Preparation method of display panel

Abstract

The embodiment of the invention provides a preparation method of a display panel. The preparation method comprises the following steps: providing a driving backboard; a plurality of single-color image display areas are formed on the upper surface of the driving backboard, a plurality of display units are arranged in each single-color image display area in an array mode, the display units arranged in the same single-color image display area have the same light emitting color, and the display units arranged in different single-color image display areas have different light emitting colors. Each monochromatic image display area is used for emitting a monochromatic image light beam.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for manufacturing a display panel. Background Technology

[0002] With the evolution of near-eye display technology, there are currently two main technical paths for realizing micro color display systems: one is the single display panel scheme, which integrates three sub-pixels of different colors in each pixel unit; the other is the three display panel scheme, which uses three independent monochrome display panels to achieve color display through optical color combining.

[0003] In the single-display panel solution, the need to integrate multiple micro-nano-scale sub-pixel structures with different light-emitting colors within the same pixel unit leads to complex processes and difficulties in yield control. In the three-display panel solution, although the fabrication process of each panel is simple, it requires the configuration of three independent display panels, resulting in a large system size and difficulty in achieving lightweight integration.

[0004] Existing technological solutions all have significant shortcomings: the former achieves miniaturization at the expense of manufacturing costs, while the latter simplifies the process at the expense of system size. Balancing the contradiction between manufacturing processes and system integration has become a key bottleneck restricting breakthroughs in the performance of near-eye display devices. Summary of the Invention

[0005] In view of the above problems, this application is made to provide a method for manufacturing a display panel that solves or at least partially solves the above problems.

[0006] Therefore, in one embodiment of this application, a method for manufacturing a display panel is provided, comprising: Provides a drive backplane; Multiple monochrome image display areas are formed on the upper surface of the drive backplate. Multiple display units are arrayed in each monochrome image display area. The display units in the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. Each monochrome image display area is used to emit a monochrome image beam.

[0007] In the technical solution provided in the embodiments of this specification, multiple monochrome image display areas are formed on the upper surface of the same driving backplane. Each monochrome image display area has an array of multiple display units arranged to display a corresponding monochrome image. The display units within the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. That is, only multiple display units with the same light-emitting color need to be integrated into an array within the same area on the upper surface of the same driving backplane; there is no need to set multiple display units with different light-emitting colors within the same area, which effectively reduces the difficulty of the manufacturing process and improves the yield. Therefore, the technical solution provided in the embodiments of this application not only has the advantage of small size but also the advantages of low manufacturing difficulty and high yield. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 A top view schematic diagram of a display panel provided in an embodiment of this application; Figure 2 A schematic diagram of the arrangement of multiple monochrome display areas (display unit array) provided in an embodiment of this application. Figure 1 ; Figure 3 A schematic diagram of the arrangement of multiple monochrome display areas (display unit array) provided in an embodiment of this application. Figure 2 ; Figure 4 A schematic diagram of the arrangement of multiple monochrome display areas (display unit array) provided in an embodiment of this application. Figure 3 ; Figure 5 A cross-sectional view of a light engine provided in an embodiment of this application; Figure 6 A cross-sectional view of another optical engine provided in an embodiment of this application; Figure 7 A cross-sectional view of yet another optical engine provided in an embodiment of this application; Figure 8 A cross-sectional view of yet another optical engine provided in an embodiment of this application; Figure 9 A cross-sectional view of yet another optical engine provided in an embodiment of this application; Figure 10A schematic flowchart illustrating a method for fabricating a display panel according to an embodiment of this application; Figure 11 This is a schematic diagram of a mass transfer process provided in an embodiment of this application; Figure 12 This is a schematic diagram of a wafer bonding process provided in an embodiment of this application; Figure 13 A cross-sectional view of a display panel provided in an embodiment of this application; Figure 14 A schematic flowchart illustrating the fabrication method of a first microlens array according to an embodiment of this application; Figure 15 This is a schematic flowchart illustrating the fabrication method of the second microlens array provided in an embodiment of this application; Figure 16 A schematic flowchart illustrating the fabrication method of the third microlens array provided in an embodiment of this application; Figure 17 This is a schematic diagram of a microlens structure provided in an embodiment of this application; Figure 18 This is a schematic flowchart illustrating the fabrication method of the fourth microlens array provided in an embodiment of this application. Detailed Implementation

[0010] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0011] Furthermore, some processes described in the specification, claims, and accompanying drawings of this application include multiple operations that appear in a specific order. These operations may be performed out of order or in parallel. Operation numbers such as 201, 202, etc., are merely used to distinguish different operations and do not represent any execution order. Additionally, these processes may include more or fewer operations, and these operations may be performed sequentially or in parallel. It should be noted that the terms "first," "second," etc., used herein are used to distinguish different messages, devices, modules, etc., and do not represent a chronological order, nor do they limit "first" and "second" to different types.

[0012] Figure 1 This is a schematic diagram of the display panel provided in an embodiment of this specification. Figure 1As shown, the display panel 11 includes: a driving back plate 110, with a plurality of monochrome image display areas 111 disposed on the upper surface of the driving back plate 110, and a plurality of display units arrayed in each monochrome image display area 111. The display units in the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. Each monochrome image display area is used to emit a monochrome image beam. The multiple monochrome image beams emitted by the plurality of monochrome image display areas are combined to obtain a color image beam.

[0013] like Figure 1 As shown, multiple display units arranged in an array within each monochrome image display area form a display unit array. Multiple unit image display areas correspond to multiple display unit arrays, and these multiple display unit arrays are arranged without overlap.

[0014] The display unit in the embodiments of this specification refers to a monochrome display unit, that is, a display unit that can only emit light of one color. A monochrome display unit may include, but is not limited to, a red display unit, a green display unit, a blue display unit, and a white display unit. Specifically, a red display unit refers to a display unit that can only emit red light, a green display unit refers to a display unit that can only emit green light, a blue display unit refers to a display unit that can only emit blue light, and a white display unit refers to a display unit that can only emit white light.

[0015] In some embodiments, the display unit may include, but is not limited to, a self-emissive device and a light modulation device. The self-emissive device may include, but is not limited to, a light-emitting diode (LED) and an organic light-emitting diode (OLED). In some specific embodiments, the LED includes a micro-LED. In other specific embodiments, the OLED includes a micro-organic light-emitting diode. The light modulation device may include a liquid crystal unit.

[0016] like Figure 1 As shown, the multiple monochrome image display areas 111 do not overlap. That is, the occupancy areas of the multiple display unit arrays on the upper surface of the driving backplate do not overlap. Each monochrome image display area is a connected region.

