Manufacturing method of integrated circuit partition control power supply embedded copper block circuit board

Abstract

The invention relates to a manufacturing method of an integrated circuit partition control power supply embedded copper block circuit board, which comprises the following steps of: forming an integrated copper block constructed by bottom copper and a special-shaped copper block through one-time depth control milling in the previous procedure, and manufacturing a windowing core plate and carrying out primary embedding forming on the windowing core plate and the integrated copper block; the problems of deformation and liquid medicine permeation caused by thickness difference are avoided through the thickness balance effect of a first single-face windowing copper-clad plate and a second single-face windowing copper-clad plate and the isolation protection function of a first windowing release film and a second windowing release film in the second multi-layer structure stacking and laminating processing in the middle procedure; and finally, an auxiliary structure is precisely removed through laser depth-controlled milling, the position precision of the irregular special-shaped copper block is guaranteed in the whole process, the problems of deflection, deviation and the like are thoroughly avoided, the functions of the special-shaped copper block in various and multiple integrated circuit partition packaging control application, efficient heat dissipation, large current bearing, high-voltage adaptation and the like can be fully played, and the production efficiency is improved. And high-precision processing and application of the partition control high-heat-dissipation circuit board are realized.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, and in particular to a method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board. Background Technology

[0002] As intelligent connected vehicles, low-altitude aircraft, and other products become increasingly intelligent, their complex power control modules are also evolving towards more intelligent integrated management models based on integrated circuits and chips. Given the requirements of factors such as installation space, heat dissipation efficiency, and intelligent capabilities, refined or zoned management of power modules has become a technological trend. This necessitates reasonable control of the power supply to achieve effective control of current and voltage. As a key component for energy conversion and distribution, the power control module must also ensure that the large amount of heat generated by chips and integrated circuits during operation is dissipated in a timely manner, preventing issues such as performance degradation, response delays, circuit overheating damage, and safety hazards.

[0003] In existing technologies, circuit board designs with embedded copper blocks are typically used to achieve heat dissipation. However, traditional embedded copper blocks are merely heat dissipation carriers and are not effectively integrated with the circuit pattern. This makes it difficult to meet the precise control requirements of high current and high voltage, and fails to fully utilize the dual characteristics of copper block in terms of conductivity and heat dissipation.

[0004] To increase the "working depth" of embedded copper blocks in circuit boards, innovative designs have emerged that integrate embedded copper blocks as part of the circuit pattern. This not only meets heat dissipation requirements but also enables high-density interconnection with chips and integrated circuits. This achieves both heat dissipation and interconnection functions while reducing the overall design area of ​​the circuit board and increasing the circuit density. Such designs generally use irregularly shaped embedded copper blocks instead of traditional simple convex geometric shapes (i.e., embedded copper block designs with non-simple convex geometric shapes appear).

[0005] During the lamination process, the insulating dielectric layer of this embedded irregular copper block will experience adhesive flow. The extrusion pressure generated by the adhesive flow can easily act on the irregular contour of the irregular copper block, causing problems such as skewing, displacement, and deformation of the copper block, which seriously affects the circuit accuracy and structural stability of the circuit board.

[0006] Based on the above background and problems, there is a need to provide a novel method for manufacturing a power supply embedded copper block circuit board with integrated circuit partition control function. Summary of the Invention

[0007] This invention aims to solve the comprehensive problems of poor processing accuracy of high-heat-dissipation embedded copper block circuit boards in existing power control modules, and provides a method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board. The circuit board is processed using a panelization method according to design data. The panelization includes forming lines, with the area within the forming lines being the effective area and the other areas being the tool area. The manufacturing method includes the following steps:

[0008] S10: Take a copper block, perform controlled-depth milling on the copper block according to the design data, and retain a bottom copper layer to form an integrated copper block composed of several independent irregular copper blocks combined on the bottom copper.

[0009] S20: According to the design data, a window core board is made to open the window corresponding to the bottom copper; the integrated copper block and the window core board are stacked accordingly, and the first pressing is performed to form the first pressing board;

[0010] S30: An adhesive layer is made on the side of the first laminated plate that is not the bottom copper; copper foil is taken, cut to the size corresponding to the bottom copper to form a protective copper layer, and attached to the adhesive layer to form a protective plate.

