Multi-auxiliary-material mounting device and eutectic chip mounter

Abstract

The invention relates to the technical field of chip mounting equipment, in particular to a multi-auxiliary-material mounting device and a eutectic chip mounter, and the device comprises a mounting table, and a chip mounting mechanism, a first visual detection mechanism, a main material conveying mechanism and a second visual detection mechanism which are mounted on the mounting table; a solder taking area of the chip mounting mechanism, the first visual detection mechanism, a chip mounting area on the main material conveying mechanism, the second visual detection mechanism and an auxiliary material taking area of the chip mounting mechanism are sequentially arranged in the transverse transferring direction of the chip mounting mechanism. The solder taking area and the auxiliary material taking area correspond to at least one material taking piece which is arranged on the chip mounting mechanism in a sliding mode in the transverse direction, and the material taking piece can rotate around the axis of the material taking piece. And after the material taking piece picks up the welding flux or the auxiliary material, compensation adjustment of the material picking angle can be correspondingly carried out at the first visual inspection mechanism or the second visual inspection mechanism. And the compensation adjustment of the material picking angle of the welding flux and the auxiliary material is completed before surface mounting, so that the surface mounting precision of the auxiliary material on the main material is improved.

Description

Technical Field

[0001] This invention relates to the field of chip mounting equipment technology, specifically to a multi-auxiliary material mounting device and a eutectic chip mounter. Background Technology

[0002] An auxiliary material placement device is an automated placement equipment that places individual auxiliary materials onto the main material, often integrated into a eutectic bonding machine. This device can replace traditional manual operation, automatically completing the precise feeding, positioning, conveying, and placement of the auxiliary materials. After completion, the robot automatically unloads, transfers, or collects the materials, requiring no human intervention throughout the process. This significantly reduces labor input and production operating costs, while effectively avoiding errors, fatigue, and safety risks associated with human operation.

[0003] However, for multi-auxiliary material placement devices, there are complex processes of picking, handling, visual inspection and placement of multiple auxiliary materials. Existing auxiliary material placement devices are difficult to meet the placement requirements of multiple auxiliary materials. Therefore, there is an urgent need to design a placement device that can achieve high efficiency and high precision in placing multiple auxiliary materials. Summary of the Invention

[0004] (a) Technical problems to be solved In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a multi-auxiliary material mounting device and a eutectic chip mounter, which solves the technical problem that the existing auxiliary material mounting devices have poor adaptability to multi-auxiliary material mounting.

[0005] (II) Technical Solution To achieve the above objectives, the multi-auxiliary material mounting apparatus of the present invention includes a mounting platform and a patch mounting mechanism, a first visual inspection mechanism, a main material transport mechanism, and a second visual inspection mechanism mounted on the mounting platform. The solder pick-up area of ​​the placement mechanism, the first vision inspection mechanism, the placement area on the main material transport mechanism, the second vision inspection mechanism, and the auxiliary material pick-up area of ​​the placement mechanism are arranged sequentially along the lateral transfer direction of the placement mechanism. At least one picking member is slidably disposed on the patch mechanism in the solder picking area and the auxiliary material picking area, and the picking member is capable of rotating around its own axis; after picking up solder or auxiliary material, the picking member can perform material picking angle compensation adjustment at the first vision inspection mechanism or the second vision inspection mechanism.

[0006] Optionally, the placement mechanism includes a gantry mounted on the mounting platform, and a solder placement module, a first sub-material placement module, and a second sub-material placement module that are slidably disposed on the gantry in the lateral direction; The solder mounting module, the first sub-material mounting module, and the second sub-material mounting module are respectively provided with the material picking components.

[0007] Optionally, the solder feeding area and the auxiliary material feeding area are respectively provided with a solder feeding mechanism and an auxiliary material feeding mechanism; the multi-auxiliary material mounting device also includes a main material feeding mechanism; The main material feeding mechanism includes a main material feeding mechanism and a main material conveying mechanism, which are respectively installed on the mounting platform; the main material conveying mechanism can move between the main material feeding mechanism and the main material conveying mechanism. The main material transport mechanism can slide longitudinally to transport the main material to the mounting area.

[0008] Optionally, the main material feeding mechanism includes an adjustable width track mounted on the mounting platform, and a carrier and detection sensors mounted on the adjustable width track; The adjustable track can adjust its width longitudinally; the vehicle is slidably mounted on the adjustable track laterally. The detection sensor can perform online monitoring of the main material on the adjustable width track, as well as monitor the position of the main material on the adjustable width track.

[0009] Optionally, the main material transport mechanism includes a longitudinal sliding module, a main material carrier, a carrier clamping mechanism, and a carrier position feedback unit; The longitudinal sliding module is mounted on the mounting platform; The bottom of the carrier clamping mechanism is slidably connected to the longitudinal sliding module along the longitudinal direction, and the top clamps the main material carrier; The vehicle position feedback unit can collect and feedback the displacement information of the main material vehicle.

[0010] Optionally, the carrier clamping mechanism includes a baffle, a linear clamping bar assembly, and a driver; The linear clamping bar group includes multiple clamping bars arranged in an array along the length direction of the baffle; the driver can synchronously drive the linear clamping bar group to move closer to or away from the baffle to clamp or release the main material; The main material carrier uses negative pressure to adsorb the main material.

[0011] Optionally, the main material transport mechanism further includes a pair of clamping assemblies that are correspondingly arranged on both sides of the main material carrier; the clamping assembly includes a clamp mounted on the carrier clamping mechanism and a clamping plate connected to the clamp. The clamp can drive the clamping plate to rotate and / or move up and down in the vertical direction; The main material carrier has corresponding slots on both sides; a pair of clamping plates can be engaged or disengaged from the pair of slots in a one-to-one correspondence.

[0012] Optionally, the main material feeding mechanism and / or the auxiliary material feeding mechanism are respectively provided with calibration components as calibration references.

[0013] Furthermore, the present invention also provides a eutectic bonding machine, which includes the multi-auxiliary material mounting device as described above; the eutectic bonding machine also includes a eutectic welding furnace body and a pre-assembled component handling mechanism mounted on the mounting platform; The eutectic welding furnace body is located on one side of the main material transport mechanism; the pre-loaded component handling mechanism can pick up pre-loaded components on the main material transport mechanism and unload the pre-loaded components into the eutectic welding furnace body.

[0014] Optionally, the pre-assembled component handling mechanism includes a bracket mounted on the mounting platform, and a lateral sliding module and a lifting clamping mechanism mounted on the bracket; the lifting clamping mechanism is mounted on the lateral sliding module. The lifting and clamping mechanism is equipped with a material sensor and a displacement sensor; the material sensor can monitor the vertical movement of the lifting and clamping mechanism relative to the pre-assembled part; the displacement sensor can monitor the position of the gripper of the lifting and clamping mechanism.

