Organic light-emitting element and pixel brightness value correction method thereof

Abstract

An organic light-emitting element includes a substrate and a plurality of organic light-emitting units on the substrate, each organic light-emitting unit including a first electrode on the substrate, an organic light-emitting layer on the first electrode, and a second electrode on the organic light-emitting layer, one of the first electrode and the second electrode including a transparent conductive material, wherein at least two organic light-emitting units with the same light color in the organic light-emitting units comprise organic light-emitting layers with different thicknesses.

Description

Technical Field

[0001] This disclosure relates to an organic light-emitting element and a method for correcting the pixel brightness value therein, and more particularly to an organic light-emitting element comprising an organic light-emitting diode (OLED) structure and a method for correcting the pixel brightness value therein. Background Technology

[0002] Currently, fine metal mask (FMM) is commonly used for the coating of the light-emitting layer of organic light-emitting elements (OLEDs), or a white light source with a color filter is used in the manufacturing process. However, the pixel sharpness or resolution produced by these processes is often unsatisfactory. Furthermore, pixel brightness unevenness (also known as mura defects) is a significant factor affecting the yield of OLEDs. Summary of the Invention

[0003] In this disclosure, an organic light-emitting element includes a substrate and a plurality of organic light-emitting units located on the substrate. Each organic light-emitting unit includes a first electrode located on the substrate, an organic light-emitting layer located on the first electrode, and a second electrode located on the organic light-emitting layer. One of the first electrode and the second electrode includes a transparent conductive material. At least two organic light-emitting units of the same light color include organic light-emitting layers of different thicknesses.

[0004] In some embodiments, the first electrode of the organic light-emitting element includes a plurality of spaced electrode portions, and the organic light-emitting layer includes a plurality of first organic light-emitting layers, a plurality of second organic light-emitting layers, and a plurality of third organic light-emitting layers respectively disposed corresponding to the electrode portions.

[0005] In some embodiments, the emission wavelength of the second organic light-emitting layer is greater than that of the first organic light-emitting layer, and at least two second organic light-emitting units include second organic light-emitting layers of different thicknesses.

[0006] In some embodiments, at least two first organic light-emitting units include first organic light-emitting layers of different thicknesses.

[0007] In some embodiments, the emission wavelength of the first organic light-emitting layer is greater than the emission wavelength of the third organic light-emitting layer, and at least two third organic light-emitting units include third organic light-emitting layers of different thicknesses.

[0008] In some embodiments, the organic light-emitting element further includes a pixel defined layer (PDL) to define a plurality of pixel regions, wherein the first electrode includes a plurality of electrode portions spaced apart in the pixel regions, and the pixel defined layer includes a plurality of bumps partially covering the electrode portions, wherein at least two bumps have different maximum vertical heights.

[0009] In some embodiments, the bumps contain organic materials.

[0010] In some embodiments, the pixel area bumps defining at least two organic light-emitting units of the same light color have different maximum vertical heights.

[0011] In some embodiments, at least two organic light-emitting units that emit the same light color have different brightness under the same driving current.

[0012] In some embodiments, at the same grayscale value, a portion of the organic light-emitting units that emit the same light color have the same brightness, and said portions are arranged in diagonal lines or arcs.

[0013] In some embodiments, portions of organic light-emitting units having the same brightness include organic light-emitting layers of the same thickness.

[0014] In some embodiments, a plurality of bumps are further included to define a plurality of pixel regions, and at least two organic light-emitting layers of the same light color are a first light-emitting layer having a first thickness and a second light-emitting layer having a second thickness, respectively. The bumps include a first bump adjacent to the first light-emitting layer and a second bump adjacent to the second light-emitting layer, wherein the first thickness is less than the second thickness and the height of the first bump is greater than the height of the second bump.

[0015] In some embodiments, the organic light-emitting element has a first side edge and a second side edge, the second side edge being relative to the first side edge, and two organic light-emitting units, including organic light-emitting layers of the same color but different thicknesses, are located in a horizontal direction and are respectively adjacent to the first side edge and the second side edge.

[0016] In some embodiments, at least three organic light-emitting units of the same color include organic light-emitting layers of different thicknesses.

[0017] In some embodiments, the organic light-emitting element includes a plurality of pixel regions arranged in an array along a first direction and a second direction, each pixel region including at least three organic light-emitting units of different colors, wherein the organic light-emitting units of at least two pixel regions arranged along the first direction or the second direction include organic light-emitting layers of different thicknesses.

[0018] In some embodiments, the pixel brightness value correction method for organic light-emitting elements includes:

[0019] An organic light-emitting element as described above is provided, wherein the organic light-emitting element includes a plurality of pixels and a pixel driving circuit, the pixel driving circuit including a driving transistor configured to provide a driving current to the pixel;

[0020] A driving current is applied to the pixel by driving the transistor;

[0021] Acquire a grayscale image of pixels to be processed;

[0022] Calculate a balanced brightness value for the grayscale image to be processed;

[0023] Determine the brightness difference between each pixel's brightness value and the balanced brightness value; and

[0024] Adjust the driving current of the pixels to compensate for the brightness difference.

[0025] In some embodiments, such as the pixel brightness value correction method for an organic light-emitting element described above, pixels of a set color of the organic light-emitting element are illuminated with a set grayscale value to obtain a grayscale image to be processed, and the grayscale image to be processed has an uneven light and shadow pattern.

[0026] In some embodiments, such as the pixel brightness value correction method for organic light-emitting elements described above, a grayscale image of pixels to be processed is acquired by an imaging device. The imaging device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. The processor executes the steps of the computer program to implement the pixel brightness value correction method for the grayscale image to be processed.

[0027] In some embodiments, such as the pixel brightness value correction method for organic light-emitting elements described above, a grayscale image of a pixel to be processed is acquired by an imaging device. The imaging device is coupled to a computer-readable storage medium. A computer program stored in the computer-readable storage medium is used to calculate the brightness value of the acquired grayscale image to be processed, thereby obtaining the update drive current value of the pixel.

[0028] In some embodiments, a larger drive current is provided to the lower brightness pixels, and a smaller drive current is provided to the higher brightness pixels. Attached Figure Description

[0029] Figure 1A A cross-sectional view of an intermediate structure of an organic light-emitting element fabrication method according to some embodiments is shown.

[0030] Figure 1B A top view illustrating an intermediate structure of a method for fabricating an organic light-emitting element according to some embodiments is shown.

[0031] Figure 2A A cross-sectional view of an intermediate structure of an organic light-emitting element fabrication method according to some embodiments is shown.

[0032] Figure 2B A cross-sectional view of an intermediate structure of an organic light-emitting element fabrication method according to some embodiments is shown.

[0033] Figure 2C Draw removal Figure 2BA cross-sectional view of the intermediate structure of an organic light-emitting element with a patterned photoresist layer.

[0034] Figure 3A A top view of a substrate of an intermediate product of an organic light-emitting element according to some embodiments is shown.

