a dual-drive pump to drive the cooling medium to flow in the first liquid guiding circuit and the second liquid guiding circuit respectively. Specifically, the two drive mechanisms of the same dual-drive pump drive the cooling medium in the first liquid guiding circuit and the second liquid guiding circuit respectively. The dual-drive pump can not only avoid heat transfer between the first liquid guiding circuit and the second liquid guiding circuit and avoid energy waste between the two circuits, but also only one dual-drive pump is needed to meet the power requirements of the two circuits. There is no need to equip each circuit with a water pump. This can reduce the number of components in the thermal management integrated module, simplify its structure, and facilitate the integrated setup of the thermal management integrated module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the thermal management integrated module provided in an embodiment of this application.

[0018] Figure 2 for Figure 1 The front view of the structure shown.

[0019] Figure 3 This is a schematic diagram of the thermal management integrated module working in conjunction with the battery cluster, air cooler, and PCS.

[0020] Figure 4 This is a schematic diagram of the thermal management integrated module in high-temperature cooling mode.

[0021] Figure 5 This is a schematic diagram of the thermal management integrated module in medium-temperature cooling mode.

[0022] Figure 6 This is a schematic diagram of the thermal management integrated module in low-temperature heating mode.

[0023] exist Figures 1-6 middle: 10-Dual drive pump, 20-First liquid guiding circuit, 30-Second liquid guiding circuit, 40-First flow channel plate, 50-Second flow channel plate, 60-Compressor, 70-Condenser plate heat exchanger, 80-Third flow channel plate, 90-First electromagnetic expansion valve, 100-Second electromagnetic expansion valve, 110-Evaporator plate heat exchanger, 120-Dehumidifying evaporator, 130-Fourth flow channel plate, 140-Third liquid guiding circuit, 150-PTC, 160-Liquid receiver, 170-Media replenishment container, 180-Connecting pipe, 190-Multi-port valve, 200-Fourth liquid guiding circuit, 210 First fan, 220-External interface, 230-Second fan, 240-Battery cluster, 250-PCS, 260-Air cooler. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] like Figures 1-6As shown, this application embodiment provides a thermal management integrated module that can be used to cool and / or heat electrical components such as battery cluster 240 and PCS 250. One of the main components of this thermal management integrated module is a dual-drive pump 10, which has two drive mechanisms (the specific structure of the dual-drive pump 10 can be found in the prior art). In the design of the thermal management integrated module, the two drive mechanisms of the dual-drive pump 10 are respectively connected to the first liquid guiding circuit 20 and the second liquid guiding circuit 30. The thermal management integrated module has a variety of different working modes. In different working modes, the first liquid guiding circuit 20 and the second liquid guiding circuit 30 may be disconnected or connected, so that one of the two drive mechanisms is used to drive the cooling medium in the first liquid guiding circuit 20 and the other is used to drive the cooling medium in the second liquid guiding circuit 30. In this way, a single power component can be used to drive the cooling medium in both circuits.

[0026] The thermal management integrated module with the above structure can drive the cooling medium in two circuits with a single power component (i.e., dual-drive pump 10) by using a dual-drive pump 10, eliminating the need to equip each circuit with a water pump. This reduces the number of components in the thermal management integrated module, simplifies its structure, and reduces its volume, which is beneficial for the integrated setup of the thermal management integrated module and the improvement of the energy density of the energy storage system.

