Bearing device, semiconductor process equipment, control method and controller

Abstract

The invention provides a bearing device, semiconductor process equipment, a control method and a controller, and relates to the technical field of semiconductors. The bearing device comprises a carrying table, an ejector pin, a lifting assembly and an anti-collision detection assembly, and the carrying table is provided with a pin hole; the ejector pin is inserted into the pin hole; the lifting assembly is in transmission connection with the ejector pin and is configured to drive the ejector pin to do lifting motion so as to upwards extend out of or downwards retract into the pin hole; the anti-collision detection assembly is provided with a detection part, and the detection part is configured to detect whether the ejector pin has a side collision risk in the early warning area 20A or not; wherein the projection of the early warning area in the vertical direction is located in an annular area between the pin hole and the ejector pin in the normal working state, and the height of the top end of the early warning area is consistent with that of the top end of the ejector pin. The bearing device can effectively detect the side collision risk of the ejector pin, so that the side collision damage to the ejector pin is reduced, the ejector pin is protected, and the use of the ejector pin is ensured.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a carrier device, semiconductor process equipment, control method, and controller. Background Technology

[0002] In semiconductor manufacturing processes, ejector pins work in conjunction with robotic arms via lifting and lowering movements to transfer and process wafers. For example, when the robotic arm carries a wafer into the reaction chamber, the ejector pin rises from the bottom of the electrostatic chuck through the ejector pin hole, receives the wafer from the robotic arm, and then descends, allowing the wafer to settle stably on the electrostatic chuck for processing. After processing, the ejector pin rises again to lift the wafer off the electrostatic chuck, and the robotic arm then removes the wafer. During this process, the ejector pin must move accurately and frictionlessly through the ejector pin hole of the electrostatic chuck and without collision with the robotic arm to ensure the smooth operation of the automated wafer transfer process. Otherwise, there is a risk of ejector pin damage or breakage, or even wafer shattering within the chamber.

[0003] In related technologies, to reduce impact damage to the ejector pins, detection components are installed at the wafer feed path. During the process of the robotic arm carrying the wafer into the process chamber, the system detects whether the left and right movement trajectories of the wafer are symmetrical and identical to the fixed trajectory to determine if there is any misalignment between the robotic arm and the wafer. This method can only determine whether there is a horizontal misalignment between the wafer and the robotic arm. Its vertical misalignment depends on the accuracy of the fixed height at which the robotic arm carries the wafer. When the height of the robotic arm carrying the wafer decreases as it enters the chamber, or when the etching machine program malfunctions and the robotic arm picks up the wafer, the wafer may collide with the ejector pin, resulting in ejector pin damage and chamber fragmentation. In addition, if the ejector pin is misaligned due to mechanical tolerances or improper installation, it may rub against and collide with the inner wall of the electrostatic chuck hole during its ascent, damaging the three pins. Related technologies cannot completely prevent this collision. Summary of the Invention

[0004] The purpose of this invention is to provide a carrier device, semiconductor process equipment, control method, and controller to solve at least one of the above-mentioned technical problems.

[0005] To address the above problems, the present invention provides a supporting device, comprising:

[0006] The platform has pinholes;

[0007] A pin is inserted into the needle hole;

[0008] A lifting assembly, drivenly connected to the ejector pin, is configured to: drive the ejector pin to move up and down, so as to extend upward or retract downward through the pinhole; and,

[0009] A collision avoidance detection component has a detection unit configured to detect whether there is a side collision risk in the warning area for the pin.

[0010] The warning area is projected vertically into an annular region between the pinhole and the pin in normal operation, and the top of the warning area is at the same height as the top of the pin.

[0011] Optionally, the detection unit is located below the warning area.

[0012] Optionally, the detection unit includes an optical distance detector head, the detection optical path of which extends vertically and passes through the warning area, configured to detect whether there are obstacles in the warning area that block the propagation of the detection light.

[0013] Optionally, the optical distance detector has multiple probes arranged circumferentially along the annular region, wherein the circumferential arrangement satisfies the following condition: when the pin is deflected and the tip of the pin does not reach the area where the inner wall of the pinhole is located, the vertical projection of the tip of the pin at least partially falls into the detection area of ​​at least one of the optical distance detectors.

[0014] Optionally, the outer contour of the detection area of ​​the optical distance probe is adjacent to the outer side wall of the pin in normal working condition.

[0015] Optionally, the optical distance detectors are multiple and arranged circumferentially along the annular region, and the minimum distance between two adjacent optical distance detectors is less than the diameter of the pin.

[0016] Optionally, the plurality of optical distance detectors are arranged at uniform intervals along the circumference of the annular region.

[0017] Optionally, the optical distance probe is fixedly connected to the lower needle segment of the pin.

[0018] Optionally, the optical distance probe is an optical fiber probe, which is configured to emit modulated light waves into the annular region.

[0019] Optionally, the anti-collision detection component includes an annular seat, the vertical projection of which surrounds the pin in normal working condition; the optical distance detection head is disposed on the annular seat.

[0020] Optionally, the annular seat is fixedly sleeved on the lower needle segment of the ejector pin.

[0021] Optionally, the annular seat is an elastic element.

[0022] Optionally, the lifting assembly includes a drive base, the drive base having a cantilever extending radially along the pin hole, and the bottom end of the ejector pin being connected to the cantilever.

[0023] The annular seat includes an inner ring portion and an outer ring portion along its radial direction, the bottom of the inner ring portion is suspended, and the outer ring portion is fixed to the drive seat.

[0024] Optionally, the drive seat has a hollow interior forming a receiving cavity, and the top of the receiving cavity is open; the cantilever is disposed on the side wall of the receiving cavity, the ejector pin extends into the receiving cavity from the open and is connected to the cantilever; the outer ring is connected to the top surface of the receiving cavity.

[0025] Optionally, the optical distance probe is an optical fiber probe, and the bottom of the drive base is provided with a first connecting hole that connects to the accommodating cavity. The optical fiber segment of the optical fiber probe passes through the accommodating cavity and extends downward through the first connecting hole, and the optical fiber segment is sealed to the first connecting hole.

[0026] Optionally, the lifting assembly further includes an outer cylinder, the axial direction of which is consistent with the axial direction of the pinhole, and a second connecting hole is provided at the bottom of the outer cylinder; the drive seat is slidably inserted into the outer cylinder along the axial direction of the outer cylinder, the optical fiber segment extends downward through the second connecting hole, and the optical fiber segment is sealed to the second connecting hole.

[0027] Optionally, the drive seat is fixedly connected to a fixing sleeve, and the top of the fixing sleeve extends radially inward with a pressure ring protruding from the inner sidewall of the fixing sleeve;

[0028] An elastic sleeve is sandwiched between the fixed sleeve and the annular seat. The top end of the elastic sleeve extends radially inward and has an elastic ring protruding from the inner sidewall of the elastic sleeve. The elastic ring is sandwiched between the annular seat and the pressure ring.

[0029] Optionally, the retaining sleeve is inserted into the pinhole.

[0030] Optionally, the lifting assembly includes a drive seat, and the bottom end of the ejector pin is tractively connected to the drive seat; the pin hole includes a first hole segment and a second hole segment arranged coaxially from top to bottom, the diameter of the second hole segment is larger than that of the first hole segment, and the first hole segment is configured to accommodate the ejector pin, and a limiting part is formed at the connection between the first hole segment and the second hole segment to limit the upward movement of the drive seat.

[0031] The present invention also provides a semiconductor process apparatus, comprising:

[0032] The aforementioned supporting device;

[0033] A robotic arm is configured to: transfer a wafer to a pin of the carrier device, or remove a wafer carried on the pin; and,

[0034] The controller, which is communicatively connected to the lifting assembly and anti-collision detection assembly of the robotic arm and the carrying device, is configured to control the operating status of the robotic arm and the lifting assembly based on the anti-collision detection signal fed back by the anti-collision detection assembly.

[0035] The present invention also provides a control method for preventing damage to the ejector pin, applied to the above-mentioned bearing device, the control method comprising:

[0036] Control the carrier device to enter wafer transfer mode;

[0037] Acquire collision avoidance detection signals;

[0038] The collision detection signal is used to determine whether the pin is at risk of side impact.

[0039] If so, the carrier device is controlled to exit the wafer transfer mode.

