Carrier for laser cutting, printing and surface mounting of chip

The integrated chip laser cutting and printing mount uses adjustable abutment rods and limiting mechanisms to achieve precise chip positioning and rapid transfer, solving the problems of position deviation and transfer risk in traditional processes, and improving production efficiency and mount quality.

CN122058073APending Publication Date: 2026-05-19KUNSHAN PHOEBE ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KUNSHAN PHOEBE ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2026-03-30
Publication Date
2026-05-19

AI Technical Summary

Technical Problem

Traditional chip laser cutting and printing and mounting processes are carried out in separate steps, which leads to positional deviations, high chip transfer risks, low production efficiency, and a lack of precise positioning at the four corners of the chip, affecting the quality of the cut surface and the mounting accuracy.

Method used

Design an integrated chip laser cutting and printing mount carrier, which adopts an adjustable contact rod and a limiting mechanism, combined with a rotatable mount carrier and a heating rod, to achieve precise chip positioning, rapid transfer and integrated operation. Multi-station feeding and modular replacement can be achieved through adjustment and rotation mechanisms.

Benefits of technology

It improves process connection efficiency, ensures stable chip positioning after cutting, enhances chip placement quality and production efficiency, reduces intermediate transfer links, adapts to various chip sizes, and supports rapid module replacement.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a carrier for laser cutting, printing and surface mounting of a chip, and relates to the technical field of semiconductor packaging. The abutting rods are arranged on the upper surface of the cutting carrier plate in a matrix mode and connected with the cutting carrier plate through an adjusting mechanism. The limiting mechanisms are arranged at the top ends of the abutting rods at the four corners correspondingly. The equal-angle rotating mechanism is arranged in the fixed plate and is connected with a shaft rod at the bottom of the patch carrier plate; the fixing rods are arranged on the upper side of the chip mounting carrier plate at equal angles, and the top ends of the fixing rods are connected with chip mounting modules through connecting mechanisms; the heating rods are equivalently inserted into the upper end of the fixed rod in a matrix manner, and the upper ends of the heating rods are inserted into the grooves in the lower side wall of the patch module in a matched manner; precise positioning during chip cutting is achieved through the adjustable abutting rod and the limiting mechanism, the integrated design of the rotatable chip mounting carrier and the heating rod is combined, the integrated operation of rapid transferring, preheating and chip mounting of the cut chip is achieved, and the procedure connection efficiency and the chip mounting quality are remarkably improved.
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Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically to a chip laser cutting and printing substrate. Background Technology

[0002] In semiconductor packaging processes, laser cutting and die placement are critical steps determining packaging quality and efficiency. Traditionally, the cutting and die placement processes typically use independent carrier equipment. After cutting, the chip must be transferred manually or by a robotic arm and repositioned onto the die placement carrier before subsequent die placement can proceed. This step-by-step approach has several significant drawbacks: First, multiple clamping operations can introduce positional deviations, affecting placement accuracy, especially when processing miniaturized and thin chips, where positioning errors directly impact yield. Second, cut chips are prone to shifting, flipping, or contamination during transfer, increasing operational risks and quality control difficulties. Third, the independent operation of the cutting and die placement carriers prevents rapid connection between workstations, limiting production cycle time and resulting in low overall efficiency. Fourth, existing carriers often use simple vacuum adsorption or mechanical clamping to fix chips, which lacks precise corner positioning for laser cutting, leading to micro-movements or warping during cutting and affecting the quality of the cut surface. Summary of the Invention