[0035] Figure 3B for Figure 3A A partial top view of one of the regions, illustrating a portion of the intermediate products of an organic light-emitting element.

[0036] Figure 4 These are microscope images of a local area of ​​an organic light-emitting element according to some embodiments.

[0037] Figure 5 This is a flowchart illustrating a pixel brightness value correction method for organic light-emitting elements according to some embodiments of the present invention.

[0038] Figure 6 For along Figure 3B Cross-sectional view of line 1A-1A' in the middle

[0039] Figures 7A to 7F Drawing based on Figure 6 Methods for fabricating organic light-emitting elements according to some embodiments.

[0040] Figure 8 The diagram illustrates an organic light-emitting element according to some embodiments, with schematic diagrams of organic light-emitting layers of different organic light-emitting units. Detailed Implementation

[0041] Figure 1A A cross-sectional view illustrating an intermediate structure of a method for fabricating an organic light-emitting element according to some embodiments is shown. In some embodiments, such as Figure 1A As shown, a substrate, such as a chip (wafer) W, can form a photoresist 1200 through spin coating during the patterning process. In some embodiments, the chip W is placed on a spin coater 700, and then the photoresist is applied to the chip W. By rotating the spin coater 700, the photoresist is subjected to centrifugal force and extends from the center region of the chip W to the periphery.

[0042] Figure 1B A top view illustrating an intermediate structure of a method for fabricating an organic light-emitting element according to some embodiments is shown. In some embodiments, such as Figure 1BAs shown, because the photoresist is viscous, during the process of centrifugal force throwing the photoresist from the center area of ​​chip W outwards, causing it to spread outwards, uneven thickness may form in some areas. Therefore, from the top surface, one or more light and shadow arcs 1200P will appear, extending outwards from the center area and thrown outwards in the direction of rotation of the spin coater 700. These light and shadow arcs 1200P are due to the uneven thickness of the photoresist 1200, which causes different reflections and / or refractions of light, resulting in the observed gloss or light and shadow pattern.

[0043] Figure 2A A cross-sectional view of an intermediate structure of an organic light-emitting element fabrication method according to some embodiments is shown. In some embodiments, the thickness of the photoresist formed by spin coating may gradually decrease from the central region of the chip W towards the peripheral edge. Therefore, after the photoresist is patterned, the thickness of the patterned photoresist layer 1210 also gradually decreases from the central region of the chip W towards the peripheral edge, as shown below. Figure 2A As shown.

[0044] Figure 2B A cross-sectional view illustrating an intermediate structure of a method for fabricating an organic light-emitting element according to some embodiments is shown. In some embodiments, such as Figure 2B As shown, the organic light-emitting layer 260 is formed by vapor deposition of electrodes (not shown) within the openings defined by the patterned photoresist layer 1210. Figures 2A to 2C In some embodiments, since the thickness of the photoresist in the multiple openings defined by the patterned photoresist layer 1210 gradually decreases from the middle region to the periphery, the organic light-emitting layer 260 filled therein will also have a thickness difference.

[0045] In some embodiments, when the depth-to-width ratio of the openings in the patterned photoresist layer 1210 is small, such as openings closer to the outer edge, the organic light-emitting layer 260 is easier to fill; when the depth-to-width ratio of the openings in the patterned photoresist layer 1210 is large, such as openings closer to the central region, the organic light-emitting layer 260 is less likely to be filled. Therefore, in portions of the patterned photoresist layer 1210 with a larger thickness, the openings are deeper, and the resulting (e.g., vapor-deposited) organic light-emitting layer 260 film is thinner; in portions of the patterned photoresist layer 1210 with a smaller thickness, the openings are shallower, and the resulting (e.g., vapor-deposited) organic light-emitting layer 260 film is thicker. Figure 2C Draw removal Figure 2B A cross-sectional view of the intermediate structure of the organic light-emitting element with patterned photoresist layer 1210. The multiple sub-pixels formed by these organic light-emitting layers 260 of varying thicknesses will also produce gloss or light and shadow patterns due to differences in the reflection / refraction of light, visually creating light and shadow curves. Figure 3AThe 260P is similar to the light and shadow arc produced by the aforementioned photoresist (1200P).

[0046] Figure 3A A top view of a substrate of an intermediate product of an organic light-emitting element according to some embodiments is shown. Figure 3A For example, multiple regions 901 to 907 are arranged along the radius 900 of chip W. Figure 3B for Figure 3A A partial top view of one region of the organic light-emitting element (OLED) illustrates a portion of an intermediate product of the OLED. In some embodiments, the OLED 10 has a light-emitting layer 20 and a capping layer 40 located above the light-emitting layer 20. For the light-emitting layer 20, spacer structures 30 can be designed to define pixel regions, defining an array of light-emitting pixels. Furthermore, Figure 3A Other areas of the organic light-emitting element can also be referenced. Figure 3B .

[0047] In some embodiments, the spacer structure 30 includes a pixel defined layer (PDL), such as bumps, to provide an array of recesses for accommodating an array of light-emitting pixels. In some embodiments, the spacer structure 30 may include a photosensitive material, formed into bumps, which can serve as the pixel defined layer.

[0048] In some embodiments, with Figure 3A Taking an organic light-emitting element as an example, regions 901 to 907 are arranged along the radius 900 of the chip W. As mentioned above, the thickness of the patterned photoresist layer used to define the position of the organic light-emitting layer may gradually decrease from the center of the chip W to the periphery, thus causing the underlying organic light-emitting layer to have different thicknesses. Therefore, in any two pixel regions, such as the pixel region of region 901 and the pixel region of region 907, at least two organic light-emitting units of the same light color may include organic light-emitting layers of different thicknesses.

[0049] In some embodiments, taking an organic light-emitting element in one of the regions 901-907 as an example, such as... Figure 3B As shown, the organic light-emitting element 10 includes a plurality of pixel regions arranged in an array along a first direction D1 and a second direction D2. Each pixel region includes, for example, at least three organic light-emitting units 101, 102, and 103 of different colors. In some embodiments, the first direction D1 is perpendicular to the second direction D2. In some embodiments, the first direction D1 or the second direction D2 is parallel to the extending direction of the radius 900 of the chip W. In some embodiments, such as Figure 3B As shown, in different pixel areas, at least two organic light-emitting units with the same light color include organic light-emitting layers of different thicknesses.

[0050] In some embodiments, such as Figure 3BAs shown, two organic light-emitting units 101 separated by organic light-emitting units 102 and 103 in the first direction D1 may include organic light-emitting layers of different thicknesses due to variations in the thickness of the patterned photoresist layer. Similarly, two organic light-emitting units 102 separated by organic light-emitting units 103 and 101 in the first direction D1 may include organic light-emitting layers of different thicknesses due to variations in the thickness of the patterned photoresist layer. For example, two organic light-emitting units 103 separated by organic light-emitting units 101 and 102 in the first direction D1 may include organic light-emitting layers of different thicknesses due to variations in the thickness of the patterned photoresist layer.

