Memory dynamic heat dissipation method, heat dissipation system, medium and product

Abstract

The invention provides a memory dynamic heat dissipation method, a heat dissipation system, a medium and a product, and relates to the technical field of automatic control. According to the method, the surface temperature of the memory module is monitored in real time and compared with the preset threshold value, and dynamic and accurate heat dissipation is achieved. When the temperature exceeds the standard, the system generates a heat dissipation intervention instruction to drive the linear displacement module to carry the flexible heat conduction capsule body which is processed into a sheet shape through negative pressure, and the flexible heat conduction capsule body accurately moves to the position above the target memory gap and extends into the target memory gap. And then a cooling medium circulating pump injects a medium to fill the bag body, and the bag body is attached to the internal storage heating surface for efficient heat conduction. And after the temperature is reduced to a safety threshold value, the pump body pumps back the medium to enable the bag body to recover to be in a sheet shape, the linear displacement module carries the bag body to leave the gap, one-time closed-loop heat dissipation is completed, and the rigid adaptation defect and energy consumption waste of a traditional scheme are effectively avoided.

Description

Technical Field

[0001] This application relates to the field of automatic control technology, and in particular to a method, system, medium and product for dynamic heat dissipation of memory. Background Technology

[0002] With the rapid increase in CPU and GPU computing power, the power consumption and heat density of next-generation memory modules such as DDR5 have increased significantly. In order to achieve the ultimate computing power within the limited cooling system chassis, the memory slots are arranged extremely closely, with physical gaps between modules typically only a few millimeters. This objective environment of "high heat flux density" and "extremely narrow heat dissipation space" causes heat to easily accumulate deep within the memory array, becoming a key bottleneck restricting system performance stability.

[0003] To address the aforementioned heat dissipation bottleneck, existing technologies typically employ a fixed liquid cooling solution. The main approach involves pre-installing rigid metal cold heads on the surface of the memory chips and connecting these cold heads to a circulation loop via fixed hard tubing or flexible tubing. During system operation, coolant continuously flows through the metal cold heads fixed to the memory chips, utilizing the liquid's thermal conductivity to remove heat and thus achieve temperature control for the high-power memory.

[0004] However, this fixed liquid cooling solution has a difficult technical problem to overcome: the contradiction between the rigid fixed structure and the narrow gaps between memory slots. Due to the extremely narrow gaps between memory slots and the existence of manufacturing tolerances, the rigid metal cold heads permanently installed in the existing technology lack the ability to deform and are difficult to adaptively fit the gaps between memory slots of different thicknesses or with slight deformations; this "size-fixed" rigid contact method makes it difficult to achieve efficient and safe heat dissipation without changing the physical layout. Summary of the Invention

[0005] This application provides a dynamic heat dissipation method, heat dissipation system, medium, and product for memory, which solves the heat dissipation bottleneck of traditional high-power memory modules in narrow installation gaps and realizes dynamic and precise intervention of memory heat dissipation.

[0006] In a first aspect, this application provides a dynamic heat dissipation method for memory modules. This method is applied to a heat dissipation system within a computer chassis. The system includes a temperature monitoring module, a deformable flexible heat-conducting bladder, a cooling medium circulation pump, and a linear displacement module mounted above the memory module slots. The method includes: acquiring real-time temperature data of the memory module surface; comparing the real-time temperature data with a preset heat dissipation activation threshold; if the real-time temperature data is higher than the heat dissipation activation threshold, generating a heat dissipation intervention command; and, based on the heat dissipation intervention command, driving the linear displacement module to move the flexible heat-conducting bladder in an unfilled state. The device moves above the gap area where the target memory module is located and extends into the gap. Before extending, the flexible heat-conducting bladder is controlled to be in a negative pressure suction state and in the form of a thin sheet. The cooling medium circulation pump is controlled to inject cooling medium into the flexible heat-conducting bladder until the outer surface of the flexible heat-conducting bladder is attached to the surface of the heat-generating area of ​​the memory module. The temperature of the memory module is continuously monitored. When the temperature drops to a preset reset threshold, the cooling medium circulation pump is controlled to draw the cooling medium back from the flexible heat-conducting bladder to an unfilled state, and the linear displacement module is controlled to perform a withdrawal action to move the flexible heat-conducting bladder out of the gap.

[0007] By adopting the above technical solution, the core leverages the deformable characteristics of the flexible heat-conducting bladder and the precise movement capability of the linear displacement module: when unfilled, the negative pressure forms a thin sheet that can easily adapt to narrow memory gaps of a few millimeters, solving the problem of rigid cold heads being unable to enter; after the cooling medium is injected, the bladder expands and fits against the heat-generating area, achieving efficient heat conduction; once the temperature reaches the target, the medium is withdrawn and the module is removed, without occupying additional space. The coordinated operation of all components overcomes the heat dissipation limitations of confined spaces and achieves dynamic and precise heat dissipation, avoiding the energy waste of continuous heat dissipation across the entire array, and significantly improving the adaptability and efficiency of memory heat dissipation.

[0008] In conjunction with some embodiments of the first aspect, in some embodiments, the step of generating the heat dissipation intervention command specifically includes: reading real-time temperature data fed back by sensors inside each memory module; determining the physical slot number of the memory module with abnormal temperature based on a pre-built physical layout mapping table of memory modules; calculating the target displacement data of the linear displacement module on the guide rail according to preset slot spacing parameters; and generating the heat dissipation intervention command based on the target displacement data.

[0009] By adopting the above technical solution, the real-time temperature data of each memory sensor is first read to accurately locate the module with abnormal temperature; then, relying on the pre-built physical layout mapping table, the slot number of the abnormal module is quickly locked; and the target displacement data is calculated by combining the slot spacing parameters to provide accurate navigation for the linear displacement module. This process, through the logical progression of "data acquisition - positioning and locking - displacement calculation," ensures the accuracy of the heat dissipation intervention command, allowing the linear displacement module to quickly and accurately reach the target position, avoiding invalid movement, and improving the heat dissipation response speed and positioning accuracy.