[0011] S40: Take two single-sided copper-clad laminates and make a first window corresponding to the bottom copper to form a first single-sided windowed copper-clad laminate and a second single-sided windowed copper-clad laminate; take two release films and make a second window corresponding to the bottom copper to form a first windowed release film and a second windowed release film; stack the first single-sided windowed copper-clad laminate, the first windowed release film, the protective plate, the second windowed release film and the second single-sided windowed copper-clad laminate from top to bottom, and perform a second pressing to form a pressed plate;

[0012] S50: The laminated board is laser-controlled deep milling to remove the first single-sided open copper-clad laminate, the first open release film, the second open release film and the second single-sided open copper-clad laminate. Then, the adhesive layer is removed by plasma. After that, the whole board is electroplated and the surface circuit pattern is made. After subsequent processing, the whole board is formed into the circuit board.

[0013] Furthermore, one side of the first windowed release film is smaller than that of the first single-sided windowed copper-clad laminate; one side of the second windowed release film is smaller than that of the second single-sided windowed copper-clad laminate.

[0014] Furthermore, the adjacent irregularly shaped copper blocks of the integrated copper block are staggered, and connection positions are made at the staggered positions; the connection positions are for retaining the copper of the copper block during the controlled depth milling.

[0015] Furthermore, forming the circuit board includes: after plasma removal of the adhesive layer, drilling through holes at the connection positions and sealing the holes with resin, then electroplating the entire board, fabricating surface circuit patterns, and performing subsequent processing steps to form the circuit board.

[0016] Furthermore, the edge of the bottom copper extends outward to form an extension area; the window core board is made by creating a window corresponding to the bottom copper excluding the extension area according to the design data, thus forming the window core board.

[0017] Furthermore, the size of the windowed core board is pre-larger on one side relative to the size of the panel; the coverage range of the first and second windowed release films when stacked is from the edge of the bottom copper to the edge of the panel; the windows of the first single-sided windowed copper-clad laminate and the second single-sided windowed copper-clad laminate are windows corresponding to the bottom copper except for the extended area.

[0018] Furthermore, the first pressing is performed using a rapid pressing method; the rapid pressing is performed by pressing for 60 to 180 seconds at a temperature of 160°C to 180°C and a pressure of 20 kg / cm² to 35 kg / cm².

[0019] Furthermore, the milling position of the laser-controlled depth milling corresponds to the edge of the bottom copper; the milling depth of the laser-controlled depth milling is: the depth from the first single-sided open-window copper clad laminate to the first open-window release film, and the depth from the second single-sided open-window copper clad laminate to the second open-window release film.

[0020] Furthermore, both the first and second windowed release films are adhesive tapes, with the adhesive side of the tape facing the first or second single-sided windowed copper-clad laminate.

[0021] Furthermore, forming the circuit board includes removing the adhesive layer with plasma to form an adhesive removal plate, and then polishing the adhesive removal plate.

[0022] This technical solution, based on the integrated circuit partition control chip and integrated circuit operation and heat dissipation requirements, forms a novel power supply copper-embedded circuit board with embedded irregular copper blocks. The main beneficial effects include the following:

[0023] (1) By controlling the depth of milling, the whole copper block is precisely milled into several independent irregular copper blocks. At the same time, the bottom copper is used to integrate them into an integrated copper block, providing a stable overall processing foundation for the subsequent one-time embedding of copper blocks. The supporting structure formed by the bottom copper can effectively resist the squeezing force of the insulating medium laminar adhesive during pressing, thereby avoiding the skewness and deformation of the irregular copper blocks. Furthermore, the connection position is reserved at the intersection of adjacent irregular copper blocks to form a continuous whole, which strengthens the structural stability of the irregular shape of the irregular copper block during the pressing process. In the subsequent process, the connection position is removed by drilling and the through hole is filled by resin plugging process. This can restore the independent design shape of the irregular copper block and avoid the seepage of chemicals in the subsequent processing, which significantly improves the processing accuracy and structural integrity of the irregular shape.

