Low-temperature electronic system and control method thereof

Abstract

The invention relates to the field of electronic systems, and provides a low-temperature electronic system and a control method thereof.The low-temperature electronic system comprises an electronic device body, a sealed container used for containing devices, a cooling inlet pipe and a cooling outlet pipe which are connected with the devices, a vacuum unit communicated with the sealed container and a gas supply unit used for filling dry inert gas into the sealed container. An electronic device is arranged in a sealed cavity capable of being vacuumized, and a closed-loop liquid cooling channel, vacuum pumping and inert gas replacement are combined, so that a set of comprehensive protection and cooling system capable of accurately controlling temperature, pressure and humidity is constructed; the system is started only when the humidity of the cavity is lower than the preset threshold value, so that the risks of short circuit, corrosion and signal distortion caused by condensation and frosting are effectively avoided, and the starting safety and the operation reliability are improved. According to the scheme, the maintainability of refrigerant recovery and long-term stable operation is considered, and the performance advantage of the low-temperature device can be applied to a server-level system in an engineering mode.

Description

Technical Field

[0001] This invention relates to the field of electronic systems, and in particular to a cryogenic electronic system and its control method. Background Technology

[0002] With the rapid development of research on low-temperature electronic devices and quantum information technology, electronic systems are being deployed in low-temperature and even cryogenic environments (such as the boiling point of liquid nitrogen). To achieve higher energy efficiency and better electrical performance (196 ℃), this has become an important development direction.

[0003] Currently, there is a lack of cryogenic environment systems capable of achieving long-term stable operation of server-level systems in the liquid nitrogen temperature range. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this invention is to propose a low-temperature electronic system and its control method to improve system stability.

[0005] To achieve the above and other related objectives, the present invention proposes a cryogenic electronic system, comprising:

[0006] The electronic device body, including the heat exchange unit; A sealed container for containing the electronic device body; A cooling inlet pipe is used to connect to the heat exchange unit of the electronic device body to provide coolant; A cooling outlet pipe is used to connect to the heat exchange unit of the electronic device body to recover the coolant; A vacuum unit, connected to the sealed container, is used to evacuate the sealed container; A gas supply unit is used to inject dry inert gas into the sealed container.

[0007] In a specific embodiment of the present invention, a first valve, a second valve, and a control unit are also included. The first valve is disposed on the cooling inlet pipe, and the second valve includes a first interface communicating with the cooling outlet pipe and a second interface communicating with the outside of the sealed container. The control unit is connected to the heat exchange unit of the electronic device body to obtain the temperature of the electronic device body. The control unit is configured to control the operation of the first valve and the second valve according to the temperature of the electronic device body.

[0008] In a specific embodiment of the present invention, the second valve is a multi-way valve, the second valve includes a third interface, a return pipe is connected to the third interface, the return pipe is connected to the cooling inlet pipe, and a heating unit connected to the control unit is provided on the return pipe. The control unit is configured to: obtain the coolant outlet temperature of the cooling outlet pipe through a temperature sensor, connect the first interface and the second interface or connect the first interface and the third interface according to the coolant outlet temperature, and start the heating unit.

[0009] In one specific embodiment of the present invention, the air supply unit includes an air inlet, which is located on the outer wall of the sealed container.

[0010] In a specific embodiment of the present invention, the air supply unit includes an air inlet, the second valve is a multi-way valve, the second valve includes a fourth interface communicating with the interior of the sealed container, and the second interface and the fourth interface of the multi-way valve are connected to form the air inlet.

[0011] In one specific embodiment of the present invention, the coolant is a liquid inert gas, and the liquid inert gas has the same composition as the dry inert gas.

[0012] In one specific embodiment of the present invention, a humidity sensor for detecting the humidity inside the sealed container is also included.

[0013] The present invention also provides a method for controlling a cryogenic electronic system, applied to the aforementioned cryogenic electronic system, comprising the following steps: The temperature of the electronic device body is obtained; The operation of the first valve and the second valve is controlled according to the temperature of the electronic device body.

[0014] In a specific embodiment of the present invention, the step of controlling the operation of the first valve and the second valve according to the temperature of the electronic device body includes: When the temperature of the electronic device body is higher than the preset target temperature, the first valve is opened and the first interface and the second interface are connected.

[0015] In a specific embodiment of the present invention, the step of controlling the operation of the first valve and the second valve according to the temperature of the electronic device body includes: Obtain the coolant outlet temperature of the cooling pipe; Connect the first interface and the second interface or connect the first interface and the third interface according to the coolant outlet temperature and start the heating unit.

[0016] In a specific embodiment of the present invention, the step of connecting the first interface and the second interface or connecting the first interface and the third interface according to the coolant outlet temperature and starting the heating unit includes: When the coolant outlet temperature is higher than a preset temperature threshold, the first interface and the second interface are connected. When the outlet temperature of the coolant is lower than the preset temperature threshold, the first interface and the third interface are connected, and the heating unit is activated to heat the coolant so that its temperature is higher than the preset temperature threshold.

