Heat dissipation structure, inverter, control method, device, equipment, medium and product

Abstract

The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure, an inverter, a control method, a device, equipment, a medium and a product, and the structure comprises a substrate, fins, a fan and a flow guide part; the fins are arranged on the substrate and used for dissipating heat of heat source devices, corresponding to the fins, on the substrate. The draught fan is arranged between the fins, the air outlet face of the draught fan is arranged between a datum plane and the tops of the fins, and the datum plane is the face, connected with the fins, of the base plate; the flow guide component is arranged between the fins, the connecting end of the flow guide component is connected to the base plate, the adjusting end of the flow guide component is arranged between the reference surface and the air outlet surface, and the flow guide component is divided into a first flow guide surface and a second flow guide surface by the adjusting end of the flow guide component; through the draught fan, the flow guide component, the first flow guide face and the second flow guide face, outlet air of the draught fan is guided, the speed of air flowing through the cooling fins is increased, and air distribution can be controlled.

Description

Technical Field

[0001] This invention relates to the fields of heat dissipation structure, inverter, and control technology, and particularly to a heat dissipation structure, inverter, control method, device, equipment, medium, and product. Background Technology

[0002] Inverters are crucial components in photovoltaic power generation systems, including high-heat-generating heat source devices. To ensure inverter reliability, heat dissipation structures such as fins are needed to cool these heat source devices. A technical challenge in this field is the relatively small airflow through the heat dissipation fins. Summary of the Invention

[0003] This invention provides a heat dissipation structure, inverter, control method, device, equipment, medium, and product, which solves the technical problem of insufficient airflow through the heat dissipation fins.

[0004] In a first aspect, the present invention provides a heat dissipation structure, comprising: a substrate, fins, a fan, and a flow guiding component; the fins are disposed on the substrate for dissipating heat from heat source devices on the substrate corresponding to the fins; the fan is disposed between the fins, and the fan is configured such that the outlet surface is between a reference surface and the top of the fins, wherein the reference surface is the surface where the substrate and the fins are connected; the flow guiding component is disposed between the fins, the connecting end of the flow guiding component is connected to the substrate, the adjusting end of the flow guiding component is disposed between the reference surface and the outlet surface, and the adjusting end of the flow guiding component divides the flow guiding component into a first flow guiding surface and a second flow guiding surface.

[0005] In some embodiments, the first guide surface and the second guide surface include a plane or a curved surface.

[0006] In some embodiments, the connection end of the flow guiding component includes a first connection end and a second connection end. The connection end of the flow guiding component is connected to the substrate, including: the first connection end is disposed on the substrate near the first fin, and the second connection end is disposed on the substrate near the second fin.

[0007] In some embodiments, the adjustment end is configured to move in a plane parallel to the reference plane to adjust the first guide surface and the second guide surface.

[0008] Secondly, the present invention provides an inverter, comprising: a heat dissipation structure according to any one of the above aspects.

[0009] Thirdly, the present invention provides a heat dissipation control method, the method comprising: acquiring the temperature of a heat source device; when the temperature difference between the heat source devices is greater than a temperature threshold, adjusting the adjustment end of the heat dissipation structure of any of the above aspects to adjust the first guide surface and the second guide surface.

[0010] Fourthly, the present invention provides a heat dissipation control device, the device comprising: a data acquisition module for acquiring the temperature of a heat source device; and an adjustment module for adjusting the adjustment end of the heat dissipation structure of any of the above aspects when the temperature difference between the heat source devices is greater than a temperature threshold, so as to adjust the first flow guide surface and the second flow guide surface.

[0011] Fifthly, the present invention provides a computer device, including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above-described heat dissipation control method.

[0012] In a sixth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described heat dissipation control method.

[0013] In a seventh aspect, the present invention provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the above-described heat dissipation control method.

[0014] This invention provides a heat dissipation structure, inverter, control method, device, equipment, medium, and product. The heat dissipation structure includes: a substrate, fins, a fan, and a flow guiding component. Fins are disposed on the substrate for dissipating heat from heat source devices on the substrate corresponding to the fins. The fan is disposed between the fins, with its outlet surface located between a reference surface and the top of the fins, wherein the reference surface is the surface where the substrate and fins connect. The flow guiding component is disposed between the fins, with its connecting end connected to the substrate and its adjusting end located between the reference surface and the outlet surface. The adjustment end of the component divides the airflow guide into a first airflow guide surface and a second airflow guide surface. The fan is positioned between the fins with the air outlet surface between the reference surface and the top of the fin, so that all the air blown out by the cooling fan enters the gap between the fins on both sides of the heat dissipation fins, increasing the airflow through the heat dissipation fins. The airflow guide is positioned between the fins, with its connecting end connected to the substrate. The adjustment end is positioned between the reference surface and the air outlet surface, dividing the airflow guide into a first airflow guide surface and a second airflow guide surface, which guides the airflow from the fan, increases the airflow velocity through the heat dissipation fins, and controls the airflow distribution. Attached Figure Description

