Transparent vacuum suction nozzle of bonding chip mounter and chip mounter with suction nozzle

Abstract

The invention discloses a transparent vacuum suction nozzle of a bonding chip mounter and a chip mounter with the suction nozzle, the transparent vacuum suction nozzle of the bonding chip mounter comprises a suction nozzle support, the suction nozzle support is internally provided with a vacuumizing channel, the end part of the suction nozzle support is provided with an assembly hole, the assembly hole is internally provided with a vacuum suction head, and the vacuum suction head is connected with the vacuum suction nozzle. The vacuum suction head is made of transparent and high-temperature-resistant materials, and an adsorption hole is formed in the vacuum suction head and communicated with the vacuumizing channel. The chip mounter comprises the transparent vacuum suction nozzle. According to the transparent vacuum suction nozzle and the chip mounter using the vacuum suction nozzle, a negative pressure or vacuum state is formed in the suction nozzle bracket by vacuumizing the vacuumizing channel so as to adsorb a chip, the chip can be observed by a lens when the suction nozzle adsorbs the chip, the surface of the chip can be observed in time during chip mounting, and reworking is avoided.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a transparent vacuum nozzle for a bonding and placement machine and a placement machine having the nozzle. Background Technology

[0002] In chip packaging, a silicon substrate is placed and fixed on a stage, then a nozzle picks up the chip and mounts it onto the substrate, completing the chip packaging process. In existing pick-and-place machines, the lens cannot see the chip's surface after the nozzle picks it up, and the nozzle is moved to the substrate to mount the chip. Because it's impossible to observe whether the chip surface is damaged or contaminated while being picked up by the nozzle, if damage or contamination is found after mounting, the chip needs to be replaced, posing a challenge to the chip packaging operation. Furthermore, existing pick-and-place machines do not allow observation of the chip surface through the nozzle; the nozzle must be moved away when the lens is close to observe the mounted chip. This post-mounting limitation hinders chip positioning and inspection during production. Summary of the Invention

[0003] The purpose of this invention is to provide a transparent vacuum nozzle for a bonding and placement machine and a placement machine having the nozzle. By evacuating the vacuum channel, a negative pressure or vacuum state is formed inside the nozzle holder to adsorb the chip. When the nozzle adsorbs the chip, the lens can observe the chip through the transparent vacuum nozzle. During placement, the chip surface can be observed in time to avoid rework.

[0004] To solve the above-mentioned technical problems, the technical solution provided by the present invention is: a transparent vacuum nozzle for a bonding and placement machine, including a nozzle support, a vacuum channel inside the nozzle support, an assembly hole at the end of the nozzle support, a vacuum suction head in the assembly hole, the vacuum suction head being made of a transparent, high-temperature resistant material, having an adsorption hole inside, the adsorption hole being connected to the vacuum channel.

[0005] This invention employs the aforementioned technical solution. A vacuum channel is used to connect to a vacuum pumping device. The vacuum channel is evacuated by the device, creating a vacuum or negative pressure state. When the nozzle support moves to the point where its suction hole is close to the chip, the chip is adsorbed onto the suction hole. The nozzle support is used to adsorb and move the chip. The lens of the pick-and-place machine can observe the chip surface through the vacuum nozzle, filtering out defective chips. Furthermore, observing the chip image facilitates chip positioning, improving the production efficiency of the pick-and-place machine for chip packaging.

[0006] The transparent vacuum nozzle of the aforementioned bonding and placement machine has an observation slot on the vacuum head, which is coaxially aligned with the suction hole. A transparent cover is sealed on top of the observation slot. This observation slot allows the lens to pass through the vacuum head more effectively, resulting in clearer image acquisition of the chip.

[0007] The transparent vacuum nozzle of the aforementioned bonding and placement machine has an annular groove in the observation slot. A transparent cover plate seals and fits onto the annular groove, with its surface flush with the nozzle support surface. The annular groove facilitates the installation of the transparent cover plate, and the periphery of the cover plate fits snugly against the outer wall of the annular groove, resulting in a better seal for the observation slot and maintaining the flushness between the cover plate and the nozzle support surface. This prevents the cover plate from protruding from the nozzle support surface, ensuring a relatively flat nozzle support structure.

[0008] The transparent vacuum nozzle of the aforementioned bonding and placement machine has a tapered suction section integrally formed at the bottom end, with a suction hole extending axially through the suction section. The nozzle holder, through the tapered suction section, can better contact the tiny chip, thereby picking it up.

