Camera module assembly mechanism and method

Abstract

The invention discloses a camera module assembly mechanism and method.The camera module assembly mechanism comprises a carrier plate, a lens, a sensor, an adhesive layer and an adhesive tape, the carrier plate is provided with a carrying hole, the adhesive tape is connected to the bottom of the carrier plate and covers the bottom of the carrying hole, the lens can be embedded in the carrying hole in an inverted mode, and the sensor is arranged in the carrying hole. The bottom of the inverted lens is bonded with an adhesive tape, the sensor is inverted, and the bottom end of the inverted sensor is fixedly connected to the top end of the inverted lens through an adhesive layer. According to the camera module assembling mechanism, the lens is fixed in advance, the sensor and the lens are connected in an inverted mode, the sensor and the lens can be conveniently positioned and fixed in a sensor moving mode, the sensor is low in grabbing difficulty, the problems of slipping and the like are not prone to occurring in the moving process, the quality of a finished camera module can be improved, and the production efficiency is improved. And in the assembling process, the sensor is not easy to deviate on the lens, so that the quality of the finished camera module is further effectively improved.

Description

Technical Field

[0001] This invention relates to the field of camera module processing, and in particular to a camera module assembly mechanism and method. Background Technology

[0002] Miniature camera modules are often used in many products in the medical and industrial fields, such as endoscopes, robots, or pinhole cameras.

[0003] Miniature cameras typically consist of a sensor and a lens, with the lens attached to the sensor. Currently, the common method for assembling a lens and sensor involves first fixing the sensor in place, then using a robotic arm or similar device to grasp the lens and attach it to the sensor.

[0004] However, the lenses in miniature cameras are mostly made of glass, which has a smooth surface. This makes it difficult to move and position the camera on the sensor after it is grasped. It is easy for the lens to slip or scratch during movement. Once the lens is damaged, it is difficult to repair and will greatly affect the operation of the miniature camera.

[0005] On the other hand, the assembly of the lens and sensor is often achieved by adhesive bonding, and the excess adhesive is often removed by vacuum suction. However, in actual adhesive suction operation, it was found that because the lens is generally thicker than the sensor and has a higher center of gravity, it is difficult to match the negative pressure airflow of the vacuum pump during vacuum suction. The lens is prone to wobbling during suction, and the bonding position of the lens and sensor may shift due to the large vacuum suction airflow, affecting the yield of the finished miniature camera. Summary of the Invention

[0006] The purpose of this invention is to provide a camera module assembly mechanism and method that can solve one or more of the above-mentioned problems.

[0007] According to one aspect of the present invention, a camera module assembly mechanism is provided, comprising a carrier plate, a lens, a sensor, an adhesive layer, and adhesive tape. The carrier plate has loading holes, and the tape is attached to the bottom of the carrier plate and covers the bottom of the loading holes. The lens can be inverted and mounted on the loading hole, with the bottom of the inverted lens adhered to the adhesive tape. The sensor is inverted, and the bottom end of the inverted sensor is fixedly connected to the top end of the inverted lens by an adhesive layer.

[0008] The beneficial effects of this camera module assembly mechanism are as follows: In this camera module assembly mechanism, the loading hole can be used for lens positioning and fixation, while the sensor and lens are connected in an inverted manner, which facilitates the positioning and fixation of the sensor and lens by moving the sensor. The sensor is easy to grasp and is less prone to slippage during movement, which can improve the quality of the finished camera module. At the same time, the lens is embedded in the loading hole and bonded with adhesive tape, so that the lens can be fixed first and the sensor can be fixed. The sensor thickness is smaller than the lens, the center of gravity is lower, and the lens fixation reliability is high. During its assembly, the sensor is less likely to shift on the lens, which further effectively improves the quality of the finished camera module.

[0009] In some embodiments, the carrier plate has a clearance hole on the side of the loading hole, and the clearance hole is connected to the loading hole. The clearance hole can be used to prevent the corners of the lens from being exposed to air, reducing the probability of damage to the lens when mounted on the carrier plate.

[0010] In some embodiments, the carrier plate is provided with mounting holes. The mounting holes facilitate the mounting of the carrier plate to external devices such as racks.

[0011] In some embodiments, the sensor thickness is no greater than 0.2 mm. By limiting the sensor thickness, the sensor's center of gravity is lowered, thereby reducing the probability of the sensor shifting during the adhesive application process.