[0051] Furthermore, in some embodiments, the multiple sub-pixels formed by the organic light-emitting layers 260 of varying thicknesses as described above will produce gloss or light and shadow patterns due to differences in the reflection / refraction of light, thus visually generating multiple light and shadow arcs 260P. The patterns of these light and shadow arcs 260P generated by the organic light-emitting layers 260 of varying thicknesses are similar to the light and shadow arcs 1200P generated by the aforementioned photoresist. Figure 1B ).exist Figure 3A The image shows one of the light and shadow arcs 260P as an example. The area defined by this light and shadow arc 260P can also be called a light and shadow pattern. The thickness of the organic light-emitting layer below the light and shadow pattern is different from the thickness of the organic light-emitting layer outside the light and shadow pattern.

[0052] Furthermore, such as Figure 3A The chip W shown, after being slit and packaged, only a local area of ​​chip W (e.g., a square unit area) is cut, and only a portion of the light and shadow arc 260P is defined by this local area, making it appear more like a diagonal line.

[0053] Figure 4 These are microscope images of a local area of ​​an organic light-emitting element according to some embodiments. In some embodiments, Figure 4 Presenting organic light-emitting elements in, for example Figure 3A The microscopic photograph of region R1 shown reveals multiple diagonal lines of light and shadow. Figure 4 Presenting the macroscopic appearance of the surface of an OLED chip (or organic light-emitting element) containing multiple pixels. In some embodiments, a sub-pixel of a set color (e.g., red) in the display panel is individually illuminated with a set grayscale value (e.g., grayscale value 128), while the grayscale of all other color (e.g., green, blue) sub-pixels is 0. That is, the grayscale of all sub-pixels of the set color in the display panel is the same set grayscale value (e.g., grayscale value 128). Figure 4 It is a microscope image taken of the red subpixel with a set grayscale value of 128.

[0054] Figure 4Multiple light and shadow patterns are displayed, formed by organic light-emitting layers of multiple sub-pixels. The non-uniformity of these light and shadow patterns constitutes the mura region of the organic light-emitting element. In some embodiments, the light and shadow patterns have arc or diagonal lines. In some embodiments, the light and shadow patterns have a rainbow-like neon effect.

[0055] Please refer to the following at the same time Figure 3A and Figure 4 In some embodiments, the light and shadow pattern of the organic light-emitting element, such as the light and shadow arc 260P, has a shape and position corresponding as follows: Figure 1B The shape and position of the light and shadow arc 1200P (from photoresist 1200) are shown. In some embodiments, each light and shadow pattern of the organic light-emitting element (having a range defined by the light and shadow arc 260P) may be formed by hundreds or thousands of pixels. In some embodiments, each light and shadow pattern may be formed by an organic light-emitting layer of the same color in hundreds or thousands of pixels. In some embodiments, the thickness of the organic light-emitting layer beneath the light and shadow pattern is different from the thickness of the organic light-emitting layer in the area outside the light and shadow pattern.

[0056] Furthermore, in some embodiments, different driving currents can be applied to the area of ​​the light and shadow pattern and the area outside the light and shadow pattern to compensate for the mura of the organic light-emitting element, thereby achieving mura defect repair (DeMura). In some embodiments, incremental or decremental or designed driving currents can be applied to address brightness differences caused by variations in the thickness of the organic light-emitting layer in the area of ​​the light and shadow pattern, thereby preventing the display of mura defects in the organic light-emitting element. In some embodiments, different driving currents can be provided based on the distribution of the light and shadow pattern through the driving circuit of the organic light-emitting element to eliminate the mura of the organic light-emitting element.

[0057] The following example illustrates a method for correcting pixel brightness values ​​of an organic light-emitting element. However, the present invention is not limited to the application of this correction method. Other correction methods that can balance brightness to eliminate mura can also be used in conjunction with the organic light-emitting elements of the embodiments.

[0058] Figure 5This is a flowchart illustrating a pixel brightness value correction method for an organic light-emitting element (OLED) according to some embodiments of the present invention. As in step S11, an OLED according to some embodiments is provided, wherein the OLED includes a plurality of pixels and a pixel driving circuit, the pixel driving circuit including a driving transistor configured to provide driving current to the pixels. As in step S12, a driving current is applied to the pixels of the OLED through the driving transistor to display a grayscale image to be processed. Then, as in step S13, the grayscale image to be processed of the pixels is acquired. In some embodiments, the grayscale image to be processed of the OLED pixels can be acquired by an imaging device (not shown). As in step S14, a balanced brightness value of the grayscale image to be processed is calculated. As in step S15, the brightness difference between the brightness value of each pixel and the balanced brightness value is determined. As in step S16, the driving current of each pixel is adjusted to compensate for the brightness difference.

[0059] In some embodiments, an imaging device acquires a grayscale image of pixels to be processed, and the imaging device may include a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it implements the steps of a pixel brightness value correction method for the grayscale image to be processed.

[0060] In some embodiments, the imaging device is coupled to a computer-readable storage medium. After acquiring a grayscale image of pixels to be processed, the imaging device uses a computer program stored in the computer-readable storage medium to calculate the brightness values ​​of the acquired grayscale image to obtain the update drive current value of each pixel.

[0061] In some embodiments, the organic light-emitting layer 260 of the pixels with lower brightness in the grayscale image to be processed ( Figure 2B , Figure 2C The thickness of the pixel may be relatively thin. The updated drive current value can be obtained by calculation based on the computer program. This updated drive current value is greater than the original drive current to improve the pixel brightness and make it approximately equal to the balanced brightness value.

[0062] In some embodiments, pixels with higher brightness in the grayscale image to be processed may have a thicker organic light-emitting layer 260. An updated driving current value can be obtained according to the calculation of a computer program. This updated driving current value is less than the original driving current to reduce the pixel brightness so that it is approximately equal to the balanced brightness value.

[0063] Therefore, the organic light-emitting element in the embodiment will exhibit Mura defects (such as...) before brightness compensation is performed. Figure 4The microscopic images shown may exhibit oblique or arc-shaped bright streaks, but after brightness compensation (such as calculation and updating of the drive current), the bright streaks no longer appear in the microscopic images of local areas of the organic light-emitting element. Therefore, after correction, the organic light-emitting element of the embodiment can compensate for the brightness difference between pixels, eliminating the Mura defect (DeMura) and solving the problems of uneven display brightness and poor display uniformity.

[0064] The following is a partial cross-sectional view of one embodiment of an organic light-emitting element 10. In some embodiments, Figure 6 Examples along Figure 3B The cross-sectional view of line 1A-1A' is shown, and only the luminescent area is illustrated.

[0065] like Figure 3B and Figure 6 As shown, in some embodiments, the spacer structure 30 has a plurality of bumps 310 to define a pattern of light-emitting pixels. Recesses are located between two adjacent bumps 310 and provide space to accommodate the light-emitting pixels. In some embodiments, the bumps 310 may comprise a photosensitive material. Those skilled in the art will understand that... Figure 6 From the cross-sectional view, protrusion 310 is drawn in a broken manner, but from Figure 3B As can be seen from the top view, they can be connected to each other via other parts of the spacer structure 30.

