A standing wave effect enhanced resonant plate vibration method and system

Abstract

The present application relates to the field of sensor, in order to solve the problem of small range of the existing resonant plate vibration method, provide a kind of standing wave effect enhanced resonant plate vibration method and system, comprising: several resonant plate groups, each resonant plate group includes: two oppositely arranged resonant plates;The center of each resonant plate group coincides;Each resonant plate is away from or close to the center simultaneously when vibrating;The force direction of the resonant plate is along its length direction;The vibration direction of the resonant plate is along its thickness direction.The present application obtains the force range of resonant plate group by the force of multiple resonant plates and the bending moment deviation between resonant plates, not only greatly improves the range, but also ensures that the energy loss in the force range will not drop too much due to the bending moment deviation of each resonant plate after force, thereby making the sensor using the vibration method provided by the present application have obvious standing wave effect, low energy dissipation, high quality factor Q value and good stability.

Description

Technical Field

[0001] This invention relates to the field of sensors, and more specifically, to a method and system for enhancing the vibration of a resonator by standing wave effect. Background Technology

[0002] Single-crystal quartz, due to its high Q value, possesses characteristics such as fast response frequency, good long-term stability, small temperature drift, and high temperature resistance, making it widely used in high-standard and high-requirement environments involving high temperature, high pressure, and high precision measurements. The high Q value of a material refers to its performance index of lower energy loss and more significant resonance characteristics at a specific frequency, typically used to measure the efficiency and stability of components such as inductors and resonators. However, due to the piezoelectric properties of quartz, it is a passive sensor, and weak charge leakage occurs during measurement. Therefore, the piezoelectric resonator vibration method can only be used for dynamic measurements and cannot achieve static measurements. Later, a resonator vibration method using the inverse piezoelectric effect of quartz emerged. Since the material is also quartz, most of the advantages of quartz can be utilized. The alternating electric field causes the quartz material to vibrate, which solves the static testing problem. However, the disadvantage is that because vibration is required, the thickness of quartz material is very thin (less than 1 mm), and a force is applied in the thickness direction. Therefore, the measurement range of quartz resonator sensors cannot be large, generally limited to a maximum range of 10-20 kg, making it impossible to achieve large-range measurements of over 100 kg. Summary of the Invention

[0003] The purpose of this invention is to provide a method and system for enhancing the standing wave effect of a resonator vibration, thereby solving the problem that existing resonator vibration methods are difficult to implement large-range measurements.

[0004] The embodiments of the present invention are achieved through the following technical solutions:

[0005] A method for enhancing the vibration of a resonator by standing wave effect includes: a plurality of resonator groups, each resonator group including: two resonators arranged opposite each other; the centers of each resonator group coincide; each resonator moves synchronously away from or towards the center during vibration;

[0006] The force on the resonator is directed along its length; the vibration direction of the resonator is directed along its thickness.

[0007] Preferably, the resonator vibration method includes: applying pressure to the resonator group along the length direction of the resonator, and then obtaining a first relationship curve between the pressure and the bending moment deviation between each resonator;

[0008] Obtain the second relationship curve between bending moment deviation and energy loss;

[0009] The stress range of the resonant plate group is obtained based on the first and second relationship curves.

[0010] In the resonator vibration method, the magnitude of the force on the resonator satisfies the stated force range.

[0011] Preferably, the bending moment deviation is obtained by acquiring the bending moment of each resonator.

[0012] Methods for detecting the bending moment of a resonator include:

[0013] After applying pressure to the resonator assembly along the length of the resonator, the output voltage across the resonator is obtained;

[0014] Under the same pressure, the maximum difference in output voltage between each resonator is obtained, and thus the relationship between pressure and the maximum difference in output voltage is obtained; the bending moment deviation is characterized by the maximum difference in output voltage.

[0015] Preferably, the bending moment deviation = 100% × the maximum difference in output voltage / the average value of output voltage.

[0016] Preferably, the resonator vibration method includes:

[0017] Under maximum design pressure, obtain the third relationship curve between the thickness of the resonator and the bending moment deviation;

[0018] The minimum value of the resonator thickness is obtained based on the preset maximum bending moment deviation threshold and the third relationship curve.

[0019] Preferably, in the second relationship curve, energy loss = 100% × (Q0 - Q) n ) / Q0; Q0 is the quality factor of the resonator when it is initially compressed; Q n This refers to the quality factor of the resonator after the pressure on the resonator increases.

