Waveguide component, waveguide device and method of manufacturing a waveguide component

Abstract

The waveguide component (100) includes: a component (10) made of a non-conductive material having an upper surface (11), a lower surface (12), a strip (14), and a plurality of holes (16), wherein the strip (14) is recessed from the lower surface (12) to the upper surface (11) and has a first top surface (15) extending in a strip shape, the plurality of holes (16) extend from the lower surface (12) to the upper surface (11) and are disposed adjacent to at least a portion of the strip (14), the plurality of holes (16) having a second top surface (17) and a side peripheral surface (18); and a conductive film (20) that at least covers the upper surface (11), the lower surface (12), the first top surface (15) of the strip (14), and the second top surface (17) and the side peripheral surface (18) of the plurality of holes (16) of the component (10).

Description

Technical Field

[0001] This invention relates to waveguide components, waveguide devices, and methods for manufacturing waveguide components. Background Technology

[0002] In recent years, research and development on sensing and communication using millimeter waves has been expanding, demanding high-gain, low-loss, wide-bandwidth, and multi-channel antennas. Correspondingly, the development of WRG (Waffle Iron Ridge Waveguide) technology, useful as a next-generation antenna and waveguide, is underway (e.g., Patent Documents 1 and 2). In Patent Document 1... Figure 3 The basic structure of a WRG is disclosed in [the document]. As a subordinate, subsidiary structure, Patent Document 2 discloses a structure for fixing two conductive components constituting the basic structure outside the waveguide region, as one of the structures of a WRG in high-frequency bands such as millimeter waves. One characteristic of WRG technology is that separation walls are formed in multiple waveguides within an antenna, from the millimeter-wave IC (MMIC: Monolithic Microwave Integrated Circuit) to the antenna's radiating aperture for transmitting and receiving millimeter-wave electromagnetic waves, to prevent coupling between adjacent waveguides. This prevents leakage of propagating electromagnetic waves, maintaining transmission loss comparable to that of a metal waveguide, and minimizing interference with transmitted electromagnetic waves from adjacent waveguides. Such separation walls are absent in conventional microstrip waveguides and microstrip antennas.

[0003] Millimeter-wave antennas are primarily used in imaging radar sensing with multiple transmit and receive channels. When microstrip antennas are used in this application, in addition to high waveguide losses, interference can occur due to coupling between adjacent waveguides and antenna radiating elements, leading to problems with object detection accuracy. On the other hand, when using WRG (Wavelength Resonance Generation) technology in such multi-channel antennas, not only are waveguide losses extremely low, but coupling between adjacent waveguides within the antenna is also significantly suppressed. Furthermore, by using antenna radiating apertures suitable for WRG, such as small horn antennas or slot antennas, mutual coupling can be further suppressed. Therefore, accurate signal transmission and reception can be achieved between the antenna transmit / receive apertures and the MMIC (Micro-Mic Interface Device) terminals for these signal transmissions and receptions. As a result, for example, in millimeter-wave radar sensing, the signal of the object contained in the received electromagnetic wave from the object can be accurately detected, leading to accurate object detection.

[0004] In WRG technology, the separation wall is achieved by magnetic walls disposed on both sides of the ridge waveguide, which can be implemented, for example, by a periodic structure such as a row of rods. When the magnetic wall is implemented using a single row of rods, a separation effect of approximately 30 dB can be expected. To further improve the separation effect, when two rows of rods are disposed between two ridge waveguides, a separation effect of approximately 40 dB can be expected, achieving high separation performance suitable for use as an array antenna. Such magnetic walls have a confinement function that blocks the propagation of electromagnetic waves in the corresponding frequency band. Furthermore, the structure constituting the magnetic wall is called an Artificial Magnetic Conductor (AMC), which can also be implemented using structures other than rods (e.g., Patent Document 2). For example, the description in the middle of paragraph 0015 of Patent Document 2, "The texture or structure is often periodic or quasi-periodic, and is configured to interact with waves so that it operates macroscopically as an Artificial Magnetic Conductor (AMC), an Electromagnetic Bandgap (EBG) surface, or a soft surface," can be used as a reference.

[0005] Patent documents 3 and 4 disclose means for adjusting the characteristics of a ridge waveguide as a WRG waveguide, and provide means for adjusting the waveguide characteristics when used in a wide range of applications.

[0006] Existing technical documents

[0007] Patent documents

[0008] Patent Document 1: International Publication No. 03 / 065497

[0009] Patent Document 2: Japanese Patent Publication No. 2011-527171

[0010] Patent Document 3: Japanese Patent Publication No. 2018-511187

[0011] Patent Document 4: Japanese Patent Application Publication No. 2017-130924 Summary of the Invention

[0012] The technical problem that the invention aims to solve

[0013] The basic structure of a waveguide gantry (WRG) is, for example, an assembly of a first conductive component comprising a ridge and a row of rods, and a second conductive component forming a top plate. In recent years, in response to the expanding applications of WRG technology, there has been a demand for simple and inexpensive manufacturing of waveguide components and waveguide devices using WRGs.

[0014] The present invention was made in view of the above-mentioned technical problems, and its object is to manufacture waveguide components and waveguide devices using WRG technology in a simple and inexpensive manner.

[0015] Means for solving technical problems

[0016] This invention relates to a waveguide component, characterized in that it comprises: a component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion, and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, the plurality of holes having a second top surface and a side peripheral surface; and a conductive film that at least covers the upper surface, the lower surface, the first top surface of the strip portion, and the second top surface and the side peripheral surface of the plurality of holes.

[0017] This invention relates to a waveguide component, characterized in that it comprises: a first component made of a non-conductive material, the first component having an upper surface, a lower surface, a strip portion, and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, the plurality of holes having a second top surface and a side peripheral surface; a conductive film that at least covers the lower surface of the first component, the first top surface of the strip portion, and the second top surface and the side peripheral surface of the plurality of holes; and a second component disposed on the upper surface side of the first component, the lower surface of the second component being conductive.

