A jig for aligning, pressing, and fixing a miniature electronic cooling chip and its application method

Abstract

This invention belongs to the field of semiconductor refrigeration technology, and relates to a positioning, pressing, and fixing fixture for a micro electronic refrigeration chip and its usage method. It includes a lower base and an upper pressing block; the lower base has a claw opening, a positioning pin hole, a guide height limiting pin hole, and a positioning groove, with a vacuum hole within the positioning groove; the upper pressing block includes a pressing block base, on which a claw mechanism, a product pressing block, and a pressure adjustment and locking mechanism are mounted; the lower surface of the pressing block base is also fixed with a positioning pin that mates with the positioning pin hole and a guide height limiting pin that mates with the guide height limiting pin hole; the product pressing block is connected to the pressing block base through the pressure adjustment and locking mechanism, and the claw mechanism is used to engage with the claw opening to press and fix the upper pressing block onto the lower base. This invention solves the problems of low accuracy, complex operation, and unstable welding quality caused by inconsistent reflow soldering pressure in existing technologies.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor refrigeration technology, and relates to a positioning, pressing and fixing fixture for a micro electronic refrigeration chip and its usage method. Background Technology

[0002] In the manufacturing process of micro-electronic coolers (TECs), existing processes typically involve manually aligning and molding the hot-side ceramic sheet with the die already mounted and the cold-side ceramic sheet with solder paste printed on it using locating pins.

[0003] This traditional mold-closing method has several inherent drawbacks: First, mold-closing accuracy is difficult to guarantee, mainly relying on the fit between the locating pin and the ceramic sheet's locating hole. If the locating hole diameter is too small, the ceramic sheet cannot be smoothly inserted; if the diameter is too large, the ceramic sheet will wobble during the mold-closing process, causing misalignment between the hot and cold surfaces, directly affecting the product's alignment accuracy and final performance. Second, the entire mold-closing process is complex and unstable. Specifically, the operator must first place the hot-side ceramic sheet with the die attached on it onto the fixture base using the locating pin, and then carefully align and place the cold-side ceramic sheet with solder paste printed on it, solder paste side down, on top of the hot-side ceramic sheet using the locating pin as well. During this placement, the cold-side ceramic sheet must be held and slowly lowered. If the falling speed is too fast or the force is slightly too great, the ceramic sheet is very likely to fall directly, impacting and damaging the precision die already attached below. Therefore, the operator's control over force and speed is extremely demanding, making the operation extremely inconvenient and inefficient. Subsequently, the pressure block needs to be placed on the cold-surface ceramic sheet using locating pins, and the fixing screws around the perimeter and in the center need to be tightened in sequence. Throughout the tightening process, due to the lack of effective and continuous constraint, the ceramic sheet still faces the risk of displacement, making it impossible to reliably guarantee the final alignment accuracy of the product. Furthermore, the process is cumbersome, highly dependent on personnel skills, resulting in low mold closing efficiency and difficulty in improving product yield.

[0004] Furthermore, existing processes also present significant problems in the subsequent reflow soldering stage. When the molded fixture is sent into the reflow oven for soldering, the solder paste thickness decreases after melting due to heat. However, the clamping blocks used in traditional fixtures are rigid and fixed structures, unable to adaptively move downwards in response to real-time changes in solder paste thickness. This results in inconsistent pressure on the product during soldering, and may even lead to pressure interruptions or insufficient pressure. This inconsistent and unstable pressure easily causes defects such as voids and cold solder joints at the solder interface, resulting in large fluctuations and poor consistency in soldering quality, severely affecting the reliability and lifespan of micro-electronic cooling chips.

[0005] In summary, the current molding process for manufacturing microelectronic cooling chips faces significant challenges in terms of precision control, ease of operation, efficiency, and welding quality assurance. General-purpose molding tools are insufficient to meet the demands of high-precision molding, while manual operation relying on human skills further increases complexity and uncertainty. Summary of the Invention

[0006] To address the problems of low precision, complex operation, and unstable welding quality caused by inconsistent reflow welding pressure in existing technologies, this invention provides a positioning, pressing, and fixing fixture for micro electronic cooling chips and its usage method.