[0017] In some embodiments, the multiple monochrome image display areas can be set separately, which ensures that the two monochrome image beams emitted from any two areas of the multiple monochrome image display areas are separated from each other, thus avoiding beam interference and affecting the final image quality.

[0018] In some embodiments, the spacing between any two adjacent monochrome image display areas in the plurality of monochrome image display areas is greater than or equal to 10 μm. In practical applications, setting the spacing between any two adjacent monochrome image display areas to be greater than or equal to 10 μm can reduce interference between monochrome image beams of two adjacent arrays, thereby ensuring imaging quality.

[0019] In some embodiments, in order to meet the requirements of miniaturization, the spacing between any two adjacent monochrome image display areas in the plurality of monochrome image display areas is less than or equal to 500 μm.

[0020] In other embodiments, the spacing between any two adjacent monochrome image display areas in the plurality of monochrome image display areas is greater than or equal to 10 μm; and the spacing between any two adjacent monochrome image display areas in the plurality of monochrome image display areas is less than or equal to 500 μm.

[0021] In some embodiments, the plurality of monochrome image display areas include a red image display area, a green image display area, and a blue image display area.

[0022] The red image display area consists of multiple red display units, used to display the red image corresponding to the red component of the color image data, that is, to emit the red image light corresponding to the red component of the color image data. The green image display area consists of multiple green display units, used to display the green image corresponding to the green component of the color image data, that is, to emit the green image light corresponding to the green component of the color image data. The blue image display area consists of multiple blue display units, used to display the blue image corresponding to the blue component of the color image data, that is, to emit the blue image light corresponding to the blue component of the color image. The distribution of the red, green, and blue image display areas on the upper surface of the drive backplane 110 can be set according to actual needs. Figure 2 The diagram shows various distribution patterns of the three display unit arrays on the upper surface of the drive backplate 110.

[0023] In other embodiments, the plurality of monochrome image display areas include a red image display area, a green image display area, a blue image display area, and a white image display area. The green image display area consists of multiple green display units, used to display the green image corresponding to the green component of the color image data, that is, to emit green image light corresponding to the green component of the color image data. The blue image display area consists of multiple blue display units, used to display the blue image corresponding to the blue component of the color image data, that is, to emit blue image light corresponding to the blue component of the color image. The distribution of the red, green, and blue image display areas on the upper surface of the drive backplane 110 can be set according to actual needs. The white image display area consists of multiple white display units, used to emit white image light; adding a white display unit array can improve overall brightness and reduce power consumption. Figure 3 The diagram shows various distribution patterns of the four display unit arrays on the upper surface of the drive backplate 110.

[0024] In practical applications, each monochrome image display area can be a rectangular area, which can be a long rectangular area or a square area. When the monochrome image display area is rectangular and the driving backplate is also rectangular, the long side of the monochrome image display area can be set parallel to the long side of the backplate or parallel to the short side of the backplate.

[0025] In practical applications, the display areas of multiple monochrome images may be equal or unequal in size (e.g., Figure 4 As shown in the image, the settings can be adjusted according to actual needs. For example, the size of each monochrome image display area can be adjusted based on requirements such as luminous efficiency or color gamut.

[0026] In some embodiments, the driving backplane 110 may include a complementary metal-oxide-semiconductor (CMOS) backplane. The CMOS backplane is fabricated based on single-crystal silicon.

[0027] Alternatively, the driving backplane 110 may include a thin-film transistor backplane (TFT), such as a polycrystalline silicon TFT or an amorphous silicon TFT.

[0028] Figure 5 This is a cross-sectional view of the light engine provided in an embodiment of this specification. Figure 5 As shown, the light engine 1 includes: the above-mentioned Figure 1The display panel 11 and optical color combining device 12 are shown. The optical color combining device 12 is disposed on the light-emitting side of multiple monochrome image display areas 111 on the upper surface of the display panel 11, and is used to optically combine multiple monochrome image beams emitted by the multiple monochrome image display areas 111 to obtain a combined image beam.

[0029] The combined image beam can be called a color image beam. When this combined image beam enters the human eye, the human eye can see a color image.

[0030] The optical color combining device 12 is used to spatially align and fuse multiple monochrome image beams emitted from multiple monochrome image display areas 111 into a color image beam.

[0031] In some embodiments, such as Figure 5 As shown, the optical color combining device 12 includes a plurality of light guides 120 corresponding one-to-one with the plurality of monochrome image display areas 111; the plurality of light guides 120 are used to guide the plurality of monochrome image beams emitted from the plurality of monochrome image display areas 111 to combine colors.

[0032] In some specific embodiments, the light emission ports of the plurality of light guides overlap, and the light incident port of each light guide is disposed opposite to the monochrome image display area 111 corresponding to the light guide, for receiving the monochrome image beam emitted by the monochrome image display area 111.

[0033] Each light guide includes a light guiding medium body and a coating layer covering the light guiding medium body; wherein the refractive index of the material of the coating layer is lower than the refractive index of the material of the light guiding medium body.

[0034] Optionally, the cladding layer of each light guide includes a wavelength-selective reflective film; the wavelength-selective reflective film of each light guide is used to reflect the monochrome image beam emitted by the monochrome image display area corresponding to the light guide (e.g., total internal reflection), and to transmit the monochrome image beam emitted by the monochrome image display area corresponding to other light guides among the plurality of light guides (e.g., total transmission).

[0035] The refractive index of the light guide medium is greater than a preset refractive index threshold, which can be set according to actual needs. The light guide medium may include resin.

[0036] The plurality of light guides are used to guide the multiple monochrome image beams emitted from the plurality of monochrome image display areas to propagate to the light emission port, and form a composite image beam at the light emission port.

[0037] Each of the aforementioned multiple optical guides is formed by segmented casting. After casting each segment of the multiple optical guides, a corresponding wavelength-selective reflective film is applied to the corresponding area of ​​each segment. Then, they are assembled, and resin material is integrally cast onto the outside of the assembly to obtain the aforementioned optical color-combining device. The transmittance of the resin material is greater than a preset transmittance threshold.

[0038] In another specific implementation, such as Figure 6 As shown, the light exit ports of the three light guides 120 do not overlap; the light incident port of each light guide is disposed opposite to the monochrome image display area 111 corresponding to that light guide, and is used to receive the monochrome image beam emitted by the monochrome image display area 111. Each light guide is used to propagate the monochrome image beam emitted by its corresponding monochrome image display area 111 to the light exit port of that light guide. The propagation directions of the multiple monochrome image beams emitted from the light exit ports of the multiple light guides intersect at a point, and a combined image beam is formed at the intersection point. In the embodiments of this specification, each light guide includes a light guiding medium body and a reflective film covered on the light guiding medium body.