[0015] (III) Beneficial Effects The beneficial effects of this invention are: The placement mechanism moves the solder and auxiliary materials to the first and second vision inspection mechanisms for visual inspection. Based on the inspection results, it drives the pick-up component to rotate at the corresponding angle to achieve angle compensation adjustment of the material picked up by the pick-up component, thereby improving the placement accuracy of the auxiliary materials on the main material and facilitating high-precision welding in subsequent processes.

[0016] The solder pick-up area, the first vision inspection mechanism, the placement area, the second vision inspection mechanism, and the auxiliary material pick-up area are sequentially arranged along the lateral transfer direction of the placement mechanism. After the placement mechanism completes solder pick-up at the solder pick-up area, it passes through the first vision inspection mechanism before moving to the auxiliary material pick-up area. This optimizes the vision inspection path, allowing for compensation and adjustment of the solder pick-up angle during the movement to the auxiliary material pick-up area. Similarly, after the placement mechanism moves to the auxiliary material pick-up area and completes pick-up of the auxiliary material, it passes through the second vision inspection mechanism before moving to the placement area. This also optimizes the vision inspection path, allowing for compensation and adjustment of the auxiliary material pick-up angle during the movement to the placement area. Before the placement process, this invention completes the compensation and adjustment of the material pick-up angle of solder and auxiliary materials, improving the placement accuracy of auxiliary materials on the main material; the visual inspection of solder and auxiliary materials does not occupy the additional movement path of the placement mechanism, and the visual inspection time is short, thus improving production efficiency. Attached Figure Description

[0017] Figure 1 This is a top view of the multi-auxiliary material mounting apparatus of the present invention; Figure 2 This is a schematic diagram of multiple working areas on the mounting platform of the present invention; Figure 3 This is a schematic diagram of the patch mechanism of the present invention; Figure 4 This is a schematic diagram of the solder feeding mechanism of the present invention; Figure 5 This is a schematic diagram of the auxiliary material feeding mechanism of the present invention; Figure 6 This is a schematic diagram of the main material feeding mechanism of the present invention; Figure 7 This is a schematic diagram of the main material transport mechanism of the present invention; Figure 8 This is a schematic diagram of the carrier clamping mechanism of the present invention in its in-situ state; Figure 9 This is a schematic diagram of the vehicle clamping mechanism of the present invention in the clamping state; Figure 10 This is a schematic diagram of the eutectic welding furnace body of the present invention; Figure 11 This is a schematic diagram of the pre-assembled component handling mechanism of the present invention; Figure 12 This is a schematic diagram of the finished product feeding mechanism of the present invention; Figure 13 This is a schematic diagram of the lifting and clamping mechanism of the present invention; Figure 14 This is a schematic diagram of the lifting and clamping mechanism of the present invention unloading material on the eutectic welding furnace body.

[0018] Explanation of reference numerals in the attached figures 1: Installation platform; 2: SMT assembly; 21: Solder pick-up area; 22: Sub-material pick-up area; 23: Gantry; 24: Solder mounting module; 25: First sub-material mounting module; 26: Second sub-material mounting module; 3: First visual inspection agency; 4: Main material transport mechanism; 41: Mounting area; 42: Longitudinal sliding module; 43: Main material carrier; 44: Carrier clamping mechanism; 441: Baffle; 442: Linear clamping strip assembly; 443: Driver; 444: Lead screw; 445: Adapter plate; 45: Carrier position feedback unit; 46: Clamp; 47: Clamping plate; 5: Second vision inspection agency; 6: Solder feeding mechanism; 7: Sub-material feeding mechanism; 71: First sliding module; 72: Chip box; 73: Pressing box; 8: Main material feeding mechanism; 81: Adjustable width track; 82: Carrier; 83: Detection sensor; 9: Main material handling mechanism; 10: Calibration parts; 20: Eutectic welding furnace body; 30: Pre-assembled parts handling mechanism; 301: Support frame; 302: Lateral sliding module; 303: Lifting and clamping mechanism; 3031: Rotary motor; 3032: Reducer; 3033: Frame; 3034: Clamping stepper motor; 3035: Gripper; 3036: Lifting motor; 304: Material sensor; 305: Displacement sensor; 40: Finished product unloading mechanism; 401: Second sliding module; 402: Finished product carrier; 403: Photoelectric sensor; 50: Pump source. Detailed Implementation

[0019] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0021] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0022] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; "connection" can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] See Figures 1 to 3This invention provides a multi-auxiliary material mounting device. The auxiliary materials include solder and secondary materials. The solder is used to weld (eutectic) the secondary materials onto the main material in subsequent processes. The multi-auxiliary material mounting device includes a mounting platform 1 and a mounting mechanism 2, a first vision inspection mechanism 3, a main material transport mechanism 4, and a second vision inspection mechanism 5 mounted on the mounting platform 1. The solder picking area 21 of the mounting mechanism 2, the mounting area 41 on the first vision inspection mechanism 3 and the main material transport mechanism 4, the second vision inspection mechanism 5, and the secondary material picking area 22 of the mounting mechanism 2 are sequentially arranged along the lateral transfer direction of the mounting mechanism 2. At least one picking element is slidably arranged on the mounting mechanism 2 along the lateral direction on the solder picking area 21 and the secondary material picking area 22. The picking element can rotate around its own axis. After picking up the solder or secondary material, the picking element can compensate and adjust the material picking angle at the first vision inspection mechanism 3 or the second vision inspection mechanism 5.

[0024] in, Figure 1 and Figure 2 In the diagram, the X-axis represents the horizontal direction, the Y-axis represents the vertical direction, and the vertical direction represents the height direction. In this embodiment, the main material is the pump source; the specific quantities of auxiliary materials, namely solder and secondary materials, are determined by setting a corresponding number of material handling components based on actual production needs.

[0025] In actual operation, the main material is loaded onto the main material transport mechanism 4, which moves to the mounting area 41 to await mounting. The mounting mechanism 2 picks up the solder in the solder picking area 21 and the auxiliary material in the auxiliary material picking area 22, and then mounts the solder and auxiliary material onto the main material accordingly. The mounting mechanism 2 moves the solder and auxiliary material to the first vision inspection mechanism 3 and the second vision inspection mechanism 5 for vision inspection. Based on the inspection results, the picking component is driven to rotate at the corresponding angle to achieve angle compensation adjustment of the material picked up by the picking component, thereby improving the mounting accuracy of the auxiliary material on the main material and facilitating high-precision welding in subsequent processes.