[0027] In addition, in related technologies, the flow channels of the thermal management system are all integrated on the same flow channel plate, and the flow channel plate is divided into different independent areas to form different liquid guiding circuits. However, heat transfer can occur between the cooling media of different circuits on the same flow channel plate, resulting in energy waste and increased energy consumption. To address this issue, the thermal management integrated module provided in this application embodiment further includes two flow channel plates, namely a first flow channel plate 40 and a second flow channel plate 50. Since these two flow channel plates are independent of each other, they can guide the cooling medium without heat transfer between them. These two flow channel plates also serve as components of the flow channels of the first liquid guiding circuit 20 and / or the second liquid guiding circuit 30. (Because the first liquid guiding circuit 20 and the second liquid guiding circuit 30 need to cool and / or heat electrical components such as the battery cluster 240 and PCS250 connected to the first flow channel plate 40 and the second flow channel plate 50, the flow channels formed by the first flow channel plate 40 and the second flow channel plate 50 are only a portion of the flow channels of the first liquid guiding circuit 20 and the second liquid guiding circuit 30; the remaining portion of the flow channels is for external piping.) Furthermore, the first liquid guiding circuit 20 and the second liquid guiding circuit 30, in their function of cooling the battery cluster 240 and PCS250, and / or heating the electrical components connected to the first flow channel plate 40 and the second flow channel plate 50, are only a portion of the flow channels of the first liquid guiding circuit 20 and the second liquid guiding circuit 30. During the cooling process of electrical components such as 250, the cooling medium flowing in the first liquid guiding circuit 20 and the second liquid guiding circuit 30 flows through the battery cluster 240 and PCS. The electrical components, such as 250, did not absorb heat beforehand and were thus a low-temperature cooling medium. However, after flowing through the electrical components, they absorbed heat and became a high-temperature cooling medium. In other words, both the first liquid guiding circuit 20 and the second liquid guiding circuit 30 include a low-temperature flow channel section upstream of the electrical components (this upstream and downstream are relative to the flow direction of the cooling medium in the circuit) that guides the low-temperature cooling medium, and a high-temperature flow channel section downstream of the electrical components that guides the high-temperature cooling medium. The low-temperature flow channel section and the high-temperature flow channel section are located on the independent first flow channel plate 40 and the second flow channel plate 50, respectively. This achieves temperature zoning on different flow channel plates for different temperatures, avoiding mutual heat transfer between cooling media of different temperatures in the first liquid guiding circuit 20 and the second liquid guiding circuit 30. Furthermore, the dual-drive pump 10 uses two drive mechanisms to drive the cooling media in these two circuits respectively, which also avoids heat transfer between the cooling media in the two circuits. Therefore, energy waste is avoided and energy consumption is reduced.

[0028] Specifically, based on the thermal management integrated module, which includes a first flow channel plate 40 and a second flow channel plate 50, when designing the specific structure of the thermal management integrated module, such as... Figure 1 and Figure 2As shown, the other components of the thermal management integrated module are divided into condenser-side components and evaporator-side components. The condenser-side components are mounted on the first flow channel plate 40, and the evaporator-side components are mounted on the second flow channel plate 50, making the structural layout of the thermal management integrated module more standardized and reasonable. One of the condenser-side components and the evaporator-side components are multiple components used by the thermal management integrated module to guide the cooling medium with a higher temperature during operation, while the other is multiple components used by the thermal management integrated module to guide the cooling medium with a lower temperature during operation. That is, the first flow channel plate 40 and the components mounted on it, and the second flow channel plate 50 and the components mounted on it, form a high-temperature zone and a low-temperature zone, respectively. This achieves temperature zoning of the components in the structure, which not only optimizes the structural layout of the thermal management integrated module but also better avoids heat transfer between cooling media of different temperatures, thus preventing energy waste.

[0029] And, as Figure 1 and Figure 2 As shown, the dual-drive pump 10 is disposed between the first flow channel plate 40 and the second flow channel plate 50, and the two drive mechanisms are respectively connected to the first flow channel plate 40 and the second flow channel plate 50. In this structure, the dual-drive pump 10 is positioned between the first flow channel plate 40 and the second flow channel plate 50, with its two drive mechanisms connected to the two flow channel plates respectively. On the one hand, this allows the two drive mechanisms to be more easily connected to the first liquid guiding circuit 20 and the second liquid guiding circuit 30, which use the first flow channel plate 40 and the second flow channel plate 50 as the main flow channels, ensuring that the two drive mechanisms can normally drive the cooling medium in the first liquid guiding circuit 20 and the second liquid guiding circuit 30. On the other hand, positioning the dual-drive pump 10 between the first flow channel plate 40 and the second flow channel plate 50 makes full use of space and avoids occupying the installation space of the condenser-side components and the evaporator-side components, making the structure of the entire thermal management integrated module more compact and smaller in size. Furthermore, this arrangement also allows the dual-drive pump 10 to serve as a connector or reinforcement connecting the first flow channel plate 40 and the second flow channel plate 50, eliminating the need for a separate connection structure for connecting the two flow channel plates. This achieves multiple uses for the dual-drive pump 10, reduces the number of components in the thermal management integrated module, reduces the size of the thermal management integrated module, and facilitates the integrated setup of the thermal management integrated module.