[0039] In some embodiments, such as Figure 7 As shown, the optical color combining device 12 includes: a color combining prism; the color combining prism is used to combine multiple monochrome image beams emitted from the multiple monochrome image display areas to obtain a color-combined image beam, and emits it from the light-emitting surface of the color combining prism.

[0040] In a specific structure, such as Figure 7 As shown, the color-combining prism includes multiple wedge prisms 121. These wedge prisms 121 combine multiple monochromatic image beams emitted from the multiple monochromatic image display areas to obtain a combined image beam, which exits from the light-emitting surface of the color-combining prism. For example, if there are N monochromatic image display areas 111, then there are N-1 wedge prisms. The N monochromatic image display areas 111 include a first monochromatic image display area. Each of the N-1 wedge prisms corresponds one-to-one with one of the remaining N-1 monochromatic image display areas 111 (excluding the first monochromatic image display area). These wedge prisms change the propagation direction of the N-1 monochromatic image beams emitted from these remaining N-1 monochromatic image display areas, thereby achieving color combination with the odd number of image beams emitted from the first monochromatic image display area to obtain the combined image beam.

[0041] A wedge prism is an optical element consisting of two tilted planes, which are typically not parallel, forming a wedge shape. It is primarily used to change the direction of light propagation. The materials used for wedge prisms can include K9 glass or BK7 glass.

[0042] Optionally, the light-emitting surfaces of the plurality of wedge prisms 121 are arranged opposite to each other, and a light guide structure 122 is integrally injection molded between the light-emitting surfaces of the plurality of wedge prisms 121. The material of the light guide structure 122 may include a high refractive index resin, wherein the refractive index n of the resin is between 1.6 and 1.9.

[0043] In another specific structure, the color-combining prism includes a frustum of a cone and a surrounding layer. The top and bottom surfaces of the frustum are exposed, with the top surface larger than the bottom surface. The orthographic projection of the bottom surface onto the display panel covers the first monochrome image display area and does not overlap with the remaining N-1 monochrome image display areas. The refractive index of the frustum is greater than that of the surrounding layer. The outer shape of the surrounding layer is cylindrical.

[0044] In some embodiments, such as Figure 8 As shown, the plurality of monochrome image display areas 111 are arranged along a first direction. The optical color combining device 12 includes a plurality of optical elements 123 corresponding one-to-one with each of the plurality of monochrome image display areas 111. The plurality of optical elements 123 reflect or transmit multiple monochrome image beams emitted from the plurality of monochrome image display areas into the same optical path for color combining. The direction of this optical path is parallel to the first direction. Each optical element 123 is provided with a semi-transparent and semi-reflective film.

[0045] In some specific structures, such as Figure 8 As shown, multiple optical elements 123 are arranged along a first direction, and the semi-transparent and semi-reflective films on each of the multiple lenses 123 are arranged in parallel. The semi-transparent and semi-reflective film on each optical element reflects the monochrome image beam emitted from its corresponding monochrome image display area onto the optical path, and transmits the monochrome image beam reflected and / or transmitted from the semi-transparent and semi-reflective film on the previous optical element onto the optical path, thereby achieving color merging.

[0046] In some embodiments, such as Figure 9 As shown, the optical color combining device includes a plano-convex lens structure. The convex surface of the plano-convex lens structure is positioned facing the plurality of monochrome image display areas. The plano-convex lens structure has a first region, a second region, and a third region defined above its plane. The first region is located above the red monochrome image display area, the second region is located above the green image display area, and the third region is located above the blue image display area. The first region is provided with a first light-guiding medium layer 124 covering the plane and a second light-guiding medium layer 125 covering the first light-guiding medium layer 124.

[0047] The second region is provided with a third light-guiding medium layer covering the plane, and the material of the third light-guiding medium layer is the same as the material of the plano-convex lens structure.

[0048] The third region is provided with a fourth light guide medium layer covering the plane and a fifth light guide medium layer covering the fourth light guide medium layer.

[0049] The first and fourth light-guiding media layers are made of the same material, and the second and fifth light-guiding media layers are made of the same material. The refractive index of the first light-guiding media layer is greater than that of the second light-guiding media layer, and the refractive index of the second light-guiding media layer is greater than that of the plano-convex lens structure.

[0050] Optionally, the plano-convex lens structure is divided into a fourth region and a fifth region above its plane. The fifth region surrounds the fourth region. A sixth light-guiding medium layer is disposed within the fourth region. The material of the sixth light-guiding medium layer is the same as that of the plano-convex lens structure. The sixth light-guiding medium layer and the plano-convex lens structure can be integrally formed. A seventh light-guiding medium layer and an eighth light-guiding medium layer covering the seventh light-guiding medium layer are disposed within the fifth region. The refractive index of the material in the seventh light-guiding medium layer is greater than that in the eighth light-guiding medium layer, and the refractive index of the material in the eighth light-guiding medium layer is greater than that in the plano-convex lens structure.

[0051] In some embodiments, the aforementioned optical engine may further include a collimating lens for collimating the combined color image beam, which helps to improve image quality.

[0052] In some embodiments, the display panel further includes: a plurality of microlens arrays; the plurality of microlens arrays are configured in one-to-one correspondence with the plurality of monochrome image display areas; the microlens arrays are disposed on the light-emitting side of the corresponding monochrome image display area and are located between the corresponding display unit and the optical color combining device.

[0053] In some embodiments, the light engine described above may not include an optical color combining device. That is, the light engine is used to emit multiple monochromatic image beams, which can be combined in the waveguide lens of the near-eye display device.

[0054] In some embodiments, the light engine includes a display device and an optical color combining device. The display device includes multiple monochrome image display areas arranged on the same plane. Each monochrome image display area has multiple display units arranged in an array. Display units within the same monochrome image display area emit the same light color, while display units in different monochrome image display areas emit different light colors. Each monochrome image display area is used to emit a monochrome image beam.

[0055] Optionally, the display device may include multiple monochrome display panels spliced ​​together on the same plane; each monochrome display panel is provided with a monochrome image display area among the multiple monochrome image display areas.

[0056] Optionally, the display device is Figure 1 The corresponding single-piece display panel.

[0057] Among them, the optical color combining device (such as Figure 5 or Figure 6 As shown, the device includes multiple light guides corresponding one-to-one with the plurality of monochrome image display areas. The light incident ports of the light guides are positioned facing the corresponding monochrome image display area to receive monochrome image beams emitted from that area. The multiple light guides are configured to guide the multiple monochrome image beams emitted by the plurality of display unit arrays to combine colors, resulting in a color image beam. Specific implementations of this optical color combining device can be found in the corresponding contents of the above embodiments and will not be detailed here.

[0058] The preparation method of the display panel provided in the embodiments of this specification will now be described in detail with reference to the accompanying drawings.