[0066] like Figure 6 As shown, in some embodiments, the organic light-emitting element 10 is, for example, a light-emitting element comprising an organic light-emitting diode (OLED) structure. In some embodiments, the organic light-emitting element 10 comprises a plurality of organic light-emitting units (or light-emitting pixels), such as at least organic light-emitting unit 101 (or first organic light-emitting unit), organic light-emitting unit 102 (or second organic light-emitting unit), and organic light-emitting unit 103 (or third organic light-emitting unit). In some embodiments, organic light-emitting units 101, 102, and 103 are located between bumps 310 and above substrate 100. Organic light-emitting units 101, 102, and 103 may emit light of the same wavelength or light of different wavelengths.

[0067] In some embodiments, the organic light-emitting element 10 includes a substrate 100, electrodes 215, 225, 235, and 216, a light-emitting layer 20, an inorganic barrier layer 268, an inorganic barrier layer 270, a spacer structure 30, and a cover layer 40.

[0068] In some embodiments, substrate 100 may include a transistor array configured to correspond to light-emitting pixels in light-emitting layer 20. Substrate 100 may include a plurality of capacitors. In some embodiments, more than one transistor is configured to form a circuit with a capacitor and a light-emitting pixel. In some embodiments, substrate 100 may include glass.

[0069] In some embodiments, electrodes 215, 225, and 235 are located on substrate 100. In some embodiments, electrodes 215, 225, and 235 are anodes. In some embodiments, electrodes 215, 225, and 235 comprise metallic materials, such as Ag, Al, Mg, Au, AlCu alloys, AgMo alloys, etc. In some embodiments, electrodes 215, 225, and 235 comprise indium tin oxide (ITO), indium zinc oxide (IZO), or other suitable materials.

[0070] In some embodiments, the light-emitting layer 20 includes an organic light-emitting layer 260A (or a first organic light-emitting layer), an organic light-emitting layer 260B (or a second organic light-emitting layer), and an organic light-emitting layer 260C (or a third organic light-emitting layer). In some embodiments, organic light-emitting layer 260A is located on electrode 215, organic light-emitting layer 260B is located on electrode 225, and organic light-emitting layer 260C is located on electrode 235. In some embodiments, the thicknesses of organic light-emitting layer 260A, organic light-emitting layer 260B, and organic light-emitting layer 260C are all different from each other. In some embodiments, in some cases, the thickness of organic light-emitting layer 260B is greater than the thickness of organic light-emitting layer 260A, and the thickness of organic light-emitting layer 260A is greater than the thickness of organic light-emitting layer 260C.

[0071] In some embodiments, organic light-emitting layers 260A, 260B, and 260C emit light of the same or different colors. In some embodiments, the emission wavelength of organic light-emitting layer 260B is greater than that of organic light-emitting layer 260A, and the emission wavelength of organic light-emitting layer 260A is greater than that of organic light-emitting layer 260C. In some embodiments, organic light-emitting layer 260A emits green light, organic light-emitting layer 260B emits red light, and organic light-emitting layer 260C emits blue light.

[0072] In some embodiments, the organic material layer of organic light-emitting layers 260A, 260B, and 260C comprises organic material, which may be placed in any one of the organic material layers of organic light-emitting layers 260A, 260B, and 260C according to different implementations. In some embodiments, the organic material has an absorption rate of 50% or greater than or equal to 60%, 70% or greater than or equal to 70%, 80% or greater than or equal to 80%, 90% or greater than or equal to 95% for a specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm, or not greater than 350 nm, or not greater than 300 nm, or 250 nm, or not greater than 200 nm, or not greater than 150 nm, or not greater than 100 nm.

[0073] like Figure 6 As shown, in some embodiments, the organic light-emitting unit 101 includes an electrode 215, an organic light-emitting layer 260A, and an electrode 216. In some embodiments, the organic light-emitting layer 260A includes multiple organic material layers, such as a hole injection layer (HIL) 261A, a hole injection layer (HIL) 261B, a hole transport layer (HTL) 262A, a hole transport layer (HTL) 262B, an organic emission layer (EM) 264, an electron transport layer (ETL) 265, and an electron injection layer (EIL) 266. In some embodiments, the electrode 216 is located above the organic light-emitting layer 260A.

[0074] like Figure 6 As shown, in some embodiments, the organic light-emitting unit 102 includes an electrode 225, an organic light-emitting layer 260B, and an electrode 216. In some embodiments, the organic light-emitting layer 260B includes multiple organic material layers, such as a hole injection layer (HIL) 261A, a hole injection layer (HIL) 261B, a hole transport layer (HTL) 262A, a hole transport layer (HTL) 262B, an organic emission layer (EM) 264, a hole blocking layer (HBL) 267, an electron transport layer (ETL) 265, and an electron injection layer (EIL) 266. In some embodiments, the electrode 216 is located above the organic light-emitting layer 260B.

[0075] like Figure 6As shown, in some embodiments, the organic light-emitting unit 103 includes an electrode 235, an organic light-emitting layer 260C, and an electrode 216. In some embodiments, the organic light-emitting layer 260C includes multiple organic material layers, such as a hole injection layer (HIL) 261A, a hole injection layer (HIL) 261B, a hole transport layer (HTL) 262A, a hole transport layer (HTL) 262B, an organic emission layer (EM) 264, an electron transport layer (ETL) 265, and an electron injection layer (EIL) 266. In some embodiments, the electrode 216 is located above the organic light-emitting layer 260C. In some embodiments, the electrode 216 is a cathode.

[0076] In some embodiments, electrode 216 is in contact with organic light-emitting layers 260A, 260B, and 260C. Electrode 216 may be as follows: Figure 6 The continuous film shown is located above the organic light-emitting layers 260A, 260B, and 260C and the bump 310. In some embodiments, the electrode 216 may be further located on the spacer structure 30. In some embodiments, the electrode 216 is a common electrode for all light-emitting pixels in the light-emitting layer 20. In some embodiments, the electrode 216 comprises a metallic material, such as Ag, Al, Mg, Au, AlCu alloy, AgMo alloy, etc. In some embodiments, the electrode 216 comprises ITO, IZO, or other suitable materials. In other words, the electrode 216 is a common electrode for several organic light-emitting units. In some embodiments, the electrode 216 is a common electrode for all organic light-emitting units in the organic light-emitting element 10.