[0010] In conjunction with some embodiments of the first aspect, in some embodiments, before the step of controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bladder, the method further includes: acquiring real-time air temperature and relative humidity data of the internal environment of the chassis; calculating the current dew point temperature based on the air temperature and relative humidity data; detecting the current temperature of the cooling medium; and if the current temperature of the cooling medium is lower than the sum of the dew point temperature and a preset safety margin, adjusting the mixing valve to introduce high-temperature reflux medium until the temperature of the cooling medium is higher than the sum of the dew point temperature and the preset safety margin.

[0011] By adopting the above technical solution, the temperature and humidity of the air inside the chassis are first obtained and the dew point temperature is calculated to determine the safe lower limit of the cooling medium's temperature. Then, the current temperature of the medium is detected, and if it is lower than the safe threshold, a high-temperature recirculation medium is introduced through a mixing valve for regulation. This approach, through the linkage and control of temperature and humidity data with the medium temperature, effectively avoids condensation on the memory surface caused by excessively low cooling medium temperature, preventing safety hazards such as short circuits. While ensuring heat dissipation performance, it provides a safety guarantee for memory operation and improves the reliability of the cooling system.

[0012] In conjunction with some embodiments of the first aspect, in some embodiments, the step of controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bag specifically includes: controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bag, and collecting fluid back pressure data at the output end of the cooling medium circulation pump in real time; calculating the slope of the fluid back pressure data over time; and determining that the flexible heat-conducting bag has completed effective contact when a positive abrupt change in the slope is detected and exceeds a preset contact determination threshold.

[0013] By employing the above technical solution, the fluid back pressure data at the output of the circulating pump is collected in real time during the injection of cooling medium. The contact state is determined by analyzing the slope of the back pressure change: when the slope changes abruptly in the positive direction and exceeds a threshold, the effective contact between the capsule and the memory is confirmed. This design utilizes the correlation between fluid back pressure and contact state, eliminating the need for additional sensors to accurately determine the bonding effect. This avoids poor heat dissipation efficiency due to poor contact and ensures a reliable heat conduction foundation from the start-up stage.

[0014] In conjunction with some embodiments of the first aspect, in some embodiments, after determining that the flexible heat-conducting bag has completed effective contact, the method further includes: acquiring real-time temperature data of the memory module and calculating the temperature drop rate of the surface temperature data; determining whether the temperature drop rate is less than a preset heat conduction efficiency threshold; if the temperature drop rate is less than the heat conduction efficiency threshold, determining that the flexible heat-conducting bag is currently in a non-fully-fitted state; controlling the cooling medium circulation pump to output a pulsed pressure of a preset waveform, so as to use the pulsed pressure to drive the outer surface of the flexible heat-conducting bag to generate a slight creep deformation between the surface textures of the memory module, the preset waveform including a sine wave or a triangular wave; until the temperature drop rate exceeds the heat conduction efficiency threshold or the output duration of the pulsed pressure reaches a preset protection time limit, stopping the output of the pulsed pressure and restoring the constant pressure injection state.

[0015] By employing the above technical solution, the rate of temperature drop in the memory is first calculated to determine if the capsule is fully fitted. If the fit is poor, the circulating pump outputs pulsating pressure of a sine wave or triangular wave to drive the capsule to slightly undulate on the memory surface. The pulsating pressure allows the capsule to adapt to the texture and minute deformations of the memory surface, filling the gaps and ensuring the temperature drop rate meets the target. This mechanism, through a closed loop, solves the problem of rigid contact being unable to adapt to surface differences, further improving heat transfer efficiency.

[0016] In conjunction with some embodiments of the first aspect, in some embodiments, after the step of controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bag, the method further includes: real-time monitoring of the medium temperature inside the flexible heat-conducting bag; when the medium temperature reaches a preset heat saturation threshold, controlling the cooling medium circulation pump to extract a preset proportion of cooling medium and reinject an equal amount of new cooling medium; repeating the extraction and reinjection operation until the medium temperature reaches a preset thermal stability threshold.

[0017] By employing the above technical solution, the temperature of the medium inside the capsule is monitored in real time. When the thermal saturation threshold is reached, a portion of the old medium is extracted and replaced with new medium until the temperature stabilizes. The thermal conductivity of the thermally saturated medium decreases; by replacing the old medium with new, the medium's heat dissipation capacity can be quickly restored, preventing the heat dissipation efficiency from decreasing due to thermal saturation. This ensures a continuously efficient heat dissipation process and maintains the memory temperature within a safe range.

[0018] In conjunction with some embodiments of the first aspect, in some embodiments, the process of performing the insertion action further includes: real-time monitoring of the resistance feedback data of the linear displacement module; if the monitored resistance feedback data exceeds a preset safety threshold, the insertion action is stopped, and the linear displacement module is controlled to perform a retraction action.

[0019] By adopting the above technical solution, resistance feedback data is monitored in real time during the extension of the linear displacement module. When the resistance exceeds the safety threshold, the module immediately stops and retracts. This design can effectively avoid module collision damage caused by sudden situations such as memory installation deviations or obstructions. Through the "real-time monitoring-emergency stoppage" protection mechanism, the physical safety of the heat dissipation system and memory module is guaranteed, improving the operational safety and stability of the solution.

[0020] In a second aspect, this application provides a heat dissipation system comprising: one or more processors and a memory; the memory is coupled to the one or more processors and is used to store computer program code, the computer program code including computer instructions, wherein the one or more processors invoke the computer instructions to cause the heat dissipation system to perform the method described in the first aspect and any possible implementation thereof.

[0021] Thirdly, this application provides a computer-readable storage medium including instructions that, when executed on a heat dissipation system, cause the heat dissipation system to perform the method described in the first aspect and any possible implementation thereof.

