Coupler and electronic equipment
By filling the coupler with a thermally conductive medium and using a temperature regulating element, combined with closed-loop feedback control, the problem of coupler detection accuracy drift is solved, improving the detection accuracy and stability of RF power supply output power and ensuring the reliability of semiconductor processes.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN SICARRIER IND MACHINES CO LTD
- Filing Date
- 2026-01-20
- Publication Date
- 2026-05-15
AI Technical Summary
The detection accuracy of traditional couplers is subject to drift, which leads to distortion or instability in the detection data of RF power supply output power, affecting the performance of semiconductor processes.
By filling the grooves in the substrate with a thermally conductive medium, combined with temperature regulation elements and a controller, efficient heat dissipation is achieved through the contact between the thermally conductive medium and the printed circuit board. Closed-loop feedback control is implemented through temperature sensors and controllers to maintain the stability of the dielectric constant of the printed circuit board.
This improves the stability of the coupler and the accuracy and stability of RF power supply output power detection, ensuring the reliability of semiconductor processes.
Smart Images
Figure CN122051622A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductors, and more particularly to couplers and electronic devices. Background Technology
[0002] The accuracy and stability of RF power supply output power are key factors affecting the performance of downstream semiconductor processes. Currently, the industry commonly uses directional couplers to detect the output power of RF power supplies. The performance of the directional coupler directly determines the accuracy of the feedback to the RF power supply's control system. Traditional couplers suffer from accuracy drift, which can easily lead to distortion or instability in the power detection data fed back to the RF power supply's control system. This results in a deviation between the actual and set values of the RF power supply's output power, potentially causing process results to deviate from expectations and affecting product yield. Summary of the Invention
[0003] This application provides a coupler and electronic device to improve the stability of the coupler, thereby improving the accuracy and stability of detecting the output power of the radio frequency power supply.
[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, a coupler is provided, comprising a substrate, a printed circuit board, and a thermally conductive medium. The substrate has a mounting surface and a recess, the printed circuit board is disposed on the mounting surface, and the printed circuit board includes transmission lines and coupling lines, the projections of the transmission lines and coupling lines on the substrate being located in the recess. The thermally conductive medium is disposed in the recess and in contact with the printed circuit board.
[0005] This embodiment of the application significantly increases the heat dissipation capacity of the coupler by filling the grooves in the substrate with a thermally conductive medium. Therefore, when the output power of the RF power supply connected to the coupler is high, a large amount of heat generated by the transmission lines and coupling lines can be conducted to the substrate, thereby significantly reducing the temperature rise of the transmission lines and coupling lines under high power conditions. This weakens or even eliminates the temperature-dependent change in the dielectric constant of the printed circuit board, thus maintaining the stability of the printed circuit board's dielectric constant. Since the performance of the coupler is related to the thickness and dielectric constant of the printed circuit board, once a fixed printed circuit board is selected, its thickness is determined. At this point, the dielectric constant of the printed circuit board becomes the main factor affecting the coupler's port matching characteristics, standing wave characteristics, directivity, coupling degree, and isolation. Therefore, maintaining the stability of the printed circuit board's dielectric constant can improve the stability of the coupler, thereby improving the accuracy and stability of detecting the RF power supply output power.
[0006] In some possible implementations, the printed circuit board has a first surface and a second surface opposite to each other along a first direction, the first surface being the surface of the printed circuit board facing away from the substrate, and the second surface being the surface facing the substrate. One of the transmission line and the coupling line is disposed on the first surface, and the other is disposed on the second surface. By distributing the transmission line and the coupling line on the first surface and the second surface opposite to the printed circuit board, respectively, wiring space on the same layer can be freed up, facilitating routing, component placement, or enabling more complex circuit layouts.
[0007] In some possible implementations, a first conductive cover is also included, comprising a first support portion and a first plate portion. A first ground line is provided on a first surface of the printed circuit board, and the first support portion is connected to the first ground line; the first plate portion is connected to the first support portion and disposed opposite to the first surface, with the projection of the first plate portion onto one of the transmission lines and coupling lines located on the first surface. The first cover can form a capacitor with the transmission line; adjusting the height of the first cover can adjust the capacitor, thereby adjusting the characteristic impedance to achieve a better characteristic impedance.
