Design method of heating sheet, heating sheet, atomization assembly, atomizer and aerosol generating device

Abstract

The invention belongs to the technical field of heating pieces, and provides a design method of a heating piece, the heating piece, an atomization assembly, an atomizer and an aerosol generating device.The design method of the heating piece comprises the steps that a three-dimensional model of the heating piece is constructed based on structural parameters of the heating piece; after the three-dimensional model is imported into simulation software, the simulation resistance value and temperature field distribution of the three-dimensional model are determined according to preset physical characteristic parameters and boundary conditions in the simulation software and a coupling control equation of a current field and a solid heat transfer field; and under the condition that the simulation resistance value and the temperature field distribution of the three-dimensional model meet the corresponding design conditions, determining that the structural parameters of the heating sheet meet the design requirements. Therefore, the resistance and temperature field distribution of the heating sheet can be accurately predicted without repeated physical proofing, the research and development efficiency is greatly improved, and the research and development cost is reduced.

Description

Technical Field

[0001] This application belongs to the field of heating element technology, and more specifically, relates to a design method for a heating element, a heating element, an atomizing component, an atomizer, and an aerosol generating device. Background Technology

[0002] In the field of atomization equipment, the resistance accuracy and temperature field uniformity of the heating element directly determine the atomization effect and service life.

[0003] Existing heating element designs often rely on empirical parameters for physical prototyping and repeated testing. This not only results in long development cycles and high costs, but also makes it difficult to accurately predict the resistance and temperature field distribution of the heating element, as these are affected by structural parameters, material properties, and the coupling of multiple physical fields. This can easily lead to problems such as local overheating and uneven temperature distribution, resulting in incomplete aerosol matrix atomization and accelerated aging of the heating element, thus failing to meet the requirements for efficient and stable design. Summary of the Invention

[0004] The purpose of this application is to provide a design method for a heating element, a heating element, an atomizing component, an atomizer, and an aerosol generating device. This aims to solve the technical problems of relying on experience for physical prototyping and repeated testing in the design of related heating elements, which not only results in low R&D efficiency and high cost, but also makes it difficult to accurately predict the resistance value and temperature field distribution, and easily leads to local overheating and uneven temperature.

[0005] To achieve the above objectives, according to the first aspect of this application, a method for designing a heating element is provided, the method comprising: Based on the structural parameters of the heating element, a three-dimensional model of the heating element is constructed; After importing the three-dimensional model into the simulation software, the simulation resistance and temperature field distribution of the three-dimensional model are determined according to the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equation of the current field and the solid heat transfer field. If the simulated resistance and temperature field distribution of the three-dimensional model meet the corresponding design conditions, then the structural parameters of the heating element are determined to meet the design requirements.

[0006] In some embodiments, the method further includes: If at least one of the simulated resistance and temperature field distribution in the three-dimensional model does not meet the corresponding design conditions, it is determined that the structural parameters of the heating element do not meet the design requirements. If the structural parameters of the heating element do not meet the design requirements, adjust the structural parameters of the heating element and rebuild a new three-dimensional model based on the new structural parameters until it is determined that the new structural parameters of the heating element meet the design requirements.

[0007] In some embodiments, the structural parameters of the heating element include composition, size parameters, and region division parameters. The structure includes a positive electrode pin, a negative electrode pin, and a heating mesh. The heating mesh integrates electrode pads, conductive heating areas, and heat dissipation areas, and the heating mesh is arranged symmetrically in the top, bottom, left, and right directions. The region division parameter is that the conductive heating region is divided into multiple continuous independent regions along the length direction. The width of the conductive heating wire in each independent region is the same, and the width of the conductive heating wire in different independent regions is gradually set along the direction away from the pin.

[0008] In some embodiments, the method further includes: The simulation software calls the preset physical characteristic parameters of the heating element, including density, constant pressure heat capacity, thermal conductivity and electrical conductivity. The preset boundary conditions are loaded in the simulation software. The boundary conditions include electrical boundary conditions and thermal boundary conditions. The electrical boundary conditions are to set the negative terminal of the heating element to ground, set the positive terminal of the heating element to a terminal when calculating the resistance, and set the positive terminal to a voltage when calculating the temperature. The thermal boundary conditions are to add convective heat flux conditions and set the corresponding heat transfer coefficient. The coupling function between the current field and the solid heat transfer field is enabled in the multiphysics module of the simulation software to construct the coupling control equation. The coupling control equation is used to characterize the interaction between the Joule heat generated by the current field as a heat source participating in the calculation of the solid heat transfer field and the feedback effect of temperature change on the current field parameters.

[0009] In some embodiments, determining the simulation resistance and temperature field distribution of the three-dimensional model based on preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field, includes: Based on the current field control equation, the electric boundary conditions, and the conductivity, the current distribution law in the three-dimensional model is solved, and the simulated resistance of the heating element is calculated. The current field control equation is used to characterize the correlation between the current density vector and the material conductivity. Based on the solid heat transfer control equation, the thermal boundary condition, the density, the constant pressure heat capacity, and the thermal conductivity, the Joule heat generated by the current field is used as the heat source input, wherein the solid heat transfer control equation is used to characterize the conduction law of heat inside the solid. By combining the aforementioned coupled control equations, the interaction between the current field and the solid heat transfer field is established, so that temperature changes affect the conductivity of the heating element, thereby correcting the current distribution and the amount of Joule heat generated. The coupling solution of the current field and the solid heat transfer field is achieved through iterative calculation, and the simulation resistance value and temperature field distribution of the three-dimensional model are finally output.

[0010] In some embodiments, adjusting the structural parameters of the heating element includes: Adjust the conductive heating line width parameter of the conductive heating area of ​​the heating mesh in the heating element; The adjustment method for the conductive heating linewidth parameter is to change the value of the baseline linewidth or the value of the linewidth gradient difference, while keeping the linewidth gradient relationship of each independent region of the conductive heating region unchanged.

[0011] In some embodiments, the linewidth of the heat dissipation area of ​​the heating mesh in the heating element is 0.08 mm to 0.38 mm; the material of the heating mesh includes iron-chromium-aluminum alloy, nickel-chromium alloy, and stainless steel alloy; the thickness of the heating mesh is 0.05 mm to 0.12 mm; and the diameter of the positive and negative leads of the heating mesh is 0.25 mm to 0.8 mm.

[0012] In some embodiments, the connection relationships of the components of the heating element include: Electrode pads are respectively provided at the edges of both ends of the heating mesh; The positive electrode pin and the negative electrode pin are respectively connected to the electrode pads at both ends of the heating mesh; The heat dissipation area is distributed on the outer edge of the conductive heating area and is integrally connected to the conductive heating area of ​​the heating mesh.

[0013] In some embodiments, the connection relationships of the components of the heating element include: The positive electrode pin and the negative electrode pin are respectively fixed to the electrode pads of the heating mesh by welding. The electrode pads, the conductive heating area, and the heat dissipation area are an integrated structure of the heating mesh. The conductive heating area is located in the middle area of ​​the heating mesh, and the heat dissipation area surrounds the outer periphery of the conductive heating area and is connected to the electrode pads.