[0015] The invention will now be described in more detail with reference to embodiments and the accompanying drawings:

[0016] Figure 1 This is a schematic diagram of a heat dissipation structure provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the flow direction of a heat dissipation structure provided in an embodiment of this application;

[0018] Figure 3This is a schematic diagram of the structure of a guide vane provided in an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the structure of a curved guide vane provided in an embodiment of this application;

[0020] Figure 5 This is a schematic diagram of the structure of an inverter provided in an embodiment of this application;

[0021] Figure 6 This is a schematic flowchart of a heat dissipation control method provided in an embodiment of this application;

[0022] Figure 7 This is a schematic diagram of the structure of a heat dissipation control device provided in an embodiment of this application.

[0023] In the accompanying drawings, the same parts are referred to by the same reference numerals, and the drawings are not drawn to scale. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention and to fully understand and implement the process of how the present invention uses technical means to solve technical problems and achieve corresponding technical effects, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. The embodiments of the present invention and the various features therein can be combined with each other without conflict, and the resulting technical solutions are all within the protection scope of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0026] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0027] Inverters are crucial components in photovoltaic power generation systems, including high-heat-generating heat source devices. To ensure inverter reliability, heat dissipation structures such as fins are needed to cool these heat source devices. A technical challenge in this field is the relatively small airflow through the heat dissipation fins.

[0028] An inverter is a converter that transforms direct current (DC) into alternating current (AC), and is a crucial component in a photovoltaic (PV) power generation system. Inverters contain heat-generating components, and to ensure inverter reliability, it is necessary to dissipate these heat sources. This field presents a technical challenge: how to improve the heat dissipation efficiency of inverters.

[0029] In related technologies, the heat dissipation structure of an inverter mainly includes a cooling fan, two heat sinks, and a baffle plate such as a guide plate. The heat sinks are spaced apart inside the housing, and each heat sink has a heat source device. The cooling fan is located at the top of the heat sink fins and blows air towards the space between the heat sinks. The air hits the baffle plate, such as the guide plate, and is dispersed to the heat sinks on both sides, thereby cooling the two heat sinks at the same time.

[0030] However, in the aforementioned technologies, on the one hand, the airflow distribution via the baffle plate results in at least one radiator having an angle greater than or equal to 90° between its air intake direction and the radiator base plate, leading to excessive wind resistance and a reduction in the airflow velocity through the heat dissipation fins. Furthermore, the airflow to the radiators on both sides cannot be freely distributed. On the other hand, the cooling fan being located above the heat dissipation fins further reduces the airflow through them. Additionally, the airflow cannot be adjusted or distributed when the heat source's heating characteristics change. Therefore, the aforementioned heat dissipation structure suffers from poor heat dissipation performance.

[0031] The technical problem addressed by this application is that airflow distribution via baffles results in at least one radiator having an angle greater than or equal to 90° between its intake direction and the radiator base plate, leading to excessive wind resistance, reduced airflow velocity through the radiator, and uncontrollable airflow distribution. The technical solution of this application involves installing baffles between the radiators to guide the airflow from the fan. This technical solution increases the airflow velocity through the heat sink fins and allows for controllable airflow distribution.

[0032] This application addresses the technical problem that a cooling fan positioned above the top of the heat sink fins reduces the airflow through them. The solution involves positioning the cooling fan outlet below the top of the heat sink fins. This solution increases the airflow through the heat sink fins.

[0033] The technical problem with this application is that the airflow directed to the radiators via a baffle plate is fixed, and the airflow distribution cannot be flexibly adjusted when the heating conditions of the heat sources on both sides change. The technical solution of this application involves installing a freely movable baffle between the radiators. This technical solution allows for free and flexible airflow distribution according to changes in the heating conditions of the heat sources.

[0034] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. The technical solutions of this application will be described below with reference to specific embodiments.

[0035] Example 1

[0036] Figure 1 This is a schematic diagram of a heat dissipation structure provided in an embodiment of this application. Figure 2 This is a schematic diagram of the airflow direction of a heat dissipation structure provided in an embodiment of this application. Figure 3 This is a schematic diagram of the structure of a baffle provided in an embodiment of this application. Figures 1 to 3 As shown in the technical solution of this embodiment, a heat dissipation structure is provided, including: a substrate, fins, a fan, and a flow guiding component; the fins are disposed on the substrate for heat dissipation of heat source devices on the substrate corresponding to the fins; the fan is disposed between the fins, and the fan is configured such that the air outlet surface is between the reference surface and the top of the fin, wherein the reference surface is the surface where the substrate and the fins are connected; the flow guiding component is disposed between the fins, the connecting end of the flow guiding component is connected to the substrate, the adjusting end of the flow guiding component is disposed between the reference surface and the air outlet surface, and the adjusting end of the flow guiding component divides the flow guiding component into a first flow guiding surface and a second flow guiding surface.