[0024] (2) In the lamination process, through the collaborative design of the first single-sided open copper clad laminate, the first open release film, the second open release film and the second single-sided open copper clad laminate, the non-open area can balance the height difference formed by the thickness of the bottom copper, effectively preventing the bottom copper layer from sinking into the open core board during lamination, avoiding vertical deformation of the board and displacement of the copper block; furthermore, the coverage range of the first open release film and the second open release film when stacked is from the edge of the bottom copper to the edge of the panel board, and the openings of the first single-sided open copper clad laminate and the second single-sided open copper clad laminate are the openings of the bottom copper except for the extended area, forming the effect of wrapping the first open release film and the second open release film in the board body, avoiding the edges of the first open release film and the second open release film being exposed, which is prone to chemical penetration and other risks, and does not affect the core release function of the release film.

[0025] (3) The entire processing flow is interconnected, with each process progressing and supporting each other. The previous process uses the bottom copper and the connecting position to build a temporary fixed whole for the irregular copper block, ensuring the structural stability during the pressing stage. The intermediate process uses the thickness balancing effect of the first single-sided open copper clad laminate and the second single-sided open copper clad laminate, along with the isolation and protection function of the first and second open release films, to avoid deformation and chemical penetration caused by thickness differences. Finally, the first single-sided open copper clad laminate, the second single-sided open copper clad laminate, the first open release film, and the second open release film are precisely removed by laser deep milling.

[0026] (4) It not only ensures the positional accuracy of irregular copper blocks throughout the process and completely avoids problems such as skew and misalignment, but also gives full play to the core functions of irregular copper blocks in terms of high current carrying capacity, high voltage adaptation and efficient heat dissipation, so as to realize the high-precision processing of the high heat dissipation buried copper block circuit board of the power control module. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is a process flow diagram of an embodiment of the present invention;

[0029] Figure 2 This is a cross-sectional schematic diagram of the integrated copper block according to an embodiment of the present invention. Figure 3 (AA section);

[0030] Figure 3 This is a planar schematic diagram of the interleaved integrated copper block according to an embodiment of the present invention;

[0031] Figure 4 for Figure 3 Design data schematic diagram;

[0032] Figure 5 This is a cross-sectional schematic diagram of the windowed core board according to an embodiment of the present invention;

[0033] Figure 6 This is a cross-sectional schematic diagram of the first pressing plate according to an embodiment of the present invention;

[0034] Figure 7 This is a cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention;

[0035] Figure 8 This is a cross-sectional schematic diagram of the pressing plate according to an embodiment of the present invention;

[0036] Figure 9 for Figure 8 Top view;

[0037] Figure 10 This is a cross-sectional schematic diagram of the milled structural plate according to an embodiment of the present invention;

[0038] Figure 11 This is a cross-sectional schematic diagram of the first molding plate according to an embodiment of the present invention;

[0039] Figure 12 This is a plan view of the plugging plate according to an embodiment of the present invention;

[0040] Figure 13 This is a cross-sectional schematic diagram of the embedded copper block circuit board according to an embodiment of the present invention.

[0041] Illustrations and symbols: 100, forming line; 10, integrated copper block; 1010, bottom copper; 1020, irregularly shaped copper block; 1030, extension area; 20, staggered integrated copper block; 2010, connection position; 30, windowed core board; PB, panel edge; 3010, pre-enlarged area; 3020, windowed area; 40, first pressing plate; 200, stacked structure; 50, protective plate; 5010, adhesive layer; 5020, protective copper layer; 60, pressing. Board; 6010, First single-sided windowed copper-clad laminate; 6020, Second single-sided windowed copper-clad laminate; 6030, First windowed release film; 6040, Second windowed release film; 6050, First window; 6060, Second window; 70, Milled structural board; 7010, Laser controlled depth milling line; 7020, Mechanical milling line; 80, First forming board; 80A, Hole-plugging board; 1050, Hole plugging; 90, Circuit board; 9010, Surface-mount circuit pattern.

[0042] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0044] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0045] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0047] To better understand the above technical solution, the following detailed explanation is provided in conjunction with the accompanying drawings.

[0048] Please see Figure 1 , Figure 1 This is a process flow diagram of an embodiment of the present invention.

[0049] This embodiment provides a method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board. During the manufacturing process, the circuit board is processed using a panelization method according to design data. The panelization includes a forming line 100, with the area within the forming line 100 being the effective area and the other areas being the tool area. The manufacturing method follows... Figure 1 The process flow is as follows, and the details are explained below.