[0020] Preferably, the method for obtaining the preset maximum bending moment deviation threshold includes:

[0021] S100, Obtain the fourth relationship curve between the quality factor and thickness of a single resonator;

[0022] S200. The maximum bending moment deviation threshold is obtained based on the preset minimum quality factor, the fourth relationship curve, and the second relationship curve.

[0023] A resonator vibration system includes a microprocessor and a memory interconnected, the microprocessor being programmed or configured to perform the resonator vibration method.

[0024] The present invention has at least the following beneficial effects:

[0025] This invention uses multiple resonators to share the force and obtains the force range of the resonator group by measuring the bending moment deviation between each resonator. This not only significantly increases the measurement range but also ensures that the energy loss within the force range does not decrease excessively due to the bending moment deviation after each resonator is subjected to force. Consequently, the sensor using the vibration method provided by this invention exhibits a significant standing wave effect, low energy dissipation, a large quality factor Q, and good stability. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the first structure of the resonator vibration method;

[0028] Figure 2 This is a schematic diagram of the connection structure of the electrode sheets;

[0029] Figure 3 This is a schematic diagram of the second structure of the resonator vibration method;

[0030] Figure 4 This is a force analysis diagram; where, Figure 4 -a is a schematic diagram of the first connection between the connector and the outer sheet. Figure 4 -c is Figure 4 -a is a diagram showing the rotation of the connection structure. Figure 4 -b is a schematic diagram of the second connection between the connector and the outer sheet. Figure 4 -d is Figure 4 A rotational diagram of the connection structure in -b;

[0031] Reference numerals: 1-quartz fixing block, 11-substrate, 12-protrusion, 2-quartz resonator, 3-electrode lead-out plate, 31-outer plate body, 32-inner plate body, 33-connector, 4-electrode plate, 5-gap. Detailed Implementation

[0032] To make the objectives, methods, and advantages of the embodiments of the present invention clearer, the methods in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0033] Example 1: As Figure 1-3As shown, a method for enhancing the vibration of a resonator by standing wave effect includes: several groups of resonators, each group of resonators including: two resonators arranged opposite each other; the centers of each group of resonators coincide; each resonator moves synchronously away from or towards the center when vibrating; the force direction of the resonator is along its length direction; the vibration direction of the resonator is along its thickness direction.

[0034] In the specific implementation process, such as Figure 1-3 As shown, the quartz sensor includes: a quartz fixing block 1 and several quartz resonant plates 2; with the center of the end face of the quartz fixing block 1 as a reference, several quartz resonant plates 2 are arranged in a ring between two quartz fixing blocks 1 and connected to the quartz fixing blocks 1; the quartz fixing block 1 is provided with electrode lead-out plates 3, and the inner and outer sides of the quartz resonant plates 2 are provided with electrode plates 4, and two electrode plates 4 on the same quartz resonant plate 2 are connected to different electrode lead-out plates 3.

[0035] The end face of the quartz fixing block 1 refers to the... Figure 1 From a certain perspective, the upper or lower end face of the quartz fixing block 1. The end face of the quartz fixing block 1 can be square, with the center of the end face being the intersection of the diagonals of the square. Existing resonant quartz sensors utilizing the inverse piezoelectric effect of quartz utilize most of the advantages of quartz material. Furthermore, the use of an alternating electric field to couple the vibration of the quartz material solves the static testing problem. However, because vibration is required, and the thickness of the quartz resonator 2 used is very thin, typically less than 1 mm, and a force is applied in the thickness direction, the measurement range of the quartz resonant sensor cannot be large, generally limited to a maximum range of 10-20 kg, making it impossible to achieve a large range measurement of over 100 kg. Based on the foregoing, the applicant aims to conceive of a quartz sensor capable of achieving a large range measurement.

[0036] The main reason why a single-chip resonant sensor cannot measure high forces is that its installation cannot guarantee absolute perpendicularity, resulting in a slight angle. As the measured force gradually increases, the bending moment component becomes larger. Since the chip is thin and hard, it may break, preventing the measurement of a large range. This embodiment uses an AT-cut quartz resonant chip 2 and a quartz fixing block 1, which are polished with high precision, ensuring dimensional tolerances within 2µm. They are then sintered at high temperature to form a whole, guaranteeing the perpendicularity of the assembly. Furthermore, the quartz resonant chip 2 is assembled in multiple directions to ensure that the sensor does not shift under high pressure, thus increasing the sensor's measurement range by tens of times.