[0037] The technical problem this embodiment aims to solve is that in the inverter heat dissipation structure, the airflow distribution via the baffle plate results in at least one radiator having an angle greater than or equal to 90° between its air intake direction and the radiator substrate, leading to excessive wind resistance, reduced airflow velocity through the radiator, and an inability to control airflow distribution. It also addresses the problem of the cooling fan being located above the radiator fins, reducing airflow through them, and the inability to flexibly adjust airflow distribution when the heating conditions of the heat sources on both sides change. There are technical problems with poor inverter heat dissipation in the art.

[0038] The heat dissipation structure includes two heat sinks 2, a cooling fan 3, and a flow guiding component / baffle 4. Each heat sink 2 consists of a substrate 201 and several fins 202 disposed on the substrate 201. The heat sink 2 is used to dissipate heat from heat source devices, and the cooling fan 3 is used for air cooling of the heat sink 2. This embodiment solves the above problems by setting a heat dissipation structure including a substrate, fins, a fan, and a flow guiding component. The fins are disposed on the substrate for dissipating heat from heat source devices. The fan is disposed between the fins with its outlet surface between the reference surface and the top of the fin, ensuring that all the air blown by the cooling fan enters the gaps between the fins on both sides, increasing the airflow through the heat dissipation fins. The flow guiding component is disposed between the fins, with its connecting end connected to the substrate and its adjusting end disposed between the reference surface and the outlet surface, dividing the flow guiding component into a first flow guiding surface and a second flow guiding surface. This guides the airflow from the fan, increasing the air velocity flowing through the heat dissipation fins and allowing control of the airflow distribution.

[0039] In this embodiment, for example in a photovoltaic inverter, the heat dissipation structure significantly improves heat dissipation. When the cooling fan is working, because its outlet surface is between the reference surface and the top of the fins, the airflow can enter the gap between the heat dissipation fins more concentratedly. Compared to the traditional heat dissipation structure where the cooling fan is located on top of the heat dissipation fins, this greatly increases the airflow through the heat dissipation fins. Simultaneously, the airflow guiding component guides and diverts the airflow, ensuring that the angle between the airflow direction of the heat sink and the substrate is always less than 90°, reducing wind resistance and increasing the air velocity flowing through the heat dissipation fins. Moreover, when the heating conditions of different heat source devices in the inverter change, the adjustment end of the airflow guiding component can adjust the first and second airflow guiding surfaces, allowing for flexible and free allocation of airflow according to changes in the heating conditions. For example, when the heat output of a heat source device suddenly increases and its temperature exceeds a threshold, adjusting the airflow guiding component can direct more airflow to the heat sink corresponding to that heat source device, thereby quickly reducing its temperature and ensuring the normal operation of the inverter. This heat dissipation structure not only improves heat dissipation efficiency but also enhances the stability and reliability of the inverter under different operating conditions, extending the service life of the equipment.

[0040] Example 2

[0041] Figure 4 This is a schematic diagram of a curved guide vane provided in an embodiment of this application. Figure 4 As shown, based on the above embodiments, the first guide surface and the second guide surface include a plane or a curved surface.

[0042] The technical problem to be solved in this embodiment is how to further optimize the shape of the airflow guiding surface of the airflow guiding component in the inverter heat dissipation structure in order to better solve the wind resistance problem and improve the heat dissipation effect.

[0043] There is a technical problem in this field where the shape of the airflow guiding surface is uniform, resulting in limited heat dissipation effect. The technical solution of this embodiment, based on the above embodiments, includes both planar and curved surfaces for the first and second airflow guiding surfaces, allowing the airflow guiding components to be flexibly selected according to different heat dissipation requirements and spatial layouts.

[0044] In practical applications, when the airflow guide surface is planar, its manufacturing is relatively simple and cost-effective, meeting general heat dissipation requirements. However, when the airflow guide surface is curved, it can better guide airflow, making the airflow smoother and further reducing wind resistance. For example, in a relatively confined space in an inverter, using a curved airflow guide surface can effectively increase the air velocity flowing through the heat dissipation fins without significantly increasing space requirements. Furthermore, different shapes of airflow guide surfaces can be adjusted according to the heat distribution of the heat source components, resulting in more uniform heat dissipation. This diverse airflow guide surface design provides inverters with more options and optimization space for heat dissipation, further improving inverter performance and reliability.