[0008] In some possible implementations, the coupler further includes a temperature regulating element. In some examples, the temperature regulating element may be disposed within a recess in the substrate, located between the substrate and the thermally conductive medium; in other examples, the temperature regulating element may be located on the side of the substrate away from the printed circuit board, with the temperature regulating element in close contact with the substrate, and the substrate (and the thermally conductive medium) located between the printed circuit board and the temperature regulating element. The temperature regulating element is used for heating and / or cooling, and conducts heat through the thermally conductive medium (or the substrate and the thermally conductive medium) to keep the temperature of the printed circuit board within a set temperature range. Embodiments of this application actively heat or cool by adding a temperature regulating element; for example, when the temperature of the printed circuit board is high, cooling can be accelerated by the temperature regulating element, and when the temperature of the printed circuit board is low, appropriate heating can be provided by the temperature regulating element. Using a temperature regulating element in conjunction with a thermally conductive medium can improve the ability to control the temperature of the printed circuit board.
[0009] In some possible implementations, the coupler further includes a first controller connected to a temperature regulating element. The first controller is configured to: acquire the output power of an RF power supply connected to the coupler; and control the temperature regulating element to cool the heat-conducting medium with a cooling power corresponding to the output power of the RF power supply. This embodiment of the application, by using the first controller to pre-regulate the temperature based on the output power of the RF power supply, can improve the response speed of temperature control and quickly control temperature fluctuations on the printed circuit board.
[0010] In some possible implementations, the coupler further includes a temperature sensor mounted on the printed circuit board. The cooling power of the temperature regulating element for cooling the heat-conducting medium is related to the temperature collected by the temperature sensor. This embodiment of the application uses a temperature sensor to collect the temperature of the printed circuit board, thereby achieving closed-loop feedback control of the printed circuit board temperature. This allows for more accurate temperature control of the printed circuit board, thus precisely maintaining the stability of the dielectric constant of the printed circuit board and significantly improving the accuracy and stability of detecting the output power of the RF power supply.
[0011] In some possible implementations, the coupler further includes a second controller connected to both the temperature sensor and the temperature regulating element. The second controller is configured to: acquire the temperature collected by the temperature sensor; increase the cooling power of the temperature regulating element in response to a temperature greater than a first threshold; and decrease the cooling power of the temperature regulating element in response to a temperature less than a second threshold. The first threshold is greater than the second threshold. In this embodiment, when the temperature collected by the temperature sensor is between the first and second thresholds, the second controller remains inactive, and the cooling power of the temperature regulating element remains constant. This prevents frequent start-stop cycles of the controller due to noise or minor disturbances, thereby avoiding frequent adjustments to the cooling power and effectively suppressing oscillations in temperature control.
[0012] In some possible implementations, the second controller is further configured to: when the cooling power of the temperature regulating element meets preset conditions, and in response to the temperature collected by the temperature sensor being less than a second threshold, control the temperature regulating element to heat the heat-conducting medium. When the temperature of the printed circuit board is too low, and the cooling power of the temperature regulating element has been reduced to its minimum (or meets other preset conditions, such as zero cooling power), simply reducing the cooling power is insufficient to raise the temperature. At this time, the temperature regulating element activates its heating function to actively provide heat, effectively preventing the impact of excessively low printed circuit board temperature on the coupler performance. Furthermore, it can maintain the temperature of the printed circuit board over a wider ambient temperature range, enhancing the environmental adaptability of the coupler.
[0013] In some possible implementations, the second controller is further configured to: when the temperature collected by the temperature sensor is greater than a first threshold, the greater the difference between the temperature collected by the temperature sensor and the first threshold, the greater the increase in the cooling power of the temperature regulating element; when the temperature collected by the temperature sensor is less than a second threshold, the greater the difference between the first threshold and the temperature collected by the temperature sensor, the greater the decrease in the cooling power of the temperature regulating element. When the temperature of the printed circuit board exceeds the first threshold by a large margin, increasing the increase in cooling power can quickly provide a stronger cooling effect, causing the temperature to drop rapidly; when the temperature of the printed circuit board is significantly lower than the second threshold, increasing the decrease in cooling power can quickly weaken the cooling effect, causing the temperature to rise more quickly. Dynamically adjusting the change in cooling power according to the deviation between the temperature of the printed circuit board and the threshold can accelerate the temperature regulation speed, thereby shortening the regulation time, preventing the temperature of the printed circuit board from deviating from the set range for a long time, and improving the dynamic response characteristics of the temperature regulation of the printed circuit board.