[0037] As an example, electrode sheet 4 and electrode lead sheet 3 can be made of materials with good conductivity, such as platinum, gold, silver and nickel.

[0038] As an example, electrode sheet 4 and electrode lead sheet 3 can be connected to the quartz by welding or bonding.

[0039] like Figure 1-2 As shown, opposing electrode plates 4 are arranged on the inner and outer sides of the quartz resonator 2. The two electrode plates 4 are connected to different electrode leads 3, and an alternating electric field is applied to achieve measurement. The measurement principle is as follows: When an alternating voltage is applied to the electrodes on both sides of the quartz crystal, the crystal vibrates mechanically due to the inverse piezoelectric effect. When the voltage frequency is close to the crystal's natural frequency, the vibration amplitude is at its maximum, forming a piezoelectric resonance. When external pressure is applied to the quartz resonator 2, stress is generated inside the crystal, causing changes in its thickness shear modulus or equivalent stiffness, thus shifting the resonant frequency. The frequency shift is linearly related to the pressure, and the pressure value can be easily obtained from the frequency shift.

[0040] like Figure 3 As shown, in this embodiment, the electrode lead-out sheet 3 includes an outer sheet 31 and an inner sheet 32 ​​disposed opposite to each other on the inner and outer sides of the quartz fixing block 1. The electrode sheet 4 on the inner side of the quartz resonator 2 is connected to the inner sheet 32, and the electrode sheet 4 on the outer side of the quartz resonator 2 is connected to the outer sheet 31.

[0041] When a through hole is provided in the middle of the quartz fixing block 1, and a columnar lead-out electrode is placed in the through hole, the connection between the inner electrode of the quartz resonator 2 and the lead-out electrode can be easily achieved. However, the manufacturing process of the resonator vibration method involves additional drilling of the quartz fixing block 1 and installation and fixing of the lead-out electrode, making the process more complicated. In addition, the quartz block is brittle, and in the field of sensors, structural defects of the quartz block can easily affect the detection accuracy, making drilling difficult. In this embodiment, the connection between the electrode plate 4 and the electrode lead-out plate 3 can be easily achieved by combining the outer plate 31 and the inner plate 32, and the drilling of the quartz block can be avoided.

[0042] In this embodiment, the edge of the outer sheet 31 is connected to the edge of the inner sheet 32 ​​through the connector 33, and the connector 33 abuts against or connects to the side wall of the quartz fixing block 1.

[0043] The connector 33, outer sheet 31, and inner sheet 32 ​​can be made of the same material. The connector 33 can be tightly attached to the quartz fixing block 1, or it can be glued or welded to the quartz fixing block 1. The outer sheet 31, connector 33, and inner sheet 32 ​​can form a six-directional wrapping structure, covering the quartz fixing block 1 between the inner sheet 32 ​​and the outer sheet 31, and then restricting the relative displacement between the quartz fixing block 1, the inner sheet 32, and the outer sheet 31 through the connector 33.

[0044] As an example, when the quartz fixing block 1 is subjected to oblique pressure, the outer plate 31 at the upper end is subjected to a horizontal component force in addition to the vertical downward force. The horizontal component force may affect the positional stability of the outer plate 31. However, under the constraints of the inner plate 32 and the connecting body 33, the possibility of displacement of the outer plate 31 due to the influence of the horizontal component force can be greatly reduced, thereby broadening the applicable scenarios of the resonator vibration method and increasing the range.

[0045] like Figure 3 As shown, in this embodiment, the outer sheet 31 and the inner sheet 32 ​​are rectangular, and there are at least four connecting bodies 33; one end of the connecting body 33 is connected to the corner of the outer sheet 31, and the other end of the connecting body 33 is connected to the corner of the inner sheet 32.