[0014] In some embodiments, when the conductive heating area is divided into five consecutive independent regions along its length, the five consecutive independent regions are, from left to right, a first region, a second region, a third region, a fourth region, and a fifth region. The conductive heating line width of the fourth region is a baseline line width, the conductive heating line widths of the third and fifth regions are both the baseline line width minus the line width gradient difference, the conductive heating line width of the first region is the baseline line width minus three times the line width gradient difference, and the conductive heating line width of the second region is the baseline line width minus four times the line width gradient difference.

[0015] In some embodiments, the baseline width ranges from 0.05 mm to 0.32 mm, and the line width gradient difference ranges from 0.005 mm to 0.04 mm.

[0016] According to a second aspect of this application, a heating element is provided, designed using any of the methods described in the present invention. The heating element includes a positive electrode pin, a negative electrode pin, and a heating mesh. The heating mesh is provided with a conductive heating area and a heat dissipation area. The conductive heating area is divided into multiple continuous independent areas along its length. The width of the conductive heating wires in each independent area is consistent, and the width of the conductive heating wires in different independent areas is gradually changed along the direction away from the pin.

[0017] According to a third aspect of this application, a heating element for an atomizing assembly is provided, including the heating element.

[0018] According to a fourth aspect of this application, an atomizing component is provided, including a liquid guiding element and a heating element, wherein the two ends of the heating mesh are bent relative to each other into a cylindrical shape, and the liquid guiding element is sleeved on the outside of the heating mesh.

[0019] According to a fifth aspect of this application, an atomizer is provided, comprising a liquid reservoir and an atomizing component, the liquid reservoir being used to store an aerosol matrix, the atomizing component being located inside the liquid reservoir, and the atomizing component being used to heat the aerosol matrix.

[0020] According to a sixth aspect of this application, an aerosol generating apparatus is provided, including a power supply component and an atomizer, wherein the power supply component is used to supply power to the atomizer component.

[0021] It is understandable that the beneficial effects of the second to sixth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here.

[0022] The beneficial effects of the embodiments in this application compared with the prior art are: The heating element design method provided in this application involves constructing a three-dimensional model of the heating element based on its structural parameters. After importing the three-dimensional model into simulation software, the simulated resistance and temperature field distribution of the three-dimensional model are determined according to the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field. If the simulated resistance and temperature field distribution of the three-dimensional model meet the corresponding design conditions, the structural parameters of the heating element are determined to meet the design requirements.

[0023] Furthermore, through digital modeling and multi-physics coupling simulation, the resistance and temperature field distribution of the heating element can be accurately predicted without repeated physical prototyping, which greatly improves R&D efficiency and reduces R&D costs. At the same time, it effectively avoids problems such as local overheating and uneven temperature, ensuring that the heating element performance meets the design requirements and guarantees stable atomization effect and service life. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic flowchart illustrating a design method for a heating element provided in an embodiment of this application; Figure 2 This is a schematic diagram of the composition structure of an optional heating element provided in an embodiment of this application; Figure 3a This is a schematic diagram of the temperature distribution of an optional heating element provided in an embodiment of this application; Figure 3b This is a schematic diagram of the temperature field distribution of an optional heating element provided in an embodiment of this application; Figure 3c This is a schematic diagram of the temperature field distribution of another optional heating element provided in this application embodiment; Figure 4a This is a temperature distribution diagram of an optional heating element compared to traditional solutions; Figure 4b This is a schematic diagram of the temperature field distribution of an optional heating element compared to traditional solutions; Figure 4c This is a schematic diagram of the temperature field distribution of an alternative heating element provided by the traditional solution; Figure 5 This is a flowchart illustrating an optional heating element design method provided in an embodiment of this application; Figure 6 This is a schematic diagram of an optional conductive heating area provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of an atomizing component provided in an embodiment of this application. Detailed Implementation

[0026] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0027] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0028] It should also be understood that, in the description of this application, unless otherwise stated, the " / " used in the specification and appended claims indicates that the related objects are in an "or" relationship. For example, A / B can mean A or B. The "and / or" in this application is merely a description of the relationship between the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0029] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, but are only used for distinguishing descriptions, and the terms "first" and "second" do not necessarily imply that they are different, nor should they be construed as indicating or implying relative importance.

[0030] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0031] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0032] In the field of atomization technology, the heating element is a crucial component for heating and atomizing aerosol matrix. The performance of the heating element directly determines the atomization efficiency, taste consistency, and service life. Currently, the design of heating elements largely relies on empirical parameter tuning. This involves first determining the structural dimensions (such as linewidth, length, and thickness) and materials of the heating element based on requirements, and then optimizing the parameters through multiple physical prototypes and testing to meet the design requirements for resistance and temperature field distribution.

[0033] However, traditional design methods have obvious drawbacks: on the one hand, the physical prototyping and testing process is cumbersome and time-consuming, and each adjustment of structural parameters requires the re-making of samples, resulting in high R&D costs and low efficiency; on the other hand, the temperature field distribution of the heating element is affected by the coupling of structural parameters (such as linewidth distribution and heat dissipation area design), material properties and working environment, and it is difficult to accurately predict by experience alone, which can easily lead to problems such as local overheating (forming hot spots) and uneven temperature distribution, which in turn leads to incomplete atomization of the aerosol matrix, poor taste, and even accelerated aging of the heating element due to local overheating, shortening the service life of the heating element.

[0034] In addition, in the existing structural design of heating elements, the line width of the conductive heating area is mostly set uniformly or with a simple gradient design, which fails to fully adapt to the heat dissipation differences of different areas (such as the area near the pin dissipates heat quickly and the middle area dissipates heat slowly), further aggravating the problem of uneven temperature distribution.

[0035] Therefore, there is an urgent need for a heating element design method that can accurately predict the resistance and temperature field distribution of the heating element, shorten the research and development cycle, reduce costs, and optimize the temperature field uniformity.

[0036] This application provides an example of a design method for a heating element. Please refer to [link / reference]. Figure 1 As shown, Figure 1 A schematic flowchart illustrating a design method for a heating element provided in this application is shown. This is an example and not a limitation; the method can be applied to or operated in electronic devices. The method includes: S101, Based on the structural parameters of the heating element, a three-dimensional model of the heating element is constructed.

[0037] S102. After importing the three-dimensional model into the simulation software, the simulation resistance and temperature field distribution of the three-dimensional model are determined according to the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field.

[0038] S103, if the simulated resistance and temperature field distribution of the three-dimensional model meet the corresponding design conditions, the structural parameters of the heating element are determined to meet the design requirements.