[0003] The purpose of this invention is to address the shortcomings and deficiencies of existing technologies by providing a reasonably designed and easy-to-use chip laser cutting and printing substrate carrier. It achieves precise positioning of the chip during cutting through an adjustable contact rod and a limiting mechanism. Combined with the integrated design of a rotatable substrate carrier and a heating rod, it realizes the integrated operation of rapid chip transfer, preheating and substrate placement after cutting, which significantly improves the efficiency of process connection and substrate placement quality.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: it comprises a fixing plate, a cutting carrier plate, and a patch carrier plate, wherein the cutting carrier plate is fixed to one side of the upper surface of the fixing plate, and the patch carrier plate is connected to the other side of the upper surface of the fixing plate via a shaft; it further comprises: The abutment rods are a plurality of rods arranged in a matrix on the upper surface of the cutting plate, and the abutment rods are connected to the cutting plate through an adjustment mechanism. The limiting mechanism consists of four parts, each located on the top of abutment rods at one of the four corners. An equal-angle rotation mechanism is provided inside the fixed plate and is connected to the shaft at the bottom of the patch carrier plate. The fixing rods are multiple in number and are set at equal angles on the upper side of the patch carrier plate. The top of the fixing rods is connected to the patch module through a connecting mechanism. The heating rods are of several kinds and are equally arranged in a matrix inside the upper end of the fixed rod. The upper end of the heating rod is inserted into the groove on the lower side wall of the patch module. The above technical solution involves selecting a corresponding number of contact rods based on the chip specifications, adjusting the distribution range of the contact rods to match the chip size using an adjustment mechanism, placing the chip on the contact rods, and then using a limiting mechanism to position the four corners of the chip before cutting. The cut chip is then transferred by a mechanical gripper to the mounting module on the mounting carrier. An equal-angle rotation mechanism drives the mounting carrier to rotate intermittently, enabling sequential loading of materials at each station. Simultaneously, a heating rod preheats the chip, providing the necessary process conditions for subsequent mounting operations.

[0005] As a further improvement of the present invention, the adjusting mechanism includes: The telescopic linkage consists of four links, which are respectively suspended on the upper side of the cutting plate. The two ends of the telescopic linkage away from the center of the cutting plate are connected to a connecting plate by bearings. The connecting plate on one side is fixed to one side wall of the cutting plate, and the connecting plate on the other side is slidably set in a groove on the side wall of the cutting plate by a slider. The adjustment screws consist of four screws, each screwed to a slider on a connecting plate via a thread. Both ends of the adjustment screws are screwed into the cutting plate via bearings. Two opposing adjustment screws are connected by a synchronous pulley transmission assembly. One end of one of the two connected adjustment screws is connected to an adjustment motor, which is embedded and fixed inside the cutting plate. Adjusting rods, there are several adjusting rods, and their two ends are respectively fixed on the shaft at the intersection of the telescopic connecting rods on both sides of the symmetry. The abutment rod is movably sleeved on the adjusting rod; The above technical solution involves starting an adjustment motor, which drives a connected adjustment screw to rotate. This adjustment screw rotates synchronously with the oppositely positioned adjustment screw via a synchronous wheel transmission assembly. The adjustment screw drives a slider to move via a thread, which in turn moves a connecting plate. The connecting plate pulls one end of a telescopic connecting rod, causing the telescopic connecting rod to extend and retract. The shaft at the intersection of the telescopic connecting rods moves the adjustment rod, which in turn moves the abutment rods fitted on the adjustment rod until each abutment rod is adjusted to a position that matches the chip size.

[0006] As a further improvement of the present invention, each of the abutment rods is provided with a movable roller at its bottom, and the movable roller is movably disposed on the upper surface of the cutting plate; this can increase the smoothness of the abutment rod when it moves.

[0007] As a further improvement of the present invention, the limiting mechanism includes: The limiting plate consists of two plates, each disposed on the side of the abutment rod away from the center of the cutting plate. A push rod is screwed into the side wall of the limiting plate adjacent to the abutment rod via a shaft. The push link consists of four push links, which are arranged symmetrically in pairs. The two support rods at the inner end of the push link are connected to the outer end of the push rod through the shaft. After the two support rods at the outer end of the push link pass through the limiting plate, they are screwed with hinge blocks through the shaft. The hinge blocks are slidably arranged in the groove on the side wall of the abutment rod. The double-acting lead screw consists of four screws, which are symmetrically connected to the top of the contact rod via bearings. The two ends of the double-acting lead screw are respectively connected to the corresponding hinge blocks via threads. The symmetrical double-acting lead screws are connected to each other via a synchronous pulley transmission assembly. One end of one of the double-acting lead screws is exposed on the outside of the contact rod. A linkage bevel gear pair is provided inside one corner of the abutment rod, and the two bevel gears in the linkage bevel gear pair are respectively sleeved and fixed on the corresponding two bidirectional lead screws. Through the above technical solution, the bidirectional lead screw exposed on the outside of the contact rod is rotated. The bidirectional lead screw drives the corresponding bidirectional lead screw to rotate synchronously through the synchronous wheel transmission assembly. At the same time, it drives the bidirectional lead screw on the other side to rotate through the bevel gear pair. When each bidirectional lead screw rotates, the hinge blocks on both sides are driven to move towards or away from each other along the slide groove through the thread. The hinge blocks drive the end of the push rod to move, and the support rod at the inner end of the push rod drives the push rod to rotate. The push rod then drives the limit plate to move until the limit plate abuts against the four corners of the chip, thus completing the limit.

