Anti-expansion and anti-shrinkage large-size backlight LED assembly and processing method

Abstract

The invention discloses an anti-expansion and anti-shrinkage large-size backlight LED assembly and a processing method. The anti-expansion and anti-shrinkage large-size backlight LED assembly comprises an LED assembly connected with a light guide plate; wherein the LED assembly comprises a flexible circuit board, LED lamps, cutting lines and anti-tearing circuits, the anti-tearing circuits connected with the LED lamps are arranged on the inner side of the flexible circuit board, and the cutting lines located between every two adjacent LED lamps are arranged on the flexible circuit board so as to release stress of the flexible circuit board; the stress cutting lines located between the LEDs are formed in the proper positions of the flexible circuit board, controllable release channels are provided for internal stress generated by the difference of thermal expansion coefficients of materials, wavy warping or permanent deformation is reduced, and it is ensured that when the stress cutting lines release stress, the stress cutting lines are not prone to being broken when the stress cutting lines release the stress. And the circuit of the flexible circuit board cannot be torn or broken.

Description

Technical Field

[0001] This invention specifically relates to a large-size backlight LED assembly resistant to expansion and contraction and its processing method. Background Technology

[0002] In large-screen display devices such as landscape laptops, to meet the requirements of high brightness and high uniformity, a large number of LEDs are usually arranged along the long side of the light guide plate to form an LED assembly. This assembly is typically fixed to the light guide plate with double-sided adhesive. In these large-screen laptop backlight modules, due to the increased number of LEDs and the concentration of the light source along the long side, and under harsh environmental testing conditions such as high temperature and humidity, and thermal shock, the differences in the coefficients of thermal expansion of the various materials can generate internal stress, easily leading to component deformation. Figure 5 As shown, this causes the flexible circuit board to warp or deform in a wavy shape, which in turn changes the light emission path of the LED, resulting in uneven display brightness and the production of bright and dark stripes and other defects.

[0003] Existing technologies propose using flexible substrates with a thermal expansion coefficient similar to that of the light guide plate, such as using PET substrates coated with copper foil, to fabricate flexible circuit boards in order to reduce the difference in expansion and contraction between materials. However, such materials require special processes such as magnetron sputtering and electroplating to form a copper layer on the PET film, which is complex and requires large equipment investment, resulting in a significant increase in cost and no advantage in terms of mass production economy. Therefore, we propose a large-size backlight LED component with anti-expansion and contraction and its processing method. Summary of the Invention

[0004] The purpose of this invention is to provide a large-size backlight LED assembly and processing method that is resistant to expansion and contraction, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a large-size backlight LED assembly resistant to expansion and contraction, comprising:

[0006] LED assembly, wherein a light guide plate is connected to the LED assembly;

[0007] Double-sided adhesive tape is disposed between the LED assembly and the light guide plate;

[0008] The LED assembly includes a flexible circuit board, LED lights, cutting lines, and tear-resistant lines. Multiple LED lights are evenly distributed along the long side of the flexible circuit board, and the inner side of the flexible circuit board has tear-resistant lines connecting multiple LED lights. Cutting lines are provided on the flexible circuit board between two adjacent LED lights to release stress on the flexible circuit board.

[0009] Preferably, the tear-resistant circuit includes a conductor and an insulating circuit, wherein the insulating circuit is disposed outside the conductor.

[0010] Preferably, the insulating material is at least one of polyamide, polyester fiber, thermoplastic polyurethane elastomer, chlorinated polyolefin, cross-linked polyolefin and polyimide.

[0011] Preferably, multiple cutting lines are evenly distributed along the long side of the flexible circuit board, and the distance between two adjacent cutting lines is 100-150mm.

[0012] Preferably, the overlap width between the flexible circuit board and the light guide plate is H, and the length L of the cutting line is 50%-80% of H.

[0013] Preferably, the double-sided adhesive has different adhesive properties, with the side with stronger adhesive properties used to cooperate with the LED component and the side with weaker adhesive properties used to cooperate with the light guide plate.

[0014] Preferably, the flexible circuit board is rectangular, and the cutting line is formed along the short side of the flexible circuit board.

[0015] A method for processing a large-size backlight LED assembly resistant to expansion and contraction, applied to the LED assembly, characterized in that it further includes the following steps:

[0016] Step A: Provide an LED assembly, which includes a flexible circuit board and a plurality of LED lights disposed thereon;

[0017] Step B: Based on the length of the flexible circuit board, cut at least one stress cutting line along the width direction on it, and the stress cutting line is offset from the LED along the width direction of the flexible circuit board;

[0018] Step C: Fix the LED assembly to the long side of the light guide plate with double-sided adhesive, and the length of the stress cutting line is less than the width of the overlapping area between the LED assembly and the light guide plate;

[0019] Step D: Create a tear-resistant structure around the cutting line and perform optical or electrical testing to ensure that the cutting does not affect the LED light output and circuit function.