[0007] To achieve the above objectives, the present invention employs the following technical solution: In a first aspect, the present invention provides a positioning, pressing and fixing fixture for a micro electronic cooling chip, comprising a lower base and an upper pressing block; the lower base is provided with a claw opening, a positioning pin hole, a guide height limiting pin hole and a positioning groove, the positioning groove being provided with a vacuum hole; the upper pressing block comprises a pressing block base, on which a claw mechanism, a product pressing block and a pressure adjustment and locking mechanism are mounted. The lower surface of the pressure block base is also fixed with a positioning pin that mates with the positioning pin hole and a guide height limiting pin that mates with the guide height limiting pin hole; the product pressure block is connected to the pressure block base through the pressure adjustment and locking mechanism, and the claw mechanism is used to engage with the claw opening to press and fix the upper pressure block on the lower base.

[0008] Preferably, the claw mechanism includes a claw, a spindle, and a first high-temperature resistant spring; the claw is rotatably connected to the pressure block base via the spindle, and the first high-temperature resistant spring is sleeved on the spindle, the first high-temperature resistant spring being used to provide elastic force that causes the claw to deflect in the engagement direction.

[0009] Preferably, a product guide pin is fixed on the product pressing block, and a guide hole is provided on the pressing block base to slide with the product guide pin; the cooperation between the product guide pin and the guide hole is used to guide the product pressing block to move relative to the pressing block base in a direction perpendicular to the bottom surface of the positioning groove.

[0010] Preferably, the pressure adjustment and locking mechanism includes an adjusting screw, a second high-temperature resistant spring, and a locking set screw; the adjusting screw is threadedly connected to the pressure block base, and its lower end is connected to the upper surface of the product pressure block; the second high-temperature resistant spring is sleeved on the adjusting screw and located between the pressure block base and the product pressure block; the locking set screw is threadedly connected to the pressure block base and abuts against the side of the adjusting screw.

[0011] Preferably, the axis of the positioning pin is parallel to the axis of the guide height limiting pin, and both are perpendicular to the upper surface of the lower base.

[0012] Preferably, the guide height limiting pin includes a pin body, a third high-temperature resistant spring sleeved on the pin body, and a washer disposed at the end of the third high-temperature resistant spring; the pin body is connected to the pressure block base; the third high-temperature resistant spring is used to press the washer against the upper surface of the lower base so that the product pressure block and the product placed in the positioning groove maintain a gap when the claw mechanism is not engaged with the claw opening.

[0013] Preferably, the bottom of the lower base is provided with a device interface for connection to an external vacuum system, and the vacuum hole in the positioning groove is connected to the device interface through an air passage provided in the lower base.

[0014] Preferably, the bottom shape of the positioning groove matches the contour of the hot-side ceramic sheet of the microelectronic cooling chip to be pressed.

[0015] Preferably, the shape and size of the pressing surface of the product block match the shape and size of the cold-side ceramic sheet of the microelectronic cooling chip to be pressed.

[0016] Secondly, the present invention provides a method for using a positioning, pressing, and fixing fixture for a micro electronic cooling chip, comprising the following steps: The hot-side ceramic sheet of the microelectronic cooling chip is placed in the positioning groove of the lower base; Place the upper pressure block on the lower base, insert the positioning pin on the lower surface of the pressure block base into the positioning pin hole, and simultaneously insert the guide height limiting pin into the guide height limiting pin hole. Pressing the base of the upper pressing block causes the claw mechanism to engage with the claw opening on the lower base, thus pressing and fixing the upper pressing block onto the lower base; simultaneously, the product pressing block presses the product located in the positioning groove through the pressure adjustment and locking mechanism.