[0030] In optional embodiments, to better standardize the structure of the thermal management integrated module and reduce its size, such as... Figure 1 and Figure 2As shown, the first flow channel plate 40 and the second flow channel plate 50 can be arranged in parallel. Based on this, the condenser-side assembly on the first flow channel plate 40 includes a compressor 60, a condenser plate heat exchanger 70, and a third flow channel plate 80. The compressor 60, condenser plate heat exchanger 70, and third flow channel plate 80 are all located on the side of the first flow channel plate 40 away from the second flow channel plate 50. The evaporator-side assembly on the second flow channel plate 50 includes an electromagnetic expansion valve, an evaporator plate heat exchanger 110, a dehumidifying evaporator 120, and a fourth flow channel plate 130. The electromagnetic expansion valve, evaporator plate heat exchanger 110, dehumidifying evaporator 120, and fourth flow channel plate 130 are located on the side of the second flow channel plate 50 away from the first flow channel plate 40. When the first flow channel plate 40 and the second flow channel plate 50 are placed vertically, in the condenser-side assembly, the compressor 60 is positioned higher on the first flow channel plate 40 than the condenser plate heat exchanger 70 and the third flow channel plate 80. Figure 2 From a visual perspective, the third flow channel plate 80 and the condenser plate heat exchanger 70 are arranged one after the other on the first flow channel plate 40; in the evaporator-side assembly, the dehumidifying evaporator 120 is positioned on the second flow channel plate 50 higher than the electromagnetic expansion valve, the evaporator plate heat exchanger 110, and the fourth flow channel plate 130, that is, the dehumidifying evaporator 120 is aligned with the compressor 60. Figure 2 From a perspective, the fourth flow channel plate 130 and the evaporator plate heat exchanger 110 are arranged in a front-to-back manner, that is, the fourth flow channel plate 130 is arranged opposite to the third flow channel plate 80, and the evaporator plate heat exchanger 110 is arranged opposite to the condenser plate heat exchanger 70. The electromagnetic expansion valve includes a first electromagnetic expansion valve 90 and a second electromagnetic expansion valve 100, both of which are arranged on the fourth flow channel plate 130 and located on the side of the fourth flow channel plate 130 away from the second flow channel plate 50.

[0031] And, as Figures 3-6As shown, the compressor 60, condenser plate heat exchanger 70, third flow channel plate 80, electromagnetic expansion valve, evaporator plate heat exchanger 110, dehumidifying evaporator 120, and fourth flow channel plate 130 form a third liquid guiding circuit 140. The third flow channel plate 80 and fourth flow channel plate 130 form the flow channels for the cooling medium in the third liquid guiding circuit 140. The cooling medium flowing in the third liquid guiding circuit 140 is refrigerant (or simply refrigerant). In this third liquid guiding circuit 140, the evaporator plate heat exchanger 110 and the dehumidifying evaporator 120 are positioned downstream of the condenser plate heat exchanger 70 and are connected in parallel. Two electromagnetic expansion valves are included. The first electromagnetic expansion valve 90 and the second electromagnetic expansion valve 100 are respectively installed in the branches where the evaporator plate heat exchanger 110 and the dehumidifying evaporator 120 are located. In the third liquid guiding circuit 140, the condenser plate heat exchanger 70 exchanges heat with the first liquid guiding circuit 20 (specifically, one of the two liquid guiding chambers of the condenser plate heat exchanger 70 is connected to the flow channel in the first flow channel plate 40 to guide the coolant, while the other serves as part of the flow channel of the third liquid guiding circuit 140 to guide the refrigerant; the two cooling media flow in the two liquid guiding chambers respectively to achieve heat exchange). The first liquid guiding circuit 20 can be connected to the PCS of the energy storage system. 250 and air cooler 260, at the same time, make the evaporator plate heat exchanger 110 exchange heat with the second liquid guiding circuit 30 (specifically, make one of the two liquid guiding chambers of the evaporator plate heat exchanger 110 connected to the flow channel in the second flow channel plate 50 to guide the coolant, while the other serves as a component of the flow channel of the third liquid guiding circuit 140 to guide the refrigerant, and the two cooling media flow in the two liquid guiding chambers respectively to achieve heat exchange), and the battery cluster 240 of the energy storage system can be connected to the second liquid guiding circuit 30.

[0032] Optional, such as Figures 1-3 As shown, the aforementioned thermal management integrated module also includes an electric heater (PTC, Positive Temperature Coefficient Heater), a liquid reservoir 160, and a media replenishment container 170.

[0033] In this design, the PTC 150 is located in the second liquid guiding circuit 30. Specifically, the PTC 150 is positioned between the first flow channel plate 40 and the second flow channel plate 50. By placing the PTC 150 in the second liquid guiding circuit 30 where the battery cluster 240 is located, it can heat the cooling medium in the second liquid guiding circuit 30, thereby achieving heating of the battery cluster 240 in a low-temperature environment. In a specific structure, to improve structural compactness, the PTC 150 is also positioned between the first flow channel plate 40 and the second flow channel plate 50, and can be connected to either the first flow channel plate 40 or the second flow channel plate 50. Figure 1 and Figure 2(The example shown is a PTC 150 installed on the first flow channel plate 40), or connected to both.

