Heat dissipation device

Abstract

The invention provides a heat dissipation device which comprises a uniform temperature plate and a phase change energy storage module which are connected in parallel and used for reducing the temperature of a heat source. According to the heat dissipation module in the embodiment, the uniform temperature plate and the phase change energy storage module are connected in parallel, and compared with a series connection structure between the uniform temperature plate and the phase change energy storage module in an existing heat dissipation device, the heat resistance of the heat dissipation device is obviously reduced, so that the problem that the heat conductivity coefficient of the existing heat dissipation device is limited is effectively solved, and the heat dissipation performance is improved.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to a heat dissipation device. Background Technology

[0002] High-power electronic devices, such as antenna devices, generally have the problems of high heat flux density and high heat dissipation risk.

[0003] In related technologies, heat dissipation is achieved using an integrated energy storage vapor chamber module. The heat-generating chip first conducts heat to the vapor chamber through a thermal pad, and the heat from the vapor chamber is then conducted to the phase change energy storage module. Finally, the heat is dissipated to the external environment through a heat dissipation substrate. However, existing integrated energy storage vapor chamber modules have low thermal conductivity. When heat flows through the integrated energy storage vapor chamber module, it will cause a certain temperature rise due to the high thermal resistance, which is not conducive to heat dissipation of high heat-consuming chips. Summary of the Invention

[0004] In the heat dissipation device provided by the present invention, the heat spreader and the phase change energy storage module are connected in parallel. Compared with the series structure between the heat spreader and the phase change energy storage module in the existing heat dissipation device, the thermal resistance of the heat dissipation device is significantly reduced, thereby effectively solving the problem of limited thermal conductivity in the existing heat dissipation device and improving heat dissipation performance.

[0005] In a first aspect, the present invention provides a heat dissipation device, comprising: The parallel-connected heat spreader and phase change energy storage module are used to reduce the temperature of the heat source.

[0006] According to a heat dissipation device provided by the present invention, the phase change energy storage module is nested inside the heat exchange plate.

[0007] According to a heat dissipation device provided by the present invention, the phase change energy storage module is nested inside the heat exchange plate by welding or bonding.

[0008] According to a heat dissipation device provided by the present invention, the phase change energy storage module is nested inside the heat exchange plate, comprising: One end of the phase change energy storage module is connected to the upper cover plate of the temperature equalization plate, and the other end of the phase change energy storage module is connected to the lower cover plate of the temperature equalization plate.

[0009] According to a heat dissipation device provided by the present invention, the phase change energy storage module includes a plurality of phase change energy storage units; the plurality of phase change energy storage units are nested inside the heat exchange plate based on a preset spacing.

[0010] According to a heat dissipation device provided by the present invention, the phase change energy storage module is fixed to the side of the heat exchange plate.

[0011] According to a heat dissipation device provided by the present invention, the phase change energy storage module is fixed to the side of the heat exchange plate by welding, bonding or screw fastening.

[0012] According to a heat dissipation device provided by the present invention, the thermal resistance of the heat dissipation device is determined based on the thermal resistance of the heat spreader and the thermal resistance of the phase change energy storage module; the thermal conductivity of the heat dissipation device is inversely proportional to the thermal resistance of the heat dissipation device.

[0013] According to the present invention, the thermal resistance of a heat dissipation device is determined based on the following method: R = R1R2 / (R1+R2); Where R represents the thermal resistance of the heat dissipation device; R1 represents the thermal resistance of the phase change energy storage module; and R2 represents the thermal resistance of the heat spreader.

[0014] In a second aspect, the present invention also provides an antenna, including the heat dissipation device as described in the first aspect.

[0015] Thirdly, the present invention also provides a terminal including the heat dissipation device as described in the first aspect.

[0016] Fourthly, the present invention also provides a network-side device, including the heat dissipation device as described in the first aspect.