[0008] As a further improvement of the present invention, the constant angle rotation mechanism includes: A rotating disk is sleeved and fixed on a shaft on the lower side of the patch carrier plate. The rotating disk is provided with staggered actuation grooves and arc-shaped contact grooves at equal angles. The drive disk is mounted in the fixed plate via a shaft. The drive disk is engaged with the arc-shaped contact groove. A drive rod is fixed at the bottom of the drive disk. A protrusion on the drive rod is inserted into the actuating groove. A rotating motor is fixed on the upper surface of the fixed plate and is located between the cutting carrier plate and the patch carrier plate. The output shaft of the rotating motor is inserted into the fixed plate and is connected to the shaft on the drive disk through a synchronous wheel transmission assembly. The above technical solution involves starting a rotating motor, which drives a drive disk to rotate via a synchronous wheel transmission assembly. The drive disk then drives a drive rod to rotate. When the drive rod rotates to one side of the rotating disk, its protrusion inserts into the actuation groove. As it continues to rotate, it drives the rotating disk to rotate at a certain angle. When the protrusion moves out of the actuation groove, the drive disk abuts against the arc-shaped contact groove, locking the position of the rotating disk. This cycle repeats, achieving intermittent, constant-angle rotation of the patch carrier.

[0009] As a further improvement of the present invention, an annular slide rail is fixed on the lower surface of the patch carrier plate, and the annular slide rail is slidably disposed in an annular groove on the fixed plate. The above technical solutions can increase the stability of the patch carrier when it rotates.

[0010] As a further improvement of the present invention, the connecting mechanism includes: The connecting plate consists of two plates, which are disposed on both sides of the fixing rod. Each connecting plate has an insert plate fixed on the upper side of the side wall adjacent to the fixing rod, and the insert plate is inserted into the slot on the side wall of the patch module. The toothed plates are of several kinds and are equally spaced from top to bottom inside the fixing rod. The toothed plates are fixed to the side walls of the connecting plates on both sides in an alternating manner. The rotating gears are of several kinds and are meshed one-to-one between two symmetrical toothed plates. The rotating gears are screwed to the fixed rod through bearings. The linkage rod is screwed into the fixed rod via a bearing. The linkage rod is connected to the shaft on one of the rotating gears via a bevel gear pair. The other end of the linkage rod is connected to a rotating shaft via a worm gear pair. The rotating shaft is screwed onto the fixed rod via a bearing, and one end of the rotating shaft is exposed on the outside of the fixed rod. With the above technical solution, when it is necessary to replace the surface mount module, rotate the rotating shaft exposed on the outside of the fixed rod. The rotating shaft drives the linkage rod to rotate through the worm gear pair. The linkage rod drives the rotating gear connected to it to rotate through the bevel gear pair. The rotating gear drives the toothed plates on the upper and lower sides to move in opposite directions. At the same time, through the linkage of the other rotating gears, all toothed plates move synchronously. The toothed plates drive the connecting plates and insert plates on both sides to retract inward, so that the insert plates are removed from the slots on the side wall of the surface mount module, and the surface mount module can be removed for replacement.

[0011] As a further improvement of the present invention, a limiting block is embedded in the strip-shaped limiting groove on both sides of the toothed plate, and the limiting block is fixed on the inner wall of the fixing rod. The above technical solution can prevent the toothed plate from moving out of the fixed rod, thus increasing the stability of the toothed plate.

[0012] As a further improvement of the present invention, a limiting ring is sleeved and fixed on the middle end of the heating rod, and a pushing spring is fixed at the lower end of the limiting ring. The pushing spring is sleeved on the lower end of the heating rod and the lower end of the pushing spring is fixed inside the fixing rod. With the above technical solution, when heating the patch module, the heating rod can be pushed by the spring so that the heating rod remains in contact with the patch module.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Adjust the motor drive screw to drive the telescopic connecting rod to deform, and adjust the distribution range of the matrix-type abutment rod synchronously through the adjusting rod, so that the positioning point can quickly adapt to chips of different sizes, achieving precise support and versatility; 2. The bidirectional lead screw drives the hinge block to move inward and clamp the chip at the four corners through the bevel gear pair and synchronous wheel, thereby achieving rapid centering and clamping and ensuring the chip is in a stable position during cutting. 3. The rotating motor drives the cam to intermittently move the rotating disk through the drive disk, and the arc-shaped contact groove locks the station, so that the chip carrier can rotate intermittently at the same angle, which facilitates the sequential feeding of multiple stations and improves the efficiency of chip mounting operation. 4. The rotating shaft drives the insert plate on the connecting plate to extend and retract synchronously through the linkage rod and gear plate mechanism, realizing the quick assembly and disassembly of the patch module; the heating rod is pushed by the spring to always keep in contact with the module, ensuring stable preheating. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is an exploded view of the structure of the present invention; Figure 3 This is an exploded view of the adjustment mechanism and the cutting carrier plate in this invention; Figure 4 This is an exploded view of the structure of the contact rod and the limiting mechanism in this invention; Figure 5 for Figure 4 Enlarged view of section A in the middle; Figure 6 This is a schematic diagram of the structure of the medium-angle rotation mechanism of the present invention; Figure 7 This is an exploded view of the structure of the fixing rod, patch module, and connecting mechanism in this invention; Figure 8 for Figure 7 Enlarged view of section B in the middle.