[0039] In some embodiments, firstly, a three-dimensional model of the heating element is constructed based on its structural parameters. These structural parameters include the composition, dimensions, and region division parameters of the heating element. For example... Figure 2 The schematic diagram shows the composition of the heating element. The heating element includes positive and negative leads and a heating mesh. The heating mesh integrates electrode pads, conductive heating areas, and heat dissipation areas, and is symmetrically arranged vertically and horizontally. Dimensional parameters include the length, width, and thickness of the heating element, the linewidth of the heat dissipation area, the thickness of the heating mesh, and the diameters of the positive and negative leads. The area division parameters are that the conductive heating area is divided into multiple continuous independent regions along its length. The width of the conductive heating line within each independent region remains consistent, and the width of the conductive heating line in different independent regions gradually changes away from the leads. After determining the above structural parameters, and considering the material properties of the heating element (e.g., the positive and negative leads are made of nickel-200 material, and the heating mesh is made of iron-chromium-aluminum alloy, nickel-chromium alloy, or stainless steel alloy), a Joule heating module and steady-state study type are added to the 3D modeling software. The structural parameters and material properties are completely entered into the 3D modeling software, replicating a 3D model consistent with the actual design of the heating element.

[0040] Next, after importing the 3D model into the simulation software, the simulated resistance and temperature field distribution of the 3D model are determined based on the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field. Specifically, the physical characteristic parameters include the density of the heating element's body and pins, constant pressure heat capacity, thermal conductivity, and electrical conductivity; the boundary conditions include setting the negative pin to ground, setting the positive pin as a terminal when calculating the resistance, setting the positive pin as a voltage when calculating the temperature, and adding convective heat flux conditions and setting the corresponding heat transfer coefficients; the operation of constructing the coupling control equations involves adding electromagnetic thermal coupling in the multiphysics module of the simulation software, associating the current field with the solid heat transfer field, to characterize the interaction between the Joule heat generated by the current field as a heat source participating in the calculation of the solid heat transfer field and the feedback effect of temperature changes on the current field parameters.

[0041] After configuring the aforementioned physical properties and boundary conditions, the current distribution in the three-dimensional model is solved based on the current field control equation, electrical boundary conditions, and conductivity, thereby calculating the simulated resistance of the heating element (the current field control equation characterizes the correlation between the current density vector and the material conductivity). Simultaneously, based on the solid heat transfer control equation, thermal boundary conditions, density, constant pressure heat capacity, and thermal conductivity, Joule heat generated by the current field is used as the heat source input (the solid heat transfer control equation characterizes the conduction of heat within the solid). Subsequently, combined with the coupling control equation, the interaction between the current field and the solid heat transfer field is established, allowing temperature changes to influence the conductivity of the heating element, thereby correcting the current distribution and the amount of Joule heat generated. Finally, through iterative calculation, the coupled solution of the current field and the solid heat transfer field is achieved, outputting the simulated resistance and temperature field distribution of the three-dimensional model.

[0042] Finally, assuming the simulated resistance and temperature field distribution of the 3D model meet the corresponding design conditions, the structural parameters of the heating element are deemed to conform to the design requirements. These design conditions include simulated resistance requirements and temperature field distribution requirements. Specifically, the simulated resistance requirement is a range of 0.2 ± 0.03 ohms. Figure 3a The temperature distribution diagram of the heating element shown is as follows: Figure 3b As shown, the temperature field distribution requirement is that the area of ​​the heating element above 180 degrees Celsius is 0, and as... Figure 3c As shown, the area of ​​the region above 140 degrees Celsius shall not be less than 90% of the total area of ​​the heating element (the total area of ​​the heating element is the product of the length and width of the heating element).

[0043] If either the simulated resistance or the temperature field distribution does not meet the above design conditions, the structural parameters of the heating element are adjusted. Specifically, the linewidth parameters of the conductive heating region are adjusted by changing the value of the baseline linewidth or the linewidth gradient difference, while keeping the gradual change relationship of the linewidth in each region unchanged. Then, based on the new structural parameters and material properties, the three-dimensional model is reconstructed, and the above simulation calculation and verification steps are repeated until the simulated resistance and temperature field distribution of the new three-dimensional model meet the design conditions. At this point, it is determined that the new structural parameters of the heating element meet the design requirements.

[0044] This application embodiment constructs a three-dimensional model of the heating element based on its structural parameters. By combining physical characteristic parameters, boundary conditions, and coupled simulation of the current field and solid heat transfer field, it predicts the resistance and temperature field distribution of the heating element. This eliminates the need for repeated physical prototyping to verify whether the structural parameters of the heating element meet the standards. It solves the technical problems of low design efficiency and high cost associated with traditional heating element methods, and allows for precise and controllable performance of the heating element through simulation optimization, thus avoiding issues such as… Figure 4a The design flaws shown include uneven temperature distribution and localized overheating of the heating element. For example, specifically... Figure 4bAs shown, the required temperature field distribution is that the area of ​​the heating element with a temperature above 180 degrees Celsius is 20.9 mm². 2 , and such Figure 4c As shown, the area above 140 degrees Celsius is less than 89.8 mm² of the total area of ​​the heating element. 2 .

[0045] In some embodiments, the structural parameters of the heating element include composition structure, size parameters, and region division parameters. The composition structure includes a positive electrode pin, a negative electrode pin, and a heating mesh. The heating mesh integrates electrode pads, conductive heating areas, and heat dissipation areas, and the heating mesh is arranged symmetrically in the top, bottom, left, and right directions. The region division parameters divide the conductive heating area into multiple continuous independent regions along the length direction. The width of the conductive heating wires in each independent region is consistent, and the width of the conductive heating wires in different independent regions gradually changes away from the pins.

[0046] In some embodiments, such as Figure 5 As shown, the method also includes: S501, if at least one of the simulated resistance and temperature field distribution in the three-dimensional model does not meet the corresponding design conditions, it is determined that the structural parameters of the heating element do not meet the design requirements.

[0047] S502, if the structural parameters of the heating element do not meet the design requirements, adjust the structural parameters of the heating element and rebuild a new three-dimensional model based on the new structural parameters until it is determined that the new structural parameters of the heating element meet the design requirements.

[0048] In some embodiments, if the simulated resistance value of the 3D model does not meet any of the corresponding design conditions in the temperature field distribution, it is determined that the structural parameters of the current heating element do not meet the design requirements. For example, if the simulated resistance value exceeds the preset range of 0.2 ± 0.03 ohms, or if there is a region above 180 degrees Celsius in the temperature field distribution, and the area of ​​the region above 140 degrees Celsius accounts for less than 90% of the total area of ​​the heating element, then the structural parameter adjustment operation is triggered.

[0049] After determining that the structural parameters do not meet the design requirements, the structural parameters of the heating element are adjusted. The main adjustment targets are the line width parameters of the conductive heating area. The specific adjustment method is to change the value of the baseline line width or the value of the line width gradient difference, while keeping the line width gradient relationship between each independent area unchanged. (For example, if the original baseline line width is 0.26 mm and the line width gradient difference is 0.02 mm, the baseline line width can be changed to 0.24 mm or the line width gradient difference can be changed to 0.015 mm, and the line width of each independent area still follows the rule of keeping the line width gradient relationship between each independent area unchanged.)

[0050] After adjusting the structural parameters, a new three-dimensional model is reconstructed based on the new structural parameters and the material properties of the heating element. The process of importing the new structural parameters into the simulation software, configuring physical property parameters and boundary conditions, constructing coupled control equations, solving the simulation resistance and temperature field distribution, and verifying whether the design conditions are met is repeated until the simulation resistance and temperature field distribution of the new three-dimensional model meet the corresponding design conditions. At this point, it is determined that the new structural parameters of the heating element meet the design requirements.