[0017] The present invention also provides a method for controlling a cryogenic electronic system, applied to the aforementioned cryogenic electronic system, comprising the following steps: The vacuum unit is activated to evacuate the sealed container to achieve the target vacuum level. Dry inert gas is injected into the sealed container through the gas supply unit to achieve the target pressure; The humidity sensor detects whether the humidity inside the sealed container has reached a preset humidity threshold. If so, the low-temperature electronic system is activated. If not, the process returns to the step of activating the vacuum unit to evacuate the sealed container to achieve the target vacuum level.

[0018] In a specific embodiment of the present invention, the step of activating the vacuum unit to evacuate the sealed container to achieve the target vacuum level includes: Continuously obtain the vacuum level inside the sealed container; Determine whether the vacuum level is maintained at the target vacuum level within a preset time. If so, proceed to the next step; If not, the seal is deemed to have failed, the process is stopped and an alarm is triggered.

[0019] In one specific embodiment of the present invention, the target pressure is higher than atmospheric pressure.

[0020] The technical advantages of this invention are as follows: By placing electronic components within a vacuum-sealed container and combining it with a closed-loop liquid-cooling channel for cooling inlet and outlet pipes, and a gas supply unit for vacuuming and replacing with dry inert gas, this invention forms a comprehensive protection and cooling system capable of precisely controlling temperature, pressure, and humidity. The system can only be activated when the humidity in the cavity is below a preset threshold, effectively avoiding the risks of short circuits, corrosion, and signal distortion caused by condensation and frost, thus improving the safety and repeatability of system startup. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the connection of a cryogenic electronic system in one embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a cryogenic electronic system according to one embodiment of the present invention; Figure 3 This is a flowchart of a cryogenic electronic system control method according to one embodiment of the present invention.

[0023] Explanation of reference numerals in the attached drawings: 10. Electronic device body; 11. Standard server rack; 12. Power supply and hybrid communication module; 13. Control unit; 20. Sealed container; 21. Low temperature resistant interface; 30. Cooling inlet pipe; 40. Cooling outlet pipe; 50. Vacuum unit; 60. Gas supply unit; 70. First valve; 80. Second valve; 81. First interface; 82. Second interface; 83. Third interface; 84. Fourth interface; 90. Return pipe; 91. Heating unit. Detailed Implementation

[0024] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0025] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and its component layout may also be more complex.

[0026] With the rapid development of low-temperature CMOS device research and quantum information technology, electronic systems are being deployed in low-temperature and even cryogenic environments (such as the boiling point of liquid nitrogen). Obtaining higher energy efficiency and better electrical performance (196 ℃) has become an important development direction. Under low temperature conditions, the carrier mobility of semiconductor devices increases significantly, the subthreshold swing decreases, and the leakage current decreases substantially, which is expected to overcome the contradiction between power consumption and performance in room temperature CMOS, and provide new opportunities for high-efficiency computing and low-noise measurement.

[0027] Although the electrical properties of individual transistors or chips at low temperatures have been extensively studied and verified, there are still many engineering bottlenecks in scaling up these advantages to the system level and enabling a complete server to operate stably and repeatedly in the liquid nitrogen temperature range for a long time.

[0028] Currently, most low-temperature testing is conducted at the device or module level. There is a lack of complete low-temperature server design specifications and engineering implementation methods that cover power supply, computing units, communication interfaces, thermal management and environmental control, making it difficult to support long-term operation and large-scale deployment.

[0029] In environments with sudden cooling or moisture, condensation or frost can easily form on the surfaces of circuit boards, connectors, and exposed components, potentially leading to short circuits, isolation failures, corrosion, and signal distortion. Current mitigation methods (vacuum chambers, inert gas replacement, insulating coatings, etc.) each have limitations and cannot guarantee both maintainability and long-term reliability at the system level.

[0030] The endothermic effect of liquid nitrogen evaporation and phase change causes the internal temperature of the cavity to change over time. Without an active thermal control strategy (such as a closed-loop refrigerator, power regulator and local heater), the temperature may drop or fluctuate beyond the device's safety window, affecting device performance and lifespan.

[0031] In summary, there is currently no solution that can achieve long-term stable operation of server-level systems in the liquid nitrogen temperature range. Therefore, there is an urgent need for a system-level design methodology and implementation platform that balances electrical performance advantages with engineering feasibility to solve core issues such as condensation protection and precise temperature control, and to promote the engineering implementation and large-scale application of cryogenic servers.

[0032] To solve the above technical problems, such as Figure 1 , 2 As shown, the present invention proposes a low-temperature electronic system, including an electronic device body 10 (e.g., a computer server), a sealed container 20, a cooling inlet pipe 30, a cooling outlet pipe 40, a vacuum unit 50, a gas supply unit 60, etc.