[0015] Explanation of reference numerals in the attached drawings: 1. Fixed plate; 2. Cutting carrier plate; 3. Patch carrier plate; 4. Abutment rod; 5. Adjustment mechanism; 5. Telescopic connecting rod; 5-1. Connecting plate; 5-2. Adjusting screw; 5-3. Adjusting motor; 5-4. Adjusting rod; 5-5. Limiting mechanism; 6. Limiting plate; 6-1. Push rod; 6-2. Push connecting rod; 6-3. Hinge block; 6-4. Bidirectional screw; 6-5. Linkage bevel gear pair; 6-6. Equal angle rotation mechanism; 7. Rotating disk; 7-1. Actuating groove; 7-1-1. Arc-shaped abutment groove; 7-1-2. Drive disk; 7-2. Drive rod; 7-3. Rotating motor; 7-4. Fixed rod; 8. Connecting mechanism; 9. Connecting plate; 9-1. Insert plate; 9-2. Toothed plate; 9-3. Rotating gear; 9-4. Linkage rod; 9-5. Rotating shaft; 9-6. Patch module; 10. Heating rod; 11. Moving roller; 12. Circular slide rail; 13. Limiting block; 14. Limiting ring; 15. Push spring; 16. Detailed Implementation

[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The preferred embodiments described are only examples. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0017] like Figures 1-8 As shown, this embodiment includes a fixing plate 1, a cutting carrier plate 2, and a patch carrier plate 3. The cutting carrier plate 2 is fixed to the left side of the upper surface of the fixing plate 1 by bolts, and the patch carrier plate 3 is connected to the right side of the upper surface of the fixing plate 1 by a shaft. An annular slide rail 13 is welded and fixed to the lower surface of the patch carrier plate 3, and the annular slide rail 13 is slidably disposed in an annular groove on the fixing plate 1. It also includes: The abutment rod 4, there are several abutment rods 4, and they are arranged in a matrix on the upper surface of the cutting carrier plate 2. The abutment rod 4 is connected to the cutting carrier plate 2 through the adjustment mechanism 5. The bottom of each abutment rod 4 is embedded with a movable roller 12, and the movable roller 12 is movably arranged on the upper surface of the cutting carrier plate 2. The limiting mechanism 6 consists of four parts, which are respectively located on the top of the abutment rods 4 at the four corners; An equal-angle rotation mechanism 7 is disposed inside the fixed plate 1 and is connected to the shaft at the bottom of the patch carrier plate 3. The fixing rods 8 are multiple in number and are arranged at equal angles on the upper side of the patch carrier plate 3. The top of the fixing rods 8 is connected to the patch module 10 through the connecting mechanism 9. Heating rods 11, there are several heating rods 11, and they are equally distributed and arranged in a matrix inside the upper end of the fixing rod 8. The upper end of the heating rod 11 is inserted into the groove on the lower side wall of the patch module 10. A limiting ring 15 is sleeved and fixed on the middle end of the heating rod 11. A push spring 16 is fixed at the lower end of the limiting ring 15. The push spring 16 is sleeved on the lower end of the heating rod 11 and the lower end of the push spring 16 is fixed inside the fixing rod 8. Example