[0022] Fourthly, this application provides a computer program product, including a computer program that, when run on a heat dissipation system, causes the heat dissipation system to perform the method described in the first aspect and any possible implementation thereof.

[0023] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0024] 1. By adopting the core technology of dynamic positioning and cooling medium injection bonding of negative pressure thin sheet flexible heat-conducting bag linear displacement module, the technical problem of rigid cold head being unable to adapt to narrow memory gaps and difficult to self-adapt to bonding in the existing technology is effectively solved. This achieves efficient adaptation of memory heat dissipation to narrow space, and achieves the technical effect of dynamic and precise heat dissipation, reducing energy waste and improving heat dissipation efficiency.

[0025] 2. By adopting the technical means of collecting chassis temperature and humidity, calculating dew point temperature, and linking cooling medium temperature for adjustment, the safety hazard of condensation on the memory surface caused by excessively low cooling medium temperature in the existing technology is effectively solved. This achieves safe control of the heat dissipation process, avoids short circuit risks, and improves the reliability of the heat dissipation system.

[0026] 3. By adopting a closed-loop regulation technology that monitors the rate of temperature drop and drives the micro-peristalsis of the bladder, the technical problem that rigid contact cannot adapt to the surface texture of the memory and the insufficient fit of small deformations in the existing technology is effectively solved. This achieves a tight fit between the flexible heat-conducting bladder and the heat-generating surface of the memory, significantly improving the heat conduction efficiency. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a system framework for the heat dissipation system in an embodiment of this application;

[0028] Figure 2 This is a flowchart illustrating a dynamic heat dissipation method for memory in an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of a scenario of the dynamic heat dissipation method for memory in an embodiment of this application;

[0030] Figure 4 This is a schematic diagram of the physical device structure of a heat dissipation system in an embodiment of this application. Detailed Implementation

[0031] The terminology used in the following embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” “the,” “the,” “the,” and “this” are intended to include the plural expressions as well, unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used in this application refers to and includes any or all possible combinations of one or more of the listed items.

[0032] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0033] For ease of understanding, the following is a framework description of the heat dissipation system provided in this embodiment. Please refer to... Figure 1 This is a schematic diagram of a system framework for the heat dissipation system in an embodiment of this application.

[0034] exist Figure 1 The cooling system is deployed inside the chassis, and its core consists of a linear displacement module, a cooling medium circulation pump, a deformable flexible heat-conducting bladder, and a memory module array (including the motherboard substrate). The components work together to form a dynamic heat dissipation path.

[0035] The linear displacement module is mounted on the guide rail directly above the memory module slot. It is a moving carrier that enables precise positioning and heat dissipation. Its slider can move horizontally along the guide rail to cover the gap area of ​​all memory modules.

[0036] The cooling medium circulation pump is integrated next to the slider of the linear displacement module. It is the power source for the flow of cooling medium. It is directly connected to the flexible heat-conducting bladder below through the pipeline and is responsible for injecting / retracting cooling medium into the bladder.

[0037] The deformable, flexible heat-conducting bladder is suspended at the bottom of the slider. When not in use, it is drawn into a thin sheet shape by negative pressure and moves with the slider to the gap of the target memory module, extending vertically into it. When the circulating pump injects cooling medium, the bladder expands and fits against the heat-generating surface of the memory module, achieving heat conduction. The length of the flexible heat-conducting bladder can be set according to the height of the memory module and the vertical space of the gap area. For example, it can be designed to cover the core heat-generating area of ​​the memory module, ensuring that it can completely fit against the heat-generating surface of the memory module after being fully inflated. Alternatively, a certain amount of expansion and contraction margin can be reserved according to the vertical redundancy space in the chassis; this is not limited here.

[0038] A pre-set length of pipe can exist between the cooling medium circulation pump and the flexible heat-conducting bladder to provide sufficient leeway for pipe movement when the flexible heat-conducting bladder moves, preventing the pipe from being pulled or jammed due to the movement of the slider; alternatively, the cooling medium circulation pump can be placed below the linear displacement module, next to the flexible heat-conducting bladder, and move together with the slider. Figure 1 (not shown in the image) This facilitates shorter pipeline lengths, reduces heat loss of the cooling medium during transmission, and improves the response speed of medium pressure control, making the filling, retraction, and pulsating pressure regulation of the bladder more precise and efficient.

[0039] The memory module array (including memory modules 1-4) is vertically inserted onto the motherboard (memory slot base), with a few millimeters of gap between each module, which is the target of the heat dissipation system.

[0040] The system works as follows: the real-time temperature of the memory surface is obtained through the temperature monitoring module. When the temperature exceeds the threshold, the linear displacement module carries a thin sheet-like capsule to the top of the target memory and extends into the gap. The circulation pump injects medium to make the capsule fully fill and adhere, and the cooling medium removes the heat. After the memory temperature drops to a safe value, the circulation pump withdraws the medium to make the capsule return to its thin sheet shape. The linear displacement module carries the capsule out of the gap, completing one dynamic heat dissipation process. The above actions can be repeated for any heat-generating memory module to achieve "precise heat dissipation on demand".

[0041] The following describes the process of the method provided in this implementation. Please refer to [link / reference]. Figure 2 This is a flowchart illustrating a dynamic heat dissipation method for memory in an embodiment of this application.

[0042] S201. Obtain real-time temperature data of the surface of the memory module;

[0043] This step is performed continuously after the cooling system is started, throughout the entire period of memory operation. The core scenario is to monitor the heat dissipation of each memory module in real time, providing data support for subsequent cooling decisions.

[0044] The cooling system continuously collects temperature data at a preset frequency using temperature sensors (core components of the temperature monitoring module) pre-deployed on the surface of each memory module. During the data collection process, the sensors convert the physical quantity of temperature into an electrical signal, which is then filtered and amplified by the signal processing module before being converted into digital temperature data and transmitted to the main control unit of the cooling system. In multi-memory module scenarios, the system assigns a unique number to the temperature data of each module, corresponding one-to-one with the physical slot of the memory module, ensuring data traceability.