[0051] In some embodiments, the method further includes: The simulation software calls the preset physical property parameters of the heating element, including density, constant pressure heat capacity, thermal conductivity and electrical conductivity.

[0052] In the simulation software, preset boundary conditions are loaded. These boundary conditions include electrical boundary conditions and thermal boundary conditions. The electrical boundary conditions are to set the negative pin of the heating element to ground, set the positive pin of the heating element to a terminal when calculating the resistance, and set the positive pin to voltage when calculating the temperature. The thermal boundary conditions are to add convective heat flux conditions and set the corresponding heat transfer coefficient.

[0053] In the multiphysics module of the simulation software, the coupling function between the current field and the solid heat transfer field is enabled to construct the coupled control equation. The coupled control equation is used to characterize the interaction between the Joule heat generated by the current field as a heat source participating in the calculation of the solid heat transfer field and the feedback effect of temperature changes on the current field parameters.

[0054] In some embodiments, firstly, preset physical characteristic parameters of the heating element are called in the simulation software. These physical characteristic parameters are inherent properties corresponding to the heating element material, specifically including the density, constant-pressure heat capacity, thermal conductivity, and electrical conductivity of the heating element body (heating mesh) and pins. For example, if the heating mesh is made of iron-chromium-aluminum alloy, then the density, constant-pressure heat capacity, thermal conductivity, and electrical conductivity corresponding to that material are called; if the pins are made of nickel-200 material, then the aforementioned physical characteristic parameters corresponding to nickel-200 are called simultaneously.

[0055] Subsequently, preset boundary conditions are loaded into the simulation software. These boundary conditions are divided into electrical boundary conditions and thermal boundary conditions. The electrical boundary conditions are set by configuring the negative pin of the heating element as a ground boundary condition to determine the potential reference. When calculating the simulated resistance of the heating element, the positive pin is set as a terminal boundary condition to simulate the actual state of the heating element connected to the energized circuit. When calculating the temperature field distribution, the positive pin is set as a voltage boundary condition to match the actual power supply voltage input of the heating element during operation. The thermal boundary conditions are set by adding convective heat flux conditions and, based on the actual working environment of the heating element within the atomization assembly, such as its contact with air and liquid guiding components, setting the corresponding heat transfer coefficient to simulate the dissipation of heat generated by the heating element to the external medium.

[0056] Finally, the coupling function between the current field and the solid heat transfer field was enabled in the multiphysics module of the simulation software to construct a coupled control equation. This equation clarifies the interaction between the current field and the solid heat transfer field. On one hand, the Joule heat generated by the current passing through the heating element in the current field is input into the solid heat transfer field as a heat source, participating in the calculation of heat conduction within the heating element and heat dissipation to the outside. On the other hand, changes in the temperature of the heating element will affect the conductivity of its material (e.g., the conductivity of most metallic materials decreases with increasing temperature), thereby altering the current distribution in the current field. This change in current distribution further affects the amount of Joule heat generated. Through this coupled control equation, the simulation software can achieve dynamic correlation calculation between the current field and the solid heat transfer field, ensuring that the simulation results closely match the actual working characteristics of the heating element.

[0057] In some embodiments, the simulated resistance and temperature field distribution of the three-dimensional model are determined based on the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field, including: Based on the current field control equation, electric boundary conditions, and conductivity, the distribution law of current in the three-dimensional model is solved, and the simulated resistance of the heating element is calculated. The current field control equation is used to characterize the correlation between the current density vector and the material conductivity. Based on the solid heat transfer control equation, thermal boundary conditions, density, constant pressure heat capacity, and thermal conductivity, Joule heat generated by the current field is used as the heat source input. The solid heat transfer control equation is used to characterize the conduction law of heat inside the solid. By combining the coupled control equations, the interaction between the current field and the solid heat transfer field is established, so that the temperature change feedback affects the conductivity of the heating element, thereby correcting the current distribution and the amount of Joule heat generated. The coupling solution of the current field and the solid heat transfer field is achieved through iterative calculation, and the simulation resistance value and temperature field distribution of the three-dimensional model are finally output.

[0058] In some embodiments, the process of determining the simulated resistance and temperature field distribution of the three-dimensional model based on the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field, specifically includes the following steps: First, based on the current field control equation, preset electrical boundary conditions, and conductivity parameters, the current distribution in the three-dimensional model is solved, and the simulated resistance of the heating element is calculated. The current field control equation characterizes the relationship between the current density vector and the material conductivity. Essentially derived from Ohm's law, it accurately describes the current flow characteristics within the heating element. Combined with the preset electrical boundary conditions (negative pin grounded, positive pin as terminal / voltage), the simulation software calculates the current distribution throughout the heating element based on the conductivity differences between different regions (e.g., the different material conductivity between the conductive heating area and the heat dissipation area, and the current path changes caused by differences in linewidth in each independent region of the conductive heating area). Then, through the correlation between current distribution and resistance, the overall simulated resistance of the heating element is derived.

[0059] Next, based on the solid heat transfer control equation, preset thermal boundary conditions, and physical property parameters such as density, constant-pressure heat capacity, and thermal conductivity, the Joule heat generated by the aforementioned current field is used as a heat source input into the solid heat transfer field calculation. The solid heat transfer control equation is used to characterize the conduction law of heat inside the solid, covering the heat conduction, accumulation, and diffusion processes: the simulation software determines the rate of temperature rise after the material absorbs heat based on the density and constant-pressure heat capacity of the heating element, calculates the heat conduction efficiency in different regions inside the heating element in combination with the thermal conductivity, and simulates the heat dissipation process to the external environment through preset thermal boundary conditions (convective heat flux and heat transfer coefficient), while the Joule heat generated by the current field serves as the initial heat source, providing energy input for the entire solid heat transfer process.

[0060] Subsequently, combining the coupled control equations constructed earlier, the interaction relationship between the current field and the solid heat transfer field is established, so that temperature changes affect the conductivity of the heating element, thereby correcting the current distribution and the amount of Joule heat generated. Since the conductivity of the heating element is a temperature-dependent parameter, as the temperature of the heating element increases, its material conductivity will change regularly (e.g., the conductivity of metallic materials decreases with increasing temperature). The change in conductivity will directly change the current distribution state of the current field. If the conductivity decreases due to the increase in temperature, the current will shift to the relatively higher conductivity region in areas with higher current density, thus changing the location and amount of Joule heat generation. The new Joule heat distribution, in turn, affects the temperature distribution of the solid heat transfer field, forming a closed-loop relationship of current distribution → Joule heat → temperature change → conductivity adjustment → current distribution correction.

[0061] Finally, the coupled solution of the current field and the solid heat transfer field is achieved through iterative calculation. The simulation software repeatedly executes the process of "solving the current distribution → calculating Joule heat → solving the temperature distribution → correcting the conductivity → resolving the current distribution" according to a preset iteration step size until the resistance deviation and temperature distribution deviation in the two iterations are both less than the preset threshold, that is, the calculation converges. At this time, the simulation software outputs the final 3D model simulation resistance value and complete temperature field distribution data (including the specific temperature values ​​of each region of the heating element, the area ratio of different temperature ranges, etc.), providing accurate data support for subsequent verification of whether the structural parameters of the heating element meet the design requirements.