[0018] See Figure 1-3 As shown, based on Embodiment 1, the adjustment mechanism 5 includes: Telescopic connecting rods 5-1, there are four telescopic connecting rods 5-1, and they are respectively suspended on the upper side of the cutting carrier plate 2. The two ends of the telescopic connecting rods 5-1 away from the center of the cutting carrier plate 2 are connected to the connecting plate 5-2 by bearings. The connecting plate 5-2 on one side is welded and fixed to one side wall of the cutting carrier plate 2, and the connecting plate 5-2 on the other side is slidably set in the groove on the side wall of the cutting carrier plate 2 by a slider. There are four adjusting screws 5-3, each of which is screwed to a slider on the connecting plate 5-2 via threads. The two ends of the adjusting screws 5-3 are screwed into the cutting carrier plate 2 via bearings. Two adjusting screws 5-3 arranged opposite each other are connected by a synchronous pulley transmission assembly. One end of one of the two connected adjusting screws 5-3 is connected to an adjusting motor 5-4, which is embedded in the cutting carrier plate 2 and fixed with bolts. Adjusting rod 5-5, there are several adjusting rods 5-5, and their two ends are respectively welded and fixed to the shaft at the intersection of the telescopic connecting rods 5-1 on both sides of the symmetrical sides. The abutting rod 4 is movably sleeved on the adjusting rod 5-5. Example

[0019] See Figure 1-5 As shown, based on Embodiment 1, the limiting mechanism 6 includes: Limiting plate 6-1, there are two limiting plates 6-1, and they are respectively set on the side of the abutment rod 4 away from the center of the cutting plate 2. The pushing rod 6-2 is screwed into the side wall of the limiting plate 6-1 adjacent to the abutment rod 4 through the shaft. There are four push rods 6-3, which are arranged symmetrically in pairs. The two support rods at the inner end of the push rod 6-3 are connected to the outer end of the push rod 6-2 through the shaft. After the two support rods at the outer end of the push rod 6-3 pass through the limiting plate 6-1, they are screwed to the hinge block 6-4 through the shaft. The hinge block 6-4 is slidably arranged in the groove on the side wall of the abutment rod 4. There are four bidirectional lead screws 6-5, which are symmetrically connected to the top of the contact rod 4 by bearings. The two ends of the bidirectional lead screws 6-5 are respectively connected to the corresponding hinge blocks 6-4 by threads. The bidirectional lead screws 6-5 are connected to each other by a synchronous pulley transmission assembly. One end of one of the bidirectional lead screws 6-5 is exposed on the outside of the contact rod 4. The linkage bevel gear pair 6-6 is located inside one corner of the abutment rod 4, and the two bevel gears in the linkage bevel gear pair 6-6 are respectively sleeved and fixed on the corresponding two bidirectional lead screws 6-5. Example

[0020] See Figure 2 , Figure 6 As shown, based on Embodiment 1, the equal-angle rotation mechanism 7 includes: Rotating disk 7-1, the rotating disk 7-1 is sleeved and fixed on the shaft on the lower side of the patch carrier plate 3, and the rotating disk 7-1 is provided with actuating grooves 7-1-1 and arc-shaped contact grooves 7-1-2 at equal angles. The drive disk 7-2 is mounted in the fixed plate 1 via a shaft. The drive disk 7-2 is engaged with the arc-shaped contact groove 7-1-2. A drive rod 7-3 is welded and fixed to the bottom of the drive disk 7-2. The protrusion on the drive rod 7-3 is engaged with the actuation groove 7-1-1. The rotating motor 7-4 is fixed on the upper surface of the fixed plate 1 and is located between the cutting carrier plate 2 and the patch carrier plate 3. The output shaft of the rotating motor 7-4 is inserted into the fixed plate 1 and is connected to the shaft on the drive disk 7-2 through the synchronous wheel transmission assembly. Example

[0021] See Figure 1-2 , Figure 7 As shown, based on Embodiment 1, the connecting mechanism 9 includes: There are two connecting plates 9-1, which are located on both sides of the fixing rod 8. Each connecting plate 9-1 is welded and fixed with an insert plate 9-2 on the upper side of the side wall adjacent to the fixing rod 8. The insert plate 9-2 is inserted into the slot on the side wall of the patch module 10. The toothed plates 9-3 are multiple in number and are equidistantly arranged from top to bottom within the fixing rod 8. The toothed plates 9-3 are staggered and fixed to the side walls of the connecting plates 9-1 on both sides. The strip-shaped limiting grooves on both sides of the toothed plates 9-3 are each embedded with a limiting block 14, which is fixed to the inner wall of the fixing rod 8. Rotating gear 9-4, there are several rotating gears 9-4, and they are meshed one-to-one between two symmetrical toothed plates 9-3. The rotating gear 9-4 is screwed to the fixed rod 8 through a bearing. Linkage rod 9-5 is screwed into fixed rod 8 via bearing. Linkage rod 9-5 is connected to the shaft on one of the rotating gears 9-4 via bevel gear pair. The other end of linkage rod 9-5 is connected to rotating shaft 9-6 via worm gear pair. Rotating shaft 9-6 is screwed onto fixed rod 8 via bearing, and one end of rotating shaft 9-6 is exposed on the outside of fixed rod 8.