[0045] The core effect of this step is to break the limitations of traditional heat dissipation systems that blindly dissipate heat. By collecting real-time and accurate temperature data, the heat dissipation system can dynamically sense the heat status of the memory, providing a basis for subsequent targeted heat dissipation and avoiding heat accumulation due to delayed temperature sensing.

[0046] S202. Compare the real-time temperature data with the preset heat dissipation start threshold.

[0047] The preset heat dissipation start threshold refers to the temperature critical value that the heat dissipation system pre-sets to trigger the heat dissipation action. It is a value determined based on the safe operating temperature range of the memory module, power consumption characteristics, and chassis heat dissipation environment.

[0048] This step is executed immediately after each temperature data acquisition. The scenario involves determining the temperature status of each memory module, distinguishing between "normal heat generation" and "heat dissipation required." After receiving the real-time temperature data transmitted by S201, the main control unit of the cooling system first retrieves the pre-stored cooling activation threshold in the system, and then performs an independent comparison for each memory module:

[0049] If the real-time temperature data of a memory module is equal to or lower than the heat dissipation activation threshold, the module is considered to be generating heat normally and does not require activation of heat dissipation.

[0050] If the real-time temperature data exceeds the heat dissipation activation threshold, the module is deemed to be overheating, requiring the triggering of subsequent heat dissipation procedures. During the comparison process, the system records the module number and the extent of the overheating, providing a basis for subsequent precise heat dissipation.

[0051] The core effect of this step is to establish a correlation logic between "temperature data and heat dissipation trigger". By comparing thresholds, heat dissipation actions are initiated on demand, avoiding energy waste caused by continuous heat dissipation of the entire array. At the same time, it ensures that only memory with excessive heat will be activated, thus improving heat dissipation efficiency.

[0052] S203. If the real-time temperature data is higher than the heat dissipation activation threshold, a heat dissipation intervention command is generated.

[0053] Among them, the heat dissipation intervention command refers to the control signal issued by the main control unit of the heat dissipation system to start subsequent heat dissipation actions, which includes core command content such as target memory module positioning information and linear displacement module action parameters.

[0054] This step is executed when the S202 comparison result determines that the temperature of one or more memory modules exceeds the standard, and the scenario is the "command issuance" phase for initiating targeted heat dissipation. Once the main control unit confirms through S202 comparison that the real-time temperature of a certain memory module is higher than the heat dissipation activation threshold, it immediately initiates the command generation process:

[0055] First, the main control unit of the cooling system reads real-time temperature data from the sensors inside all memory modules at a preset frequency (consistent with S201). Each set of data is accompanied by a corresponding sensor number, which is pre-bound to the physical slot number of the memory module to ensure data traceability. Then, the main control unit retrieves a pre-built physical layout mapping table of memory modules, compares the real-time temperature data of each module with the cooling start threshold, filters out abnormal modules with excessive temperatures, and determines their corresponding physical slot number through the mapping table (for example, if sensor number 002 corresponds to slot 3, then the memory module in slot 3 is determined to have an abnormal temperature).

[0056] Next, the main control unit extracts the preset slot spacing parameters recorded in the mapping table, and combines the current initial position coordinates of the linear displacement module (e.g., the initial position is above slot 1) and the target slot number (e.g., slot 3) to calculate the target displacement data: Assuming the slot spacing is 2cm, the initial position corresponds to slot 1 with an X-axis coordinate of 10cm and slot 3 with an X-axis coordinate of 14cm, then the target displacement distance is 4cm, and the direction is the positive X-axis direction. During the calculation process, the mechanical error of the guide rail (e.g., ±0.1cm) will be automatically compensated.

[0057] Finally, the main control unit integrates the target displacement data with preset action timing parameters (such as moving speed of 5cm / s and insertion delay of 0.5s) and initial injection parameters of cooling medium (such as initial pressure of 0.3MPa) to generate standardized heat dissipation intervention commands. The command format conforms to the control protocol of the linear displacement module and the cooling medium circulation pump, ensuring that the components can accurately identify and execute them.

[0058] The core effect of this step is that it solves the problem of traditional heat dissipation systems being unable to accurately locate abnormal memory modules through the logic of "data binding-mapping positioning-precise calculation". This gives the movement of the linear displacement module a clear target basis, avoids invalid movement or positioning deviation, significantly improves the heat dissipation response speed and execution accuracy, and lays the foundation for the subsequent flexible heat-conducting bladder to quickly reach the target position and dissipate heat efficiently.

[0059] S204. Based on the heat dissipation intervention command, drive the linear displacement module to move the flexible heat-conducting bag in an unfilled state to the gap area where the target memory module is located, and perform an insertion action. Before insertion, the flexible heat-conducting bag is controlled to be in a negative pressure suction state so as to be in a thin sheet shape.

[0060] This step is executed immediately after the heat dissipation intervention command is generated, and the scenario is to accurately deliver the heat dissipation execution component to the target location to solve the problem of entering narrow gaps.

[0061] First, the main control unit of the heat dissipation system transmits the target displacement data in the heat dissipation intervention command to the drive motor of the linear displacement module. The drive motor drives the slider to move horizontally along the guide rail. The flexible heat-conducting bladder fixed at the bottom of the slider moves synchronously with the slider until it reaches directly above the gap area where the target memory module is located (the positioning accuracy is ensured by the module physical layout mapping table and slot spacing parameters, with an error ≤0.5mm).

[0062] Before moving, the system has performed a negative pressure suction operation on the flexible heat-conducting bladder through a cooling medium circulation pump to extract the air from the bladder and shrink it into a thin sheet shape, ensuring that the thickness is less than the width of the internal gap to avoid jamming during entry.