[0014] In some possible implementations, the temperature regulating element includes a thermoelectric cooler (TEC). A thermoelectric cooler is a solid-state heat pump device based on the Peltier effect. It controls the direction of heat flow through direct current, achieving heat absorption at the cold end and heat release at the hot end, thereby completing the cooling or heating function. Using only a single thermoelectric cooler to achieve the cooling or heating function allows for effective control of the coupler size.
[0015] In some possible implementations, the dielectric constant of the thermally conductive medium is less than 8. This avoids the influence of a high dielectric constant on the electromagnetic field distribution, thereby reducing unnecessary coupling or interference caused by the thermally conductive medium.
[0016] In some possible implementations, the first support portion is detachably connected to the printed circuit board, and the first support portion is detachably connected to the first board body. This allows for adjustment of the height of the first cover by replacing the first support portion with one of different lengths, making the feature matching of the coupler more flexible.
[0017] In some possible implementations, the length of the first support portion in the first direction is adjustable. This allows for adjustment of the height of the first cover by extending and retracting the length of the first support portion, resulting in more flexible feature matching of the coupler.
[0018] In a second aspect, an electronic device is provided, which includes a radio frequency power supply and a coupler as described in the first aspect above, the coupler being connected to the radio frequency power supply.
[0019] It should be understood that the technical effects of the second aspect can be referred to the technical effects of the first aspect and any of its embodiments, and will not be repeated here. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in some embodiments of this application will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this application.
[0021] Figure 1 This is a schematic diagram of a parallel microstrip directional coupler provided in an embodiment of this application; Figure 2 An exploded view of the structure of a first type of coupler provided in an embodiment of this application; Figure 3 This is a cross-sectional view of the structure of the first type of coupler provided in the embodiments of this application; Figure 4 This is a cross-sectional view of the structure of the second type of coupler provided in the embodiments of this application; Figure 5 This is a cross-sectional view of the structure of the third type of coupler provided in the embodiments of this application; Figure 6 This is a cross-sectional view of the structure of the fourth type of coupler provided in the embodiments of this application; Figure 7 This is a schematic diagram showing the connection relationship between the first controller and the temperature regulating element provided in an embodiment of this application; Figure 8 A schematic diagram of the control logic of the first controller provided in an embodiment of this application; Figure 9 This is a cross-sectional view of the structure of the fifth type of coupler provided in the embodiments of this application; Figure 10 This is a cross-sectional view of the sixth type of coupler provided in the embodiments of this application; Figure 11 This is a schematic diagram illustrating the connection relationship between the second controller, the temperature sensor, and the temperature regulating element provided in an embodiment of this application. Figure 12 This is a schematic diagram of the control logic of a second controller provided in an embodiment of this application; Figure 13 Another control logic diagram of the second controller provided in the embodiments of this application; Figure 14A schematic diagram of the control logic for the coordinated control of a temperature regulating element by a first controller and a second controller, provided in an embodiment of this application; Figure 15 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.
[0022] Explanation of reference numerals in the attached figures: 100, Directional coupler; 110, Microstrip transmission line; 120, Microstrip coupling line; 121, Coupling section; 122, First extension section; 123, Second extension section; 200, Coupler; 210, Substrate; 211, Groove; 220, Printed circuit board; 221, Transmission line; 222, Coupling line; 230, Thermal conductive medium; 240, First cover; 241, First support section; 242, First plate section; 250, Temperature regulating element; 260, First controller; 270, Temperature sensor; 280, Second controller; 300, Radio frequency power supply; 400, Electronic device. Detailed Implementation
[0023] The technical solutions in some embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments provided in this application, all other embodiments obtained by those skilled in the art are within the scope of protection of this application.
[0024] Unless the context otherwise requires, throughout this application, the term "comprising" is interpreted as open and encompassing, meaning "including, but not limited to." In the description, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "exemplary," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this application. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, specific features, structures, materials, or characteristics may be included in any suitable manner in any one or more embodiments or examples.
[0025] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this application, unless otherwise stated, "a plurality of" means two or more.