[0045] Example 3

[0046] Based on the above embodiments, the connecting end of the flow guiding component includes a first connecting end and a second connecting end. The connecting end of the flow guiding component is connected to the substrate, including: the first connecting end is disposed on the substrate near the first fin, and the second connecting end is disposed on the substrate near the second fin.

[0047] Based on the above embodiments, the connection ends of the flow guiding component are divided into a first connection end and a second connection end, which are respectively disposed on the substrate near the first fin and the second fin. This design allows the flow guiding component to be more tightly integrated with the heat sink, improving the accuracy and stability of flow guiding.

[0048] The connection method in this embodiment ensures that the airflow guiding component accurately directs the air blown by the cooling fan to the radiators on both sides. For example, when the cooling fan is working, the air first blows to the connecting end of the airflow guiding component. Since the first connecting end is close to the first fin and the second connecting end is close to the second fin, the airflow can flow to the corresponding radiator more quickly under the action of the airflow guiding component. This avoids airflow turbulence and waste, and improves the utilization efficiency of air volume.

[0049] Example 4

[0050] Based on the above embodiments, the adjustment end is configured to move in a plane parallel to the reference plane to adjust the first guide surface and the second guide surface.

[0051] The technical problem this embodiment aims to solve is how to adjust the flow guide component in the inverter's heat dissipation structure to achieve more precise airflow distribution and heat dissipation control. Currently, there is a technical problem in the art where the inflexible adjustment of the flow guide component fails to meet the needs of different heat dissipation conditions.

[0052] The technical solution of this embodiment, based on the above embodiment, sets the adjustment end to move in a plane parallel to the reference plane to adjust the first and second guide surfaces. This design allows the guide component to be dynamically adjusted according to the actual heat generation. The distance between the adjustment end and the reference plane is less than the distance of the minor axis of the ellipse formed by the two connecting ends as foci. Therefore, when the adjustment end moves in a plane parallel to the reference plane, it can adjust the first and second guide surfaces.

[0053] Example 5

[0054] Figure 5 This is a schematic diagram of the structure of an inverter provided in an embodiment of this application. Figure 5 As shown, in the technical solution of this embodiment, an inverter is provided, including: the heat dissipation structure of any of the above embodiments.

[0055] The technical problem this embodiment aims to solve is to provide an inverter structure with good heat dissipation performance in inverter design, so as to meet the heat dissipation requirements of the inverter during operation and improve the reliability and stability of the inverter. There are existing technical problems in the art where poor inverter heat dissipation affects equipment performance and lifespan.

[0056] The technical solution of this embodiment solves the above-mentioned problems by employing an inverter that includes the heat dissipation structure described in the above embodiment. This design enables the inverter to effectively dissipate heat from internal heat source components during operation.

[0057] In practical inverter applications, inverters with specific heat dissipation structures offer significant advantages. First, the cooling fan outlet in the heat dissipation structure is located between the reference plane and the top of the fins, ensuring ample airflow into the gaps between the fins, increasing airflow and improving heat dissipation efficiency. Second, the guiding components accurately guide the fan outlet, ensuring the angle between the radiator's airflow direction and the substrate is always less than 90°, reducing wind resistance and further enhancing airflow speed and heat dissipation. Moreover, when the heating conditions of different heat source devices within the inverter change, the adjusting end of the guiding components can be adjusted as needed, flexibly distributing airflow to ensure each heat source device receives adequate cooling. For example, in a large photovoltaic power plant, the inverter needs to operate stably for extended periods; excellent heat dissipation performance prevents overheating and malfunctions, improving the overall power generation efficiency of the plant. Furthermore, this inverter structure can be optimized and adjusted according to different operating environments and load conditions, adapting to various complex application scenarios.

[0058] Example 6

[0059] Figure 6 This is a schematic flowchart illustrating a heat dissipation control method provided in an embodiment of this application. Figure 6 As shown, in the technical solution of this embodiment, a heat dissipation control method is provided. The method includes: acquiring the temperature of the heat source device; when the temperature difference between the heat source devices is greater than a temperature threshold, adjusting the adjustment end of the heat dissipation structure of any of the above embodiments to adjust the first guide surface and the second guide surface.

[0060] The technical problem this embodiment aims to solve is how to automatically adjust the heat dissipation structure based on the temperature of heat source devices in inverter heat dissipation control, thereby improving heat dissipation efficiency and the intelligence level of the equipment. There are existing technical problems in this field where inaccurate heat dissipation control leads to energy waste and unstable equipment performance.