[0017] In the heat dissipation device provided by the present invention, the heat spreader and the phase change energy storage module are connected in parallel. Compared with the series structure between the heat spreader and the phase change energy storage module in the existing heat dissipation device, the thermal resistance of the heat dissipation device is significantly reduced, thereby effectively solving the problem of limited thermal conductivity in the existing heat dissipation device and improving heat dissipation performance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of an existing heat dissipation device provided by the present invention.

[0020] Figure 2 This is one of the schematic diagrams of the heat dissipation device provided by the present invention.

[0021] Figure 3 This is the second schematic diagram of the heat dissipation device provided by the present invention.

[0022] Figure 4 This is the third schematic diagram of the heat dissipation device provided by the present invention.

[0023] Figure 5 This is the fourth schematic diagram of the heat dissipation device provided by the present invention.

[0024] Figure 6 This is a schematic diagram of the heat dissipation effect provided by the present invention. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0026] The following is combined Figures 1-6 The heat dissipation device of the present invention is described.

[0027] To facilitate a clearer understanding of the technical solutions of the various embodiments of this application, some technical content related to the various embodiments of this application will be introduced first.

[0028] High-power electronic devices, such as antenna devices, generally suffer from high heat flux density and high heat dissipation risk. Traditional heat dissipation bumps utilize the thermal conductivity of the metal material itself for heat conduction. However, in cases of high heat dissipation of a single chip, the thermal conductivity of the heat dissipation bumps is limited, resulting in the chip's heat dissipation performance falling short of expectations. Compared to traditional heat dissipation bumps, integrated energy storage vapor chamber modules have two major advantages: (1) Due to the two-phase change heat transfer effect of the refrigerant inside the vapor chamber, it has a stronger temperature uniformity, which can effectively improve the heat dissipation performance of the equipment. (2) The phase change material inside the phase change energy storage module can store heat, playing a role in reducing transient temperature peaks. In summary, integrated energy storage vapor chamber modules can improve heat dissipation performance as much as possible while ensuring reliable quality.

[0029] In existing heat dissipation solutions, the phase change energy storage module and the vapor chamber are designed relatively independently, and the two are combined by welding and bonding. However, since the thermal conductivity of the phase change material inside the phase change energy storage module is only 0.5W / mK, the heat flow through the phase change energy storage module will cause a certain temperature rise due to the large thermal resistance, which is not conducive to the heat dissipation of high heat-consuming chips.

[0030] For example, such as Figure 1As shown, in existing heat dissipation devices, the heat-generating chip first conducts heat to the vapor chamber through a thermal pad. The vapor chamber then transfers heat in a planar direction, and the heat is further conducted to the phase change energy storage module for collection and storage. Finally, the heat is dissipated to the external environment through a heat dissipation substrate. The phase change energy storage module and the vapor chamber can be welded, glued, or screwed together. The vapor chamber has a lateral thermal conductivity of approximately 10000 W / mK and a longitudinal thermal conductivity of approximately 1000 W / mK. The thermal conductivity of the phase change material inside the phase change energy storage module is approximately 0.5 W / mK. Considering the additional metal rib structure inside the phase change energy storage module, the overall thermal conductivity of the phase change energy storage module is approximately 50 W / mK. The thermal resistance of the vapor chamber is R1, and the thermal resistance of the phase change energy storage module is R2. The vapor chamber and the phase change energy storage module are connected in series in the thermal path. Therefore, the thermal resistance of the integrated vapor chamber module is R = R1 + R2. From this, the overall thermal conductivity of the integrated vapor chamber module is calculated to be around 50 W / mK. Currently, some researchers are trying to improve the thermal conductivity of phase change materials to address the low thermal conductivity of phase change energy storage modules, but the effect is very limited and cannot completely solve the problem.

[0031] The heat dissipation device in this embodiment includes a heat spreader and a phase change energy storage module connected in parallel, used to reduce the temperature of the heat source.