[0022] When using this invention, according to the chip specifications, the adjusting motor 5-4 is started. The adjusting motor 5-4 drives the adjusting screw 5-3 to rotate. Through the synchronous wheel transmission assembly, the relatively set adjusting screws 5-3 rotate synchronously, driving the slider to move the connecting plate 5-2, which in turn drives the telescopic connecting rod 5-1 to extend and retract. The shaft at the intersection of the telescopic connecting rod 5-1 drives each abutment rod 4 to move through the adjusting rod 5-5, so that the distribution range of the abutment rod 4 array matches the chip size. The moving rollers 12 at the bottom of the abutment rod 4 ensure smooth movement. After completion, the chip is placed on the contact rod 4 and positioned by the four corner limiting mechanisms 6. The bidirectional lead screw 6-5 exposed on the outside of the contact rod 4 is rotated. The bidirectional lead screw 6-5 drives the other bidirectional lead screws 6-5 to rotate synchronously through the synchronous wheel transmission assembly and bevel gear pair, driving the hinge block 6-4 to move along the slide groove on the side wall of the contact rod 4. The hinge block 6-4 drives the push rod 6-2 to rotate through the push connecting rod 6-3. The push rod 6-2 drives the limiting plate 6-1 to move to the four corners of the chip to complete the limiting. At this time, the chip can be cut. After cutting, the cut chips are transferred one by one to the mounting modules 10 on the mounting carrier 3 by a mechanical gripper. The rotating motor 7-4 is started, and the rotating motor 7-4 drives the drive disk 7-2 to rotate through the synchronous wheel transmission assembly. The drive rod 7-3 at the bottom of the drive disk 7-2 rotates accordingly. When the drive rod 7-3 rotates to one side of the rotating disk 7-1, the protrusion on the drive rod 7-3 inserts into the actuation groove 7-1-1 on the rotating disk 7-1, causing the rotating disk 7-1 to rotate at a certain angle. When the protrusion moves out of the actuation groove 7-1-1, the drive disk 7-2 abuts against the arc-shaped contact groove 7-1-2 on the rotating disk 7-1, achieving intermittent positioning. The annular slide rail 13 at the bottom of the mounting carrier 3 cooperates with the annular slide groove on the fixed plate 1 to ensure the stability of the rotation process. Through the intermittent drive of the equal angle rotation mechanism 7, the mounting carrier 3 sequentially delivers each mounting module 10 to the working position. While the chip is placed on the surface mount module 10, the heating rod 11 inside the fixing rod 8 is activated. Under the action of the pushing spring 16, the heating rod 11 always keeps in close contact with the groove at the bottom of the surface mount module 10 to preheat the chip and provide temperature conditions for subsequent surface mount operations. When it is necessary to replace the surface mount module 10 of different specifications, the rotating shaft 9-6 exposed on the outside of the fixing rod 8 is rotated. The rotating shaft 9-6 drives the linkage rod 9-5 to rotate through the worm gear pair. The linkage rod 9-5 drives the rotating gear 9-4 to rotate through the bevel gear pair. The rotating gear 9-4 drives the upper and lower interlocking toothed plates 9-3 to move. The toothed plates 9-3 drive the insertion plate 9-2 to exit from the slot on the side wall of the surface mount module 10 through the connecting plate 9-1, so that the surface mount module 10 can be easily replaced. The limiting blocks 14 on both sides of the toothed plates 9-3 cooperate with the limiting groove to prevent the toothed plates 9-3 from moving excessively. Through its integrated structural design, this equipment enables continuous operation, allowing chips to be directly transferred to the placement process after dicing, reducing intermediate transfer links and improving production efficiency. Meanwhile, the adjustable array of contact rods 4 and the limiting mechanism 6 adapt to various chip sizes, the equal-angle rotation mechanism 7 ensures the accuracy of the placement position, and the modular placement module 10 allows for easy process switching by changing its structure.