[0026] The solder pick-up area 21, the first vision inspection mechanism 3, the placement area 41, the second vision inspection mechanism 5, and the auxiliary material pick-up area 22 are sequentially arranged along the lateral transfer direction of the placement mechanism 2. After the placement mechanism 2 completes solder pick-up at the solder pick-up area 21, it passes through the first vision inspection mechanism 3 before moving to the auxiliary material pick-up area 22. This optimizes the vision inspection path, allowing the compensation adjustment of the solder pick-up angle to be completed during the movement to the auxiliary material pick-up area 22. Similarly, after the placement mechanism 2 moves to the auxiliary material pick-up area 22 and completes the pick-up of the auxiliary material, it passes through the second vision inspection mechanism 5 before moving to the placement area 41. This optimizes the vision inspection path, allowing the compensation adjustment of the auxiliary material pick-up angle to be completed during the movement to the placement area 41. Before the placement process, the present invention completes the compensation and adjustment of the material picking angle of solder and auxiliary materials, which improves the placement accuracy of auxiliary materials on the main material; the visual inspection of solder and auxiliary materials does not occupy the additional movement path of the placement mechanism 2, and the visual inspection time is short, thus improving production efficiency.

[0027] Furthermore, the placement mechanism 2 includes a gantry 23 mounted on the mounting platform 1, and solder placement modules 24, a first sub-material placement module 25, and a second sub-material placement module 26 slidably mounted on the gantry 23. Each of the solder placement module 24, the first sub-material placement module 25, and the second sub-material placement module 26 is equipped with a material picking component. Specifically, the material picking component can be a suction nozzle, which picks up or releases materials through negative pressure or vacuum adsorption. This nozzle is highly adaptable to materials of different shapes and provides a gentle picking method, effectively protecting small materials, improving finished product yield, and meeting the stringent process requirements of the micro-assembly field. In this embodiment, the solder placement module 24, the first sub-material placement module 25, and the second sub-material placement module 26 can all slide along the X-direction on the gantry 23 and can rise and fall vertically. They also integrate a compensating motor for rotating the material picking component. Solder placement module 24 is equipped with a solder sheet picker, first sub-material placement module 25 is equipped with a pressure block picker, and second sub-material placement module 26 is equipped with a chip picker. The corresponding picker picks up the corresponding material, and the material picking angle is compensated and adjusted at the first vision inspection mechanism 3 or the second vision inspection mechanism 5 to ensure the material picking accuracy of each picker, and finally achieve high-precision placement of multiple auxiliary materials on the main material.

[0028] The placement mechanism 2 is the core actuator for achieving simultaneous multi-material operation and high-precision placement of the entire machine. It undertakes the precise picking and placement of solder sheets, pressure blocks, and chips, while integrating vision positioning and overall support functions, laying the foundation for the high stability and efficiency of the entire machine. The placement mechanism 2 has a compact and reasonable layout, adaptable to the process requirements of multi-auxiliary material collaborative placement on the pump source. The solder sheet suction nozzle is responsible for the precise gripping and placement of solder sheets. Utilizing a dedicated suction nozzle structure and vacuum control module, it can stably adsorb solder sheets and ensure accurate placement, avoiding solder sheet misalignment, damage, or missed placement, providing a reliable solder base for subsequent eutectic soldering. The pressure block suction nozzle focuses on the picking and positioning of pressure blocks. Through customized nozzle design and precise force control adjustment, it ensures tight adhesion and accurate positioning between the pressure block and the chip, meeting the stability requirements of the assembly structure. The chip suction nozzle, as the core placement unit, is adapted for high-precision gripping of micro-miniature pump source chips, possessing low-damage adsorption and ultra-precision alignment capabilities, enabling precise bonding between the chip and the solder sheet, ensuring efficient photoelectric transmission.

[0029] In this embodiment, one auxiliary material corresponds to one mounting module on the gantry 23. Each mounting module independently adjusts the material pickup angle at the first vision inspection mechanism 3 or the second vision inspection mechanism 5. On the right side of the mounting area 41, there are two auxiliary materials: a pressure block and a chip. During the transfer of the two auxiliary materials to the mounting area 41, the material pickup angle is adjusted sequentially at the second vision inspection mechanism 5.

[0030] See Figure 4 and Figure 5 The solder pick-up area 21 and the auxiliary material pick-up area 22 are respectively provided with a solder feeding mechanism 6 and an auxiliary material feeding mechanism 7; the multi-auxiliary material mounting device also includes a main material feeding mechanism; the main material feeding mechanism includes a main material feeding mechanism 8 and a main material transport mechanism 9, which are respectively installed on the mounting platform 1; the main material transport mechanism 9 can rotate between the main material feeding mechanism 8 and the main material transport mechanism 4; the main material transport mechanism 4 can slide longitudinally to transport the main material to the mounting area 41. Specifically, the chip mounting mechanism 2 picks up the material at the solder pick-up area 21, i.e., the solder feeding mechanism 6, and the chip mounting mechanism 2 picks up the material at the auxiliary material pick-up area 22, i.e., the auxiliary material feeding mechanism 7, while the main material transport mechanism 9 can transport the main material from the main material feeding mechanism 8 to the main material transport mechanism 4. The main material transport mechanism 4 is arranged along the Y-direction, with the first end as the loading position, the middle as the mounting area 41, and the last end as the unloading position. It can work in conjunction with the main material handling mechanism 9 and the chip placement mechanism 2. In this embodiment, the solder feeding mechanism 6 provides solder sheets, the auxiliary material feeding mechanism 7 provides clamping blocks and chips, and the main material handling mechanism 9 provides the pump source. By optimizing the equipment layout and workflow, high-precision placement of main materials, solder, and auxiliary materials in the mounting area 41 is achieved within a short travel distance.

[0031] In one embodiment, the solder feeding mechanism 6 is a feeder component, which is the core unit for the equipment to achieve automated, continuous, and high-precision feeding of small materials such as solder sheets. It is specifically designed for the supply of micro-volume solder in the pump source mounting and soldering process, and can stably output materials such as solder sheets, providing accurate and efficient material support for the placement mechanism 2, ensuring the cycle time and placement quality of the entire automated production line. The solder feeding mechanism 6 adopts a modular design, with a compact structure and convenient replacement. It can be flexibly adapted according to the specifications (size, thickness) of materials such as solder sheets, and is compatible with the production needs of multiple product models. The solder feeding mechanism 6 integrates a precision drive system and a material conveying mechanism. Driven by a stepper motor or servo motor, and in conjunction with high-precision guide rails and transmission components, it achieves smooth material conveying and precise indexing, ensuring that each piece of material can be delivered to the designated picking position according to the preset trajectory and cycle time, with high repeatability and positioning accuracy, avoiding material deviation, jamming, or damage. Meanwhile, the solder feeding mechanism 6 is equipped with material detection sensors and a material shortage warning function, which can monitor the remaining amount of the material strip and the material arrival status in real time. When a material shortage or abnormal feeding is detected, it promptly sends a signal to the control system, triggering a shutdown warning or automatic material replacement prompt, avoiding problems such as empty feeding or missed feeding, and ensuring the continuity and stability of the material supply. In addition, the components support quick disassembly and maintenance, and the material tray is easy to install, which can effectively shorten the changeover time and maintenance cycle, improve the overall operating efficiency of the equipment, and adapt to the needs of large-scale, high-cycle pump source production.