[0033] The electronic device body 10 includes heat exchange units (such as a cold head and heat exchanger). As the core computing unit of the system, the electronic device body 10 integrates a central processing unit (CPU) and a graphics processing unit (GPU). The surface of the electronic device body 10 directly contacts the oxygen-free copper microchannel cold head, ensuring efficient heat conduction. Under liquid nitrogen cooling conditions, the surface temperature of the cold head can be stably maintained at [temperature missing]. 196°C, meeting the requirements for cryogenic calculations.

[0034] The sealed container 20 is used to house the electronic device body 10. The sealed container 20 is made of high-strength metal material, completely isolating it from external air intrusion and capable of withstanding a set internal and external pressure difference. By performing a vacuum operation on this cavity, internal air and water vapor can be effectively removed, providing a high-vacuum basic environment for the cryogenic computing node. Furthermore, combined with nitrogen circulation and replacement, a high-purity nitrogen atmosphere is maintained, reducing ambient humidity and fundamentally eliminating the possibility of condensation formation.

[0035] The cooling inlet pipe 30 is used to connect to the electronic device body 10 to provide coolant. The cooling inlet pipe 30 is cooled by a coolant source (e.g., a liquid nitrogen tank).

[0036] The cooling outlet pipe 40 is used to connect to the electronic device body 10 to recover the coolant. The cooling outlet pipe 40 can perform coolant recovery (coolant recycling or reuse).

[0037] Vacuum unit 50 (mechanical pump, molecular pump, or a combination thereof) is connected to the sealed container 20 to evacuate the sealed container 20. It is used to initially remove air from the cavity until a vacuum of ≤5 × 10⁻⁶ is achieved. - The high vacuum of 2 Pa ensures maximum removal of residual moisture, laying a dry and clean foundation for subsequent low-temperature operation.

[0038] The gas supply unit 60 is used to inject dry inert gas into the sealed container 20.

[0039] This solution fundamentally suppresses the moisture content within the cavity through vacuum evacuation and replacement with a dry inert gas, significantly reducing the risks of short circuits, corrosion, and signal distortion caused by condensation and frost during cooling. The efficient thermal coupling between the oxygen-free copper microchannel cold head and the closed-loop refrigerant can stably maintain the device surface at its cryogenic operating point (e.g., At 196 °C, semiconductor devices exhibit electrical advantages such as increased carrier mobility, reduced subthreshold swing, and lower leakage current and noise at low temperatures, thereby improving computing energy efficiency and single-node performance. Simultaneously, the dry, inert atmosphere and high vacuum conditions reduce oxidation and chemical degradation, lowering long-term failure rates. Modular cold heads, recyclable refrigerants, and standardized penetrators enhance maintainability and scalability. Humidity thresholds, redundant sensing, and safety protections (pressure relief, ODH monitoring, leak alarms, etc.) enhance the safety and repeatability of system startup and operation.

[0040] In this design, the sealed container 20 is equipped with a low-temperature resistant interface 21 that is vacuum-sealed with potting compound. All power supply and communication lines pass through this interface through the cavity wall. This interface is encapsulated using a vacuum potting process, which ensures reliable communication of electrical signals and power inside and outside the cabinet 11, and also ensures the long-term sealing reliability of the cavity under alternating high and low temperatures and vacuum / positive pressure switching conditions.

[0041] In this solution, the electronic device body 10 is set on the standard server rack 11. The overall structure of the standard server rack 11 follows the general server rack 11 technical specifications, which makes it easy to deploy in existing data centers or experimental platforms, significantly reducing the complexity of later maintenance and improving system compatibility and scalability.

[0042] This solution also includes a power supply and hybrid communication module 12, which contains a power supply unit optimized for low temperatures and a hybrid fiber optic / electrical signal transmission interface. The startup strategy employs a dual redundancy design: on one hand, it supports remote wake-up of the host via the BMC wireless protocol. On the other hand, for devices that do not support wireless BMC, a physical jumper startup can be implemented by connecting an external expansion potting interface cable to a specific pin on the motherboard, ensuring cold starts can be completed under various hardware configurations.

[0043] In one specific embodiment of the invention, the coolant is a liquid inert gas (typically liquid nitrogen), and the dry inert gas used for cavity replacement and backfill has the same composition (nitrogen). The phase change endothermic capacity (high latent heat) of liquid nitrogen and the tight thermal coupling of the microchannel cold head achieve efficient heat extraction, enabling the device surface to be stably maintained at a constant temperature. The system features a cryogenic operating point of 196 °C and minimizes temperature fluctuations. Furthermore, the dry, high-purity nitrogen environment within the chamber completely eliminates sources of condensation and frost, significantly reducing the risks of short circuits, corrosion, and signal distortion, thereby improving startup safety, operational reliability, and device lifespan. The monolithic gas system also simplifies refrigerant recovery and reliquefaction processes, reduces the risk of cross-contamination, and facilitates leak detection and handling. It is important to note that using a nitrogen system increases the oxygen deficiency hazard (ODH) in the work area; therefore, it is essential to implement safety measures such as ODH monitoring, forced ventilation, pressure relief, and emergency circuit breaking to ensure personnel safety.