[0040] Optionally, the detection unit includes an optical distance detector, and the optical distance signal measured by the optical distance detector is used as the anti-collision detection signal; the step of determining whether the pin has a collision risk based on the anti-collision detection signal includes:

[0041] The measured distance value represented by the optical distance signal is compared with the actual distance value between the optical distance probe and the tip of the pin;

[0042] If the measured distance value is greater than or equal to the actual distance value, then it is determined that the pin does not pose a risk of collision.

[0043] If the measured distance value is less than the actual distance value, then it is determined that the pin is at risk of collision.

[0044] Optionally, when the wafer transfer mode is a rising pin stage or a falling pin stage, the step of controlling the carrier device to exit the wafer transfer mode includes:

[0045] The control lifting component drives the ejector pin to descend to the first preset position.

[0046] Optionally, when the wafer transfer mode is the wafer feeding stage or wafer retrieval stage in which the carrier device and the robot cooperate to feed and retrieve wafers, the step of controlling the carrier device to exit the wafer transfer mode includes:

[0047] The control lifting assembly drives the ejector pin to descend to the first preset position, and controls the robotic arm to retract to the second preset position.

[0048] The present invention also provides a controller, including a processor and a memory, wherein the memory stores computer instructions, and the processor executes the above-described control method by executing the computer instructions.

[0049] The present invention also provides a computer-readable storage medium storing a computer program, which is read and executed by a controller to implement the above-described control method.

[0050] The carrier device provided by this invention, in wafer transfer mode, utilizes an anti-collision detection component to detect the presence of side-collision risk in the warning area on the side of the ejector pin. This effectively detects the risk of side-collision caused by ejector pin misalignment, thereby reducing the possibility of side-collision damage to the ejector pin due to misalignment and the hole sidewall. Furthermore, it effectively detects the risk of side-collision caused by robot arm height and horizontal deviations, as well as program malfunctions that cause the robot arm to pick up or remove wafers, thereby reducing the possibility of side-collision damage to the robot arm or wafer during wafer transfer. Consequently, it provides an early warning function for the side-collision risk of the ejector pin, effectively reducing side-collision damage to the ejector pin, protecting it, and ensuring its usability.

[0051] The semiconductor process equipment provided by the present invention uses the above-mentioned carrier device, including all the beneficial effects of the carrier device, which will not be repeated here.

[0052] The control method for preventing damage to the ejector pin provided by the present invention is applied to the above-mentioned support device and has all the beneficial effects of the support device, which will not be elaborated here. Attached Figure Description

[0053] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0054] Figure 1 This is a front view diagram of a wafer passing through an inner gate in a related technology;

[0055] Figure 2 This is a side view schematic diagram of a robotic arm carrying a wafer through an inner door in a related technology.

[0056] Figure 3 This is a partial cross-sectional view of the support device provided in an embodiment of the present invention, wherein the ejector pin is retracted into the pin hole and is in normal working condition;

[0057] Figure 4 for Figure 3 A diagram illustrating how the tip of the central pin deflects and enters the warning zone.

[0058] Figure 5This is a cross-sectional view of a robotic arm carrying a wafer and feeding it into a ejector pin in a semiconductor process equipment provided in an embodiment of the present invention.

[0059] Figure 6 A cross-sectional schematic diagram of a robotic arm in a semiconductor process equipment provided in an embodiment of the present invention, wherein the robotic arm carries and feeds the wafer into a warning area at a height lower than the ejector pin, so that the wafer enters the warning area.

[0060] Figure 7 This is a schematic diagram of a first form of the anti-collision detection component in the carrier device provided in an embodiment of the present invention, wherein the optical distance detection head is tangent to the outer wall of the pin;

[0061] Figure 8 This is a schematic diagram of a second form of the anti-collision detection component in the carrier device provided in an embodiment of the present invention, wherein the optical distance detection head and the outer side wall of the pin are spaced apart;

[0062] Figure 9 This is a schematic diagram of the ranging principle when the optical distance probe in the carrier device provided in this embodiment of the invention uses an optical fiber probe;

[0063] Figure 10 This is a schematic diagram of one arrangement of the pin, optical distance detector, and pinhole in the carrier device provided in an embodiment of the present invention;

[0064] Figure 11 This is a flowchart illustrating a first control method provided according to an embodiment of the present invention;

[0065] Figure 12 This is a flowchart illustrating a second control method provided according to an embodiment of the present invention;

[0066] Figure 13 This is a flowchart illustrating a third control method provided according to an embodiment of the present invention.

[0067] Explanation of reference numerals in the attached figures:

[0068] 10-Robot; 20-Wafer; 30-Process Chamber; 40-Transfer Chamber; 50-Inner Door; 60-Laser Inspection Component; 61-Laser Emitter; 62-Laser Receiver; 100-Stage; 110-Pinhole; 111-First Hole Segment; 112-Second Hole Segment; 10A-Annular Region; 200-Ejector Pin; 20A-Warning Region; 300-Lifting Component; 310-Drive Base; 311-Accommodation Cavity; 312-First Connecting Hole; 313-First Sealing Block; 320-Cantilever ; 330-Outer cylinder; 331-Second connecting hole; 332-Second sealing block; 340-Fixing sleeve; 341-Pressure ring; 350-Elastic sleeve; 351-Elastic ring; 360-Belling pipe; 400-Anti-collision detection assembly; 410-Detection part; 411-Optical distance detection head; 412-Fiber optic segment; 40A-Detection light; 41A-Incident light; 41B-Reflected light; 40B-Contour circle; 40C-Obstacle; 420-Annular seat; 421-Inner ring part; 422-Outer ring part. Detailed Implementation

[0069] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0070] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0071] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0072] Among the technologies related to reducing the collision risk of the ejector pin 200, such as Figure 1 and Figure 2As shown, an inner door 50 is provided between the transmission chamber 40 and the process chamber 30. Two sets of laser detection components 60 are arranged at the inner door 50, symmetrically about the inner door 50. Each laser detection component 60 includes a laser emitter 61 located at the top of the inner door 50 and a laser receiver 62 located at the bottom of the inner door 50 and directly below the laser emitter 61. During the process of the robotic arm 10 carrying the wafer 20 into the process chamber 30 through the inner door 50, when the wafer 20... When the robot passes through the inner door 50, the left and right sides of the wafer 20 will block the laser propagation on the corresponding sides. The duration of the two sets of laser detection components 60 being blocked by the left and right sides of the wafer 20 is obtained. When the blocking duration of the two sets of laser detection components 60 is equal, it indicates that there is no horizontal offset between the robot 10 and the wafer 20. When the blocking duration of the two sets of laser detection components 60 is different, it indicates that there is a horizontal offset between the wafer 20 and the robot 10. The horizontal offset of the robot 10 is further determined by the two sets of blocking durations.

[0073] This method can only determine whether there is a horizontal offset between the wafer 20 and the robot arm 10. Its vertical direction depends on the accuracy of the fixed height at which the robot arm 10 carries the wafer 20. When the height at which the robot arm 10 carries the wafer 20 decreases or when the etching machine program malfunctions and the robot arm 10 picks up the wafer, the wafer 20 may collide with the ejector pin 200, resulting in damage to the ejector pin 200 and fragmentation of the chamber. In addition, in related technologies, if the ejector pin 200 is misaligned due to mechanical tolerances or improper installation, the ejector pin 200 may rub and collide with the inner wall of the pin hole 110 during the process of rising, thus damaging the ejector pin 200. Related technologies cannot avoid the above-mentioned ejector pin collision.

[0074] The carrier device provided in this embodiment of the invention can effectively detect the side impact risk of the ejector pin 200 in wafer transfer mode. Specifically, this includes side impact risks caused by ejector pin 200 misalignment, side impact risks caused by robot arm 10 height deviation, side impact risks caused by robot arm 10 horizontal deviation, and side impact risks caused by robot arm 10 carrying and picking up wafers due to program malfunctions, thereby reducing side impact damage to the ejector pin 200 during operation. For ease of understanding, the technical solutions provided by various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0075] This invention provides a supporting device, such as... Figure 3 As shown, the device includes a platform 100, a pin 200, a lifting assembly 300, and an anti-collision detection assembly 400. The platform 100 has a pinhole 110; the pin 200 is inserted into the pinhole 110; the lifting assembly 300 is connected to the pin 200 and configured to drive the pin 200 to move up and down, extending upwards or retracting downwards into the pinhole 110. Figure 7 and Figure 8As shown, the collision avoidance detection component 400 has a detection unit 410, which is configured to detect whether there is a side collision risk in the warning area 20A for the pin 200; wherein, the vertical projection of the warning area 20A is located in the annular area 10A between the pin hole 110 and the pin 200 in normal working condition, and the top of the warning area 20A is at the same height as the top of the pin 200.