[0046] A corner point refers to the vertex of a corner of the outer sheet 31. When subjected to force, the outer sheet 31 may exhibit a tendency to rotate. (See also...) Figure 4 -a, When the connecting body 33 is connected to the midpoint of one side of the outer body 31, its rotation trend can be seen in [reference needed]. Figure 4 -c, which only requires breaking one connection point, while the remaining connection points are subjected to compressive force rather than tensile force, thus it can smoothly achieve the rotation of the outer sheet 31 without breaking it, and as... Figure 4 As shown in -b, when the connecting body 33 is connected to the vertex of a corner of the outer body 31, its rotation trend can be seen in [reference needed]. Figure 4 -d requires breaking the two connection points to achieve rotation, i.e. Figure 4 The structure shown in -b provides greater restriction on the rotation of the outer plate 31. While ensuring the stability of the resonator vibration method, the outer plate 31 can withstand higher forces, thereby increasing the range of the sensor.

[0047] In this embodiment, the corner points of the outer sheet 31 and the corner points of the inner sheet 32 ​​are positioned on the horizontal plane in a corresponding manner.

[0048] The correspondence of positions on the horizontal plane means that when the quartz resonator 2 is placed vertically, the X-axis and Y-axis coordinates of the corner points of the outer plate 31 and the inner plate 32 are the same in the same coordinate system. When the corner point coordinates of the two plates correspond, the extension direction of the end of the connector 33 is consistent with the extension direction of the edge of the outer plate 31, which can improve the restraining strength of the connector 33 on the outer plate 31.

[0049] like Figure 2 As shown, in this embodiment, the electrode sheet 4 is connected to the center of the edge of the electrode lead-out sheet 3.

[0050] After the electrode plate 4 is connected to one side of the electrode lead plate 3, it cooperates with the connecting body 33, making the positional stability of the outer plate body 31 stronger when subjected to force. Connecting the center of the electrode plate 4 to one side of the electrode lead plate 3 can improve the uniformity of force, thereby improving the performance uniformity of the outer plate body 31, thus improving the uniformity of current transmission between the electrode lead plate 3 and the four electrode plates 4. Ultimately, the vibration of each quartz resonator 2 tends to be consistent, with no amplitude at the sensor edge, obvious standing wave effect, and low energy dissipation, resulting in a very large quality factor Q value and excellent stability. Even under the action of small forces, the frequency change remains very stable, so the sensor has high discrimination power and achieves high-precision measurement.

[0051] like Figure 1 As shown, in this embodiment, a gap 5 is left between adjacent quartz resonators 2, and the connector 33 passes through the gap 5.

[0052] Four quartz resonators 2 can be used. Ideally, to increase the range of the resonator vibration method, the width of the quartz resonators 2 should be as large as possible, meaning adjacent quartz resonators 2 should be as close as possible. However, since the detection accuracy of the resonator vibration method is affected by temperature changes, to reduce the temperature difference between the inner and outer spaces of the quartz resonators 2 and improve heat dissipation, this embodiment provides a gap 5 between adjacent quartz resonators 2 to allow air circulation between the inner and outer spaces of the quartz resonators 2. Furthermore, a channel is provided for the connector 33 to connect with the inner plate body 32.

[0053] like Figure 1 As shown, in this embodiment, the quartz fixing block 1 includes: a base 11 and a boss 12 connected to the inner side of the base 11, the end of the quartz resonator 2 is connected to the base 11, and the inner sidewall of the quartz resonator 2 is connected to the boss 12.

[0054] The addition of the boss 12 increases the number of connection points along the thickness direction of the quartz resonator 2. When the quartz resonator 2 is bent under stress, the bending direction is along the thickness direction of the quartz resonator 2. Increasing the number of connection points along the thickness direction enhances the positional stability between the quartz resonator 2 and the quartz fixing block 1. Furthermore, the boss 12 facilitates the positioning of the quartz resonator 2. When the quartz resonator 2 abuts against the side wall of the boss 12, its positioning is achieved. This not only facilitates its connection with the quartz fixing block 1 but also ensures the uniformity of the four quartz resonators 2's positions, improving the overall measurement accuracy of the sensor.

[0055] The force direction of the resonator vibration method is along the length of the quartz resonator 2.

[0056] The method of making the resonator vibrate by applying force along the length of the quartz resonator 2 can be set up so that multiple quartz resonators 2 are subjected to pressure together. When using the force along the length to achieve measurement, it is necessary to ensure the perpendicularity of the quartz resonator 2. Therefore, after the quartz resonator 2 is connected to the quartz fixing block 1, it is necessary to ensure that it is perpendicular as much as possible, and to maintain perpendicularity as much as possible after multiple uses. Therefore, the connection method of the quartz resonator 2 is quite important.

