Inverted RGB CHIP LED lamp bead and preparation method thereof

Abstract

The invention discloses an inverted RGB CHIP LED lamp bead and a preparation method thereof.The inverted RGB CHIP LED lamp bead comprises a substrate, the substrate is provided with a first surface and a second surface which are oppositely arranged, the inverted RGB CHIP LED lamp bead is characterized in that one of the first surface and the second surface is provided with a die bonding area, the other one of the first surface and the second surface is provided with a pin area, a conductive through hole is formed between the first surface and the second surface, and the conductive through hole is communicated with the first surface and the second surface. The die bonding area is conductively connected with the pin area; wherein the wafer fixing area is used for installing an LED chip, an annular groove is formed in the periphery of the wafer fixing area, so that a ball-head-shaped first glue sealing layer is formed when the LED chip is packaged through packaging glue, multiple stages of steps are formed on the surface, provided with the wafer fixing area, of the substrate and located on the outer side of the wafer fixing area, and the multiple stages of steps and the first glue sealing layer are covered with a second glue sealing layer so that the substrate can be packaged. The LED lamp bead solves the problem that an LED lamp bead in the prior art cannot give consideration to high brightness, good air tightness and high heat dissipation capacity.

Description

Technical Field

[0001] This invention relates to the field of LED technology, specifically to a flip-chip RGB chip LED and its manufacturing method. Background Technology

[0002] Existing MIP LED devices, belonging to the small-pitch LED category, use a flat BT substrate as a support. The substrate is divided into front circuitry, back circuitry, and substrate. The front circuitry is used to bond the light-emitting chips and achieve electrical interconnection, while the back circuitry is used for soldering to the LED display module PCB. The front and back circuitry are connected and conductive. The front circuitry of the substrate is divided into a die-bonding functional area, a wire bonding functional area, and an insulating isolation area. Silver paste is used to fix the red light chip on the red die-bonding functional area, and insulating glue or silver paste is used to fix the blue and green light chips on their respective die-bonding functional areas. Finally, through molding and cutting processes, individual LED beads capable of emitting RGB three-primary-color light are obtained.

[0003] As displays gradually move towards higher definition, higher brightness, and higher consistency, the existing packaging methods for LED chips cannot simultaneously achieve uniform ink color and high brightness. This results in LED chips that are sufficiently black but lack sufficient brightness. Because the substrate is a combination of BT substrate and packaging, the heat dissipation and airtightness of the LED chips are relatively poor, making them unsuitable for a wider range of applications. Therefore, there is an urgent need to develop an LED chip that combines the advantages of existing CHIP products while offering higher brightness, better airtightness, and stronger heat dissipation. Summary of the Invention

[0004] Based on this, the purpose of this invention is to provide a flip-chip RGB CHIP LED and its preparation method, aiming to propose an LED that simultaneously achieves high brightness, good airtightness, and strong heat dissipation.

[0005] To achieve the above objectives, the first aspect of the present invention provides the following technical solution: A flip-chip RGB chip LED includes a substrate having a first surface and a second surface disposed opposite to each other. One of the first surface and the second surface has a die-bonding region and the other has a lead region. A conductive via is formed between the first surface and the second surface to electrically connect the die-bonding region and the lead region. The die-bonding area is used to mount LED chips, and an annular groove is formed around the die-bonding area to form a spherical first encapsulation layer when the LED chips are encapsulated with encapsulating adhesive. The surface of the substrate with the die-bonding area has multiple steps formed on the outer side of the die-bonding area. The multiple steps and the first encapsulation layer are covered with a second encapsulation layer to encapsulate the substrate.

[0006] Furthermore, in the aforementioned flip-chip RGB CHIP LED, the conductive via is arranged at an angle.

[0007] Furthermore, in the aforementioned flip-chip RGB CHIP LED, the inclined direction of the conductive via is set upwards from the lead area towards the die-bonding area.

[0008] Furthermore, in the aforementioned flip-chip RGB CHIP LED, the tilt angle of the conductive via is 8°~10°.

[0009] Furthermore, in the aforementioned flip-chip RGB CHIP LED, the LED chip is mounted in a flip-chip manner on the die bond area, and the LED chip is fixed on the die bond area by applying solder paste.