[0076] This invention also provides a semiconductor process apparatus, such as... Figure 5 and Figure 6 As shown, the device includes a robotic arm 10, a controller (not shown), and the aforementioned carrier device. The robotic arm 10 is configured to transfer the wafer 20 to the ejector pin 200 of the carrier device, or to remove the wafer 20 carried on the ejector pin 200. The controller is communicatively connected to the robotic arm 10 and the lifting assembly 300 and the anti-collision detection assembly 400 of the carrier device, and is configured to control the operating state of the robotic arm 10 and the lifting assembly 300 according to the anti-collision detection signal fed back by the anti-collision detection assembly 400.

[0077] The carrier device provided in this embodiment of the invention is applied in semiconductor process equipment, such as... Figure 3 As shown, when the axis of the ejector pin 200 extends vertically, that is, when the axis of the ejector pin 200 is collinear with or parallel to the axis of the pin hole 110, the ejector pin 200 is in normal working condition. At this time, the outer wall of the ejector pin 200 and the inner wall of the pin hole 110 form an annular region 10A; as shown Figure 3 and Figure 5 As shown, the outer area of ​​the ejector pin 200 in normal working condition is set as the warning area 20A. The vertical projection of the warning area 20A is located within the annular area 10A, and the warning area 20A moves up and down synchronously with the ejector pin 200, always keeping the top of the warning area 20A at the same height as the top of the ejector pin 200.

[0078] The warning area 20A is located between the vertical ejector pin 200 and the pinhole 110. When the ejector pin 200 is tilted relative to the vertical direction, the tip of the ejector pin 200 must pass through the warning area 20A to contact the sidewall of the pinhole 110 and cause a side collision. Correspondingly, in wafer transfer mode, such as Figure 4As shown, when the ejector pin 200 deviates vertically to a degree sufficient to cause its tip to enter the warning area 20A, the detection unit 410 detects the obstacle entering the warning area 20A. This determines that the ejector pin 200 poses a side-impact risk in the warning area 20A before colliding with the hole sidewall. Since the ejector pin 200 has a high probability of side-impact damage to its tip against the hole sidewall during its vertical movement relative to the pinhole 110, this risk is mitigated by the ejector pin 200's deviated position. The side impact risk warning system serves as an early warning mechanism. The anti-collision detection component feeds back the anti-collision detection signal to the controller. When the controller determines that there is a side impact risk to the ejector pin 200 based on the anti-collision detection signal, it controls the lifting component 300 to stop lifting the ejector pin 200 or to lower the ejector pin 200 to its initial position for maintenance. This effectively reduces the possibility of side impact damage to the ejector pin 200 due to deflection against the hole sidewall, thus protecting the ejector pin 200 and ensuring its usability.

[0079] Similarly, as the robotic arm 10 and wafer 20 approach the ejector pin 200, they must first pass through the warning area 20A before contacting the side wall of the ejector pin 200 and colliding with it; correspondingly, in wafer transfer mode, such as Figure 6 As shown, when the height of the robotic arm 10 is lower than that of the ejector pin 200 during the process of feeding the wafer 20, when the robotic arm 10 moves horizontally to the warning area 20A during the process of picking up the wafer from the ejector pin 200, or when a program malfunction causes the robotic arm 10 to pick up the wafer 20, as the robotic arm 10 and the wafer 20 approach the ejector pin 200, the robotic arm 10 and the wafer 20 first enter the warning area 20A. The detection unit 410 detects the obstacle entering the warning area 20A, thereby determining that there is a risk of side collision between the ejector pin 200 and the robotic arm 10 or the wafer 20 before the ejector pin 200 sides collides with the ejector pin 200. This warns that if the robotic arm 10 or the wafer 20 continues to move forward, it will cause the ejector pin to collide with the ejector pin. The system 200 causes side impact damage, thus providing an early warning of the risk of side impact to the ejector pin 200 due to height or horizontal deviation of the robotic arm 10, as well as program malfunctions causing the robotic arm 10 to pick up and carry wafers. Specifically, the anti-collision detection component feeds back the anti-collision detection signal to the controller. When the controller determines that there is a risk of side impact to the ejector pin 200, it controls the robotic arm 10 to stop moving forward or retreat to its initial position for maintenance. This effectively reduces the possibility of side impact damage to the robotic arm 10 or the wafer 20 during the process of the ejector pin 200 and the robotic arm 10 working together to transfer the wafer 20, thereby further protecting the ejector pin 200 and ensuring its usability.

[0080] Accordingly, in wafer transfer mode, such as Figure 3 and Figure 5As shown, when the tip of the ejector pin 200 is not tilted vertically or the tilt is too small to enter the warning area 20A, and at the same time, the ejector pin 200 and the robot arm 10 do not cooperate, the height of the robot arm 10 is higher than the ejector pin 200 during the process of feeding the wafer 20, or the robot arm 10 does not shift horizontally to the warning area 20A during the wafer picking process, the detection unit 410 cannot detect the obstacle entering the warning area 20A, thus determining that there is no risk of side collision for the ejector pin 200 in the warning area 20A; the anti-collision detection component 400 feeds back the anti-collision detection signal to the controller, the controller determines that there is no risk of side collision for the ejector pin 200, and accordingly controls the lifting component 300 and the robot arm 10 to maintain the current normal operation, and the wafer transfer mode proceeds normally.

[0081] As can be seen, by using the carrier device provided in this embodiment of the invention, in wafer transfer mode, the anti-collision detection component 400 can effectively detect the side collision risk caused by the deviation of the ejector pin 200 by detecting whether there is a side collision risk in the warning area 20A on the side of the ejector pin 200, thereby reducing the side collision damage of the ejector pin 200 to the hole sidewall due to deviation; and effectively detect the side collision risk caused by the robot arm 10 carrying and picking up wafers due to height deviation, horizontal deviation, and program failure of the ejector pin 200, thereby reducing the side collision damage to the robot arm 10 or the wafer 20 during the transfer of wafer 20 between the ejector pin 200 and the robot arm 10; accordingly, it plays a warning role for the side collision risk of the ejector pin 200, effectively reduces the side collision damage to the ejector pin 200, protects the ejector pin 200, and ensures the use of the ejector pin 200.

[0082] Specifically, the semiconductor process equipment can be an etching machine or a deposition equipment, and the carrier device can be in the form of an electrostatic chuck; the carrier device can be located in the process chamber 30 of the semiconductor process equipment, and the robot 10 can be located in the transfer chamber 40 of the semiconductor process equipment; or, the carrier device can be located in the transfer chamber 40 of the semiconductor process equipment, and the stage 100 serves as the base of the transfer chamber 40, and the robot 10 is located on the stage 100; or any other semiconductor process equipment involving the cooperation of the ejector pin 200 and the robot 10 to transfer the wafer 20 is acceptable, and no limitation is made here.

[0083] Using the aforementioned carrier device or semiconductor process equipment, embodiments of the present invention also provide a control method for preventing damage to ejector pins. Figure 11 This is a flowchart illustrating a first control method provided according to an embodiment of the present invention. Figure 11 As shown, the control method includes:

[0084] S102 controls the carrier device to enter wafer transfer mode.

[0085] S104 acquires collision avoidance detection signals.

[0086] S106 determines whether there is a risk of side impact on the pin based on the collision detection signal; if yes, proceed to step S108; if no, proceed to S104.

[0087] S108 controls the carrier device to exit wafer transfer mode.

[0088] The specific operations and effects of steps 102-108 have been described above, and the control method has all the beneficial effects of the aforementioned carrier device and semiconductor process equipment, so they will not be repeated here.

[0089] Specifically, the operation phases of the ejector pin 200 in wafer transfer mode include:

[0090] Initial stage: The ejector pin 200 retracts to its initial position within the pinhole 110.

[0091] In the lifting stage: the lifting assembly 300 drives the ejector pin 200 to move upward and extend out of the pin hole 110 to reach the receiving position to carry the wafer 20 to be processed; or, the lifting assembly 300 drives the ejector pin 200 to move upward and extend out of the pin hole 110 to reach the delivery position to lift the wafer 20 that has completed the process processing.

[0092] Wafer delivery stage: The ejector pin 200 remains in the receiving position to receive the wafer 20 transferred by the robot arm 10.