[0026] A coupler can be used to couple out a small portion of power for power detection. Figure 1 A schematic diagram of a parallel microstrip directional coupler is shown. Figure 1As shown, the directional coupler 100 may include a microstrip transmission line 110 and a microstrip coupling line 120. The microstrip transmission line 110 is a strip-shaped straight line with a length of λ / 4, where λ is the wavelength of the electromagnetic wave transmitted by the microstrip transmission line 110. One end of the microstrip transmission line 110 serves as the input terminal of the directional coupler 100, through which the electromagnetic wave requiring power detection is input; the other end of the microstrip transmission line 110 serves as the output terminal of the directional coupler 100, through which most of the power of the electromagnetic wave is output. The microstrip coupling line 120 includes a coupling section 121, a first extension section 122, and a second extension section 123, all of which are also strip-shaped straight lines. The coupling section 121 is arranged parallel to the microstrip transmission line 110. The first extension 122 is perpendicular to the coupling portion 121, and one end of the first extension 122 is connected to one end of the coupling portion 121, while the other end serves as the coupling end of the directional coupler 100. A small portion of the electromagnetic wave power is output from the coupling end through electromagnetic coupling. The second extension 123 is perpendicular to the coupling portion 121, and one end of the second extension 123 is connected to the other end of the coupling portion 121. The other end serves as the isolation end of the directional coupler 100. Ideally, there is no electromagnetic wave output at the isolation end.
[0027] However, in high-power scenarios, the self-heating of the microstrip transmission line 110 and the microstrip coupling line 120 (the main heat source) and changes in ambient temperature can easily cause the internal circuit parameters of the directional coupler 100 to drift, resulting in unstable measured values with temperature changes; that is, poor temperature stability.
[0028] To improve the stability of the coupler, this application provides a coupler, such as... Figure 2 and Figure 3 As shown, the coupler 200 includes a substrate 210, a printed circuit board (PCB) 220, and a thermally conductive medium 230.
[0029] In some examples, substrate 210 may be made of metal (e.g., aluminum or copper) and grounded via a ground wire; substrate 210 may also be referred to as a metal substrate reference ground. In other examples, substrate 210 may also be made of a thermally conductive composite material. Substrate 210 has a mounting surface, and printed circuit board 220 is disposed on the mounting surface. Printed circuit board 220 includes transmission lines 221 and coupling lines 222. Furthermore, substrate 210 also has a recess 211, the projections of transmission lines 221 and coupling lines 222 onto substrate 210 are located in recess 211. It should be noted that "the projections of transmission lines 221 and coupling lines 222 onto substrate 210 are located in recess 211" means that the entire projection of transmission lines 221 and coupling lines 222 onto substrate 210 is located in recess 211; or, a portion of the projections of transmission lines 221 and coupling lines 222 onto substrate 210 is located in recess 211.
[0030] A thermally conductive medium 230 is disposed in the groove. The thermally conductive medium 230 can be solid, gel, or liquid; for example, it can be thermally conductive grease, thermally conductive pad, thermally conductive gel, ceramic, or a highly thermally conductive insulating adhesive. The thickness of the thermally conductive medium 230 is adjusted according to the depth h1 of the groove 211 of the substrate 210. Furthermore, the thermally conductive medium 230 is in contact with the printed circuit board 220; for example, the upper surface of the thermally conductive medium 230 is in direct contact with the lower surface of the printed circuit board 220, thereby establishing an efficient heat conduction path between the printed circuit and the substrate 210. Once the printed circuit board 220 and the thermally conductive medium 230 are selected, the standing wave ratio and directivity of the coupler 200 can be adjusted by adjusting the depth h1 of the groove 211 and the width w of the transmission line 221. That is to say, the depth of the groove 211 can be determined according to design requirements.
[0031] In some embodiments, the dielectric constant of the thermally conductive medium 230 is less than 8. The low dielectric constant of the thermally conductive medium 230 can avoid the influence of the high dielectric constant of the thermally conductive medium 230 on the electromagnetic field distribution, thereby reducing unnecessary coupling or interference caused by the thermally conductive medium 230, so as to ensure the stability of the radio frequency performance (e.g., coupling degree, directivity and insertion loss) of the coupler 200.