[0010] Furthermore, in the aforementioned flip-chip RGB CHIP LED, a through-hole is formed between the first surface and the second surface. The through-hole is filled with a conductive metal using a metal filling process to form the conductive through-hole.

[0011] Furthermore, in the aforementioned flip-chip RGB chip LED, the step width gradually increases from the end closest to the LED chip to the end furthest from the LED chip in the multi-level steps.

[0012] Furthermore, in the aforementioned flip-chip RGB chip LED, the surface of the substrate with the pin area is provided with marking points.

[0013] Furthermore, in the aforementioned flip-chip RGB chip LED, the substrate material is BT resin substrate material.

[0014] Another object of the present invention is to provide a method for preparing a flip-chip RGB chip LED, the method comprising: A substrate with a die-bonding region and a lead region is provided; An annular groove is made on the outside of the die-bonding area on the surface of the substrate by means of opening holes, and then multiple steps are cut around the substrate by cutting process. Through-holes are formed on a substrate with die-bonding areas, pin areas, and surfaces by drilling, and then the through-holes are filled by metal filling process to form conductive through-holes. By applying solder paste, an LED chip capable of emitting RGB three primary colors is fixed onto the die bonding area. Then, a first encapsulation and a second encapsulation are performed sequentially to form a first encapsulation layer and a second encapsulation layer, respectively, to obtain a flip-chip RGB CHIP LED.

[0015] This invention provides a flip-chip RGB chip LED and its fabrication method. By redesigning the LED structure, an annular groove is created on the surface of the substrate's die-bonding area through an opening, facilitating the application of adhesive to form a ball-shaped LED after die bonding, further enhancing the LED's brightness. Then, multi-level steps are cut around the substrate, increasing the contact area between the encapsulant and the substrate surface, improving the LED's adhesion, and extending the moisture penetration path, further improving its hermeticity. Furthermore, conductive vias are formed between the first and second surfaces of the substrate. Since the chip is in direct contact with these vias, the LED's heat dissipation capacity is improved, simultaneously enhancing its hermeticity. This solves the problem in existing LED technologies where high brightness, good hermeticity, and strong heat dissipation cannot be simultaneously achieved. Attached Figure Description

[0016] Figure 1 A top view of the substrate with a die-bonding area surface in a flip-chip RGB CHIP LED without LED chips; Figure 2 A top view of the substrate with a die-bonding area surface in a flip-chip RGB CHIP LED with LED chips; Figure 3 A cross-sectional view of a flip-chip RGB CHIP LED with an LED chip; Figure 4 A top view of the substrate with a lead area surface in a flip-chip RGB CHIP LED with LED chips; Figure 5 This is a flowchart illustrating the fabrication process of flip-chip RGB LEDs.

[0017] In the figure: 1. Substrate; 2. Die-bonding area; 21. Die-bonding part; 3. Lead area; 31. Lead; 4. Conductive via; 5. LED chip; 6. Annular groove; 7. First encapsulant layer; 8. Step; 9. Second encapsulant layer; 10. Marker point. Detailed Implementation

[0018] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of the invention are illustrated in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

[0019] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] The embodiments of the present invention will now be described.

[0022] Please see Figures 1 to 4 The flip-chip RGB chip LED includes a substrate 1, which has a first surface and a second surface arranged opposite to each other. These two surfaces are two planes of the substrate 1 that are opposite to each other. For example, the first surface can be the front of the substrate 1 and the second surface can be the back of the substrate 1. The functional allocation of the two can also be adjusted according to actual installation requirements. One surface is provided with a die-bonding area 2, and the other surface is provided with a corresponding pin area 3. The die-bonding area 2 is a specific area for mounting the LED chip 5, and the pin area 3 is used to solder the LED display module to the PCB board to ensure that the LED is connected to the external circuit. Specifically, in this embodiment of the invention, the die-bonding area 2 includes 6 die-bonding parts 21, which are used to mount the RGB flip-chip, and the pin area 3 includes a corresponding number of pins 31. A conductive via 4 is formed between the first surface and the second surface. The via penetrates both surfaces of the substrate 1. Its core function is to establish a conductive path between the die-bonding area 2 and the pin area 3, so that the current generated when the LED chip 5 is working can be transmitted through the die-bonding area 2 to the conductive via 4, and then conducted through the conductive via 4 to the pin area 3, and finally connected to the external circuit to form a complete circuit.