[0020] Preferably, in step B, the cutting is performed by at least one of stamping, laser cutting, or mechanical cutting.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] This invention provides a controllable release channel for the internal stress caused by the difference in thermal expansion coefficients of the material by creating stress-cutting lines between LEDs at appropriate locations on the flexible circuit board. This reduces the occurrence of wavy warping or permanent deformation and avoids the high cost problem caused by copper foil on traditional PET substrates. In addition, the addition of anti-tear lines ensures that the stress-cutting lines will not cause tearing or breakage of the flexible circuit board lines when releasing stress, thus maintaining the integrity of the circuit function and long-term reliability. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a schematic diagram of the exploded structure of the present invention;

[0025] Figure 3 This is a schematic diagram of the cutting line structure of the present invention;

[0026] Figure 4 This is a schematic diagram of the overlapping area between the flexible circuit board and the light guide plate of the present invention;

[0027] Figure 5 This is a schematic diagram of the deformation of an existing LED component.

[0028] In the diagram: 1. Light guide plate; 2. LED assembly; 21. Flexible circuit board; 22. LED light; 23. Cutting line; 24. Tear-resistant circuit; 3. Double-sided adhesive; 4. Overlapping area. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figures 1-5 This invention provides a technical solution: a large-size backlight LED assembly resistant to expansion and contraction, comprising:

[0031] LED component 2, with light guide plate 1 connected to LED component 2;

[0032] Double-sided adhesive tape 3 is placed between LED component 2 and light guide plate 1;

[0033] The double-sided adhesive 3 facilitates the quick connection and fixation of the LED component 2 and the light guide plate 1. During stress release, the weak adhesive strength allows for slight slippage between the LED component 2 and the light guide plate 1, resulting in better stress release and reducing the wavy warping of the LED component 2.

[0034] The LED component 2 includes a flexible circuit board 21, LED lights 22, cutting lines 23 and tear-resistant lines 24. Multiple LED lights 22 are evenly distributed along the long side of the flexible circuit board 21, and the inner side of the flexible circuit board 21 has tear-resistant lines 24 connecting multiple LED lights 22. Cutting lines 23 are provided on the flexible circuit board 21 between two adjacent LED lights 22 to release stress on the flexible circuit board 21.

[0035] The cutting line 23 can effectively guide the internal stress caused by the difference in thermal expansion coefficients between the flexible circuit board 21 and the light guide plate 1, preventing the overall component from warping and deforming; the anti-tear line 24 ensures that the circuit does not break or get damaged during the stress release process, maintaining the reliability of the electrical connection, thereby solving the problem of uneven display at the structural level.

[0036] Preferably, the tear-resistant line 24 includes a conductor and an insulated line, with the insulated line disposed outside the conductor;

[0037] Insulation lines may cover the outer surface of the conductor or be arranged around the conductor to improve the tear resistance at the cut line 23.

[0038] Preferably, the insulating material is at least one of polyamide, polyester fiber, thermoplastic polyurethane elastomer, chlorinated polyolefin, cross-linked polyolefin and polyimide;

[0039] It possesses excellent flexibility, insulation, and thermal stability, allowing for the selection of the most suitable material based on the actual usage environment.

[0040] Preferably, multiple cutting lines 23 are evenly distributed along the long side of the flexible circuit board 21, and the distance between two adjacent cutting lines 23 is 100-150mm;

[0041] The distribution of stress relief points is uniform and reasonable. This spacing range can avoid the overall rigidity reduction caused by excessively dense cutting points, and also prevent local stress accumulation caused by excessively large spacing, thereby optimizing the deformation resistance of the entire backlight area.

[0042] Preferably, the width of the overlap area 4 between the flexible circuit board 21 and the light guide plate 1 is H, and the length L of the cutting line 23 is 50%-80% of H;

[0043] This ratio ensures sufficient stress relief openings while maintaining adequate bonding area, preventing components from detaching from or shifting from the light guide plate 1 due to excessively long openings.

[0044] Preferably, the double-sided adhesive 3 is a double-sided adhesive with different adhesive properties, and the side with strong adhesiveness is used to cooperate with the LED component 2, while the side with weak adhesiveness is used to cooperate with the light guide plate 1.

[0045] The strong adhesive side ensures that the LED component 2 is firmly attached, while the weak adhesive side allows for micro-slippage between the light guide plate 1 and the flexible circuit board 21 when the temperature changes, further absorbing the difference in expansion and contraction, reducing the interface shear stress, and protecting the surface of the light guide plate 1 from being damaged by the adhesive layer.