[0018] The present invention is a waveguide component, characterized in that it comprises: a component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, and the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion; and a conductive film covering the entire surface of the component.

[0019] The present invention is a waveguide device, characterized in that: it includes the waveguide component described above, a waveguide can be formed between the conductive film disposed on the first top surface and the conductive film disposed on the upper surface, and an electromagnetic wave propagation barrier can be formed by utilizing the conductive film disposed in the plurality of holes.

[0020] The present invention is a waveguide device, characterized in that: it includes the waveguide component described above, a waveguide can be formed between the conductive film disposed on the first top surface and the second component, and an electromagnetic wave propagation barrier can be formed by utilizing the conductive film disposed in the plurality of holes.

[0021] This invention relates to a method for manufacturing a waveguide component, characterized by comprising: a step of forming a component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion, and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, the plurality of holes having a second top surface and a side peripheral surface; and a step of forming a conductive film, the conductive film at least covering the upper surface, the lower surface, the first top surface of the strip portion, and the second top surface and the side peripheral surface of the plurality of holes.

[0022] This invention relates to a method for manufacturing a waveguide component, characterized by comprising: a step of forming a first component made of a non-conductive material, the first component having an upper surface, a lower surface, a strip portion, and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extending from the lower surface to the upper surface and disposed adjacent to at least a portion of the strip portion, the plurality of holes having a second top surface and a side peripheral surface; a step of forming a conductive film, the conductive film at least covering the lower surface of the first component, the first top surface of the strip portion, and the second top surface and the side peripheral surface of the plurality of holes; and a step of forming a second component with a conductive lower surface on the upper surface side of the first component.

[0023] The present invention relates to a method for manufacturing a waveguide component, characterized by comprising: a step of forming a component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, and the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion; and a step of forming a conductive film covering the entire surface of the component.

[0024] Invention Effects

[0025] Using this invention, waveguide components and waveguide devices using WRG technology can be manufactured easily and inexpensively. Attached Figure Description

[0026] Figure 1 (a) is a plan view of the waveguide component of Embodiment 1. Figure 1 (b) is Figure 1 (a) AA section view, Figure 1 (c) is a cross-sectional view of a waveguide device using the waveguide component of Embodiment 1.

[0027] Figure 2(a) and Figure 2 (c) is a plan view showing the manufacturing method of the waveguide component of Embodiment 1. Figure 2 (b) and Figure 2 (d) is Figure 2 (a) and Figure 2 AA section view of (c).

[0028] Figure 3 This is a cross-sectional view of a waveguide component and a waveguide device using the waveguide component, which are variations of Embodiment 1.

[0029] Figure 4 (a) is a cross-sectional view of the waveguide component of Embodiment 2 and the waveguide device using the waveguide component. Figure 4 (b) is a cross-sectional view of the waveguide component of a modified example of Embodiment 2 and the waveguide device using the waveguide component.

[0030] Figure 5 (a) is a plan view of the waveguide component of Embodiment 3 and the waveguide device using the waveguide component. Figure 5 (b) is Figure 5 (a) AA section view, Figure 5 (c) is a cross-sectional view of the waveguide component of a modified example of Embodiment 3 and the waveguide device using the waveguide component.

[0031] Figure 6 (a) to Figure 6 (c) is a cross-sectional view showing the manufacturing method of the waveguide component of Embodiment 3.

[0032] Figure 7 (a) is a plan view of the waveguide component of Embodiment 4 and the waveguide device using the waveguide component. Figure 7 (b) is Figure 7 (a) AA section view, Figure 7 (c) is a cross-sectional view of the waveguide component of a modified example of Embodiment 4 and the waveguide device using the waveguide component.

[0033] Figure 8 (a) to Figure 8 (c) is a cross-sectional view showing the manufacturing method of the waveguide component in Embodiment 4.

[0034] Figure 9 (a) is a plan view of the waveguide component of Embodiment 5 and the waveguide device using the waveguide component. Figure 9 (b) is Figure 9 AA section view of (a).

[0035] Figure 10 (a) and Figure 10(b) is a cross-sectional view showing the manufacturing method of the waveguide component of Embodiment 5.

[0036] Figure 11 This is a block diagram illustrating the vehicle driving control device of Embodiment 6. Detailed Implementation

[0037] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0038] Example 1

[0039] Figure 1 (a) is a plan view of the waveguide component 100 of Embodiment 1. Figure 1 (b) is Figure 1 AA section view of (a). Figure 1 (c) is a cross-sectional view of the waveguide device 600 using the waveguide component 100 of Embodiment 1. The thickness direction of the component 10, which is made of a non-conductive material, is defined as the Z-axis direction. The directions orthogonal to and mutually orthogonal to the Z-axis direction are defined as the X-axis direction and the Y-axis direction. Furthermore, the terms "upper" and "lower" used in this specification and claims are expediently used to facilitate understanding of the description of the relative positions of the objects and are not intended to limit the scope of the invention.

[0040] like Figure 1 (a) and Figure 1 As shown in (b), the waveguide component 100 includes a component 10 and a conductive film 20. The component 10 has an upper surface 11, a lower surface 12, four side surfaces 13 connected to the periphery of the upper surface 11 and the periphery of the lower surface 12, a strip-shaped portion 14 recessed from the lower surface 12 to the upper surface 11, and a plurality of holes 16 extending from the lower surface 12 to the upper surface 11. The component 10 is formed, for example, of a resin material such as polyimide. In this specification, "upper surface" refers to the collection of surfaces that can be captured in the surface of the component 10 when the component 10 is arranged along the XY plane as viewed from the +Z axis direction. "Lower surface" is used in the same sense.