[0023] An annular groove 6 is formed around the edge of the die-bonding area 2. This groove 6 is formed using mechanical or laser drilling processes, and its width and depth can be precisely designed according to the required size of the spherical encapsulant. When the LED chip 5 is encapsulated with encapsulant, the annular groove 6 guides the encapsulant to flow and accumulate naturally, ultimately forming a spherical first encapsulant layer 7. This spherical structure, similar to the optical characteristics of a convex lens, can converge and refract the light emitted by the LED chip 5, effectively improving the light extraction efficiency and brightness of the LED.

[0024] Preferably, the conductive via 4 is inclined, rather than perpendicularly penetrating the first and second surfaces of the substrate 1. This inclined arrangement is achieved using a dedicated inclined drilling device, where the drill bit forms a certain angle with the surface of the substrate 1 during drilling, rather than making perpendicular contact. Compared to traditional vertical vias, the inclined conductive via 4 allows for a more uniform distribution of the metal filler material within the via, avoiding the filling voids that are prone to occur in vertical vias, thus ensuring more stable conductivity of the conductive via 4. Simultaneously, the inclined via allows for a more rational current conduction path between the die-bonding region 2 and the pin region 3, reducing losses during current transmission. Furthermore, the heat generated by the chip can be more quickly dissipated to the pin region 3 through the inclined via, improving overall heat dissipation.

[0025] Specifically, the conductive via 4 is tilted upwards from the lead area 3 towards the die-bonding area 2. Specifically, if the lead area 3 is located on the second surface of the substrate 1 and the die-bonding area 2 is located on the first surface of the substrate 1, then the conductive via 4 extends upwards from the lead area 3 on the second surface towards the die-bonding area 2 on the first surface and penetrates the substrate 1. This tilted design allows the opening of the conductive via 4 in the die-bonding area 2 to be closer to the mounting area of ​​the LED chip 5, shortening the current conduction path between the chip and the conductive via 4, further reducing energy loss during current transmission and improving the electrical performance of the LED chip. Simultaneously, the heat generated during chip operation can be transferred to the conductive via 4 via a shorter path, then quickly conducted to the lead area 3 and dissipated onto the external PCB board, significantly optimizing heat dissipation efficiency and preventing performance degradation due to high temperatures.

[0026] For example, the tilt angle of the conductive via 4 is 8°~10°, and the tilt angle can be selected according to actual production needs, such as 8°, 9° or 10°. This angle range is the optimal range obtained through a large number of experiments. If the tilt angle is less than 8°, the length of the conductive via 4 will increase accordingly, resulting in a longer current transmission path, reduced conductivity, and increased heat transfer distance, thus affecting the heat dissipation effect. If the tilt angle is greater than 10°, it will affect the structural strength of the substrate 1, and the substrate 1 is prone to cracking during the drilling process. In addition, in the metal filling process, an excessively large tilt angle may cause the filling material to fail to completely fill the via, resulting in gaps, which will affect conductivity and heat dissipation performance. The tilt angle of 8°~10° can ensure the structural stability of the substrate 1 while taking into account the conductivity efficiency and heat dissipation effect of the conductive via 4, ensuring the overall performance stability of the LED.

[0027] In a specific implementation of this invention, a through-hole is first formed between the first and second surfaces through a drilling process, penetrating the substrate 1. During drilling, precise machining is performed using CNC drilling equipment according to the tilt angle and position requirements of the conductive through-hole 4. Then, the through-hole is filled using a metal filling process, such as electroplating copper or chemical plating silver. The filling metal is a material with good electrical and thermal conductivity, such as copper or silver. Through this metal filling process, the metal material is completely filled into the through-hole, forming a complete conductive through-hole 4. Compared to traditional through-hole conduction methods, this metal-filled conductive through-hole 4 has lower contact resistance, smoother current transmission, reduces energy loss during current transmission, and improves the electrical performance of the LED chip. Simultaneously, the excellent thermal conductivity of the metal material allows for rapid heat conduction from the chip, significantly improving the LED chip's heat dissipation capacity and extending its lifespan.