[0012] In some embodiments, there are multiple objects, lenses, sensors, and adhesive layers. The multiple lenses are inverted and respectively embedded in the multiple objects, and the multiple sensors are inverted and respectively fixedly connected to the top of the multiple inverted lenses by multiple adhesive layers.

[0013] According to one aspect of the present invention, a method for assembling a camera module is provided, comprising the following steps: Take the carrier plate, the bottom of which is connected to adhesive tape. Insert the lens upside down into the loading hole, so that the lens is fixedly embedded in the loading hole of the carrier plate in an upside-down position and adhered to the adhesive tape. Apply adhesive to the top of the inverted lens. Grasp the sensor and invert it, placing the bottom end of the inverted sensor on the top end of the lens fixed to the loading hole, so that the sensor is glued to the top end of the inverted lens. Excess adhesive between the lens and the sensor is removed by airflow. The adhesive between the lens and the sensor is cured to form an adhesive layer.

[0014] The beneficial effects of this camera module assembly method are as follows: In this camera module assembly method, the inverted lens is fixed first, and then the inverted sensor is fixed to the lens for bonding. It moves and positions the sensor on the lens by gripping it. Compared with the traditional lens gripping method, the gripping difficulty is low, the movement is less prone to slippage, and the movement stability and reliability are high. Moreover, the excess glue can be effectively removed by airflow to avoid excess glue residue. Furthermore, since the sensor is set on the fixed lens, the sensor thickness is small and the center of gravity is low, which can effectively reduce the probability of swaying and displacement during the glue suction process.

[0015] In some implementations, the dispensing of the lens and the placement of the sensor at the top of the lens are both determined using CCD vision positioning. CCD vision positioning improves the accuracy of the dispensing position and the connection position between the sensor and the lens, thereby ensuring the quality of the finished camera module.

[0016] In some implementations, the adhesive is cured by irradiation with a UV lamp. Curing adhesive by light irradiation is a simple and reliable process.

[0017] In some embodiments, the camera module assembly method further includes removing the bonded lens and sensor together from the loading hole, and then flipping the bonded lens and sensor together. Flipping the bonded lens and sensor together, i.e., inverting the whole assembly, facilitates subsequent handling or processing of the camera module. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a camera module assembly mechanism according to one embodiment of the present invention.

[0019] Figure 2 for Figure 1 An enlarged view of part A.

[0020] Figure 3 This is a schematic diagram of the carrier plate of a camera module assembly mechanism according to one embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of a camera module assembly method according to one embodiment of the present invention.

[0022] In the diagram: 1. Carrier plate, 2. Lens, 3. Sensor, 4. Adhesive layer, 5. Tape, 11. Loading hole, 12. Clearing hole, 13. Mounting hole. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings.

[0024] Example 1 refer to Figure 1 , Figure 2 and Figure 3 The present invention provides a camera module assembly mechanism, comprising a carrier plate 1, a lens 2, a sensor 3, an adhesive layer 4, and an adhesive tape 5.

[0025] The carrier plate 1 is provided with loading holes 11, and there can be multiple loading holes 11.

[0026] The bottom of the carrier plate 1 is fixedly adhered with tape 5, and the tape 5 covers the bottom of the loading hole 11.

[0027] There are also multiple lenses 2, the number of which is equivalent to that of the loading holes 11. Multiple lenses 2 are respectively inverted and embedded in multiple loading holes 11, and the bottom of the inverted lenses 2 can be slightly glued to the tape 5, so that multiple lenses 2 are fixed on the carrier plate 1.

[0028] There are also multiple sensors 3 and adhesive layers 4, and the number of sensors 3 and adhesive layers 4 is comparable to that of lens 2. The thickness of sensor 3 is preferably no more than 0.2 mm.

[0029] Sensor 3 is also inverted, and the bottom of the inverted sensor 3 is fixedly connected to the top of the inverted lenses 2 one by one by multiple adhesive layers 4.

[0030] The carrier plate 1 has a clearance hole 12 on the side of the loading hole 11. The clearance hole 12 is connected to the loading hole 11, and each loading hole 11 can be connected to multiple clearance holes 12. After the lens 2 is embedded in the loading hole 11, the lens 2 cannot cover the clearance hole 12. The clearance hole 12 can avoid the corners of the lens 2 when the lens 2 is set on the carrier plate 1.