[0044] In one specific embodiment of the present invention, such as Figure 1 As shown, the device also includes a first valve 70, a second valve 80, and a control unit 13. The first valve 70 is disposed on the cooling inlet pipe 30. The second valve 80 includes a first interface 81 communicating with the cooling outlet pipe 40 and a second interface 82 communicating with the outside of the sealed container 20. The control unit 13 is connected to the electronic device body 10 to obtain the temperature of the electronic device body 10. The control unit 13 is configured to control the operation of the first valve 70 and the second valve 80 according to the temperature of the electronic device body 10. The first valve 70 is a cryogenic solenoid valve, designed specifically for extremely low temperature environments, used to perform fast and reliable on / off control of liquid nitrogen flow, and is a key actuator for realizing chip-level dynamic cooling.

[0045] The control unit 13 is used for unified scheduling of the system's global interface and electronic control logic. This module acquires the current temperature of the object being cooled (such as a CPU / GPU) in real time through a thermocouple sensor network, and controls the opening and closing of the first valve 70 accordingly to achieve precise temperature control. At the same time, the control unit 13 also reads the air pressure and humidity data inside the cavity and dynamically adjusts the second valve 80.

[0046] The first valve 70, located on the cooling inlet pipe 30, is a cryogenic solenoid valve designed for extremely low-temperature environments, used to rapidly and controllably open and close liquid inert gases (such as liquid nitrogen). The second valve 80 has a first interface 81 communicating with the cooling outlet pipe 40 and a second interface 82 communicating with the outside of the sealed container 20, allowing switching or isolation of the loop between the recovery path and the container discharge / replacement path. The control unit 13 obtains real-time temperature information through connection with the electronic device body 10 and issues opening and closing commands to the first valve 70 and the second valve 80 based on the set temperature target, cooling / heating rate, and safety threshold: During the startup and steady-state cooling phases, the first valve 70 adjusts the liquid nitrogen flow rate in a pulsed or continuous manner to achieve precise temperature control, while the second valve 80 ensures that the cooling gas flows to the recovery device to complete the closed-loop cycle. During shutdown, replacement, or fault handling phases, the second valve 80 can switch to the external replacement path or discharge path to complete cavity backfilling, venting, or rapid depressurization. This combination employs strategies such as soft start, rate limiting and cooling, and threshold interlocking to jointly avoid thermal shock, vaporization blockage, and pressure fluctuations, ensuring that the device operates smoothly within the allowable temperature window.

[0047] In one specific embodiment of the present invention, such as Figure 1As shown, the second valve 80 is a multi-way valve, and the second valve 80 includes a third interface 83. A return pipe 90 is connected to the third interface 83. The return pipe 90 is connected to the cooling inlet pipe 30. A heating unit 91 connected to the control unit 13 is provided on the return pipe 90. The control unit 13 is configured to: obtain the coolant outlet temperature of the cooling outlet pipe 40 through a temperature sensor (not shown in the figure), and connect the first interface 81 and the second interface 82 or connect the first interface 81 and the third interface 83 according to the coolant outlet temperature and start the heating unit 91.

[0048] Heating unit 91 is installed in the middle of the nitrogen circulation loop to reheat the ultracooled nitrogen gas generated after liquid nitrogen evaporation as needed. Its start / stop status is dynamically controlled by control unit 13 based on the real-time temperature of the cavity—when the overall system temperature approaches the lower limit (e.g., when...). When the temperature reaches 196°C, the heater is activated to moderately raise the temperature. Once the temperature returns to the safe range, the heater is turned off to prevent overheating. This mechanism effectively prevents the system from "running out of control due to overcooling" and ensures that the operating temperature remains stable within the target range.

[0049] In one specific embodiment of the present invention, the gas supply unit 60 includes an air inlet, which is located on the outer wall of the sealed container 20. The air inlet is used to introduce replacement gas or maintain positive working pressure into the cavity through an external high-purity inert gas source (such as a central dry nitrogen pipeline or portable gas cylinder). The air inlet is engineered with a low-temperature / high-vacuum compatible quick-connect coupling or flange (e.g., VCR, CF, or metal-faced quick-tight coupling), a filter / molecular sieve and mass flow controller, a one-way check valve, and necessary safety components (pressure reducing valve and safety relief device). It is also linked with valves and sensors within the cavity, and the control unit 13 executes a preset program to switch the gas path and regulate the flow rate for vacuuming, replacement, backfilling, or maintaining positive pressure, thereby completing gas replacement, replenishment, and maintenance operations without disassembling the cavity.