[0028] Furthermore, the substrate 1 has a multi-level step 8 formed on the outer side of the die-bonding region 2. The multi-level step 8 is formed in steps by a precision cutting process, for example, two or three levels of steps 8 can be formed by two or three cuts. After the first encapsulating layer 7 is formed, the second encapsulating layer 9 covers the surface of the multi-level step 8 and the first encapsulating layer 7, thus fully encapsulating the entire substrate 1. The design of the multi-level step 8 can significantly increase the contact area between the second encapsulating layer 9 and the surface of the substrate 1, making the bonding between the encapsulating adhesive and the substrate 1 more solid. At the same time, it extends the path for external moisture to penetrate into the LED chip, greatly improving the airtightness of the LED chip and preventing moisture from corroding the chip and affecting its service life.

[0029] Preferably, the step 8 near the LED chip 5 gradually widens towards the end furthest from the LED chip 5. For example, if two steps 8 are provided, the first step 8, closer to the LED chip 5, can be designed with a width of 20 micrometers, and the second step 8, furthest from the LED chip 5, can be designed with a width of 40 micrometers; if three steps 8 are provided, the widths of each step 8 can be designed to be 15 micrometers, 30 micrometers, and 50 micrometers respectively. This gradually widening design allows the contact area between the second encapsulating layer 9 and the surface of the substrate 1 to increase in a gradient, resulting in stronger adhesion between the encapsulating adhesive and the substrate 1, a more robust encapsulation structure, and effectively preventing the encapsulating adhesive from falling off. At the same time, the multi-level widening of the steps 8 makes the path for moisture to penetrate into the LED bead more tortuous and lengthy, significantly increasing the difficulty of moisture penetration and further improving the airtightness of the LED bead, allowing it to adapt to harsh application environments such as humid conditions.

[0030] In addition, in specific implementation, the LED chip 5 is mounted in a flip-chip configuration on the die-bonding area 2. Flip-chips, as opposed to traditional upright chips, have their electrodes located at the bottom, not the top, of the chip. This structure avoids the problem of electrodes blocking the light-emitting area, maximizing the chip's light-emitting area and thus improving the brightness of the LED. The LED chip 5 is fixed to the die-bonding area 2 by applying solder paste. Specifically, a high-precision dispensing machine applies an appropriate amount of solder paste to a designated location on the die-bonding area 2. Then, the electrode surface of the flip-chip is adhered to the solder paste. Following a reflow soldering process, the solder paste melts upon heating and then cools and solidifies, firmly fixing the chip to the die-bonding area 2. Compared to the silver paste or insulating adhesive used for traditional upright chips, solder paste has superior thermal conductivity, quickly transferring the heat generated by the chip to the substrate 1, improving heat dissipation. Simultaneously, the solder paste has higher bonding strength after curing, resulting in better chip fixation reliability and reducing the likelihood of chip detachment or poor contact. Furthermore, it eliminates the wire bonding process, effectively improving production efficiency.

[0031] In some optional embodiments of the present invention, the surface of the substrate 1 with the pin area 3 is provided with marking points 10. The marking points 10 can be circular, square, or other easily identifiable shapes, and are made by ink printing or metal etching processes. The marking points 10 are mainly used for positioning and identification during the production and mounting process. During the production of LED chips, the marking points 10 can be used to quickly locate the positions of the die-bonding area 2 and the pin area 3, ensuring the accuracy of chip installation and circuit connection. When the LED chips are mounted onto the LED display PCB board, the mounting equipment captures the marking points 10 through visual recognition technology, which can accurately determine the installation direction and position of the LED chips, avoiding situations where the polarity of the RGB chips is reversed or the installation is offset, significantly improving mounting accuracy and production efficiency, and ensuring the display effect of the display screen.