[0017] Compared with the prior art, the present invention has the following beneficial effects: This invention, through the positioning groove and its internal vacuum hole on the lower base, can accurately and firmly adsorb and fix the hot-side ceramic sheet before mold closing, eliminating the loss of alignment reference caused by movement during operation. At the same time, the upper pressure block, through the precise cooperation of the positioning pin and guide height limiting pin with the lower base, ensures the pre-positioning accuracy and operational safety when the upper pressure block is placed. Combined with the rapid locking and pressure adjustment of the claw mechanism and the control of the constant pressure output of the product pressure block by the locking mechanism, it realizes the integrated operation of precise positioning and stable alignment of the cold and hot-side ceramic sheets to constant pressure pressing and locking. Thus, structurally, it fundamentally solves the technical problems of unstable positioning, cumbersome operation and uncontrollable pressure in traditional manual mold closing. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a positioning, pressing, and fixing fixture for a micro electronic cooling chip according to the present invention; Figure 2 This is a schematic diagram of the lower base in this invention; Figure 3 This is a schematic diagram of the micro electronic cooling chip in this invention; Figure 4 This is a schematic diagram of the upper pressure block in this invention.

[0020] The components are as follows: 1. Lower base; 11. Claw opening; 12. Positioning pin hole; 13. Guide height limiting pin hole; 14. Positioning groove; 15. Equipment interface; 2. Upper pressure block; 20. Pressure block base; 21. Claw mechanism; 22. Product pressure block; 23. Product guide pin; 24. Pressure adjustment and locking mechanism; 25. Positioning pin; 26. Guide height limiting pin; 31. Hot surface ceramic sheet; 32. Cold surface ceramic sheet. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0023] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0024] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper," "lower," "horizontal," or "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, terms such as "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] Furthermore, the use of the term "horizontal" does not imply that the component must be absolutely horizontal, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0027] The present invention will now be described in further detail with reference to the accompanying drawings: The first objective of this invention is to provide a positioning, pressing, and fixing fixture for a micro-electronic cooling chip, such as... Figures 1-4As shown, the device includes a lower base 1 and an upper pressure block 2. The lower base 1 is provided with a claw opening 11, a positioning pin hole 12, a guide height limiting pin hole 13, and a positioning groove 14 for placing the hot-side ceramic sheet 31 of the cooling chip. The positioning groove 14 is provided with a vacuum hole for reliably fixing the hot-side ceramic sheet 31 by vacuum adsorption before mold closing, preventing it from moving during operation. The upper pressure block 2 includes a pressure block base 20, on which a claw mechanism 21, a product pressure block 22, and a pressure adjustment and locking mechanism 24 are installed. The lower surface of the pressure block base 20 is also fixed with a positioning pin 25 that cooperates with the positioning pin hole 12 and a guide height limiting pin 26 that cooperates with the guide height limiting pin hole 13. The positioning pin 25 ensures the precise positioning between the upper pressure block 2 and the lower base 1, while the guide height limiting pin 26 can play a pre-guiding and limiting role during the lowering of the upper pressure block 2, preventing the product pressure block 22 from contacting the product too early and damaging it. The product pressing block 22 is connected to the pressing block base 20 through the pressure adjustment and locking mechanism 24, and the claw mechanism 21 is used to engage with the claw opening 11, thereby pressing and fixing the upper pressing block 2 as a whole onto the lower base 1.

[0028] This invention can ensure high-precision alignment of the hot and cold surface ceramic sheet 31 during the mold closing process and provide continuous, stable and controllable pressure during the subsequent reflow soldering process. This effectively solves the problems of alignment deviation, complex operation and welding voids and insufficient strength caused by pressure interruption during the traditional manual mold closing process, and significantly improves the product quality and production efficiency of micro electronic cooling chips.

[0029] For example, the claw mechanism 21 includes a claw, a spindle, and a first high-temperature resistant spring; wherein the claw is rotatably connected to the side of the pressure block base 20 via the spindle, forming a lever structure with a movable end and a fixed end, and the first high-temperature resistant spring is sleeved on the spindle and provides the claw with an elastic restoring force that causes its movable end to continuously deflect toward the engaging direction. During operation, when the upper pressure block 2 is pressed down, the movable end of the claw first contacts the guide slope of the corresponding claw opening 11 on the lower base 1 and slides along the slope, overcoming the elastic force of the first high-temperature resistant spring and temporarily expanding outward until the claw passes the locking edge of the claw opening 11, and then quickly rebounds under the elastic force of the first high-temperature resistant spring and engages in the claw opening 11, achieving automatic, fast, and secure locking. This design not only enables rapid locking and releasing between the upper pressure block 2 and the lower base 1, significantly improving operational efficiency, but also ensures the stability of the locking state during subsequent high-temperature reflow welding through the continuous elastic force provided by the high-temperature resistant spring, preventing locking failure caused by thermal expansion and contraction or vibration, thus providing reliable mechanical protection for the entire pressing and welding process.