[0061] The technical solution of this embodiment acquires the temperature of the heat source devices. When the temperature difference between the heat source devices exceeds a temperature threshold, the adjustment end of the heat dissipation structure described in the above embodiment is adjusted to adjust the first and second airflow guide surfaces. By acquiring the temperature of the heat source devices in real time, the heat generation status of the equipment can be accurately understood. When the temperature difference between different heat source devices exceeds the set temperature threshold, it indicates that the heat dissipation demand has changed. At this time, the adjustment end of the heat dissipation structure is automatically adjusted to adjust the airflow distribution in a timely manner, ensuring that the heat source devices with higher heat generation receive more cooling air. Automatic adjustment can reduce manual intervention and improve the intelligence and reliability of the equipment.

[0062] Example 7

[0063] Figure 7 This is a schematic diagram of the structure of a heat dissipation control device provided in an embodiment of this application. Figure 7 As shown, in the technical solution of this embodiment, a heat dissipation control device is provided. The device includes: a data acquisition module for acquiring the temperature of the heat source device; and an adjustment module for adjusting the adjustment end of the heat dissipation structure of any of the above embodiments when the temperature difference between the heat source devices is greater than a temperature threshold, so as to adjust the first guide surface and the second guide surface.

[0064] The technical problem this embodiment aims to solve is how to automatically adjust the heat dissipation structure based on the temperature of heat source devices in inverter heat dissipation control, thereby improving heat dissipation efficiency and the intelligence level of the equipment. There are existing technical problems in this field where inaccurate heat dissipation control leads to energy waste and unstable equipment performance.

[0065] The technical solution of this embodiment obtains the temperature of the heat source devices. When the temperature difference between the heat source devices exceeds a temperature threshold, the adjustment end of the heat dissipation structure described in the above embodiment is adjusted to adjust the first and second flow guide surfaces. In actual inverter operation, the heat dissipation control method of this embodiment is of great significance.

[0066] By acquiring the temperature of heat source devices in real time, the heat dissipation status of the equipment can be accurately understood. When the temperature difference between different heat source devices exceeds the set temperature threshold, it indicates a change in heat dissipation requirements. At this time, the automatic adjustment end of the heat dissipation structure can adjust the airflow distribution in a timely manner to ensure that the heat source devices with higher heat generation receive more cooling air. Automatic adjustment can reduce manual intervention and improve the intelligence and reliability of the equipment. Other technical features and beneficial effects of this embodiment correspond to those of the above embodiments and will not be repeated here.

[0067] Example 8

[0068] In this embodiment, a computer device is provided, including a memory, a processor, and a computer program stored in the memory. The processor executes the computer program to implement the steps of the above-described heat dissipation control method.

[0069] In this embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, it implements the steps of the above-described heat dissipation control method.

[0070] In the technical solution of this embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of the above-described heat dissipation control method.

[0071] Based on the above embodiments, this embodiment provides a computer device, including a memory, a processor, and a computer program stored in the memory. The processor executes the computer program to implement the steps of the method described in the above embodiments. In some embodiments of this embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When executed by a processor, the computer program implements the steps of the method described in the above embodiments. In some embodiments of this embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of the method described in the above embodiments. The processor may include, but is not limited to, one or more processors or microprocessors. Each processor may be implemented as an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Digital Signal Processing Device (DSPD), a Programmable Logic Device (PLD), a Field Programmable Gate Array (FPGA), a controller, a microcontroller, a microprocessor, or other electronic components to execute the methods in the above embodiments. Computer-readable storage media can be implemented by any type of volatile or non-volatile storage device or a combination thereof. Computer-readable storage media may include, but are not limited to, random access memory (RAM), read-only memory (ROM), flash memory, EPROM memory, EEPROM memory, registers, and computer storage media (e.g., hard disks, floppy disks, solid-state drives, removable disks, CD-ROMs, DVD-ROMs, Blu-ray discs, etc.).

[0072] The computer-readable storage medium may also store at least one computer-executable program / instruction, such as computer-readable instructions. The computer-readable storage medium includes, but is not limited to, volatile memory and / or non-volatile memory. Volatile memory may include, for example, random access memory (RAM) and / or cache memory. The computer-readable storage medium may include, for example, read-only memory (ROM), hard disk, flash memory, etc. For example, a non-transitory computer-readable storage medium may be connected to a computing device such as a computer, and then, when the computing device executes the computer-readable instructions stored on the computer-readable storage medium, the various methods described above can be performed. In addition, the computer device may also include (but is not limited to) a data bus, an input / output (I / O) bus, a display, and input / output devices (e.g., a keyboard, mouse, speaker, etc.).