[0093] Lowering stage: The lifting assembly 300 drives the ejector pin 200 to move downward to the initial position so as to place the wafer 20 to be processed on the stage 100; or, the lifting assembly 300 drives the empty ejector pin 200 to move downward back to the initial position.

[0094] Wafer removal stage: The ejector pin 200 remains in the delivery position to transfer the completed wafer 20 it carries to the robot arm 10.

[0095] In the initial stage, the rising stage, the wafer feeding stage, the descending stage, and the wafer removal stage, if the tip of the ejector pin 200 is deflected, it may cause the ejector pin 200 to collide with the side wall of the pinhole 110 during the rising and descending stages. Accordingly, the anti-collision detection component 400 detects whether the tip of the ejector pin 200 is deflected to the warning area 20A in the above stages, thereby realizing the detection and warning of the risk of side collision caused by the deflection of the ejector pin 200.

[0096] Accordingly, in this embodiment of the invention, when the wafer transfer mode is in the rising or falling pin stage, step S108, controlling the carrier device to exit the wafer transfer mode, includes: controlling the lifting assembly 300 to drive the ejector pin 200 to descend to a first preset position. Specifically, the first preset position can be the initial position where the ejector pin 200 retracts into the pinhole 110 before entering the wafer transfer mode, in order to reduce the occurrence of side impact damage between the ejector pin 200 and the sidewall of the pinhole 110, thereby reducing the risk of side impact of the ejector pin 200 and facilitating the maintenance of the ejector pin 200.

[0097] The wafer feeding stage and wafer removal stage involve the ejector pin 200 and the robot arm 10 cooperating to transfer the wafer 20. During the wafer feeding stage, if the height of the robot arm 10 carrying the wafer 20 is lower than that of the ejector pin 200, a side collision may occur between the wafer 20 and the ejector pin 200. During the wafer removal stage, if a program malfunction causes the robot arm 10 to remove the wafer 20, a side collision may occur between the wafer 20 and the ejector pin 200; similarly, if the robot arm 10 horizontally deviates into the warning area 20A, a side collision may occur between the robot arm 10 and the ejector pin 200. Accordingly, the anti-collision detection component 400 detects whether the robot arm 10 and the wafer 20 enter the warning area 20A during both stages, thereby detecting and warning of the risk of side collisions caused by the robot arm 10 carrying and removing wafers due to height or horizontal deviations of the robot arm 10, or program malfunctions.

[0098] Accordingly, in this embodiment of the invention, when the wafer transfer mode is the wafer feeding stage or wafer retrieval stage in which the carrier device and the robot 10 cooperate to deliver and retrieve the wafer 20, step S108 controls the carrier device to exit the wafer transfer mode, including: controlling the lifting component 300 to drive the ejector pin 200 to descend to a first preset position, and controlling the robot 10 to retract to a second preset position. Specifically, the second preset position can be the initial position before the robot 10 enters the wafer transfer mode, with the ejector pin 200 retracted into the pin hole 110 to reduce side impact damage caused by the ejector pin 200 colliding with the side wall of the pin hole 110; the robot 10 retracts away from the ejector pin 200 and retracts to the initial position to effectively reduce side impact damage to the ejector pin 200 caused by the robot 10 and the wafer 20, thereby reducing the side impact risk of the ejector pin 200 and facilitating the maintenance of the ejector pin 200 and the robot 10.

[0099] In this embodiment of the invention, the detection unit 410 is located below the warning area 20A. The detection unit 410 detects the warning area 20A from bottom to top, ensuring that the robot arm 10 and the wafer 20 will not obstruct the warning area 20A during the entire operation phase of the ejector pin 200: the initial phase, the rising phase, the wafer feeding phase, the descending phase, and the wafer removal phase. Correspondingly, the anti-collision detection component 400 can always maintain effective detection of the warning area 20A, meaning that the anti-collision detection component 400 can effectively detect the side-impact risk present in the ejector pin 200 throughout its entire operation phase. This improves the comprehensiveness of the anti-collision detection component's detection of the side-impact risk of the ejector pin 200, and further reduces the side-impact damage to the ejector pin 200 during wafer transfer mode.

[0100] Of course, in some other embodiments, the detection unit 410 may also be located above the warning area 20A, such as on the top wall of the process chamber 30. In this case, when the robot arm 10 and the wafer 20 are not obstructed between the detection unit 410 and the warning area 20A, i.e., during the initial stage, the rising pin stage, the falling pin stage, and the wafer feeding stage and the wafer taking stage, when the robot arm 10 and the wafer 200 have not reached above the ejector pin 200, the detection unit 410 can detect the side collision risk caused by the ejector pin 200 being tilted. When the robot arm 10 and the wafer 20 normally reach above the ejector pin 200 during the wafer feeding stage and the wafer taking stage, and the wafer 20 is obstructed between the detection unit 410 and the warning area 20A, the detection unit 410 cannot detect the side collision risk caused by the ejector pin 200 being tilted, and can only detect the side collision risk caused by the robot arm 10 and the wafer 20.

[0101] In embodiments of the present invention, such as Figure 7 and Figure 8 As shown, the detection unit 410 includes an optical distance detector 411. The detection light 40A of the optical distance detector 411 extends vertically and passes through the warning area 20A, configured to detect whether there are obstacles blocking the propagation of the detection light 40A within the warning area 20A. The optical distance signal measured by the optical distance detector 411 serves as a collision avoidance detection signal. Correspondingly, in step S106, the step of determining whether the pin 200 has a collision risk based on the collision avoidance detection signal includes: comparing the measured distance value represented by the optical distance signal with the actual distance value between the optical distance detector 411 and the tip of the pin 200; if the measured distance value is greater than or equal to the actual distance value, it is determined that the pin 200 has no collision risk; if the measured distance value is less than the actual distance value, it is determined that the pin 200 has a collision risk.

[0102] The detection unit 410 uses an optical distance detector 411. In use, the vertical distance between the optical distance detector 411 and the top of the pin 200, i.e. the top of the warning area 20A, is taken as the actual distance value. Under normal conditions, when the robot arm 10 and the wafer 20 are not obstructed between the detection unit 410 and the warning area 20A, the detection light 40A emitted vertically by the optical distance detector 411 passes through the warning area 20A and reaches the top wall of the process chamber 30 or other objects located above the warning area 20A, and an initial distance signal is obtained accordingly. The initial distance value represented by the initial distance signal is greater than the actual distance value.

[0103] In wafer transfer mode, the entire operation phase of the ejector pin 200 includes: initial phase, rising phase, wafer feeding phase, falling phase, and wafer removal phase. When the tip of the ejector pin 200 deflects and enters the warning area 20A, the upper part of the ejector pin 200 in the warning area 20A acts as an obstacle to block the upward propagation of the detection light 40A, thereby obtaining an optical distance signal. The measured distance value represented by the optical distance signal is the vertical distance from the optical distance detection head 411 to the deflected upper part of the ejector pin 200, and this measured distance value is less than the actual distance value.

[0104] When the height of the robot arm 10 is lower than the ejector pin 200 during the wafer feeding stage, or when the robot arm 10 is horizontally offset into the warning area 20A during the wafer removal stage, or when a fault causes the robot arm 10 to carry the wafer 20 for removal, the wafer 20 or the robot arm 10 first enters the warning area 20A as an obstacle to block the upward propagation of the detection light 40A, thereby obtaining an optical distance signal. The measured distance value represented by the optical distance signal is the vertical distance from the optical distance detector head 411 to the robot arm 10 or the wafer 20, and this measured distance value is less than the actual distance value.

[0105] During the wafer delivery stage, when the robot arm 10 normally delivers the wafer 20 and reaches above the warning area 20A, the measured distance value represented by the optical distance signal measured by the optical distance detector 411 is the vertical distance between the optical distance detector 411 and the wafer 20. This measured distance value is greater than the actual distance value. During the remaining operation stages of the ejector pin 200, if the ejector pin 200 does not deviate or the degree of deviation is small enough that its tip is insufficient to enter the warning area 20A, or if the robot arm 10 transmits the wafer 20 at a normal height, the measured distance value measured by the optical distance detector 411 is greater than or equal to the actual distance value.