[0032] The printed circuit board 220 has a first surface and a second surface opposite to each other along a first direction. The first surface is the surface of the printed circuit board 220 facing away from the substrate 210, and the second surface is the surface facing the substrate 210. The first direction refers to the thickness direction of the printed circuit board. In some embodiments, one of the transmission line 221 and the coupling line 222 is disposed on the first surface, and the other is disposed on the second surface. For example, the transmission line 221 is disposed on the first surface, and the coupling line 222 is disposed on the second surface. By disposing the transmission line 221 and the coupling line 222 on the first and second surfaces opposite to the printed circuit board 220, respectively, wiring space on the same layer can be freed up, facilitating routing, component placement, or enabling more complex circuit layouts.
[0033] Although not shown in the accompanying drawings, it is understood that in other examples, the transmission line 221 may be disposed on the second surface and the coupling line 222 may be disposed on the first surface. Furthermore, in some other embodiments, the printed transmission line 221 and coupling line 222 may both be disposed on the first surface; or both may be disposed on the second surface.
[0034] This embodiment of the application significantly increases the heat dissipation capacity of the coupler 200 by filling the groove 211 of the substrate 210 with a thermally conductive medium 230. Therefore, when the output power of the RF power supply 300 connected to the coupler 200 is high, a large amount of heat generated by the transmission line 221 and coupling line 222 can be conducted to the substrate 210, thereby significantly reducing the temperature rise of the transmission line 221 and coupling line 222 under high power conditions. This weakens or even prevents the dielectric constant of the printed circuit board 220 from changing with temperature, thus maintaining the stability of the dielectric constant of the printed circuit board 220. Since the dielectric constant of the printed circuit board 220 affects the port matching characteristics, standing wave characteristics, directivity, coupling degree, and isolation degree of the coupler 200, maintaining the stability of the dielectric constant of the printed circuit board 220 can improve the stability of the coupler 200, thereby improving the accuracy and stability of detecting the output power of the RF power supply 300.
[0035] like Figure 4 As shown, in some embodiments, the coupler 200 further includes a conductive first cover 240, which includes a first support portion 241 and a first plate portion 242. A first ground line (not shown) is provided on a first surface of the printed circuit board 220, and one end of the first support portion 241 is connected to the first ground line. The first plate portion 242 is connected to the other end of the first support portion 241 and is disposed opposite to the first surface. The projection of the first plate portion onto the first surface covers one of the transmission line 221 and the coupling line 222 located on the first surface. In some examples, the first cover 240 may be metal, and the first cover 240 may also be referred to as an upper metal cover reference ground.
[0036] The first cover can form a capacitor with the transmission line. Adjusting the height h2 of the first cover (i.e., the length of the first support 241) can adjust the capacitance value of the capacitor, thereby adjusting the characteristic impedance to make it more optimal, so that the coupler 200 can have a better standing wave ratio and directivity. Furthermore, the first cover 240 and the substrate 210 can together form a protective shell, providing mechanical protection and a certain degree of electromagnetic shielding for the internal transmission line 221, coupling line 222 and printed circuit board 220.
[0037] To allow for flexible adjustment of the height h2 of the first cover 240, in some embodiments, the first support portion 241 is detachably connected to the first plate portion 242. This allows for adjustment of the height h2 of the first cover 240 by replacing the first support portion 241 with different lengths, thereby optimizing the characteristic impedance of the coupler. In other embodiments, the length of the first support portion 241 is telescopically adjustable in a first direction. This allows for adjustment of the height h2 of the first cover 240 by telescopically adjusting the length of the first support portion 241.
[0038] like Figure 5 or Figure 6 As shown, in some embodiments, the coupler 200 further includes a temperature regulating element 250 disposed within a groove 211, located between the substrate 210 and the heat-conducting medium 230; that is, disposed at the bottom of the groove 211. The temperature regulating element 250 is used for heating and / or cooling to keep the temperature of the printed circuit board 220 within a set temperature range. The temperature regulating element 250 can actively heat or cool the heat-conducting medium 230, thereby controlling the temperature of the printed circuit board 220, which is in close contact with the heat-conducting medium 230, and the transmission lines 221 and coupling lines 222 on the printed circuit board 220. This fundamentally solves the temperature drift problem caused by changes in ambient temperature or fluctuations in its own power, enabling the coupler 200 to maintain high accuracy and stability over a wider range of ambient temperatures.