[0073] The processor can communicate with external devices via a wired or wireless network through an I / O bus. In one embodiment, the at least one computer-executable instruction can also be compiled into or comprise a software product / computer program product, wherein one or more computer-executable instructions are executed by the processor to perform the steps of the various functions and / or methods in the embodiments described herein.

[0074] Example 9

[0075] Based on the above embodiments, this embodiment provides an application example.

[0076] Regarding application example one. Figure 1 This is a schematic diagram of a heat dissipation structure provided in an embodiment of this application. (See attached diagram.) Figure 1 This application discloses a heat dissipation structure for an inverter, comprising two heat sinks 2, a cooling fan 3, and a flow guiding component / plate 4. Each heat sink 2 consists of a substrate 201 and a plurality of fins 202 disposed on the substrate 201. The heat sink 2 is used to dissipate heat from heat source devices, and the cooling fan 3 is used to provide air cooling for the heat sink 2.

[0077] Specifically, the heat dissipation structure of the inverter includes at least two heat sinks 2, with a first heat source device 101 and a second heat source device 102 respectively disposed on two adjacent heat sinks 2. Correspondingly, sufficient space is left between the two adjacent heat sinks 2 to accommodate a cooling fan 3. The outlet surface of the cooling fan 3 is higher than the reference surface of the substrate 201 and lower than the top of the fins 202. The reference surface of the substrate 201 is the side of the substrate 201 connected to the fins 202, and the top of the fins 202 is the end of the fins 202 away from the substrate 201. Correspondingly, a flow guiding component / plate 4 is disposed between the two adjacent heat sinks 2, and the flow guiding component / plate 4 is located at the output end of the cooling fan 3.

[0078] Figure 2 This is a schematic diagram of the flow direction disclosed in this embodiment. For example... Figure 2 As shown, in the above-described inverter heat dissipation structure, the air blown by the cooling fan 3 is guided and diverted to both sides by the guide component / guide plate, and simultaneously flows through the heat dissipation fins 202 of the two heat sinks 2 on both sides. The first heat source device 101 and the second heat source device 102 are respectively disposed on the two heat sinks 2, so the heat source devices corresponding to different heat sinks 2 can be cooled simultaneously by the same cooling fan 3. The air outlet surface of the cooling fan 3 is higher than the reference surface of the substrate 201 and lower than the top of the fins 202, so all the air blown by the cooling fan 3 enters the fin gaps of the heat dissipation fins 202 on both sides, increasing the airflow through the heat dissipation fins 202. The air blown by the cooling fan 3 is guided and diverted by the guide plate 4 and flows through the heat dissipation fins 202, so the angle between the air inlet direction of the heat sink 2 and the substrate 201 is always less than 90°, reducing wind resistance and increasing the air velocity flowing through the heat dissipation fins. The above-described inverter heat dissipation structure improves the heat dissipation effect of the inverter.

[0079] For the aforementioned heat sink 2, the specific structure of the heat sink can be freely selected according to actual application requirements. For two adjacent heat sinks 2, independent base plates 201 can be set respectively, or the two base plates 201 can be connected, that is, sharing a single base plate 201. If independent base plates 201 are set, the size of the base plates 201 can be the same or different. The shape of the heat dissipation fins 202 of the heat sink 2 is not limited; they can be set as sheet-like, needle-like, or other shapes as required, and can be straight or curved. The angle between the fins 202 and the corresponding base plate 201 can be equal to 90° or less than 90°. The height, number, and arrangement direction of the heat dissipation fins 202 can be freely selected according to requirements. Different heat sinks 2 can have the same size and structure or different structures. The types of heat sinks 2 include, but are not limited to: profile heat sinks, toothed heat sinks, heat pipe heat sinks, phase change heat sinks, etc.

[0080] For the aforementioned cooling fan 3, if the air outlet surface of the cooling fan 3 is higher than the reference plane of the substrate 201 but lower than the top of the fins 202, then all the air blown out by the cooling fan 3 will enter the fin gaps of the heat dissipation fins 202 on both sides. The angle between the air outlet direction of the cooling fan 3 and the normal direction of the substrate 201 of the heat sink 2 is less than 90°, and the air outlet direction of the cooling fan 3 can be changed by adjusting the installation angle of the cooling fan 3. Provided that the air outlet surface of the cooling fan 3 is higher than the reference plane of the substrate 201 but lower than the top of the fins 202, the installation position of the cooling fan 3 can be freely arranged. The number of cooling fans 3 between two adjacent heat sinks 2 can be one or more. When there are multiple cooling fans 3 between two adjacent heat sinks 2, the relative positions between two cooling fans 3 can be set according to actual needs. The type of cooling fan 3 can be selected according to actual needs. In the above embodiment, an axial flow fan is preferably used as the cooling fan 3, but other types of fans can also be selected according to needs.