[0009] The transparent vacuum nozzle of the aforementioned bonding and placement machine has a nozzle head with an axially extending adsorption portion attached to the inner surface of the adsorption hole. The nozzle head contains a suction hole communicating with the adsorption hole or observation slot. The axial extension of the nozzle head beyond the adsorption portion further reduces the contact area between the nozzle holder and the chip, achieving better chip positioning and adsorption.

[0010] The transparent vacuum nozzle of the aforementioned bonding and placement machine is made of transparent, high-temperature resistant quartz glass. The quartz glass nozzle head is heat-resistant and can withstand the high temperatures of the environment during chip placement.

[0011] The transparent vacuum nozzle of the aforementioned bonding and placement machine has a positioning hole on the side wall of the assembly hole. This positioning hole is coaxial with the vacuum channel and contains a seal. The positioning hole, located on the side wall, is used to machine the inside of the nozzle holder to form the vacuum channel. The seal is used to seal the positioning hole, maintaining vacuum and negative pressure inside the nozzle holder during vacuuming.

[0012] The transparent vacuum nozzle of the aforementioned bonding and placement machine has a mounting hole at the end of the nozzle holder away from the vacuum head. A nozzle rod is connected to the mounting hole, and the nozzle rod has a vacuum hole that communicates with a vacuum channel. The nozzle rod is located at the end of the nozzle holder and is used to connect a vacuum pump to evacuate the vacuum channel inside the nozzle holder.

[0013] The present invention also provides a chip mounter, including the transparent vacuum nozzle described in any of the above technical solutions.

[0014] The beneficial effects of this invention are as follows: When the nozzle holder picks up the chip, the lens on the pick-and-place machine can observe the picked-up chip through the transparent vacuum nozzle or through the transparent cover, observation slot, and suction hole, ensuring that qualified and effective chips are placed on the silicon substrate and avoiding rework of defective products. By acquiring images from above the chip, a frontal image of the chip is captured. After acquiring the chip image, the pick-and-place machine can easily mark and position it for rapid placement. The lens captures images of the chip from above, allowing placement to be completed without moving the lens. This invention effectively improves the production efficiency of chip placement using pick-and-place machines. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of a transparent vacuum nozzle according to an embodiment of the present invention; Figure 2 This is a cross-sectional structural diagram of a transparent vacuum nozzle according to an embodiment of the present invention; Figure 3 yes Figure 2 A magnified view of the local structure at position A; Figure 4 This is a cross-sectional structural diagram of a transparent vacuum nozzle according to another embodiment of the present invention; Figure 5 yes Figure 4 Enlarged view of the local structure at position B in the middle; Figure 6 This is an exploded structural diagram of a transparent vacuum nozzle according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the lens of the pick-and-place machine corresponding to the transparent vacuum nozzle in a specific implementation of the present invention; Figure 8 yes Figure 7 Enlarged view of the local structure at position C in the middle.

[0016] Explanation of reference numerals in the attached drawings: 1A transparent vacuum nozzle, 1 nozzle bracket, 1a vacuum channel, 1b assembly hole, 11 observation slot, 12 transparent cover plate, 13 suction hole, 14 annular groove, 15 suction part, 16 nozzle head, 17 suction hole, 18 mounting hole, 19 vacuum suction head, 111 positioning hole, 112 seal, 2 nozzle rod, 3 clamp, 4 lens, 2a vacuum hole. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] Reference Figure 1-3As shown, a transparent vacuum nozzle for a bonding and placement machine includes a nozzle support 1. The nozzle support 1 has a vacuum channel 1a inside, and a mounting hole 1b at its end. A vacuum suction head 19 is disposed in the mounting hole 1b. The vacuum suction head 19 is made of a transparent, high-temperature resistant material and has an adsorption hole 13 inside, which communicates with the vacuum channel 1a. The vacuum channel 1a and the adsorption hole 13 communicate, and during vacuuming, the adsorption hole 13 forms a vacuum or negative pressure state, generating an adsorption force to lift the chip located below it. Because the vacuum suction head 19 is made of a transparent material, the lens of the placement machine can observe the image of the chip adsorbed by the adsorption hole 13 through the vacuum suction head 19. The vacuum suction head 19 is made of a high-temperature resistant material, capable of withstanding the high temperatures generated during thermal bonding of chips. Preferably, the vacuum suction head 19 is made of transparent, high-temperature resistant quartz glass. In this design, an assembly hole 1b is formed at the end of the nozzle support 1, and a vacuum nozzle 19 is then inserted into the assembly hole 1b. Sealant is filled between the outer circumferential surface of the vacuum nozzle 19 and the wall of the assembly hole 1b to achieve fixation and sealing. The suction hole 13 of the vacuum nozzle 19 penetrates the bottom of the vacuum nozzle 19 and extends radially outward from the outer wall of the vacuum nozzle 19. When the vacuum nozzle 19 is inserted into the assembly hole 1b, the vacuum channel 1a connects with the suction hole 13 extending outward from the outer wall of the vacuum nozzle 19, thus establishing communication between the two.