[0039] In some embodiments, the temperature regulating element 250 employs a thermoelectric cooler, which has a cold end and a hot end. By controlling the direction of heat flow with a direct current, the thermoelectric cooler can achieve heat absorption at the cold end and heat release at the hot end, thereby completing the cooling or heating function. In some examples, one side of the thermoelectric cooler faces the heat conduction medium 230, while the other side is in contact with the substrate 210 via thermal paste or the like, where the substrate 210 also serves as a heat sink. The embodiments of this application use only a single device, the thermoelectric cooler, to achieve the cooling or heating function, effectively controlling the size of the coupler 200.
[0040] like Figure 7 As shown, in some embodiments, the coupler 200 further includes a first controller 260, which is connected to the temperature regulating element 250. In some examples, the first controller 260 may include a device with data processing and control capabilities, such as a microcontroller unit (MCU), a field-programmable gate array (FPGA), a digital signal processor (DSP), or an application-specific integrated circuit (ASIC).
[0041] like Figure 8 As shown, in some embodiments, the first controller 260 can acquire the output power of the RF power supply connected to the coupler 200. In some examples, this power value can be read directly from the RF power supply via a communication interface (such as an analog input or a digital communication bus).
[0042] Then, the first controller 260 controls the temperature regulating element 250 to cool the heat-conducting medium 230 with a cooling power corresponding to the output power of the radio frequency power supply, based on the output power of the radio frequency power supply. In some examples, the first controller 260 can find the cooling power of the temperature regulating element 250 corresponding to the output power of the radio frequency power supply based on a pre-stored "output power-cooling power" mapping relationship (which can be obtained through experimental calibration), and control the temperature regulating element 250 to cool the heat-conducting medium 230 with the found cooling power by sending a control signal to the temperature regulating element 250.
[0043] In other words, the first controller 260 adopts a feedforward control method to pre-regulate the temperature based on the output power of the RF power supply, thereby improving the response speed of temperature control and enabling rapid control of temperature fluctuations on the printed circuit board 220.
[0044] In other embodiments, the first controller 260 may be integrated into an external system controller. The first controller 260, belonging to the external system controller, can be integrated with, for example... Figure 5 or Figure 6 The coupler 200 shown is connected, and the first controller 260 can still perform operations such as... Figure 8 The control logic shown is used to achieve the following: Figure 5 or Figure 6 The temperature regulating element 250 in the coupler 200 shown is controlled.
[0045] like Figure 9 or Figure 10 As shown, in some embodiments, the coupler 200 may also include a temperature sensor 270, which is directly disposed on the printed circuit board 220. In some examples, the temperature sensor 270 (e.g., a surface-mount thermistor or a digital temperature sensor 270) is positioned close to the main heat source area, such as the transmission line 221 or the coupling line 222, to most accurately sense the actual operating temperature of the printed circuit board 220.
[0046] The cooling power of the temperature regulating element 250 in cooling the heat-conducting medium 230 is also related to the temperature collected by the temperature sensor 270. For example... Figure 11 As shown, in some embodiments, the coupler 200 further includes a second controller 280, which is connected to both the temperature sensor 270 and the temperature regulating element 250. In some examples, the second controller 280 may also include devices with data processing and control capabilities, such as a microcontroller unit, a field-programmable gate array, a digital signal processor, or an application-specific integrated circuit.
[0047] like Figure 12As shown, the second controller 280 can acquire the temperature collected by the temperature sensor 270. When the temperature collected by the temperature sensor 270 is greater than the first threshold, the second controller 280 controls the cooling power of the temperature regulating element 250 to increase; when the temperature collected by the temperature sensor 270 is less than the second threshold, the second controller 280 controls the cooling power of the temperature regulating element 250 to decrease; wherein the second threshold is less than the first threshold.
[0048] Furthermore, when the temperature collected by the temperature sensor 270 is greater than the first threshold, the greater the difference between the temperature collected by the temperature sensor 270 and the first threshold, the greater the increase in the cooling power of the temperature regulating element 250 controlled by the second controller 280. When the temperature collected by the temperature sensor 270 is less than the second threshold, the greater the difference between the first threshold and the temperature collected by the temperature sensor 270, the greater the decrease in the cooling power of the temperature regulating element 250.