[0030] For example, a product guide pin 23 is fixed on the product pressing block 22, and a guide hole is provided on the pressing block base 20 to slide with the product guide pin 23; the product guide pin 23 and the guide hole form a sliding pair, which can accurately guide the product pressing block 22 to move linearly relative to the pressing block base 20 in a vertical direction perpendicular to the bottom surface of the positioning groove 14, while effectively constraining any translational or rotational freedom of the product pressing block 22 in the horizontal plane. This structure ensures that the product pressing block 22 always maintains a parallel relationship with the bottom surface of the positioning groove 14 during the pressing process, thereby enabling the pressure applied to the cold surface ceramic sheet 32 ​​of the micro electronic cooling chip to be evenly distributed, avoiding problems such as local stress concentration, ceramic sheet displacement or grain damage caused by the tilting or imbalance of the pressing block.

[0031] For example, the pressure adjustment and locking mechanism 24 includes an adjusting screw, a second high-temperature resistant spring, and a locking set screw. The adjusting screw is precisely threaded to a threaded hole on the pressure block base 20 via its upper external thread, and its lower end can be movably connected to the upper surface of the product pressure block 22 via a spherical or flexible connection, allowing for slight angular adaptation when pressure is applied. The second high-temperature resistant spring is sleeved on the adjusting screw, with its two ends abutting against the lower surface of the pressure block base 20 and the upper surface of the product pressure block 22, respectively. The locking set screw is also threaded onto the pressure block base 20, and its tip can press against the side of the adjusting screw after being screwed in, thereby locking the rotational position of the adjusting screw. In use, the axial position of the adjusting screw in the pressure block base 20 can be changed by turning the adjusting screw, thereby adjusting the initial compression of the second high-temperature resistant spring, thus presetting the initial pressure value of the product pressure block 22 acting on the product. After adjustment, tightening the locking set screw will fix the adjusting screw and prevent loosening during subsequent operation or vibration. During reflow soldering, as the solder paste melts and the product thickness decreases, the compressed second high-temperature spring can continuously release its elastic force, pushing the adjusting screw and the product pressure block 22 to move down synchronously. This provides dynamic, continuous and basically constant pressure to the solder interface throughout the liquid phase, which greatly promotes the flow and venting of the solder, effectively suppresses the formation of solder voids, and significantly improves the reliability and mechanical strength of the solder joint.

[0032] For example, the axis of the positioning pin 25 is parallel to the axis of the guide height limiting pin 26 and is perpendicular to the upper surface of the lower base 1, ensuring that the upper pressure block 2 can move in a strictly vertical direction during the lowering process, avoiding horizontal force or jamming caused by the tilt of the pin shaft.

[0033] For example, the guide height limiting pin 26 includes a pin body, a third high-temperature resistant spring sleeved on the pin body, and a washer disposed at the end of the third high-temperature resistant spring; the upper end of the pin body is fixedly connected to the pressure block base 20, and its lower end can freely pass through the through hole disposed in the washer, while the washer can slide axially relative to the lower end of the pin body under the action of the spring; the third high-temperature resistant spring has a certain pre-compression amount or length in its natural state, and its two ends respectively abut against the lower surface of the pressure block base 20 and the upper surface of the washer. The third high-temperature resistant spring is used to press the washer against the upper surface of the lower base 1 so that the product pressure block 22 and the product placed in the positioning groove 12 maintain a gap when the claw mechanism 21 is not engaged with the claw opening 11. Specifically, when the operator places the upper pressure block 2 but has not yet pressed it down to lock it, under the elastic force of the third high-temperature resistant spring, the pad is continuously pressed against the upper surface of the lower base 1. At this time, the supporting force of the spring overcomes the self-weight of the upper pressure block 2 and the possible partial preload of the pressure adjustment mechanism, so that the entire pressure block base 20 together with the product pressure block 22 below it is supported, thereby forming a definite and safe protective gap between the product pressure block 22 and the product placed in the positioning groove 14, effectively avoiding rigid collisions between the pressure block and the product caused by misoperation or unstable placement, and protecting the fragile ceramic sheet and grains.