[0034] The receiver 160 is located in the third liquid guiding circuit 140. The receiver 160 stores refrigerant. In a specific structure, the receiver 160 is located on the side of the first flow channel plate 40 away from the second flow channel plate 50, and is located between the compressor 60 and the third flow channel plate 80. The receiver 160 is fixedly connected to the first flow channel plate 40 and communicates with the flow channel in the third flow channel plate 80 so as to replenish refrigerant to the third liquid guiding circuit 140, thereby ensuring that the refrigerant in the third liquid guiding circuit 140 is sufficient.

[0035] Media replenishment container 170 ( Figure 3 Located in the first liquid guiding circuit 20 and / or the second liquid guiding circuit 30 (not shown), the medium replenishment container 170 stores coolant (specifically, cooling water or cooling oil, etc.). In a specific structure, this medium replenishment container 170 is disposed between the first flow channel plate 40 and the second flow channel plate 50, and is connected to both the first flow channel plate 40 and the second flow channel plate 50, and communicates with the flow channel of at least one of these two flow channel plates. One of its functions is to replenish coolant to the first liquid guiding circuit 20 and / or the second liquid guiding circuit 30 when the coolant in the first liquid guiding circuit 20 and / or the second liquid guiding circuit 30 decreases. Another function is to serve as a connector or reinforcement connecting the first flow channel plate 40 and the second flow channel plate 50, thereby eliminating the need for a separate connection structure for connecting the two flow channel plates, realizing the multi-purpose use of the medium replenishment container 170, and reducing the number of components in the thermal management integrated module. Specifically, when the stored coolant is cooling water, the medium replenishment container 170 is a water jug.

[0036] In optional embodiments, such as Figure 1 and Figure 2As shown, a multi-way valve 190 is provided between the first flow channel plate 40 and the second flow channel plate 50. This multi-way valve 190 has no fewer than six ports, such as a six-way valve. Furthermore, this multi-way valve 190 forms a first liquid guiding circuit 20 and a second liquid guiding circuit 30 by connecting different ports, and connects the first liquid guiding circuit 20 and the second liquid guiding circuit 30 to form a fourth liquid guiding circuit 200 by connecting different ports and the connecting pipe 180 (described later). By providing the multi-way valve 190, the thermal management integrated module can have multiple operating modes, such as the mode where the first liquid guiding circuit 20 and the second liquid guiding circuit 30 independently guide coolant, the mode where the first liquid guiding circuit 20 and the second liquid guiding circuit 30 are connected in series to form the fourth liquid guiding circuit 200, and the mode where the second liquid guiding circuit 30 alone guides coolant, etc., thus enabling the thermal management integrated module to meet more diverse operating requirements. Of course, in other embodiments, the multi-way valve 190 may not be provided. Instead, the thermal management integrated module may be configured to have a mode in which the first liquid guiding circuit 20 and the second liquid guiding circuit 30 independently guide the coolant, or a mode in which the second liquid guiding circuit 30 guides the coolant alone.

[0037] And, as Figure 1 and Figure 2 As shown, a connecting pipe 180 is also provided between the first flow channel plate 40 and the second flow channel plate 50. This connecting pipe 180 is used to connect the first flow channel plate 40 and the second flow channel plate 50. The reason for providing the connecting pipe 180 is to cooperate with the PTC 150 and the multi-way valve 190. For example Figure 1 and Figure 2As shown, when the PTC 150 and the multi-way valve 190 are installed on the first flow channel plate 40, and the second flow channel plate 50 serves as the main flow channel of the second liquid guiding circuit 30 where the battery cluster 240 is located, if the battery cluster 240 needs to be heated in a low-temperature environment, the cooling medium in the second flow channel plate 50 needs to flow into the first flow channel plate 40 and reach the PTC 150 to be heated by the PTC 150. The path for the cooling medium in the second flow channel plate 50 to flow into the first flow channel plate 40 is the connecting pipe 180. Similarly, when the multi-way valve 190 needs to be used to switch the flow path of the coolant and change the working mode (i.e., when the multi-way valve 190 changes the conductive interface), the cooling medium in the second flow channel plate 50 needs to flow into the first flow channel plate 40 and reach the multi-way valve 190 to be controlled for subsequent flow direction. Alternatively, in other optional embodiments, the PTC 150 can be placed on the second flow channel plate 50 so that the PTC 150 directly heats the cooling medium in the second flow channel plate 50. This eliminates the need for the cooling medium in the second flow channel plate 50 to enter the first flow channel plate 40 for heating. Thus (without considering other factors such as the multi-way valve 190), the connecting pipe 180 can be omitted. Furthermore, the multi-way valve 190 can be placed at the location where the connecting pipe 180 connects to the first flow channel plate 40 or the second flow channel plate 50. This avoids the formation of a third liquid guiding circuit 140 and prevents the cooling medium from flowing between the two flow channel plates without passing through electrical components, thereby optimizing the circuit.