[0031] The carrier plate 1 is also provided with mounting holes 13, which can be used for the installation of bolts and other connecting parts, making it convenient for the carrier plate 1 to be installed on fixed equipment such as a frame.

[0032] Example 2 refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The present invention provides a method for assembling a camera module, comprising the following steps: Take a carrier plate 1. The carrier plate 1 has a loading hole 11. Adhesive tape 5 is fixedly glued to the bottom of the carrier plate 1. The adhesive tape 5 will cover the bottom of the loading hole 11 on the carrier plate 1. Use a clamp to hold the lens 2. The lens 2 is inserted into the loading hole 11 of the carrier plate 1 in an inverted position through the clamp, so that the lens 2 is fixedly embedded in the loading hole 11 of the carrier plate 1 in an inverted position. At this time, the bottom of the lens 2 can be glued to the adhesive tape 5.

[0033] Adhesive is applied to the top of the inverted lens 2 using a dispensing machine, and the dispensing position on the top of the lens 2 can be located by CCD vision to ensure the accuracy of the dispensing position.

[0034] The sensor 3 is grasped by a gripping device such as a robotic arm and then inverted. The bottom of the inverted sensor 3 is placed on the top of the lens 2 fixed to the carrier plate 1. At this time, the sensor 3 can be glued to the top of the inverted lens 2, and the placement position of the sensor 3 on the top of the lens 2 can be positioned by CCD vision. Preferably, the sensor 3 is grasped by a mechanical gripping device of a packaging device with CCD vision positioning to ensure the accuracy of the connection position between the sensor 3 and the lens 2.

[0035] Use a vacuum nozzle to generate airflow to remove excess adhesive between lens 2 and sensor 3.

[0036] Ultraviolet light is used to generate ultraviolet light to cure the adhesive between lens 2 and sensor 3 to form an adhesive layer 4.

[0037] Use a clamp to remove the glued lens 2 and sensor 3 together from the loading hole 11, and separate the lens 2 from the adhesive tape 5. Then flip the glued lens 2 and sensor 3 together to obtain the camera module.

[0038] The above descriptions are merely some embodiments of the present invention. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A camera module assembly mechanism, characterized in that, Includes carrier board, lens, sensor, adhesive layer and tape. The carrier plate is provided with loading holes. The tape is attached to the bottom of the carrier plate and covers the bottom of the loading hole. The lens can be inverted and mounted on the loading hole, with the bottom of the inverted lens adhered to the adhesive tape. The sensor is inverted, and the bottom end of the inverted sensor is fixedly connected to the top end of the inverted lens by an adhesive layer.

2. The camera module assembly mechanism according to claim 1, characterized in that, The carrier plate has a clearance hole on the side of the loading hole, and the clearance hole is connected to the loading hole.

3. The camera module assembly mechanism according to claim 1, characterized in that, The carrier plate is provided with mounting holes.

4. The camera module assembly mechanism according to claim 1, characterized in that, The thickness of the sensor is no greater than 0.2 mm.

5. A camera module assembly mechanism according to claim 1, characterized in that, The object-carrying hole, lens, sensor, and adhesive layer are multiple. The multiple lenses are inverted and respectively embedded in the multiple object-carrying holes. The multiple sensors are inverted and respectively fixedly connected to the top of the multiple inverted lenses by multiple adhesive layers.

6. A method for assembling a camera module, characterized in that, Includes the following steps: Take the carrier plate, the bottom of which is connected to adhesive tape. Insert the lens upside down into the loading hole, so that the lens is fixedly embedded in the loading hole of the carrier plate in an upside-down position and adhered to the adhesive tape. Apply adhesive to the top of the inverted lens. Grasp the sensor and invert it, placing the bottom end of the inverted sensor on the top end of the lens fixed to the loading hole, so that the sensor is glued to the top end of the inverted lens. Excess adhesive between the lens and the sensor is removed by airflow. The adhesive between the lens and the sensor is cured to form an adhesive layer.

7. A camera module assembly mechanism according to claim 6, characterized in that, The dispensing of the lens and the placement of the sensor at the top of the lens are both positioned using CCD vision.

8. A camera module assembly mechanism according to claim 6, characterized in that, The adhesive is cured by exposure to ultraviolet light.

9. A camera module assembly mechanism according to claim 6, characterized in that, The steps also include Remove the glued lens and sensor together from the loading hole, and then flip the glued lens and sensor together.

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