[0059] Figure 10 This is a schematic flowchart illustrating a method for fabricating a display panel according to an embodiment of this specification. Figure 10 As shown, the method includes: 100. Provide a drive backplane.

[0060] 101. Multiple monochrome image display areas are formed on the upper surface of the drive backplate.

[0061] Each monochrome image display area is arrayed with multiple display units. The display units in the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. Each monochrome image display area is used to emit a monochrome image beam.

[0062] In some embodiments of the above 100, an active driving circuit array consisting of semiconductor devices, metal interconnects and dielectric layers is fabricated on a specific substrate by a patterned microfabrication process of cyclic superposition.

[0063] In practical applications, the driving backplane includes multiple active driving circuit arrays, each corresponding one-to-one with one of the multiple monochrome image display areas set in step 101. Each active driving circuit in the active driving circuit array corresponds one-to-one with a display unit in the display unit array within its corresponding monochrome image display area.

[0064] The upper surface of the drive backplane has multiple carrier areas, which do not overlap. Each carrier area corresponds one-to-one with a plurality of active drive circuit arrays. The carrier area is located above (e.g., directly above) its corresponding active drive circuit array. Each carrier area is used to form a monochrome image display area.

[0065] Taking a thin-film transistor (TFT) backplane as an example, on a glass substrate, key structures such as gate, semiconductor active layer, source / drain electrodes are formed sequentially by cyclically performing processes such as thin film deposition, photolithography (coating, exposure, development), etching (dry / wet) and cleaning, ultimately forming a three-dimensional transistor array and interconnection lines to provide electrical signals for the display unit.

[0066] Taking a CMOS backplane as an example, an active matrix backplane containing driving transistors, storage capacitors, and complex control circuits is fabricated on a single-crystal silicon wafer using standard CMOS processes (such as photolithography, ion implantation, thin film deposition, and etching), achieving high integration and small pixel size. CMOS backplanes are commonly used in high-end Micro-LED and other display technologies, and their fabrication process is compatible with silicon-based integrated circuit processes. In some embodiments, the CMOS backplane can be fabricated using 14nm-180nm tape-out processes.

[0067] In some embodiments of the above 101, the display units in the display unit array may be realRGB silicon-based OLEDs or micro-LEDs. Among them, micro-LEDs can provide higher luminous brightness, and realRGB silicon-based OLEDs can improve luminous efficiency by more than 30% compared to the white OLED plus filter solution, and the cost is lower than that of micro-LEDs.

[0068] An array of display units is formed in each bearing area on the upper surface of the drive backplate, resulting in multiple arrays of display units, which in turn result in multiple monochrome image display areas.

[0069] Alternatively, an encapsulation layer may be formed to cover the plurality of display unit arrays to obtain a display panel.

[0070] In the technical solution provided in the embodiments of this specification, multiple monochrome image display areas are formed on the upper surface of the same driving backplane. Each monochrome image display area has an array of multiple display units arranged to display a corresponding monochrome image. The display units within the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. That is, only multiple display units with the same light-emitting color need to be integrated into an array within the same area on the upper surface of the same driving backplane; there is no need to set multiple display units with different light-emitting colors within the same area, which effectively reduces the difficulty of the manufacturing process and improves the yield. Therefore, the technical solution provided in the embodiments of this application not only has the advantage of small size but also the advantages of low manufacturing difficulty and high yield.

[0071] In some embodiments, the display units in the above-described display unit array include inorganic light-emitting diodes (LEDs), such as micro-LEDs.

[0072] To ensure the performance of the light-emitting diodes (LEDs), LEDs can be generated on a growth substrate and then transferred from the growth substrate to a driving backplane to form a display unit array.

[0073] In some embodiments, the plurality of monochrome image display areas includes a first monochrome image display area. The phrase "forming the first monochrome image display area on the upper surface of the drive backplane" in step 101 above can be implemented using the following steps: 1011. Provide growth substrate.

[0074] The growth substrate has multiple light-emitting diodes (LEDs) grown on it, and the LEDs emit light of the same color.

[0075] 1012. The plurality of light-emitting diodes are transferred to the upper surface of the driving backplane (e.g., the first bearing area) to form the first monochrome image display area.

[0076] In some embodiments of 1011 above, multiple light-emitting diodes are grown on a substrate wafer using epitaxial growth technology.

[0077] Specifically, an epitaxial functional layer, including an N-type semiconductor layer, a light-emitting layer, and a P-type semiconductor layer, can be grown on a substrate wafer. After the epitaxial functional layer is grown, the light-emitting diode region is defined by partial photolithography and etching processes, and a transparent conductive layer and electrodes are deposited to obtain multiple light-emitting diodes.

[0078] In practical applications, light-emitting diodes with different light-emitting colors are obtained by growing them on different growth substrates, which helps to improve the performance of light-emitting diodes.

[0079] In practical applications, for light-emitting diodes that emit blue or green light, sapphire substrates or GaN homogeneous substrates can be selected. On the substrate, n-type GaN, InGaN / GaN multi-quantum-well light-emitting layer, and p-type GaN are grown sequentially. Multiple light-emitting diode regions are defined by photolithography and etching processes, and transparent conductive layers and electrodes are deposited to obtain multiple light-emitting diodes.

[0080] For red light-emitting diodes, GaAs (gallium arsenide) substrates can be used, and epitaxial functional layers are grown sequentially on the substrate. From bottom to top, these layers include an N-type AlGaInP layer (lower confinement layer), an AlGaInP multi-quantum-well active layer (light-emitting layer), a P-type AlGaInP layer (upper confinement layer), and a P-type GaP window layer. Multiple light-emitting diode regions are defined through photolithography and etching processes, and transparent conductive layers and electrodes are deposited to obtain multiple red light-emitting diodes.

[0081] In the above 1012, mass transfer technology or wafer bonding technology can be used to transfer the plurality of light-emitting diodes to the first carrier area to form a corresponding display unit array, that is, the first monochrome image display area.

[0082] In some specific embodiments, the phrase "transferring the plurality of light-emitting diodes to the upper surface of the driving backplane to form the first monochrome image display area" in 1012 above includes: cutting the growth substrate through a mass transfer process to obtain a plurality of separate light-emitting diodes, transferring the plurality of separate light-emitting diodes to a plurality of electrode pads in the first bearing area and bonding them, thereby forming a first display unit array.

[0083] In practical applications, after obtaining multiple separate light-emitting diodes, the LED devices can be transferred to the CMOS backplane using gripping techniques based on magnetic force, van der Waals force or electrostatic force, self-assembly techniques (e.g., fluid self-assembly), selective release techniques or transfer techniques.