[0032] The auxiliary material feeding mechanism 7 includes a first sliding module 71, a chip cassette 72, and a compact cassette 73. The first sliding module 71 is mounted on the mounting platform 1. The chip cassette 72 is mounted on the first sliding module 71, and the first sliding module 71 can drive the chip cassette 72 to move along the X and Y axes. Specifically, the auxiliary material feeding mechanism 7 is a key functional unit for the equipment to achieve automatic feeding, precise positioning, and stable gripping of chips and compacts. It mainly consists of two parts: a dedicated waffle box for loading chips and compacts and a dual linear module drive mechanism, providing a stable and reliable material supply guarantee for subsequent high-precision mounting and soldering. The auxiliary material feeding mechanism 7 is equipped with two dedicated waffle boxes, which are used for the orderly loading of chips and compacts. The box size, slot layout, and load-bearing specifications can be flexibly customized according to product models and production needs to adapt to the feeding requirements of pump source chips and compacts of different specifications. The waffle box is fixed using vacuum adsorption, ensuring reliable clamping and precise positioning. This allows the robot to quickly and stably complete loading and unloading operations, effectively preventing material shifting, shaking, or collision damage. The accompanying vacuum pipeline integrates a high-precision flow control system, which can monitor vacuum pressure and adsorption status in real time, ensuring strong adsorption and stable operation. Any abnormalities such as air leakage or adsorption failure can be promptly reported, guaranteeing continuous and reliable loading. The linear module drive mechanism features independent X and Y axis motion control. Through high-precision servo drive and precise motion trajectory planning, it can smoothly and efficiently transport the compressed blocks and chips loaded in the waffle box to the designated picking position, cooperating with the robot for precise gripping. The module operates smoothly, with high repeatability and fast response, meeting the stringent requirements for positional accuracy, motion stability, and cycle consistency in chip and compressed block loading, providing solid support for the automation and high-precision operation of the entire machine.

[0033] See Figure 6The main material feeding mechanism 8 includes an adjustable-width track 81 mounted on the mounting platform 1, a carrier 82 mounted on the adjustable-width track 81, and a detection sensor 83. The adjustable-width track 81 can adjust its width longitudinally; the carrier 82 is slidably mounted on the adjustable-width track 81 laterally; the detection sensor 83 can perform online monitoring of the main material on the adjustable-width track 81 and monitor its position on the adjustable-width track 81. Specifically, the main material feeding mechanism 8 is the core module for realizing automatic feeding, precise positioning, and stable conveying of the pump source. The adjustable-width track 81 can flexibly adjust its width according to different models and sizes of pump sources, accommodating feeding of multiple specifications of products and improving the equipment's versatility and changeover efficiency. The adjustable-width track 81 integrates a stepper motor, which, in conjunction with a precision transmission system, provides stable and controllable power for track conveying, ensuring smooth pump source conveying and precise start-stop. The detection sensor 83 can be equipped with a laser sensor, and the number can be set reasonably based on the detection requirements. When combined with detection elements such as laser sensors, it can monitor the arrival and real-time position of the pump source in real time, realize material tracking and status feedback, ensure stable, reliable and automated operation of the feeding process, and work with the main material handling mechanism 9 to pick up materials with high precision.

[0034] like Figure 7 As shown, the main material transport mechanism 4 includes a longitudinal sliding module 42, a main material carrier 43, a carrier clamping mechanism 44, and a carrier position feedback unit 45. The longitudinal sliding module 42 is mounted on the mounting platform 1. The bottom of the carrier clamping mechanism 44 is slidably connected to the longitudinal sliding module 42 along the longitudinal direction, and the top clamps the main material carrier 43. The carrier position feedback unit 45 can collect and feedback the displacement information of the main material carrier 43. Specifically, the main material transport mechanism 4 is the core functional component for achieving high-precision and high-stability transfer of the pump source within the equipment. The main material carrier 43 is detachably connected to the carrier clamping mechanism 44, facilitating the disassembly and assembly of the main material carrier 43, allowing for the replacement of different models of main material carriers 43 to meet the transfer requirements of different main materials. The main material carrier 43 is used to stably support the pump source, ensuring reliable material posture during transport. The carrier clamping mechanism 44 can reliably clamp and fix the pump source, preventing displacement or shaking of the pump source during high-speed movement. The longitudinal sliding module 42 uses a flat linear motor to provide direct and efficient power output to the module. Combined with a high-rigidity linear guide, it achieves smooth movement and rapid response. The carrier position feedback unit 45 can optionally include a grating ruler and a reading head to form a high-precision position feedback unit. This unit collects and feeds back motion displacement information in real time, forming a closed-loop control system. This ensures the positioning accuracy and repeatability of the pump source during transportation, meeting the stringent requirements of automated production lines for high-speed, high-precision transport.

[0035] See Figure 8The carrier clamping mechanism 44 includes a baffle 441, a linear clamping strip group 442, and a driver 443. The linear clamping strip group 442 includes multiple clamping strips arranged in an array along the length of the baffle 441. The driver 443 can synchronously drive the linear clamping strip group 442 to move closer to or away from the baffle 441 to clamp or release the main material. The main material carrier 43 uses negative pressure to adsorb the main material. Specifically, the main material handling mechanism 9, as the core actuator of the entire feeding system, precisely clamps the pump source sequentially according to a preset rhythm and smoothly transfers it to the designated workstation of the carrier clamping mechanism 44 for placement. During the placement process, through mechanical positioning constraints, it is ensured that one end face of the pump source can closely fit the preset placement stop on the carrier, that is, the inner side of the baffle 441, thereby achieving the initial reference positioning of the pump source in the carrier and providing a reliable position reference for subsequent clamping and mounting processes. At this time, the carrier clamping mechanism 44 remains in its initial standby position, fully released. The linear clamping bar assembly 442 will not interfere with the placement of the pump source, ensuring a smooth, collision-free, and scratch-free loading process. Once the pump source is positioned on the carrier and has completed its reference positioning, the driver 443 starts operating. Driven by the driver 443 (optional servo motor), the linear clamping bar assembly 442 moves smoothly and with high precision along the linear guide rail via a high-precision lead screw, with the movement strictly following the X-axis direction. As the linear clamping bar assembly 442 continues to move until its working surface is completely in contact with the other end face of the pump source, clamping the pump source is achieved. Throughout the clamping process, the clamping force is precisely controlled by the torque output from the driver 443. By setting reasonable torque parameters, sufficient clamping force is ensured to fix the pump source in position, while effectively preventing deformation of the pump source housing and damage to internal components due to excessive clamping force. Once the clamping action is in place, the motor immediately releases the torque and no longer applies driving force. It maintains the positioning state solely through the static friction between the clamping block and the pump source, thereby reducing energy consumption and extending the service life of the mechanism.