[0077] In some embodiments, spacer structure 30 is located on substrate 100 and partially covers electrodes 215, 225, and 235. In some embodiments, spacer structure 30 is located between organic light-emitting layers 260A, 260B, and 260C. In some embodiments, spacer structure 30 may include bumps 310. In some embodiments, the pattern of spacer structure 30 is designed according to pixel arrangement. In some embodiments, spacer structure 30 serves as a pixel defined layer (PDL). In some embodiments, bumps 310 define pixel regions. In some embodiments, each bump 310 fills the gap between two adjacent electrodes 215, 225, and 235. Each electrode 215, 225, and 235 is partially covered by bump 310. In some embodiments, spacer structure 30 includes an organic insulating material. In some embodiments, spacer structure 30 includes a photosensitive material. In some embodiments, spacer structure 30 may further include quantum dots, which have excellent light absorption performance. In some embodiments, the spacer structure 30 may further comprise a carbon black material, such as carbon black nanoparticles, carbon black-containing conductive fibers, or the like. In some embodiments, the spacer structure 30 may further comprise a blackbody material having an absorption rate of 90%, 95%, 99%, 99.5%, or 99.9% or higher for visible light.

[0078] In some embodiments, the spacer structure 30 has an absorption rate of 50% or more, or 60% or more, or 70% or more, or 80% or more, or 90% or more, or 95% or more for a specific wavelength. In some embodiments, the specific wavelength is not greater than 400 nm, or not greater than 350 nm, or not greater than 300 nm, or not greater than 250 nm, or not greater than 200 nm, or not greater than 150 nm, or not greater than 100 nm.

[0079] In some embodiments, the capping layer 40 includes a capping layer 410, an encapsulation layer 420, a filler layer 430, and a cover plate 440. In some embodiments, the capping layer 410 is disposed on the electrode 216 and is substantially conformal to the non-planar upper surface of the electrode 216. The capping layer 410 may comprise a dielectric material or an inorganic insulating material, such as silicon oxide. In some embodiments, the capping layer 410 may comprise a hole transport layer material for extracting light lost inside the organic light-emitting element to increase luminous efficiency. The capping layer 410 may also be referred to as a light extraction layer.

[0080] In some embodiments, the encapsulation layer 420 is disposed on the capping layer 410 and is substantially conformally oriented to the non-planar upper surface of the capping layer 410. The encapsulation layer 420 may comprise an oxide, such as silicon oxide. In some embodiments, the encapsulation layer 420 is substantially conformally oriented to the non-planar upper surface of the capping layer 410 and has a plurality of recesses corresponding to the organic light-emitting layers 260A, 260B, and 260C. The encapsulation layer 420 may comprise a polymeric organic material, such as an epoxy-based material.

[0081] In some embodiments, the filler layer 430 is disposed on the encapsulation layer 420, and the lower surface of the filler layer 430 is substantially conformal to the non-planar upper surface of the encapsulation layer 420. The filler layer 430 may also be referred to as a planarization layer. The filler layer 430 may contain a polymeric organic material, such as epoxy resin.

[0082] In some embodiments, a cover plate 440 is disposed on the flat upper surface of the filler layer 430. The cover plate 440 may also be referred to as a protective layer. The cover plate 440 may comprise a transparent rigid cover plate, such as a glass plate. The cover plate 440 is used to prevent the organic light-emitting element from coming into contact with external moisture, which could cause the element to fail and lose its ability to emit light. In some embodiments, surface 440a of the cover plate 440 is a light-emitting surface.

[0083] In some embodiments, an inorganic barrier layer 268 is located between electrodes 215, 225, and 235 and organic light-emitting layers 260A, 260B, and 260C. In some embodiments, the side surfaces of the inorganic barrier layer 268 contact bumps 310. In some embodiments, the inorganic barrier layer 268 substantially completely covers the interface between electrodes 215, 225, and 235 and organic light-emitting layers 260A, 260B, and 260C. In some embodiments, the inorganic barrier layer 268 comprises a transition metal oxide. In some embodiments, the inorganic barrier layer 268 comprises molybdenum oxide (MoO3). In some embodiments, the thickness of the inorganic barrier layer 268 is equal to or less than 100 angstroms. In some embodiments, the ratio of the thickness of the inorganic barrier layer 268 to the thickness of electrodes 215, 225, and 235 is less than 0.1, 0.06, or 0.03. In some embodiments, the inorganic barrier layer 268 and the hole injection layers 261A and 261B can together constitute the hole injection layer of the organic light-emitting layers 260A, 260B and 260C.

[0084] In some embodiments, the inorganic barrier layer 270 contacts the capping layer 410. In some embodiments, the inorganic barrier layer 270 covers the electrode 216. In some embodiments, the capping layer 410 is located on the inorganic barrier layer 270 and is separated from the electrode 216 through the inorganic barrier layer 270. In some embodiments, the inorganic barrier layer 270 substantially completely covers the interface between the electrode 216 and the capping layer 410. In some embodiments, the inorganic barrier layer 270 comprises a transition metal oxide. In some embodiments, the inorganic barrier layer 270 comprises molybdenum oxide (MoO3). In some embodiments, the thickness of the inorganic barrier layer 270 is equal to or less than 100 angstroms. In some embodiments, the ratio of the thickness of the inorganic barrier layer 270 to the thickness of the electrode 216 is less than 0.15, 0.1, or 0.05. In some embodiments, the ratio of the thickness of the inorganic barrier layer 270 to the thickness of the capping layer 410 is less than 0.5, 0.3, or 0.15.

[0085] Furthermore, according to some embodiments of this disclosure, the inorganic barrier layer 268 can be used to block metal atoms in the electrode 215 from diffusing into the organic light-emitting layers 260A, 260B, and 260C (e.g., hole injection layer 261, hole transport layer 262, electron blocking layer 263, and organic emitting layer 264), preventing quenching and thus avoiding a decrease in luminous efficiency. This, in turn, can improve the luminous brightness and color rendering index (RA) of the organic light-emitting element. Furthermore, according to some embodiments of this disclosure, the inorganic barrier layer 268 has a very thin thickness relative to the electrodes 215, 225, and 235, therefore it does not significantly increase the thickness of the organic light-emitting element, nor does it adversely lengthen the light-emitting path.

[0086] Furthermore, according to some embodiments of this disclosure, the inorganic barrier layer 270 can be used to block metal atoms in the electrode 216 from diffusing into the organic layer (e.g., capping layer 410), preventing a decrease in luminous efficiency, thereby improving the luminous brightness and color rendering index (RA) of the organic light-emitting element. Moreover, according to some embodiments of this disclosure, the inorganic barrier layer 270 has a very thin thickness relative to the electrode 216 and capping layer 410, therefore it does not significantly increase the thickness of the organic light-emitting element, nor does it adversely lengthen the light-emitting path.

[0087] Figures 7A to 7F Drawing based on Figure 6 Methods for fabricating organic light-emitting elements 10 in some embodiments.

[0088] like Figure 7AAs shown, in some embodiments, a substrate 100 is provided, on which a plurality of electrodes 215, 225, and 235 are disposed, forming a plurality of bumps 310 (or spacer structures 30), each bump 310 filling the gap between adjacent electrodes 215, 225, and 235. In some embodiments, each bump 310 fills the gap between adjacent electrodes 215, 225, and 235. In some embodiments, electrodes 215, 225, and 235 are made of a transparent conductive material.