[0084] For example, such as Figure 11 As shown, red light-emitting diode wafer 1101, green light-emitting diode wafer 1102, and blue light-emitting diode wafer 1103 are prepared respectively. These three wafers are cut to obtain multiple red light-emitting diode wafers R, multiple green light-emitting diode wafers G, and multiple blue light-emitting diode wafers B. Then, multiple red light-emitting diode wafers R are transferred to the first carrier area on the upper surface of the driving backplate 1104 by gripping technology. Then, multiple green light-emitting diode wafers G are transferred to the second carrier area on the upper surface of the driving backplate 1104 by gripping technology. Finally, multiple blue light-emitting diode wafers B are transferred to the third carrier area on the upper surface of the driving backplate 1104 by gripping technology.

[0085] In some other specific embodiments, the phrase "transferring the plurality of light-emitting diodes to the upper surface of the driving backplane to form the first monochrome image display area" in 1012 above includes: performing wafer-level bonding between the growth substrate and the driving substrate through a wafer bonding process; after bonding, cutting the growth substrate to obtain a plurality of separate light-emitting diodes to form a corresponding display unit array.

[0086] The wafer bonding process mainly includes the following steps: surface treatment, alignment, pre-bonding, main bonding, and post-processing. Surface treatment involves cleaning and activating the wafer surface to remove surface contaminants and improve bonding ability; the alignment step ensures precise alignment of the two wafers during the bonding process; pre-bonding is a preliminary bonding process performed at lower temperatures and pressures to eliminate gaps between wafers; main bonding achieves tight bonding of the wafers at higher temperatures and pressures; post-processing includes steps such as cooling, cleaning, and inspection to ensure bonding quality.

[0087] For example, such as Figure 12 As shown, for any one of the red, green, and blue LED wafers 1201, the surface of the wafer and the surface of the driving backplane 1201 are cleaned and activated. The LED wafer 1201 and the driving backplane 1201 are aligned, pre-bonded, and main-bonded in sequence to obtain a bonding body 1203. Then, the LED wafer 1201 in the bonding body 1203 is cut to obtain an LED array bonded to the driving backplane 1201.

[0088] In some embodiments, the display units in the above-described display unit array include organic light-emitting diodes (OLEDs). Step 101, "forming a plurality of monochrome image display areas on the upper surface of the driving backplane," can be achieved using the following steps: S11. A patterned bottom metal layer is formed on the upper surface of the drive backplate.

[0089] S12. A first charge-organic transport layer is deposited over the patterned bottom metal layer.

[0090] S13. Patterned organic light-emitting layers of different colors are formed in multiple regions on the upper surface of the first charge organic transport layer.

[0091] S14. A second charge-organic transport layer and a top metal layer are sequentially deposited above the patterned organic light-emitting layer.

[0092] Each of the plurality of regions corresponds one-to-one with a plurality of monochrome image display regions.

[0093] In step S11 above, a bottom metal layer can first be formed on the upper surface of the drive backplane, and then the bottom metal layer can be patterned to obtain a patterned bottom metal layer. The patterned bottom metal layer includes multiple bottom electrode arrays. The occupancy areas of each bottom electrode array do not overlap, and the multiple bottom electrode arrays are not intersected. The multiple bottom electrode arrays correspond one-to-one with multiple monochrome image display areas, and each bottom electrode array is located within its corresponding monochrome image display area. The bottom electrode can be referred to as the anode electrode.

[0094] In S12 above, a first charge-organic transport layer, such as an organic hole transport layer, is deposited above the patterned bottom metal layer using thin film deposition technology.

[0095] Optionally, a first charge organic injection layer, such as an organic hole injection layer, may be deposited before depositing the first charge organic transport layer.

[0096] In S13 above, patterned organic light-emitting layers of different colors can be formed sequentially in multiple regions on the upper surface of the first charge organic transport layer.

[0097] The patterned organic light-emitting layer can be fabricated using photolithography. The patterned organic light-emitting layer contains multiple arrays of organic light-emitting islands, which are arranged without overlap. Each array corresponds one-to-one with a monochrome image display area, with each island located within its corresponding monochrome image display area. The organic light-emitting islands within the same array emit the same color, while those in different arrays emit different colors.

[0098] In S14 above, the second charge-organic transport layer may include an organic electron transport layer. The top metal layer may include an anode electrode layer.

[0099] Alternatively, after depositing a second charge organic transport layer over the patterned organic light-emitting layer, a second charge organic injection layer (e.g., an organic electron injection layer) may be deposited, and finally a top metal layer may be deposited.

[0100] For example, such as Figure 13As shown, a metal layer can be formed on the upper surface of the drive backplate 1301. The metal layer is patterned to obtain a patterned metal layer 1302. The patterned metal layer 1302 includes an anode array formed in each of the three carrier regions on the upper surface of the drive backplate 1301. Any two anodes in the anode array are electrically isolated from each other. A hole injection layer 1303 is formed above the patterned metal layer 1302. Through a first mask, a first hole transport layer 1304, a red light-emitting material layer 1305, a first electron transport layer 1306, a first electron injection layer 1307, and a first cathode metal layer 1308 are sequentially formed in the region of the hole injection layer 1302 located directly above the first carrier region. The first mask has an opening corresponding to the shape and position of the first carrier region. Similarly, using a second mask, a second hole transport layer, a green light-emitting material layer, a second electron transport layer, a second electron injection layer, and a second cathode metal layer are sequentially formed in the region of the hole injection layer directly above the second carrier region. The second mask has openings corresponding to the shape and position of the second carrier region. Using a third mask, a third hole transport layer, a blue light-emitting material layer, a third electron transport layer, a third electron injection layer, and a third cathode metal layer are sequentially formed in the region of the hole injection layer directly above the third carrier region. The third mask also has openings corresponding to the shape and position of the third carrier region.

[0101] The red luminescent material layer, green luminescent material layer, and blue luminescent material layer are arranged in the same layer but separately.

[0102] Optionally, the first hole injection layer, the second hole injection layer, and the third hole injection layer can be on the same layer, or can be set separately or as a whole.

[0103] Optionally, the first hole transport layer, the second hole transport layer, and the third hole transport layer can be on the same layer, or can be set up separately or as a whole.

[0104] Optionally, the first, second, and third electronic transport layers can be on the same layer, or set up separately or as a whole.

[0105] Optionally, the first, second, and third electron injection layers can be in the same layer, or can be set separately or as a single unit.

[0106] Optionally, the first anode metal layer, the second anode metal layer, and the third anode metal layer can be in the same layer, or can be separated or integrated.

[0107] Alternatively, when preparing any of the red, green, and blue luminescent material layers, the luminescent material layer needs to be patterned to obtain a patterned luminescent material layer, which forms an array of multiple luminescent material islands.