[0036] In this embodiment, the bottom of the clamping bar is connected to an adapter plate 445 by screws. Depending on the type of main material, a corresponding clamping bar can be replaced to improve the adaptability of the carrier clamping mechanism 44 to clamp different types of main materials. The adapter plate 445 includes a horizontal plate and a vertical plate connected vertically. A driver 443 is connected to a lead screw 444 and can drive the lead screw 444 to rotate. The vertical plate is screwed onto the lead screw 444 to form a lead screw slider drive module. The linear clamping bar assembly 442 is mounted on the horizontal plate by screws. The driver 443 can drive the linear clamping bar assembly 442 to move closer to or away from the baffle 441 to clamp or release the main material.

[0037] Compared to clamping components such as clamping plates, the linear clamping strip assembly 442 consists of multiple clamping strips arrayed along the length of the baffle 441. The interaction force between the clamping strips is small, allowing each strip to fully conform to the other end face of its corresponding pump source, ensuring clamping and positioning accuracy. Furthermore, simultaneously with the release of torque by the driver 443, a negative pressure air source is introduced into the vacuum suction cup integrated on the main material carrier 43. This negative pressure adsorption firmly adheres the pump source to the carrier surface, further enhancing the stability of the pump source in subsequent mounting processes and preventing positional shifts, shaking, or even detachment during high-speed movement or station transitions. The vacuum adsorption structure employs a lightweight, high-response design, providing stable adsorption force while enabling rapid airflow adsorption and rapid vacuum release. This balances positioning reliability with production cycle efficiency, truly meeting the rapid pick-and-place requirements of automated production lines while ensuring assembly stability.

[0038] Optionally, during the clamping process, negative pressure is simultaneously activated to enhance the placement stability of the pump source on the main material carrier 43. The negative pressure value should ensure that the pump source can slide on the main material carrier 43 under the clamping force, thereby improving the stability of the pump source movement during clamping and effectively preventing the bottom part of the pump source from being hollowed out due to the squeezing and pushing of the linear clamping strips 442. This improves the clamping and positioning accuracy of the pump source on the main material carrier 43 after clamping. After clamping is completed, the negative pressure can be increased to perform vacuum adsorption, ensuring the stability of the pump source on the main material carrier 43.

[0039] like Figure 9As shown, the main material transport mechanism 4 also includes a pair of clamping assemblies correspondingly disposed on both sides of the main material carrier 43; the clamping assemblies include clamps 46 mounted on the carrier clamping mechanism 44, and clamping plates 47 connected to the clamps 46; the clamps 46 can drive the clamping plates 47 to rotate and / or move up and down in the vertical direction; slots are correspondingly opened on both sides of the main material carrier 43; the pair of clamping plates 47 can be engaged or disengaged from the pair of slots correspondingly. In this embodiment, the main material carrier 43 and the base plate at the top of the carrier clamping mechanism 44 are connected by a rotary cylinder pressing method. Of course, locking or unlocking can also be achieved by raising and lowering the clamping plates 47, and rotation and lifting actions can also be integrated on the clamps 46. This connection method eliminates the cumbersome steps of traditional bolt tightening. The carrier can be clamped and loosened / disassembled via the rapid extension and rotation of a rotary cylinder. This allows for quick carrier replacement when different shapes and sizes of pump sources need to be mounted, significantly reducing changeover downtime and improving the equipment's flexible production capabilities. Optionally, a precision pin connection structure is also provided between the main carrier 43 and the substrate. Through the high-precision fit of the positioning pin and pin hole, while enabling rapid replacement, it effectively ensures the positional accuracy, parallelism, and perpendicularity of the carrier after repeated installation. This ensures that the positioning reference of the pump source remains highly consistent after each replacement, providing a stable and reliable structural guarantee for subsequent high-precision mounting processes.

[0040] In addition, the main material feeding mechanism 8 and / or the auxiliary material feeding mechanism 7 are respectively equipped with calibration components 10 as calibration references. The calibration components 10 provide a precise visual reference for the robot to load or unload materials, which facilitates the camera on the robot to identify the calibration position, ensuring that the robot picks up materials at the designated workstation or unloads materials to the designated workstation, thereby improving the positional accuracy during the material turnover process.

[0041] In addition, the present invention also provides a eutectic bonding machine, see [link to relevant documentation]. Figure 10 and Figure 11 The eutectic bonding machine includes the aforementioned multi-auxiliary material mounting device; it also includes a eutectic welding furnace body 20 mounted on the mounting platform 1 and a pre-assembled part handling mechanism 30; the eutectic welding furnace body 20 is located on one side of the main material transport mechanism 4; the pre-assembled part handling mechanism 30 can pick up pre-assembled parts from the main material transport mechanism 4 and unload them into the eutectic welding furnace body 20. Specifically, the bonding mechanism 2 and the main material transport mechanism 4 cooperate in the bonding area 41 to complete the pre-mounting of auxiliary materials onto the main material; after the pre-mounting is completed, the main material transport mechanism 4 moves the pre-assembled parts to the unloading position, where the pre-assembled part handling mechanism 30 picks up the pre-assembled parts and unloads them onto the eutectic welding furnace body 20. The eutectic welding furnace body 20 automatically completes the welding of the pre-assembled parts to obtain the finished workpiece. The finished workpiece is then unloaded according to a preset path.

[0042] The eutectic welding furnace body 20 employs a high-vacuum chamber and a precision temperature control architecture, effectively eliminating bubbles at the welding interface, significantly reducing void ratio, and improving weld thermal conductivity and structural strength. The eutectic welding furnace body 20 integrates a vacuum system, an atmosphere control system, a multi-zone uniform heating module, a rapid cooling unit, and a fully closed-loop intelligent control system. It can automatically complete the entire process of heating, holding, eutectic bonding, and cooling according to the process curve, ensuring consistent welding quality and long-term reliability. The heating module uses independent PID temperature control in different zones and a highly uniform heating platform, ensuring high temperature control accuracy and a uniform temperature field, avoiding welding defects caused by localized overheating or temperature differences. The vacuum and atmosphere system creates an oxygen-free, clean welding environment, inhibiting workpiece oxidation. Combined with an optional formic acid reduction function, it further improves the wettability and adhesion of the weld interface. The cooling system supports rapid cooling via air / water cooling, shortening the process cycle and improving production efficiency. The machine features automated docking, process parameter storage, real-time monitoring, and anomaly alarm functions. It can seamlessly link with corresponding feeding, handling, and unloading mechanisms to achieve fully automated operation of the pump source from feeding and welding to discharging, meeting the comprehensive requirements of mass production lines for stability, precision, and efficiency.