[0032] In some optional embodiments of the present invention, the substrate 1 is made of BT resin substrate 1, which is a high-performance electronic packaging substrate 1 material based on bismaleimide triazine resin. This material has excellent insulation properties, effectively isolating different circuits on the substrate 1 and avoiding short circuits; it also possesses good mechanical strength and dimensional stability, maintaining its shape without deformation during a series of processing steps such as cutting steps 8, drilling, and metal filling, ensuring the structural precision of the LED chip; furthermore, BT resin substrate 1 has excellent high-temperature resistance, able to withstand the high-temperature environment of processes such as reflow soldering and molding during LED chip production without material aging or performance degradation. Using BT resin substrate 1 material retains the advantages of traditional CHIP type LED chips—high flatness and good ink color effect—while also being compatible with various process designs in this invention, providing a reliable structural foundation for the high airtightness and high heat dissipation performance of the LED chip.

[0033] In another embodiment of the present invention, a method for preparing a flip-chip RGB chip LED is provided. Please refer to [link to relevant documentation]. Figure 5 This is a flowchart illustrating the fabrication method of a flip-chip RGB LED, used to fabricate the aforementioned flip-chip RGB LED. The method includes steps S01 to S04, specifically: Step S01: Provide a substrate with a die-bonding region and a pin region.

[0034] First, a substrate with a die-bonding area and a pin area is provided. The substrate is made of BT resin substrate material. In the early stage of substrate processing, the positions of the die-bonding area and the pin area and the related circuit layout are planned and formed in advance through circuit design and manufacturing process to ensure that the die-bonding area can be adapted to the installation of LED chips and the pin area can meet the requirements of soldering with external PCB board. The size and thickness of the substrate are precisely controlled according to the application scenario and design requirements of the LED chips.

[0035] In step S02, an annular groove is opened on the outside of the die-bonding area on the surface of the substrate by means of an opening method, and then multiple steps are cut around the substrate by a cutting process.

[0036] Next, an annular groove is created on the surface of the substrate with the die-bonding area by an opening method outside the die-bonding area. A laser opening machine can be used, as it offers advantages such as high precision and clean edges, and can accurately control the width and depth of the annular groove. For example, the groove width is designed to be 0.1 mm and the depth to be 0.08 mm, ensuring that the subsequent encapsulating adhesive can form an ideal spherical structure. After the opening is completed, multiple steps are cut around the substrate using a precision cutting process. A CNC cutting machine is used, and the cutting is performed multiple times according to the number and width requirements of the steps. For example, when cutting two steps, the first narrow step closer to the die-bonding area is cut first, followed by the second wide step further away from the die-bonding area, ensuring the dimensional accuracy and surface flatness of each step.

[0037] Step S03: Through-holes are formed on the substrate with die-bonding areas, pin areas and surfaces by drilling, and the through-holes are filled by metal filling process to form conductive through-holes.

[0038] Then, through-holes are formed on the surface of the substrate with die-bonding and lead regions using a drilling process. A CNC drilling machine with tilting drilling capability is used to precisely machine through-holes into the substrate according to a preset tilt angle (8°~10°) and tilt direction (tilting upwards from the lead region towards the die-bonding region). After drilling, the through-holes are filled using a metal filling process, such as copper plating. The substrate is placed in an electroplating solution, and copper ions are uniformly deposited on the inner wall of the through-hole and fill the entire through-hole by applying an electric current, forming a conductive through-hole with excellent conductivity, ensuring a stable conductive connection between the die-bonding and lead regions.

[0039] Step S04: The LED chip that can emit RGB three primary colors of light is fixed on the die bonding area by applying solder paste. The first encapsulation and the second encapsulation are performed in sequence to form the first encapsulation layer and the second encapsulation layer respectively to obtain the flip-chip RGB CHIP LED.