[0032] Specifically, in related technologies, the vapor chamber and phase change energy storage module within the heat dissipation device are connected in series. This means the heat source first conducts heat to the vapor chamber through a thermal pad, the vapor chamber then conducts the heat to the phase change energy storage module, and finally the heat is dissipated to the external environment through the heat dissipation substrate. It should be noted that this series connection between the vapor chamber and the phase change energy storage module presents the following problems: First, because the phase change material inside the phase change energy storage module has a high thermal resistance and low thermal conductivity, heat flow through the module will cause a temperature rise due to the high thermal resistance, which is detrimental to the heat dissipation of high-heat-dissipation chips. Secondly, because the heat dissipation device and the phase change energy storage module are connected in series, the thermal resistance of the heat dissipation device is the sum of the thermal resistance of the heat dissipation device and the thermal resistance of the phase change energy storage module, i.e., the thermal resistance of the heat dissipation device is R = R1 + R2. This makes the thermal resistance of the heat dissipation device higher than that of the phase change energy storage module, which is not conducive to the heat dissipation of high heat-consuming chips. Here, R is the thermal resistance of the heat dissipation device, R1 is the thermal resistance of the heat dissipation device, and R2 is the thermal resistance of the phase change energy storage module. In other words, in the existing technology, due to the limitation of the thermal conductivity of the phase change material inside the phase change energy storage module by the material itself and the series structure between the heat dissipation device and the phase change energy storage module, the thermal resistance of the heat dissipation device is relatively large, and it is difficult to significantly improve the thermal conductivity, thus failing to utilize the heat dissipation of high heat-consuming chips.

[0033] To address the aforementioned issues, in this embodiment, the vapor chamber and phase change energy storage module in the heat dissipation device are connected in parallel, meaning the phase change energy storage module and the vapor chamber are connected in parallel along the heat flow path. Compared to the series structure of the vapor chamber and phase change energy storage module in existing heat dissipation devices, where the thermal resistance R = R1 + R2, the thermal resistance of the heat dissipation device composed of the parallel connection of the vapor chamber and phase change energy storage module in this application is significantly reduced. This effectively solves the problem of limited thermal conductivity in existing heat dissipation devices and improves their overall heat dissipation performance. Optionally, the parallel structure between the vapor chamber and phase change energy storage module in the heat dissipation device can be implemented in various ways. For example, the vapor chamber and phase change energy storage module can be nested in the heat dissipation device to achieve parallel connection, or other methods can be used to achieve parallel connection. This embodiment does not impose specific limitations. Optionally, the heat source in this application embodiment can be a heat-generating electronic device, such as a central processing unit (CPU), or other types of heat sources. No specific limitations are made in this application embodiment.

[0034] In the heat dissipation device of the above embodiment, the heat spreader and the phase change energy storage module are connected in parallel. Compared with the series structure between the heat spreader and the phase change energy storage module in the existing heat dissipation device, the thermal resistance of the heat dissipation device is significantly reduced, thereby effectively solving the problem of limited thermal conductivity in the existing heat dissipation device and improving heat dissipation performance.

[0035] In some embodiments, the phase change energy storage module is nested inside the heat exchanger.

[0036] Specifically, in this embodiment, the phase change energy storage module in the heat dissipation device is nested inside the vapor chamber. That is, the phase change energy storage module and the vapor chamber are connected in parallel along the heat flow path. Compared to the existing heat dissipation devices where the phase change energy storage module and the vapor chamber are connected in series, the heat dissipation device of this application has lower thermal resistance and higher thermal conductivity. This effectively solves the problem of limited thermal conductivity in existing heat dissipation devices and improves its overall heat dissipation performance. In other words, the vapor chamber and phase change energy storage module in this heat dissipation device have a nested structure, which on the one hand provides storage function for short-term high heat dissipation, and on the other hand solves the problem of high thermal resistance in the heat dissipation device, thus improving the overall heat dissipation capacity of the heat dissipation module.

[0037] Furthermore, in existing technologies, the phase change energy storage module and the vapor chamber in the heat dissipation device are connected in series, and the vapor chamber is hollow, filled with a certain proportion of refrigerant. When the area is large, the strength of the vapor chamber is relatively weak, and there is a risk of deformation under pressure. In this application, the heat dissipation module is composed of a vapor chamber and a phase change energy storage module connected in parallel. The phase change energy storage module is nested inside the vapor chamber. Considering that there are also some metal rib structures inside the phase change energy storage module, the overall strength of the vapor chamber can be effectively enhanced, improving the problem of easy deformation of the heat dissipation device and the vapor chamber under pressure, and greatly improving the pressure resistance of the heat dissipation device.