[0057] The quartz fixing block 1 and the quartz resonator 2 are connected by glass sintering; the sintering temperature is 800-900℃, the holding time is 8-12min, the heating rate is 1-3℃ / min, and the sintering atmosphere is nitrogen.

[0058] Glass sintering can be performed using glass dielectric slurry. Glass dielectric slurry is a paste-like material used for sealing, insulating, or protecting electronic components. Its basic components include inorganic glass powder and an organic carrier. The particle size of the inorganic glass powder is controlled between 0.1-1 μm. Existing products can be used as the glass dielectric slurry in this embodiment. Using a nitrogen atmosphere can suppress the volatilization loss of active ingredients such as zinc oxide. The optimal sintering process is to heat to 850°C at a rate of 2°C / min, and then hold at that temperature for 10 minutes.

[0059] For the quartz sensor with the specific structure described above, this embodiment provides a new method for resonator vibration. By having the resonator group subjected to pressure and vibrating in the same direction, not only is the measurement range of the sensor improved, but the sensor can also be ensured to have the advantages of significant standing wave effect and low energy dissipation.

[0060] Example 2: The resonator vibration method includes: applying pressure to the resonator group along the length of the resonator, and then obtaining a first relationship curve between the pressure and the bending moment deviation between each resonator;

[0061] Obtain the second relationship curve between bending moment deviation and energy loss;

[0062] The stress range of the resonant plate group is obtained based on the first and second relationship curves.

[0063] In the resonator vibration method, the magnitude of the force on the resonator satisfies the stated force range.

[0064] In specific implementation, for the quartz sensor with the aforementioned specific structure, since it is equipped with four resonant plates, the bending moment of the four resonant plates may deviate when the quartz fixing block is compressed. The reasons for this deviation are at least as follows: there are unavoidable differences in the size and physical properties of the four resonant plates; there is a deviation in the perpendicularity of the four resonant plates after assembly; and there is a pressure deviation among the four resonant plates under pressure. When the bending moment deviation of the four resonant plates is large, it will inevitably affect the quality factor of the sensor, especially when the pressure is 10 times higher than that of conventional sensors. Therefore, this embodiment constructs a second relationship curve between the bending moment deviation of the resonant plates and the energy loss of the sensor through experiments to determine the maximum acceptable bending moment deviation within a preset energy loss threshold range; then, through the first relationship curve between pressure and bending moment deviation, the maximum applicable pressure of the sensor is obtained, and the force range can be from 0 to the maximum pressure.

[0065] The existing technology for testing sensor energy loss often uses the quality factor Q to measure energy loss. Examples include the free decay method or the -3dB bandwidth method.

[0066] The exemplary free decay method works by exciting a resonator to oscillate freely and recording the exponential decay curve of the amplitude over time. The Q value is proportional to the decay time constant (T), Q = πf r T, π are constants, f r Where is the resonant frequency, and T is the time required for the signal to decay to 1 / e≈36.8% of its original amplitude.

[0067] Exemplary, Q=f r / △f -3dB f r Where is the resonant frequency, Δf -3dB This represents the bandwidth when the power is reduced by half. Under constant environmental conditions, such as constant temperature, and with a fixed resonant element and resonant frequency, the Q value can be easily calculated.

[0068] The energy loss of the resonator array is equal to the sum of the energy losses of all the resonators.

[0069] Example 3: The bending moment deviation is obtained by acquiring the bending moment of each resonator;

[0070] Methods for detecting the bending moment of a resonator include:

[0071] After applying pressure to the resonator assembly along the length of the resonator, the output voltage across the resonator is obtained;

[0072] Under the same pressure, the maximum difference in output voltage between each resonator is obtained, and thus the relationship between pressure and the maximum difference in output voltage is obtained; the bending moment deviation is characterized by the maximum difference in output voltage.

[0073] In the specific implementation, when measuring the output voltage, the electrode leads are not assembled. The voltage is measured by drawing charge from the electrode plates on both sides of the quartz resonator. The voltage signal can be amplified by a charge amplifier or similar means. Although existing image recognition or ranging technologies can easily determine the distance of the resonator from the center of the resonator group after being compressed, thus simply characterizing the bending moment deviation, the bending amplitude of the resonator under pressure is inherently very small, typically on the nanometer scale, making it difficult to ensure detection accuracy. In this embodiment, however, by characterizing the bending moment through the output voltage, not only is the measurement process simple, but the measurement accuracy can also be easily guaranteed.