[0046] Preferably, the flexible circuit board 21 is rectangular, and the cutting line 23 is opened along the short side of the flexible circuit board 21;

[0047] By following the main direction of material expansion and contraction, the stress release path becomes more direct and efficient, while avoiding interference with circuit traces along the long side, resulting in a more reasonable layout.

[0048] A method for processing a large-size backlight LED component resistant to expansion and contraction, applied to LED components, further includes the following steps:

[0049] Step A: Provide LED assembly 2, which includes a flexible circuit board 21 and a plurality of LED lights 22 disposed thereon;

[0050] Step B: Based on the length of the flexible circuit board 21, cut at least one stress cutting line 23 along the width direction on it, and the stress cutting line 23 is offset from the LED along the width direction of the flexible circuit board 21.

[0051] Step C: Fix the LED component 2 to the long side of the light guide plate 1 with double-sided adhesive 3, and the length of the stress cutting line 23 is less than the width of the overlapping area between the LED component 2 and the light guide plate 1.

[0052] Step D: Create a tear-resistant structure around the cutting line 23 and perform optical or electrical testing to ensure that the cutting does not affect the LED light output and circuit function;

[0053] By using a process of cutting and then bonding, the stress-relieving structure is prefabricated before assembly, which improves production consistency and yield.

[0054] Preferably, in step B, the cutting is performed by at least one of stamping, laser cutting, or mechanical cutting.

[0055] With good process compatibility and selection flexibility, laser cutting is especially suitable for high-precision, non-contact processing, avoiding mechanical damage to flexible circuit boards 21, and is suitable for the processing of circuit boards with high-density LED layouts.

[0056] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A large-size backlight LED assembly resistant to expansion and contraction, characterized in that, include: LED assembly (2), on which a light guide plate (1) is connected; Double-sided adhesive tape (3) is placed between the LED assembly (2) and the light guide plate (1); The LED assembly (2) includes a flexible circuit board (21), LED lights (22), cutting lines (23) and tear-resistant lines (24). Multiple LED lights (22) are evenly distributed along the long side of the flexible circuit board (21), and the inner side of the flexible circuit board (21) has tear-resistant lines (24) connecting multiple LED lights (22). Cutting lines (23) are provided on the flexible circuit board (21) between two adjacent LED lights (22) to release stress on the flexible circuit board (21).

2. The anti-expansion and anti-shrinkage large-size backlight LED assembly according to claim 1, characterized in that: The tear-resistant line (24) includes a conductor and an insulating line, wherein the insulating line is disposed outside the conductor.

3. A large-size backlight LED assembly with anti-expansion and anti-shrinkage properties according to claim 2, characterized in that: The insulating material is at least one of polyamide, polyester fiber, thermoplastic polyurethane elastomer, chlorinated polyolefin, cross-linked polyolefin and polyimide.

4. A large-size backlight LED assembly with anti-expansion and anti-shrinkage properties according to claim 1, characterized in that: The cutting lines (23) are evenly distributed along the long side of the flexible circuit board (21), and the distance between two adjacent cutting lines (23) is 100-150mm.

5. A large-size backlight LED assembly with anti-expansion and anti-shrinkage properties according to claim 1, characterized in that: The width of the overlap area (4) between the flexible circuit board (21) and the light guide plate (1) is H, and the length L of the cutting line (23) is 50%-80% of H.

6. A large-size backlight LED assembly with anti-expansion and anti-shrinkage properties according to claim 1, characterized in that: The double-sided adhesive (3) has different adhesive properties, with the side with strong adhesive properties used to cooperate with the LED assembly (2) and the side with weak adhesive properties used to cooperate with the light guide plate (1).

7. A large-size backlight LED assembly with anti-expansion and anti-shrinkage properties according to claim 1, characterized in that: The flexible circuit board (21) is rectangular, and the cutting line (23) is opened along the short side of the flexible circuit board (21).

8. A method for processing a large-size backlight LED component resistant to expansion and contraction, applied to the LED component according to any one of claims 1-6, characterized in that, It also includes the following steps: Step A: Provide an LED assembly (2), which includes a flexible circuit board (21) and a plurality of LED lights (22) disposed thereon; Step B: Based on the length of the flexible circuit board (21), cut at least one stress cutting line (23) along the width direction on it, and the stress cutting line (23) is offset from the LED along the width direction of the flexible circuit board (21); Step C: Fix the LED component (2) to the long side of the light guide plate (1) with double-sided tape (3), and the length of the stress cutting line (23) is less than the width of the overlapping area between the LED component (2) and the light guide plate (1); Step D: Create a tear-resistant structure around the cutting line (23) and perform optical or electrical testing to ensure that the cutting does not affect the LED light output and circuit function.

9. A method for processing a large-size backlight LED assembly (2) resistant to expansion and contraction according to claim 8, characterized in that: In step B, the cutting process is carried out by at least one of stamping, laser cutting, or mechanical cutting.

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