[0038] In the heat dissipation device of the above embodiment, a heat dissipation module is formed by a parallel-connected heat spreader and a phase change energy storage module, that is, a nested structure design is adopted, in which the phase change energy storage module is nested inside the heat spreader. Compared with the existing heat dissipation device where the heat spreader and the phase change energy storage module are connected in series, the heat dissipation device of this application has a smaller thermal resistance and an increased thermal conductivity, thereby effectively solving the problem of limited thermal conductivity of the heat dissipation device and improving the overall heat dissipation capacity of the heat dissipation module. Moreover, by forming a heat dissipation module by a parallel-connected heat spreader and a phase change energy storage module, and by nesting the phase change energy storage module inside the heat spreader, the overall strength of the heat spreader can also be effectively enhanced, improving the problem of easy deformation of the heat dissipation device and the heat spreader under pressure, and greatly improving the pressure resistance of the heat dissipation device.

[0039] In some embodiments, the phase change energy storage module is nested inside the heat exchanger plate by welding or bonding.

[0040] Specifically, in this embodiment, the phase change energy storage module can be nested inside the vapor chamber by welding or bonding, thus allowing for flexible and diverse parallel architectures between the phase change energy storage module and the vapor chamber in the heat dissipation device. It should be noted that, in this embodiment, using welding or bonding to nest the phase change energy storage module inside the vapor chamber provides better sealing compared to screw fastening, thereby more effectively improving the heat dissipation performance of the heat dissipation device.

[0041] The heat dissipation device in the above embodiments nests the phase change energy storage module inside the heat spreader using welding or bonding methods, offering flexible implementation options. Furthermore, compared to screw-fastening methods for nesting the phase change energy storage module and the heat spreader, it provides better sealing and superior heat dissipation performance.

[0042] In some embodiments, the phase change energy storage module is nested inside the heat exchanger, including: One end of the phase change energy storage module is connected to the upper cover of the heat spreader, and the other end of the phase change energy storage module is connected to the lower cover of the heat spreader.

[0043] Specifically, in this embodiment, one end of the phase change energy storage module is connected to the upper cover of the vapor chamber, and the other end is connected to the lower cover of the vapor chamber. This achieves parallel connection of the phase change energy storage module and the vapor chamber in the heat dissipation device, significantly reducing the thermal resistance of the heat dissipation device. This maximizes the volume and energy storage effect of the phase change energy storage module, solves the problem of limited thermal conductivity in existing heat dissipation devices, improves heat dissipation performance, and reduces the transient high temperature of the heat source. On the other hand, with one end of the phase change energy storage module connected to the upper cover of the vapor chamber and the other end connected to the lower cover of the vapor chamber, the heat dissipation device, supported by the internal phase change energy storage module, can solve the problem of easy deformation of the heat dissipation device and the vapor chamber under pressure. This maximizes the strength of the heat dissipation module and the vapor chamber, improving their compressive strength. Optionally, the phase change energy storage module and the heat spreader can be connected by welding or bonding to achieve parallel connection of the phase change energy storage module and the heat spreader in the heat dissipation device. Other connection methods are also possible, and no specific limitations are imposed in the embodiments of this application.

[0044] In the heat dissipation device of the above embodiment, one end of the phase change energy storage module is connected to the upper cover plate of the heat spreader, and the other end of the phase change energy storage module is connected to the lower cover plate of the heat spreader. This not only maximizes the energy storage capacity of the phase change energy storage module and reduces the transient high temperature of the chip, but also maximizes the strength of the heat dissipation module and the heat spreader, and improves the pressure resistance of the heat dissipation device and the heat spreader.

[0045] In some embodiments, the phase change energy storage module includes multiple phase change energy storage units; the multiple phase change energy storage units are nested inside the heat exchange plate based on a preset spacing.