[0108] Alternatively, the aforementioned red, green, and blue luminescent material layers can be quantum dot luminescent layers. Methods for fabricating and patterning quantum dot luminescent layers include photolithography and nanoimprint lithography.

[0109] Photolithography is a technique that uses ultraviolet light to copy a pattern from a photomask onto a substrate. The specific steps are as follows: First, a layer of photoresist is coated onto the substrate. When ultraviolet light passes through the photomask and irradiates the photoresist, the irradiated areas undergo a series of chemical reactions. Next, a developer is applied to the photoresist surface. The developer reacts with the surface photoresist; if a positive photoresist is used, the irradiated areas are removed; if a negative photoresist is used, the irradiated areas are retained. Finally, dry or wet etching techniques are used to copy the pattern from the photoresist onto the substrate. Photolithography is characterized by high resolution, mature technology, and high processing efficiency, and is widely used in electronics, home appliances, automobiles, and communications. The process of using photolithography to pattern quantum dot thin films is as follows: Photoresist undergoes a photochemical reaction under specific wavelength light (usually ultraviolet light). Positive photoresist causes the bonds between polymers to break, and the exposed areas are dissolved by the developing solvent; negative photoresist produces chemical cross-linking, and the exposed areas remain stable during development. A pattern is formed on a photoresist film by selective exposure using a photomask. The uncovered quantum dot film areas are then selectively etched using the photoresist pattern, and finally the residual photoresist is removed to obtain the quantum dot pattern.

[0110] Nanoimprint lithography is a technique that transfers nanoscale patterns from a mold onto a substrate material using physical or chemical methods. This technology enables high-resolution pattern replication and allows for large-area, rapid, and low-cost production. Compared to traditional photolithography, nanoimprint lithography eliminates the need for expensive equipment and complex photoresist processing, resulting in higher production efficiency and lower costs. Traditional nanoimprint lithography works primarily based on the physical contact and pressure between the mold and the substrate material. Specifically, a mold with a nanoscale pattern is pressed onto a substrate coated with a polymer or other deformable material. Applying pressure deforms the substrate, thus replicating the pattern from the mold onto the substrate. During the replication process, the contact area between the mold and the substrate is very small, enabling high-resolution pattern replication.

[0111] The nanoimprint lithography process can be mainly divided into four steps: mold preparation, substrate preparation, imprinting, and curing. After curing, the mold is removed from the substrate to obtain a substrate with nanoscale patterns. In the preparation of patterned quantum dots, nanoimprint lithography has been optimized into an imprint transfer process. Quantum dots are prepared on a patterned nanoimprint lithography template, and then, using an imprinting process similar to nanoimprint lithography, the quantum dots on the template are transferred to the target substrate to achieve patterning.

[0112] The Langmuir-Blodgett technique utilizes the gas-liquid interface to achieve precise capture of submicron-sized quantum dot monolayers, thereby forming tightly self-assembled quantum dot films with significantly improved film quality compared to traditional techniques. Finally, a microstructured polydimethylsiloxane (PDMS) template is used to imprint the entire film onto the target substrate. Furthermore, because the quantum dot film formed by the Langmuir-Blodgett method is a monolayer, the thickness of the quantum dot layers can be precisely controlled by adjusting the number of layers, enabling controllable thickness of the quantum dot emitting layer and precise transfer of the desired patterns.

[0113] Alternatively, the aforementioned red, green, and blue luminescent material layers can be quantum dot luminescent layers. Quantum dots can be used as luminescent layers, and the fabrication and patterning methods for quantum dot luminescent layers include photolithography, nanoimprint lithography, etc.

[0114] Photolithography is a technique that uses ultraviolet (UV) light to copy a pattern from a photomask onto a substrate. The specific steps are as follows: First, a layer of photoresist is coated onto the substrate. When UV light passes through the photomask and shines on the photoresist, the illuminated areas undergo a series of chemical reactions. Next, a developer is applied to the photoresist surface. The developer reacts with the surface photoresist; if a positive photoresist is used, the UV-illuminated areas are removed; if a negative photoresist is used, the UV-illuminated areas are retained. Finally, dry or wet etching techniques are used to copy the pattern from the photoresist onto the substrate. Photolithography is characterized by high resolution, mature technology, and high processing efficiency, and is widely used in the electronics, home appliances, automotive, and communications industries.

[0115] Currently, photolithography is used to pattern quantum dot thin films. The process flow is shown in the figure below. Photoresist undergoes a photochemical reaction under specific wavelength light (usually ultraviolet light). Positive photoresist breaks the bonds between polymers, allowing the exposed areas to be dissolved by the developing solvent; negative photoresist produces chemical cross-linking, keeping the exposed areas stable during development. Selective exposure using a photomask forms a pattern on the photoresist film. Subsequently, the uncovered quantum dot film areas are selectively etched using the photoresist pattern. Finally, residual photoresist is removed to obtain the quantum dot pattern.

[0116] Nanoimprint lithography is a technique that transfers nanoscale patterns from a mold onto a substrate material using physical or chemical methods. This technology enables high-resolution pattern replication and allows for large-area, rapid, and low-cost production. Compared to traditional photolithography, nanoimprint lithography eliminates the need for expensive equipment and complex photoresist processing, resulting in higher production efficiency and lower costs. Traditional nanoimprint lithography works primarily based on the physical contact and pressure between the mold and the substrate material. Specifically, a mold with a nanoscale pattern is pressed onto a substrate coated with a polymer or other deformable material. Applying pressure deforms the substrate, thus replicating the pattern from the mold onto the substrate. During the replication process, the contact area between the mold and the substrate is very small, enabling high-resolution pattern replication.

[0117] The nanoimprint lithography process can be mainly divided into four steps: mold preparation, substrate preparation, imprinting, and curing. After curing, the mold is removed from the substrate to obtain a substrate with nanoscale patterns. In the preparation of patterned quantum dots, nanoimprint lithography has been optimized into an imprint transfer process. Quantum dots are prepared on a patterned nanoimprint lithography template, and then, using an imprinting process similar to nanoimprint lithography, the quantum dots on the template are transferred to the target substrate to achieve patterning.

[0118] The Langmuir-Blodgett transfer technique utilizes the gas-liquid interface to achieve precise capture of submicron-sized quantum dot monolayers, thereby forming tightly self-assembled quantum dot films with significantly improved film quality compared to traditional techniques. Finally, a microstructured polydimethylsiloxane template is used to imprint the entire film onto the target substrate. Furthermore, because the quantum dot film formed by the Langmuir-Blodgett method is a monolayer, the thickness of the quantum dot layers can be precisely controlled by adjusting the number of layers, enabling controllable thickness of the quantum dot emitting layer and precise transfer of the desired patterns.