[0040] Finally, RGB LED chips are fixed onto the die-bonding area using solder paste. A high-precision dispensing machine applies an appropriate amount of solder paste to designated locations on the die-bonding area, and then flip-chip RGB LEDs are attached to their corresponding solder paste locations. The substrate is then placed in a reflow oven for reflow soldering. The solder paste melts upon heating and then cools and solidifies, firmly fixing the LED chips onto the die-bonding area. After chip fixing, a first and second encapsulation process is performed sequentially. The first encapsulation uses a transparent, high-transmittance encapsulating adhesive, which is applied to the die-bonding area and the LED chip surface using a dispensing process. Utilizing the guiding effect of the annular grooves, the encapsulating adhesive naturally forms a spherical first encapsulation layer. This spherical structure improves light emission efficiency and enhances the brightness of the LED. After the first encapsulation layer cures, a second encapsulation is performed using a black encapsulating adhesive. The encapsulating adhesive is applied to the surface of the multi-step steps and the first encapsulation layer using a molding process, comprehensively encapsulating the entire substrate. The black encapsulating adhesive enhances the black color effect of the LEDs and improves the contrast after screen mounting. After the second sealant layer has cured, the substrate is cut into individual LED chips using a cutting process, ultimately resulting in flip-chip RGB CHIP LED chips.

[0041] In summary, the present invention proposes a flip-chip RGB chip LED and its fabrication method. By redesigning the LED structure, an annular groove is created on the surface of the die-bonding area of ​​the substrate through an opening, facilitating the application of a ball-shaped die after die bonding, thereby further enhancing the LED's brightness. Then, multi-level steps are cut around the substrate to increase the contact area between the encapsulant and the substrate surface, improving the LED's adhesion and extending the moisture penetration path, further enhancing its hermeticity. Furthermore, conductive vias are formed between the first and second surfaces of the substrate. Since the chip is in direct contact with these vias, the LED's heat dissipation capacity is improved, simultaneously enhancing its hermeticity. This solves the problem in existing LED technologies where high brightness, good hermeticity, and strong heat dissipation cannot be simultaneously achieved.

[0042] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A flip-chip RGB chip LED, comprising a substrate, the substrate having a first surface and a second surface disposed opposite to each other, characterized in that, One of the first surface and the second surface has a die-bonding region and the other has a pin region. A conductive via is formed between the first surface and the second surface to electrically connect the die-bonding region and the pin region. The die-bonding area is used to mount LED chips, and an annular groove is formed around the die-bonding area to form a spherical first encapsulation layer when the LED chips are encapsulated with encapsulating adhesive. The surface of the substrate with the die-bonding area has multiple steps formed on the outer side of the die-bonding area. The multiple steps and the first encapsulation layer are covered with a second encapsulation layer to encapsulate the substrate.

2. The flip-chip RGB chip LED according to claim 1, characterized in that, The conductive via is inclined.

3. The flip-chip RGB chip LED according to claim 2, characterized in that, The conductive via is tilted upwards from the pin area towards the die-bonding area.

4. The flip-chip RGB chip LED according to claim 3, characterized in that, The tilt angle of the conductive via is 8°~10°.

5. The flip-chip RGB chip LED according to claim 1, characterized in that, The LED chip is mounted in a flip-chip manner on the die bond area, and the LED chip is fixed on the die bond area by applying solder paste.

6. The flip-chip RGB chip LED according to claim 1, characterized in that, A through hole is formed between the first surface and the second surface. The conductive through hole is formed by filling the through hole with a conductive metal through a metal filling process.

7. The flip-chip RGB LED according to claim 1, characterized in that, In the multi-level steps, the step width gradually increases from the end closer to the LED chip to the end farther away from the LED chip.

8. The flip-chip RGB chip LED according to claim 1, characterized in that, The substrate has marking points on the surface with the pin area.

9. The flip-chip RGB chip LED according to claim 1, characterized in that, The substrate is made of BT resin substrate material.

10. A method for preparing a flip-chip RGB chip LED, characterized in that, The method for preparing the flip-chip RGB CHIP LED according to any one of claims 1 to 9 comprises: A substrate with a die-bonding region and a lead region is provided; An annular groove is made on the outside of the die-bonding area on the surface of the substrate by means of opening holes, and then multiple steps are cut around the substrate by cutting process. Through-holes are formed on a substrate with die-bonding areas, pin areas, and surfaces by drilling, and then the through-holes are filled by metal filling process to form conductive through-holes. By applying solder paste, an LED chip capable of emitting RGB three primary colors is fixed onto the die bonding area. Then, a first encapsulation and a second encapsulation are performed sequentially to form a first encapsulation layer and a second encapsulation layer, respectively, to obtain a flip-chip RGB CHIP LED.

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