[0046] Specifically, if only a single large phase change energy storage module is nested within the vapor chamber, although it's possible to achieve parallel connection between the vapor chamber and the phase change energy storage module in the heat dissipation device, reducing the thermal resistance of the heat dissipation device, this method will significantly affect the flow of liquid within the vapor chamber, thereby impacting the heat dissipation efficiency of both the vapor chamber and the heat dissipation device. To address the above issues, such as... Figure 2 and Figure 3 As shown, the phase change energy storage module in this embodiment includes multiple phase change energy storage units, and the multiple phase change energy storage units are nested inside the heat exchange plate based on a preset spacing. This not only minimizes the impact on the liquid flow in the heat exchange plate, but also evenly distributes the external pressure, effectively improving the heat dissipation performance and pressure resistance of the heat dissipation module.

[0047] In the heat dissipation device of the above embodiment, the phase change energy storage module includes multiple phase change energy storage units, which can not only minimize the impact on the liquid flow in the heat spreader, but also evenly distribute the external pressure, effectively improving the heat dissipation performance and pressure resistance of the heat dissipation module.

[0048] In some embodiments, the phase change energy storage module is fixed to the side of the heat exchanger.

[0049] Specifically, such as Figure 4 and Figure 5 As shown in the embodiment of this application, by fixing the phase change energy storage module to the side of the heat exchange plate, the heat exchange plate and the phase change energy storage module can also be connected in parallel in the heat dissipation device, thereby realizing the parallel connection of the phase change energy storage module and the heat exchange plate in the heat flow path. Compared with the existing heat dissipation device in which the phase change energy storage module and the heat exchange plate are connected in series, the heat dissipation device of this application has a smaller thermal resistance and an increased thermal conductivity, which can effectively solve the problem of limited thermal conductivity of the existing heat dissipation device and improve its overall heat dissipation performance.

[0050] It should also be noted that fixing the phase change energy storage module to the side of the vapor chamber is more convenient and easier to implement than nesting it inside the vapor chamber. Nesting the phase change energy storage module inside the vapor chamber, compared to fixing it to the side, effectively reduces the size of the heat dissipation device. In scenarios with limited space or where size is a concern, nesting the phase change energy storage module inside the vapor chamber is a viable option for heat dissipation. In other words, this application provides several different methods for parallel connection of the phase change energy storage module and the vapor chamber in the heat dissipation device. The phase change energy storage module can be nested inside the vapor chamber or fixed to the side of the vapor chamber, allowing users to choose different methods for heat dissipation based on their specific needs.

[0051] Optionally, phase change energy storage modules can be fixed on all four sides of the heat exchanger, thereby realizing the parallel connection of the heat exchanger and the phase change energy storage modules in the heat dissipation device. Alternatively, the phase change energy storage module can be fixed on only one side of the heat exchanger. This allows for a variety of flexible methods to achieve the parallel connection structure of the phase change energy storage module and the heat exchanger in the heat dissipation device, solving the problem of high thermal resistance in existing heat dissipation devices, realizing the storage function of high heat dissipation in a short time, and improving the overall heat dissipation capacity of the heat dissipation module.

[0052] In the heat dissipation device of the above embodiment, the phase change energy storage module is fixed on the side of the heat spreader. Compared with the series architecture in the existing heat dissipation device, the thermal resistance of the heat dissipation device is reduced and the thermal conductivity is increased, which effectively solves the problem of limited thermal conductivity and improves heat dissipation performance. Compared with nesting the phase change energy storage module inside the heat spreader, the operation is more convenient and easier to implement. Moreover, the phase change energy storage module can be fixed on any one or more sides of the heat spreader, making the implementation more flexible and diverse.

[0053] In some embodiments, the phase change energy storage module is fixed to the side of the heat exchanger by welding, bonding or screw fastening.