[0038] Optional, in molding Figure 1 and Figure 2 When using the thermal management integrated module shown, the condenser-side components can be connected to the first flow channel plate 40 using a clamping plate, and the evaporator-side components can be connected to the second flow channel plate 50 using the same clamping plate method. Furthermore, the PTC 150, liquid receiver 160, media replenishment container, multi-way valve 190, and connecting pipe 180 can also be connected to the first flow channel plate 40 and / or the second flow channel plate 50 using a clamping plate method, thereby achieving fixed connection and integration of the various components of the thermal management integrated module. The clamping plate fixing method is chosen because it provides high connection strength, resulting in high structural strength of the thermal management integrated module. It also enables non-destructive connection, preventing damage to the structure of the first and second flow channel plates 40 and 50, ensuring their proper operation. Additionally, it offers convenient assembly, strong maintainability, high adaptability, and low cost.

[0039] Based on the aforementioned thermal management integrated module, this application embodiment also provides an energy storage system. This energy storage system includes a battery cluster 240, an energy storage converter (i.e., PCS 250), an air cooler 260, and a thermal management integrated module for heat exchange with the battery cluster 240 and PCS 250. This thermal management integrated module is the aforementioned thermal management integrated module, and, as... Figures 3-6 As shown, the air cooler 260 and PCS 250 are connected to the first liquid guiding circuit 20 of the thermal management integrated module, and the battery cluster 240 is connected to the second liquid guiding circuit 30 of the thermal management integrated module.