[0034] For example, the bottom of the lower base 1 is provided with a device interface 15 for connection to an external vacuum system, and the vacuum hole in the positioning groove 14 is connected to the device interface 15 through an air passage provided in the lower base 1.

[0035] The bottom of the lower base 1 is provided with a device interface 15 for quick connection and positioning with an external vacuum system. At the same time, one or more vacuum holes located in the positioning groove 14 are connected to the device interface 15 area through the air passage (e.g., drilled holes or flow channels) inside the lower base 1. This allows the external vacuum system to apply negative pressure to the vacuum holes in the positioning groove 14 through the device interface 15 and the air passage. This allows the vacuum to be started immediately after the hot surface ceramic sheet 31 is placed, so that it can be firmly and stably adsorbed and fixed in the positioning groove 14. This completely eliminates the risk of any movement of the hot surface when the cold surface ceramic sheet 32 ​​is placed or when the mold is closed, ensuring the alignment accuracy.

[0036] For example, the bottom shape and depth of the positioning groove 14 are designed so that its inner contour matches the outer contour of the hot-side ceramic sheet 31 of the micro electronic cooling chip to be pressed, and it typically has a depth slightly greater than the thickness of the ceramic sheet but much smaller than its planar dimensions, so as to achieve precise positioning of the ceramic sheet in the horizontal direction and reliable support in the vertical direction.

[0037] For example, the lower surface of the product pressing block 22, i.e. the pressing surface, is designed in shape and size to closely match the contour shape and planar dimensions of the cold-side ceramic sheet 32 ​​of the microelectronic cooling chip to be pressed. This pressing surface is typically a flat and smooth plane to ensure full-area surface contact with the cold-side ceramic sheet 32.

[0038] The second objective of this invention is to provide a method for using a positioning, pressing, and fixing fixture for a micro electronic cooling chip, comprising the following steps: The hot-side ceramic sheet 31 of the micro electronic cooling chip is placed in the positioning groove 14 of the lower base 1. The outline of the positioning groove 14 matches the hot-side ceramic sheet 31 to provide initial positioning, and is connected to the device interface 15 through the vacuum hole in the groove to achieve adsorption and fixation. The upper pressure block 2 is placed on the lower base 1, and the positioning pin 25 on the lower surface of the pressure block base 20 is inserted into the positioning pin hole 12. At the same time, the guide height limiting pin 26 is inserted into the guide height limiting pin hole 13, so as to achieve rapid and accurate pre-positioning of the upper pressure block 2 relative to the lower base 1. At this time, under the support of the third temperature-resistant spring in the guide height limiting pin 26, a safe gap is maintained between the product pressure block 22 and the placed product. Press the base 20 of the upper pressing block 2 to engage the claw mechanism 21 with the claw opening 11 on the lower base 1, and press and fix the upper pressing block 2 onto the lower base 1; at the same time, the product pressing block 22 presses the product located in the positioning groove 14 through the pressure adjustment and locking mechanism 24.

[0039] Specifically, the method includes: S1. Place the hot-side ceramic chip 31 of the micro electronic cooling chip, which has been mounted with semiconductor chips, into the positioning groove 14 of the lower base 1. The inner contour of the positioning groove 14 precisely matches the outer contour of the hot-side ceramic chip 31, providing it with initial planar positioning and support.

[0040] Subsequently, an external vacuum system is connected through the device interface 15 at the bottom of the lower base 1, so that the negative pressure generated by the vacuum system is transmitted to the vacuum hole in the positioning groove 14 through the air channel set inside the lower base 1, thereby firmly adsorbing and fixing the hot surface ceramic sheet 31 in the positioning groove 14, eliminating the possibility of it moving in all subsequent operations.

[0041] S2. Place the cold-side ceramic sheet 32, printed with solder paste, onto an external alignment device (e.g., a robotic arm or platform with visual positioning capabilities). Start the alignment device to precisely align the cold-side ceramic sheet 32 ​​with the hot-side ceramic sheet 31, which is already fixed in the positioning groove 14, using optical recognition or other technologies. After alignment, the alignment device smoothly places the cold-side ceramic sheet 32 ​​onto the hot-side ceramic sheet 31, completing the initial bonding of the cold-side ceramic sheet 32 ​​and the hot-side ceramic sheet 31.