[0119] In some embodiments, after the plurality of display unit arrays are prepared, an encapsulation layer may be formed to cover the plurality of display unit arrays in order to protect the display unit arrays.

[0120] In some embodiments, after forming the encapsulation layer, a microlens array can be fabricated above each of the multiple display unit arrays. This microlens array may include, but is not limited to: liquid crystal microlens arrays, silicon-based aspherical cylindrical microlens arrays, diffractive microlens arrays, photosensitive glass microlens arrays, and convex microlens arrays fabricated by thermal reflow.

[0121] Microlens arrays are multifunctional micro-optical elements that can modulate incident light through diffusion, beam shaping, light splitting, and optical focusing, thereby achieving wide viewing angles, low aberrations, small distortions, high temporal resolution, and infinite depth of field. They have significant application potential in the miniaturization, intelligentization, and integration of optoelectronic devices and optical systems.

[0122] Microlenses come in various types, and based on their shape, they can be classified into rectangular aperture microlenses, hexagonal aperture microlenses, and circular aperture microlenses, with circular aperture microlenses, also known as hemispherical microlenses, being the most common. Hemispherical microlenses can be further divided into two types based on their optical principles: refractive microlenses and diffractive microlenses. Refractive microlenses have smooth and continuous surfaces, while diffractive microlenses have a surface phase relief structure and discontinuous surface shape. Similar to lenses, microlenses are also classified into convex and concave microlenses based on their morphology. Due to the need for beam focusing and increased light energy utilization, convex microlenses are more widely researched and applied, but their fabrication process is more complex than that of concave microlenses.

[0123] A Liquid Crystal Micro Lens Array (LCMLA) is a tunable optical device based on liquid crystal materials. It consists of an array of multiple tiny lens units, possessing the functions of a traditional optical lens array while also being electrically tunable. As a novel tunable optical element, LCMLA offers advantages such as high integration, fast response speed, and low driving voltage, leading to its widespread application in the 3D display field.

[0124] The liquid crystal microlens array adopts a typical "sandwich" structure design, consisting of an upper substrate, a liquid crystal layer (nematic liquid crystal E7), and a lower substrate. The specific preparation process is as follows: Figure 14 As shown.

[0125] (1) Fabrication of patterned electrodes: The patterned electrodes are fabricated using photolithography (e.g., ...). Figure 14 (as shown in (a)). First, photoresist is spin-coated onto a clean glass substrate (after pre-baking), and then exposed to ultraviolet light through a custom mask; after development, a photoresist micropillar array is formed (e.g., Figure 14 As shown in (b)); copper layers are deposited using physical vapor deposition (e.g. Figure 14 (as shown in (c)); residual photoresist is removed by a stripping process to obtain a copper via array electrode (square arrangement) (as shown in (c)). Figure 14 (as shown in d).

[0126] (2) Fabrication of high impedance layers (e.g.) Figure 14 As shown in (e): After uniformly mixing the PEDOT:PSS solution with the PVA aqueous solution, the mixture is spin-coated onto the surface of the patterned electrode and dried to form a composite film.

[0127] (3) Orientation treatment: Planar oriented polyimide (PI) is spin-coated onto the surface of the lower substrate, and unidirectional orientation treatment is performed by mechanical friction method (e.g. Figure 14 As shown in f). The ITO glass substrate also undergoes PI coating and rubbing treatment (as shown in f). Figure 14 (as shown in g).

[0128] (4) Liquid crystal cell assembly and crystal filling: The upper and lower substrates are aligned in an antiparallel orientation, and liquid crystal E7 is filled to complete the device fabrication (e.g. Figure 14 (as shown in h).

[0129] Silicon-based aspherical cylindrical microlenses can correct spherical aberrations introduced by spherical lenses in collimation and focusing homogenization systems by adjusting the surface constant and aspherical coefficient, thereby improving optical performance while reducing the size of optoelectronic systems. They are currently widely used in optical instruments, imaging, and optoelectronic industries.

[0130] The fabrication process of large numerical aperture aspherical silicon cylindrical microlenses based on mask moving exposure technology and plasma etching technology is as follows: Figure 15 As shown.

[0131] First, by spin coating (such as...) Figure 15 As shown in (a), baking (as shown in) Figure 15 As shown in (b), let it stand (as shown in the middle). Figure 15 A relatively thick photoresist film layer is coated on the silicon substrate surface in the manner shown in (c); subsequently, a pre-designed mask (such as...) is used... Figure 15 As shown in (d), the substrate is moved for exposure and development (as shown in the middle). Figure 15 As shown in (e), an aspherical photoresist structure with a continuous surface is formed (e.g., Figure 15 (as shown in f). It is worth noting that the core of this exposure technology is the non-contact directional movement of the mask and substrate. Different exposure amounts can be achieved by adjusting the pattern function of the unit mask or controlling the mask's movement speed. This allows for continuous modulation of the light energy during exposure using the binary mask pattern on the mask, resulting in a continuous exposure distribution on the photoresist surface. This, in turn, achieves a gradient change in exposure amount within the movement cycle. After development, the continuous surface-type aspherical cylindrical microlens structure of the photoresist is fabricated. Therefore, the mask needs to be precisely designed according to the target structural parameters. Combined with plasma etching technology, a specific gas is selected to etch the substrate (e.g.,...). Figure 15 As shown in (g), a silicon-based aspherical cylindrical microlens array is obtained.

[0132] The main methods for fabricating diffractive microlens arrays include multiple exposure-overlay method, laser direct writing method, and grayscale mask method. Figure 16 Based on the principle of multiple exposure-overlay, 8π, 4π, and 2π phase structures are sequentially fabricated through this process. Each exposure and development after aligning with the photomask creates a more complex phase step structure, with the phase modulation depth increasing towards the top (outer layers) (from 2π to 8π). Photomasks are typically generated through direct exposure using optical or electron beam pattern generators. Their working principle involves first calculating the mask pattern in a computer and storing it in a data file according to a specific data format. The pattern generator then converts this into the deflection and displacement of an electron beam or laser beam, driving the beam to expose the chromium and resist substrate surfaces. After development, a mask pattern is formed on the resist layer. The exposed chromium and residual resist layer are then washed away with a solution, yielding the photomask. Repeating the exposure, development, and etching processes using a set of photomasks produces diffractive microlenses. Laser direct writing eliminates the need for photomask exposure. Computer-controlled laser beams create patterns of microlenses or microlens arrays on the photoresist surface, followed by development and etching processes to obtain diffractive microlenses or microlens arrays. Since the transmittance of a grayscale photomask is continuously variable, the desired microlenses or microlens arrays can be obtained in a single exposure using the grayscale mask method.