[0050] In one specific embodiment of the present invention, such as Figure 1As shown, the air supply unit 60 includes an air inlet, and the second valve 80 is a multi-way valve. The second valve 80 includes a fourth interface 84 that communicates with the interior of the sealed container 20. The second interface 82 and the fourth interface 84 of the multi-way valve are connected to form the air inlet. That is, the second valve 80 itself is used as a service interface for external air supply / replacement, thereby eliminating the need for an additional independent air inlet penetrating component. The control unit 13 can switch between different path states by driving the multi-way valve, and can switch between working states such as "recovery / exhaust", "replacement / backfilling", and "isolation / closure". Replacing the independent air inlet with a multi-way valve can significantly reduce the number of external penetrating components and sealing interfaces, thereby reducing the overall leakage probability, reducing heat introduction (thermal bridge), and reducing the risk of secondary pollution during assembly and maintenance. The integrated functionality of the valve body facilitates the compactness and standardization of pipeline layout, reduces the number of openings in the sealed container 20, simplifies the field access process, and shortens the replacement and maintenance response time.

[0051] In one specific embodiment of the invention, a humidity sensor (not shown) is also included for detecting the humidity inside the sealed container 20. The humidity sensor is used to measure the water vapor content or dew point inside the cavity in real time and transmit the measured data back to the control unit 13 as a closed-loop input for replacement, vacuuming, and start / stop decisions.

[0052] The present invention also provides a method for controlling a cryogenic electronic system, applied to the aforementioned cryogenic electronic system, comprising the following steps: S1. The temperature of the electronic device body 10 is obtained by using low-temperature compatible temperature sensors (not shown in the figure) arranged near the chip (e.g., on the back of the die, on the cold head contact surface) and at key system nodes (cold head inlet / outlet, inside the cavity). The sensor type can be a thermocouple, a platinum resistance thermometer (PT100 / RTD), or a semiconductor temperature diode.

[0053] S2. The first valve 70 and the second valve 80 are activated according to the temperature of the electronic device body 10.

[0054] When the temperature of the electronic device body 10 exceeds a preset target temperature, the first valve 70 is opened, connecting the first interface 81 and the second interface 82. That is, when the chip temperature is detected to exceed the preset target temperature (e.g., ...), the first valve 70 is opened, connecting the first interface 81 and the second interface 82. When the temperature reaches 180°C, immediately open the first valve 70 and the second valve 80 to introduce cryogenic liquid nitrogen through the microfluidic cold head for forced cooling. When the temperature drops back to the preset target temperature (e.g., 180°C), the first valve 70 and the second valve 80 are opened. When the temperature reaches 190°C ± 5°C, the valve is closed to prevent overcooling from causing thermal stress damage or performance fluctuations. This closed-loop temperature control strategy enables rapid and targeted cooling intervention during power surges or thermal imbalances, preventing chip overheating that could lead to performance degradation or protection triggering. Simultaneously, by promptly shutting off the liquid nitrogen supply after reaching the target low temperature, thermal stress, material embrittlement, or performance fluctuations caused by overcooling are prevented, improving device reliability and thermal cycle life.

[0055] Step S2 includes: S21. Obtain the coolant outlet temperature of the cooling outlet pipe 40. The coolant (or return gas) outlet temperature of the cooling outlet pipe 40 is measured in real time by a temperature sensor (not shown in the figure) and the data is sent to the control unit 13.

[0056] S22. Connect the first interface 81 and the second interface 82 or connect the first interface 81 and the third interface 83 according to the coolant outlet temperature and start the heating unit 91.

[0057] When the outlet temperature is higher than the preset threshold, the second valve 80 is set to connect the first interface 81 and the second interface 82, allowing the recovery / recirculation path to operate in normal mode. When the outlet temperature is lower than the preset threshold, the second valve 80 is switched to connect the first interface 81 and the third interface 83, and the heating unit 91 is activated to heat the recirculated cooling medium (gas phase or liquid phase, depending on the system design), raising its temperature to above the preset threshold before returning it to the cold head or recovery device.

[0058] If the overall temperature of the cavity continues to drop, approaching the operating temperature limit of the motherboard's electronic components, the heater will be activated to moderately reheat the circulating nitrogen gas and prevent the temperature from dropping further. If the cavity temperature is too high due to slowed liquid nitrogen evaporation or external thermal disturbances, the heater will be turned off, relying on the natural heat absorption of liquid nitrogen to maintain cooling balance.

[0059] Based on the outlet liquid temperature, the switching of the flow path and the intervention of heating can achieve closed-loop protection of the refrigerant temperature. This allows for timely reheating when the refrigerant is too cold, preventing overcooling, embrittlement, or thermal stress concentration in components and structures. It also enables rapid recirculation to maintain cooling efficiency when the refrigerant is overheated. Incorporating the overall cavity temperature into the strategy prevents motherboard electronic components from exceeding their operating limits due to localized deep cooling, thereby reducing the risk of thermal mismatch, material fatigue, and functional failure. This solution reduces frequent valve switching and liquid nitrogen waste through controlled reheating of the return fluid, improving refrigerant recovery and energy efficiency. Simultaneously, safety interlocks (humidity / ODH / pressure) can quickly put the system into a safe state under abnormal conditions, enhancing system reliability and personnel safety.