[0106] Correspondingly, in wafer transmission mode, when the measured distance value represented by the optical distance signal measured by the optical distance detector 411 is less than the actual distance value, it is determined that the ejector pin 200 is deflected or the position of the robot arm 10 and the wafer 20 is too low, and the ejector pin 200 is at risk of side collision; when the measured distance value represented by the optical distance signal measured by the optical distance detector 411 is greater than or equal to the actual distance value, it is determined that the ejector pin 200 is not deflected and the robot arm 10 is working normally, and the ejector pin 200 is not at risk of side collision; thus, the detection and early warning of whether the ejector pin 200 is at risk of side collision in the warning area 20A is realized.

[0107] Specifically, in this embodiment of the invention, the optical distance detection head 411 is an optical fiber probe, configured to emit modulated light waves into the annular region 10A. In use, the output end of the optical fiber serves as both the optical fiber probe and the optical distance detection head 411, while the input end of the optical fiber is connected to the detection light source, and the detection light source is communicatively connected to the controller; its working principle is as follows... Figure 9 As shown, the optical distance probe 411 emits a modulated light wave. When the modulated light wave encounters an obstacle 40C, it is reflected and transmitted back to the controller via the fiber optic probe and fiber optic cable. The controller detects the phase delay between the reflected light 41B and the incident light 41A, according to the formula:

[0108]

[0109] Where Di is the distance from the fiber optic probe to the obstacle, in meters; c is the speed of light, in meters per second; and f is the frequency of the ranging light wave, in Hz. The phase difference generated by the round-trip propagation of a modulated light wave is expressed in degrees; the phase difference is known to be... It is directly proportional to the distance between the laser infrared probe and the object.

[0110] For example, after the inner door 50 of the cavity is opened, the robot arm 10 carrying the wafer 20 enters from the inner door 50 and enters above the ejector pin 200. During this transmission process, the distance the wafer 20 travels is 0.328m, the time is 2.76s, and the average speed is 0.119m / s. The fiber optic probe in this embodiment of the invention relies on the modulated light wave emitted by the fiber to detect, and its detection range is the diameter of the fiber, 0.0004m. That is, the maximum reaction distance to prevent the wafer 20 from hitting the ejector pin 200 is 0.0004m. The controller sampling period is 0.2ms, and the controller software data transmission period is 1ms. Therefore, the total time for the controller to detect the wafer 20 entering the warning area 20A and to send the robot arm 10 to stop transmission is 2ms, that is, 0.002s. The reaction distance is 2ms × 0.119m / s = 0.000238m. This distance is less than the maximum reaction distance of 0.0004m, thereby realizing the collision detection and stopping the transmission of the wafer 20 before the wafer 20 hits the ejector pin 200.

[0111] If the pin 200 deviates during the pin-raising stage, the deviation can be detected almost immediately because the optical fiber emitting the modulated light wave is close to the outer wall of the pin 200, with a reaction time of 2ms. Due to its fixed connection, the pin 200 deviates very slowly or not at all in the deviated direction. At the same time, the distance between the pin 200 and the side wall of the pin hole 110 is 0.00045m, which is greater than the controller response distance of 0.000238m. Combining these two factors, the present invention can detect the deviation of the pin 200 during the pin-raising stage and stop the pin-raising in time, thus protecting the pin 200 from damage to the side wall of the pin hole 110 during the pin-raising stage.

[0112] In this embodiment of the invention, the outer contour of the detection area of ​​the optical distance detector 411 is adjacent to the outer wall of the ejector pin 200 in normal working condition. The detection area formed by the optical distance detector 411 is a vertical columnar area, such as... Figure 7 As shown, the outer contour of the detection area and the outer contour of the vertical pin 200 are abutted, or as... Figure 8 As shown, there is a small gap between the outer contour of the detection area and the outer contour of the vertical pin 200. When the pin 200 is slightly deflected, the tip of the pin 200 can deflect into the detection area. Correspondingly, the optical distance detector 411 can detect the slight deflection of the pin 200 to realize the detection and early warning of the side collision risk of the pin 200, thereby improving the detection sensitivity of the anti-collision detection component 400 to the side collision risk caused by the deflection of the pin 200, and further reducing the side collision damage caused by the deflection of the pin 200.

[0113] In this embodiment of the invention, multiple optical distance detectors 411 are arranged circumferentially along an annular region 10A. The circumferential arrangement satisfies the following condition: when the pin 200 is deflected and its tip does not reach the area where the inner wall of the pinhole 110 is located, the vertical projection of the tip of the pin 200 at least partially falls into the detection area of ​​at least one optical distance detector 411. Multiple optical distance detectors 411 surround the outer periphery of the pin 200, and the detection light 40A emitted by the multiple optical distance detectors 411 surrounds the outer periphery of the pin 200. In wafer transfer mode, when the pin 200 deflects in any direction toward the sidewall of the pinhole 110, the tip of the pin 200 can enter the detection area of ​​the detection light 40A before contacting the sidewall, and the optical distance detector 411 detects that the pin 200 has a side impact risk. This comprehensively and effectively detects the side impact risk caused by the deflection of the pin 200, thereby improving the effect of reducing side impact damage to the pin 200 in the carrier device.

[0114] Meanwhile, the detection area formed by multiple optical distance detectors 411 surrounds the outer periphery of the ejector pin 200, which can more comprehensively and accurately detect the side collision risk caused by the robot arm 10 and the wafer 20 to the ejector pin 200; thus comprehensively and effectively detecting the side collision risk of the ejector pin 200 caused by the positional offset or program failure of the robot arm 10 and the wafer 20, and correspondingly further improving the effect of reducing the side collision damage of the ejector pin 200 in the support device.

[0115] Specifically, in this embodiment of the invention, in order to achieve comprehensive detection of the side impact risk of the ejector pin 200, the arrangement of multiple optical distance detectors 411 can be as follows: when the outer contour of the detection area of ​​the optical distance detector 411 is close to the outer side wall of the ejector pin 200 in normal working condition, there are multiple optical distance detectors 411 arranged circumferentially along the annular region 10A, and the minimum distance between two adjacent optical distance detectors 411 is less than the diameter of the ejector pin 200. Multiple optical distance detectors 411 form a detection area surrounding the pin 200. The minimum width of the gap between two adjacent detection areas is less than the diameter of the pin 200. When the pin 200 deflects toward the side wall of the pinhole 110, the width of the area through which the pin 200 deflects is the diameter of the pin 200. When the pin 200 deflects through the annular area 10A formed by the optical distance detectors 411, it will inevitably overlap with the detection area. When the pin 200 deflects to this overlapping area, it can be detected by the corresponding optical distance detector 411, thereby realizing the comprehensive detection of the side collision risk caused by the deflection of the pin 200 by the anti-collision detection component 400.

[0116] In this embodiment of the invention, multiple optical distance detectors 411 are arranged at uniform intervals along the circumference of the annular region 10A. On the one hand, a smaller number of optical distance detectors 411 can achieve comprehensive detection of the side impact risk of the pin 200, thereby reducing the number of optical distance detectors 411 and lowering the cost of the anti-collision detection component 400 while ensuring the comprehensive detection effect of the anti-collision detection component 400. On the other hand, arranging multiple optical distance detectors 411 at equal intervals improves the accuracy and convenience of their arrangement.

[0117] Figure 10 This is a schematic diagram illustrating one possible arrangement of the pin, optical distance detector, and pinhole in the carrier device provided in an embodiment of the present invention. Figure 10As shown, in normal working condition, the pin 200 is located within the pinhole 110, forming an annular region 10A between them. The radius of the pinhole 110 is 1.2 mm, and the radius of the pin 200 is 0.75 mm. Eight circular optical distance detectors 411 are located in the annular region 10A. All eight optical distance detectors 411 are attached to the outer wall of the pin 200 and are evenly spaced along the circumference of the annular region 10A. The radius of each optical distance detector 411 is 0.2 mm. The distance AB between the centers of two adjacent optical distance detectors 411 minus the radii AE+FB of the two optical distance detectors 411 is approximately equal to the minimum distance EF between the two optical distance detectors 411, which is ≈0.322 mm. The radius of the pinhole 110, 1.2 mm, is much larger than EF, thus ensuring that the optical distance detectors 411 can fully detect the side impact risk caused by the tilt of the pin 200.

[0118] The maximum number of optical distance detectors 411 evenly spaced along the circumference of the annular region 10A can be determined based on the dimensions of the pin 200 and the optical distance detectors 411: the minimum distance between two adjacent optical distance detectors 411 is less than the diameter of the pin 200, and the sum of the diameters of the multiple optical distance detectors 411 is not greater than the circumference of the contour circle 40B formed by the centers of the multiple optical distance detectors 411. Figure 10 As shown, the diameter of the optical distance detector 411 is 0.4 mm, and the circumference of the contour circle 40B is 5.966 mm. Therefore, the number of optical distance detectors 411 is no more than 14.