[0063] Upon reaching the target position, the drive motor performs a vertical extension / retraction motion, slowly extending the flexible heat-conducting bladder into the gap area. During this extension, to cope with sudden obstacles and protect the physical safety of the cooling system and memory module, the drive motor of the linear displacement module has a built-in resistance sensor. As the flexible heat-conducting bladder extends into the memory gap, the sensor converts the reverse resistance experienced by the motor into an electrical signal in real time, which is transmitted to the main control unit of the cooling system. The main control unit continuously compares the received resistance feedback data with a preset safety threshold: if the resistance data remains below the safety threshold, the extension process is deemed normal, and the module is allowed to continue extending until the preset depth is reached; if the resistance feedback data suddenly increases and exceeds the safety threshold due to memory installation deviation (such as module tilt), the presence of foreign objects in the gap, or abnormal shape of the flexible heat-conducting bladder, the main control unit immediately triggers the protection mechanism.

[0064] The system immediately sends a stop command to cut off the drive motor's insertion power, preventing further force application that could overload the motor or damage the memory module. Subsequently, the main control unit sends a retraction command, controlling the drive motor to rotate in the opposite direction, causing the slider and flexible heat-conducting bag to retract vertically upwards at a speed lower than the insertion speed to prevent secondary impacts during retraction. After retraction is complete, the system records data such as the peak resistance and insertion depth of this abnormal event and alerts the user to troubleshoot the problem via the alarm module.

[0065] The core effect of this step is that by combining "precise positioning + thin sheet insertion", the technical problem that existing rigid cold heads cannot enter narrow memory gaps is solved. At the same time, through the precise drive of the linear displacement module, it is ensured that the flexible heat-conducting bag can quickly and accurately reach the target position, laying the foundation for subsequent bonding and heat dissipation.

[0066] S205. Control the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bag until the outer surface of the flexible heat-conducting bag is in contact with the surface of the heat-generating area of ​​the memory module.

[0067] This step is performed after the flexible heat-conducting bladder in S204 has fully extended into the target gap area. The scenario is that the bladder expands to achieve close contact with the memory heating surface, establishing an efficient heat conduction path.

[0068] The main control unit of the heat dissipation system sends an injection command to the cooling medium circulation pump. The circulation pump starts and injects cooling medium into the flexible heat-conducting bladder at a preset initial pressure (e.g., 0.3 MPa, which can be adjusted according to the memory gap width). During the injection process, the fluid back pressure sensor at the output of the circulation pump collects back pressure data in real time, and the main control unit continuously calculates the slope of the back pressure data over time: In the initial stage, the bladder is not fully expanded, the back pressure is low and changes slowly; when the bladder expands to contact the surface of the memory's heat-generating area, continued injection of medium will cause the internal pressure of the bladder to rise rapidly, and the slope of the back pressure change will change abruptly in the positive direction. When this slope exceeds the preset contact judgment threshold, the main control unit determines that the bladder has made effective contact, and at this time, the injection pressure can be appropriately reduced to maintain the bladder's fit. For cases where there are minute textures or deformations on the memory surface, the flexible characteristics of the bladder allow it to adapt to the surface morphology and fill the gaps in the fit.

[0069] The core effect of this step is to solve the technical problem that existing rigid cold blocks cannot adaptively fit the memory surface. By expanding and fitting the flexible capsule, the heat conduction contact area is maximized. At the same time, back pressure monitoring is used to ensure the fitting effect, providing a reliable heat conduction foundation for efficient heat dissipation.

[0070] In some embodiments, after the flexible heat-conducting bladder completes the effective contact determination in S205, in order to solve the problem of insufficient heat dissipation efficiency caused by insufficient initial adhesion of the flexible bladder, the optimal adhesion effect can be achieved through dynamic adjustment, as follows:

[0071] First, the temperature monitoring module of the heat dissipation system acquires real-time temperature data of the target memory module at a high-frequency acquisition frequency. The main control unit calculates the temperature drop rate based on two consecutive sets of data. Then, the main control unit retrieves a preset heat conduction efficiency threshold and compares the calculated temperature drop rate with it: if the drop rate is higher than or equal to the threshold, it is determined that the capsule fits sufficiently, the heat conduction efficiency meets the standard, and the current constant pressure injection state is maintained.

[0072] If the temperature drop rate is below the threshold, the capsule is determined to be in a non-perfectly fitted state (possibly due to gaps caused by surface texture protrusions, minor deformations, or foreign matter residue). At this point, the main control unit sends a pulsed pressure control command to the cooling medium circulation pump. The circulation pump outputs pulsed pressure according to a preset waveform, with the pressure value fluctuating periodically around the baseline constant pressure. The pulsed pressure is transmitted to the flexible heat-conducting capsule through the cooling medium, driving the outer surface of the capsule to produce micro-peristalsis along the surface texture of the memory: when the pressure increases, the capsule locally expands, filling the gaps in the texture; when the pressure decreases, the capsule locally contracts, and then, with the next pressure increase, it peristalsizes towards the unfitted area, gradually eliminating the contact gaps. During this process, the system continuously monitors the temperature drop rate and the duration of the pulsed pressure output: if the temperature drop rate exceeds the heat transfer efficiency threshold, it is determined that the fit has been optimized, and the pulsed pressure output is immediately stopped, restoring the constant pressure injection state; if the pulsed pressure output duration reaches the preset protection time limit, even if the temperature drop rate does not meet the standard, the pulsed output is stopped to avoid excessive deformation and damage to the capsule, and this state is recorded for subsequent parameter optimization.

[0073] The core effect of this step is to solve the technical defect that traditional rigid contact cannot adapt to the surface texture and slight deformation of memory through a closed loop of "efficiency monitoring - problem judgment - dynamic creep adjustment". This allows the flexible heat-conducting bladder to upgrade from "initial fit" to "full fit", maximize the heat conduction contact area, significantly improve heat dissipation efficiency, and at the same time, through the protection time limit design, balance the fit effect and component safety.