[0060] This invention also provides a method for controlling a cryogenic electronic system, applied to the aforementioned cryogenic electronic system, such as... Figure 3As shown, it includes the following steps: A1. Turn on the vacuum unit 50 to evacuate the sealed container 20 to achieve the target vacuum level.

[0061] In this stage, all relevant solenoid valves within the system are first shut off to completely isolate the cavity from external piping. This aims to eliminate interference from external leaks and backflow channels on the vacuuming process before evacuation. Then, vacuum unit 50 is activated (typically, a dry mechanical pump is used for rough evacuation first, followed by a molecular pump / turbomolecular pump for fine evacuation, with a cold trap or adsorber installed before the pump if necessary to trap condensable components), continuously evacuating the sealed container 20 until the internal pressure reaches the preset threshold of 5 × 10⁻⁶. - ² Pa or lower. After the vacuum reaches the standard, the vacuum unit 50 is isolated or stopped from operation according to the process requirements, but the cavity is kept closed. The high vacuum state is maintained for no less than 30 minutes without leakage. At the same time, the humidity sensor (and vacuum gauge) inside the cavity is read in real time to confirm that the relative humidity is below 10% (or the equivalent moisture content threshold) to ensure that residual water vapor and volatile impurities have been fully removed, and to avoid the formation of liquid water or ice crystals on the surface of the circuit board, chip or connector during subsequent cooling.

[0062] By first isolating the tubing and then performing continuous deep vacuuming, and maintaining a steady-state vacuuming time after reaching the target, the residual amount of adsorbed water and volatile organic pollutants in the cavity can be significantly reduced. This reduces the risk of condensation and frost formation during cooling, thereby preventing short circuits, corrosion, and signal integrity issues caused by liquid water / ice crystals, and improving the device's startup safety and long-term reliability. Continuous steady-state vacuuming also promotes secondary desorption on the material surface to reach equilibrium, making subsequent replacement, backfilling, and cryogenic cooling processes more controllable and repeatable.

[0063] In step A1, the control unit 13 continuously monitors the vacuum level inside the sealed container 20 online, using a preset target vacuum level and duration as criteria (e.g., target vacuum level ≤ 5 × 10⁻⁶). - The pressure is 2 Pa and maintained for ≥30 min. The monitoring logic not only determines whether the instantaneous value meets the threshold, but also detects whether there is a significant rebound in vacuum after the vacuum pump is turned off or isolated. If the pressure rises rapidly after isolation (e.g., rises by more than double the order of magnitude or exceeds the set ΔP threshold in a short period of time), the system determines that the seal has failed or leaked. When the maintenance condition is not met or a significant rebound occurs, the control unit 13 will immediately stop the subsequent process, issue an audible and visual alarm and a remote alarm, and place the system in an isolation / pending repair state according to the preset safety procedure, prohibiting entry into the next stage of operation to prevent further risk spread.

[0064] Continuous online vacuum stabilization verification and springback detection significantly improve early leak detection capabilities, eliminating airtightness defects before the process enters sensitive stages (such as backfilling and replacement, cryogenic cooling). This prevents water vapor, oxygen, or contaminants introduced by minute leaks from causing condensation, short circuits, device failure, or personal safety hazards. This strategy, through automated judgment and forced process termination, reduces overhaul and rework costs caused by hidden leaks, improving process reliability and personnel safety.

[0065] A2. Dry inert gas is injected into the sealed container 20 through the gas supply unit 60 to achieve the target pressure. After confirming that the vacuum treatment is qualified (i.e., the vacuum degree is stable and the humidity meets the standard), the system automatically or manually enters the second stage. The core objective of this stage is to use high-purity nitrogen (purity ≥99.999%) to perform multiple inert gas replacements inside the cavity to further reduce the residual moisture content and establish a clean, dry, and chemically inert operating environment.

[0066] A3. Detect whether the humidity inside the sealed container 20 has reached the preset humidity threshold using a humidity sensor. If yes, start the low-temperature electronic system; otherwise, return to step A1.