[0049] In other words, when the temperature of the printed circuit board 220 exceeds the first threshold by a significant margin, increasing the cooling power provides a faster and stronger cooling effect, causing the temperature to drop rapidly. Conversely, when the temperature of the printed circuit board 220 falls significantly below the second threshold, increasing the cooling power reduces the cooling effect quickly, causing the temperature to rise more rapidly. This dynamic adjustment of the cooling power based on the deviation between the temperature of the printed circuit board 220 and the threshold accelerates temperature regulation, shortens regulation time, prevents the temperature of the printed circuit board 220 from deviating from the set range for extended periods, and improves the dynamic response characteristics of temperature control for the printed circuit board 220.
[0050] Through the above implementation, the second controller 280 can achieve closed-loop feedback control of the temperature of the printed circuit board 220, thereby stabilizing the temperature of the printed circuit board 220 within the range of a second threshold to a first threshold, wherein the first threshold is greater than the second threshold. This allows for more accurate temperature control of the printed circuit board 220, maintaining the stability of its dielectric constant and significantly improving the accuracy and stability of the RF power output detection. Furthermore, when the temperature collected by the temperature sensor 270 is between the first and second thresholds, the second controller 280 remains inactive (the cooling power of the temperature regulating element 250 remains unchanged), thus preventing frequent start-stop of the controller due to noise or minor disturbances, thereby avoiding frequent adjustments to the cooling power and effectively suppressing temperature regulation oscillations.
[0051] Furthermore, such as Figure 13As shown, in some embodiments, when the cooling power of the temperature regulating element 250 meets preset conditions; for example, when the cooling power of the temperature regulating element 250 has been reduced to a preset minimum value (e.g., close to 0, or an extremely low power to maintain thermal equilibrium), if the temperature collected by the temperature sensor 270 is still below the second threshold, it indicates that simply reducing the cooling power of the temperature regulating element 250 is insufficient to raise the temperature back to the target range. At this time, the second controller 280 will control the temperature regulating element 250 to switch its operating mode, controlling the temperature regulating element 250 to begin heating the heat-conducting medium 230 (e.g., reversing the current direction of the thermoelectric cooler, swapping its cold and hot ends), until the temperature rises above the second threshold, thereby ensuring that the coupler 200 can operate stably even in cold environments. That is, it can maintain the temperature of the printed circuit board 220 over a wider ambient temperature range, enhancing the environmental adaptability of the coupler 200.
[0052] It should be understood that in other embodiments, the second controller 280 may also be integrated into an external system controller. The second controller 280, belonging to the external system controller, can be integrated with... Figure 9 or Figure 10 The coupler 200 shown is connected, and the second controller 280 can still perform operations such as... Figure 12 or Figure 13 The control logic shown is used to achieve the following: Figure 9 or Figure 10 The temperature regulating element 250 in the coupler 200 shown is controlled.
[0053] In some embodiments, the first controller 260 and the second controller 280 can cooperate to control the temperature regulating element 250. For example... Figure 14 As shown, the first controller 260 can first control the temperature regulating element 250 to cool the heat-conducting medium 230 with a cooling power corresponding to the output power of the RF power supply. Then, the second controller dynamically adjusts the cooling power of the temperature regulating element 250 based on the temperature collected by the temperature sensor 270. Thus, the final cooling power of the temperature regulating element 250 for cooling the heat-conducting medium 230 is not only related to the calculated value of the RF power supply power, but also to the real-time temperature collected by the temperature sensor 270, forming a composite closed-loop control.
[0054] It should be noted that the first controller 260 and the second controller 280 can be the same physical entity; that is, the first controller 260 and the second controller 280 are the same controller, which can achieve the following: Figure 14 The control logic is shown.
[0055] This application also provides an electronic device, such as... Figure 15As shown, the electronic device 400 includes an RF power supply 300 and, as shown, a ...400. Figures 2 to 6 and Figures 9-10 Any of the couplers 200 in the embodiment. The input port of the coupler 200 is connected to the output terminal of the RF power supply 300, and is used to couple and sample the electromagnetic signal output by the RF power supply 300, and feed back the sampled power data to the control system of the RF power supply 300 to realize closed-loop feedback control of the output power of the RF power supply 300. Since the coupler 200 provided in this embodiment has excellent stability, it can ensure the long-term reliability of the entire electronic device 400 (e.g., plasma generator and material processing equipment).