[0119] In embodiments of the present invention, such as Figure 3As shown, the optical distance detector 411 is fixedly connected to the lower pin segment of the pin 200. In use, the optical distance detector 411 moves synchronously with the lifting and lowering of the pin 200, and is always positioned below the warning area 20A, thus ensuring the comprehensiveness of the anti-collision detection component's detection of the side-impact risk of the pin 200. Simultaneously, on the one hand, during the lifting and lowering movement of the pin 200, the vertical distance between the optical distance detector 411 and the top of the pin 200 remains constant. Correspondingly, the actual distance value remains constant throughout the entire operation of the pin 200, facilitating the comparison between the measured distance value obtained by the optical distance detector 411 and the actual distance value, thereby improving the ease of determining whether the pin 200 has a side-impact risk in the warning area 20A. On the other hand, the synchronous movement of the optical distance detector 411 and the pin 200 effectively eliminates the impact of the lifting component 30... The error introduced by the height of the ejector pin 200 due to the 0 fault introduces an error in the standard vertical distance. During the stage when the ejector pin 200 cooperates with the robot arm 10 to transfer the wafer 20, the difference between the standard vertical distance and the measured distance value is the actual vertical relative distance between the ejector pin 200 and the robot arm 10 or the wafer 20. Based on this actual relative distance, it is possible to accurately determine whether there is a risk of side collision with the ejector pin 200, thereby improving the detection accuracy of the anti-collision detection component 400 and reducing the side collision damage to the ejector pin 200 and the fragment damage to the wafer 20 caused by misjudgment.

[0120] In embodiments of the present invention, such as Figure 3 , Figure 7 and Figure 8 As shown, the anti-collision detection component 400 includes an annular base 420, the vertical projection of which surrounds the pin 200 in normal working condition; an optical distance detector 411 is disposed on the annular base 420. The annular base 420 is configured to support and fix the optical distance detector 411. During installation, the annular base 420 can be connected and installed to fix the orientation of the optical distance detector 411, thereby improving the ease of installation and orientation stability of the optical distance detector 411. In particular, when there are multiple optical distance detectors 411, the installation of the annular base 420 allows for the simultaneous installation and fixation of multiple optical distance detectors 411, and the relative orientation between each optical distance detector 411 can also be defined, further improving the ease of installation and orientation stability of the optical distance detector 411.

[0121] Specifically, the annular seat 420 can be located above or below the warning zone 20A.

[0122] In this embodiment of the invention, the annular seat 420 is fixedly sleeved on the lower needle segment of the ejector pin 200 to achieve a relatively fixed connection between the optical distance detector head 411 and the lower needle segment of the ejector pin 200. At the same time, the anti-collision detection component 400 can be installed without modifying or damaging the process chamber 30, thereby improving the processing convenience of the bearing device and reducing the processing cost.

[0123] In this embodiment of the invention, the annular seat 420 is an elastic element. On one hand, the annular seat 420 is made of an elastic material (such as rubber). When the annular seat 420 is fitted onto the lower needle segment of the ejector pin 200, the annular seat 420 can elastically open to facilitate assembly. After assembly, the annular seat 420 can be elastically tightened onto the ejector pin 200, thereby ensuring a firm connection between the annular seat 420 and the ejector pin 200. On the other hand, the annular seat 420 has a certain elastic deformation capacity. When the ejector pin 200 is tilted, it will compress the annular seat 420 on the tilted side, preventing... It can not only reduce the rigid compression damage caused by both, but the area of ​​the ring seat 420 under compression can also tilt downward under the compression action, so that the optical distance detector 411 tilts towards the pin 200. The detection light 40A generated by the optical distance detector 411 tilts towards the pin 200 accordingly. That is, the pin 200 and the detection light 40A on the tilted side tilt towards each other. The detection light 40A can detect the side collision risk more quickly, thereby further improving the sensitivity of the detection light 40A to detect the side collision risk caused by the tilt of the pin 200.

[0124] In embodiments of the present invention, such as Figure 3 and Figure 4As shown, the lifting assembly 300 includes a drive seat 310, which has a cantilever 320 extending radially along the pin hole 110, and the bottom end of the ejector pin 200 is connected to the cantilever 320; the annular seat 420 includes an inner ring portion 421 and an outer ring portion 422 along its radial direction, the bottom of the inner ring portion 421 is suspended, and the outer ring portion 422 is fixed to the drive seat 310. Under normal operating conditions, the cantilever 320 can stably support the ejector pin 200. When the ejector pin 200 is subjected to downward impact, it transmits the downward force to the cantilever 320. The cantilever 320 can bend downward slightly to buffer the downward impact on the ejector pin 200, thereby reducing the damage caused by the downward impact. Simultaneously, when the robot arm 10 exerts downward impact on the ejector pin 200, the ejector pin 200 moves downward under pressure. The inner ring 421 of the annular seat 420 moves downward synchronously with the ejector pin 200, while the outer ring 422 remains fixed under the fixing action of the drive seat 310. The top surface of the annular seat 420 then tilts towards the ejector pin 200, and the optical distance detector 411 generates... The detection light 40A is tilted towards the ejector pin 200. When the detection light 40A intersects with the ejector pin 200, the measured distance value is less than the standard vertical distance, thus determining that the ejector pin 200 is at risk of downward collision. This serves as an early warning of the risk of downward collision caused by the manipulator 10 pressing down on the ejector pin 200. When the controller receives the anti-collision detection signal fed back by the optical distance detection head 411 and determines that the ejector pin 200 is at risk of downward collision, it controls the manipulator 10 to rise and retract, thereby reducing the possibility of downward collision damage to the ejector pin 200 caused by the manipulator 10 pressing down on it. This further improves the comprehensiveness and functionality of the anti-collision detection component 400 in detecting the risk of collision with the ejector pin 200.

[0125] In embodiments of the present invention, such as Figure 3 and Figure 4 As shown, the drive seat 310 has a hollow interior forming a receiving cavity 311, with an open top. A cantilever 320 is disposed on the side wall of the receiving cavity 311, and a ejector pin 200 extends into the receiving cavity 311 from the open top and connects to the cantilever 320. An outer ring portion 422 is connected to the top surface of the receiving cavity 311. By making the drive seat 310 hollow and placing the cantilever 320 inside the hollow receiving cavity 311 to connect the cantilever 320 to the ejector pin 200, not only can the interference of the externally placed cantilever 320 on surrounding components be reduced, but the stability of the ejector pin 200 connected to the drive seat 310 can also be improved. At the same time, the entire annular region 10A of the outer ring portion 422 can be supported on the top surface of the receiving cavity 311, resulting in higher stability and firmness of the outer ring portion 422 connected to the drive seat 310.

[0126] In this embodiment of the invention, the optical distance detection head 411 is an optical fiber probe, such as... Figure 3 and Figure 4As shown, the bottom of the drive base 310 is provided with a first connecting hole 312 that connects to the receiving cavity 311. The fiber optic segment 412 of the fiber optic probe passes through the receiving cavity 311 and extends downward through the first connecting hole 312, and the fiber optic segment 412 is sealed to the first connecting hole 312. The emitting end of the fiber optic cable, serving as the fiber optic probe, is located on the annular base 420. The fiber optic segment 412 extends downward through the receiving cavity 311 and the first connecting hole 312 to connect to the detection light source. This reduces the likelihood of the fiber optic cable being snagged when located outside the drive base 310, thereby ensuring the normal detection and use of the fiber optic probe.

[0127] The optical fiber segment 412 is sealed to the first connecting hole 312. For example, by setting a sealing ring between the two, on the one hand, this part of the optical fiber segment 412 can be fixed to encapsulate the optical fiber segment 412 near the output end in the receiving cavity 311. Even if the optical fiber segment 412 located outside the receiving cavity 311 is snagged, the impact on the optical fiber segment 412 encapsulated in the receiving cavity 311 is small, thereby further ensuring the normal detection and use of the optical fiber probe. On the other hand, the receiving cavity 311 is a sealed chamber to reduce the adverse effects of the external environment on the interior.