[0041] The strip-shaped portion 14 has: a first top surface 15 extending in a strip shape; and an inner surface 19 connected to the first top surface 15. The strip-shaped portion 14 extends in the Y-axis direction. The first top surface 15 and the upper surface 11 are surfaces opposite to each other, and the member 10 is located in the region 32 between the first top surface 15 and the upper surface 11. In this specification, "opposing surfaces" refers to surfaces that enter the field of view when viewing another surface along the Z-axis from an observation point on one surface. At least a portion of the inner surface 19 of the strip-shaped portion 14 may also be a downwardly extending cone shape.

[0042] At least a portion of the plurality of holes 16 are disposed adjacent to the strip portion 14. Each hole 16 has a second top surface 17 and a side peripheral surface 18 connected to the second top surface 17. The second top surface 17 and the upper surface 11 are opposite to each other, and the member 10 is present in the region 42 between the second top surface 17 and the upper surface 11. The hole 16 is rectangular in shape, for example, when viewed from the Z-axis direction, but is not limited to this; it may also be other shapes such as circular or elliptical. Furthermore, at least a portion of the side peripheral surface 18 of the hole 16 may also be a downwardly extending tapered shape.

[0043] The conductive film 20 is provided in such a way that it covers the entire surface of the component 10. That is, the conductive film 20 covers the upper surface 11, lower surface 12, four side surfaces 13, the first top surface 15 and inner side surface 19 of the strip portion 14, and the second top surface 17 and side peripheral surface 18 of the hole portion 16 of the component 10. The portions of the strip portion 14 and the hole portion 16 that are inside the conductive film 20 are hollow. Alternatively, they may not be hollow, but at least a portion of them may be covered or filled with a non-conductive material. The conductive film 20 is, for example, a conductive metal film containing copper or nickel. The conductive film 20 provided on the first top surface 15 of the strip portion 14 and the conductive film 20 provided on the second top surface 17 of the hole portion 16 are opposite to the conductive film 20 provided on the upper surface 11 of the component 10 across the component 10. The conductive film 20 disposed on the inner surface 19 of the strip portion 14 is in contact with the conductive film 20 disposed on the first top surface 15 and the conductive film 20 disposed on the lower surface 12. Furthermore, the conductive film 20 disposed on the side peripheral surface 18 of the hole portion 16 is in contact with the conductive film 20 disposed on the second top surface 17 and the conductive film 20 disposed on the lower surface 12. "Contact" means that the conductive film 20 disposed on the inner surface 19 or the side peripheral surface 18 is connected to the conductive film 20 disposed on the first top surface 15 or the second top surface 17 and the conductive film 20 disposed on the lower surface 12 in a manner that ensures electrical conductivity between them.

[0044] As described above, the waveguide component 100 has the following structure: a conductive film 20 is provided to cover the surface of the component 10, wherein the component 10 has a strip-shaped portion 14 recessed from the lower surface 12 to the upper surface 11, and a plurality of holes 16 extending from the lower surface 12 to the upper surface 11. This structure allows for the use of... (described later) Figure 2 (a) to Figure 2 The method shown in (d) makes it easy and inexpensive to manufacture. In particular, since the conductive film 20 covers the entire surface of the component 10, manufacturing becomes even simpler and cheaper.

[0045] like Figure 1As shown in (c), in the waveguide device 600 using the waveguide component 100 of Embodiment 1, the conductive film 20 of the first top surface 15 forms a waveguide surface 30. The waveguide surface 30 faces the conductive film 20 of the upper surface 11 across the component 10 and extends along the strip 14 in the Y-axis direction. In the region 32 between the conductive film 20 of the first top surface 15 and the conductive film 20 of the upper surface 11, a ridge waveguide 34 (WRG: Waffle-iron Ridge waveGuide) for electromagnetic wave propagation can be formed.

[0046] By providing conductive films 20 on the second top surface 17 and side peripheral surface 18 of a plurality of apertures 16 arranged adjacent to the strip portion 14, the apertures 16 can function as magnetic walls to suppress the lateral leakage of electromagnetic waves propagating in the ridge waveguide 34. That is, by utilizing the conductive films 20 of the apertures 16, an electromagnetic wave propagation barrier 36 capable of suppressing the leakage of electromagnetic waves propagating in the ridge waveguide 34 can be formed. Here, "adjacent" means that the apertures 16 are arranged close to the strip portion 14 at the position where the desired function is achieved, without being separated by a conductive object other than the conductive films 20, where the desired function is the function of blocking electromagnetic waves when used as a magnetic wall. In this case, the distance between adjacent conductive films 20 is, for example, about λ0 / 4. Furthermore, even if the distance is greater than this value, it is included in the range of "adjacent" if the desired function can be achieved. λ0 is a representative value of the wavelength of the electromagnetic wave propagating in the ridge waveguide 34 in free space (e.g., the wavelength corresponding to the center frequency of the operating frequency band). The ridge waveguide 34 is capable of propagating electromagnetic waves in the microwave or millimeter-wave band with low loss.

[0047] The various dimensions of the strip portion 14 and the aperture portion 16 are defined by the wavelength of the electromagnetic wave propagating in the ridge waveguide 34. For example, the various dimensions of the strip portion 14 and the aperture portion 16 can be applied to the various dimensions of the waveguide component and the conductive rod described in Patent Document 4. In Patent Document 4, the waveguide component corresponds to the strip portion 14, and the conductive rod corresponds to the aperture portion 16.

[0048] Waveguide component 100 can be described as follows. Figure 2 (a) to Figure 2As shown in (d), the waveguide device 600 can be manufactured simply and inexpensively, and therefore, it can also be manufactured simply and inexpensively. Furthermore, since the ridge waveguide 34 is filled with the component 10, the wavelength of the electromagnetic wave propagating in the ridge waveguide 34 is shorter compared to the case where the ridge waveguide 34 is empty. The various dimensions of the strip portion 14 and the aperture portion 16 are determined by the wavelength of the electromagnetic wave propagating in the ridge waveguide 34, therefore, the various dimensions of the strip portion 14 and the aperture portion 16 are reduced. Therefore, the waveguide component 100 and the waveguide device 600 can be miniaturized. This is particularly useful in cases where electromagnetic waves propagate in the terahertz frequency band.