[0050] Please see Figure 2 , Figure 2 This is a cross-sectional schematic diagram of the integrated copper block according to an embodiment of the present invention. Figure 3 (AA section).

[0051] Step S10:

[0052] Take a copper block, perform controlled-depth milling on the copper block according to the design data, and retain a layer of bottom copper 1010 to form an integrated copper block 10 composed of several independent irregular copper blocks 1020 combined on the bottom copper 1010; the bottom copper 1010 can be optionally 10μm to 70μm, preferably 25μm, 35μm or 50μm.

[0053] The integral molding of the irregular copper block 1020 is achieved through a precise depth-controlled milling process. Instead of directly milling adjacent irregular copper blocks 1020 into independent finished parts, the scattered irregular copper blocks 1020 are integrated into a stable whole by using the bottom copper 1010.

[0054] On the one hand, the integrated copper block 10 can provide a stable overall processing foundation for the one-time embedding of copper blocks in subsequent processes, eliminating the need for separate positioning and installation of individual irregular copper blocks 1020, significantly reducing positioning errors during processing, simplifying the operation process, making processing more convenient and efficient, and improving the stability of the production process. On the other hand, the fixed and supporting foundation structure formed by the bottom copper 1010 can provide reliable support for the irregular copper block 1020, effectively resisting the lateral extrusion force generated by the lamination adhesive of the insulating medium in the subsequent pressing process, thereby avoiding problems such as skewing and deformation of the irregularly shaped copper block 1020 due to uneven force, ensuring the positional accuracy and structural integrity of the irregular copper block 1020, and laying the foundation for the subsequent performance stability of the circuit board 90.

[0055] Optionally, the edge of the bottom copper 1010 extends outward to form an extension area 1030, which provides a basis for the stability and interlayer bonding force of the subsequent lamination process for embedding the integrated copper block 10.

[0056] Optionally, the extended region 1030 is 30 μm to 100 μm.

[0057] Optionally, the thickness of the base copper 1010 is 30 μm to 50 μm.

[0058] Please see Figure 3 and Figure 4 , Figure 3 This is a planar schematic diagram of the interleaved integrated copper block according to an embodiment of the present invention; Figure 4 for Figure 3 Design data diagram.

[0059] Furthermore, the adjacent irregularly shaped copper blocks 1020 of the integrated copper block 10 are staggered and interleaved, and connection positions 2010 are made at the staggered positions; the connection positions 2010 are copper that is retained during controlled depth milling, and are formed as a whole in the staggered integrated copper blocks 20.

[0060] When milling a copper block to form an independent irregular copper block 1020, the original copper material of the copper block is deliberately preserved at the staggered position without milling, forming the connection position 2010.

[0061] When the embedded copper block is thick and the length-to-width ratio of the irregular copper block 1020 is high, it is more significantly affected by the extrusion pressure of the insulating medium laminar adhesive in the subsequent pressing process. It is very easy to lose structural balance due to uneven stress, resulting in precision deviations such as tilting and displacement. Therefore, by setting the connecting position 2010, the originally scattered and intertwined irregular copper blocks 1020 can be tightly connected in series, forming a coherent and complete whole in structure. This greatly improves the structural integrity and stability of the irregular copper block 1020 in the pressing process, effectively resists the lateral force generated by the adhesive flow, and structurally avoids problems such as tilting or displacement of the irregular copper block 1020, providing a reliable guarantee for the precision control of subsequent processing.

[0062] Please see Figure 5 and Figure 6 , Figure 5 This is a cross-sectional schematic diagram of the windowed core board according to an embodiment of the present invention; Figure 6 A cross-sectional schematic diagram of the first pressing plate according to an embodiment of the present invention.

[0063] Step S20:

[0064] According to the design data, a window core board 30 is made to open the corresponding bottom copper 1010; the integrated copper block 10 and the window core board 30 are stacked in correspondence and pressed together for the first time to form the first pressed board 40.