[0074] In some embodiments, before the S205 controls the cooling medium circulation pump to inject the medium, a pre-protection process to ensure heat dissipation safety can be added to avoid the cooling medium temperature being too low, causing condensation on the memory surface and triggering safety hazards such as short circuits.

[0075] First, the cooling system uses temperature and humidity sensors deployed inside the chassis to acquire real-time air temperature and relative humidity data at a preset frequency. The sensors are installed close to the memory module array to ensure that the collected data accurately reflects the environmental conditions surrounding the memory. Then, the main control unit calls a preset dew point temperature calculation formula (such as the Magnus-Tetens formula), substituting the collected air temperature and relative humidity data into the calculation to obtain the dew point temperature under the current environment (e.g., when the air temperature is 30℃ and the relative humidity is 60%, the dew point temperature is approximately 21.5℃). Simultaneously, the system uses a temperature sensor installed in the cooling medium circulation pipeline to detect the current temperature of the cooling medium to be injected into the capsule (e.g., a detected value of 18℃). Next, the main control unit calculates the sum of the dew point temperature and a preset safety margin (assuming a safety margin of 3℃, then the safety temperature threshold is 24.5℃), and compares the current cooling medium temperature with this safety threshold: if the current cooling medium temperature is higher than the safety threshold, it is determined that there is no risk of condensation, and the subsequent injection action is directly executed; if the current cooling medium temperature is lower than the safety threshold, an adjustment command is immediately sent to the mixing valve. After receiving the command, the mixing valve gradually increases its opening degree, introducing the high-temperature reflux medium (typically higher than the temperature of the fresh cooling medium, such as 40°C) that has undergone heat dissipation circulation in the pipeline. This reflux medium then mixes thoroughly with the low-temperature fresh medium in the mixing chamber. During the mixing process, the system continuously monitors the temperature of the mixed cooling medium and dynamically adjusts the opening degree of the mixing valve until the medium temperature rises above the safety threshold. At this point, the high-temperature reflux medium inlet channel is closed, and after maintaining a stable temperature for the cooling medium, the injection operation is performed again.

[0076] The core effect of this step is to fundamentally solve the safety hazard of condensation on the memory surface caused by excessively low cooling medium temperature in existing heat dissipation systems through closed-loop control of "environmental data acquisition - dew point calculation - medium temperature adjustment". While ensuring that the heat dissipation efficiency is not reduced, it provides dual protection for the electrical and physical safety of the memory module and the heat dissipation system, and significantly improves the reliability and applicability of the entire heat dissipation solution.

[0077] In some embodiments, after the cooling medium is injected and the capsule is attached in step S205, in order to solve the problem of heat saturation and heat dissipation efficiency decay caused by continuous heat absorption of the cooling medium, and to maintain the stability of the heat dissipation effect, the following can be implemented:

[0078] First, the heat dissipation system uses temperature sensors installed inside the flexible heat-conducting bladder to collect real-time temperature data of the cooling medium. The sensors are in direct contact with the medium, ensuring accurate temperature detection. The main control unit continuously compares the collected medium temperature with a preset heat saturation threshold: if the medium temperature is below the heat saturation threshold, it is determined that the medium still possesses efficient heat conduction capabilities, and no medium replacement is needed, maintaining the current circulation state; if the medium temperature rises to the heat saturation threshold, it indicates that the medium has absorbed a large amount of heat, and the heat conduction efficiency has significantly decreased. At this point, the main control unit sends a replacement command to the cooling medium circulation pump. The circulation pump first extracts a preset proportion of heat-saturated medium from the bladder at a preset extraction rate. The extracted heat-saturated medium is temporarily stored in a return tank, and then immediately reinjects an equal amount of new cooling medium at the same rate, ensuring that the total amount of medium in the bladder remains unchanged, maintaining the fit between the bladder and the memory, and preventing failure of the fit due to a reduction in the amount of medium.

[0079] After replacement, the system continues to monitor the medium temperature. If the temperature remains above the thermal stability threshold, the extraction-reinjection operation is repeated until the medium temperature drops below the thermal stability threshold. At this point, the replacement operation is stopped, and the normal circulation of the cooling medium is restored. Throughout the replacement process, sufficient medium volume is maintained within the bladder to ensure uninterrupted heat conduction, while the injection of new medium rapidly replenishes the heat dissipation capacity.

[0080] The core effect of this step is to solve the technical problem of a sharp drop in heat dissipation efficiency after the cooling medium becomes thermally saturated in traditional heat dissipation systems through a closed loop of "real-time monitoring - saturation determination - dynamic replacement". This ensures that the heat dissipation process is continuously efficient and avoids the memory temperature from rising due to the decay of the thermal conductivity of the medium, thereby further improving the stability and continuous heat dissipation capability of the heat dissipation system.

[0081] S206. Continuously monitor the temperature of the memory module. When the temperature drops to the preset reset threshold, control the cooling medium circulation pump to draw the cooling medium back from the flexible heat-conducting bag to an unfilled state, and control the linear displacement module to perform a withdrawal action to move the flexible heat-conducting bag out of the gap.

[0082] This step is executed after S205 completes the capsule bonding and enters the heat dissipation stage. The scenario is that the heat dissipation components are recycled after the heat dissipation meets the standard, so as to avoid occupying memory gaps or affecting subsequent heat dissipation needs.