[0049] [Manufacturing Method]

[0050] Figure 2 (a) and Figure 2 (c) is a plan view showing the manufacturing method of the waveguide component 100 of Embodiment 1. Figure 2 (b) and Figure 2 (d) is Figure 2 (a) and Figure 2 AA section diagram of (c). Figure 2 (a) and Figure 2 As shown in (b), a component 10 is formed having a strip-shaped portion 14 and a plurality of holes 16, wherein the strip-shaped portion 14 is recessed from the lower surface 12 to the upper surface 11, and the plurality of holes 16 extend from the lower surface 12 to the upper surface 11 and are disposed adjacent to at least a portion of the strip-shaped portion 14. The component 10 can be formed, for example, by molding using a mold. Alternatively, the strip-shaped portion 14 and the holes 16 can be formed by cutting a cuboid-shaped component using a drill bit or the like, thereby forming the component 10.

[0051] like Figure 2 (c) and Figure 2 As shown in (d), a conductive film 20 is formed covering the entire surface of the component 10. The conductive film 20 can be formed, for example, by electrolytic plating or electroless plating. The conductive film 20 is, for example, a conductive metal film containing copper, nickel, etc. Thus, the waveguide component 100 of Embodiment 1 is formed.

[0052] [Variation Example]

[0053] Figure 3 This is a cross-sectional view of the waveguide component 110 and the waveguide device 610 using the waveguide component 110, a variation of Embodiment 1. Figure 3As shown, in a variation of Embodiment 1, the conductive film 20 only covers the upper surface 11, lower surface 12, first top surface 15 of the strip 14, second top surface 17 of the hole 16, and side peripheral surface 18 of the component 10. Alternatively, a portion of the side peripheral surface 18 of the hole 16 may not have the conductive film 20 provided, but at least the conductive film 20 on the second top surface 17 and the conductive film 20 on the lower surface 12 will be in contact at some point. Other structures are the same as in Embodiment 1, and descriptions are omitted.

[0054] The waveguide component 110 of the modified example of Embodiment 1 can be manufactured using the same method as the waveguide component 100 of Embodiment 1, except for the following aspects: after forming a mask layer on the side surface 13 of the component 10 where the conductive film 20 is not formed and the inner side surface 19 of the strip portion 14, the conductive film 20 is formed using an electrolytic plating method or an electroless plating method, and then the mask layer is removed. Therefore, the waveguide component 110 of the modified example of Embodiment 1 can also be manufactured easily and inexpensively.

[0055] In the waveguide device 610 using the waveguide component 110 of the modified example of Embodiment 1, similarly to the waveguide device 600 in Embodiment 1, the conductive film 20 of the first top surface 15 forms a waveguide surface 30, and a ridge waveguide 34 can be formed in the region 32 between the conductive film 20 of the first top surface 15 and the conductive film 20 of the upper surface 11. Using the conductive film 20 with multiple apertures 16, an electromagnetic wave propagation barrier 36 capable of suppressing leakage of electromagnetic waves propagating in the ridge waveguide 34 can be formed. The waveguide component 110 of the modified example of Embodiment 1 can be manufactured easily and inexpensively; therefore, the waveguide device 610 can also be manufactured easily and inexpensively. Furthermore, since the ridge waveguide 34 is filled with component 10, the waveguide device 610 can be miniaturized, similarly to Embodiment 1.

[0056] Example 2

[0057] Figure 4 (a) is a cross-sectional view of the waveguide component 200 and the waveguide device 700 using the waveguide component 200 in Embodiment 2. Figure 4As shown in (a), in Embodiment 2, component 10 has a first portion 10a and a second portion 10b, wherein the first portion 10a forms a lower surface 12, and the second portion 10b has a different dielectric constant than the first portion 10a and forms an upper surface 11. The second portion 10b is located in at least a portion of region 32 between the first top surface 15 of the strip portion 14 and the upper surface 11 of the component 10, and in at least a portion of region 42 between the second top surface 17 of the hole portion 16 and the upper surface 11 of the component 10. For example, the first portion 10a is formed of polyimide, and the second portion 10b is formed of benzocyclobutene (BCB) or syndiotactic polystyrene (SPS). In region 32, the thickness of the second portion 10b may, for example, be thicker than that of the first portion 10a, which may be more than 1.2 times, more than 1.5 times, or more than 2.0 times the thickness of the first portion 10a. Other structures are the same as in Embodiment 1, and descriptions are omitted.

[0058] The waveguide component 200 of Embodiment 2, except for the following aspects, can utilize with Figure 2 (a) to Figure 2 The waveguide component 100 of Embodiment 1 shown in (d) is manufactured using the same method: for example, by molding, a component 10 having a first portion 10a and a second portion 10b is formed, wherein the first portion 10a forms a lower surface 12, and the second portion 10b has a different dielectric constant than the first portion 10a and forms an upper surface 11. Therefore, the waveguide component 200 of Embodiment 2 can also be manufactured easily and inexpensively. Furthermore, the waveguide device 700 using the waveguide component 200 can also be manufactured easily and inexpensively.

[0059] Figure 4 (b) is a cross-sectional view of the waveguide component 210 and the waveguide device 710 using the waveguide component 210, a variation of Embodiment 2. Figure 4 As shown in (b), in a variation of Embodiment 2, the conductive film 20 only covers the upper surface 11, lower surface 12, first top surface 15 of the strip portion 14, second top surface 17 of the hole portion 16, and side peripheral surface 18 of the component 10. The other structures are the same as in Embodiment 2, and the description is omitted.

[0060] The waveguide component 210 of the modified example of Embodiment 2 can be manufactured using the same method as the waveguide component 200 of Embodiment 2, except for the following aspects: after forming a mask layer on the side surface 13 of the component 10 where the conductive film 20 is not formed and the inner side surface 19 of the strip portion 14, the conductive film 20 is formed using an electrolytic plating method or an electroless plating method, and then the mask layer is removed. Therefore, the waveguide component 210 of the modified example of Embodiment 2 can also be manufactured easily and inexpensively. Furthermore, the waveguide device 710 using the waveguide component 210 can also be manufactured easily and inexpensively.