[0065] The design data is used to precisely manufacture the windowed core board 30, whose windowed area 3020 corresponds precisely to the bottom copper 1010 of the integrated copper block 10, ensuring that the integrated copper block 10 can be accurately embedded in the preset position of the windowed core board 30 when stacked. Then, the integrated copper block 10 and the windowed core board 30 are stacked and then pressed together for the first time, so that the two initially form the first pressed board 40.

[0066] The entire processing step is divided into two pressing steps. First, the integrated copper block 10 and the windowed core board 30 are pressed together for the first time, which can effectively lock the relative position of the integrated copper block 10. Then, the first pressing plate 40 formed by pressing is used in the subsequent pressing. This can effectively avoid the problems of the integrated copper block 10 being displaced or misaligned due to the squeezing of the multi-layer structure or the impact of the insulating medium laminar adhesive when the integrated copper block 10 is used in the one-time stacking and pressing of the multi-layer structure.

[0067] If step S10 extends the bottom copper 1010 to form an extended area 1030, then the windowed core board 30 is made by creating a window in the bottom copper 1010 excluding the extended area 1030 according to the design data, thus forming the windowed core board 30.

[0068] During the subsequent first pressing process, the extended area 1030 can form sufficient contact and pressing area with the non-windowed area 3020 of the windowed core board 30, providing uniform and stable planar support for the integrated copper block 10. The supporting effect can effectively disperse the force during pressing, ensure the position of the integrated copper block 10 during the pressing process, further improve the bonding stability between the integrated copper block 10 and the windowed core board 30, and lay a solid foundation for the precise processing of subsequent processes.

[0069] Furthermore, the size of the window core board 30 is pre-larged on one side relative to the size of the panel, and the edge of the panel PB and the pre-larged edge form a pre-larged area 3010.

[0070] This means that the board size is further enlarged based on the panel. On the one hand, it is equivalent to further increasing the area of ​​the tool area on the basis of the existing tool area of ​​the panel itself, forming a dedicated adhesion area at the edge of the board. The enlarged area 3010 provides the board edge foundation for the mutual adhesion of the first single-sided windowed copper clad laminate 6010, the second single-sided windowed copper clad laminate 6020 and the first lamination board 40, avoiding the use of the original tool area as the adhesion area, and preventing the tool area from occupying too much space and affecting the processing.

[0071] In this embodiment, the first pressing is performed using a rapid pressing method; rapid pressing is performed by pressing for 60 to 180 seconds at a temperature of 160°C to 180°C and a pressure of 20 kg / cm² to 35 kg / cm².

[0072] Using rapid pressing instead of traditional press pressing, the windowed core board 30 and the integrated copper block 10 form a stable preliminary bond rather than a completely firm bond, providing an overall processing foundation for subsequent processing.

[0073] Please see Figure 7 , Figure 7 A cross-sectional schematic diagram of the stacked structure according to an embodiment of the present invention.

[0074] Step S30:

[0075] An adhesive layer 5010 is made on the non-bottom copper 1010 side of the first laminating plate 40; copper foil is taken and cut to the size corresponding to the bottom copper 1010 to form a protective copper layer 5020, which is then attached to the adhesive layer 5010, and the whole plate is formed into a protective plate 50.

[0076] The protective copper layer 5020 ensures that the non-bottom copper side of the first laminating plate 40 has a complete copper layer structure, which meets the requirements of the laminating process for the flatness of the plate surface and the uniformity of force. It avoids the imbalance of force during lamination caused by the lack of copper layer on the plate surface, which may lead to deformation of the plate or displacement of the integrated copper block 10.

[0077] Alternatively, the adhesive layer 5010 can be made by applying the adhesive layer 5010 or by screen printing the adhesive layer 5010.

[0078] Optionally, the thickness of the adhesive layer 5010 is 5 μm to 10 μm.

[0079] Please refer to it again. Figure 7 And see Figure 8 and Figure 9 , Figure 8 A cross-sectional schematic diagram of the pressing plate according to an embodiment of the present invention; Figure 9 for Figure 8 Top view.