[0019] like Figure 4 and Figure 5 As shown, the vacuum suction head 19 is provided with an observation groove 11, which is coaxially arranged with the adsorption hole 13. A transparent cover plate 12 is sealed on the top of the observation groove 11. The transparent cover plate 12 covers the observation groove 11 and ensures a seal. When a vacuum is drawn, a sealed environment is formed inside the observation groove 11 to form a vacuum or negative pressure state, so that the adsorption hole 13 has an adsorption force to pick up the chip.

[0020] Furthermore, combined Figure 6 As shown, the observation slot 11 has an annular groove 14, and a transparent cover plate 12 is sealed and fitted onto the annular groove 14, with the surface of the transparent cover plate 12 flush with the surface of the nozzle support 1. When the transparent cover plate 12 is set, its edge is attached to the groove wall of the annular groove 14, and it can be fixed and sealed by filling with sealant. During the chip picking and moving process, the lens of the pick-and-place machine can observe the chip through the transparent cover plate 12, the observation slot 11, and the suction hole 13, thus screening out defective products and improving product quality.

[0021] The vacuum suction head 19 has a tapered suction section 15 integrally formed at its bottom end, extending downwards. A suction hole 13 axially penetrates the suction section 15. The tapered suction section 15 can better position and contact the small chip, thus better picking it up. Furthermore, a suction nozzle 16 extending axially from the suction section 15 is attached to the inner surface of the suction hole 13. The suction nozzle 16 has a suction hole 17 communicating with the suction hole 13 or the observation slot 11. In practice, the vacuum equipment evacuates the vacuum channel 1a. The suction hole 17 communicates with the suction hole 13 or the observation slot 11, achieving vacuuming inside the nozzle support 1, creating a vacuum or negative pressure state. The suction hole 17 of the suction nozzle 16 has suction force, enabling it to pick up the chip when it approaches it. After picking up the chip, the lens of the pick-and-place machine can observe the surface of the adsorbed chip through the transparent cover plate 12, the observation slot 11, the suction hole 13, and the suction hole 17, allowing for a direct assessment of chip defects and ensuring the quality of the pick-and-place process.

[0022] In this embodiment, the suction head 16 is made of transparent, high-temperature resistant quartz glass. Sealant can be applied to the outer circumferential surface of the suction head 16, which is then inserted into the adsorption hole 13 and sealed to it, while simultaneously being fixed in place by the adhesive. Alternatively, the suction head 16 can be made of acrylic, using either quartz glass or acrylic, with a light transmittance of 70%-80% or higher.

[0023] The side wall of the assembly hole 1b is provided with a positioning hole 111, which is coaxially opposite to the vacuum channel 1a. A sealing element 112 is provided in the positioning hole 111. During processing, the drill bit can pass through the positioning hole 111 in the side wall of the observation slot 11 to make a hole in the nozzle support 1, and the hole formed forms the vacuum channel 1a. The positioning hole 111 facilitates the opening of the vacuum channel 1a in the nozzle support 1. During use, the sealing element 112 is provided in the positioning hole 111 to ensure a sealed environment inside the observation slot 11. First, the positioning hole 111 is opened in the side wall of the assembly hole 1b, and then the drill bit is inserted into the positioning hole 111 to open a hole inside the nozzle support 1. This hole forms the vacuum channel 1a, which is coaxially opposite to the positioning hole 111. Furthermore, the end of the nozzle holder 1 furthest from the vacuum head 19 is provided with a mounting hole 18, through which a nozzle rod 2 is connected. The nozzle rod 2 is provided with a vacuum hole 2a, which communicates with the vacuum channel 1a. The nozzle rod 2 is used to connect to a vacuuming device. Through its vacuum hole 2a and the vacuum channel 1a, the vacuuming device evacuates the vacuum channel 1a inside the nozzle holder 1, thereby adsorbing the chip.