[0089] Next, in some embodiments, an inorganic barrier layer 268, a hole injection layer (HIL) 261A, a hole injection layer (HIL) 261B, a hole transport layer (HTL) 262A, and a hole transport layer (HTL) 262B are formed on the surfaces of the bumps 310 and the electrodes 215, 225, and 235. In some embodiments, the inorganic barrier layer 268, the hole injection layer 261A, the hole injection layer 261B, the hole transport layer 262A, and the hole transport layer 262B are formed by evaporation. In some embodiments, an inorganic barrier layer 268, a hole injection layer 261A, a hole injection layer 261B, a hole transport layer 262A, and a hole transport layer 262B can be deposited over electrodes 215, 225, and 235. Because the inorganic barrier layer 268, the hole injection layer 261A, the hole injection layer 261B, and the hole transport layer 262B are relatively thin, these layers are disconnected from each other over the bumps 310. Because the hole transport layer 262A is relatively thick, it is formed to continuously extend over electrodes 215, 225, and 235 and over the bumps 310.

[0090] like Figure 7B As shown, in some embodiments, a buffer layer 301 is disposed on the bump 310, and the buffer layer 301 also covers the inorganic barrier layer 268, hole injection layer 261A, hole injection layer 261B, hole transport layer 262A, hole transport layer 262B, and electrodes 215, 225, and 235. The buffer layer 301 is used to prevent moisture from penetrating into the bump 310 and the inorganic barrier layer 268, hole injection layer 261A, hole injection layer 261B, hole transport layer 262A, and hole transport layer 262B. Next, in some embodiments, a photosensitive layer 302 is disposed on the buffer layer 301. In some embodiments, the buffer layer 301 and the photosensitive layer 302 are formed by coating. In some embodiments, the photosensitive layer 302 formed by coating has a varying thickness. The thickness of the photosensitive layer 302 gradually decreases with increasing distance from the center of the chip W (e.g., ...). Figure 2A (As shown).

[0091] Next, in some embodiments, the photosensitive layer 302 is patterned using a lithography process to expose a portion of the buffer layer 301 through the groove 312. Then, in some embodiments, a portion of the buffer layer 301 is removed to have a groove 313, exposing the hole transport layer 262B. In some embodiments, the buffer layer 301 is removed using a wet etching process.

[0092] like Figure 7C As shown, in some embodiments, an organic emission layer (EM) 264 is formed on the hole transport layer 262B via grooves 312 and 313, followed by an electron transport layer (ETL) 265 formed on the organic emission layer (EM) 264. In some embodiments, the organic emission layer 264 and the electron transport layer 265 are formed by evaporation. In some embodiments, the thicker the patterned photosensitive layer 302, the thinner the organic emission layer 264 deposited on the hole transport layer 262B.

[0093] like Figure 7D As shown, in some embodiments, the buffer layer 301, the photosensitive layer 302, and a portion of the organic emission layer 264 and electron transport layer 265 above the photosensitive layer 302 are removed. In some embodiments, the buffer layer 301, the photosensitive layer 302, a portion of the organic emission layer 264, and a portion of the electron transport layer 265 are removed by a wet etching process. In some embodiments, the process is repeated as follows. Figures 7B to 7C The steps described involve forming an organic emission layer 264, a hole blocking layer (HBL) 267, and an electron transport layer 265 on electrode 225, and forming the organic emission layer 264 and the electron transport layer 265 on electrode 235. In some embodiments, the organic emission layer 264, the hole blocking layer (HBL) 267, and the electron transport layer 265 are formed by evaporation.

[0094] like Figure 7E As shown, in some embodiments, an electron injection layer (EIL) 266 is provided on the bump 310 and the electron transport layer 265. This forms organic light-emitting layers 260A, 260B, and 260C (or light-emitting layer 20). Next, in some embodiments, electrodes 216 are provided on the organic light-emitting layers 260A, 260B, and 260C and the spacer structure 30, and an inorganic barrier layer 270 is provided on the electrodes 216. This forms organic light-emitting units 101, 102, and 103.

[0095] like Figure 7FAs shown, in some embodiments, a capping layer 410 is provided on the inorganic barrier layer 270. In some embodiments, the capping layer 410 is formed by evaporation. Next, in some embodiments, an encapsulation layer 420 is provided on the capping layer 410. In some embodiments, the encapsulation layer 420 is formed by plasma-assisted chemical vapor deposition (PECVD). Next, in some embodiments, a filler layer 430 is provided on the encapsulation layer 420, and a cover plate 440 is provided on the filler layer 430. Thus, a cover layer 40 is formed, which includes the capping layer 410, the encapsulation layer 420, the filler layer 430, and the cover plate 440. Figure 7F As shown, this completes the process. Figure 6 The organic light-emitting element 10 shown.

[0096] Figure 8 The diagram illustrates an organic light-emitting element according to some embodiments, with schematic diagrams of organic light-emitting layers of different organic light-emitting units. Figure 8 This is an example of a partial cross-sectional view of an organic light-emitting element taken from a region of chip W. For clarity, the following... Figure 8 The organic light-emitting unit is shown in a simplified form with some labels omitted. The various material layers / components of the organic light-emitting unit can be referenced. Figure 6 , Figures 7A-7F And related content.

[0097] In some embodiments, at least two organic light-emitting units of the same light color comprise organic light-emitting layers of different thicknesses. For example... Figure 8 As shown, the organic light-emitting element in the selected area has a first side edge E1 and a second side edge E2. The second side edge E2 is relative to the first side edge E1. Two organic light-emitting units in the organic light-emitting element, each including an organic light-emitting layer of the same color but different thicknesses, are located in a horizontal direction, for example, arranged along a first direction D1 and adjacent to the first side edge E1 and the second side edge E2, respectively.

[0098] Furthermore, in some embodiments, such as Figure 8 As shown, the organic light-emitting element includes multiple spaced bottom electrodes (e.g., electrodes 215, 225, 235 serving as the anodes of each organic light-emitting unit), electrode 216 (also referred to as the top electrode), and an organic light-emitting layer located between the bottom electrodes 215, 225, 235 and the top electrode 216.

[0099] like Figure 8As shown, an example of two pixels (each containing three sub-pixels of different colors) is used. In some embodiments, when fabricated on chip W, organic light-emitting units 101-1, 102-1, and 103-1 are closer to the first side edge E1 and closer to the chip center than organic light-emitting units 101-2, 102-2, and 103-2. Therefore, when fabricating the patterned photoresist used to define the position of the organic light-emitting layer, the photoresist height is relatively high, resulting in a relatively thin organic light-emitting layer that is subsequently filled in.