[0080] Step S40:

[0081] Two single-sided copper-clad laminates are taken, and a first window 6050 is made corresponding to the bottom copper 1010, forming a first single-sided windowed copper-clad laminate 6010 and a second single-sided windowed copper-clad laminate 6020 respectively; two release films are taken, and a second window 6060 is made corresponding to the bottom copper 1010, forming a first windowed release film 6030 and a second windowed release film 6040 respectively; the first single-sided windowed copper-clad laminate 6010, the first windowed release film 6030, the protective plate 50, the second windowed release film 6040 and the second single-sided windowed copper-clad laminate 6020 are stacked from top to bottom to form a stacked structure 200, and then a second pressing is performed to form a press-fit plate 60.

[0082] Since the base copper 1010 has a thickness of 30μm to 50μm, if it is directly laminated, the base copper 1010 is prone to sinking into the surface of the windowed core board 30, causing the board to deform in the lamination direction. This, in turn, causes the embedded irregular copper block 1020 to tilt and deform. The arrangement of the first single-sided windowed copper clad laminate 6010 and the second single-sided windowed copper clad laminate 6020 can form a thickness balance structure. The windowed area 3020 corresponds precisely to the base copper 1010, while the non-windowed area fills the height difference caused by the thickness of the base copper 1010, effectively improving the flatness of the board surface during lamination. It also constrains the displacement of the base copper 1010 in the vertical direction, effectively avoiding problems such as sinking of the base copper 1010 or deformation of the irregular copper block 1020.

[0083] The first windowed release film 6030 and the second windowed release film 6040 are respectively bonded between the first single-sided windowed copper clad laminate 6010 and the second single-sided windowed copper clad laminate 6020 and the protective plate 50, providing processing conditions for the smooth peeling of the first single-sided windowed copper clad laminate 6010 and the second single-sided windowed copper clad laminate 6020.

[0084] At the same time, combined with the adhesive layer 5010 and the protective copper layer 5020 in step S30, the multi-layer structure provides all-round constraint and protection for the irregular copper block 1020 from both the top and bottom, so that the dispersed irregular copper block 1020 forms a more stable whole in terms of structure, preventing the irregular copper block 1020 from tilting or shifting, and laying a solid structural foundation for the precise processing of subsequent processes.

[0085] Optionally, the copper thickness of the first single-sided windowed copper clad laminate 6010 and the second single-sided windowed copper clad laminate 6020 are both 5 μm to 8 μm.

[0086] Optionally, the size of the second window 6060 corresponds to the area of ​​the irregular copper block 1020, and the edge of the second window 6060 just presses against the extension area 1030 of the bottom copper 1010. During the second pressing process, an effective buffer space can be formed to buffer the pressing force and the impact of the adhesive flow of the insulating dielectric layer, so that the first window release film 6030, the second window release film 6040 and the extension area 1030 of the bottom copper 1010 are effectively bonded. After pressing, an integral structure is formed, which enhances the structural integrity and stability of the press plate 60.

[0087] Furthermore, the first windowed release film 6030 has a smaller side than the first single-sided windowed copper clad laminate 6010; the second windowed release film 6040 has a smaller side than the second single-sided windowed copper clad laminate 6020.

[0088] That is, the non-windowed area of ​​the first windowed release film 6030 extends outward beyond the edge of the first single-sided windowed copper clad laminate 6010, forming a structure that covers and extends the edge size of the first single-sided windowed copper clad laminate 6010. The purpose is to enhance the release effect and ensure the smooth peeling of the first single-sided windowed copper clad laminate 6010 in the future.

[0089] Optionally, both the first window release film 6030 and the second window release film 6040 are adhesive tapes, with the adhesive side of the tape facing the first single-sided windowed copper clad laminate 6010 or the second single-sided windowed copper clad laminate 6020.

[0090] The coverage area of ​​the first windowed release film 6030 and the second windowed release film 6040 when stacked is from the edge of the bottom copper 1010 to the edge PB of the panel; the windows of the first single-sided windowed copper clad laminate 6010 and the second single-sided windowed copper clad laminate 6020 are the windows of the bottom copper 1010 except for the extension area 1030.

[0091] This creates an effect where the first windowed release film 6030 and the second windowed release film 6040 are encased within the board body, preventing the edges of the first windowed release film 6030 and the second windowed release film 6040 from being exposed. This would prevent various chemicals from seeping into the board body from the edges during subsequent processing, causing corrosion or damage. At the same time, it does not affect the core release function of the first windowed release film 6030 and the second windowed release film 6040. Subsequently, the first single-sided windowed copper clad laminate 6010 and the second single-sided windowed copper clad laminate 6020 can still be successfully peeled off by laser deep milling.