[0062] In some embodiments, adjusting the structural parameters of the heating element includes: adjusting the conductive heating linewidth parameter of the conductive heating area of ​​the heating mesh in the heating element; wherein, the conductive heating linewidth parameter is adjusted by changing the value of the baseline linewidth or the value of the linewidth gradient difference, while keeping the gradual change relationship of the linewidth of each independent area of ​​the conductive heating area unchanged.

[0063] In some embodiments, when it is determined that the structural parameters of the heating element do not meet the design requirements, the adjustment of the structural parameters revolves around the conductive heating linewidth parameter of the conductive heating area of ​​the heating mesh in the heating element. The adjustment method strictly follows the principle of maintaining a gradual relationship and optimizing only key parameters, as follows: The adjustment targets for the conductive heating linewidth parameter are the baseline linewidth and the linewidth gradient difference. During adjustment, the linewidth gradient relationship between the independent regions of the conductive heating area must remain constant. The baseline linewidth refers to the width of the conductive heating line in the middle independent region (such as the fourth region out of five independent regions divided along the length), serving as the reference for setting the linewidth gradient. The linewidth gradient difference refers to the change in conductive heating linewidth between adjacent independent regions, used to determine the magnitude of the linewidth gradient.

[0064] When making specific adjustments, you can choose to change the value of the baseline width alone, or change the value of the line width gradient difference alone, or adjust both values ​​simultaneously. For example, if the original baseline width is 0.26 mm and the line width gradient difference is 0.02 mm, the line width of each independent area follows the gradient rules of "baseline width - 4 × line width gradient difference", "baseline width - 3 × line width gradient difference", "baseline width - line width gradient difference", "baseline width", and "baseline width - line width gradient difference". After adjustment, the baseline width can be changed to 0.24 mm (the line width gradient difference remains unchanged at 0.02 mm). At this time, the line width of each independent area still follows the same gradient logic as above, and only the overall line width is adjusted synchronously. Alternatively, the line width gradient difference can be changed to 0.015 mm (the baseline width remains unchanged at 0.26 mm). The gradient amplitude of the line width of each independent area is adjusted accordingly, but the line width gradient relationship between adjacent areas remains consistent with that before the adjustment. Alternatively, the baseline width can be changed to 0.25 mm and the line width gradient difference can be changed to 0.018 mm at the same time to ensure that the line width gradient ratio and logic of each independent area do not change.

[0065] By adjusting in the above way, not only can the overall resistance characteristics and heat generation distribution of the conductive heating area be changed, thereby specifically correcting the simulated resistance and temperature field distribution, but the design logic of adapting heat dissipation differences through linewidth gradient of the conductive heating area can also be maintained, avoiding the failure of the design goal of temperature distribution uniformity due to adjustment, and ensuring that the adjusted structural parameters can still meet the requirements of long life and uniform temperature of the heating element.

[0066] In some embodiments, the linewidth of the heat dissipation area of ​​the heating mesh in the heating element is 0.08 mm to 0.38 mm; the material of the heating mesh includes iron-chromium-aluminum alloy, nickel-chromium alloy, and stainless steel alloy; the thickness of the heating mesh is 0.05 mm to 0.12 mm; and the diameter of the positive and negative leads of the heating mesh is 0.25 mm to 0.8 mm.

[0067] In some embodiments, the connection relationships of the components of the heating element include: Electrode pads are provided at the edges of both ends of the heating mesh; The positive and negative leads are connected to the electrode pads at both ends of the heating mesh, respectively. The heat dissipation area is located on the outer edge of the conductive heating area and is integrally connected to the conductive heating area of ​​the heating mesh.

[0068] In some embodiments, the heating mesh is an integrated structure with electrode pads integrated at both ends of the edge. The electrode pads are formed synchronously with the main structure of the heating mesh to ensure structural stability and conductivity continuity. The material of the electrode pads is consistent with that of the main body of the heating mesh to avoid technical problems such as excessive contact resistance or unstable conductivity due to material differences.

[0069] In some embodiments, the positive and negative pins are connected in a one-to-one correspondence to the electrode pads at both ends of the heating mesh, and the connection method is preferably welding. Welding forms a tight electrical and mechanical connection, ensuring that the current can be stably conducted from the pins to the conductive heating area of ​​the heating mesh, while ensuring the structural strength of the connection part and preventing the connection from loosening or falling off due to factors such as vibration and temperature changes during use.

[0070] In some embodiments, the heat dissipation area, as an important component of the heating element, is distributed on the outer edge of the conductive heating area and is integrally connected to it without additional splicing or assembly processes. This integrated design allows the heat generated by the conductive heating area to be directly and quickly conducted and diffused through the heat dissipation area, reducing heat accumulation in the conductive heating area. It also avoids the problem of reduced heat dissipation efficiency caused by gaps or contact resistance at splicing points, ensuring the overall uniformity of heat dissipation of the heating element and thus helping to improve the stability of the temperature field distribution. The connection between the electrode pads and the pins ensures the reliability of current transmission, while the integrated connection between the heat dissipation area and the conductive heating area ensures efficient heat diffusion. The connection methods and positional distribution of each component are highly compatible with the heating and heat dissipation functions of the heating element, providing structural support for the long-term stable operation of the heating element.

[0071] In some embodiments, the positive and negative leads are fixed to the electrode pads of the heating mesh by soldering. The electrode pads, the conductive heating area, and the heat dissipation area are an integrated structure of the heating mesh. The conductive heating area is located in the middle area of ​​the heating mesh, and the heat dissipation area surrounds the conductive heating area and is connected to the electrode pads.

[0072] In some embodiments, the heating mesh is an integral structure, ensuring structural stability, conductive continuity, and efficient heat dissipation. The electrode pads, conductive heating area, and heat dissipation area are manufactured using the same forming process (such as etching, laser cutting, etc.), with no seams and identical materials, structurally guaranteeing the continuity of conductivity and the unobstructed heat dissipation path. The conductive heating area is located in the central core region of the heating mesh and is the main area where Joule heat is generated by current flow. The heat dissipation area surrounds the conductive heating area, forming a surrounding distribution, and both ends of the heat dissipation area are seamlessly connected to the electrode pads at both ends of the heating mesh, making the electrode pads, heat dissipation area, and conductive heating area form a complete integrated conductive structure.

[0073] The positive and negative leads are fixedly connected to the electrode pads at both ends of the heating element via soldering. The soldered joints must be tightly fitted, without any cold or incomplete soldering, to reduce contact resistance and ensure efficient current conduction from the leads to the electrode pads, and then even distribution to the conductive heating area. Simultaneously, the soldering connection enhances the mechanical connection strength between the leads and the heating element, preventing leads from detaching or making poor contact during assembly, transportation, or use due to vibration, temperature cycling, or other factors, thus ensuring long-term stable operation of the heating element.