[0081] Figure 3 This is a schematic diagram of the structure of a flow guide plate disclosed in this embodiment. The structure of the flow guide component / flow guide plate 4 is as follows: Figure 3 As shown (for ease of explanation), Figure 3 (Cooling fan 3 not shown) The guide plate 4 consists of a first guide surface / first air-facing plate 401 and a second guide surface / second air-facing plate 402, and is disposed between the two heat sinks 2. The first air-facing plate 401 is closer to the first heat source device 101, and the second air-facing plate 402 is closer to the second heat source device 102. The angle between the first air-facing plate 401 and the second air-facing plate 402 and the substrate 201 is greater than 90°, so the angle between the air intake direction of the heat sink 2 and the substrate 201 is always less than 90°, reducing wind resistance and increasing the air velocity flowing through the heat dissipation fins 202. Figure 2 As shown, the air blown out by the cooling fan 3 is directed to the connection end of the guide vane 4 and flows to the heat sinks 2 on both sides under the action of the first wind vane 401 and the second wind vane 402, thereby cooling the first heat source device 101 and the second heat source device 102 and reducing the number of cooling fans 3 required.

[0082] In this embodiment, both the first windward plate 401 and the second windward plate 402 of the guide vane 4 are flat panels. Optionally, the first windward plate 401 and the second windward plate 402 can also be curved surfaces, such as... Figure 4 As shown. In fact, the first air intake plate 401 and the second air intake plate 402 of the air intake plate 4 can be of any shape, as long as they can reduce the air resistance from the cooling fan 3 to the radiator 2.

[0083] For the aforementioned guide plate 4, one end of its first guide surface / first air-facing plate 401 is connected to one end of its second guide surface / second air-facing plate 402; this end is the connection end, and the corresponding other end is the mounting end. The mounting end of the guide plate 4 is disposed on the base plate 201 of the radiator 2 or on the cabinet on which the radiator 2 is mounted. The guide plate 4 is connected to the base plate 201 of the radiator 2 or the cabinet on which the radiator 2 is mounted via a slide rail. The guide plate 4 can move freely along the slide rail, so the relative position of the guide plate 4 and the cooling fan 3 can be freely adjusted. According to the specific heat generation of the first heat source device 101 and the second heat source device 102, the airflow blowing to the two radiators 2 on both sides can be distributed by adjusting the position of the guide plate 4.

[0084] Regarding the adjustment and control method for the position of the aforementioned airflow guide component / airflow plate 4, it can be adjusted manually or by connecting the airflow plate 4 to a motor for electric adjustment. When using a motor for electric adjustment of the position of the airflow guide component / airflow plate 4, preferably, the position of the airflow plate 4 can be automatically controlled. Specifically, input signals are collected from the first heat source device 101 and the second heat source device 102. These input signals can be heat generation or other parameters that characterize the heat generation of the heat source device, such as temperature. The collected input signals are input to the control system. When the heat generation of the first heat source device 101 is greater than that of the second heat source device 102, the control system automatically adjusts the airflow plate 4 so that the airflow towards the first heat source device 101 is greater than the airflow towards the second heat source device 102. Similarly, when the heat generation of the first heat source device 101 is less than that of the second heat source device 102, the control system automatically adjusts the airflow plate 4 so that the airflow towards the first heat source device 101 is less than the airflow towards the second heat source device 102.

[0085] For the heat dissipation structure of the inverter mentioned above, based on the requirements of heat dissipation and installation, one side of the substrate 201 of the heat sink 2 is set as the reference surface, which is connected to the fins 202. The other side opposite to the reference surface is the mounting surface of the substrate 201, and the heat source device is set on the mounting surface of the substrate 201.

[0086] For the heat dissipation structure of the inverter described above, based on the heating conditions of the first heat source device 101 and the second heat source device 102, the airflow blowing towards the two heat sinks 2 can be adjusted by changing the installation angles of the first and second air intake plates 401 and 402, the installation angle of the cooling fan 3, and the dimensional parameters such as the height, length, and gap of the heat dissipation fins on both sides, thus meeting the heat dissipation requirements under different heating conditions. When the operating conditions change or the heating conditions of the first heat source device 101 and the second heat source device 102 change, the airflow blowing towards the two heat sinks 2 can be freely distributed by adjusting the relative positions of the guide plate 4 and the cooling fan 3, thus meeting the heat dissipation requirements under different operating conditions.

[0087] For the heat dissipation structure of the inverter described above, the spacing between two adjacent heat sinks 2 can be freely adjusted according to structural requirements, so as not to obstruct the installation of the cooling fan 3 and the guide plate 4.