[0092] Please see Figure 10 , Figure 11 , Figure 12 and Figure 13 , Figure 10 A cross-sectional schematic diagram of the milled structural plate according to an embodiment of the present invention; Figure 11 A cross-sectional schematic diagram of the first molding plate according to an embodiment of the present invention; Figure 12 A plan view of the plugging plate according to an embodiment of the present invention; Figure 13 A cross-sectional schematic diagram of the embedded copper block circuit board according to an embodiment of the present invention.

[0093] Step S50:

[0094] Laser-controlled depth milling is performed on the laminate 60 to remove the first single-sided windowed copper clad laminate 6010, the first windowed release film 6030, the second windowed release film 6040, and the second single-sided windowed copper clad laminate 6020, forming the first molded board 80. Then, the adhesive layer 5010 is removed by plasma, followed by electroplating of the entire board, and then surface circuit patterns 9010 are made. After subsequent processing, the entire board is formed into a circuit board 90.

[0095] First, laser-controlled depth milling line 7010 is used to mill the edge of the laminated plate 60 corresponding to the bottom copper 1010. Then, mechanical milling line 7020 is used to mill the panel edge PB of the laminated plate 60 (for milling the structural plate 70, please refer to [reference]). Figure 10 Then remove the first single-sided windowed copper clad laminate 6010, the first windowed release film 6030, the second windowed release film 6040, and the second single-sided windowed copper clad laminate 6020 to form the first molded board 80.

[0096] Furthermore, the milling position of the laser controlled depth milling corresponds to the edge of the bottom copper 1010; the milling depth of the laser controlled depth milling is: the depth from the first single-sided windowed copper clad laminate 6010 to the first windowed release film 6030, and the depth from the second single-sided windowed copper clad laminate 6020 to the second windowed release film 6040.

[0097] Plasma de-adhesive removal quickly removes the adhesive layer 5010 without direct contact with the board surface, thus avoiding problems such as board deformation that may be caused by mechanical scratching and grinding, providing a high-quality base for subsequent processing. After de-adhesive removal, electroplating of the entire board allows the irregularly shaped copper block 1020 to form a good electrical connection with the surface circuit pattern 9010, giving full play to the core role of the irregularly shaped copper block 1020 in high current carrying capacity and high heat dissipation. After further processing, the entire board forms the high heat dissipation embedded copper block circuit board 90 for the power control module.

[0098] Optionally, the plasma degumming parameters are:

[0099]

[0100] Optionally, forming the circuit board 90 includes forming a de-adhesive plate (not shown in the figure) after plasma removal of the adhesive layer 5010, and polishing the de-adhesive plate.

[0101] The process involves first using plasma chemical decomposition to remove most of the 5010 adhesive layer, followed by light polishing as a supplementary cleaning method to remove any remaining 5010 adhesive layer and adhesive residue from the insulating dielectric layer. This ensures thorough removal of impurities while minimizing mechanical damage to the core structure of the board.

[0102] As an optional implementation, if the previous process has a connection position 2010, the circuit board 90 is formed by: after plasma removal of the adhesive layer 5010, drilling through holes at the location of the connection position 2010 and filling the holes with resin to form a plug hole 1050, forming a plug hole board 80A on the whole board, then electroplating the whole board, and then making surface circuit patterns 9010. After subsequent processing, the whole board is formed into a circuit board 90.

[0103] By precisely drilling and directionally removing the connection position 2010, the irregular copper block 1020 body and surrounding structure are not damaged, and its independent design function is restored. Then, resin plugging is performed to fill the through hole, which effectively improves the processing accuracy of irregular shapes and avoids problems such as skewing or misalignment of irregular shapes.

[0104] The circuit board provided by this embodiment can be used to solder chips and integrated circuits to the pads formed on the surface of the circuit board, realizing the effective interconnection between them and the internal circuit patterns and irregular copper blocks of the circuit board. The irregular copper blocks can not only provide high heat dissipation for the chips and integrated circuits, but also improve the design density and working efficiency of the circuit board and enhance the intelligence of the management system.