[0023] Compared with the prior art, the beneficial effects of this specific embodiment are as follows: 1. Adjust the motor 5-4 to drive the lead screw to deform the telescopic connecting rod 5-1. Adjust the distribution range of the matrix-type abutment rod 4 synchronously through the adjusting rod 5-5, so that the positioning point can quickly adapt to chips of different sizes, achieving precise support and high versatility. 2. Rotating the bidirectional lead screw 6-5 drives the hinge block 6-4 to drive the linkage mechanism through the bevel gear pair and synchronous wheel transmission, so that the limiting plate 6-1 synchronously presses against the four corners of the chip, realizing rapid centering and clamping, and ensuring that the chip position is firm and stable during cutting; 3. The rotating motor 7-4 drives the convex rod to intermittently move the rotating disk 7-1 through the drive disk 7-2, and locks the station position with the arc-shaped contact groove 7-1-2, so that the chip carrier 3 can achieve intermittent rotation at equal angles, which facilitates the sequential feeding of materials at multiple stations and significantly improves the efficiency of chip mounting operations. 4. The rotating shaft 9-6 drives the insert plate 9-2 on the connecting plate 9-1 to extend and retract synchronously through the linkage rod 9-5 and the gear plate mechanism, so as to realize the quick installation and removal of the patch module 10; the heating rod 11 is pushed by the push spring 16 to always fit the module, ensuring continuous and stable preheating.

[0024] For those skilled in the art, modifications can be made to the technical solutions described in the foregoing embodiments, and equivalent substitutions can be made to some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this invention should be included within the protection scope of this invention.

Claims

1. A chip laser cutting and printing substrate carrier, comprising a fixing plate (1), a cutting substrate (2), and a substrate carrier (3), wherein the cutting substrate (2) is fixed to one side of the upper surface of the fixing plate (1), and the substrate carrier (3) is connected to the other side of the upper surface of the fixing plate (1) via a shaft; characterized in that, It also includes: Abutting rod (4), there are several abutting rods (4), and they are arranged in a matrix on the upper surface of the cutting carrier plate (2). The abutting rods (4) are connected to the cutting carrier plate (2) through the adjustment mechanism (5). The limiting mechanism (6) consists of four parts, which are respectively set on the top of the abutment rod (4) at the four corners; An equal-angle rotation mechanism (7) is provided in the fixed plate (1) and is connected to the shaft at the bottom of the patch carrier plate (3). Fixed rod (8), there are several fixed rods (8), and they are set at equal angles on the upper side of the patch carrier plate (3). The top of the fixed rod (8) is connected to the patch module (10) through the connecting mechanism (9). Heating rods (11) are a number of rods, and they are equally arranged in a matrix and inserted into the upper end of the fixing rod (8). The upper end of the heating rods (11) is inserted into the groove on the lower side wall of the patch module (10).

2. The chip laser cutting and printing substrate carrier according to claim 1, characterized in that: The adjustment mechanism (5) includes: Telescopic connecting rods (5-1), there are four telescopic connecting rods (5-1), and they are respectively suspended on the upper side of the cutting plate (2) around the perimeter. The two ends of the telescopic connecting rods (5-1) away from the center of the cutting plate (2) are connected to the connecting plate (5-2) by bearings. The connecting plate (5-2) on one side is fixed on one side wall of the cutting plate (2), and the connecting plate (5-2) on the other side is slidably set in the groove on the side wall of the cutting plate (2) by a slider. There are four adjusting screws (5-3), and they are respectively screwed to the slider on the connecting plate (5-2) by threads. The two ends of the adjusting screws (5-3) are respectively screwed into the cutting plate (2) by bearings. The two adjusting screws (5-3) arranged opposite to each other are connected by a synchronous wheel transmission assembly. One end of one of the two connected adjusting screws (5-3) is connected to an adjusting motor (5-4). The adjusting motor (5-4) is embedded and fixed in the cutting plate (2). Adjusting rod (5-5), there are several adjusting rods (5-5), and their two ends are respectively fixed on the shaft at the intersection of the telescopic connecting rod (5-1) on both sides of the symmetry. The abutting rod (4) is movably sleeved on the adjusting rod (5-5).

3. The chip laser cutting and printing substrate carrier according to claim 1, characterized in that: The bottom of each of the abutment rods (4) is fitted with a movable roller (12), which is movably mounted on the upper surface of the cutting plate (2).