[0074] Using the embodiments of this application, the integrated electrode pad, conductive heating area, and heat dissipation area can reduce interface losses during heat conduction, allowing the heat generated by the conductive heating area to be quickly dissipated through the heat dissipation area. At the same time, through the connection between the heat dissipation area and the electrode pad, some heat is conducted to the pin, further improving the overall heat dissipation efficiency. The welding and fixing of the pin to the electrode pad ensures the reliability of current transmission and avoids local heat concentration or conductivity degradation due to connection problems, providing structural protection for the temperature uniformity and long life design of the heating element.

[0075] In some embodiments, when the conductive heating area is divided into five consecutive independent regions along its length, the five consecutive independent regions are, from left to right, the first region, the second region, the third region, the fourth region, and the fifth region. The conductive heating line width of the fourth region is the baseline line width, the conductive heating line width of the third and fifth regions is the baseline line width minus the line width gradient difference, the conductive heating line width of the first region is the baseline line width minus three times the line width gradient difference, and the conductive heating line width of the second region is the baseline line width minus four times the line width gradient difference.

[0076] In some embodiments, the baseline width ranges from 0.05 mm to 0.32 mm, and the line width gradient difference ranges from 0.005 mm to 0.04 mm.

[0077] In some embodiments, when the conductive heat-generating area is divided into five consecutive independent regions along its length, the division rules and linewidth settings of each region follow a precise gradient logic to adapt to the heat dissipation differences of different regions, such as... Figure 6Taking the five consecutive independent regions shown as an example, these five regions are defined from left to right as Region A, Region B, Region C, Region D, and Region E. Each independent region is continuously arranged along the length of the heating mesh, with no obvious boundary gaps between adjacent regions, ensuring the continuity of current conduction and the smoothness of heat diffusion. Region A, as the middle region of the conductive heating area, has its conductive heating wire width set as a baseline width (as shown in Figure 3, denoted as d). This baseline width is the core reference standard for the line width design of the entire conductive heating area, directly determining the overall resistance level and the basis of heat generation in the conductive heating area.

[0078] Around the baseline width, the width of the conductive heating lines in the other four regions is symmetrically and gradually changed using the baseline width minus the gradient difference. For example, as shown in Figure 3, the third and fifth regions are symmetrically distributed about the fourth region. The width of the conductive heating lines in both regions is set to the baseline width minus the line width gradient difference (denoted as △d), that is, the line width is d-△d. This setting makes the line width of the two regions near the middle region slightly narrower than the baseline width, matching their relatively weak heat dissipation conditions. The second and first regions are located at the left end of the conductive heating region (near the left electrode pad). The width of the conductive heating lines in the second region is the baseline width minus three times the line width gradient difference (d-3△d), and the width of the conductive heating lines in the first region is the baseline width minus four times the line width gradient difference (d-4△d), making it the narrowest region among the five regions.

[0079] It is worth noting that, due to the symmetrical arrangement of the heating mesh, the right side of the conductive heating area (near the right electrode pad) follows the same linewidth gradient rule as the left side (i.e., the linewidth of the right side symmetrical to the first area is d-4△d, and the linewidth of the right side symmetrical to the second area is d-3△d), ensuring that the linewidth distribution of the entire conductive heating area presents a symmetrical gradient trend. The end area near the electrode pad (the first area, the symmetrical right end area) dissipates heat through the pins the fastest, requiring a narrower linewidth to increase local heating power and offset the heat loss caused by rapid heat dissipation; while the fourth area in the middle dissipates heat the slowest, using the widest baseline linewidth to reduce local heating power and prevent heat accumulation and the formation of hot spots; the remaining areas achieve a precise match between heating power and heat dissipation efficiency through gradient linewidth settings, ultimately ensuring the uniformity of temperature distribution in the conductive heating area.

[0080] According to an embodiment of this application, a heating element embodiment is also provided, which is designed using any of the above-described design methods. The heating element includes a positive electrode pin, a negative electrode pin, and a heating mesh. The heating mesh is provided with a conductive heating area and a heat dissipation area. The conductive heating area is divided into multiple continuous independent areas along the length direction. The width of the conductive heating wire in each independent area is the same, and the width of the conductive heating wire in different independent areas is gradually set along the direction away from the pin.

[0081] The heating element provided in this application embodiment is designed using any of the above-described design methods. The structure and function of this heating element are highly adapted to the atomization heating requirements of the atomization assembly. The heating element includes a positive electrode pin, a negative electrode pin, and a heating mesh, which are connected in a stable manner to form an integrated heating structure. The heating mesh serves as the heating carrier of the heating element, and it integrates a conductive heating area and a heat dissipation area. These two areas are integrally molded without seams, ensuring efficient heat conduction and structural stability.

[0082] The conductive heating area is divided into multiple continuous independent regions along the length of the heating mesh, with seamless connections between these regions to ensure continuous and uniform current flow. In the design of the heating element, the width of the conductive heating wires within each independent region remains completely consistent to ensure uniform current density within each region and prevent localized heat concentration caused by uneven wire widths. Furthermore, the width of the conductive heating wires within different independent regions gradually changes in a regular pattern away from the pins.

[0083] The aforementioned linewidth gradient design accommodates the varying heat dissipation across different areas of the heating element. For instance, areas near the pins, being directly connected, allow for rapid heat conduction to the outside, resulting in higher heat dissipation efficiency. Conversely, the central area further from the pins has a longer heat dissipation path, leading to relatively lower efficiency. The linewidth gradient adjusts the resistance and heating power of each independent area. Narrower linewidths near the pins result in higher resistance and greater heating power, offsetting heat loss from rapid heat dissipation. Wider linewidths in the central area further from the pins result in lower resistance and less heating power, preventing heat buildup and hotspot formation. Ultimately, this differentiated linewidth design achieves uniform temperature distribution across the conductive heating area, effectively improving the heating stability and lifespan of the heating element.

[0084] In some embodiments, the heat dissipation area surrounds the conductive heating area and is seamlessly connected to it. The line width is set to 0.08~0.38mm, preferably 0.22mm, which can quickly dissipate excess heat generated by the conductive heating area, further assisting in optimizing the temperature field distribution and preventing local overheating from causing the heating element to age and fail. The positive and negative leads are fixed to the electrode pads at both ends of the heating mesh by welding. The electrode pads, conductive heating area, and heat dissipation area are integrated into a single structure, which ensures the continuity of current transmission and improves heat conduction efficiency, enabling the heating element to stably output heat during operation and meet the heating requirements of the atomized aerosol matrix of the atomizing component.

[0085] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0086] According to an embodiment of this application, an embodiment of a heating element for an atomizing component is also provided. The heating element includes a heating element made by the above-described design method, which is adapted to the assembly and heating requirements of the atomizing component.

[0087] The heating element of the atomizing component includes a heating element, a positive electrode pin, and a negative electrode pin. Both the positive and negative electrode pins are made of nickel material, preferably nickel-200 material. This material has excellent electrical conductivity, thermal conductivity, and mechanical stability, which can ensure efficient current transmission to the heating element and quickly dissipate some of the heat generated by the heating element, preventing heat accumulation at the connection between the pin and the heating element. At the same time, the good temperature resistance and corrosion resistance of this material can adapt to the temperature cycling and medium contact environment during long-term use of the atomizing component, extending the service life of the heating element.