[0105] This implementation method effectively achieves high processing accuracy and reliability in the pressing and other processing of embedded irregular copper blocks under the design requirements of high density and high heat dissipation of chips and integrated circuits, avoiding the phenomenon of glue flow and preventing problems such as skewing, displacement and deformation of copper blocks.

[0106] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made under the inventive concept of the present invention using the description and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board, wherein the circuit board is processed using a panelization method according to design data during the processing, the panelization includes a forming line, the area within the forming line is the effective area, and the other areas are the tool area, characterized in that... The manufacturing method includes the following steps: S10: Take a copper block, perform controlled-depth milling on the copper block according to the design data, and retain a bottom copper layer to form an integrated copper block composed of several independent irregular copper blocks combined on the bottom copper. S20: Fabricate a window core board corresponding to the bottom copper for opening windows according to the design data; The integrated copper block and the windowed core board are stacked accordingly and pressed together for the first time to form the first pressed board. S30: Apply an adhesive layer to the side of the first laminate that is not the bottom copper. Take copper foil, cut it to the size corresponding to the bottom copper to form a protective copper layer, and attach it to the adhesive layer to form a protective plate. S40: Take two single-sided copper-clad laminates and make a first window corresponding to the bottom copper to form a first single-sided windowed copper-clad laminate and a second single-sided windowed copper-clad laminate respectively. Take two layers of release film and make a second window corresponding to the bottom copper, respectively forming a first window release film and a second window release film; The first single-sided windowed copper-clad laminate, the first windowed release film, the protective plate, the second windowed release film, and the second single-sided windowed copper-clad laminate are stacked sequentially from top to bottom and then pressed together for the second time to form a pressed plate. S50: The laminated board is laser-controlled deep milling to remove the first single-sided open copper-clad laminate, the first open release film, the second open release film and the second single-sided open copper-clad laminate. Then, the adhesive layer is removed by plasma. After that, the whole board is electroplated and the surface circuit pattern is made. After subsequent processing, the whole board is formed into the circuit board.

2. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1, characterized in that, One side of the first windowed release film is smaller than the first single-sided windowed copper-clad laminate; The second windowed release film has a smaller diameter on one side than the second single-sided windowed copper-clad laminate.

3. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1, characterized in that, The adjacent irregularly shaped copper blocks of the integrated copper block are staggered, and connection positions are made at the staggered positions; the connection positions are where the copper blocks are retained during the controlled depth milling.

4. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 3, characterized in that, The process of forming the circuit board includes: after removing the adhesive layer by plasma, drilling through holes at the connection positions and filling the holes with resin, then electroplating the entire board, then creating surface circuit patterns, and finally processing the entire board to form the circuit board.

5. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1, characterized in that, The edge of the base copper extends outward to form an extension area; the window core board is made by creating a window corresponding to the base copper excluding the extension area according to the design data, thus forming the window core board.

6. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 5, characterized in that, The size of the windowed core board is pre-larger on one side relative to the size of the splicing board; The coverage area of ​​the first and second windowed release films when stacked is from the edge of the bottom copper to the edge of the panel; the windows of the first single-sided windowed copper clad laminate and the second single-sided windowed copper clad laminate are windows corresponding to the bottom copper except for the extended area.

7. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1, characterized in that, The first pressing is performed using a rapid pressing method; the rapid pressing is performed by pressing for 60 to 180 seconds at a temperature of 160°C to 180°C and a pressure of 20 kg / cm² to 35 kg / cm².

8. A method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1 or 4, characterized in that, The milling position of the laser-controlled depth milling corresponds to the edge of the bottom copper; the milling depth of the laser-controlled depth milling is: the depth from the first single-sided open-window copper clad laminate to the first open-window release film, and the depth from the second single-sided open-window copper clad laminate to the second open-window release film.

9. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1, characterized in that, Both the first and second windowed release films are adhesive tapes, with the adhesive side of the tape facing the first or second single-sided windowed copper-clad laminate.

10. The method for manufacturing an integrated circuit partition control power supply embedded copper block circuit board as described in claim 1, characterized in that, The process of forming the circuit board includes removing the adhesive layer with plasma to form an adhesive removal plate, and then polishing the adhesive removal plate.

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