[0088] This embodiment discloses an inverter, such as Figure 5 As shown, the inverter includes an inverter body and the heat dissipation structure of the inverter described in Application Example 1.

[0089] The inverter provided in this application example includes the heat dissipation structure of the inverter provided in application example one. Therefore, the inverter disclosed in this embodiment also has the technical effects corresponding to those in application example one. These technical effects have been described in detail in application example one, so they will not be repeated in this embodiment.

[0090] The inverter described above includes two heat source devices, namely a first heat source device 101 and a second heat source device 102, and each of the first heat source device 101 and the second heat source device 102 corresponds to a heat sink 2, which are respectively disposed on the mounting surface of the corresponding substrate 201. The heat emitted by the heat source devices is transferred to the fins 202 through the substrate 201, and the heat on the fins 202 is carried away by the air blown out by the cooling fan 3 and dissipated to the outside, thereby achieving heat dissipation of the inverter.

[0091] Based on structural design and dustproof / waterproof performance requirements, preferably, the inverter housing 5 is completely sealed, meaning that the interior and exterior of the inverter housing 5 are not interconnected. Figure 5 As shown. Specifically, the first heat source device 101 and the second heat source device 102 are located inside the inverter housing 5, while the fins 202 of the heat sink 2, the cooling fan 3, and the airflow guide / baffle 4 of the aforementioned heat dissipation structure are located outside the inverter housing 5. The outside of the inverter housing 5 is directly connected to the external environment, allowing for direct heat dissipation using ambient air. Simultaneously, ambient air will not enter the interior of the inverter housing 5. To improve the inverter's heat dissipation effect, preferably, the substrate 201 of the heat sink 2 can be an integral part of the inverter housing 5.

[0092] By installing air guide components / baffles between the radiators to guide the airflow from the fan, the angle between the air inlet direction of the radiator and the direction of the base plate is less than 90°, which reduces wind resistance and increases the airflow velocity through the heat dissipation fins.

[0093] If the air outlet of the cooling fan is set lower than the top of the heat dissipation fins, all the air blown out by the cooling fan will enter the gaps between the fins on both sides of the heat dissipation fins, increasing the airflow through the heat dissipation fins.

[0094] In the embodiments provided by this invention, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative; for example, the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of apparatus, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0095] It should be noted that, in this invention, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element limited by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0096] While the embodiments disclosed in this invention are as described above, the above content is merely for the purpose of facilitating understanding of this invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes in form and detail of the implementation without departing from the spirit and scope disclosed in this invention; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A heat dissipation structure, characterized in that, include: Substrates, fins, fans, and flow guide components; The fins are disposed on the substrate and are used to dissipate heat from the heat source devices on the substrate corresponding to the fins. The fan is disposed between the fins, and the fan is configured such that the air outlet surface is between the reference surface and the top of the fins, wherein the reference surface is the surface where the substrate and the fins are connected; The flow guiding component is disposed between the fins, the connecting end of the flow guiding component is connected to the substrate, the adjusting end of the flow guiding component is disposed between the reference surface and the air outlet surface, and the adjusting end of the flow guiding component divides the flow guiding component into a first flow guiding surface and a second flow guiding surface.

2. The heat dissipation structure according to claim 1, characterized in that, The first guide surface and the second guide surface include planes or curved surfaces.

3. The heat dissipation structure according to claim 1, characterized in that, The connecting end of the flow guiding component includes a first connecting end and a second connecting end, and the connecting end of the flow guiding component is connected to the substrate, including: The first connection end is disposed on the substrate near the first fin, and the second connection end is disposed on the substrate near the second fin.

4. The heat dissipation structure according to claim 1, characterized in that, The adjustment end is configured to move in a plane parallel to the reference plane to adjust the first guide surface and the second guide surface.

5. An inverter, characterized in that, include: The heat dissipation structure according to any one of claims 1 to 4.

6. A heat dissipation control method, characterized in that, The method includes: Obtain the temperature of the heat source device; When the temperature difference between the heat source devices is greater than the temperature threshold, the adjustment end of the heat dissipation structure according to any one of claims 1 to 4 is adjusted to adjust the first guide surface and the second guide surface.

7. A heat dissipation control device, characterized in that, The device includes: The acquisition module is used to obtain the temperature of the heat source device; An adjustment module is used to adjust the adjustment end of the heat dissipation structure according to any one of claims 1 to 4 when the temperature difference between the heat source devices is greater than a temperature threshold, so as to adjust the first guide surface and the second guide surface.

8. A computer device, comprising a memory, a processor, and a computer program stored in the memory, characterized in that, The processor executes the computer program to implement the steps of the heat dissipation control method of claim 6.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the heat dissipation control method of claim 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the heat dissipation control method of claim 6.

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