[0133] The fabrication of microlens arrays using photosensitive glass utilizes the photosensitive glass's sensitivity to ultraviolet light. Through heat treatment, the photosensitive areas nucleate and crystallize, changing their density to form microlenses – a photothermal technique. Using a suitable mask pattern, after ultraviolet light exposure and heat treatment, the density of the exposed areas increases, exceeding that of the unexposed areas. When the temperature exceeds the softening temperature of the unexposed glass areas, the high-density exposed areas create pressure along the boundary of the unexposed cylindrical area, compressing the softened glass and causing it to protrude from the surface. This creates surface undulations between the exposed and unexposed glass areas. Due to surface tension, a spherical shape forms on the unexposed surface, ultimately resulting in a convex lens surface. Figure 17 This is a schematic diagram of a microlens structure formed by a photosensitive glass, where T is the thickness of the photosensitive glass, D is the lens aperture, and d is the surface protrusion height.

[0134] A convex microlens array was fabricated using the hot reflow method, a widely used microlens manufacturing technique. This process allows for the efficient fabrication of convex microlens arrays on large-area substrates. The fabrication process is as follows: Figure 18As shown, the process mainly consists of three steps. First, photoresist is spin-coated onto the substrate surface, allowing ultraviolet light to pass through a mask with a circular pattern. Second, after development, a cylindrical array of photoresist is formed. Finally, under appropriate temperature heating, the photoresist cylinders transform into a smooth and curved spherical cap structure due to surface tension.

[0135] The fabrication method of the optical engine provided in the embodiments of this specification will now be described in detail with reference to the accompanying drawings.

[0136] This specification also provides an embodiment of a method for fabricating a light engine. The method includes: 200. Provide a drive backplane.

[0137] 201. Multiple monochrome image display areas are formed on the upper surface of the drive backplate.

[0138] Each monochrome image display area is arrayed with multiple display units. The display units in the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. Each monochrome image display area is used to emit a monochrome image beam.

[0139] 202. An optical color combining device is provided on the light-emitting side of the plurality of monochrome image display areas.

[0140] The optical color combining device performs optical color combining on multiple monochromatic image beams emitted by the plurality of display unit arrays to obtain a combined image beam.

[0141] The specific implementation of steps 200 and 201 can be found in the corresponding contents of the above embodiments, and will not be repeated here.

[0142] In the above 202, there are various specific structures for the optical color combining device. Each optical color combining device can be designed and manufactured according to actual needs. The embodiments in this specification do not specifically limit this.

[0143] This application embodiment also provides a near-eye display device, which includes the aforementioned optical engine. Optionally, the near-eye display device further includes a waveguide lens, the waveguide lens including an incident coupling region and an outgoing coupling region; the waveguide lens is configured to receive the color-combined image beam emitted by the optical engine through the incident coupling region and guide it to the outgoing coupling region.

[0144] This application embodiment also provides a near-eye display device, which includes: the aforementioned display panel and a waveguide lens. The waveguide lens includes multiple incident coupling regions and exit coupling regions. Each of the multiple incident coupling regions corresponds one-to-one with a multiple monochrome image display area of ​​the display panel. The waveguide lens is configured to receive monochrome image beams emitted from the multiple monochrome image display areas through the multiple incident coupling regions, and guide them to the exit coupling regions, where a color image beam is formed.

[0145] The waveguide lenses provided in the embodiments of this specification can be implemented using diffractive waveguides or geometric waveguides (arrayed waveguides).

[0146] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application. In addition, if two or more features, systems, articles, materials and / or methods described herein do not contradict each other, then any combination of these features, systems, articles, materials and / or methods is included within the scope of this disclosure.

Claims

1. A method for manufacturing a display panel, characterized in that, include: Provides a drive backplane; Multiple monochrome image display areas are formed on the upper surface of the drive backplate. Multiple display units are arrayed in each monochrome image display area. The display units in the same monochrome image display area emit the same light color, while the display units in different monochrome image display areas emit different light colors. Each monochrome image display area is used to emit a monochrome image beam.

2. The method according to claim 1, characterized in that, The plurality of monochrome image display areas includes a first monochrome image display area; The first monochrome image display area is formed on the upper surface of the drive backplate, including: A growth substrate is provided on which multiple light-emitting diodes are grown, wherein the multiple light-emitting diodes emit light of the same color; The plurality of light-emitting diodes are transferred to the upper surface of the driving backplane to form the first monochrome image display area.

3. The method according to claim 2, characterized in that, Transferring the plurality of light-emitting diodes to the upper surface of the driving backplane to form the first monochrome image display area includes: The growth substrate is cut using a mass transfer process to obtain multiple separate light-emitting diodes (LEDs). These multiple LEDs are then transferred to and bonded to multiple electrode pads on the upper surface of the driving backplane to form the first monochrome image display area.

4. The method according to claim 2, characterized in that, Transferring the plurality of light-emitting diodes to the upper surface of the driving backplane to form the first monochrome image display area includes: The growth substrate and the driving substrate are bonded at the wafer level using a wafer bonding process. After bonding, the growth substrate is cut to obtain multiple separate light-emitting diodes to form the first monochrome image display area.

5. The method according to claim 1, characterized in that, Multiple monochrome image display areas are formed on the upper surface of the drive backplate, including: A patterned bottom metal layer is formed on the upper surface of the drive backplate; A first charge-organic transport layer is deposited over the patterned bottom metal layer; Patterned organic light-emitting layers of different colors are formed in multiple regions on the upper surface of the first charge organic transport layer; A second charge-organic transport layer and a top metal layer are sequentially deposited above the patterned organic light-emitting layer; Each of the plurality of regions corresponds one-to-one with a plurality of monochrome image display regions.

6. The method according to any one of claims 1 to 5, characterized in that, There is no overlap between the multiple monochrome image display areas.

7. The method according to any one of claims 1 to 5, characterized in that, The spacing between any two adjacent monochrome image display areas in the plurality of monochrome image display areas is greater than or equal to 10 μm; and / or The spacing between any two adjacent monochrome image display areas in the plurality of monochrome image display areas is less than or equal to 500 μm.

8. The method according to any one of claims 1 to 5, characterized in that, The plurality of monochrome image display areas include a red image display area, a green image display area, and a blue image display area; or The plurality of monochrome image display areas include a red image display area, a green image display area, a blue display unit array, and a white image display area.

9. The method according to any one of claims 1 to 5, characterized in that, The drive backplane includes a complementary metal-oxide-semiconductor backplane.

10. The method according to any one of claims 1 to 5, characterized in that, Also includes: A corresponding microlens array is provided on the light-emitting side of each of the plurality of monochrome image display areas.

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