[0128] In embodiments of the present invention, such as Figure 3 and Figure 4 As shown, the lifting assembly 300 also includes an outer cylinder 330, the axial direction of which is consistent with the axial direction of the pinhole 110, and the bottom of the outer cylinder 330 is provided with a second connecting hole 331; the drive seat 310 is slidably inserted into the outer cylinder 330 along the axial direction of the outer cylinder 330, the optical fiber segment 412 extends downward through the second connecting hole 331, and the optical fiber segment 412 is sealed to the second connecting hole 331, for example, by providing a sealing ring between the two. In use, the outer cylinder 330 can be fixedly connected to the platform 100. During the process of the drive seat 310 driving the ejector pin 200 to move up and down, the outer cylinder 330 can guide and limit the vertical movement of the drive seat 310, thereby improving the accuracy of the drive seat 310 driving the ejector pin 200 to move up and down, and correspondingly reducing the probability of the ejector pin 200 colliding with the side wall of the pinhole 110 during the up and down movement. In addition, after the optical fiber segment 412 extends downward through the first connecting hole 312 into the outer cylinder 330, it continues to extend downward through the second connecting hole 331 into the outer cylinder 330 to achieve connection with the detection light source. The optical fiber segment 412 is sealed to the second connecting hole 331, which not only fixes the connection position of the optical fiber segment 412, but also reduces the adverse effects of the external environment on the interior of the outer cylinder 330.

[0129] Specifically, the lifting assembly 300 can be made using a cylinder. For example... Figure 3 and Figure 4As shown, the optical fiber segment 412 can be sealed through the first sealing block 313, which is threadedly connected to the first connecting hole 312; similarly, the optical fiber segment 412 can be sealed through the second sealing block 332, which is threadedly connected to the second connecting hole 331. Preferably, the optical fiber is a flexible optical fiber, and when there are multiple optical fibers, the multiple optical fibers are bundled together to pass through the accommodating cavity 311 and the outer cylinder 330.

[0130] In embodiments of the present invention, such as Figure 3 and Figure 4 As shown, a fixed sleeve 340 is fixedly connected to the drive seat 310, and a pressure ring 341 protruding from the inner wall of the fixed sleeve 340 extends radially inward from the top of the fixed sleeve 340; an elastic sleeve 350 is sandwiched between the fixed sleeve 340 and the annular seat 420, and an elastic ring 351 protruding from the inner wall of the elastic sleeve 350 extends radially inward from the top of the elastic sleeve 350. The elastic ring 351 is sandwiched between the annular seat 420 and the pressure ring 341. The fixed sleeve 340 presses the annular seat 420 onto the ejector pin 200 via the elastic sleeve 350. The pressure ring 341 at the top of the fixed sleeve 340 presses the annular seat 420 onto the drive seat 310 via the elastic ring 351, thereby achieving the connection between the annular seat 420, the ejector pin 200, and the drive seat 310. The provision of the elastic sleeve 350 and the elastic ring 351 not only improves the stability and firmness of the fixed sleeve 340 in fixing the annular seat 420, but also makes its assembly more convenient.

[0131] Specifically, the bottom end of the fixed sleeve 340 can be threaded to the top of the drive seat 310.

[0132] In embodiments of the present invention, such as Figure 3 As shown, the fixed sleeve 340 is inserted into the pin hole 110. The ejector pin 200, the annular seat 420, the elastic sleeve 350, and the fixed sleeve 340 are sequentially fixedly fitted to form an integral structure. This integral structure is always movably inserted into the pin hole 110, which not only reduces the risk of the ejector pin 200 dislodging from the pin hole 110 during the lifting and lowering process, ensuring the normal use of the ejector pin 200, but also plays a role in partially sealing the lower end of the vacuum, so as to reduce the heat loss from the pin hole 110 when the stage 100 performs temperature control adjustment on the wafer 20, thereby ensuring the uniformity of temperature control of the wafer 20 by the stage 100.

[0133] Specifically, such as Figure 3 As shown, the fixed sleeve 340 can also be fitted with a bellows 360. The top end of the bellows 360 abuts against the bottom end face of the pin hole 110 and the bottom end is connected to the drive seat 310. During the process of the drive seat 310 driving the ejector pin 200 to move up and down, the bellows 360 is stretched by contraction and extension to improve the stability of the up and down movement of the drive seat 310 and the ejector pin 200.

[0134] In embodiments of the present invention, such as Figure 3 and Figure 5 As shown, the pinhole 110 includes a first hole segment 111 and a second hole segment 112 arranged coaxially from top to bottom. The diameter of the second hole segment 112 is larger than that of the first hole segment 111, and the first hole segment 111 is configured to accommodate the ejector pin 200. The sidewall of the first hole segment 111 and the ejector pin 200 in normal working condition form an annular region 10A. The vertical projection of the warning region 20A is located within this annular region 10A. The fixing sleeve 340 is inserted into the second hole segment 112, wherein the diameter of the first hole segment 111 is smaller than that of the second hole segment 112, which can further reduce the heat loss when the stage 100 performs temperature control adjustment on the wafer 20, thereby further ensuring the uniformity of temperature control of the wafer 20 by the stage 100.

[0135] The bottom end of the ejector pin 200 is connected to the drive seat 310. The connection between the first hole segment 111 and the second hole segment 112 forms a limiting part to limit the upward movement of the drive seat 310. The radial dimension of the top of the drive seat 310 is smaller than the diameter of the second hole segment 112 but larger than the diameter of the first hole segment 111. The top of the drive seat 310 is inserted into the second hole segment 112 to move up and down, thereby driving the ejector pin 200 to move up and down. When the drive seat 310 rises to the bottom end face of the first hole segment 111, it will abut against the bottom end face to limit the maximum stroke of the upward movement of the drive seat 310, reducing the occurrence of the drive seat 310 moving too far upward and disengaging from the pin hole 110, and thus ensuring the stability of the lifting assembly 300 in driving the ejector pin 200 to move up and down.

[0136] Specifically, such as Figure 3 As shown, the ejector pin 200, the annular seat 420, the elastic sleeve 350, and the fixed sleeve 340 are sequentially fitted together. The radius of the ejector pin 200 can be 0.75 mm; the inner ring radius of the annular seat 420 is 0.75 mm, and the outer ring radius is 1.25 mm; the inner ring radius of the elastic sleeve 350 is 1.25 mm, and the outer ring radius is 1.75 mm; the inner ring radius of the fixed sleeve 340 is 1.75 mm, and the inner diameter of the outer ring is 2.5 mm.

[0137] The pinhole 110 includes a first hole segment 111 and a second hole segment 112. The first hole segment 111 has a radius of 1.2 mm to allow the ejector pin 200 to be inserted through the gap, and the annular area 10A formed by the first hole segment 111 and the ejector pin 200 can accommodate the annular seat 420. The second hole segment 112 has a radius of 3.25 mm to allow the fixing sleeve 340 to be inserted through the gap.

[0138] This invention also provides a controller, including a processor and a memory, wherein the memory stores computer instructions, and the processor executes the computer instructions to perform the above-described control method.

[0139] This invention also provides a computer-readable storage medium storing a computer program, which is read and executed by a controller to implement the above-described control method.

[0140] Figure 12 This is a flowchart illustrating a second control method provided according to an embodiment of the present invention. Figure 12 As shown, the control method includes:

[0141] S202 enters wafer transfer mode.

[0142] S204 acquires optical distance signals.

[0143] S206 compares the measured distance value represented by the optical distance signal with the actual distance value between the optical distance probe and the tip of the pin.

[0144] S208 If the measured distance value is greater than or equal to the actual distance value, it is determined that there is no risk of the pin colliding. Proceed to step S204.

[0145] S210 If the measured distance is less than the actual distance, it is determined that there is a risk of collision with the pin. Proceed to step S212.

[0146] S212 controls the carrier device to exit wafer transfer mode.

[0147] Figure 13 This is a flowchart illustrating a third control method provided according to an embodiment of the present invention. Figure 13 As shown, the control method includes:

[0148] S301 enters the initial stage of wafer transfer mode.

[0149] S302 acquires optical distance signals.

[0150] S303 determines whether the measured distance value represented by the optical distance signal is less than the actual distance between the optical distance detector head and the tip of the pin. If yes, proceed to step S310; otherwise, proceed to step S304.

[0151] When S304 enters the needle lifting stage, the lifting assembly drives the ejector pin to rise to the bearing position.

[0152] S305 Determine whether the measured distance value is less than the actual distance value; if yes, proceed to step S311; if no, proceed to step S306.