4. The chip laser cutting and printing substrate carrier according to claim 1, characterized in that: The limiting mechanism (6) includes: Limiting plate (6-1), there are two limiting plates (6-1), and they are respectively set on the side of the abutment rod (4) away from the center of the cutting plate (2). The limiting plate (6-1) is connected to the push rod (6-2) by a shaft in the side wall adjacent to the abutment rod (4). The push link (6-3) consists of four push links (6-3), which are arranged symmetrically in pairs. The two support rods at the inner end of the push link (6-3) are connected to the outer end of the push rod (6-2) through shafts. The two support rods at the outer end of the push link (6-3) pass through the limiting plate (6-1) and are screwed to the hinge block (6-4) through the shaft. The hinge block (6-4) is slidably arranged in the groove on the side wall of the abutment rod (4). There are four bidirectional lead screws (6-5), which are symmetrically connected to the top of the contact rod (4) by bearings. The two ends of the bidirectional lead screws (6-5) are respectively connected to the corresponding hinge blocks (6-4) by threads. The bidirectional lead screws (6-5) that are symmetrically connected to each other are connected by a synchronous pulley transmission assembly. One end of one of the bidirectional lead screws (6-5) is exposed on the outside of the contact rod (4). The linkage bevel gear pair (6-6) is located in one corner of the abutment rod (4), and the two bevel gears in the linkage bevel gear pair (6-6) are respectively sleeved and fixed on the corresponding two bidirectional lead screws (6-5).

5. A chip laser cutting and printing substrate carrier according to claim 1, characterized in that: The constant angle rotation mechanism (7) includes: Rotary disk (7-1), the rotating disk (7-1) is sleeved and fixed on the shaft on the lower side of the patch carrier plate (3), and the rotating disk (7-1) is provided with staggered actuation grooves (7-1-1) and arc-shaped contact grooves (7-1-2) at equal angles. The drive disk (7-2) is mounted in the fixed plate (1) via a shaft. The drive disk (7-2) is engaged with the arc-shaped contact groove (7-1-2). A drive rod (7-3) is fixed at the bottom of the drive disk (7-2). The protrusion on the drive rod (7-3) is engaged with the actuating groove (7-1-1). The rotating motor (7-4) is fixed on the upper surface of the fixed plate (1) and is located between the cutting carrier plate (2) and the patch carrier plate (3). The output shaft of the rotating motor (7-4) is inserted into the fixed plate (1) and is connected to the shaft on the drive disk (7-2) through the synchronous wheel transmission assembly.

6. A chip laser cutting and printing substrate carrier according to claim 1, characterized in that: An annular slide rail (13) is fixed on the lower surface of the patch carrier plate (3), and the annular slide rail (13) is slidably disposed in the annular groove on the fixed plate (1).

7. A chip laser cutting and printing substrate carrier according to claim 1, characterized in that: The connecting mechanism (9) includes: Connecting plate (9-1), there are two connecting plates (9-1), and they are set on both sides of the fixing rod (8). Each connecting plate (9-1) is fixed with a plug plate (9-2) on the upper side of the side wall of the fixing rod (8). The plug plate (9-2) is inserted into the slot on the side wall of the patch module (10). The toothed plates (9-3) are several in number and are equidistantly arranged from top to bottom inside the fixing rod (8). The toothed plates (9-3) are staggered and fixed to the side walls of the connecting plates (9-1) on both sides. Rotating gears (9-4), there are several rotating gears (9-4), and they are meshed one-to-one between two symmetrical toothed plates (9-3). The rotating gears (9-4) and the fixed rod (8) are screwed together by bearings. Linkage rod (9-5) is screwed into fixed rod (8) through bearing. Linkage rod (9-5) is connected to shaft on one of the rotating gears (9-4) through bevel gear pair. The other end of linkage rod (9-5) is connected to rotating shaft (9-6) through worm gear pair. Rotating shaft (9-6) is screwed onto fixed rod (8) through bearing, and one end of rotating shaft (9-6) is exposed on the outside of fixed rod (8).

8. A chip laser cutting and printing substrate carrier according to claim 7, characterized in that: Limiting blocks (14) are embedded in the strip-shaped limiting grooves on both sides of the toothed plate (9-3), and the limiting blocks (14) are fixed on the inner wall of the fixing rod (8).

9. A chip laser cutting and printing substrate carrier according to claim 1, characterized in that: A limiting ring (15) is sleeved and fixed on the middle end of the heating rod (11). A push spring (16) is fixed at the lower end of the limiting ring (15). The push spring (16) is sleeved on the lower end of the heating rod (11). The lower end of the push spring (16) is fixed inside the fixing rod (8).