[0100] In some embodiments, organic light-emitting unit 101-1 and organic light-emitting unit 101-2 include organic light-emitting layers 260A-1 and 260A-2 that emit the same light color (e.g., but not limited to green) but have different thicknesses. In some embodiments, the thickness HA-1 of organic light-emitting layer 260A-1 is less than the thickness HA-2 of organic light-emitting layer 260A-2; that is, HA-1 <HA-2。

[0101] In some embodiments, organic light-emitting unit 102-1 and organic light-emitting unit 102-2 include organic light-emitting layers 260B-1 and 260B-2 that emit the same light color (e.g., but not limited to red) but have different thicknesses. In some embodiments, the thickness of organic light-emitting layer 260B-1 is smaller than the thickness of organic light-emitting layer 260B-2, that is, HB-1 <HB-2。

[0102] In some embodiments, organic light-emitting unit 103-1 and organic light-emitting unit 103-2 include organic light-emitting layers 260C-1 and 260C-2 that emit the same light color (e.g., but not limited to blue) but have different thicknesses. In some embodiments, the thickness HC-1 of organic light-emitting layer 260C-1 is less than the thickness HC-2 of organic light-emitting layer 260C-2, that is, HC-1 <HC-2。

[0103] In some embodiments, the emission wavelengths of organic light-emitting layers 260B-1 and 260B-2 (e.g., but not limited to red light wavelengths) are greater than the emission wavelengths of organic light-emitting layers 260A-1 and 260A-2 (e.g., but not limited to green light wavelengths), while the emission wavelengths of organic light-emitting layers 260A-1 and 260A-2 are greater than the emission wavelengths of organic light-emitting layers 260C-1 and 260C-2 (e.g., but not limited to blue light wavelengths).

[0104] Additionally, in some embodiments, the bumps 310 used to define and provide for accommodating the array of light-emitting pixels may comprise organic materials, such as photosensitive materials formed on the chip W through spin coating and fabricated by patterning. Therefore, as described above... Figure 1A , 1BAs described in section 2A, the height of these bumps 310, such as the maximum vertical height, also varies depending on their position during fabrication on the chip W. In some embodiments, organic light-emitting units 101-1, 102-1, and 103-1 are fabricated closer to the center of the chip W than organic light-emitting units 101-2, 102-2, and 103-2. Therefore, when fabricating the bumps 310, the maximum vertical height (or simply height) of the bumps 310 gradually decreases with increasing distance from the center of the chip W.

[0105] In some embodiments, the bumps 310 corresponding to the organic light-emitting layers 260A-1, 260B-1, 260C-1, 260A-2, 260B-2, and 260C-2 are arranged from near the chip center to near the chip edge, and therefore the heights H11, H12, H13, H21, H22, and H23 of the bumps 310 are arranged from high to low. According to some embodiments, two organic light-emitting layers (the first light-emitting layer and the second light-emitting layer) of the same light color have a first thickness and a second thickness greater than the first thickness, respectively, while the bumps adjacent to the first and second light-emitting layers have a first height and a second height less than the first height, respectively.

[0106] Furthermore, in some embodiments, as described above, Figure 8 The light and shadow pattern of the organic light-emitting element is also shown, such as the light and shadow arc 260P. The thickness of the organic light-emitting layer of each organic light-emitting unit below the light and shadow arc 260P is the same, and the thickness of the organic light-emitting layer below the light and shadow arc 260P is different from the thickness of the organic light-emitting layer outside the light and shadow arc 260P.

[0107] Furthermore, in some embodiments, substrate 100 may include a silicon substrate and an insulating layer (not shown; for example, but not limited to, a silicon dioxide layer) located above the silicon substrate. In some embodiments, substrate 100 may include a transistor array configured to correspond to the light-emitting pixels in light-emitting layer 20. Substrate 100 may include a plurality of capacitors (not shown). In some embodiments, transistor 110 is configured to form a circuit with the capacitors and the light-emitting pixels to electrically connect and control the respective organic light-emitting units. For example, transistors 111-1, 112-1, and 113-1 (which may be collectively referred to as transistor 110-1) are electrically connected to organic light-emitting units 101-1, 102-1, and 103-1, respectively. Transistors 111-2, 112-2, and 113-2 (which may be collectively referred to as transistor 110-2) are electrically connected to organic light-emitting units 101-2, 102-2, and 103-2, respectively.

[0108] Although Figure 8The organic light-emitting element is illustrated using only two pixels as an example, but this disclosure is not intended to be limiting. In some embodiments, the organic light-emitting element may include multiple pixels, such as three, four, five, ... pixels, and therefore the organic light-emitting element may include several organic light-emitting layers of different thicknesses and the same light color. Furthermore, according to an embodiment, the organic light-emitting element exhibits Mura defects before brightness compensation, but after brightness compensation as described above, for example by controlling and applying updated pixel drive current values ​​through transistors 110 coupled to the respective organic light-emitting units, it achieves brightness balance.

[0109] The foregoing outlines some features of the embodiments, thus enabling those skilled in the art to better understand various aspects of this disclosure. Those skilled in the art should understand that this disclosure can be readily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or the same advantages as the embodiments described in this application. Those skilled in the art should also understand that this equivalent architecture does not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this disclosure.

[0110] Symbol Explanation

[0111] 10 Organic light-emitting elements

[0112] 20 Organic light-emitting layer (light-emitting layer)

[0113] 30 Spacer Structure

[0114] 40 Covering layer

[0115] 100 substrates

[0116] 101 Organic Light Emitting Unit

[0117] 101-1 Organic Light Emitting Unit

[0118] 101-2 Organic Light Emitting Unit

[0119] 102 Organic Light Emitting Units

[0120] 102-1 Organic Light Emitting Unit

[0121] 102-2 Organic Light Emitting Unit

[0122] 103 Organic Light Emitting Units

[0123] 103-1 Organic Light Emitting Unit

[0124] 103-2 Organic Light Emitting Unit

[0125] 110 transistors

[0126] 110-1 Transistor

[0127] 111-1 Transistor

[0128] 112-1 Transistor

[0129] 113-1 Transistor

[0130] 110-2 transistor

[0131] 111-2 Transistor

[0132] 112-2 Transistor

[0133] 113-2 Transistor

[0134] 215 electrode

[0135] 216 electrode

[0136] 225 electrode

[0137] 235 electrode

[0138] 260 Organic light-emitting layer

[0139] 260A Organic Light Emitting Layer

[0140] 260A-1 Organic Light Emitting Layer

[0141] 260A-2 Organic Light Emitting Layer

[0142] 260B Organic Light Emitting Layer

[0143] 260B-1 Organic Light Emitting Layer

[0144] 260B-2 Organic Light Emitting Layer

[0145] 260C Organic Light Emitting Layer

[0146] 260C-1 Organic Light Emitting Layer

[0147] 260C-2 Organic Light Emitting Layer

[0148] 260P Light and Shadow Curves

[0149] 261 Hole Injection Layer

[0150] 261A Hole Injection Layer

[0151] 261B Hole Injection Layer

[0152] 262 Hole Transport Layer

[0153] 262A Hole Transport Layer

[0154] 262B Hole Transport Layer

[0155] 263 Electron blocking layer

[0156] 264 Organic Emitting Layer

[0157] 265 Electron Transport Layer

[0158] 266 Electron Injection Layer

[0159] 267 Hole-blocking layer

[0160] 268 Inorganic barrier layer

[0161] 270 Inorganic barrier layer

[0162] 301 Buffer Layer

[0163] 302 Photosensitive Layer

[0164] 310-pixel definition layer (bump)