[0088] The heating element has integrated electrode pads pre-set at both ends of its heating mesh. One end of each of the two leads is connected to one of the two electrode pads, preferably by welding. Welding creates a tight mechanical and electrical connection between the leads and the electrode pads, minimizing contact resistance and preventing problems such as concentrated localized heat and decreased conductivity caused by loose connections or poor contact. After welding, the other end of the lead extends away from the heating mesh to establish an electrical connection with the power supply interface of the atomizing component or an external power supply component, providing a stable operating voltage for the heating element.

[0089] The structural design of this heating element fully considers conductivity reliability, heat dissipation rationality, and assembly compatibility, ensuring the stability of current transmission and the efficiency of heat conduction. The precise docking of the pins and the electrode pads of the heating mesh allows the current to be evenly distributed to each independent area of ​​the conductive heating region through the electrode pads, ensuring that the heating element outputs heat stably according to the designed temperature field distribution. At the same time, the simple and compact structure can be adapted to the internal installation space of the atomizing assembly, making it easy to assemble with other components such as liquid guiding components and liquid storage components, providing support for the atomizing assembly to achieve efficient and uniform aerosol matrix heating.

[0090] According to an embodiment of this application, an embodiment of an atomizing component is provided, such as... Figure 7 As shown, the atomizing assembly includes a liquid guiding component 701 and a heating component 702. The two ends of the heating mesh are bent into a cylindrical shape, and the liquid guiding component is sleeved on the outside of the heating mesh. The atomizing assembly may also include a support, which can cover the liquid guiding component.

[0091] The atomizing assembly includes a liquid guiding component and the aforementioned heating component, which are nested together to form a core structure that works collaboratively. The heating element's heating mesh is made of a flexible, bendable material. During assembly, the two ends of the heating mesh are bent relative to each other, forming a cylindrical structure with its ends joined or nearly joined. The diameter of this cylindrical structure matches the fitting dimensions of the liquid guiding component, ensuring both structural compactness and maximizing the contact area between the heating mesh and the liquid guiding component.

[0092] The liquid-conducting component is made of porous adsorption material, preferably cotton core, ceramic fiber, or other materials with excellent liquid absorption and conduction properties. Its interior can adsorb and store aerosol matrix. The liquid-conducting component is cylindrical in shape, adapted to the cylindrical structure of the heating mesh. During assembly, the liquid-conducting component is fitted over the cylindrical heating mesh, ensuring a tight fit between the inner wall of the component and the outer wall of the heating mesh. This allows the heating mesh to directly heat the aerosol matrix adsorbed within the liquid-conducting component.

[0093] During operation, the liquid guide continuously delivers the aerosol matrix to the area in contact with the heating mesh through capillary action. When energized, the cylindrical heating mesh generates uniform heat, heating and atomizing the aerosol matrix on the liquid guide to form a stable aerosol. The advantages of this nested cylindrical structure are: firstly, the cylindrical structure of the heating mesh expands the heating area, allowing the aerosol matrix to be heated uniformly, improving atomization efficiency and taste consistency; secondly, the tight fit between the liquid guide and the heating mesh shortens the aerosol matrix's transmission path, preventing localized dry burning; and thirdly, the compact overall structure meets the miniaturization requirements of atomization components, facilitating assembly with other components such as the liquid reservoir and nozzle to form a complete atomization device.

[0094] According to an embodiment of this application, an embodiment of an atomizer is provided, including a liquid storage component and an atomizing component. The liquid storage component is used to store an aerosol matrix, and the atomizing component is located inside the liquid storage component and is used to heat the aerosol matrix.

[0095] The atomizer includes a liquid storage component and the aforementioned atomizing component, which are coaxially nested in an assembly structure. The atomizing component is entirely housed inside the liquid storage component, forming a compact and functionally coordinated overall structure.

[0096] The liquid storage component has a hollow cavity structure with a reserved liquid storage space inside for storing the aerosol matrix. The liquid storage component is preferably made of food-grade plastic or glass, which has excellent sealing and corrosion resistance, and can effectively prevent the aerosol matrix from leaking or deteriorating. A reasonable gap is left between the inner wall of the liquid storage component and the outer wall of the atomizing component, which not only ensures the stable assembly of the atomizing component, but also allows the aerosol matrix in the liquid storage component to be continuously delivered to the liquid guiding component of the atomizing component through capillary action or liquid guiding structure, so as to realize the on-demand supply of aerosol matrix.

[0097] As the core functional component of the atomizer, the atomizing component is fixedly installed in a preset assembly position inside the liquid storage component. It precisely connects with the liquid guide interface of the liquid storage component to ensure that the aerosol matrix can be stably transferred to the liquid guide component. When the atomizer is working, after the heating element of the atomizing component is powered on, the heating mesh generates uniform heat to heat and atomize the aerosol matrix adsorbed in the liquid guide component to form an aerosol. At the same time, the liquid storage component can balance the internal air pressure through its own sealing structure and ventilation channel design to ensure a stable supply of aerosol matrix and smooth discharge of aerosol.

[0098] The atomizer's structural design fully integrates liquid storage and atomization functions. The large-capacity liquid storage component meets the needs of long-term use, while the efficient heating structure of the atomization component ensures the stable generation of aerosols. The synergistic cooperation between the two gives the atomizer the advantages of convenient use and stable atomization effect, providing users with a continuous and consistent user experience.

[0099] According to an embodiment of this application, an aerosol generating device is provided, including a power supply component and an atomizer. The power supply component supplies power to the atomizer component. The aerosol generating device includes the power supply component and the aforementioned atomizer, both of which are detachable assembly structures. They are precisely connected via an electrical interface, facilitating user replacement, cleaning, or maintenance of the atomizer.

[0100] The power supply component, serving as the energy source for the entire device, integrates components such as a battery, main control circuit board, charging module, and switching elements. The battery is preferably a high-capacity rechargeable lithium battery, capable of providing a stable and continuous operating voltage for the atomizer. The main control circuit board integrates control modules such as voltage regulation and temperature control, which can automatically adjust the output power according to the atomizer's operating requirements. It also features overcurrent, overtemperature, and short-circuit protection functions to ensure the safety and stability of the device. The outer wall of the power supply component is equipped with an operation switch and a power indicator light, allowing users to easily control the device's start and stop and check the remaining power.

[0101] The atomizer is connected to the power supply component through a preset electrical interface. After connection, the power supply component can deliver a stable current to the atomization component of the atomizer, drive the heating mesh of the heating element to generate heat, and then heat and atomize the aerosol matrix in the liquid guiding component to form an aerosol that can be inhaled by the user.

[0102] The structural design of this aerosol generating device enables efficient coordination between power supply and atomization functions. The intelligent control characteristics of the power supply components can adapt to the heating requirements under different working conditions, ensuring the consistency of atomization effect. The detachable assembly structure enhances the flexibility of the device and meets the diverse needs of users. The overall structure is compact and portable, making it suitable for use in everyday scenarios.