[0040] In the aforementioned energy storage system, such as Figure 4 As shown, the thermal management integrated module operates in a high-temperature cooling mode, under which: The multi-way valve 190 of the thermal management integrated module allows the first liquid guiding circuit 20 and the second liquid guiding circuit 30 to independently guide the coolant. The two drive mechanisms of the dual-drive pump 10 of the thermal management integrated module drive the coolant flow in the first liquid guiding circuit 20 and the second liquid guiding circuit 30 respectively. Furthermore, the third liquid guiding circuit 140 of the thermal management integrated module exchanges heat with the first liquid guiding circuit 20 through the condenser plate heat exchanger 70 and with the second liquid guiding circuit 30 through the evaporator plate heat exchanger 110. Specifically, the six-way valve's ports 1 and 2, 3 and 4, and 5 and 6 are connected. The connected ports 1 and 2, as well as the connected ports 3 and 4, are located in the first liquid guiding circuit 20. Figure 4 In the red circuit (in the diagram), the connected interfaces 5 and 6 are located in the second liquid guiding circuit 30 ( Figure 4In the green circuit (of the system), the first liquid guiding circuit 20 and the second liquid guiding circuit 30 independently guide their respective cooling media; in the first liquid guiding circuit 20, the air cooler 260 and PCS of the energy storage system... The condenser plate heat exchanger 70 of the 250 and thermal management integrated module are connected in series. After the air cooler 260 exchanges heat with the outdoor environment through the first fan 210, the coolant in the first liquid guiding circuit 20 becomes a low-temperature coolant. The low-temperature coolant flows to the six-way valve and reaches the condenser plate heat exchanger 70 through the connected interface 2 and interface 1. When flowing through the condenser plate heat exchanger 70, it cools the refrigerant in the third liquid guiding circuit 140. The low-temperature coolant absorbs heat and becomes a medium-temperature coolant. The medium-temperature coolant flows to the dual-drive pump 10 in the first flow channel plate 40, where it is pressurized and driven by one of the drive mechanisms of the dual-drive pump 10. Then, the medium-temperature coolant flows out of the first flow channel plate 40 (the coolant enters and exits the first flow channel plate 40 and the second flow channel plate 50 through multiple external interfaces 220 opened at the ends of the first flow channel plate 40 and the second flow channel plate 50) and flows to the PCS 250. When flowing through the PCS 250, it cools the PCS 250, that is, it absorbs heat from the PCS. The refrigerant, heated by 250°C, becomes a high-temperature coolant. This high-temperature coolant then flows back into the first flow channel plate 40 and reaches the six-way valve. From there, it flows through ports 4 and 3 of the six-way valve to the air cooler 260 outside the first flow channel plate 40, thus forming a cycle in the first liquid guiding circuit 20. In the third liquid guiding circuit 140, the refrigerant is compressed into a high-temperature, high-pressure gas by the compressor 60. It then flows through the third flow channel plate 80 towards the condenser plate 70. The high-temperature, high-pressure refrigerant is cooled into a liquid state as it passes through the condenser plate 70, and then flows to the first electromagnetic expansion valve 90. After being throttled by the first electromagnetic expansion valve 90, it becomes a low-temperature, low-pressure liquid state. This low-temperature, low-pressure liquid refrigerant then flows through the fourth flow channel plate 130... The refrigerant flows to the evaporator plate heat exchanger 110 and cools the coolant in the first liquid guiding circuit 20 through the evaporator plate heat exchanger 110. After flowing through the evaporator plate heat exchanger 110, the refrigerant becomes gaseous or gas-liquid mixture and flows back to the compressor 60. When the energy storage system is in a high humidity environment, the refrigerant after passing through the condenser plate heat exchanger 70 can enter the branch where the dehumidifying evaporator 120 is located while flowing to the evaporator plate heat exchanger 110. In this branch, after being throttled by the second electromagnetic expansion valve 100, it becomes a low-temperature and low-pressure liquid and then flows through the dehumidifying evaporator 120. Under the action of the second fan 230, it dehumidifies the battery cluster 240 (the dehumidification of the battery cluster 240 can be carried out simultaneously with the cooling of the battery cluster 240).In the second liquid guiding circuit 30, the battery cluster 240 of the energy storage system is connected in series with the evaporator and PTC of the thermal management integrated module. The coolant flowing through the evaporator 110 is cooled down by the evaporator 110. The cooled coolant flows out of the second flow channel plate 50 and flows to the battery cluster 240. When the coolant flows through the battery cluster 240 outside the second flow channel plate 50, it cools the battery cluster 240. That is, the coolant absorbs the heat of the battery cluster 240 and heats up. The heated coolant enters the first flow channel plate 40 and flows through the PTC 150, the dual-drive pump 10 and the six-way valve in sequence. Among them, when the coolant flows through the PTC 150, the PTC... 150 is not heated. As the coolant flows towards the dual-drive pump 10, it is pressurized and driven by another drive mechanism of the dual-drive pump 10. The coolant then flows through the first flow channel plate 40 to the six-way valve. After passing through the connecting ports 5 and 6 of the six-way valve, it flows to the evaporator plate 110 and is cooled.

[0041] In the above working mode, the first flow channel plate 40 is mainly used to guide the medium-temperature coolant that absorbs heat from the condenser plate 70, the high-temperature coolant that absorbs heat from the PCS 250, and the high-temperature coolant that absorbs heat from the battery cluster 240. The second flow channel plate 50 is mainly used to guide the low-temperature coolant that has been cooled by the evaporator plate 110 and flows to the battery cluster 240. Therefore, the first flow channel plate 40 and the components on it are in the high-temperature zone, while the second flow channel plate 50 and the components on it are in the low-temperature zone. Furthermore, the two flow channel plates are set separately and do not transfer heat between each other, thus avoiding energy waste.