[0061] like Figure 4 (a) and Figure 4 As shown in (b), in the waveguide devices 700 and 710 using the waveguide components of Embodiment 2 and its variations, the conductive film 20 on the first top surface 15 forms a waveguide surface 30, and a ridge waveguide 34 can be formed in the region 32 between the conductive film 20 on the first top surface 15 and the conductive film 20 on the upper surface 11. Using the conductive film 20 with multiple apertures 16, an electromagnetic wave propagation barrier 36 capable of suppressing leakage of electromagnetic waves propagating in the ridge waveguide 34 can be formed.

[0062] For example, at the center frequency of the operating frequency band, the dielectric loss tangent tanδ of the second portion 10b is smaller than that of the first portion 10a. Because the second portion 10b, with its smaller dielectric loss tangent tanδ, is located in at least a portion between the first top surface 15 of the strip portion 14 and the upper surface 11 of the component 10, the loss of electromagnetic waves propagating in the ridge waveguide 34 can be reduced compared to the case where the component 10 is entirely formed by the first portion 10a.

[0063] For example, at the center frequency of the operating band, the relative permittivity of the first portion 10a is greater than that of the second portion 10b. By providing the first portion 10a with such a large relative permittivity around the strip portion 14, the various dimensions of the strip portion 14 and the aperture portion 16 are reduced compared to the case where the component 10 is entirely formed of the second portion 10b. Therefore, waveguide components and waveguide devices can be miniaturized.

[0064] From the viewpoint of reducing electromagnetic wave loss, at the center frequency of the operating frequency band, the dielectric loss tangent tanδ of the second part 10b is preferably 0.9 times or less than the dielectric loss tangent tanδ of the first part 10a, more preferably 0.8 times or less, and even more preferably 0.7 times or less. From the viewpoint of miniaturization, at the center frequency of the operating frequency band, the relative permittivity of the first part 10a is preferably 1.1 times or more than the relative permittivity of the second part 10b, more preferably 1.2 times or more, and even more preferably 1.3 times or more. Furthermore, materials with a large dielectric loss tangent tanδ tend to have a larger relative permittivity.

[0065] Example 3

[0066] Figure 5 (a) is a plan view of the waveguide component 300 and the waveguide device 800 using the waveguide component 300 in Embodiment 3. Figure 5 (b) is Figure 5 AA section view of (a). Figure 5 (c) is a cross-sectional view of the waveguide component 310 and the waveguide device 810 using the waveguide component 310, a variation of Embodiment 3. Figure 5In (a), only component 50 and spacer 52 are shown for clarity. Figure 5 (a) and Figure 5 As shown in (b), in Embodiment 3, no conductive film 20 is provided on the upper surface 11 of component 10 (first component). Component 50 (second component) is provided on the upper surface 11 side with a plurality of spacers 52 between them. In this specification, "upper surface side" means "including the area above the upper surface". The spacers 52 are provided at the periphery of the upper surface 11 of component 10 and are positioned so as not to overlap with the strip portion 14 when viewed from the +Z axis direction. The spacers 52 are formed of metal, resin, or ceramic, etc. The spacers 52 may also be formed of the same material as component 10. At least the lower surface 51 of component 50 is conductive. Component 50 may be a component formed by forming or cutting conductive metal, or it may be a structure in which a conductive film, such as a metal film formed by plating, coating, or surface treatment, is provided on the surface of an insulating component such as resin. Component 10 and gap 54 are present in the region 32 between the first top surface 15 of the strip portion 14 and the conductive lower surface 51 of component 50. The component 10 and the gap 54 are also present in the region 42 between the second top surface 17 of the plurality of holes 16 and the conductive lower surface 51 of the component 50. Other structures are the same as in Embodiment 1, and descriptions are omitted.

[0067] like Figure 5 As shown in (c), in a variation of Embodiment 3, the conductive film 20 only covers the lower surface 12, the first top surface 15 of the strip portion 14, the second top surface 17 of the hole portion 16, and the side peripheral surface 18 of the component 10. The other structures are the same as in Embodiment 3, and the description is omitted.

[0068] like Figure 5 (b) and Figure 5 As shown in (c), in the waveguide devices 800 and 810 using the waveguide components of Embodiment 3 and its variations, the conductive film 20 on the first top surface 15 forms a waveguide surface 30. In the region 32 between the conductive film 20 on the first top surface 15 and the conductive film 20 on the upper surface 11, a ridge waveguide 34 composed of the component 10 and the gap 54 can be formed. Using the conductive film 20 with multiple apertures 16, an electromagnetic wave propagation barrier 36 capable of suppressing the leakage of electromagnetic waves propagating in the ridge waveguide 34 can be formed.

[0069] [Manufacturing Method]

[0070] Figure 6 (a) to Figure 6 (c) is a cross-sectional view showing the manufacturing method of the waveguide component 300 of Embodiment 3. Figure 6As shown in (a), a component 10 is formed having a strip-shaped portion 14 and a plurality of holes 16, wherein the strip-shaped portion 14 is recessed from the lower surface 12 to the upper surface 11, and the plurality of holes 16 extend from the lower surface 12 to the upper surface 11. Component 10, like in Embodiment 1, can be formed by molding using a mold, or by cutting a cuboid-shaped component using a drill bit or the like.

[0071] like Figure 6 As shown in (b), after a mask layer 60 is formed on the upper surface 11, a conductive film 20 is formed using the mask layer 60 as a mask, employing either electrolytic plating or electroless plating. This forms a conductive film 20 covering all surfaces of the component 10 except the upper surface 11. The mask layer 60 is formed, for example, from a photoresist.