[0042] S3. Take the upper pressure block 2, lift it and move it above the lower base 1, so that the positioning pin 25 fixed to the lower surface of the pressure block base 20 and the guide height limiting pin 26 at the lower end are aligned with the corresponding positioning pin hole 12 and guide height limiting pin hole 13 on the lower base 1, respectively; then, smoothly lower the upper pressure block 2. During this process, the third high-temperature resistant spring in the guide height limiting pin 26 presses the pad against the upper surface of the lower base 1, thereby supporting the entire upper pressure block 2, so that a preset safety gap is maintained between the product pressure block 22 and the bonded product (cold and hot surface ceramic sheet assembly) to prevent collision.

[0043] S4. A downward pressing force is applied to the pressure block base 20. This pressing force overcomes the supporting force of the third high-temperature resistant spring inside the guide height limiting pin 26, causing the upper pressure block 2 to descend as a whole. At the same time, the movable end of the claw of the claw mechanism 21 fixed to the side of the pressure block base 20 contacts, slides, and expands outward with the guide slope of the claw opening 11 on the lower base 1, temporarily overcoming the elastic force of the first high-temperature resistant spring. When the claw passes the locking edge of the claw opening 11, it quickly rebounds inward under the elastic restoring force of the first high-temperature resistant spring, engaging with the claw opening 11 to lock, thereby rigidly locking the upper pressure block 2 and the lower base 1 together.

[0044] Simultaneously, as the upper pressure block 2 descends, the product pressure block 22, connected to the pressure block base 20 via the pressure adjustment and locking mechanism 24, begins to contact the product after the height restriction of the guide height limit pin 26 is released. The product pressure block 22 is precisely guided vertically by the product guide pin 23 and the guide hole on the pressure block base 20, ensuring its parallel downward movement. Finally, the product pressure block 22 presses evenly onto the cold-surface ceramic sheet 32 ​​with its pressing surface, and a precise and constant initial clamping force is applied by the pre-set second high-temperature resistant spring in the pressure adjustment and locking mechanism 24.

[0045] S5. The entire fixture, after locking and pressing, is transferred to the reflow oven for soldering. During the heating stage of reflow soldering, the product thickness decreases as the solder paste melts into the liquid phase. At this time, the second high-temperature resistant spring in the pressure regulating and locking mechanism 24 continuously releases its elastic potential energy, pushing the adjusting screw and the connected product pressure block 22 to move slightly downward in sync with the change in product thickness. This provides dynamic, continuous, and essentially constant pressure to the solder interface throughout the liquid phase soldering stage, effectively promoting solder flow, filling and expelling gas, and significantly suppressing the formation of solder voids.

[0046] S6. After welding is completed, the fixture cools to room temperature with the furnace, and the solder solidifies to form a strong connection. Remove the fixture from the furnace. Release the claw mechanism 21 (e.g., by turning the mandrel) to disengage the claws from the claw opening 11. At this time, the third high-temperature resistant spring inside the guide height limiting pin 26 lifts the upper pressure block 2 as a whole, and the product pressure block 22 is then removed from the product. Finally, turn off the external vacuum system to release the adsorption on the hot-surface ceramic sheet 31, and the finished microelectronic cooling chip that has been welded can be removed from the positioning groove 14.

[0047] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A jig for aligning, pressing, and fixing a miniature electronic cooling chip, characterized in that, It includes a lower base (1) and an upper pressure block (2); the lower base (1) is provided with a claw opening (11), a positioning pin hole (12), a guide height limiting pin hole (13) and a positioning groove (14), and the positioning groove (14) is provided with a vacuum hole; the upper pressure block (2) includes a pressure block base (20), and a claw mechanism (21), a product pressure block (22) and a pressure adjustment and locking mechanism (24) are installed on the pressure block base (20); The lower surface of the pressure block base (20) is also fixed with a positioning pin (25) that cooperates with the positioning pin hole (12) and a guide height limiting pin (26) that cooperates with the guide height limiting pin hole (13); the product pressure block (22) is connected to the pressure block base (20) through the pressure adjustment and locking mechanism (24), and the claw mechanism (21) is used to engage with the claw opening (11) to press and fix the upper pressure block (2) on the lower base (1).