[0024] The present invention also discloses a pick-and-place machine, including the transparent vacuum nozzle described in the above embodiments. The pick-and-place machine uses the transparent vacuum nozzle to pick up the chip, moves the chip to the placement station, and then moves it into the lens. The lens can observe the chip surface and outline through the transparent cover plate 12, the observation slot 11, the suction hole 13, and the nozzle head 16, which is beneficial for taking surface images and overall outline images of the chip, and facilitates chip positioning.

[0025] like Figure 7 , 8 As shown, the transparent vacuum nozzle 1A is embedded in the fixture 3. The lens 4 of the pick-and-place machine is aligned with the transparent vacuum nozzle 1A from directly above it. The lens 4 is equipped with an industrial camera that can collect the surface information and contour of the adsorbed chip to generate an image.

[0026] In this embodiment, the transparent cover plate 12, the observation groove 11, the adsorption hole 13, and the suction hole 17 are coaxial, forming an optical channel through which the lens observes the chip surface.

[0027] In summary, as described in the specification and figures, the present invention has been manufactured into actual samples and subjected to multiple usage tests. The results of these tests demonstrate that the present invention achieves its intended purpose, and its practical value is undeniable. The embodiments described above are merely illustrative examples and are not intended to limit the present invention in any way. Any person skilled in the art who makes partial modifications or alterations to the technical content disclosed in the present invention, without departing from the scope of the technical features of the present invention, shall still fall within the scope of the technical features of the present invention.

Claims

1. A transparent vacuum nozzle for a bonding and placement machine, comprising a nozzle holder (1), characterized in that: The nozzle support (1) has a vacuum channel (1a) inside and an assembly hole (1b) at the end of the nozzle support (1). A vacuum suction head (19) is provided in the assembly hole (1b). The vacuum suction head (19) is made of transparent, high-temperature resistant material and has an adsorption hole (13) inside. The adsorption hole (13) is connected to the vacuum channel (1a).

2. The transparent vacuum nozzle of the bonding and placement machine according to claim 1, characterized in that: The vacuum suction head (19) is provided with an observation groove (11), which is coaxially arranged with the adsorption hole (13), and a transparent cover plate (12) is sealed on the top of the observation groove (11).

3. The transparent vacuum nozzle of the bonding and placement machine according to claim 2, characterized in that: The observation slot (11) is provided with an annular groove (14), and the transparent cover plate (12) is sealed and covered on the annular groove (14). The surface of the transparent cover plate (12) is flush with the surface of the suction nozzle bracket (1).

4. The transparent vacuum nozzle of the bonding and placement machine according to any one of claims 1-3, characterized in that: The bottom end of the vacuum suction head (19) is integrally formed with a tapered adsorption part (15) extending downward, and the adsorption hole (13) penetrates the adsorption part (15) axially.

5. The transparent vacuum nozzle of the bonding and placement machine according to claim 4, characterized in that: The inner surface of the adsorption hole (13) is fitted with a suction head (16) that extends axially out of the adsorption part (15), and the suction head (16) has a suction hole (17) that connects to the adsorption hole (13) or the observation groove (11).

6. The transparent vacuum nozzle of the bonding and placement machine according to claim 5, characterized in that: The suction head (16) is made of transparent, high-temperature resistant quartz glass.

7. The transparent vacuum nozzle of the bonding and placement machine according to claim 1 or 2, characterized in that: The side wall of the assembly hole (1b) is provided with a positioning hole (111), which is coaxial with the vacuum channel (1a) and a sealing element (112) is provided in the positioning hole (111).

8. The transparent vacuum nozzle of the bonding and placement machine according to claim 1, characterized in that: The nozzle support (1) has a mounting hole (18) at the end away from the vacuum head (19). A nozzle rod (2) is connected in the mounting hole (18). The nozzle rod (2) has a vacuum hole (2a) that is connected to the vacuum channel (1a).

9. A pick-and-place machine, characterized in that: The pick-and-place machine includes the transparent vacuum nozzle described in any one of claims 1-8.

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