[0072] like Figure 6 As shown in (c), after the mask layer 60 is removed, the component 50 is arranged with a plurality of spacers 52 on the upper surface 11 side of the component 10. Thus, the waveguide component 300 of Embodiment 3 is formed. The spacers 52 may be components made of a different material than the component 10 arranged on the upper surface 11 side, or they may be formed by integral molding of a structure made of the same material as the component 10 and continuous with the component 10.

[0073] The waveguide component 310 of the modified example of Embodiment 3 can be manufactured using the same method as the waveguide component 300 of Embodiment 3, except for the following aspects: after forming a mask layer on the upper surface 11, side surface 13 and inner side surface 19 of the strip portion 14 of the component 10 where the conductive film 20 is not formed, the conductive film 20 is formed by electrolytic plating or electroless plating, and then the mask layer is removed.

[0074] As described above, the waveguide components 300 and 310 of Embodiment 3 and its modifications can be manufactured easily and inexpensively. Therefore, waveguide devices 800 and 810 using the waveguide components of Embodiment 3 and its modifications can also be manufactured easily and inexpensively. In particular, when the conductive film 20 covers all surfaces of the component 10 except for the upper surface 11, it can be manufactured even more easily and inexpensively.

[0075] Furthermore, no conductive film 20 is provided on the upper surface 11 of component 10, and component 50 is provided on the upper surface 11 side with a plurality of spacers 52. Therefore, a gap 54, for example made of air, can be formed in the region 32 between the first top surface 15 of component 10 forming the ridge waveguide 34 and the lower surface 51 of component 50. The dielectric loss of air is less than that of resin or the like, so the loss of electromagnetic waves propagating in the ridge waveguide 34 can be reduced. In addition, since component 10 is provided around the strip portion 14, the various sizes of the strip portion 14 and the aperture portion 16 are reduced, enabling miniaturization of waveguide components and waveguide devices.

[0076] Example 4

[0077] Figure 7 (a) is a plan view of the waveguide component 400 and the waveguide device 900 using the waveguide component 400 in Embodiment 4. Figure 7 (b) is Figure 7 AA section view of (a). Figure 7 (c) is a cross-sectional view of the waveguide component 410 and the waveguide device 910 using the waveguide component 410, a variation of Embodiment 4. Figure 7 In (a), only component 10, recess 72, and component 70 are shown for clarity. Figure 7 (a) and Figure 7 As shown in (b), in embodiment 4, a recess 72 is provided on the upper surface 11 of component 10 (first component). The recess 72 is positioned at least opposite to the first top surface 15 of the strip portion 14 and extends in the Y-axis direction. No conductive film 20 is provided on the upper surface 11. A component 70 (second component) is provided on the upper surface 11, covering the recess 72. The component 70 extends in the Y-axis direction and completely covers the recess 72. At least the lower surface 71 of the component 70 is conductive. The component 70 may be a component formed by forming or cutting a conductive metal, or it may be a structure in which a conductive film, such as a metal film formed by plating, coating, or surface treatment, is provided on the surface of an insulating component such as resin. Component 10 and a gap 74 are present in the region 32 between the first top surface 15 of the strip portion 14 and the conductive lower surface 71 of the component 70. Multiple holes 16 exist in a mixed manner: in the region 42 between the second top surface 17 and the conductive lower surface 71 of the component 70, the component 10 and the void 54 are present; in the region 42, only the component 10 is present. Other structures are the same as in Embodiment 1, and descriptions are omitted.

[0078] like Figure 7As shown in (c), in a variation of Embodiment 4, the conductive film 20 only covers the lower surface 12, the first top surface 15 of the strip 14, the second top surface 17 of the hole 16, and the side peripheral surface 18 of the component 10. The other structures are the same as in Embodiment 4, and the description is omitted.

[0079] like Figure 7 (b) and Figure 7 As shown in (c), in waveguide devices 900 and 910 using waveguide components of Embodiment 4 and its variations, a conductive film 20 on the first top surface 15 forms a waveguide surface 30. In the region 32 between the conductive film 20 on the first top surface 15 and the component 70, a ridge waveguide 34 composed of the component 10 and the gap 74 can be formed. Using the conductive film 20 with multiple apertures 16, an electromagnetic wave propagation barrier 36 capable of suppressing leakage of electromagnetic waves propagating in the ridge waveguide 34 can be formed.

[0080] [Manufacturing Method]

[0081] Figure 8 (a) to Figure 8 (c) is a cross-sectional view showing the manufacturing method of the waveguide component 400 of Embodiment 4. Figure 8 As shown in (a), a component 10 is formed having a strip-shaped portion 14, a plurality of holes 16, and a recess 72. The strip-shaped portion 14 is recessed from the lower surface 12 to the upper surface 11, the plurality of holes 16 extend from the lower surface 12 to the upper surface 11, and the recess 72 is provided on the upper surface 11 opposite to the strip-shaped portion 14. Component 10, like in Embodiment 1, can be formed by molding using a mold, or by cutting a cuboid-shaped component using a drill bit or the like.

[0082] like Figure 8 As shown in (b), after the mask layer 60 is formed on the upper surface 11 and the recess 72, a conductive film 20 is formed using the mask layer 60 as a mask, employing either electrolytic plating or electroless plating. This forms a conductive film 20 covering all surfaces of the component 10 except for the upper surface 11 and the recess 72. The mask layer 60 is formed, for example, from a photoresist.

[0083] like Figure 8 As shown in (c), after the mask layer 60 is removed, a component 70 covering the recess 72 is disposed on the upper surface 11 of the component 10. Thus, the waveguide component 400 of Embodiment 4 is formed.

[0084] The waveguide component 410 of the modified example of Embodiment 4 can be manufactured using the same method as the waveguide component 400 of Embodiment 4, except for the following aspects: after forming a mask layer on the upper surface 11, the recess 72, the side surface 13 and the inner side surface 19 of the strip portion 14 of the component 10 where the conductive film 20 is not formed, the conductive film 20 is formed by electrolytic plating or electroless plating, and then the mask layer is removed.