[0054] Specifically, in this embodiment, when the phase change energy storage module is fixed to the side of the heat spreader, the phase change energy storage module and the heat spreader are independent. Only individual sealing of the phase change energy storage module and the heat spreader is required. The sealing requirements at the joint between the phase change energy storage module and the heat spreader are not high. Therefore, various methods can be used to fix the phase change energy storage module to the side of the heat spreader, which is easier to implement than nesting the energy storage module inside the heat spreader. Optionally, in this embodiment, the phase change energy storage module can be fixed to the side of the heat spreader by bonding, welding, or screw fastening, providing more flexible and diverse implementation methods.

[0055] In some embodiments, the thermal resistance of the heat dissipation device is determined based on the thermal resistance of the heat spreader and the thermal resistance of the phase change energy storage module; the thermal conductivity of the heat dissipation device is inversely proportional to the thermal resistance of the heat dissipation device.

[0056] Specifically, in this embodiment, the phase change energy storage module and the vapor chamber are connected in parallel within the heat dissipation device. That is, the phase change energy storage module and the vapor chamber are connected in parallel along the heat flow path. Therefore, the thermal resistance of the heat dissipation device can be determined based on the thermal resistance of the vapor chamber and the thermal resistance of the parallel-connected phase change energy storage module. Compared to the series-connected architecture in existing heat dissipation devices, the thermal resistance of the heat dissipation device in this application is reduced. Furthermore, since the thermal conductivity of the heat dissipation device is inversely proportional to its thermal resistance, the thermal conductivity of the heat dissipation device is increased. This effectively solves the problem of limited thermal conductivity in existing heat dissipation devices and improves the overall heat dissipation performance of the heat dissipation module.

[0057] In some embodiments, the thermal resistance of the heat dissipation device is determined based on the following: R = R1R2 / (R1+R2); Where R represents the thermal resistance of the heat dissipation device; R1 represents the thermal resistance of the phase change energy storage module; and R2 represents the thermal resistance of the heat spreader.

[0058] Specifically, in existing heat dissipation devices, the lateral thermal conductivity of the vapor chamber is around 10000 W / mK, and the longitudinal thermal conductivity is around 1000 W / mK. The thermal conductivity of the phase change material inside the phase change energy storage module is around 0.5 W / mK. Considering the additional metal rib structure inside the phase change energy storage module, the overall thermal conductivity of the phase change energy storage module is around 50 W / mK. The thermal resistance of the vapor chamber is R1, and the thermal resistance of the phase change energy storage module is R2. Since the vapor chamber and the phase change energy storage module are connected in series in the thermal path, the thermal resistance of the integrated vapor chamber module is R = R1 + R2. Therefore, the overall thermal conductivity of the integrated vapor chamber module is calculated to be around 50 W / mK. Because the thermal conductivity of the phase change material inside the phase change energy storage module is limited by the material itself, it is difficult to significantly improve the thermal conductivity of the integrated vapor chamber module.

[0059] In this embodiment, the phase change energy storage module and the vapor chamber are connected in parallel within the heat dissipation device. The phase change energy storage module is nested inside the vapor chamber or fixed to the side of the vapor chamber. The phase change energy storage module and the vapor chamber are connected in parallel along the heat flow path. Therefore, the thermal resistance of the heat dissipation module is R = R1R2 / (R1+R2), where R represents the thermal resistance of the heat dissipation device; R1 represents the thermal resistance of the phase change energy storage module; and R2 represents the thermal resistance of the vapor chamber. The calculated overall thermal conductivity of the energy storage VC module reaches 1000 W / mK, which is 20 times higher than that of existing heat dissipation devices. This effectively solves the problem of limited thermal conductivity in existing heat dissipation devices and improves the overall heat dissipation performance of the heat dissipation module.

[0060] In the heat dissipation device of the above embodiment, the phase change energy storage module and the heat spreader are connected in parallel. The phase change energy storage module is nested inside the heat spreader or fixed to the side of the heat spreader. That is, the phase change energy storage module and the heat spreader are connected in parallel in the heat flow path. Compared with the series architecture in the existing heat dissipation device, the thermal resistance of the heat dissipation device is reduced and the thermal conductivity is increased, thereby effectively solving the problem of limited thermal conductivity in the existing heat dissipation device and improving the overall heat dissipation performance of the heat dissipation module.