[0074] The maximum difference in output voltage refers to the difference between the maximum and minimum voltages among the four detected resonant plates.

[0075] In the sensor with the specific structure of this invention, the dimensional tolerance of the resonator needs to be as small as possible, ideally controlled within 2μm, which can be checked and controlled before use. At this point, under the same pressure conditions, the factor affecting the bending moment deviation is primarily the perpendicularity between the resonator and the quartz fixing block after assembly. Figure 1 In this structure, the perpendicularity or uniformity of the resonator is particularly important, as it significantly affects the overall energy loss of the sensor. However, the perpendicularity of the resonator after assembly is inherently related to the manufacturing process and process control, making it difficult to completely ensure. If product testing, such as energy consumption testing, is performed after the process is completed and the product is found to be defective, the wasted processing time and materials are excessive. Therefore, this embodiment addresses this issue by... Figure 1 In the structure shown, testing is performed without electrode leads. This not only allows for simple detection of the output voltage of a single resonator but also enables the identification of product quality before completion, reducing processing time and material waste. Bending moment deviation essentially reflects the perpendicularity of the resonator. When the perpendicularity deviation is too large, the bending moment deviation increases, leading to increased energy loss.

[0076] Example 4: Bending moment deviation = 100% × maximum difference in output voltage / average value of output voltage.

[0077] In practice, the average value of the output voltage is equal to the quotient of the sum of the output voltages of each resonator and the number of resonators.

[0078] Example 5: In this example, the resonator vibration method includes:

[0079] Under maximum design pressure, obtain the third relationship curve between the thickness of the resonator and the bending moment deviation;

[0080] The minimum value of the resonator thickness is obtained based on the preset maximum bending moment deviation threshold and the third relationship curve.

[0081] In practical implementation, the resonator needs to vibrate and therefore requires a relatively thin thickness. However, excessive thinness leads to easy breakage, while excessive thickness makes it difficult to achieve high frequencies. Thus, the thickness of the resonator is typically between 0.2-0.5 mm, a narrow design range that is difficult to adjust significantly. However, by using the method of having four resonators subjected to pressure together as provided in this invention, even with the same overall pressure as conventional sensors, the design thickness of the resonators can be narrower. Furthermore, the design size of the resonator is usually directly related to its Q value; larger resonators typically have higher Q values ​​than micro-resonators, meaning lower energy loss. The resonant frequency of a quartz resonator is generally inversely proportional to its thickness. To achieve high-frequency operation, the resonator thickness needs to be smaller, resulting in a relatively lower Q value. With a narrower thickness, the pressure is greater, and it is more prone to deviation. Therefore, in the sensor structure of this invention, with a narrower thickness, the bending moment deviation tends to increase, leading to increased energy loss. Thus, to ensure high-frequency operation, the resonator may need to sacrifice some of its stress range, while to ensure the maximum pressure it can withstand, the design frequency range becomes narrower.

[0082] Since the measurement range of the sensor in this invention has already been significantly improved, the applicant further desires to achieve high frequency of the resonator. However, unlike conventional sensors, the reduction in thickness associated with achieving high frequency will increase bending moment deviation to some extent, thereby increasing energy loss. That is, compared to the energy loss of conventional sensors, there is an additional portion of energy loss due to bending moment deviation. Therefore, even if the thickness of the sensor in the structure of this invention is smaller than that of conventional sensors, it still needs to be controlled to reduce energy loss.

[0083] The maximum design pressure is the maximum value of the stress range of the resonator.

[0084] Example 6: Energy loss in the second relationship curve = 100% × (Q0 - Q) n ) / Q0; Q0 is the quality factor of the resonator when it is initially compressed; Q n This refers to the quality factor of the resonator after the pressure on the resonator increases.

[0085] In practice, under normal circumstances, unless the force on the sensor exceeds the design threshold, the size of the resonator does not significantly affect the energy loss. However, if the energy loss in the second relationship curve of this invention is directly the Q value, the size of the Q value is not only related to the bending moment deviation, but also to the size and material of the resonator itself. Therefore, this embodiment uses the percentage of energy loss as a factor to eliminate the difference in energy loss caused by the difference in the resonator itself.