[0043] See Figure 12 In this embodiment, the eutectic bonding machine also includes a finished product unloading mechanism 40. The finished product unloading mechanism 40 includes a second sliding module 401 disposed on the mounting platform 1, and a finished product carrier 402 slidably connected to the second sliding module 401. Specifically, the finished product unloading mechanism 40 is a key unit for the transfer and organization of finished products after the equipment completes the bonding and welding. The overall design focuses on the requirements of efficient, accurate, and stable unloading, realizing the automated collection and status monitoring of finished product pump sources. As the core of finished product carrying, the finished product carrier 402 adopts a regular layout design adapted to the shape of the pump source, which can stably hold the finished products after unloading, avoid workpiece displacement and collision during the transfer process, and ensure the integrity of the product's appearance and performance. The carrier structure is detachable and easy to clean, facilitating subsequent batch transfer and maintenance of finished products. The second sliding module 401 can be an optional linear module, which provides precise power drive for the unloading process. Through smooth linear motion in the X / Y directions, it drives the carrier or gripping mechanism to accurately transport the finished product pump source from the welding station to the designated unloading area. The module has a rapid response and high repeatability, ensuring consistent unloading position and adapting to the cycle time requirements of automated production lines.

[0044] Optionally, a calibration component 10 is provided on the finished product carrier 402. The calibration component 10 serves as a blanking calibration piece, providing a precise benchmark for visual positioning, assisting the robot or vision system in quickly identifying the carrier's positioning coordinates, ensuring that the finished product pump source is accurately placed in the designated position on the finished product carrier 402, further improving the regularity and accuracy of blanking and placement, and providing convenience for subsequent quality inspection and packaging processes.

[0045] Optionally, the finished product unloading mechanism 40 also includes a photoelectric sensor 305 mounted on the mounting platform 1. As a core component for status detection, the photoelectric sensor 305 monitors the unloading status of the finished product and the fullness of the carrier in real time. Once it detects that the finished product is in place or the carrier is full, it promptly sends a signal to the control system to realize the linkage start and stop of the unloading action and the fullness warning, ensuring the continuous and orderly unloading process, avoiding problems such as missing or stacking, and improving the automation and reliability of the equipment operation.

[0046] like Figure 13 and Figure 14 As shown, the pre-assembled part handling mechanism 30 includes a bracket 301 mounted on the mounting platform 1, and a transverse sliding module 302 and a lifting clamping mechanism 303 mounted on the bracket 301. The lifting clamping mechanism 303 is mounted on the transverse sliding module 302. A material sensor 304 and a displacement sensor 305 are provided on the lifting clamping mechanism 303. The material sensor 304 can monitor the vertical movement of the lifting clamping mechanism 303 relative to the pre-assembled part; the displacement sensor 305 can monitor the position of the grippers of the lifting clamping mechanism 303. Specifically, the pre-assembled part handling mechanism 30 mainly undertakes the automatic handling, picking, and station transfer tasks of the pump source before and after entering the furnace body, and is a key actuator for achieving seamless connection between processes before and after entering the furnace body. The overall structure is compact, the movement is stable, and the positioning accuracy is high, meeting the continuous and reliable transfer requirements of fully automated equipment. The lateral sliding module 302 provides linear motion in the X direction for the mechanism. Through high-precision guide rails and servo control, it enables smooth and rapid translation of pre-assembled parts or finished products between different workstations, ensuring accurate transfer paths and smooth operation. The bracket 301 provides rigid support and a mounting foundation for the entire mechanism. It adopts a high-strength welded structure, possessing good stability and deformation resistance. It can effectively ensure the overall rigidity and positioning accuracy of each motion module under high-speed and frequent movements, providing a guarantee for the long-term stable operation of the equipment.

[0047] The lifting and clamping mechanism 303 is the core actuator for grasping, adjusting the posture, and positioning the pump source. Clamping action: Utilizing a stepper motor and belt drive, it achieves stable and reliable clamping of the pump source, with fast response and moderate clamping force to avoid workpiece damage. Rotation action: Driven by a servo motor and a high-precision reducer, it allows for precise adjustment of the pump source angle, meeting the workpiece posture requirements of different workstations and ensuring the accuracy of subsequent process connections. Lifting action: Achieved through a servo motor and precision lead screw drive, it features smooth movement, accurate positioning, and high repeatability. It allows for flexible adjustment of the workpiece height to adapt to the furnace inlet and various workstation heights. The entire mechanism, through multi-axis collaborative control, completes a series of complex actions including clamping, lifting, rotation, and translation, achieving automated and high-precision transfer of the pump source before and after the furnace, effectively improving the overall operating efficiency and process stability of the equipment.

[0048] The lifting and clamping mechanism 303 is the core actuator connecting the upstream material feeding and eutectic furnace mounting processes. Through an automated cycle of "signal triggering - lifting and picking - rotation reversal - linear transfer - precise placement," it achieves efficient and precise transfer of the pump source between designated workstations. The entire process is controlled in conjunction with sensor feedback and preset parameters, adapting to the size and layout requirements of the eutectic furnace cavity. The lifting and clamping mechanism 303 includes a lifting motor 3036, a reducer 3032, a frame 3033, a clamping stepper motor 3034, and grippers 3035. The clamping drive adopts a transmission structure of clamping stepper motor 3034, synchronous pulley, and synchronous belt. The grippers 3035 are fixed to the frame 3033 on the synchronous belt. The bidirectional movement of the synchronous belt realizes the opening and closing of the grippers 3035, ensuring smooth and highly synchronized clamping action. The lifting motor 3036 outputs torque after being reduced by the reducer 3032, ensuring the angular accuracy and stability of the pump source during rotation.

[0049] The complete operating procedure of the lifting and clamping mechanism 303 includes: 1. Signal Triggering and Initial Preparation In the standby state, the gripper 3035 is in the released state, the lifting motor 3036 is in the high position, and the linear module is located at the initial transfer station (near the unloading position of the main material transport mechanism 4). When the system receives the pre-assembled part arrival signal (the previous process confirms that the pre-assembled part has been accurately placed at the picking station), the component starts the action process, and all drive mechanisms operate in conjunction according to the preset program.