[0042] Furthermore, such as Figure 5 As shown, the thermal management integrated module also includes a medium-temperature cooling mode. In this medium-temperature cooling mode: The multi-way valve 190 of the thermal management integrated module connects the first liquid guiding circuit 20 and the second liquid guiding circuit 30 to form a fourth liquid guiding circuit 200. Figure 5In the green loop of the thermal management integrated module, the two drive mechanisms of the dual-drive pump 10 drive the coolant flow at different positions in the fourth liquid guiding loop 200. Specifically, since the ambient temperature is not high enough to meet the cooling requirements of the battery cluster 240 and PCS 250, the cooling capacity generated by the compressor 60 is too redundant, so the third liquid guiding loop 140 does not work. In the first liquid guiding loop 20 and the second liquid guiding loop 30, the six-way valve interfaces 1 and 6, 2 and 5, and 3 and 4 are connected, thus connecting the first liquid guiding loop 20 and the second liquid guiding loop 30 in series to form a larger liquid guiding loop, namely the fourth liquid guiding loop 200. In the fourth liquid guiding loop 200, the air cooler 260 cools the coolant by exchanging heat with the external environment. The cooled coolant flows into the first flow channel plate 40 and, through the flow guidance of the six-way valve interfaces 2 and 5, flows sequentially through one drive mechanism of the dual-drive pump 10 and the PTC in the first flow channel plate 40. 150 (PTC150 is not heated at this time), then the low-temperature coolant flows out of the first flow channel plate 40 and flows to the battery cluster 240, cooling the battery cluster 240 as it passes through it. That is, the low-temperature coolant absorbs the heat from the battery cluster 240 and becomes a medium-temperature coolant. The medium-temperature coolant then enters the second flow channel plate 50 and flows through the guide of the second flow channel plate 50 past the evaporator 110 (evaporator 110 is not working). Then it flows through the connecting pipe 180 back to the first flow channel plate 40. In the first flow channel plate 40, it flows sequentially through the interface 6 and interface 1 of the six-way valve, the condenser 70 (condenser 70 is not working), and the other drive mechanism of the dual-drive pump 10. Then it flows out of the first flow channel plate 40 and flows to the PCS 250, cooling the PCS 250 as it passes through it. That is, the medium-temperature coolant absorbs heat from the PCS 250 again. The 250°C heat is converted into high-temperature coolant. The high-temperature coolant then flows through the six-way valve connecting ports 4 and 3 to the air cooler 260, where it is cooled down and becomes low-temperature coolant again. In this way, the coolant completes one cycle in the fourth liquid guiding circuit 200.

[0043] Furthermore, such as Figure 6 As shown, the thermal management integrated module operates in a low-temperature heating mode, under which: The multi-way valve 190 of the thermal management integrated module makes the first liquid guiding circuit 20 and the second liquid guiding circuit 30 independent of each other. One of the drive mechanisms of the dual-drive pump 10 of the thermal management integrated module drives the coolant flow in the second liquid guiding circuit 30. Furthermore, the electric heater of the thermal management integrated module heats the coolant in the second liquid guiding circuit 30. Specifically, because the ambient temperature is low, the battery cluster 240 not only does not need cooling but also requires a large amount of heat for heating, so the first liquid guiding circuit 20 and the third liquid guiding circuit 140 do not operate. Only one drive mechanism of the dual-drive pump 10 drives the coolant in the second liquid guiding circuit 30, and the ports 1, 2, 3, and 4 of the six-way valve are closed, leaving only ports 5 and 6 connected to form the second liquid guiding circuit 30. The PTC 150 is turned on, and when the coolant in the second liquid guiding circuit 30 flows through the PTC... At 150°C, the coolant is heated by PTC150 to form a high-temperature coolant. The high-temperature coolant then flows through the six-way valve-connected interfaces 5 and 6 in the first flow channel plate 40 and flows to the second flow channel plate 50 and the evaporator plate 110. When the high-temperature coolant flows through the evaporator plate 110, the evaporator plate 110 does not work. After that, the high-temperature coolant flows out of the second flow channel plate 50 and flows to the externally connected battery cluster 240. When passing through the battery cluster 240, the high-temperature coolant heats the battery cluster 240, and the coolant cools down to form a low-temperature coolant. Then the low-temperature coolant flows into the first flow channel plate 40 and reaches PTC 150, where it is heated again. Thus, the coolant completes one cycle in the second liquid guiding circuit 30.

[0044] In addition, since the energy storage system mentioned above includes the thermal management integrated module, other beneficial effects brought about by the thermal management integrated module can be found in the above content and will not be repeated here.

[0045] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0046] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0047] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0048] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0049] It should be understood that the qualifiers “first,” “second,” “third,” “fourth,” “fifth,” and “sixth” used in the description of the embodiments of this application are only used to more clearly illustrate the technical solutions and are not intended to limit the scope of protection of this application.

[0050] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A thermal management integrated module, characterized in that, It includes a dual-drive pump, and the thermal management integrated module is capable of forming a first liquid guiding circuit and a second liquid guiding circuit; wherein, one of the two drive mechanisms of the dual-drive pump is used to drive the cooling medium in the first liquid guiding circuit, and the other is used to drive the cooling medium in the second liquid guiding circuit.

2. The thermal management integrated module according to claim 1, characterized in that, The thermal management integrated module includes a first flow channel plate and a second flow channel plate that are insulated from each other. The flow channels of the first liquid guiding circuit and the second liquid guiding circuit each include a low-temperature flow channel section that guides the low-temperature cooling medium that has not absorbed heat, and a high-temperature flow channel section that guides the high-temperature cooling medium that absorbs heat. The low-temperature flow channel section and the high-temperature flow channel section are respectively located on the first flow channel plate and the second flow channel plate.