[0103] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0104] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments claimed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0105] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0106] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0107] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for designing a heating element, characterized in that, include: Based on the structural parameters of the heating element, a three-dimensional model of the heating element is constructed; After importing the three-dimensional model into the simulation software, the simulation resistance and temperature field distribution of the three-dimensional model are determined according to the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equation of the current field and the solid heat transfer field. If the simulated resistance and temperature field distribution of the three-dimensional model meet the corresponding design conditions, then the structural parameters of the heating element are determined to meet the design requirements.

2. The method according to claim 1, characterized in that, The method further includes: If at least one of the simulated resistance and temperature field distribution in the three-dimensional model does not meet the corresponding design conditions, it is determined that the structural parameters of the heating element do not meet the design requirements. If the structural parameters of the heating element do not meet the design requirements, adjust the structural parameters of the heating element and rebuild a new three-dimensional model based on the new structural parameters until it is determined that the new structural parameters of the heating element meet the design requirements.

3. The method according to claim 1, characterized in that, The structural parameters of the heating element include its composition, dimensions, and area division parameters. The structure includes a positive electrode pin, a negative electrode pin, and a heating mesh. The heating mesh integrates electrode pads, conductive heating areas, and heat dissipation areas, and the heating mesh is arranged symmetrically in the top, bottom, left, and right directions. The region division parameter is that the conductive heating region is divided into multiple continuous independent regions along the length direction. The width of the conductive heating wire in each independent region is the same, and the width of the conductive heating wire in different independent regions is gradually set along the direction away from the pin.

4. The method according to claim 1, characterized in that, The method further includes: The simulation software calls the preset physical characteristic parameters of the heating element, including density, constant pressure heat capacity, thermal conductivity and electrical conductivity. The preset boundary conditions are loaded in the simulation software. The boundary conditions include electrical boundary conditions and thermal boundary conditions. The electrical boundary conditions are to set the negative terminal of the heating element to ground, set the positive terminal of the heating element to a terminal when calculating the resistance, and set the positive terminal to a voltage when calculating the temperature. The thermal boundary conditions are to add convective heat flux conditions and set the corresponding heat transfer coefficient. The coupling function between the current field and the solid heat transfer field is enabled in the multiphysics module of the simulation software to construct the coupling control equation. The coupling control equation is used to characterize the interaction between the Joule heat generated by the current field as a heat source participating in the calculation of the solid heat transfer field and the feedback effect of temperature change on the current field parameters.

5. The method according to claim 4, characterized in that, The step of determining the simulation resistance and temperature field distribution of the three-dimensional model based on the preset physical characteristic parameters and boundary conditions in the simulation software, as well as the coupling control equations of the current field and the solid heat transfer field, includes: Based on the current field control equation, the electric boundary conditions, and the conductivity, the distribution law of the current in the three-dimensional model is solved, and the simulated resistance of the heating element is calculated. The current field control equation is used to characterize the correlation between the current density vector and the material conductivity. Based on the solid heat transfer control equation, the thermal boundary condition, the density, the constant pressure heat capacity, and the thermal conductivity, the Joule heat generated by the current field is used as the heat source input, wherein the solid heat transfer control equation is used to characterize the conduction law of heat inside the solid. By combining the aforementioned coupled control equations, the interaction between the current field and the solid heat transfer field is established, so that temperature changes affect the conductivity of the heating element, thereby correcting the current distribution and the amount of Joule heat generated. The coupling solution of the current field and the solid heat transfer field is achieved through iterative calculation, and the simulation resistance value and temperature field distribution of the three-dimensional model are finally output.

6. The method according to any one of claims 1 to 5, characterized in that, Adjusting the structural parameters of the heating element includes: Adjust the conductive heating line width parameter of the conductive heating area of ​​the heating mesh in the heating element; The adjustment method for the conductive heating linewidth parameter is to change the value of the baseline linewidth or the value of the linewidth gradient difference, while keeping the linewidth gradient relationship of each independent region of the conductive heating region unchanged.

7. The method according to any one of claims 1 to 5, characterized in that, The line width of the heat dissipation area of ​​the heating mesh in the heating element is 0.08 mm to 0.38 mm; The heating mesh is made of iron-chromium-aluminum alloy, nickel-chromium alloy, or stainless steel alloy, and its thickness is 0.05 mm to 0.12 mm; the diameter of the positive and negative leads of the heating mesh is 0.25 mm to 0.8 mm.

8. The method according to claim 3, characterized in that, Electrode pads are respectively provided at the edges of both ends of the heating mesh; The positive electrode pin and the negative electrode pin are respectively connected to the electrode pads at both ends of the heating mesh; The heat dissipation area is distributed on the outer edge of the conductive heating area and is integrally connected to the conductive heating area of ​​the heating mesh.

9. The method according to claim 3 or 8, characterized in that, The connection relationships of the components of the heating element include: The positive electrode pin and the negative electrode pin are respectively fixed to the electrode pads of the heating mesh by welding. The electrode pads, the conductive heating area, and the heat dissipation area are an integrated structure of the heating mesh. The conductive heating area is located in the middle area of ​​the heating mesh, and the heat dissipation area surrounds the outer periphery of the conductive heating area and is connected to the electrode pads.

10. The method according to claim 3 or 8, characterized in that, When the conductive heating area is divided into five consecutive independent regions along its length, the five consecutive independent regions are, from left to right, the first region, the second region, the third region, the fourth region, and the fifth region. The conductive heating line width of the fourth region is the baseline line width. The conductive heating line widths of the third and fifth regions are both the baseline line width minus the line width gradient difference. The conductive heating line width of the first region is the baseline line width minus three times the line width gradient difference. The conductive heating line width of the second region is the baseline line width minus four times the line width gradient difference.

11. The method according to claim 10, characterized in that, The baseline width ranges from 0.05 mm to 0.32 mm, and the line width gradient difference ranges from 0.005 mm to 0.04 mm.

12. A heating element, characterized in that, Designed using the method described in any one of claims 1 to 11, the heating element includes a positive electrode pin, a negative electrode pin, and a heating mesh. The heating mesh is provided with a conductive heating area and a heat dissipation area. The conductive heating area is divided into multiple continuous independent areas along the length direction. The width of the conductive heating wire in each independent area is consistent, and the width of the conductive heating wire in different independent areas is gradually set away from the pin.

13. A heating element for an atomizing assembly, characterized in that, Includes the heating element as described in claim 12.

14. An atomizing component, characterized in that, It includes a liquid guiding component and a heating component as described in claim 13, wherein the two ends of the heating mesh are bent into a cylindrical shape and the liquid guiding component is sleeved on the outside of the heating mesh.

15. An atomizer, characterized in that, It includes a liquid storage component and an atomizing component as described in claim 14, wherein the liquid storage component is used to store an aerosol matrix, the atomizing component is located inside the liquid storage component, and the atomizing component is used to heat the aerosol matrix.

16. An aerosol generating apparatus, characterized in that, It includes a power supply component and the atomizer as described in claim 15, wherein the power supply component is used to supply power to the atomizer component.

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