[0153] S306 controls the opening of the inner door, entering the wafer feeding stage, where the robotic arm carries the wafer in and transfers it to the ejector pin.

[0154] S307 Determine whether the measured distance value is less than the actual distance value; if yes, proceed to step S312; if no, proceed to step S308.

[0155] S308 enters the pin lowering stage, controls the robot arm to exit and controls the lifting assembly to drive the pin to descend to the first preset position, so as to place the wafer on the stage.

[0156] S309 wafer transfer mode completed.

[0157] S310 controls the exit from wafer transfer mode.

[0158] The S311 controls the lifting assembly to drive the ejector pin to descend to the first preset position and exit the wafer transfer mode.

[0159] The S312 controls the lifting assembly to drive the ejector pin to descend to the first preset position, controls the robotic arm to return to the second preset position, and exits the wafer transfer mode.

[0160] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A supporting device, characterized in that, include: The stage (100) is provided with a pinhole (110); A pin (200) is inserted into the pinhole (110); A lifting assembly (300), drivenly connected to the ejector pin (200), is configured to: drive the ejector pin (200) to move up and down, so as to extend upward or retract downward into the pinhole (110); and, The collision avoidance detection component (400) has a detection unit (410) configured to detect whether the pin (200) has a side collision risk in the warning area (20A); The warning area (20A) is projected vertically into an annular region (10A) between the pinhole (110) and the ejector pin (200) in normal working condition, and the top of the warning area (20A) is at the same height as the top of the ejector pin (200).

2. The bearing device according to claim 1, characterized in that, The detection unit (410) is located below the warning area (20A).

3. The bearing device according to claim 1, characterized in that, The detection unit (410) includes an optical distance detector (411), the optical distance detector (411) extends vertically and passes through the warning area (20A), and is configured to detect whether there are obstacles in the warning area (20A) that block the propagation of the detection light (40A).

4. The bearing device according to claim 3, characterized in that, The optical distance detector (411) has multiple probes arranged circumferentially along the annular region (10A), and the circumferential arrangement satisfies the following: when the pin (200) is deflected and the tip of the pin (200) does not reach the area where the inner wall of the pinhole (110) is located, the vertical projection of the tip of the pin (200) falls at least partially into the detection area of ​​at least one of the optical distance detectors (411).

5. The bearing device according to claim 3, characterized in that, The optical distance probe (411) has multiple probes arranged circumferentially along the annular region (10A). The outer contour of the detection area of ​​the optical distance probe (411) is close to the outer side wall of the ejector pin (200) in normal working condition, and the minimum distance between two adjacent optical distance probes (411) is less than the diameter of the ejector pin (200).

6. The bearing device according to claim 4 or 5, characterized in that, Multiple optical distance detectors (411) are arranged at uniform intervals along the circumference of the annular region (10A).

7. The bearing device according to any one of claims 3-5, characterized in that, The optical distance probe (411) is an optical fiber probe, which is configured to emit modulated light waves into the annular region (10A).

8. The bearing device according to any one of claims 3-5, characterized in that, The anti-collision detection component (400) includes an annular seat (420), which is fixedly connected to the lower needle segment of the pin (200), and the vertical projection of the annular seat (420) surrounds the pin (200) in normal working condition; the optical distance detection head (411) is disposed on the annular seat (420).

9. The bearing device according to claim 8, characterized in that, The annular seat (420) is fixedly sleeved on the lower needle section of the ejector pin (200), and the annular seat (420) is an elastic element.

10. The bearing device according to claim 9, characterized in that, The lifting assembly (300) includes a drive seat (310), the drive seat (310) is hollow to form a receiving cavity (311), the top of the receiving cavity (311) is open, and the side wall of the receiving cavity (311) is provided with a cantilever (320) extending radially along the pin hole (110), the bottom end of the pin (200) extends into the receiving cavity (311) from the opening and is connected to the cantilever (320); The annular seat (420) includes an inner ring portion (421) and an outer ring portion (422) along its radial direction. The bottom of the inner ring portion (421) is suspended, and the outer ring portion (422) is fixed to the top surface of the accommodating cavity (311).

11. The bearing device according to claim 10, characterized in that, The optical distance detection head (411) is an optical fiber probe. The bottom of the drive base (310) is provided with a first connecting hole (312) that connects to the accommodating cavity (311). The optical fiber segment (412) of the optical fiber probe passes through the accommodating cavity (311) and extends downward through the first connecting hole (312). The optical fiber segment (412) is sealed to the first connecting hole (312). The lifting assembly (300) further includes an outer cylinder (330), the axial direction of which is consistent with the axial direction of the pinhole (110), and the bottom of the outer cylinder (330) is provided with a second connecting hole (331); the drive seat (310) is slidably inserted into the outer cylinder (330) along the axial direction of the outer cylinder (330), the optical fiber segment (412) extends downward through the second connecting hole (331), and the optical fiber segment (412) is sealed to the second connecting hole (331).

12. The bearing device according to claim 10, characterized in that, The drive seat (310) is fixedly connected to a fixing sleeve (340), the fixing sleeve (340) is inserted into the pin hole (110), and the top of the fixing sleeve (340) extends radially inward with a pressure ring (341) protruding from the inner sidewall of the fixing sleeve (340). An elastic sleeve (350) is sandwiched between the fixed sleeve (340) and the annular seat (420). An elastic ring (351) protrudes from the inner wall of the elastic sleeve (350) and extends radially inward from the top end of the elastic sleeve (350). The elastic ring (351) is sandwiched between the annular seat (420) and the pressure ring (341).

13. The bearing device according to any one of claims 1-5, characterized in that, The lifting assembly (300) includes a drive base (310), and the bottom end of the ejector pin (200) is drivenly connected to the drive base (310). The pin hole (110) includes a first hole segment (111) and a second hole segment (112) arranged coaxially from top to bottom. The diameter of the second hole segment (112) is larger than that of the first hole segment (111), and the first hole segment (111) is configured to accommodate the ejector pin (200). The connection between the first hole segment (111) and the second hole segment (112) forms a limiting part for limiting the upward movement of the drive base (310).

14. A semiconductor process apparatus, characterized in that, include: The bearing device according to any one of claims 1-13; The robotic arm (10) is configured to: transfer the wafer (20) to the ejector pin (200) of the carrier device, or remove the wafer (20) carried on the ejector pin (200); as well as, The controller is communicatively connected to the robotic arm (10) and the lifting assembly (300) and anti-collision detection assembly (400) of the carrying device, and is configured to control the operating status of the robotic arm (10) and the lifting assembly (300) according to the anti-collision detection signal fed back by the anti-collision detection assembly (400).

15. A control method for preventing damage to ejector pins, characterized in that, The control method, applied to the bearing device according to any one of claims 1-13, comprises: Control the carrier device to enter wafer transfer mode; Obtain collision avoidance detection signals; The collision detection signal is used to determine whether the pin (200) is at risk of side impact; If so, then control the carrier device to exit the wafer transfer mode.

16. The control method according to claim 15, characterized in that, The detection unit (410) includes an optical distance detector (411), and the optical distance signal measured by the optical distance detector (411) serves as the anti-collision detection signal; the step of determining whether the pin (200) poses a collision risk based on the anti-collision detection signal includes: The measured distance value represented by the optical distance signal is compared with the actual distance value between the optical distance probe (411) and the tip of the pin (200); If the measured distance value is greater than or equal to the actual distance value, then it is determined that the pin (200) does not pose a risk of collision. If the measured distance value is less than the actual distance value, then it is determined that the pin (200) is at risk of collision.

17. The control method according to claim 15, characterized in that, When the wafer transfer mode is either the rise-up or fall-down phase, the step of controlling the carrier device to exit the wafer transfer mode includes: The control lifting assembly (300) drives the ejector pin (200) to descend to the first preset position.

18. The control method according to claim 15, characterized in that, When the wafer transfer mode is the wafer feeding stage or wafer retrieval stage in which the carrier device and the robot (10) cooperate to feed and retrieve the wafer (20), the step of controlling the carrier device to exit the wafer transfer mode includes: The control lifting assembly (300) drives the ejector pin (200) to descend to the first preset position, and controls the robot arm (10) to retract to the second preset position.

19. A controller, characterized in that, It includes a processor and a memory, the memory storing computer instructions, the processor executing the computer instructions to perform the control method according to any one of claims 15-18.

20. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, which is read and executed by the controller to implement the control method as described in any one of claims 15-18.

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