[0165] 312 Groove

[0166] 313 Groove

[0167] 410 cap layer

[0168] 420 encapsulation layer

[0169] 430 fill layer

[0170] 440 cover plate

[0171] 440a surface

[0172] 700 Spin Coating Machine

[0173] 900 chip radius

[0174] Area 901

[0175] Area 902

[0176] Area 903

[0177] Area 904

[0178] Area 905

[0179] Area 906

[0180] Area 907

[0181] 1200 photoresist

[0182] 1210 Patterned photoresist layer

[0183] 1200P Light and Shadow Curves

[0184] W chip

[0185] Step S11

[0186] Step S12

[0187] Step S13

[0188] Step S14

[0189] S15 Step

[0190] Step S16

[0191] 1A-1A' line

[0192] HA-1 thickness

[0193] HA-2 thickness

[0194] HB-1 thickness

[0195] HB-2 thickness

[0196] HC-1 thickness

[0197] HC-2 thickness

[0198] H11 Height

[0199] H12 height

[0200] H13 height

[0201] H21 height

[0202] H22 height

[0203] H23 height

[0204] E1 First Lateral Edge

[0205] E2 Second Lateral Edge

[0206] D1 First Direction

[0207] D2 Second Direction

Claims

1. An organic light-emitting element, comprising: substrate; and A plurality of organic light-emitting units are located on the substrate, each organic light-emitting unit comprising: The first electrode is located on the substrate; An organic light-emitting layer, which is located on the first electrode; and The second electrode is located on the organic light-emitting layer, and one of the first electrode and the second electrode comprises a transparent conductive material; Wherein, at least two organic light-emitting units of the same light color in the organic light-emitting unit include organic light-emitting layers of different thicknesses.

2. The organic light-emitting element as claimed in claim 1, wherein the first electrode comprises a plurality of spaced electrode portions, and the organic light-emitting layer comprises a plurality of first organic light-emitting layers, a plurality of second organic light-emitting layers, and a plurality of third organic light-emitting layers respectively disposed corresponding to the electrode portions. The emission wavelength of the second organic light-emitting layer is greater than that of the first organic light-emitting layer, and at least two second organic light-emitting units include second organic light-emitting layers of different thicknesses.

3. The organic light-emitting element as claimed in claim 2, wherein at least two of the first organic light-emitting units comprise first organic light-emitting layers of different thicknesses.

4. The organic light-emitting element as claimed in claim 2, wherein the emission wavelength of the first organic light-emitting layer is greater than the emission wavelength of the third organic light-emitting layer, and at least two of the third organic light-emitting units include the third organic light-emitting layers of different thicknesses.

5. The organic light-emitting element of claim 1, further comprising a pixel defined layer (PDL) to define a plurality of pixel regions, wherein the first electrode includes a plurality of electrode portions spaced apart in the pixel regions, and the pixel defined layer includes a plurality of bumps partially covering the electrode portions, wherein at least two of the bumps have different maximum vertical heights.

6. The organic light-emitting element of claim 5, wherein the bump comprises an organic material.

7. The organic light-emitting element of claim 1, wherein the pixel area bumps of at least two of the organic light-emitting units that define the same light color have different maximum vertical heights.

8. The organic light-emitting element as claimed in claim 1, wherein at least two of the organic light-emitting units emitting the same light color have different brightness under the same driving current.

9. The organic light-emitting element as claimed in claim 1, wherein at the same grayscale value, a portion of the organic light-emitting units emitting the same light color have the same brightness, and the portions are arranged in a diagonal line or an arc.

10. The organic light-emitting element of claim 9, wherein the portions of the organic light-emitting units having the same brightness comprise the organic light-emitting layer of the same thickness.

11. The organic light-emitting element of claim 1, further comprising a plurality of bumps defining a plurality of pixel regions, wherein at least two of the organic light-emitting layers of the same color are a first light-emitting layer having a first thickness and a second light-emitting layer having a second thickness, the bumps comprising a first bump adjacent to the first light-emitting layer and a second bump adjacent to the second light-emitting layer, wherein the first thickness is less than the second thickness, and the height of the first bump is greater than the height of the second bump.

12. The organic light-emitting element of claim 1, having a first side edge and a second side edge, wherein the second side edge is relative to the first side edge, and two organic light-emitting units comprising organic light-emitting layers of the same color but different thicknesses are located in a horizontal direction and are respectively adjacent to the first side edge and the second side edge.

13. The organic light-emitting element as claimed in claim 1, wherein at least three organic light-emitting units of the same light color comprise organic light-emitting layers of different thicknesses.

14. The organic light-emitting element of claim 1, comprising a plurality of pixel regions arranged in an array along a first direction and a second direction, each pixel region comprising at least three organic light-emitting units of different colors, wherein the organic light-emitting units of at least two of the pixel regions arranged along the first direction or the second direction comprise organic light-emitting layers of different thicknesses.

15. A method for correcting pixel brightness values ​​of an organic light-emitting element, comprising: An organic light-emitting element as claimed in any one of claims 1 to 14 is provided, wherein the organic light-emitting element includes a plurality of pixels and a pixel driving circuit, the pixel driving circuit including a driving transistor configured to provide a driving current to the pixel; A driving current is applied to the pixel through the driving transistor; Obtain a grayscale image of the pixel to be processed; Calculate a balanced brightness value for the grayscale image to be processed; Determine the brightness difference between each brightness value of the pixel and the balanced brightness value; as well as Adjust the driving current of the pixel to compensate for the brightness difference.

16. The pixel brightness value correction method for an organic light-emitting element as described in claim 15, wherein the pixel of a set color of the organic light-emitting element is illuminated with a set grayscale value to obtain the grayscale image to be processed, and the grayscale image to be processed has an uneven light and shadow pattern.

17. The pixel brightness value correction method for an organic light-emitting element as described in claim 15, wherein the grayscale image to be processed of the pixel is acquired by an imaging device, the imaging device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, the processor executing the computer program to implement the pixel brightness value correction method for the grayscale image to be processed.

18. The pixel brightness value correction method for an organic light-emitting element as described in claim 15, wherein a grayscale image of the pixel to be processed is acquired by an imaging device, the imaging device is coupled to a computer-readable storage medium, and a computer program stored in the computer-readable storage medium is used to calculate the brightness value of the acquired grayscale image to be processed, thereby obtaining the updated driving current value of the pixel.

19. The pixel brightness value correction method for an organic light-emitting element as described in claim 15, wherein a larger driving current is provided to the pixel with lower brightness and a smaller driving current is provided to the pixel with higher brightness.

Images