[0083] First, the temperature monitoring module continuously collects surface temperature data of the target memory module and transmits it to the main control unit in real time. The main control unit continuously compares this data with a preset reset threshold: if the temperature is still higher than the reset threshold, the cooling medium circulation and the capsule's contact state are maintained to continue heat dissipation; if the temperature drops to or below the reset threshold, it is determined that the memory module's heating has returned to normal, and the main control unit immediately sends a retraction command. Upon receiving the command, the cooling medium circulation pump reverses its direction, retracting all the cooling medium in the capsule to the storage tank, and the capsule returns to a sheet-like shape due to the internal negative pressure. Subsequently, the main control unit sends a withdrawal command to the linear displacement module. The drive motor first moves the slider vertically upward, completely detaching the capsule from the memory gap, and then moves horizontally to the initial standby position (if another memory module with excessive cooling exists, it moves to above the gap of that module). Throughout the process, the system records data such as heat dissipation time and medium usage to optimize subsequent heat dissipation parameters.

[0084] The core effect of this step is to achieve closed-loop control of the heat dissipation process. Under the premise of ensuring that the memory temperature returns to normal, the heat dissipation components are promptly reclaimed without occupying narrow memory gaps, thus avoiding additional impact on the memory heat dissipation environment. At the same time, it prepares for the next heat dissipation demand and improves the cycle efficiency of the heat dissipation system.

[0085] In this embodiment, a dynamic heat dissipation technology is adopted that integrates real-time temperature monitoring, threshold comparison triggering, precise positioning of linear displacement modules, negative pressure thin-sheet insertion and full-filling of flexible heat-conducting bladders, medium retraction after temperature reaches the target, and module removal. Through the collaborative efforts of various components, a closed-loop control of "on-demand intervention - precise adaptation - efficient heat dissipation - timely recovery" is achieved. This effectively solves the technical problems of rigid cold heads in existing fixed liquid cooling solutions, such as inability to adapt to narrow memory gaps, difficulty in adaptively fitting the memory surface, delayed heat dissipation response, and energy waste. As a result, efficient adaptation of memory heat dissipation to confined spaces is achieved, resulting in dynamic and precise heat dissipation, improved heat conduction efficiency, reduced energy consumption, and safe and stable operation of the memory and heat dissipation system.

[0086] For better understanding, please refer to the following: Figure 3 This is a schematic diagram of a scenario for the dynamic heat dissipation method for memory in an embodiment of this application.

[0087] Figure 3 In (a) of the above, the system first determines, through a pre-built physical layout mapping table of memory modules, that the real-time temperatures of memory modules 1 and 2 are simultaneously higher than the heat dissipation activation threshold. After determining memory modules 1 and 2 as the target heat dissipation objects through temperature monitoring and location calculation, the flexible heat-conducting bladder is preferentially positioned in the gap between them. Figure 3In (a) of the diagram, the heat dissipation system is in its initial standby state. At this time, the deformable flexible heat-conducting bladder is in a thin, uninflated state under negative pressure suction, suspended at the bottom of the slider of the linear displacement module, awaiting the temperature monitoring module to trigger the heat dissipation intervention command. In this state, the bladder is very thin, easily adapting to gaps of only a few millimeters, preparing for precise insertion into the target location. Once positioning is complete, it can begin to inflate, thus presenting its full potential. Figure 3 The scenario shown in (b) is shown in the image.

[0088] Figure 3 In (b), the cooling system is in the engagement state. The linear displacement module, carrying a thin, flexible heat-conducting bladder, has completed its vertical insertion. The cooling medium circulation pump is injecting cooling medium into the bladder, causing it to inflate. The expanded bladder, utilizing its flexibility, adaptively adheres to the two opposing heat-generating surfaces of memory modules 1 and 2, forming a complete heat conduction path. The cooling medium can efficiently remove heat from both memory modules through the bladder. Simultaneously, the system monitors fluid back pressure to confirm effective contact and continuously monitors memory temperature to assess heat dissipation efficiency, providing a basis for subsequent dynamic adjustments or removal.

[0089] The heat dissipation system in the embodiments of this invention is described below from a hardware processing perspective. Please refer to [link / reference needed]. Figure 4 This is a schematic diagram of a physical device structure of a heat dissipation system in an embodiment of this application.

[0090] It should be noted that, Figure 4 The structure of the heat dissipation system shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments of the present invention.

[0091] like Figure 4 As shown, the heat dissipation system includes a Central Processing Unit (CPU) 401, which can perform various appropriate actions and processes based on programs stored in Read-Only Memory (ROM) 402 or programs loaded from storage section 408 into Random Access Memory (RAM) 403, such as performing the methods described in the above embodiments. The RAM 403 also stores various programs and data required for system operation. The CPU 401, ROM 402, and RAM 403 are interconnected via a bus 404. An Input / Output (I / O) interface 405 is also connected to the bus 404.

[0092] The following components are connected to I / O interface 405: input section 406 including audio input devices, push-button switches, etc.; output section 407 including a liquid crystal display (LCD) and audio output devices, indicator lights, etc.; storage section 408 including a hard disk, etc.; and communication section 409 including a network interface card such as a LAN (Local Area Network) card, modem, etc. Communication section 409 performs communication processing via a network such as the Internet. Drive 410 is also connected to I / O interface 405 as needed. Removable media 411, such as a disk, optical disk, magneto-optical disk, semiconductor memory, etc., are installed on drive 410 as needed so that computer programs read from them can be installed into storage section 408 as needed.

[0093] In particular, according to embodiments of the present invention, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of the present invention include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing computer programs for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via communication section 409, and / or installed from removable medium 411. When the computer program is executed by central processing unit (CPU) 401, it performs the various functions defined in the present invention.

[0094] It should be noted that specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM), flash memory, optical fiber, portable compact disc read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this invention, a computer-readable storage medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0095] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. Each block in a flowchart or block diagram may represent a module, program segment, or portion of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those shown in the drawings.

[0096] Specifically, the heat dissipation system of this embodiment includes a processor and a memory. The memory stores a computer program. When the computer program is executed by the processor, it implements the dynamic memory heat dissipation method provided in the above embodiment.