[0086] As an example, when n is a positive integer and the quality factor is Q0, the pressure on the resonator is 5 kg. When n=1, the pressure on the resonator group is 10 kg; when n=2, the pressure on the resonator group is 15 kg; when n=3, the pressure on the resonator group is 20 kg; and so on.

[0087] Example 7: In this example, the method for obtaining the preset maximum bending moment deviation threshold includes:

[0088] S100, Obtain the fourth relationship curve between the quality factor and thickness of a single resonator;

[0089] S200. The maximum bending moment deviation threshold is obtained based on the preset minimum quality factor, the fourth relationship curve, and the second relationship curve.

[0090] In the specific implementation process, this embodiment selects the preset maximum bending moment deviation threshold according to the specific value of energy loss, so as to avoid the problem that the overall energy loss of the sensor cannot be directly reflected when the energy loss is characterized by the percentage of Q value in the second relationship curve. Therefore, this embodiment further limits the method of obtaining the maximum bending moment deviation threshold.

[0091] The quality factor of resonators of different thicknesses can be obtained from the fourth relationship curve, given a fixed length and width. The percentage by which the quality factor can be reduced can be determined based on the preset minimum quality factor. Then, the corresponding bending moment deviation can be obtained from the second relationship curve, and this bending moment deviation is used as the maximum bending moment deviation threshold.

[0092] Example 8: A resonator vibration system includes a microprocessor and a memory interconnected, the microprocessor being programmed or configured to execute the resonator vibration method described above.

[0093] The above are merely preferred embodiments of the present invention and are not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for enhancing the vibration of a resonator using the standing wave effect, characterized in that, include: Several groups of resonators, each group of resonators including: two resonators arranged opposite each other; the centers of each group of resonators coincide; each resonator moves synchronously away from or towards the center when vibrating; The force on the resonator is directed along its length; the vibration direction of the resonator is directed along its thickness. After applying pressure to the resonator group along the length of the resonator, a first relationship curve between the pressure and the bending moment deviation between each resonator is obtained; Obtain the second relationship curve between bending moment deviation and energy loss; The stress range of the resonant plate group is obtained based on the first and second relationship curves. In the resonator vibration method, the magnitude of the force on the resonator satisfies the stated force range; With the center of the end face of the quartz fixing block as a reference, several resonant plates are arranged in a ring and vertically fixed between two quartz fixing blocks and connected to the quartz fixing blocks; the quartz fixing blocks are provided with electrode lead plates, and the inner and outer sides of the resonant plates are provided with electrode plates, and the two electrode plates on the same resonant plate are connected to different electrode lead plates.

2. The resonator vibration method according to claim 1, characterized in that, The bending moment deviation is obtained by acquiring the bending moment of each resonator. Methods for detecting the bending moment of a resonator include: After applying pressure to the resonator assembly along the length of the resonator, the output voltage across the resonator is obtained; Under the same pressure, the maximum difference in output voltage between each resonator is obtained, and thus the relationship between pressure and the maximum difference in output voltage is obtained; the bending moment deviation is characterized by the maximum difference in output voltage.

3. The resonator vibration method according to claim 2, characterized in that, Bending moment deviation = 100% × maximum difference in output voltage / average value of output voltage.

4. The method for resonator vibration according to any one of claims 1-3, characterized in that, Resonator vibration methods include: Under maximum design pressure, obtain the third relationship curve between the thickness of the resonator and the bending moment deviation; The minimum value of the resonator thickness is obtained based on the preset maximum bending moment deviation threshold and the third relationship curve.

5. The resonator vibration method according to claim 4, characterized in that, In the second relationship curve, energy loss = 100% × (Q0 - Q) n ) / Q0; Q0 is the quality factor of the resonator when it is initially compressed; Q n This refers to the quality factor of the resonator after the pressure on the resonator increases.

6. The resonator vibration method according to claim 5, characterized in that, The methods for obtaining the preset maximum bending moment deviation threshold include: S100, Obtain the fourth relationship curve between the quality factor and thickness of a single resonator; S200. The maximum bending moment deviation threshold is obtained based on the preset minimum quality factor, the fourth relationship curve, and the second relationship curve.

7. A resonator oscillation system, comprising a microprocessor and a memory interconnected, characterized in that, The microprocessor is programmed or configured to perform the resonator vibration method according to any one of claims 1-6.

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