[0050] 2. Lifting motor 3036 operates: Gripper 3035 descends and approaches the pre-installed component. The lifting motor 3036 starts first, driving the frame 3033 to move downwards vertically. During the movement, the closing direction of the gripper 3035 is clearly defined as the X direction (consistent with the direction of subsequent clamping actions, ensuring proper posture adaptation in advance). During the descent, the lifting motor 3036 operates smoothly at a preset speed to avoid impact. When the lower end of the gripper 3035 approaches the preset height of the bottom surface of the pre-installed part, the system continuously monitors the feedback signal from the material sensor 304 until the sensor detects that the gripper 3035 has reached the "pickup ready position". At this point, a stop command is sent to the lifting motor 3036, and the lifting motor 3036 stops precisely, completing the descent positioning. At this time, the gripper 3035 maintains a reasonable gap with the side of the pre-installed part, avoiding contact with the workpiece and shortening the subsequent clamping stroke.

[0051] 3. Clamping stepper motor 3034 action: Gripper 3035 synchronously clamps the workpiece. After the lifting motor 3036 comes to a complete stop, the clamping stepper motor 3034 immediately starts, and its power is transmitted to the synchronous belt through the synchronous pulley. Since the opposing grippers 3035 are locked on the synchronous belt, the bidirectional traction of the synchronous belt drives the two sets of grippers 3035 to move towards the center simultaneously along the X direction. In this embodiment, the auxiliary materials are pre-attached inside the pump source. Therefore, the movement stroke of the grippers 3035 is executed according to the preset parameters of the dimensions of different specifications of pre-assembled parts, i.e., the pump source, to ensure compatibility with various workpiece models. During the clamping process, the displacement sensor 305 (optional photoelectric sensor) monitors the position of the grippers 3035 in real time. When the grippers 3035 move to the preset clamping position (closely fitting the side of the pump source, the clamping force meets the transfer requirements, and does not damage the workpiece surface), the displacement sensor 305 sends a "clamping in place signal" to the control system, and the clamping stepper motor 3034 stops operating, completing the reliable clamping of the pre-assembled parts.

[0052] 4. Lifting and rotation linkage: workpiece pickup and reversal After the pre-assembled part is clamped in place and confirmed, the rotary motor 3031 starts in reverse, driving the gripper 3035 to lift the pre-assembled part vertically upwards, thus picking up the workpiece. During the upward movement, the rotary motor 3031 starts synchronously, and the output speed is reduced by the reducer 3032, causing the pre-assembled part in the gripper to rotate 90°. This rotation is based on the dimensional layout design of the eutectic furnace cavity, aiming to ensure that the posture of the pre-assembled part perfectly matches the placement requirements of the heating platform inside the furnace when it reaches the top of the eutectic furnace, avoiding interference with the furnace structure. Throughout the entire linkage process, the lifting speed and rotation speed are optimized to ensure that the pre-assembled part remains stable, without shaking or deviation, during movement and reversal.

[0053] 5. Linear module transfer: The workpiece is transferred to the area above the eutectic furnace. After the pre-assembled part completes a 90° rotation and the lifting mechanism 3036 reaches the preset upper limit, the linear module of the pre-assembled part entering and exiting the oven starts, driving the entire assembly holding the pre-assembled part to move horizontally along the X-axis. High-precision positioning control is used during the linear module's operation to ensure accurate transfer trajectory and prevent workpiece deviation. When the assembly moves to the preset unloading position above the eutectic furnace body, the linear module's position detection sensor sends a "positioning signal," and the module stops operating. At this point, the pre-assembled part is precisely above the eutectic furnace heating platform, preparing for the subsequent lowering action.

[0054] 6. Precise placement and reset: Completes a single cycle. Upon reaching the unloading position, the lifting motor 3036 restarts, driving the gripper 3035 to move the pre-assembled part vertically downwards, slowly lowering it onto the heating platform of the eutectic furnace. Once the pre-assembled part smoothly contacts the platform, the system receives a platform contact feedback signal. The clamping stepper motor 3034 reverses its movement, driving the synchronous belt to release the gripper along the X-axis, detaching it from the pre-assembled part. After the gripper 3035 is fully released, the lifting motor 3036 starts, lifting the entire gripper 3035 upwards to its initial high position. Simultaneously, the linear module reverses its movement, moving the mechanism along the X-axis back to the initial pick-up station, awaiting the next pre-assembled part arrival signal to begin the next cycle. This entire process, through multi-motor coordination and real-time sensor feedback, achieves automated and precise pre-assembled part transfer. It meets the layout and positioning requirements of the eutectic furnace process while adapting to the transfer needs of pre-assembled parts of different specifications, ensuring production cycle time and operational stability.

[0055] Overall workflow in one embodiment: The robot places the pump source to the main material feeding mechanism 8. After placement, the main material feeding mechanism 8 moves the pump source along the X-axis to the loading position of the main material handling mechanism 9. The main material handling mechanism 9 then picks up the pump source and moves it along the X-axis to the loading position of the main material transport mechanism 4. The robot places the waffle box containing the briquette and chip to the auxiliary material feeding mechanism 7, and then the linear module in the auxiliary material feeding mechanism 7 moves to the picking position of the chip mounting mechanism 2, waiting for the briquette nozzle and chip nozzle to pick up the chip. Solder feeding mechanism 6 removes the film from the solder sheet reel, and waits for the solder sheet pick-up nozzle in the chip mounting mechanism 2 to pick it up. The placed pump source moves along the Y-axis from the loading position of the main material transport mechanism 4 to the mounting area 41; The placement mechanism 2 picks up solder sheets, chips and pressure blocks from the auxiliary material feeding mechanism 7 and the solder feeding mechanism 6 respectively. After being positioned and corrected by the first vision inspection mechanism 3 and the second vision inspection mechanism 5, it goes to the placement area 41 to place the pump source placed in the main material transport mechanism 4. After the pump source completes the mounting action in the mounting area, it is moved by the main material transport mechanism 4 to the pre-mounted part handling mechanism 30, and the pre-mounted part handling mechanism 30 picks up the pre-mounted part and moves it along the X-axis to the eutectic welding furnace body 20. The pre-assembled parts enter the eutectic welding furnace body 20 for high-temperature heating and welding. After welding is completed, the pre-assembled parts handling mechanism 30 picks up the welded finished products and transports them to the finished product unloading mechanism 40. The finished product unloading mechanism 40 moves the finished product along the X-axis to the robot arm pickup point.

[0056] The eutectic bonding machine of this invention is tailored for high-precision placement and soldering of chips inside pump sources. It can achieve fully automated operation from raw material loading to finished product unloading, completely replacing the traditional manual operation mode. The equipment can automatically complete the precise loading, positioning, and conveying of key materials such as pump sources to be mounted, blocks, chips, and solder, as well as the integrated execution of mounting and soldering processes. After the operation is completed, the finished pump sources are also automatically unloaded, transferred, or collected by robots. The entire process requires no human intervention, significantly reducing labor input and production and operation costs, while effectively avoiding errors, fatigue, and safety risks caused by human operation.