[0085] As described above, the waveguide components 400 and 410 of Embodiment 4 and its variations can be manufactured easily and inexpensively. Therefore, waveguide devices 900 and 910 using the waveguide components of Embodiment 4 and its variations can also be manufactured easily and inexpensively. In particular, when the conductive film 20 covers all surfaces of the component 10 except for the upper surface 11 and the recess 72, manufacturing can be even easier and cheaper.

[0086] Furthermore, a recess 72 is formed on the upper surface 11 of component 10 at a position corresponding to at least the first top surface 15 of the strip portion 14, and component 70 is disposed to cover the recess 72. Therefore, a gap 74 can be formed in the region 32 between the first top surface 15 of component 10 forming the ridge waveguide 34 and the lower surface 71 of component 70. This reduces the loss of electromagnetic waves propagating in the ridge waveguide 34. Furthermore, since component 10 is disposed around the strip portion 14, the various dimensions of the strip portion 14 and the aperture portion 16 are reduced, enabling miniaturization of the waveguide component and waveguide device.

[0087] Example 5

[0088] Figure 9 (a) is a plan view of the waveguide component 500 and the waveguide device 1000 using the waveguide component 500 in Embodiment 5. Figure 9 (b) is Figure 9 AA section view of (a). Figure 9 (a) and Figure 9 As shown in (b), in Embodiment 5, the hole 16 provided in component 10 extends from the lower surface 12 to the upper surface 11 and is circular when viewed from the Z-axis direction. The other structures are the same as in Embodiment 1, so the description is omitted.

[0089] In the waveguide device 1000 using the waveguide component of Embodiment 5, the conductive film 20 of the first top surface 15 forms a waveguide surface 30, and a ridge waveguide 34 can be formed in the region 32 between the conductive film 20 of the first top surface 15 and the conductive film 20 of the upper surface 11. The conductive films 20 of the plurality of apertures 16 act as electric walls, forming an electromagnetic wave propagation barrier 36 that can suppress the leakage of electromagnetic waves propagating in the ridge waveguide 34.

[0090] [Manufacturing Method]

[0091] Figure 10 (a) and Figure 10 (b) is a cross-sectional view showing the manufacturing method of the waveguide component 500 of Embodiment 5. Figure 10 As shown in (a), a component 10 is formed having a strip-shaped portion 14 and a plurality of holes 16, wherein the strip-shaped portion 14 is recessed from the lower surface 12 to the upper surface 11, and the plurality of holes 16 extend from the lower surface 12 to the upper surface 11. Component 10, like in Embodiment 1, can be formed by molding using a mold, or by cutting a cuboid-shaped component using a drill bit or the like.

[0092] like Figure 10 As shown in (b), a conductive film 20 is formed covering the entire surface of the component 10. The conductive film 20 is formed, for example, by electrolytic plating or electroless plating. Through the above process, the waveguide component 500 of Embodiment 5 is formed.

[0093] As described above, the waveguide component 500 of Embodiment 5 can be manufactured easily and inexpensively. Therefore, the waveguide device 1000 using the waveguide component of Embodiment 5 can also be manufactured easily and inexpensively. Furthermore, since the component 10 is provided around the strip portion 14, the various dimensions of the strip portion 14 and the hole portion 16 are reduced, enabling miniaturization of the waveguide component and the waveguide device.

[0094] Example 6

[0095] Figure 11 This is a block diagram illustrating the vehicle driving control device 1200 of Embodiment 6. (See diagram below.) Figure 11 As shown, the vehicle driving control device 1200 includes a radar system 80 and a driving assistance electronic control device 86 connected to the radar system 80. The radar system 80 includes an array antenna 81 and a radar signal processing device 82. The array antenna 81 is capable of radiating high-frequency millimeter waves. The array antenna 81 includes multiple antenna elements 83 and a waveguide device 600 connected to the antenna elements 83. The antenna elements 83 are capable of outputting received signals to the waveguide device 600 in response to one or more arriving waves. The array antenna 81 is mounted on the vehicle. At least a portion of the functionality of the radar signal processing device 82 can also be implemented by a computer 90 and a database 92 located outside the vehicle driving control device 1200. The database 92 stores programs for specifying various signal processing algorithms. The data and program content required for the operation of the radar system 80 can be updated externally via a communication device 87.

[0096] The radar signal processing device 82 includes a signal processing circuit 84. The signal processing circuit 84 is capable of receiving a received signal from the array antenna 81 and inputting the received signal or a secondary signal generated from the received signal into the arrival wave calculation unit 85. The signal processing circuit 84 is capable of performing calculations using the received signal or the secondary signal and outputting a signal indicating the number of arrival waves. The signal indicating the number of arrival waves is a signal indicating the number of one or more preceding vehicles (vehicles ahead) traveling in front of this vehicle.

[0097] The arrival wave estimation unit 85 can estimate the angle representing the azimuth of the arrival wave and output a signal representing the estimation result. The signal processing circuit 84 can use a known algorithm executed by the arrival wave estimation unit 85 to estimate the distance to the target object, the relative velocity of the target object, and the azimuth of the target object, which is the source of the arrival wave, and output a signal representing the estimation result.

[0098] The driving assistance electronic control unit 86 can provide driving assistance to the vehicle based on various signals output from the radar signal processing unit 82. The driving assistance electronic control unit 86 can instruct various electronic control units to perform functions such as issuing an alarm and prompting the driver to brake when the inter-vehicle distance is shorter than a set value, controlling the brakes, and controlling the accelerator.

[0099] In addition, Figure 11 The example shown includes the waveguide device 600 of Embodiment 1, but it could also include waveguide devices described in variations of Embodiment 1 to Embodiment 5. Furthermore, the waveguide device is not limited to radar systems such as millimeter-wave radar, but could also be used in other devices.