[0067] After confirming that the vacuum treatment is qualified, high-purity inert gas (e.g., N2, purity ≥99.999%) is quantitatively and controllably introduced into the sealed container 20 through the gas supply unit 60, so that the pressure inside the cavity rises back to the preset target pressure and the replacement is completed. The common process is a "vacuuming-backfilling (replacement)" cycle: first, the vacuum pump is used to evacuate to the target vacuum level and the humidity is verified to meet the standard. Then, the isolation valve with the pump is closed, and the gas inlet passage is opened to backfill N2 to the set pressure (which can be slightly positive pressure or atmospheric pressure, depending on the subsequent operating conditions) at a constant flow rate or according to the mass flow controller (MFC). A residence time is maintained to achieve gas mixing and desorption, and then the vacuum is re-evacuated or the next step is directly entered. By multiple cycles (usually 3-5 times or depending on the humidity / dew point index), the residual water vapor and oxygen content can be gradually reduced. During the process implementation, the air intake link is equipped with a particulate filter, an active molecular sieve / dryer and a one-way check valve. The valves and sensors are linked by the control unit 13 in a predetermined sequence. The humidity sensor, pressure gauge and valve position feedback are used to determine the replacement effect in a closed loop and decide whether to continue the cycle or complete the final backfill to the operating pressure.

[0068] Employing high-purity inert gas in multiple rounds of replacement significantly reduces residual moisture and oxygen content within the cavity, minimizing the risk of condensation and frosting during subsequent cooling. This avoids failure modes such as short circuits, contact corrosion, and signal interference, improving the consistency of electronic device startup and long-term reliability. Standardized filtration and dehumidification devices, combined with automated replacement processes, reduce human error and the probability of secondary contamination and leakage. Selecting a slightly positive pressure operation or an atmospheric pressure clean inert environment simultaneously prevents the backflow of harmful external gases and extends the stable operating time of the device under both normal and low-temperature conditions.

[0069] Once the internal environment of the chamber (including vacuum level, humidity, air pressure, and gas purity) is fully prepared, the system enters the equipment startup phase. Startup is only permitted when all environmental conditions are met, employing soft start, speed-limited cooling, and multiple interlocks. This significantly reduces the risk of short circuits, corrosion, and device failures caused by sudden cooling changes, residual moisture condensation, or gas contamination. It also improves the consistency of the first-run startup and batch repeatability. Closed-loop monitoring and automatic shutdown measures reduce the probability of accidents caused by human error and hidden defects, thereby enhancing equipment reliability and maintainability.

[0070] In one specific embodiment of the invention, the target pressure is higher than atmospheric pressure. The pressure within the cavity is maintained at a slightly positive pressure (e.g., 102–105 kPa, approximately 2–5 kPa higher) slightly above ambient atmospheric pressure via a gas supply and regulation unit, with high-purity nitrogen constituting the cavity medium. The control system employs a mass flow controller (MFC) or proportional pressure regulating valve and pressure sensor to form a closed-loop circuit, compensating for leakage losses in real time to maintain the set slightly positive pressure. One-way check valves and flow-limiting structures are used at all penetrations or locations requiring ventilation to form a stable "nitrogen curtain," allowing gas to escape from the cavity to the outside rather than being drawn in the opposite direction, thereby preventing external humid air and contaminants from entering the cavity. To ensure gas phase cleanliness and dryness, the gas supply link is often equipped with particulate filters, activated desiccants, or online purification / recovery devices, and is monitored in real time by humidity, oxygen content, and pressure sensors. The control unit 13 adjusts the replacement and replenishment frequency based on these signals. Maintaining a slightly positive pressure nitrogen environment can significantly reduce the infiltration rate of external humid air and pollutants, and maintain a low humidity, low oxygen and clean state inside the cavity for a long time. This reduces the risk of condensation and frost during the cooling stage, reduces the probability of oxidation / corrosion and circuit short circuits, and improves the consistency and reliability of device restarts.

[0071] In summary, by first drawing a deep vacuum and then repeatedly purging with high-purity, dry, inert gas while maintaining a slightly positive pressure nitrogen environment, the moisture and oxygen content within the cavity can be fundamentally suppressed. This significantly reduces the risks of condensation and frosting during cooling, as well as the resulting short circuits, corrosion, and signal distortion, thereby improving start-up consistency and long-term reliability. The oxygen-free copper microfluidic cold head and the liquid nitrogen closed-loop refrigerant achieve efficient thermal coupling to the device surface, stably maintaining the working surface at a deep cooling point (e.g., At 196 °C, semiconductor devices exhibit electrical advantages at low temperatures, including increased mobility, reduced subthreshold swing, and lower leakage current and noise, thereby improving single-node computing performance and energy efficiency. A closed-loop valve control and reheating strategy based on chip temperature and liquid outlet temperature enables rapid directional cooling, avoids overcooling or thermal shock, and improves refrigerant recovery efficiency, reducing frequent valve operations and liquid nitrogen waste. Multi-port valves integrating inlet / displacement pathways, vacuum potting penetration components, and standardized cabinet deployment enhance system engineering reliability, maintainability, and scalability, while reducing leak points and thermal bridge introduction. Furthermore, redundant sensing, threshold interlocking and overpressure safety devices, automated abnormal shutdown and fault diagnosis, and other protective measures ensure personnel and equipment safety and shorten fault response time. These optimizations also reduce operating and maintenance costs and improve resource utilization (with the option of recycling), thus providing a solid technical foundation for the long-term stable operation of cryogenic high-performance electronic systems while ensuring safety.