3. The thermal management integrated module according to claim 2, characterized in that, The thermal management integrated module includes a condenser-side component and an evaporator-side component. The condenser-side component is disposed on the first flow channel plate, and the evaporator-side component is disposed on the second flow channel plate. Furthermore, the dual-drive pump is disposed between the first flow channel plate and the second flow channel plate, and the two drive mechanisms are respectively connected to the first flow channel plate and the second flow channel plate.

4. The thermal management integrated module according to claim 3, characterized in that, The first flow channel plate and the second flow channel plate are arranged in parallel, and: The condenser-side assembly includes a compressor, a condenser plate heat exchanger, and a third flow channel plate disposed on the side of the first flow channel plate away from the second flow channel plate; The evaporation-side assembly includes an electromagnetic expansion valve disposed on the side of the second flow channel plate away from the first flow channel plate, an evaporation plate heat exchanger, a dehumidifying evaporator, and a fourth flow channel plate; The compressor, the condenser plate heat exchanger, the third flow channel plate, the electromagnetic expansion valve, the evaporator plate heat exchanger, the dehumidifying evaporator, and the fourth flow channel plate form a third liquid guiding circuit. The third liquid guiding circuit exchanges heat with the first liquid guiding circuit through the condenser plate heat exchanger and with the second heat guiding circuit through the evaporator plate heat exchanger.

5. The thermal management integrated module according to claim 4, characterized in that, Also includes: An electric heater located in the second liquid guiding circuit, the electric heater being disposed between the first flow channel plate and the second flow channel plate; The reservoir is located in the third liquid guiding circuit, and the reservoir is disposed on the side of the first flow channel plate away from the second flow channel plate; A medium replenishment container located in the first liquid guiding circuit and / or the second liquid guiding circuit, the medium replenishment container being disposed between the first flow channel plate and the second flow channel plate, and connected to the first flow channel plate and the second flow channel plate.

6. The thermal management integrated module according to any one of claims 1-5, characterized in that, A connecting pipe and a multi-way valve are provided between the first flow channel plate and the second flow channel plate. The multi-way valve forms the first liquid guiding circuit and the second liquid guiding circuit by connecting different interfaces, and connects the first liquid guiding circuit and the second liquid guiding circuit by connecting different interfaces and the connecting pipe to form a fourth liquid guiding circuit.

7. An energy storage system, characterized in that, The device includes a battery cluster, an energy storage converter, an air cooler, and a thermal management integrated module for exchanging heat with the battery cluster and the energy storage converter, wherein the thermal management integrated module is the thermal management integrated module according to any one of claims 1-6. Furthermore, the air cooler and the energy storage converter are connected to the first liquid guiding circuit of the thermal management integrated module, and the battery cluster is connected to the second liquid guiding circuit of the thermal management integrated module.

8. The energy storage system according to claim 7, characterized in that, The thermal management integrated module operates in a high-temperature cooling mode, in which: The multi-way valve of the thermal management integrated module allows the first liquid guiding circuit and the second liquid guiding circuit to guide the coolant independently. The two drive mechanisms of the dual-drive pump of the thermal management integrated module drive the coolant flow in the first liquid guiding circuit and the second liquid guiding circuit respectively. Furthermore, the third liquid guiding circuit of the thermal management integrated module exchanges heat with the first liquid guiding circuit through the condenser plate and with the second liquid guiding circuit through the evaporator plate.

9. The energy storage system according to claim 7, characterized in that, The thermal management integrated module operates in a medium-temperature cooling mode, wherein: The multi-way valve of the thermal management integrated module connects the first liquid guiding circuit and the second liquid guiding circuit to form a fourth liquid guiding circuit. The two drive mechanisms of the dual-drive pump of the thermal management integrated module drive the coolant flow at different positions in the fourth liquid guiding circuit.

10. The energy storage system according to claim 7, characterized in that, The thermal management integrated module operates in a low-temperature heating mode, in which: The multi-way valve of the thermal management integrated module makes the first liquid guiding circuit and the second liquid guiding circuit independent of each other. One of the drive mechanisms of the dual-drive pump of the thermal management integrated module drives the flow of coolant in the second liquid guiding circuit. Furthermore, the electric heater of the thermal management integrated module heats the coolant in the second liquid guiding circuit.

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