[0100] The embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments described above. Various modifications and changes can be made within the scope of the spirit of the present invention as described in the claims.

[0101] Explanation of reference numerals in the attached figures

[0102] 10… Component, 10a… First part, 10b… Second part, 11… Upper surface, 12… Lower surface, 13… Side surface, 14… Strip, 15… First top surface, 16… Hole, 17… Second top surface, 18… Side peripheral surface, 19… Inner surface, 20… Conductive film, 30… Waveguide surface, 32… Region, 34… Ridge waveguide, 36… Electromagnetic wave propagation barrier, 42… Region, 50… Component, 51… Lower surface, 52… Spacer, 54… Gap, 60… Mask layer, 70… Component, 71… Lower surface, 72… Recess, 74… Gap 80…Radar system, 81…Array antenna, 82…Radar signal processing device, 83…Antenna element, 84…Signal processing circuit, 85…Arrival wave calculation unit, 86…Driving assistance electronic control device, 87…Communication equipment, 90…Computer, 92…Database, 100, 110, 200, 210, 300, 310, 400, 410, 500…Waveguide components, 600, 610, 700, 710, 800, 810, 900, 910, 1000…Waveguide device, 1200…Vehicle driving control device.

Claims

1. A waveguide component, characterized in that, include: A component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, and the plurality of holes have a second top surface and a side peripheral surface; and A conductive film that at least covers the upper surface, the lower surface, the first top surface of the strip portion, the second top surface of the plurality of holes, and the side peripheral surface of the component.

2. The waveguide component according to claim 1, characterized in that: The component has a first portion and a second portion, wherein the first portion forms the lower surface, and the second portion has a different dielectric constant from the first portion and forms the upper surface, and is located at least a portion between the first top surface of the strip and the upper surface.

3. The waveguide component according to claim 1 or 2, characterized in that: The conductive film covers the entire surface of the component.

4. A waveguide component, characterized in that, include: A first component made of a non-conductive material, the first component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, and the plurality of holes have a second top surface and a side peripheral surface; A conductive film that at least covers the lower surface of the first component, the first top surface of the strip portion, and the second top surface and the side peripheral surface of the plurality of holes; and A second component is disposed on the upper surface side of the first component, and the lower surface of the second component is conductive.

5. The waveguide component according to claim 4, characterized in that: The second component is disposed on the upper surface side of the first component with spacers between it.

6. The waveguide component according to claim 5, characterized in that: The conductive film covers all surfaces of the first component except for the upper surface.

7. The waveguide component according to claim 4, characterized in that: The first component has a recess disposed on the upper surface, the recess being positioned at least opposite to the first top surface of the strip portion. The second component is disposed on the upper surface of the first component in such a way as to cover the recess.

8. The waveguide component according to claim 7, characterized in that: The conductive film covers all surfaces of the first component except for the upper surface and the recess.

9. A waveguide component, characterized in that, include: A component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, and the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion; and A conductive film that covers the entire surface of the component.

10. A waveguide device, characterized in that: Including the waveguide component as described in claim 1 or 9, A waveguide can be formed between the conductive film disposed on the first top surface and the conductive film disposed on the upper surface, and an electromagnetic wave propagation barrier can be formed by utilizing the conductive film disposed in the plurality of holes.

11. A waveguide device, characterized in that: Including the waveguide component as described in claim 4, A waveguide can be formed between the conductive film disposed on the first top surface and the second component, and an electromagnetic wave propagation barrier can be formed by utilizing the conductive film disposed in the plurality of holes.

12. A method for manufacturing a waveguide component, characterized in that, include: A process for forming a component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, and the plurality of holes have a second top surface and a side peripheral surface; and The process of forming a conductive film, wherein the conductive film at least covers the upper surface, the lower surface, the first top surface of the strip portion, the second top surface and the side peripheral surface of the plurality of holes of the component.

13. The method for manufacturing a waveguide component according to claim 12, characterized in that: In the process of forming the component, the component having a first portion and a second portion is formed, wherein the first portion forms the lower surface, and the second portion has a different dielectric constant from the first portion and forms the upper surface, and is located at least a portion between the first top surface and the upper surface.

14. The method for manufacturing a waveguide component according to claim 12 or 13, characterized in that: In the process of forming the conductive film, the conductive film is formed to cover the entire surface of the component.

15. A method for manufacturing a waveguide component, characterized in that, include: A process for forming a first component made of a non-conductive material, the first component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion, and the plurality of holes have a second top surface and a side peripheral surface; In the process of forming a conductive film, the conductive film at least covers the lower surface of the first component, the first top surface of the strip portion, and the second top surface and the side peripheral surface of the plurality of holes; and The process of forming a second component with a conductive lower surface on the upper surface side of the first component.

16. The method for manufacturing a waveguide component according to claim 15, characterized in that: In the process of forming the second component, the second component is formed on the upper surface side of the first component with spacers between it.

17. The method for manufacturing a waveguide component according to claim 16, characterized in that: In the process of forming the conductive film, the conductive film is formed to cover all surfaces of the first component except for the upper surface.

18. The method for manufacturing a waveguide component according to claim 15, characterized in that: In the process of forming the first component, a first component having a recess on the upper surface is formed, the recess being positioned at least opposite to the first top surface of the strip portion. In the process of forming the second component, the second component is formed on the upper surface of the first component in a manner that covers the recess.

19. The method for manufacturing a waveguide component according to claim 18, characterized in that: In the process of forming the conductive film, the conductive film is formed to cover all surfaces of the first component except for the upper surface and the recess.

20. A method for manufacturing a waveguide component, characterized in that, include: A process for forming a component made of a non-conductive material, the component having an upper surface, a lower surface, a strip portion and a plurality of holes, wherein the strip portion is recessed from the lower surface to the upper surface and has a first top surface extending in a strip shape, and the plurality of holes extend from the lower surface to the upper surface and are disposed adjacent to at least a portion of the strip portion; and The process of forming a conductive film covering the entire surface of the component.

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