2. The alignment, pressing, and fixing fixture for a microelectronic cooling chip according to claim 1, characterized in that, The claw mechanism (21) includes a claw, a spindle, and a first high-temperature resistant spring; the claw is rotatably connected to the pressure block base (20) via the spindle, and the first high-temperature resistant spring is sleeved on the spindle. The first high-temperature resistant spring is used to provide elastic force that causes the claw to deflect in the engagement direction.

3. The alignment, pressing, and fixing fixture for a microelectronic cooling chip according to claim 1, characterized in that, The product pressure block (22) is fixed with a product guide pin (23), and the pressure block base (20) is provided with a guide hole that slides with the product guide pin (23); the product guide pin (23) and the guide hole are used to guide the product pressure block (22) to move relative to the pressure block base (20) in a direction perpendicular to the bottom surface of the positioning groove (14).

4. The alignment, pressing, and fixing fixture for a micro electronic cooling chip according to claim 1, characterized in that, The pressure adjustment and locking mechanism (24) includes an adjusting screw, a second high-temperature resistant spring, and a locking screw; the adjusting screw is threaded onto the pressure block base (20), and its lower end is connected to the upper surface of the product pressure block (22); the second high-temperature resistant spring is sleeved on the adjusting screw and located between the pressure block base (20) and the product pressure block (22); the locking screw is threaded onto the pressure block base (20) and abuts against the side of the adjusting screw.

5. The alignment, pressing, and fixing fixture for a micro electronic cooling chip according to claim 1, characterized in that, The axis of the positioning pin (25) is parallel to the axis of the guide height limiting pin (26), and both are perpendicular to the upper surface of the lower base (1).

6. The alignment, pressing, and fixing fixture for a microelectronic cooling chip according to claim 1, characterized in that, The guide height limiting pin (26) includes a pin body, a third high-temperature resistant spring sleeved on the pin body, and a washer disposed at the end of the third high-temperature resistant spring; the pin body is connected to the pressure block base (20); the third high-temperature resistant spring is used to press the washer against the upper surface of the lower base (1) so that the product pressure block (22) and the product placed in the positioning groove (14) maintain a gap when the claw mechanism (21) is not engaged with the claw opening (11).

7. The alignment, pressing, and fixing fixture for a microelectronic cooling chip according to claim 1, characterized in that, The bottom of the lower base (1) is provided with a device interface (15) for connection with an external vacuum system. The vacuum hole in the positioning groove (14) is connected to the device interface (15) through an air passage provided in the lower base (1).

8. The alignment, pressing, and fixing fixture for a micro electronic cooling chip according to claim 1, characterized in that, The bottom shape of the positioning groove (14) matches the outline of the hot-side ceramic sheet (31) of the micro electronic cooling chip to be pressed.

9. The alignment, pressing, and fixing fixture for a microelectronic cooling chip according to claim 1, characterized in that, The shape and size of the pressing surface of the product pressing block (22) are matched with the shape and size of the cold surface ceramic sheet (32) of the micro electronic cooling chip to be pressed.

10. A method for using a positioning, pressing, and fixing fixture for a microelectronic cooling chip according to any one of claims 1 to 9, characterized in that, Includes the following steps: The hot-side ceramic sheet (31) of the micro electronic cooling chip is placed in the positioning groove (14) of the lower base (1); Place the upper pressure block (2) on the lower base (1), so that the positioning pin (25) on the lower surface of the pressure block base (20) is inserted into the positioning pin hole (12), and at the same time, the guide height limiting pin (26) is inserted into the guide height limiting pin hole (13). Press the base (20) of the upper pressure block (2) to engage the claw mechanism (21) with the claw opening (11) on the lower base (1), and press the upper pressure block (2) firmly onto the lower base (1); at the same time, the product pressure block (22) presses the product located in the positioning groove (14) through the pressure adjustment and locking mechanism (24).

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