[0057] Thanks to the fully automated operation mode, the overall stability of the equipment has been greatly improved. The mounting and welding processes are not affected by factors such as the skill level and working status of the operators, and the consistency of product quality and process repeatability are reliably guaranteed, effectively improving the yield rate and production cycle, and meeting the needs of large-scale and standardized production.

[0058] The placement module integrates a high-precision mechanical structure and an advanced force control system, enabling precise force control and position compensation during the placement process. This ensures stable material placement and accurate positioning, preventing chip damage and positional misalignment, and meeting the stringent process requirements of the micro-assembly field. Simultaneously, the overall equipment operation adopts a full feedback closed-loop control system. Through real-time data acquisition and status monitoring, it dynamically tracks the operational status of each stage, including loading, alignment, placement, soldering, and unloading. This allows for rapid anomaly identification, precise adjustment, and stable output, further enhancing equipment reliability and operational accuracy, and providing solid equipment support for the high performance and high reliability of pump source products.

[0059] It should be understood that the above description of specific embodiments of the present invention is only for illustrating the technical approach and features of the present invention, and is intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the present invention is not limited to the specific embodiments described above. All changes or modifications made within the scope of the claims of the present invention should be covered within the protection scope of the present invention.

Claims

1. A multi-auxiliary material mounting device, characterized in that, The multi-auxiliary material mounting device includes a mounting platform (1) and a patching mechanism (2), a first visual inspection mechanism (3), a main material transport mechanism (4), and a second visual inspection mechanism (5) mounted on the mounting platform (1). The solder picking area (21) of the mounting mechanism (2), the first visual inspection mechanism (3), the mounting area (41) on the main material transport mechanism (4), the second visual inspection mechanism (5) and the auxiliary material picking area (22) of the mounting mechanism (2) are arranged sequentially along the transverse transfer direction of the mounting mechanism (2); At least one picking member is slidably disposed on the patch mechanism (2) in the solder picking area (21) and the auxiliary material picking area (22). The picking member can rotate around its own axis. After picking up the solder or auxiliary material, the picking member can adjust the material picking angle at the first vision inspection mechanism (3) or the second vision inspection mechanism (5).

2. The multi-auxiliary material mounting device according to claim 1, characterized in that, The chip mounting mechanism (2) includes a gantry (23) mounted on the mounting platform (1), and a solder mounting module (24), a first sub-material mounting module (25), and a second sub-material mounting module (26) slidably mounted on the gantry (23). The solder mounting module (24), the first sub-material mounting module (25), and the second sub-material mounting module (26) are respectively provided with the material picking component.

3. The multi-auxiliary material mounting device according to claim 1 or 2, characterized in that, The solder feeding area (21) and the auxiliary material feeding area (22) are respectively provided with a solder feeding mechanism (6) and an auxiliary material feeding mechanism (7); the multi-auxiliary material mounting device also includes a main material feeding mechanism; The main material feeding mechanism includes a main material feeding mechanism (8) and a main material handling mechanism (9) installed on the mounting platform (1); the main material handling mechanism (9) can rotate between the main material feeding mechanism (8) and the main material transport mechanism (4); The main material transport mechanism (4) can slide longitudinally to transport the main material to the mounting area (41).

4. The multi-auxiliary material mounting device according to claim 3, characterized in that, The main material feeding mechanism (8) includes an adjustable width track (81) mounted on the mounting platform (1), and a carrier (82) and a detection sensor (83) mounted on the adjustable width track (81). The adjustable width track (81) can adjust the track width longitudinally; the vehicle (82) is slidably mounted on the adjustable width track (81) laterally; The detection sensor (83) can monitor the main material on the adjustable width track (81) online and monitor the position of the main material on the adjustable width track (81).

5. The multi-auxiliary material mounting device according to claim 3, characterized in that, The main material transport mechanism (4) includes a longitudinal sliding module (42), a main material carrier (43), a carrier clamping mechanism (44), and a carrier position feedback unit (45). The longitudinal sliding module (42) is mounted on the mounting platform (1); The bottom of the carrier clamping mechanism (44) is slidably connected to the longitudinal sliding module (42) in the longitudinal direction, and the top clamps the main material carrier (43). The vehicle position feedback unit (45) can collect and feedback the displacement information of the main material vehicle (43).

6. The multi-auxiliary material mounting device according to claim 5, characterized in that, The carrier clamping mechanism (44) includes a baffle (441), a linear clamping bar assembly (442), and a driver (443). The linear clamping bar group (442) includes multiple clamping bars arranged in an array along the length direction of the baffle (441); the driver (443) can synchronously drive the linear clamping bar group (442) to move closer to or away from the baffle (441) to clamp or release the main material; The main material carrier (43) adsorbs the main material under negative pressure.

7. The multi-auxiliary material mounting device according to claim 6, characterized in that, The main material transport mechanism (4) further includes a pair of clamping components that are correspondingly arranged on both sides of the main material carrier (43); the clamping components include a clamp (46) installed on the carrier clamping mechanism (44) and a clamping plate (47) connected to the clamp (46). The clamp (46) can drive the clamping plate (47) to rotate and / or move up and down in the vertical direction; The main material carrier (43) has corresponding slots on both sides; a pair of clamping plates (47) can be engaged or disengaged from the pair of slots in a one-to-one correspondence.

8. The multi-auxiliary material mounting device according to claim 4, characterized in that, The main material feeding mechanism (8) and / or the auxiliary material feeding mechanism (7) are respectively provided with calibration components (10) as calibration references.

9. A eutectic bonding machine, characterized in that, The eutectic chip mounter includes the multi-auxiliary material mounting device as described in any one of claims 1-8; the eutectic chip mounter also includes a eutectic welding furnace body (20) and a pre-assembled component handling mechanism (30) mounted on the mounting platform (1). The eutectic welding furnace body (20) is located on one side of the main material transport mechanism (4); the pre-loaded part handling mechanism (30) can pick up the pre-loaded parts on the main material transport mechanism (4) and unload the pre-loaded parts into the eutectic welding furnace body (20).

10. The eutectic bonding machine according to claim 9, characterized in that, The pre-assembled component handling mechanism (30) includes a bracket (301) mounted on the mounting platform (1), and a lateral sliding module (302) and a lifting clamping mechanism (303) mounted on the bracket (301); the lifting clamping mechanism (303) is mounted on the lateral sliding module (302); The lifting clamping mechanism (303) is equipped with a material sensor (304) and a displacement sensor (305); the material sensor (304) can monitor the vertical movement of the lifting clamping mechanism (303) relative to the pre-assembled part; the displacement sensor (305) can monitor the position of the gripper of the lifting clamping mechanism (303).

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