[0061] For example, the temperature cloud map of the heat dissipation module is as follows: Figure 6As shown, the heat dissipation module achieves uniform temperature control and heat storage of the heat source, reducing its temperature by more than 5 degrees Celsius. Specifically, in this application, the phase change energy storage module and the vapor chamber are connected in parallel within the heat dissipation device. The phase change energy storage module is nested inside the vapor chamber or fixed to its side. Heat from the chip is absorbed, evaporated, and diffused into the inner cavity through the working fluid inside the vapor chamber, achieving uniform temperature control and heat conduction. Heat is released at the condensation end, and the phase change working fluid circulates back through a capillary wick to achieve a steady-state cycle. Nesting the phase change energy storage module inside the vapor chamber or fixing it to its side increases the thermal conductivity of the heat dissipation module, thereby reducing the chip's transient high temperature. Utilizing the heat absorption and release process of the internal phase change material, a large amount of energy is converted within a very small temperature change range, improving the heat dissipation performance of the heat dissipation module.

[0062] Optionally, this application embodiment also provides an antenna, which includes a heat dissipation device in which the phase change energy storage module is nested inside the heat spreader or the phase change energy storage module is fixed to the side of the heat spreader, which can effectively reduce transient high temperature and improve heat dissipation performance.

[0063] Optionally, this application embodiment also provides a terminal, which includes a heat dissipation device in which the phase change energy storage module is nested inside the heat spreader or the phase change energy storage module is fixed to the side of the heat spreader, which can effectively reduce transient high temperature and improve heat dissipation performance.

[0064] Optionally, this application embodiment also provides a network-side device, which includes a heat dissipation device in which the phase change energy storage module is nested inside the heat spreader or the phase change energy storage module is fixed to the side of the heat spreader, which can effectively reduce transient high temperature and improve heat dissipation performance.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation device, characterized in that, include: The parallel-connected heat spreader and phase change energy storage module are used to reduce the temperature of the heat source.

2. The heat dissipation device according to claim 1, characterized in that, The phase change energy storage module is nested inside the temperature distribution plate.

3. The heat dissipation device according to claim 2, characterized in that, The phase change energy storage module is nested inside the heat exchange plate by welding or bonding.

4. The heat dissipation device according to claim 2, characterized in that, The phase change energy storage module is nested inside the temperature distribution plate and includes: One end of the phase change energy storage module is connected to the upper cover plate of the temperature equalization plate, and the other end of the phase change energy storage module is connected to the lower cover plate of the temperature equalization plate.

5. The heat dissipation device according to claim 2, characterized in that, The phase change energy storage module includes multiple phase change energy storage units; the multiple phase change energy storage units are nested inside the temperature distribution plate based on a preset spacing.

6. The heat dissipation device according to claim 1, characterized in that, The phase change energy storage module is fixed to the side of the temperature distribution plate.

7. The heat dissipation device according to claim 6, characterized in that, The phase change energy storage module is fixed to the side of the heat exchange plate by welding, bonding or screw fastening.

8. The heat dissipation device according to any one of claims 1-7, characterized in that, The thermal resistance of the heat dissipation device is determined based on the thermal resistance of the heat spreader and the thermal resistance of the phase change energy storage module; the thermal conductivity of the heat dissipation device is inversely proportional to the thermal resistance of the heat dissipation device.

9. The heat dissipation device according to any one of claims 1-7, characterized in that, The thermal resistance of the heat dissipation device is determined based on the following method: R = R1R2 / (R1+R2); Where R represents the thermal resistance of the heat dissipation device; R1 represents the thermal resistance of the phase change energy storage module; and R2 represents the thermal resistance of the heat spreader.

10. An antenna, characterized in that, The antenna includes a heat dissipation device as described in any one of claims 1-9.

11. A terminal, characterized in that, The terminal includes a heat dissipation device as described in any one of claims 1-9.

12. A network-side device, characterized in that, The network-side device includes the heat dissipation device as described in any one of claims 1-9.

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