[0056] This application provides a coupler and electronic device. The coupler 200 significantly increases its heat dissipation capacity by filling a groove 211 in the substrate 210 with a thermally conductive medium 230. Therefore, when the RF power supply 300 connected to the coupler 200 outputs a high power, a large amount of heat generated by the transmission line 221 and coupling line 222 can be conducted to the substrate 210, thereby significantly reducing the temperature rise of the transmission line 221 and coupling line 222 under high power conditions. This weakens or even prevents the dielectric constant of the printed circuit board 220 from changing with temperature, thus maintaining the stability of the dielectric constant of the printed circuit board 220. Since the dielectric constant of the printed circuit board 220 affects the port matching characteristics, standing wave characteristics, directivity, coupling degree, and isolation of the coupler 200, maintaining the stability of the dielectric constant of the printed circuit board 220 can improve the stability of the coupler 200, thereby improving the accuracy and stability of detecting the output power of the RF power supply 300.
[0057] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the descriptions of each embodiment in the above embodiments have different focuses. For parts not described in detail in a certain embodiment, refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.
[0058] In the several embodiments provided in this application, it should be understood that the disclosed couplers and electronic devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between devices or modules, and may be electrical, mechanical, or other forms.
[0059] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located on one device or distributed across multiple devices. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.
[0060] In addition, the functional modules in the various embodiments of this application can be integrated into one device, or each module can exist physically separately, or two or more modules can be integrated into one device.
[0061] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented using software programs, implementation can be, in whole or in part, in the form of a computer program product.
[0062] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.
Claims
1. A coupler, characterized in that, include: The substrate has a mounting surface and a groove; A printed circuit board is disposed on the mounting surface. The printed circuit board includes transmission lines and coupling lines, and the projections of the transmission lines and coupling lines on the substrate are located in the groove. as well as A thermally conductive medium is disposed in the groove and in contact with the printed circuit board.
2. The coupler according to claim 1, characterized in that, The printed circuit board has a first surface and a second surface opposite to each other along a first direction, wherein the first surface is the surface of the printed circuit board facing away from the substrate, and the second surface is the surface facing the substrate; One of the transmission line and the coupling line is located on the first surface, and the other is located on the second surface.
3. The coupler according to claim 2, characterized in that, It also includes a first conductive cover, the first cover comprising: A first support portion, wherein the printed circuit board has a first ground line on the first surface, and the first support portion is connected to the first ground line; and A first plate portion is connected to the first support portion and is disposed opposite to the first surface. The projection of the first plate portion onto the first surface covers one of the transmission line and the coupling line disposed on the first surface.
4. The coupler according to claim 3, characterized in that, The first support portion is detachably connected to the first plate portion.
5. The coupler according to claim 3, characterized in that, The length of the first support portion in the first direction is adjustable.
6. The coupler according to any one of claims 1-5, characterized in that, It also includes a temperature regulating element disposed in the groove, and the heat-conducting medium is disposed between the temperature regulating element and the printed circuit board. The temperature regulating element is used for heating and / or cooling.
7. The coupler according to claim 6, characterized in that, It also includes a first controller, which is connected to the temperature regulating element, and the first controller is configured to: Obtain the output power of the radio frequency power supply connected to the coupler; as well as Based on the output power of the radio frequency power supply, the temperature regulating element is controlled to cool the heat-conducting medium with a cooling power corresponding to the output power.
8. The coupler according to claim 7, characterized in that, It also includes a temperature sensor and a second controller; The temperature sensor is disposed on the printed circuit board and is used to collect the temperature of the printed circuit board; The second controller is connected to both the temperature sensor and the temperature regulating element, and is configured to acquire the temperature collected by the temperature sensor. In response to the temperature collected by the temperature sensor being greater than a first threshold, the cooling power of the temperature regulating element is increased. In response to the temperature collected by the temperature sensor being lower than the second threshold, the cooling power of the temperature regulating element is reduced. Wherein, the first threshold is greater than the second threshold.
9. The coupler according to any one of claims 6 to 8, characterized in that, The temperature regulating element includes a semiconductor cooler.
10. The coupler according to any one of claims 1 to 9, characterized in that, The dielectric constant of the thermally conductive medium is less than 8.
11. An electronic device, characterized in that, It includes a radio frequency power supply and a coupler as described in any one of claims 1-10, wherein the coupler is connected to the radio frequency power supply.