[0097] In another aspect, the present invention also provides a computer-readable storage medium, which may be included in the heat dissipation system described in the above embodiments; or it may exist independently and not assembled into the heat dissipation system. The storage medium carries one or more computer programs, which, when executed by a processor of the heat dissipation system, cause the heat dissipation system to implement the dynamic memory heat dissipation method provided in the above embodiments.

[0098] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

[0099] As used in the above embodiments, depending on the context, the term "when..." can be interpreted as meaning "if...", "after...", "in response to determining...", or "in response to detecting...". Similarly, depending on the context, the phrase "when determining..." or "if (the stated condition or event) is interpreted as meaning "if determining...", "in response to determining...", "when (the stated condition or event) is detected", or "in response to detecting (the stated condition or event)".

[0100] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. This program can be stored in a computer-readable storage medium, and when executed, it can include the processes described in the above method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM or random access memory (RAM), magnetic disks, or optical disks.

Claims

1. A dynamic heat dissipation method for memory, characterized in that, The method is applied to a heat dissipation system within a computer chassis. The system includes a temperature monitoring module, a deformable flexible heat-conducting bladder, a cooling medium circulation pump, and a linear displacement module mounted above memory module slots. The method includes: Obtain real-time temperature data of the surface of the memory module; The real-time temperature data is compared with the preset heat dissipation activation threshold; If the real-time temperature data is higher than the heat dissipation activation threshold, a heat dissipation intervention command is generated; Based on the heat dissipation intervention command, the linear displacement module is driven to move the flexible heat-conducting bag, which is in an unfilled state, to the gap area where the target memory module is located, and to perform an insertion action. Before insertion, the flexible heat-conducting bag is controlled to be in a negative pressure suction state so as to be in a thin sheet shape. The cooling medium circulation pump is controlled to inject cooling medium into the flexible heat-conducting bag until the outer surface of the flexible heat-conducting bag is in contact with the surface of the heat-generating area of ​​the memory module. The temperature of the memory module is continuously monitored. When the temperature drops to a preset reset threshold, the cooling medium circulation pump is controlled to draw the cooling medium back from the flexible heat-conducting bag to an unfilled state, and the linear displacement module is controlled to perform a withdrawal action to move the flexible heat-conducting bag out of the gap.

2. The method according to claim 1, characterized in that, The step of generating the heat dissipation intervention command specifically includes: Read real-time temperature data fed back by sensors inside each memory module; Based on a pre-built physical layout mapping table of memory modules, the physical slot number of the memory module with abnormal temperature is determined. Based on the preset slot spacing parameters, calculate the target displacement data of the linear displacement module on the guide rail; The heat dissipation intervention command is generated based on the target displacement data.

3. The method according to claim 1, characterized in that, Prior to the step of controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bladder, the method further includes: Obtain real-time air temperature and relative humidity data of the internal environment of the chassis; Calculate the current dew point temperature based on the air temperature and relative humidity data; Detect the current temperature of the cooling medium; If the current temperature of the cooling medium is lower than the sum of the dew point temperature and the preset safety margin, the mixing valve is adjusted to introduce a high-temperature reflux medium until the temperature of the cooling medium is higher than the sum of the dew point temperature and the preset safety margin.

4. The method according to claim 1, characterized in that, The step of controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bag specifically includes: The cooling medium circulation pump is controlled to inject cooling medium into the flexible heat-conducting bag, and the fluid back pressure data at the output end of the cooling medium circulation pump is collected in real time. Calculate the slope of the fluid back pressure data over time; When a positive abrupt change in the slope of the change is detected and exceeds the preset contact determination threshold, it is determined that the flexible heat-conducting bag has completed effective contact.

5. The method according to claim 4, characterized in that, After the step of determining that the flexible heat-conducting bag has achieved effective contact, the method further includes: Acquire the real-time temperature data of the memory module and calculate the temperature drop rate of the surface temperature data; Determine whether the rate of temperature decrease is less than a preset heat conduction efficiency threshold; If the rate of temperature decrease is less than the heat conduction efficiency threshold, then the flexible heat-conducting bag is determined to be in a non-fully fitted state. The cooling medium circulation pump is controlled to output a pulsating pressure with a preset waveform, so as to use the pulsating pressure to drive the outer surface of the flexible heat-conducting bladder to produce a slight creeping deformation between the surface texture of the memory module. The preset waveform includes a sine wave or a triangular wave. The output of the pulsating pressure will stop and the constant pressure injection state will be restored when the rate of temperature drop exceeds the heat conduction efficiency threshold or the output duration of the pulsating pressure reaches the preset protection time limit.

6. The method according to claim 1, characterized in that, After the step of controlling the cooling medium circulation pump to inject cooling medium into the flexible heat-conducting bag, the method further includes: Real-time monitoring of the medium temperature inside the flexible heat-conducting bladder; When the temperature of the medium reaches the preset heat saturation threshold, the cooling medium circulation pump is controlled to extract a preset proportion of cooling medium and reinject an equal amount of new cooling medium. Repeat the extraction and reinjection operations until the medium temperature reaches a preset thermal stability threshold.

7. The method according to claim 1, characterized in that, The process of performing the insertion action also includes: Real-time monitoring of the resistance feedback data of the linear displacement module; If the detected resistance feedback data exceeds a preset safety threshold, the insertion action is stopped, and the linear displacement module is controlled to perform a retraction action.

8. A heat dissipation system, characterized in that, The heat dissipation system includes: one or more processors and a memory; the memory is coupled to the one or more processors, the memory is used to store computer program code, the computer program code including computer instructions, and the one or more processors call the computer instructions to cause the heat dissipation system to perform the method as described in any one of claims 1-7.

9. A computer-readable storage medium comprising instructions, characterized in that, When the instruction is executed on the heat dissipation system, the heat dissipation system performs the method as described in any one of claims 1-7.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is run on the cooling system, it causes the cooling system to perform the method as described in any one of claims 1-7.

Images