[0072] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

[0073] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of the invention. However, those skilled in the art will recognize that embodiments of the invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the invention.

Claims

1. A low-temperature electronic system, characterized in that, include: The electronic device body, including the heat exchange unit; A sealed container for containing the electronic device body; A cooling inlet pipe is used to connect to the heat exchange unit of the electronic device body to provide coolant; A cooling outlet pipe is used to connect to the heat exchange unit of the electronic device body to recover the coolant; A vacuum unit, connected to the sealed container, is used to evacuate the sealed container; A gas supply unit is used to inject dry inert gas into the sealed container.

2. The cryogenic electronic system according to claim 1, characterized in that, It also includes a first valve, a second valve, and a control unit. The first valve is disposed on the cooling inlet pipe. The second valve includes a first interface communicating with the cooling outlet pipe and a second interface communicating with the outside of the sealed container. The control unit is connected to the heat exchange unit of the electronic device body to obtain the temperature of the electronic device body. The control unit is configured to control the operation of the first valve and the second valve according to the temperature of the electronic device body.

3. The cryogenic electronic system according to claim 2, characterized in that, The second valve is a multi-port valve, and the second valve includes a third port. A return pipe is connected to the third port. The return pipe is connected to the cooling inlet pipe. A heating unit connected to the control unit is provided on the return pipe. The control unit is configured to: obtain the coolant outlet temperature of the cooling outlet pipe through a temperature sensor, connect the first port and the second port or connect the first port and the third port according to the coolant outlet temperature, and start the heating unit.

4. The cryogenic electronic system according to claim 1, characterized in that, The air supply unit includes an air inlet, which is located on the outer wall of the sealed container.

5. The cryogenic electronic system according to claim 2, characterized in that, The air supply unit includes an air inlet, and the second valve is a multi-way valve. The second valve includes a fourth interface that communicates with the interior of the sealed container. The second interface and the fourth interface of the multi-way valve are connected to form the air inlet.

6. The cryogenic electronic system according to claim 1, characterized in that, The coolant is a liquid inert gas, and the liquid inert gas has the same composition as the dry inert gas.

7. The cryogenic electronic system according to claim 1, characterized in that, It also includes a humidity sensor for detecting the humidity inside the sealed container.

8. A method for controlling a cryogenic electronic system, characterized in that, Applied to the cryogenic electronic system as described in claim 3, the method includes the following steps: The temperature of the electronic device body is obtained; The operation of the first valve and the second valve is controlled according to the temperature of the electronic device body.

9. The cryogenic electronic system control method according to claim 8, characterized in that, The steps of controlling the operation of the first and second valves based on the temperature of the electronic device body include: When the temperature of the electronic device body is higher than the preset target temperature, the first valve is opened and the first interface and the second interface are connected.

10. The cryogenic electronic system control method according to claim 8, characterized in that, The steps of controlling the operation of the first and second valves based on the temperature of the electronic device body include: Obtain the coolant outlet temperature of the cooling pipe; Connect the first interface and the second interface or connect the first interface and the third interface according to the coolant outlet temperature and start the heating unit.

11. The cryogenic electronic system control method according to claim 10, characterized in that, The step of connecting the first interface and the second interface or connecting the first interface and the third interface according to the coolant outlet temperature and starting the heating unit includes: When the coolant outlet temperature is higher than a preset temperature threshold, the first interface and the second interface are connected. When the outlet temperature of the coolant is lower than the preset temperature threshold, the first interface and the third interface are connected, and the heating unit is activated to heat the coolant so that its temperature is higher than the preset temperature threshold.

12. A method for controlling a cryogenic electronic system, characterized in that, Applied to the cryogenic electronic system as described in any one of claims 1-7, comprising the following steps: The vacuum unit is activated to evacuate the sealed container to achieve the target vacuum level. Dry inert gas is injected into the sealed container through the gas supply unit to achieve the target pressure; The humidity sensor detects whether the humidity inside the sealed container has reached a preset humidity threshold. If so, the low-temperature electronic system is activated. If not, the process returns to the step of activating the vacuum unit to evacuate the sealed container to achieve the target vacuum level.

13. The cryogenic electronic system control method according to claim 12, characterized in that, The step of activating the vacuum unit to evacuate the sealed container to achieve the target vacuum level includes: Continuously obtain the vacuum level inside the sealed container; Determine whether the vacuum level is maintained at the target vacuum level within a preset time. If so, proceed to the next step; If not, the seal is deemed to have failed, the process is stopped and an alarm is triggered.

14. The cryogenic electronic system control method according to claim 12, characterized in that, The target pressure is higher than atmospheric pressure.

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